ATE509511T1 - Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat - Google Patents
Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substratInfo
- Publication number
- ATE509511T1 ATE509511T1 AT07100104T AT07100104T ATE509511T1 AT E509511 T1 ATE509511 T1 AT E509511T1 AT 07100104 T AT07100104 T AT 07100104T AT 07100104 T AT07100104 T AT 07100104T AT E509511 T1 ATE509511 T1 AT E509511T1
- Authority
- AT
- Austria
- Prior art keywords
- electrical
- electrical component
- substrate
- producing
- hearing aid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07100104A EP1942710B1 (de) | 2007-01-04 | 2007-01-04 | Verfahren zur Herstellung einer elektrischen Komponente eines elektrischen Schaltkreises auf einem Substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE509511T1 true ATE509511T1 (de) | 2011-05-15 |
Family
ID=38066440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07100104T ATE509511T1 (de) | 2007-01-04 | 2007-01-04 | Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100062145A1 (de) |
EP (1) | EP1942710B1 (de) |
AT (1) | ATE509511T1 (de) |
DK (1) | DK1942710T3 (de) |
WO (1) | WO2008080712A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2330875A1 (de) * | 2009-07-15 | 2011-06-08 | Stichting Dutch Polymer Institute | Verfahren zur Erzeugung von photonisch bearbeiteten Druckstrukturen auf Oberflächen, Vorrichtung und Verwendung dafür |
DE102010029939A1 (de) * | 2010-06-10 | 2011-12-15 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Kontaktieren eines Halbleitersubstrates mittels eines Strahldruckverfahrens |
DE102011010407B4 (de) * | 2011-02-04 | 2013-10-24 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren und Vorrichtung zum Herstellen einer polymerbasierten Leiterbahn |
EP3562277A1 (de) * | 2018-04-25 | 2019-10-30 | Siemens Aktiengesellschaft | Herstellung einer leiterbahn auf einer trägerplatte |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4470096A (en) * | 1982-06-18 | 1984-09-04 | Motorola Inc. | Multilayer, fully-trimmable, film-type capacitor and method of adjustment |
ATE146304T1 (de) * | 1993-07-30 | 1996-12-15 | Ibm | Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen |
US5683928A (en) * | 1994-12-05 | 1997-11-04 | General Electric Company | Method for fabricating a thin film resistor |
US5994909A (en) * | 1997-08-25 | 1999-11-30 | Lucas; Brian K. | Robotic twin probe for measurement on printed circuit boards and electrical and electronic assemblies |
US6256866B1 (en) * | 1999-05-11 | 2001-07-10 | Motorola, Inc. | Polymer thick-film resistor printed on planar circuit board surface |
US7239524B2 (en) * | 2001-10-12 | 2007-07-03 | Intel Corporation | Resistive element apparatus and method |
US6972391B2 (en) * | 2002-11-21 | 2005-12-06 | Hadco Santa Clara, Inc. | Laser trimming of annular passive components |
JP2004319927A (ja) * | 2003-04-21 | 2004-11-11 | Shinko Electric Ind Co Ltd | パターニング装置及び膜のパターニング方法 |
US20040245210A1 (en) * | 2003-06-09 | 2004-12-09 | Peter Kukanskis | Method for the manufacture of printed circuit boards with embedded resistors |
GB2417490A (en) * | 2004-08-27 | 2006-03-01 | Nanofilm Technologies Int | Tetrahedral amorphous carbon coating with pre-determined resistivity |
-
2007
- 2007-01-04 DK DK07100104.4T patent/DK1942710T3/da active
- 2007-01-04 EP EP07100104A patent/EP1942710B1/de not_active Not-in-force
- 2007-01-04 AT AT07100104T patent/ATE509511T1/de not_active IP Right Cessation
- 2007-11-29 US US12/520,797 patent/US20100062145A1/en not_active Abandoned
- 2007-11-29 WO PCT/EP2007/062993 patent/WO2008080712A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP1942710B1 (de) | 2011-05-11 |
US20100062145A1 (en) | 2010-03-11 |
EP1942710A1 (de) | 2008-07-09 |
WO2008080712A1 (en) | 2008-07-10 |
DK1942710T3 (da) | 2011-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |