AT377673B - Verfahren zum befestigen von chip-artigen schaltungselementen auf einer platte fuer gedruckteschaltungen sowie vorrichtung zur durchfuehrung dieses verfahrens - Google Patents

Verfahren zum befestigen von chip-artigen schaltungselementen auf einer platte fuer gedruckteschaltungen sowie vorrichtung zur durchfuehrung dieses verfahrens

Info

Publication number
AT377673B
AT377673B AT0291679A AT291679A AT377673B AT 377673 B AT377673 B AT 377673B AT 0291679 A AT0291679 A AT 0291679A AT 291679 A AT291679 A AT 291679A AT 377673 B AT377673 B AT 377673B
Authority
AT
Austria
Prior art keywords
carrying
plate
circuit elements
printed circuits
fastening chip
Prior art date
Application number
AT0291679A
Other languages
English (en)
Other versions
ATA291679A (de
Original Assignee
Tdk Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1978050219U external-priority patent/JPS5633199Y2/ja
Priority claimed from JP1978050220U external-priority patent/JPS5633200Y2/ja
Priority claimed from JP5481778U external-priority patent/JPS54156756U/ja
Priority claimed from JP5481678U external-priority patent/JPS54156755U/ja
Priority claimed from JP11874878U external-priority patent/JPS5537210U/ja
Priority claimed from JP1978160112U external-priority patent/JPS58312Y2/ja
Application filed by Tdk Electronics Co Ltd filed Critical Tdk Electronics Co Ltd
Publication of ATA291679A publication Critical patent/ATA291679A/de
Application granted granted Critical
Publication of AT377673B publication Critical patent/AT377673B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1763—Magazine stack directly contacting separate work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1776—Means separating articles from bulk source
    • Y10T156/1778—Stacked sheet source
    • Y10T156/1783—Translating picker
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53252—Means to simultaneously fasten three or more parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53478—Means to assemble or disassemble with magazine supply

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT0291679A 1978-04-18 1979-04-18 Verfahren zum befestigen von chip-artigen schaltungselementen auf einer platte fuer gedruckteschaltungen sowie vorrichtung zur durchfuehrung dieses verfahrens AT377673B (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1978050219U JPS5633199Y2 (de) 1978-04-18 1978-04-18
JP1978050220U JPS5633200Y2 (de) 1978-04-18 1978-04-18
JP5481778U JPS54156756U (de) 1978-04-25 1978-04-25
JP5481678U JPS54156755U (de) 1978-04-25 1978-04-25
JP11874878U JPS5537210U (de) 1978-08-30 1978-08-30
JP1978160112U JPS58312Y2 (ja) 1978-11-22 1978-11-22 電子部品押し上げピン機構

Publications (2)

Publication Number Publication Date
ATA291679A ATA291679A (de) 1984-08-15
AT377673B true AT377673B (de) 1985-04-25

Family

ID=27550390

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0291679A AT377673B (de) 1978-04-18 1979-04-18 Verfahren zum befestigen von chip-artigen schaltungselementen auf einer platte fuer gedruckteschaltungen sowie vorrichtung zur durchfuehrung dieses verfahrens

Country Status (10)

Country Link
US (1) US4292116A (de)
AT (1) AT377673B (de)
AU (1) AU524769B2 (de)
CA (1) CA1130477A (de)
CH (1) CH640993A5 (de)
DE (1) DE2915366A1 (de)
FR (1) FR2423956A1 (de)
GB (1) GB2025910B (de)
IT (1) IT1166750B (de)
NL (1) NL172293C (de)

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DE2935082A1 (de) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum auftrag viskoser fluessigkeit auf einem flaechigen traegerkoerper
DE2935021A1 (de) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung und verfahren zur bestueckung von leiterplatten mit elektrischen bauelementen
US4353481A (en) * 1979-10-23 1982-10-12 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Magazine for storing and supplying circuit elements
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
FR2474270A1 (fr) * 1980-01-21 1981-07-24 Radiotechnique Compelec Procede et dispositif d'assemblage simultane de composants sur un support
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4461610A (en) * 1980-06-02 1984-07-24 Tdk Corporation Apparatus for mounting chip type circuit elements on printed circuit boards
IT1131749B (it) * 1980-07-22 1986-06-25 Ferco Spa Procedimento e relativo dispositivo di alimentazione di oggetti pressappoco parallelepipedi di dimensioni diverse il quale fornisce serie consecutive di oggetti su un piano di deposito unico
IT1193984B (it) * 1980-10-03 1988-08-31 Ferco Spa Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati
NL8006058A (nl) * 1980-11-06 1982-06-01 Philips Nv Inrichting voor het opschuiven van in magazijnen opgenomen onderdelen.
NL8006194A (nl) * 1980-11-13 1982-06-01 Philips Nv Inrichting voor het gelijktijdig plaatsen van meerdere elektrische en/of elektronische onderdelen op een gedrukte bedradingspaneel.
DE3043749A1 (de) * 1980-11-20 1982-07-08 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und vorrichtung zum bestuecken von leiterplatten
JPS57211430A (en) * 1981-06-16 1982-12-25 Sony Corp Method for supplying parts to automatic assembly machine and carrier for it
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
NL8201532A (nl) * 1982-04-13 1983-11-01 Philips Nv Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer.
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
US4449282A (en) * 1982-08-18 1984-05-22 At&T Technologies, Inc. Assembling components such as lids to chip enclosures
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
SE454643B (sv) * 1983-06-13 1988-05-16 Sincotron Aps Sett och anordning for att pa ett kretskort montera elektroniska komponenter
DE3472769D1 (en) * 1983-08-26 1988-08-25 Cod Int Tech Sa Assembling robot comprising a collective transport device for transporting parts to be assembled, assembling method and application thereof
DE3410130C1 (de) * 1984-03-20 1985-10-10 Philips Patentverwaltung Gmbh, 2000 Hamburg Werkstuecktraeger fuer Leiterplatten
US4626167A (en) * 1984-03-22 1986-12-02 Thomson Components-Mostek Corporation Manipulation and handling of integrated circuit dice
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US4531277A (en) * 1984-04-12 1985-07-30 At&T Technologies, Inc. Assembling components having mating faces
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GB2173426A (en) * 1985-04-09 1986-10-15 Dynapert Precima Ltd Component placement machine
EP0208492A3 (de) * 1985-07-12 1989-02-08 AB Electronic Components Limited Zusammensetzung von oberflächenmontierten Bauteilen
US4832784A (en) * 1986-06-02 1989-05-23 Motorola Inc. Positive stop, pick up tool
US4817273A (en) * 1987-04-30 1989-04-04 Reliability Incorporated Burn-in board loader and unloader
US4985107A (en) * 1988-03-01 1991-01-15 Sci Systems, Inc. Component location device and method for surface-mount printed circuit boards
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
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JP2811613B2 (ja) * 1991-09-02 1998-10-15 ティーディーケイ株式会社 電子部品の製造方法及び装置
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
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US6161749A (en) * 1998-07-13 2000-12-19 Ericsson, Inc. Method and apparatus for holding a printed circuit board during assembly
US6346154B1 (en) * 1999-08-25 2002-02-12 Herve Briend Suction plate for holding and supporting electronic circuit boards during printing operation
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
US7886430B2 (en) * 2002-12-13 2011-02-15 Hewlett-Packard Development Company, L.P. Method of installing circuit board component
JP3833997B2 (ja) * 2002-12-17 2006-10-18 オリオン電機株式会社 プリント回路板の製造方法
US7604451B2 (en) * 2003-03-10 2009-10-20 Honeywell Federal Manufacturing & Technologies, Llc Feed mechanism and method for feeding minute items
JP4319220B2 (ja) * 2004-02-24 2009-08-26 株式会社 大昌電子 マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法
DE112009001736T5 (de) * 2008-07-17 2012-01-26 Murata Mfg. Co., Ltd. Verfahren zum Herstellen eines komponenteneingebetteten Moduls
US8297472B2 (en) * 2010-11-24 2012-10-30 Texas Instruments Incorporated Pellet loader with pellet separator for molding IC devices
DE102012218322A1 (de) 2012-10-09 2014-04-10 Continental Automotive Gmbh Verfahren zur Bestückung einer Leiterplatte und Bestückungsvorrichtung
CN105438885B (zh) * 2015-11-24 2017-05-31 宁波普利达智能科技应用有限公司 贴双面胶的机构
CN111180374A (zh) * 2018-09-01 2020-05-19 温州市科泓机器人科技有限公司 芯片的智能化传送系统
CN115802639B (zh) * 2022-12-14 2023-06-09 深圳市星迅电子科技有限公司 一种异形插件机
CN119031612B (zh) * 2024-10-24 2024-12-27 福力加特(南通)新能源科技有限公司 一种电子元件装配结构

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Also Published As

Publication number Publication date
NL7903043A (nl) 1979-10-22
NL172293B (nl) 1983-03-01
NL172293C (nl) 1984-12-17
CA1130477A (en) 1982-08-24
IT7921952A0 (it) 1979-04-18
ATA291679A (de) 1984-08-15
FR2423956B1 (de) 1982-11-19
CH640993A5 (de) 1984-01-31
GB2025910B (en) 1982-06-09
AU4617879A (en) 1979-10-25
US4292116A (en) 1981-09-29
FR2423956A1 (fr) 1979-11-16
GB2025910A (en) 1980-01-30
AU524769B2 (en) 1982-09-30
IT1166750B (it) 1987-05-06
DE2915366A1 (de) 1979-10-31

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