DE3584415D1 - Verfahren und vorrichtung zum ziehen dicker filmschaltungen. - Google Patents

Verfahren und vorrichtung zum ziehen dicker filmschaltungen.

Info

Publication number
DE3584415D1
DE3584415D1 DE8585902118T DE3584415T DE3584415D1 DE 3584415 D1 DE3584415 D1 DE 3584415D1 DE 8585902118 T DE8585902118 T DE 8585902118T DE 3584415 T DE3584415 T DE 3584415T DE 3584415 D1 DE3584415 D1 DE 3584415D1
Authority
DE
Germany
Prior art keywords
thick film
film circuits
drawing thick
circuits
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585902118T
Other languages
English (en)
Inventor
Yukio Maeda
Shinichi Kudo
Keiji Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE3584415D1 publication Critical patent/DE3584415D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
DE8585902118T 1984-04-16 1985-04-15 Verfahren und vorrichtung zum ziehen dicker filmschaltungen. Expired - Lifetime DE3584415D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59076008A JPS60219791A (ja) 1984-04-16 1984-04-16 厚膜回路の形成装置
PCT/JP1985/000199 WO1985005005A1 (en) 1984-04-16 1985-04-15 Method and apparatus for drawing thick-film circuits

Publications (1)

Publication Number Publication Date
DE3584415D1 true DE3584415D1 (de) 1991-11-21

Family

ID=13592781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585902118T Expired - Lifetime DE3584415D1 (de) 1984-04-16 1985-04-15 Verfahren und vorrichtung zum ziehen dicker filmschaltungen.

Country Status (5)

Country Link
US (1) US4692351A (de)
EP (1) EP0179917B1 (de)
JP (1) JPS60219791A (de)
DE (1) DE3584415D1 (de)
WO (1) WO1985005005A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823277A (en) * 1985-04-16 1989-04-18 Protocad, Inc. Forming plated through holes in a printed circuit board by using a computer controlled plotter
US4787332A (en) * 1986-02-12 1988-11-29 Robotics, Inc. Adhesive dispensing pump control system
US4753700A (en) * 1986-02-28 1988-06-28 W. R. Grace & Co., Cryovac Div. Packaging film
GB2192567B (en) * 1986-04-23 1990-04-25 Honda Motor Co Ltd Method of and apparatus for supplying coating agent to coating robot
US5080036A (en) * 1986-06-24 1992-01-14 Matsushita Electric Industrial Co., Ltd. Thick film drawing apparatus
JPH0797696B2 (ja) * 1986-07-05 1995-10-18 株式会社豊田自動織機製作所 ハイブリツドｉｃ基板と回路パタ−ン形成方法
DE3631057A1 (de) * 1986-09-12 1988-03-24 Preh Elektro Feinmechanik Verfahren zur herstellung nichtlinearer widerstandsbahnen und nach diesem verfahren hergestelltes drehpotentiometer
JPS6387789A (ja) * 1986-09-30 1988-04-19 ジューキ株式会社 回路形成装置
JPS63110789A (ja) * 1986-10-29 1988-05-16 ジューキ株式会社 回路形成装置
JPH01200693A (ja) * 1988-02-05 1989-08-11 Juki Corp 厚膜回路形成装置を校正する方法及び装置
JPH0719946B2 (ja) * 1988-09-13 1995-03-06 ジューキ株式会社 直接描画装置におけるペーストの吐出量制御方法
DE3913028A1 (de) * 1989-04-20 1990-10-25 Fraunhofer Ges Forschung Verfahren und vorrichtung zur herstellung einer leitenden verbindung
US4961965A (en) * 1989-06-29 1990-10-09 Minnesota Mining And Manufacturing Company Method and apparatus for automated dispensing of liquid materials onto a workpiece
US4979380A (en) * 1989-09-12 1990-12-25 Sakowski And Robbins Corporation Automated dye pattern application system
US5035018A (en) * 1989-09-12 1991-07-30 Sakowski And Robbins Corporation Method of applying dye
US5033700A (en) * 1989-09-12 1991-07-23 Sakowski & Robbins Corp. Automated dye pattern application system
US5019004A (en) * 1989-12-28 1991-05-28 Zenith Electronics Corporation Method of manufacturing cathode ray tubes with binary coded faceplates
US5151377A (en) * 1991-03-07 1992-09-29 Mobil Solar Energy Corporation Method for forming contacts
US5622747A (en) * 1991-09-18 1997-04-22 National Semiconductor Corporation Method for dispensing a layer of photoresist on a wafer without spinning the wafer
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
ATE146304T1 (de) * 1993-07-30 1996-12-15 Ibm Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen
US5509966A (en) * 1993-10-22 1996-04-23 Sykes; Richard H. Graphic arts material extrusion device
US6258167B1 (en) * 1996-11-27 2001-07-10 Tokyo Electron Limited Process liquid film forming apparatus
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6548115B1 (en) * 1998-11-30 2003-04-15 Fastar, Ltd. System and method for providing coating of substrates
US6701835B2 (en) 2001-07-31 2004-03-09 Pilkington North America, Inc. Method for placing indicia on substrates
JP4037157B2 (ja) * 2002-04-23 2008-01-23 芝浦メカトロニクス株式会社 ペースト塗布装置
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
BRPI0617737A8 (pt) * 2005-10-21 2017-10-10 Ch & I Tech Inc Sistema integrado de transferência e dispensa de material
US8800482B2 (en) * 2005-12-29 2014-08-12 Exatec Llc Apparatus and method of dispensing conductive material with active Z-axis control
KR20100098552A (ko) 2007-12-31 2010-09-07 엑사테크 엘.엘.씨. 3차원 물체를 인쇄하기 위한 장치 및 방법
EP2921507B1 (de) * 2012-11-13 2017-10-18 Nippon Soda Co., Ltd. Verfahren zur herstellung von (meth)acrylmodifiziertem polybutadien
US9931665B2 (en) 2014-10-28 2018-04-03 Flextronics Ap, Llc Motorized adhesive dispensing module
EP3676021B1 (de) * 2017-08-29 2024-07-17 Henkel AG & Co. KGaA Flüssigkeitsspender mit verdrängungsfreier abdichtungsvorrichtung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2659310A (en) * 1950-09-02 1953-11-17 Ryba Anton Electromagnetic pumping device for pumping fluids
US3088434A (en) * 1955-05-02 1963-05-07 Carlton L Sprague Printed circuit apparatus
US3381623A (en) * 1966-04-26 1968-05-07 Harold F Elliott Electromagnetic reciprocating fluid pump
US3961599A (en) * 1971-08-12 1976-06-08 Air Products And Chemicals, Inc. Apparatus for making miniature layer resistors on insulating chips by digital controls
US3781907A (en) * 1972-01-17 1973-12-25 Gerber Scientific Instr Co Apparatus for expressing writing fluid from a plotting pen
SU531927A1 (ru) * 1973-07-02 1976-10-15 Институт Электродинамики Ан Украинской Сср Перистальтический насос
JPS5234330B2 (de) * 1973-11-10 1977-09-02
US3909831A (en) * 1974-02-14 1975-09-30 Strauss Levi & Co Fluid applicating device
SU712530A1 (ru) * 1974-04-05 1980-01-30 Aleksandrov Mikhail P Рабочий орган электромагнитного насоса перистальтического типа
CH597596A5 (de) * 1975-06-27 1978-04-14 Hoffmann La Roche
JPS54127732A (en) * 1978-03-27 1979-10-03 Nippon Telegraph & Telephone Writing device for automatic figure drawing machine etc*
JPS5573571A (en) * 1978-11-28 1980-06-03 Seiko Epson Corp Electric-mechanical converting element for ink jet printer
JPS5853886A (ja) * 1981-09-25 1983-03-30 オリエント時計株式会社 ポツテイング枠等の成形装置
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
JPS59200080A (ja) * 1983-04-25 1984-11-13 Ricoh Co Ltd 液体ポンプ

Also Published As

Publication number Publication date
EP0179917B1 (de) 1991-10-16
EP0179917A4 (de) 1986-08-21
JPH0367353B2 (de) 1991-10-22
WO1985005005A1 (en) 1985-11-07
EP0179917A1 (de) 1986-05-07
US4692351A (en) 1987-09-08
JPS60219791A (ja) 1985-11-02

Similar Documents

Publication Publication Date Title
DE3584415D1 (de) Verfahren und vorrichtung zum ziehen dicker filmschaltungen.
DE3486027D1 (de) Testvorrichtung und verfahren.
DE3580060D1 (de) Verfahren und vorrichtung zum auflegen von baendern.
DE3581906D1 (de) Verfahren und vorrichtung zum detektieren von blaettern.
DE3483819D1 (de) Verfahren und vorrichtung zum verbinden unabhaengiger netzwerke.
DE3680166D1 (de) Verfahren und vorrichtung zum automatischen fuegen und bearbeiten.
DE3587155D1 (de) Verfahren und vorrichtung zum verdichten von bilddaten.
DE69104775D1 (de) Verfahren und Vorrichtung zum Durchführen der Kapillarelektroforese.
DE3587197D1 (de) Geraet und verfahren zum filtern einer abbildung.
DE3485301D1 (de) Verfahren und vorrichtung zum kaltverformen von loechern.
DE3582671D1 (de) Verfahren und vorrichtung zum festklemmen.
DE3586510D1 (de) Verfahren und vorrichtung zur bilduebertragung.
DE3673917D1 (de) Verfahren und vorrichtung zum absoluten wegmessen.
DE3280123D1 (de) Geraet und verfahren zur mustererkennung.
DE3672027D1 (de) Verfahren und vorrichtung zum ausrichten.
DE3884046D1 (de) Verfahren und Vorrichtung zum Markieren photographischer Aufträge.
DE68914667D1 (de) Verfahren und vorrichtung für temporäre linienmarkierung.
DE3771416D1 (de) Verfahren und vorrichtung zum mikroloeten.
DE3381736D1 (de) Verfahren und geraet zum anzeigen von leiterdiagrammen.
DE3776821D1 (de) Vorrichtung und verfahren zum beschichten.
DE3782382D1 (de) Vorrichtung und verfahren zum zerteilen von schlacke.
DE3768665D1 (de) Verfahren und vorrichtung zum auftragen von filmen.
DE3763019D1 (de) Verfahren und einrichtung zum weich- oder hartloeten.
DE3481698D1 (de) Vorrichtung und verfahren zum dekorieren von gegenstaenden.
DE3583102D1 (de) Verfahren und vorrichtung zum auslesen von strahlungsbildern.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee