JPS5897894A - Soldering device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a printed circuit board solder which suppresses the occurrence of solder cutting defects (for example, icicles or bridges) and obtains strong soldering in soldering of printed circuit boards using a soldering tank. The attachment is attached to the device.

Conventionally, in order to prevent poor solder cutting due to the oxidation force of the solder, as shown in FIG. Measures have been taken to prevent this problem by increasing the velocity of the jet flow and the moving speed of the carrier 3 to vI4m, and adjusting the temperature of the preheater 4, but the adjustment is delicate, and depending on the conditions, solder breakage may occur without any countermeasures. There was a drawback that defects (for example, icicles or bridges) were likely to occur.

The present invention solves the above-mentioned drawbacks under a wide range of soldering conditions by using a soldering method using a 7 lux spray device after soldering, and also achieves a strong joint by rapidly cooling the soldered part. obtained, and
The aim is to provide a soldering device that can save resources and increase the quantity of products by reducing excess solder, and can achieve good soldering by lowering the surface tension of molten solder.

The present invention provides a means for reducing the occurrence of solder breakage defects (such as icicles or bridging), removing excess solder, and obtaining a strong and good solder joint. By providing an et& device such as flux, it is possible to achieve good soldering over a wide range of conditions.

Next, embodiments of the present invention will be explained with reference to the drawings.

Referring to FIG. 2, which shows a side view of the soldering unit according to the present invention, the first embodiment of the present invention has a flux spout 5 installed immediately after the soldering bath 6. The slack spraying device 5 is activated when the stamp 1 base plate 7 begins to separate from the molten solder surface, and flux is sprayed toward the soldering s8, and when the soldering is completed, the operation w1 is stopped. The flux proboscisless device 5 starts and stops the cutting 1 using a limit switch 9.

In the present invention, 7 lux is supplied during cooling of the soldering part to lower the surface tension of the molten solder to obtain strong soldering by rapid cooling, and to remove excess solder by gas pressure during repair. ) is excluded.

The effect is that according to an experiment conducted by the Ministry of Public Affairs 81-1, the icicle occurrence rate is reduced by about 0.003% at 10"i compared to the normal soldering method (which has an icicle occurrence rate of about 3%). was completed.

In this example, a noodle-shaped iron tube was used as the flux casting iron tube, but it is also possible to use a tube in which the ejaculation part is connected to the side of the tube or in a flat shape, and air or other organic solvent is used as the cracking agent. It is clear that the present invention can be implemented even if the above is used.

As explained above, the present invention employs a soldering device equipped with an olfactory ring device such as 7LAX, thereby achieving strong joints by rapid cooling, saving resources by removing excess solder, and reducing surface vibration. Furthermore, since good soldering without bridges can be achieved, efficiency can be greatly improved.

[Brief explanation of the drawing]

FIG. 1 is a side view of a conventional soldering device, and FIG. 2 is a side view of a soldering device using a conventional soldering device according to the present invention. 1...Hanta cypress, 2...Fusing solder,
3...Carrier, 4...Preheater, 5...Flux $a device, 6...
Solder bath, 7...Printed circuit board, 8...Soldering part, 9...Limit switch.

Claims (1)

[Claims] Soldering is carried out by submerging the printed circuit board on which the molten solder parts are mounted in the molten solder in the solder tank. A printed circuit board installation device characterized by the installation of.