FR2687845B1 - Procede et appareil pour la production d'un motif lineaire de faible resistance et pile solaire ainsi obtenue. - Google Patents
Procede et appareil pour la production d'un motif lineaire de faible resistance et pile solaire ainsi obtenue.Info
- Publication number
- FR2687845B1 FR2687845B1 FR9211047A FR9211047A FR2687845B1 FR 2687845 B1 FR2687845 B1 FR 2687845B1 FR 9211047 A FR9211047 A FR 9211047A FR 9211047 A FR9211047 A FR 9211047A FR 2687845 B1 FR2687845 B1 FR 2687845B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- linear pattern
- production
- low resistance
- solar battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 3
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
L'invention concerne un appareil pour la production d'un motif linéaire d'une largeur de moins de 100 microns et d'une résistivité de l'ordre de 10- 6 OMEGA.cm, sur un substrat. Selon l'invention, il comprend un réservoir (2) contenant un métal à faible point de fusion à l'état fondu, ayant un passage étroit (8) par où s'écoule le métal fondu et une tête à tracer (3) ayant une gorge fine (7) qui est connectée au passage étroit du réservoir, dont la pointe est agencée très près du substrat où contacte ce substrat et le métal fondu est appliqué à la pointe de la tête à tracer par la gorge par un phénomène capillaire puis est appliqué à la surface du substrat. L'invention s'applique notamment à la fabrication de piles solaires.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4075308A JPH05235388A (ja) | 1992-02-24 | 1992-02-24 | 低抵抗線状パターンの形成方法及び形成装置並びに太陽電池 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2687845A1 FR2687845A1 (fr) | 1993-08-27 |
FR2687845B1 true FR2687845B1 (fr) | 1995-02-24 |
Family
ID=13572500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9211047A Expired - Fee Related FR2687845B1 (fr) | 1992-02-24 | 1992-09-16 | Procede et appareil pour la production d'un motif lineaire de faible resistance et pile solaire ainsi obtenue. |
Country Status (4)
Country | Link |
---|---|
US (3) | US5328520A (fr) |
JP (1) | JPH05235388A (fr) |
DE (1) | DE4304858C2 (fr) |
FR (1) | FR2687845B1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101500739B (zh) * | 2006-04-10 | 2012-09-05 | Dek国际有限责任公司 | 丝网打印头、系统和方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2642574B2 (ja) * | 1992-12-17 | 1997-08-20 | 同和鉱業株式会社 | セラミックス電子回路基板の製造方法 |
US5411897A (en) * | 1994-02-04 | 1995-05-02 | Mobil Solar Energy Corporation | Machine and method for applying solder paste to electronic devices such as solar cells |
US5391514A (en) * | 1994-04-19 | 1995-02-21 | International Business Machines Corporation | Low temperature ternary C4 flip chip bonding method |
US5725665A (en) * | 1996-05-01 | 1998-03-10 | Minnesota Mining And Manufacturing Company | Coater enclosure and coating assembly including coater enclosure |
JPH1125829A (ja) * | 1997-07-04 | 1999-01-29 | Yazaki Corp | 温度ヒューズ及び車両用ワイヤハーネスの異常検出装置 |
EP1027723B1 (fr) * | 1997-10-14 | 2009-06-17 | Patterning Technologies Limited | Procédé de formation d'un condensateur électrique |
GB2369087B (en) * | 1997-10-14 | 2002-10-02 | Patterning Technologies Ltd | Method of forming a circuit element on a surface |
US6086942A (en) | 1998-05-27 | 2000-07-11 | International Brachytherapy S.A. | Fluid-jet deposition of radioactive material for brachytherapy devices |
ES2274611T3 (es) | 1998-12-17 | 2007-05-16 | Guardian Industries Corp. | Dispositivo y procedimiento para el revestimiento de un substrato plano. |
JP2002217434A (ja) * | 2001-01-19 | 2002-08-02 | Sharp Corp | 太陽電池、太陽電池用インターコネクターおよびストリング |
US7162302B2 (en) * | 2002-03-04 | 2007-01-09 | Nanoset Llc | Magnetically shielded assembly |
US7091412B2 (en) * | 2002-03-04 | 2006-08-15 | Nanoset, Llc | Magnetically shielded assembly |
US20040210289A1 (en) * | 2002-03-04 | 2004-10-21 | Xingwu Wang | Novel nanomagnetic particles |
US20050155779A1 (en) * | 2003-04-08 | 2005-07-21 | Xingwu Wang | Coated substrate assembly |
US20050244337A1 (en) * | 2003-04-08 | 2005-11-03 | Xingwu Wang | Medical device with a marker |
US20050240100A1 (en) * | 2003-04-08 | 2005-10-27 | Xingwu Wang | MRI imageable medical device |
US20050261763A1 (en) * | 2003-04-08 | 2005-11-24 | Xingwu Wang | Medical device |
US20050278020A1 (en) * | 2003-04-08 | 2005-12-15 | Xingwu Wang | Medical device |
US20070027532A1 (en) * | 2003-12-22 | 2007-02-01 | Xingwu Wang | Medical device |
EP1555695B1 (fr) * | 2004-01-13 | 2011-05-04 | Sanyo Electric Co., Ltd. | Dispositif photovoltaique |
EP1560272B1 (fr) * | 2004-01-29 | 2016-04-27 | Panasonic Intellectual Property Management Co., Ltd. | Module de cellules solaires |
US8178778B2 (en) * | 2005-03-24 | 2012-05-15 | Kyocera Corporation | Photovoltaic conversion element and manufacturing method therefor, and photovoltaic conversion module using same |
WO2007076424A1 (fr) * | 2005-12-27 | 2007-07-05 | Bp Corporation North America Inc. | Procédé pour constituer des contacts électriques sur une plaquette semi-conductrice au moyen d’une encre à changement de phase |
JP2009081386A (ja) * | 2007-09-27 | 2009-04-16 | U-Tec Kk | 光起電力素子の製造方法 |
WO2009145857A1 (fr) * | 2008-04-18 | 2009-12-03 | 1366 Technologies Inc. | Procédés permettant de former des motifs de couches de diffusion dans des cellules solaires et cellules solaires fabriquées selon ces procédés |
TWI362759B (en) * | 2008-06-09 | 2012-04-21 | Delsolar Co Ltd | Solar module and system composed of a solar cell with a novel rear surface structure |
EP2386118A4 (fr) * | 2009-01-06 | 2013-09-04 | 1366 Tech Inc | Distribution d'un matériau contenant un liquide à des surfaces à motifs à l'aide d'un tube de distribution |
KR101732633B1 (ko) * | 2011-05-26 | 2017-05-04 | 엘지전자 주식회사 | 태양전지 모듈 |
WO2016147970A1 (fr) * | 2015-03-16 | 2016-09-22 | シャープ株式会社 | Élément de conversion photoélectrique et procédé de fabrication d'élément de conversion photoélectrique |
US10424680B2 (en) * | 2015-12-14 | 2019-09-24 | Solarcity Corporation | System for targeted annealing of PV cells |
CN113769978B (zh) * | 2021-09-15 | 2022-05-17 | 杭州中芯微科技有限公司 | 一种用于rfid读写器机板导电胶涂覆设备 |
CN116364788A (zh) * | 2021-12-27 | 2023-06-30 | 隆基绿能科技股份有限公司 | 一种太阳能电池及其电极 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3536039A (en) * | 1968-07-01 | 1970-10-27 | Rca Corp | Marking device |
GB1355890A (en) * | 1972-04-29 | 1974-06-05 | Ferranti Ltd | Contacts for solar cells |
US4017871A (en) * | 1976-02-09 | 1977-04-12 | Graphic Controls Corporation | Marker with three phase ink circuit |
US4320250A (en) * | 1980-07-17 | 1982-03-16 | The Boeing Company | Electrodes for concentrator solar cells, and methods for manufacture thereof |
US4485387A (en) * | 1982-10-26 | 1984-11-27 | Microscience Systems Corp. | Inking system for producing circuit patterns |
US4511600A (en) * | 1984-02-10 | 1985-04-16 | Solarex Corporation | Solar cell metal spray process |
US4595790A (en) * | 1984-12-28 | 1986-06-17 | Sohio Commercial Development Co. | Method of making current collector grid and materials therefor |
JPS61166126A (ja) * | 1985-01-18 | 1986-07-26 | Nec Corp | 半導体装置の電極配線方法 |
DE3619311A1 (de) * | 1986-06-07 | 1987-12-10 | Telefunken Electronic Gmbh | Solargenerator mit hoher flaechenausnutzung |
US4694115A (en) * | 1986-11-04 | 1987-09-15 | Spectrolab, Inc. | Solar cell having improved front surface metallization |
JPS6439079A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Manufacture of photovoltaic device |
JPS6439076A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Manufacture of photovoltaic element |
JPS6439078A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Method for forming compound semiconductor film by drawing-printing method |
DE3802746A1 (de) * | 1988-01-30 | 1989-08-03 | Schneider Geb Gmbh | Zeichengeraet mit einer zeichenspitze, deren stirnflaeche die gezeichnete strichstaerke bestimmt |
DE3815512C2 (de) * | 1988-05-06 | 1994-07-28 | Deutsche Aerospace | Solarzelle und Verfahren zu ihrer Herstellung |
JPH074568B2 (ja) * | 1988-06-07 | 1995-01-25 | 富士写真フイルム株式会社 | 塗布方法 |
US5052626A (en) * | 1989-01-09 | 1991-10-01 | Union Carbide Canada Limited | Coolant introduction in blow molding |
US5045358A (en) * | 1989-10-30 | 1991-09-03 | Matsushita Electric Industrial Co., Ltd. | Coating head assembly and coating method |
JP2533812B2 (ja) * | 1990-07-13 | 1996-09-11 | 富士写真フイルム株式会社 | ガラス乾板製造方法及び装置 |
US5151377A (en) * | 1991-03-07 | 1992-09-29 | Mobil Solar Energy Corporation | Method for forming contacts |
-
1992
- 1992-02-24 JP JP4075308A patent/JPH05235388A/ja active Pending
- 1992-09-16 FR FR9211047A patent/FR2687845B1/fr not_active Expired - Fee Related
- 1992-09-22 US US07/948,441 patent/US5328520A/en not_active Expired - Fee Related
-
1993
- 1993-02-17 DE DE4304858A patent/DE4304858C2/de not_active Expired - Fee Related
-
1994
- 1994-03-21 US US08/215,478 patent/US5389573A/en not_active Expired - Fee Related
- 1994-03-21 US US08/216,018 patent/US5498289A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101500739B (zh) * | 2006-04-10 | 2012-09-05 | Dek国际有限责任公司 | 丝网打印头、系统和方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH05235388A (ja) | 1993-09-10 |
FR2687845A1 (fr) | 1993-08-27 |
US5389573A (en) | 1995-02-14 |
DE4304858A1 (fr) | 1993-08-26 |
US5498289A (en) | 1996-03-12 |
US5328520A (en) | 1994-07-12 |
DE4304858C2 (de) | 1997-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |