ATE109302T1 - Verfahren zur befestigung einer wicklung an einem elektronischen kreis. - Google Patents

Verfahren zur befestigung einer wicklung an einem elektronischen kreis.

Info

Publication number
ATE109302T1
ATE109302T1 AT92904987T AT92904987T ATE109302T1 AT E109302 T1 ATE109302 T1 AT E109302T1 AT 92904987 T AT92904987 T AT 92904987T AT 92904987 T AT92904987 T AT 92904987T AT E109302 T1 ATE109302 T1 AT E109302T1
Authority
AT
Austria
Prior art keywords
winding
pct
circuits
electronic circuit
sec
Prior art date
Application number
AT92904987T
Other languages
English (en)
Inventor
Ake Gustafson
Original Assignee
Ake Gustafson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4189710&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE109302(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ake Gustafson filed Critical Ake Gustafson
Application granted granted Critical
Publication of ATE109302T1 publication Critical patent/ATE109302T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • H01F41/076Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/127Encapsulating or impregnating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065Mounting on printed circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49087Resistor making with envelope or housing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49087Resistor making with envelope or housing
    • Y10T29/49096Resistor making with envelope or housing with winding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5187Wire working

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Windings For Motors And Generators (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT92904987T 1991-02-25 1992-02-20 Verfahren zur befestigung einer wicklung an einem elektronischen kreis. ATE109302T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH55591 1991-02-25

Publications (1)

Publication Number Publication Date
ATE109302T1 true ATE109302T1 (de) 1994-08-15

Family

ID=4189710

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92904987T ATE109302T1 (de) 1991-02-25 1992-02-20 Verfahren zur befestigung einer wicklung an einem elektronischen kreis.

Country Status (11)

Country Link
US (5) US5572410A (de)
EP (1) EP0573469B1 (de)
JP (1) JPH0817132B2 (de)
AT (1) ATE109302T1 (de)
AU (1) AU655455B2 (de)
BR (1) BR9205671A (de)
CA (1) CA2101850C (de)
DE (1) DE69200282C5 (de)
DK (1) DK0573469T3 (de)
ES (1) ES2059215T3 (de)
WO (1) WO1992015105A1 (de)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2059215T3 (es) * 1991-02-25 1994-11-01 Ake Gustafson Procedimiento de fijacion de un bobinado a un circuito electronico.
US5223851A (en) 1991-06-05 1993-06-29 Trovan Limited Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
DE4220194C2 (de) * 1992-06-19 1996-02-22 Herbert Stowasser Vorrichtung und Verfahren zur Herstellung eines Transponders, wobei Wickeldraht einer Spule mit den Anschlußflächen eines elektronischen Bauelementes (Chip) verbunden wird
DE4307080C2 (de) * 1993-03-06 1996-01-25 Amatech Gmbh & Co Kg Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung mit mindestens einem elektronischen Bauelement (IC), wobei eine Bildverarbeitungseinrichtung zur Bauelementpositionierung zum Einsatz kommen kann
DE69310376D1 (de) * 1993-12-09 1997-06-05 Ake Gustafson Verfahren zum Wickeln eines Kerns mit einem elektronsichen Bauelement, sowie Mittel zur Führung von Drähten zum Verbinden einer Spule mit dem elektronischen Bauelement
ES2122620T3 (es) * 1994-05-27 1998-12-16 Ake Gustafson Procedimiento de realizacion de un modulo electronico y modulo electronico obtenido segun este procedimiento.
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
WO1996022608A1 (de) * 1995-01-20 1996-07-25 David Finn Vorrichtung und verfahren zum herstellen einer spulenanordnung
DE19509999C2 (de) * 1995-03-22 1998-04-16 David Finn Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit sowie Transpondereinheit
FR2733104B1 (fr) * 1995-04-12 1997-06-06 Droz Francois Repondeur de petites dimensions et procede de fabrication de tels repondeurs
US6025129A (en) * 1995-04-25 2000-02-15 Irori Remotely programmable matrices with memories and uses thereof
US6017496A (en) 1995-06-07 2000-01-25 Irori Matrices with memories and uses thereof
US5925562A (en) * 1995-04-25 1999-07-20 Irori Remotely programmable matrices with memories
US6331273B1 (en) 1995-04-25 2001-12-18 Discovery Partners International Remotely programmable matrices with memories
US5874214A (en) 1995-04-25 1999-02-23 Irori Remotely programmable matrices with memories
US6329139B1 (en) 1995-04-25 2001-12-11 Discovery Partners International Automated sorting system for matrices with memory
US6416714B1 (en) 1995-04-25 2002-07-09 Discovery Partners International, Inc. Remotely programmable matrices with memories
US5741462A (en) 1995-04-25 1998-04-21 Irori Remotely programmable matrices with memories
DE19720747C2 (de) * 1996-05-24 2003-04-10 Sokymat Identifikations Kompon Sicherheitselement enthaltend einen Transponder
US5731957A (en) * 1996-06-24 1998-03-24 Texas Instruments Incorporated Transponder including a fluid cushioning medium and a method for its production
DE19634661A1 (de) 1996-08-28 1998-03-05 David Finn Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung
US5963132A (en) * 1996-10-11 1999-10-05 Avid Indentification Systems, Inc. Encapsulated implantable transponder
EP0937304A1 (de) * 1996-11-11 1999-08-25 Metget AB Herstellungsverfahren einer spule und verfahren zur verbindung und apparat dafuer
WO1998038658A1 (de) * 1997-02-24 1998-09-03 Meteor Maschinen Ag Wickelmaschine zur herstellung von insbesondere kernlosen spulen sowie verfahren, insbesondere zum betrieb einer derartigen wickelmaschine
DE19730166A1 (de) * 1997-07-14 1999-01-21 Aeg Identifikationssys Gmbh Transponderanordnung und Verfahren zu deren Herstellung
JP4119608B2 (ja) * 1998-04-14 2008-07-16 ザ・グッドイヤー・タイヤ・アンド・ラバー・カンパニー 封止パッケージ、および電子回路モジュールをパッケージングする方法
US6412977B1 (en) 1998-04-14 2002-07-02 The Goodyear Tire & Rubber Company Method for measuring temperature with an integrated circuit device
US6534711B1 (en) 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6543279B1 (en) 1998-04-14 2003-04-08 The Goodyear Tire & Rubber Company Pneumatic tire having transponder and method of measuring pressure within a pneumatic tire
US6901654B2 (en) * 2000-01-10 2005-06-07 Microstrain, Inc. Method of fabricating a coil and clamp for variable reluctance transducer
WO2002099743A1 (en) * 2001-06-07 2002-12-12 Sokymat S.A. Ic connected to a winded isolated wire coil by flip-chip technology
AU2003229418A1 (en) * 2002-04-29 2003-11-17 Allflex Europe Sas Coil arrangement for radio-frequency identification devices, process and apparatus for making said arrangement
DE60333074D1 (de) * 2003-04-25 2010-08-05 Assa Abloy Ab Verfahren und Vorrichtung zur Herstellung eines Transponders
EP1770603A1 (de) * 2005-10-03 2007-04-04 Assa Abloy Identification Technology Group AB Gekapselter Transponder und Methode zur Herstellung desselben
EP1774917B1 (de) 2005-10-13 2010-02-17 Mbbs Sa Medizinisches Instrument und Verfahren zu dessen Erkennung
EP1786004B1 (de) 2005-11-11 2015-05-20 SMARTRAC TECHNOLOGY GERMANY GmbH Herstellungsmethode für ein einen integrierten Schaltkreis und eine Wicklungsanordnung enthaltendes elektronisches Bauteil
EP1793395A1 (de) * 2005-11-11 2007-06-06 Sokymat Automotive GmbH Herstellungsmethode für ein einen integrierten Schaltkreis und eine Wicklungsanordnung enthaltendes elektronisches Bauelement
EP1793398A1 (de) 2005-12-05 2007-06-06 Sokymat Automotive GmbH Haltewerkzeug zum Halten einer elektronischen Komponente und Herstellungseinheit mit Drehtischanordnung
EP1793399B1 (de) * 2005-12-05 2010-06-30 SMARTRAC TECHNOLOGY GERMANY GmbH Haltewerkzeug und Verfahren zum Befestigen eines elektronischen Bauteils und Rundtischherstellungseinheit
FR2909258B1 (fr) * 2006-11-30 2012-08-03 Prosonic Transpondeur miniature et systeme d'identification comportant un tel transpondeur et un lecteur adapte.
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US7825869B2 (en) * 2007-07-03 2010-11-02 Masin Joseph V Miniature transponders
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
DE102008033523B4 (de) * 2008-07-17 2010-08-12 Assa Abloy Sicherheitstechnik Gmbh Türöffnermagnetspule, Verwendung einer derartigen Türöffnermagnetspule sowie Türöffner mit einer derartigen Spule
EP2175400A1 (de) 2008-10-08 2010-04-14 NagralD Verfahren zur Herstellung einer Vorrichtung zur RF-Kommunikation, die einen mit einer elektronischen Einheit verbundenen Antennendraht umfasst
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011009577A1 (de) * 2011-01-27 2012-08-02 Texas Instruments Deutschland Gmbh RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne
BR112014005507A2 (pt) 2011-09-11 2017-06-13 Féinics Amatech Teoranta módulos de antena rfid e métodos de fabricação
ES2524427T3 (es) 2012-01-16 2014-12-09 Assa Abloy Ab Método para producir una etiqueta en forma de barra y etiqueta producida mediante dicho procedimiento
BR112014019291A8 (pt) 2012-02-05 2017-07-11 Feinics Amatech Teoranta Módulos da antena de rfid e métodos
EP2873031B1 (de) 2012-07-12 2018-08-22 Assa Abloy Ab Verfahren zur herstellung einer funktionellen einlage
WO2014191123A1 (en) 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
CN104240936B (zh) * 2013-06-21 2017-05-31 万润科技股份有限公司 线圈绕线方法及装置
JP2013219404A (ja) * 2013-08-02 2013-10-24 Sumida Corporation アンテナ部品の製造方法
WO2016097817A1 (en) 2014-12-15 2016-06-23 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2792775A (en) * 1955-05-24 1957-05-21 Sanford R Beyette Christmas tree baler
US3628238A (en) * 1966-05-19 1971-12-21 Donald E Hill Method of manufacturing wound stators
US3524601A (en) * 1968-07-23 1970-08-18 Globe Tool Eng Co Armature winding
US3609741A (en) * 1969-03-21 1971-09-28 Wendell S Miller Prevention of unauthorized movement of articles between predetermined areas
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
US4001822A (en) * 1974-05-28 1977-01-04 Rca Corporation Electronic license plate for motor vehicles
JPS5812794B2 (ja) * 1975-06-20 1983-03-10 ソニー株式会社 エイゾウシンゴウデンソウホウシキ
US4273859A (en) * 1979-12-31 1981-06-16 Honeywell Information Systems Inc. Method of forming solder bump terminals on semiconductor elements
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device
US4507852A (en) * 1983-09-12 1985-04-02 Rockwell International Corporation Method for making a reliable ohmic contact between two layers of integrated circuit metallizations
IT1176028B (it) * 1984-04-12 1987-08-12 Tekma Kincmat Spa Bobinartrice in linea, a due teste di guida
DE3536908A1 (de) * 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
US5211129A (en) * 1986-02-25 1993-05-18 Destron/Idi, Inc. Syringe-implantable identification transponder
ATE82827T1 (de) * 1986-02-25 1992-12-15 Destron Idi Inc Mit einer spritze implantierbarer identifikationstransponder.
US4783646A (en) * 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
FR2601502B1 (fr) * 1986-07-09 1989-04-28 Em Microelectronic Marin Sa Dispositif electronique semi-conducteur comportant un element metallique de refroidissement
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
US4805232A (en) * 1987-01-15 1989-02-14 Ma John Y Ferrite-core antenna
JPS63283040A (ja) * 1987-05-15 1988-11-18 Toshiba Corp 半導体装置
ES2008655T3 (es) * 1987-07-31 1994-02-01 Texas Instruments Deutschland Gmbh Disposicion de transmision-respuesta (transpondedora).
US5142698A (en) * 1988-06-08 1992-08-25 Nec Corporation Microwave integrated apparatus including antenna pattern for satellite broadcasting receiver
NL8802481A (nl) * 1988-10-10 1990-05-01 Texas Instruments Holland Transponder alsmede werkwijze voor het vervaardigen daarvan.
US5136271A (en) * 1989-01-09 1992-08-04 Mitsubishi Denki Kabushiki Kaisha Microwave integrated circuit mountings
DE3905214A1 (de) * 1989-02-21 1990-08-23 Focke & Co Verfahren und vorrichtung zur entnahme von (packungs-)zuschnitten aus einem zuschnitt-magazin
NL8901663A (nl) * 1989-06-30 1991-01-16 Philips Nv Wikkelingsdrager en werkwijze voor het met behulp daarvan vormen van een samenstel bevattende een elektrische spoel en een elektronisch onderdeel.
WO1991000603A1 (fr) * 1989-07-03 1991-01-10 Sokymat Sa Procede de fabrication de composants electroniques comportant un bobinage en fil fin, et dispositif de maintien du fil de bobinage permettant une fabrication selon ce procede
US5025550A (en) * 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
US5050292A (en) * 1990-05-25 1991-09-24 Trovan Limited Automated method for the manufacture of transponder devices by winding around a bobbin
ES2059215T3 (es) * 1991-02-25 1994-11-01 Ake Gustafson Procedimiento de fijacion de un bobinado a un circuito electronico.
CH684642A5 (fr) * 1991-02-25 1994-11-15 Ake Gustafson Pince de maintien d'un corps de bobine dans une machine de bobinage.
US5223851A (en) * 1991-06-05 1993-06-29 Trovan Limited Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
US5281855A (en) * 1991-06-05 1994-01-25 Trovan Limited Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
JP3513452B2 (ja) * 1999-07-02 2004-03-31 新光電気工業株式会社 非接触型icカードと非接触型icカードの製造方法と非接触型icカード用平面コイル

Also Published As

Publication number Publication date
JPH06505365A (ja) 1994-06-16
WO1992015105A1 (fr) 1992-09-03
AU1256992A (en) 1992-09-15
ES2059215T3 (es) 1994-11-01
US5634261A (en) 1997-06-03
DE69200282C5 (de) 2006-01-26
DK0573469T3 (da) 1994-11-28
US5572410A (en) 1996-11-05
US20010010117A1 (en) 2001-08-02
CA2101850C (fr) 1999-06-29
CA2101850A1 (fr) 1992-08-26
DE69200282D1 (de) 1994-09-01
US20020189080A1 (en) 2002-12-19
BR9205671A (pt) 1994-02-17
DE69200282T2 (de) 1994-12-22
EP0573469B1 (de) 1994-07-27
EP0573469A1 (de) 1993-12-15
US5790387A (en) 1998-08-04
AU655455B2 (en) 1994-12-22
JPH0817132B2 (ja) 1996-02-21

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