ATE509511T1 - Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat - Google Patents

Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat

Info

Publication number
ATE509511T1
ATE509511T1 AT07100104T AT07100104T ATE509511T1 AT E509511 T1 ATE509511 T1 AT E509511T1 AT 07100104 T AT07100104 T AT 07100104T AT 07100104 T AT07100104 T AT 07100104T AT E509511 T1 ATE509511 T1 AT E509511T1
Authority
AT
Austria
Prior art keywords
electrical
electrical component
substrate
producing
hearing aid
Prior art date
Application number
AT07100104T
Other languages
English (en)
Inventor
Thomas Bill
Original Assignee
Oticon As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oticon As filed Critical Oticon As
Application granted granted Critical
Publication of ATE509511T1 publication Critical patent/ATE509511T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT07100104T 2007-01-04 2007-01-04 Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat ATE509511T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07100104A EP1942710B1 (de) 2007-01-04 2007-01-04 Verfahren zur Herstellung einer elektrischen Komponente eines elektrischen Schaltkreises auf einem Substrat

Publications (1)

Publication Number Publication Date
ATE509511T1 true ATE509511T1 (de) 2011-05-15

Family

ID=38066440

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07100104T ATE509511T1 (de) 2007-01-04 2007-01-04 Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat

Country Status (5)

Country Link
US (1) US20100062145A1 (de)
EP (1) EP1942710B1 (de)
AT (1) ATE509511T1 (de)
DK (1) DK1942710T3 (de)
WO (1) WO2008080712A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2330875A1 (de) * 2009-07-15 2011-06-08 Stichting Dutch Polymer Institute Verfahren zur Erzeugung von photonisch bearbeiteten Druckstrukturen auf Oberflächen, Vorrichtung und Verwendung dafür
DE102010029939A1 (de) * 2010-06-10 2011-12-15 Robert Bosch Gmbh Verfahren und Vorrichtung zum Kontaktieren eines Halbleitersubstrates mittels eines Strahldruckverfahrens
DE102011010407B4 (de) * 2011-02-04 2013-10-24 Deutsches Zentrum für Luft- und Raumfahrt e.V. Verfahren und Vorrichtung zum Herstellen einer polymerbasierten Leiterbahn
EP3562277A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Herstellung einer leiterbahn auf einer trägerplatte

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470096A (en) * 1982-06-18 1984-09-04 Motorola Inc. Multilayer, fully-trimmable, film-type capacitor and method of adjustment
ATE146304T1 (de) * 1993-07-30 1996-12-15 Ibm Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen
US5683928A (en) * 1994-12-05 1997-11-04 General Electric Company Method for fabricating a thin film resistor
US5994909A (en) * 1997-08-25 1999-11-30 Lucas; Brian K. Robotic twin probe for measurement on printed circuit boards and electrical and electronic assemblies
US6256866B1 (en) * 1999-05-11 2001-07-10 Motorola, Inc. Polymer thick-film resistor printed on planar circuit board surface
US7239524B2 (en) * 2001-10-12 2007-07-03 Intel Corporation Resistive element apparatus and method
US6972391B2 (en) * 2002-11-21 2005-12-06 Hadco Santa Clara, Inc. Laser trimming of annular passive components
JP2004319927A (ja) * 2003-04-21 2004-11-11 Shinko Electric Ind Co Ltd パターニング装置及び膜のパターニング方法
US20040245210A1 (en) * 2003-06-09 2004-12-09 Peter Kukanskis Method for the manufacture of printed circuit boards with embedded resistors
GB2417490A (en) * 2004-08-27 2006-03-01 Nanofilm Technologies Int Tetrahedral amorphous carbon coating with pre-determined resistivity

Also Published As

Publication number Publication date
EP1942710B1 (de) 2011-05-11
US20100062145A1 (en) 2010-03-11
EP1942710A1 (de) 2008-07-09
WO2008080712A1 (en) 2008-07-10
DK1942710T3 (da) 2011-08-15

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