GB2369087B - Method of forming a circuit element on a surface - Google Patents
Method of forming a circuit element on a surfaceInfo
- Publication number
- GB2369087B GB2369087B GB0201275A GB0201275A GB2369087B GB 2369087 B GB2369087 B GB 2369087B GB 0201275 A GB0201275 A GB 0201275A GB 0201275 A GB0201275 A GB 0201275A GB 2369087 B GB2369087 B GB 2369087B
- Authority
- GB
- United Kingdom
- Prior art keywords
- forming
- circuit element
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0201275A GB2369087B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0201275A GB2369087B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
GB9721809A GB2330331B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0201275D0 GB0201275D0 (en) | 2002-03-06 |
GB2369087A GB2369087A (en) | 2002-05-22 |
GB2369087B true GB2369087B (en) | 2002-10-02 |
Family
ID=10820560
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0201275A Expired - Fee Related GB2369087B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
GB9721809A Expired - Fee Related GB2330331B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9721809A Expired - Fee Related GB2330331B (en) | 1997-10-14 | 1997-10-14 | Method of forming a circuit element on a surface |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2369087B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9803763D0 (en) | 1998-02-23 | 1998-04-15 | Cambridge Display Tech Ltd | Display devices |
AU5090400A (en) | 1999-05-27 | 2001-03-05 | Jetmask Limited | Method of forming a masking pattern on a surface |
JP3958972B2 (en) * | 2001-01-19 | 2007-08-15 | 矢崎総業株式会社 | Circuit body manufacturing method and circuit body manufacturing apparatus |
GB2381665B (en) * | 2001-11-02 | 2005-06-22 | Jetmask Ltd | Method of forming a mask on a surface |
GB0127252D0 (en) | 2001-11-13 | 2002-01-02 | Vantico Ag | Production of composite articles composed of thin layers |
EP1467945A2 (en) | 2002-01-18 | 2004-10-20 | Avery Dennison Corporation | Covered microchamber structures |
GB2391871A (en) * | 2002-08-16 | 2004-02-18 | Qinetiq Ltd | Depositing conductive solid materials using reservoirs in a printhead |
ITUD20020238A1 (en) | 2002-11-11 | 2004-05-12 | New System Srl | METHOD FOR CONTROLLED INK-JET LAYING OF POLYMERS FOR INSULATION AND / OR PROTECTION OF PRINTED CIRCUITS |
US6896937B2 (en) | 2002-11-15 | 2005-05-24 | Markem Corporation | Radiation-curable inks |
US6932451B2 (en) * | 2003-02-18 | 2005-08-23 | T.S.D. Llc | System and method for forming a pattern on plain or holographic metallized film and hot stamp foil |
US7695998B2 (en) | 2005-07-02 | 2010-04-13 | Hewlett-Packard Development Company, L.P. | Methods for making and using high-mobility inorganic semiconductive films |
JP5113164B2 (en) | 2007-06-01 | 2013-01-09 | ビ−エイイ− システムズ パブリック リミテッド カンパニ− | Improvements to Direct Light and additional manufacturing methods |
DE102014104321A1 (en) * | 2014-03-27 | 2015-10-01 | Leonhard Kurz Stiftung & Co. Kg | Shaped body and method for its production |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268597A (en) * | 1976-04-13 | 1981-05-19 | Philip A. Hunt Chemical Corp. | Method, apparatus and compositions for liquid development of electrostatic images |
WO1989005567A1 (en) * | 1987-12-09 | 1989-06-15 | Hammershoej Rene | A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part |
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5328520A (en) * | 1992-02-24 | 1994-07-12 | Mitsubishi Denki Kabushiki Kaisha | Solar cell with low resistance linear electrode |
JPH0818125A (en) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | Field-effect transistor, manufacture thereof and liquid crystal display device using transistor thereof |
US5560543A (en) * | 1994-09-19 | 1996-10-01 | Board Of Regents, The University Of Texas System | Heat-resistant broad-bandwidth liquid droplet generators |
EP0736580A2 (en) * | 1995-04-04 | 1996-10-09 | Fuji Xerox Co., Ltd. | Ink for ink jet recording and ink jet recording process |
WO1997048557A2 (en) * | 1996-06-04 | 1997-12-24 | Thin Film Technology (Consultancy) Limited | 3d printing and forming of structures |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6153001A (en) * | 1997-12-18 | 2000-11-28 | Fuji Xerox Co., Ltd. | Ink jet recording ink, method for producing the same, and ink jet recording method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3599404B2 (en) * | 1995-03-01 | 2004-12-08 | キヤノン株式会社 | Method and apparatus for manufacturing printed wiring board |
-
1997
- 1997-10-14 GB GB0201275A patent/GB2369087B/en not_active Expired - Fee Related
- 1997-10-14 GB GB9721809A patent/GB2330331B/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268597A (en) * | 1976-04-13 | 1981-05-19 | Philip A. Hunt Chemical Corp. | Method, apparatus and compositions for liquid development of electrostatic images |
WO1989005567A1 (en) * | 1987-12-09 | 1989-06-15 | Hammershoej Rene | A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part |
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5328520A (en) * | 1992-02-24 | 1994-07-12 | Mitsubishi Denki Kabushiki Kaisha | Solar cell with low resistance linear electrode |
JPH0818125A (en) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | Field-effect transistor, manufacture thereof and liquid crystal display device using transistor thereof |
US5705826A (en) * | 1994-06-28 | 1998-01-06 | Hitachi, Ltd. | Field-effect transistor having a semiconductor layer made of an organic compound |
US5560543A (en) * | 1994-09-19 | 1996-10-01 | Board Of Regents, The University Of Texas System | Heat-resistant broad-bandwidth liquid droplet generators |
EP0736580A2 (en) * | 1995-04-04 | 1996-10-09 | Fuji Xerox Co., Ltd. | Ink for ink jet recording and ink jet recording process |
WO1997048557A2 (en) * | 1996-06-04 | 1997-12-24 | Thin Film Technology (Consultancy) Limited | 3d printing and forming of structures |
US6153001A (en) * | 1997-12-18 | 2000-11-28 | Fuji Xerox Co., Ltd. | Ink jet recording ink, method for producing the same, and ink jet recording method |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
Non-Patent Citations (1)
Title |
---|
SCIENCE, vol.265, no. 5179, 16 September 1994, USA, Garnier et al, "All-polymer...", pages 1684-1686 * |
Also Published As
Publication number | Publication date |
---|---|
GB9721809D0 (en) | 1997-12-17 |
GB2330331A (en) | 1999-04-21 |
GB0201275D0 (en) | 2002-03-06 |
GB2330331B (en) | 2002-04-10 |
GB2369087A (en) | 2002-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20081014 |