ATE551668T1 - Verfahren zur herstellung einer entität und entsprechende vorrichtung - Google Patents
Verfahren zur herstellung einer entität und entsprechende vorrichtungInfo
- Publication number
- ATE551668T1 ATE551668T1 AT06291782T AT06291782T ATE551668T1 AT E551668 T1 ATE551668 T1 AT E551668T1 AT 06291782 T AT06291782 T AT 06291782T AT 06291782 T AT06291782 T AT 06291782T AT E551668 T1 ATE551668 T1 AT E551668T1
- Authority
- AT
- Austria
- Prior art keywords
- entity
- producing
- corresponding apparatus
- mould
- personalising
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Treatment Of Fiber Materials (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06291782A EP1923821B1 (de) | 2006-11-17 | 2006-11-17 | Verfahren zur Herstellung einer Entität und entsprechende Vorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE551668T1 true ATE551668T1 (de) | 2012-04-15 |
Family
ID=38051785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06291782T ATE551668T1 (de) | 2006-11-17 | 2006-11-17 | Verfahren zur herstellung einer entität und entsprechende vorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US8173056B2 (de) |
EP (1) | EP1923821B1 (de) |
CN (1) | CN101536019B (de) |
AT (1) | ATE551668T1 (de) |
WO (1) | WO2008059380A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110316201A1 (en) * | 2010-06-24 | 2011-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer Level Packaging Using Blade Molding |
CN102039262B (zh) * | 2010-12-31 | 2014-04-02 | 上海众人网络安全技术有限公司 | 一种灌胶的电子口令牌及灌胶工艺方法 |
DE102011104510A1 (de) * | 2011-06-17 | 2012-12-20 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgers |
ES2753416T3 (es) | 2013-12-09 | 2020-04-08 | Bae Systems Plc | Sensor de corrosión que tiene conexiones de cable doble encapsulado y método para fabricarlo |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
US10939546B2 (en) * | 2019-01-28 | 2021-03-02 | Eagle Technology, Llc | Interconnect device |
CN111136845A (zh) * | 2019-12-18 | 2020-05-12 | 浙江格林特木塑材料有限公司 | 一种制作塑木板材的定型系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2609821B1 (fr) | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
JPH06120281A (ja) * | 1992-10-08 | 1994-04-28 | Hitachi Ltd | モールド金型及びこれを用いたモールド装置 |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
DE19519901C2 (de) | 1995-05-31 | 1998-06-18 | Richard Herbst | Verfahren zum taktweisen Spritzgießen von Gegenständen aus Kunststoff und Halbzeug zur Verwendung bei diesem Verfahren |
US5817208A (en) * | 1995-08-04 | 1998-10-06 | Matsushita Electronics Corporation | Resin sealing die, resin-sealed-type semiconductor device and method of manufacturing the device |
US6002663A (en) * | 1997-04-17 | 1999-12-14 | Imation Corp. | Hubless optical disc having low radial runout and method of manufacture |
JP3742211B2 (ja) * | 1998-02-09 | 2006-02-01 | シャープ株式会社 | 半導体装置のモールド金型およびマーキング方法 |
US6534711B1 (en) * | 1998-04-14 | 2003-03-18 | The Goodyear Tire & Rubber Company | Encapsulation package and method of packaging an electronic circuit module |
US6040622A (en) * | 1998-06-11 | 2000-03-21 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6139307A (en) * | 1998-07-23 | 2000-10-31 | Imation Corp. | Assembly for molding optical data storage disks formatted on both sides |
JP2002544656A (ja) * | 1999-05-14 | 2002-12-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 接点配置及び対応接点モジュール |
FR2817374B1 (fr) * | 2000-11-28 | 2003-02-21 | Schlumberger Systems & Service | Support electronique d'informations |
JP2006128459A (ja) * | 2004-10-29 | 2006-05-18 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7235423B1 (en) * | 2004-11-05 | 2007-06-26 | Super Talent Electronics, Inc. | Molded memory card production using carrier strip |
US7719845B1 (en) * | 2005-04-26 | 2010-05-18 | Amkor Technology, Inc. | Chamfered memory card module and method of making same |
FR2895547B1 (fr) * | 2005-12-26 | 2008-06-06 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a microcircuit |
NO20070649L (no) | 2007-02-05 | 2008-08-06 | Ntnu Technology Transfer As | Gassturbin |
-
2006
- 2006-11-17 AT AT06291782T patent/ATE551668T1/de active
- 2006-11-17 EP EP06291782A patent/EP1923821B1/de not_active Not-in-force
-
2007
- 2007-11-13 US US12/514,537 patent/US8173056B2/en active Active
- 2007-11-13 CN CN200780042581.3A patent/CN101536019B/zh active Active
- 2007-11-13 WO PCT/IB2007/004276 patent/WO2008059380A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP1923821B1 (de) | 2012-03-28 |
US8173056B2 (en) | 2012-05-08 |
WO2008059380A3 (en) | 2008-07-17 |
US20100038820A1 (en) | 2010-02-18 |
WO2008059380A2 (en) | 2008-05-22 |
EP1923821A1 (de) | 2008-05-21 |
CN101536019A (zh) | 2009-09-16 |
CN101536019B (zh) | 2015-11-25 |
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