JPS5495955A - Method and apparatus for massssoldering printed wiring board - Google Patents

Method and apparatus for massssoldering printed wiring board

Info

Publication number
JPS5495955A
JPS5495955A JP14895278A JP14895278A JPS5495955A JP S5495955 A JPS5495955 A JP S5495955A JP 14895278 A JP14895278 A JP 14895278A JP 14895278 A JP14895278 A JP 14895278A JP S5495955 A JPS5495955 A JP S5495955A
Authority
JP
Japan
Prior art keywords
massssoldering
wiring board
printed wiring
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14895278A
Other languages
Japanese (ja)
Inventor
Jii Bointon Kenesu
Teruransu Ooruuke Harorudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLIS ENGINEERING
Original Assignee
HOLLIS ENGINEERING
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOLLIS ENGINEERING filed Critical HOLLIS ENGINEERING
Publication of JPS5495955A publication Critical patent/JPS5495955A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP14895278A 1977-12-02 1978-12-01 Method and apparatus for massssoldering printed wiring board Pending JPS5495955A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85675977A 1977-12-02 1977-12-02
US85676077A 1977-12-02 1977-12-02
US89749278A 1978-04-18 1978-04-18
US89749378A 1978-04-18 1978-04-18

Publications (1)

Publication Number Publication Date
JPS5495955A true JPS5495955A (en) 1979-07-28

Family

ID=27505924

Family Applications (2)

Application Number Title Priority Date Filing Date
JP14895278A Pending JPS5495955A (en) 1977-12-02 1978-12-01 Method and apparatus for massssoldering printed wiring board
JP62233612A Pending JPS63268563A (en) 1977-12-02 1987-09-17 Device for matrix-binding printed wiring circuit board by solder

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP62233612A Pending JPS63268563A (en) 1977-12-02 1987-09-17 Device for matrix-binding printed wiring circuit board by solder

Country Status (7)

Country Link
JP (2) JPS5495955A (en)
DE (1) DE2852132A1 (en)
FR (1) FR2410938A1 (en)
GB (2) GB1602779A (en)
HK (1) HK83388A (en)
IT (1) IT1107979B (en)
NL (1) NL184862C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897894A (en) * 1981-12-07 1983-06-10 日本電気株式会社 Soldering device
JPH039263U (en) * 1989-06-08 1991-01-29

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451000A (en) * 1982-06-11 1984-05-29 Hollis Engineering, Inc. Soldering apparatus exhaust system
DE3309648A1 (en) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München METHOD FOR SOLDERING PLATE-SHAPED CIRCUIT CARRIERS WITHIN A PROTECTIVE GAS SOLDERING DEVICE
GB8331200D0 (en) * 1983-11-23 1983-12-29 Treiber Automation Ltd Solder method and apparatus
FR2572970B1 (en) * 1984-11-15 1987-02-13 Outillages Scient Lab HEATING DEVICE FOR GENERATING A WELDING WAVE FOR A WAVE WELDING MACHINE
DE3539585A1 (en) * 1985-10-11 1987-07-02 Kaspar Eidenberg METHOD FOR SOLDERING THE CONNECTIONS OF COMPONENTS TO THE CIRCUIT LAYERS AND SOLDERING EYES OF CIRCUIT BOARDS, AND DEVICE FOR CARRYING OUT THIS METHOD
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
JP2506695Y2 (en) * 1990-08-04 1996-08-14 三菱電機株式会社 Printed circuit board cooling device
DE4416788C2 (en) * 1994-05-06 1999-08-19 Siemens Ag Process for wave soldering of printed circuit boards
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
DE10061032A1 (en) * 2000-12-08 2002-06-27 Messer Griesheim Gmbh Method and device for soldering electronic components on printed circuit boards

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605244A (en) * 1966-04-20 1971-09-20 Electrovert Mfg Co Ltd Soldering methods and apparatus
US3398873A (en) * 1966-09-07 1968-08-27 Hollis Engineering Sumps and nozzles for soldering machines
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3773261A (en) * 1969-06-13 1973-11-20 North American Rockwell Material removing device
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
US3948212A (en) * 1972-03-30 1976-04-06 Robert Bosch G.M.B.H. Coating apparatus
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
JPS5258042A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Dip soldering device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897894A (en) * 1981-12-07 1983-06-10 日本電気株式会社 Soldering device
JPH039263U (en) * 1989-06-08 1991-01-29

Also Published As

Publication number Publication date
FR2410938A1 (en) 1979-06-29
GB2009012A (en) 1979-06-13
FR2410938B1 (en) 1984-11-02
IT1107979B (en) 1985-12-02
NL184862C (en) 1989-11-16
IT7852160A0 (en) 1978-12-01
GB1602779A (en) 1981-11-18
GB2009012B (en) 1982-10-13
DE2852132C2 (en) 1989-08-10
NL7811803A (en) 1979-06-06
HK83388A (en) 1988-10-21
DE2852132A1 (en) 1979-06-07
JPS63268563A (en) 1988-11-07

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