JPH04338693A - Coating method for printed wiring board with solder - Google Patents
Coating method for printed wiring board with solderInfo
- Publication number
- JPH04338693A JPH04338693A JP13958391A JP13958391A JPH04338693A JP H04338693 A JPH04338693 A JP H04338693A JP 13958391 A JP13958391 A JP 13958391A JP 13958391 A JP13958391 A JP 13958391A JP H04338693 A JPH04338693 A JP H04338693A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- wiring board
- board
- coating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000000576 coating method Methods 0.000 title claims abstract description 14
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000007639 printing Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、プリント配線板への半
田コーティング方法に係り、詳しくはＳＭＤパッド（フ
ットプリント）に半田をコーティングする方法に関する
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of coating a printed wiring board with solder, and more particularly to a method of coating an SMD pad (footprint) with solder.
【０００２】0002
【従来の技術】従来、プリント配線板への半田コーティ
ング方法としては、半田めっき工法或いは半田レベラー
工法が採られている。2. Description of the Related Art Conventionally, solder plating methods or solder leveler methods have been adopted as methods for applying solder coating to printed wiring boards.
【０００３】また部品実装において採用されているマス
ク印刷法、即ち １５０又は ２００μｍ厚のメタルマ
スクを用い印刷法によりソルダーペースト（一般的に粒
径４５μｍ又は７５μｍの半田粒子を含有）をコーティ
ングする方法と同様の方法でもプリント配線板へ半田を
コーティングすることができる。[0003] There is also a mask printing method used in component mounting, that is, a method in which a metal mask with a thickness of 150 or 200 μm is used to coat solder paste (generally containing solder particles with a particle size of 45 μm or 75 μm) by a printing method. A similar method can also be used to coat solder on a printed wiring board.
【０００４】ところで、上記の半田めっき工法では、め
っき設備、ヒュージング設備、水処理設備などを必要と
し、設備が大がかりとなり、イニシャルコストが高くな
る。また半田レベラー工法では、プリント配線板の板厚
が薄い為、プリント配線板の受けるダメージが大きく、
シーズリングやプリント配線板の破損などが発生した。
しかもホットエアー吹き付け時、プリント配線板が振動
することによって半田膜厚が不均一となるなどの問題が
あった。さらに部品実装用マスク印刷法では、塗布され
る半田の量が多く、半田膜厚の過多、パッド間半田ブリ
ッジ、部分的半田不濡れ等が発生するなどの問題があっ
た。[0004] However, the solder plating method described above requires plating equipment, fusing equipment, water treatment equipment, etc., resulting in large-scale equipment and high initial costs. In addition, with the solder leveler method, since the printed wiring board is thin, the damage to the printed wiring board is large.
Damage occurred to the seal ring and printed wiring board. Moreover, when blowing hot air, the printed wiring board vibrates, causing problems such as uneven solder film thickness. Furthermore, in the mask printing method for component mounting, a large amount of solder is applied, resulting in problems such as excessive solder film thickness, solder bridges between pads, and partial solder non-wetting.
【０００５】[0005]
【発明が解決しようとする課題】そこで本発明は、大が
かりな特別な装置を必要とせず、またプリント配線板を
破損せず、適正な半田量と均一な膜厚で半田をプリント
配線板へコーティングできる方法を提供しようとするも
のである。[Problems to be Solved by the Invention] Therefore, the present invention provides a method for coating a printed wiring board with solder in an appropriate amount and uniform thickness without requiring any large-scale special equipment or damaging the printed wiring board. This is an attempt to provide a possible method.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
の本発明のプリント配線板への半田コーティング方法は
、テーブル上にプリント配線板をセットし、次にプリン
ト配線板上にソルダーペーストをスクリーン印刷し、然
る後ソルダーペーストをリフローして溶融することを特
徴とするものである。[Means for Solving the Problems] In order to solve the above problems, the method of solder coating a printed wiring board of the present invention involves setting the printed wiring board on a table, and then applying solder paste onto the printed wiring board using a screen. It is characterized by printing and then reflowing and melting the solder paste.
【０００７】[0007]
【作用】上記のように本発明のプリント配線板への半田
コーティング方法は、テーブル上でプリント配線板にソ
ルダーペーストをスクリーン印刷し、ソルダーペースト
をリフローして溶融するので、プリント配線板の板厚が
薄くともダメージを受けることがなく、シーズリングや
プリント配線板が破損することがなく、適正な半田量で
均一な厚さに半田をコーティングできる。また本発明の
プリント配線板への半田コーティング方法は、プリント
配線板のソルダーレジスト等の印刷装置を用いて印刷で
きるので、特別な装置を導入する必要がない。[Operation] As mentioned above, the solder coating method for a printed wiring board of the present invention involves screen printing the solder paste on the printed wiring board on a table, and reflowing and melting the solder paste, so that the thickness of the printed wiring board can be reduced. Even if the solder is thin, it will not be damaged, the sheath ring or printed wiring board will not be damaged, and the solder can be coated to a uniform thickness with the appropriate amount of solder. Moreover, since the solder coating method for a printed wiring board of the present invention can be printed using a printing device such as a solder resist for a printed wiring board, there is no need to introduce a special device.
【０００８】[0008]
【実施例】本発明のプリント配線板への半田コーティン
グ方法の一実施例を説明する。図１に示すように印刷装
置１のテーブル２上にプリント配線板３をセットし、次
にこのプリント配線板３上に印刷装置１の ２００メッ
シュのテトロンスクリーン４の上側に塗った平均粒径２
５μｍの球形の半田粒子を８０〜９０ｗｔ％、残りフラ
ックスよりなるソルダーペースト５を硬度８０ショアの
印刷用スキージー６の動作によりスクリーン４より押し
出してプリント配線板３に転写する。即ちスクリーン印
刷する。然る後プリント配線板３にスクリーン印刷され
たソルダーペースト５をリフロー装置（図示省略）によ
り溶融する。かくしてプリント配線板３には板厚が薄く
ともダメージを受けることなく適正な半田量で２０〜３
０μｍの均一な厚さに半田がコーティングされる。[Embodiment] An embodiment of the method for coating a printed wiring board with solder according to the present invention will be described. As shown in FIG. 1, a printed wiring board 3 is set on the table 2 of the printing device 1, and then the average particle diameter 2 coated on the upper side of the 200 mesh Tetron screen 4 of the printing device 1 is placed on the printed wiring board 3.
A solder paste 5 consisting of 80 to 90 wt% of 5 μm spherical solder particles and the remainder flux is pushed out from the screen 4 by the operation of a printing squeegee 6 having a hardness of 80 Shore and transferred onto the printed wiring board 3. That is, screen printing is performed. Thereafter, the solder paste 5 screen printed on the printed wiring board 3 is melted using a reflow device (not shown). In this way, even if the printed wiring board 3 is thin, it will not be damaged and the printed wiring board 3 can be soldered with an appropriate amount of solder.
Solder is coated to a uniform thickness of 0 μm.
【０００９】尚、部品実装においては、プリント配線板
３の表面処理として半田があるなしにかかわらず、ソル
ダーペーストをスクリーン印刷し、部品を載せているが
、この方法を応用すれば、半田コーティングされたプリ
ント配線板３にポストフラックスを塗布するだけで、ソ
ルダーペースト印刷なしに部品を実装することが可能で
ある。この場合プリント配線板にコーティングする半田
膜厚を増加させるために ２００メッシュのスクリーン
を用いると良い。このようにスクリーンのメッシュ及び
パッド部開口寸法、ソルダーペーストの半田粒子径、フ
ラックス配合率を変えることにより目的とする半田コー
ティング方法を行なうことができる。[0009] In component mounting, solder paste is screen printed and components are mounted on the surface of the printed wiring board 3, regardless of whether or not there is solder. By simply applying post flux to the printed wiring board 3, it is possible to mount components without printing solder paste. In this case, it is preferable to use a 200 mesh screen to increase the thickness of the solder film coated on the printed wiring board. In this way, by changing the screen mesh and pad opening dimensions, the solder particle diameter of the solder paste, and the flux compounding ratio, the desired solder coating method can be performed.
【００１０】0010
【発明の効果】以上詳記した通り本発明のプリント配線
板への半田コーティング方法によれば、薄い板厚のプリ
ント配線板でもダメージを受けることなく、適正な半田
量で均一な厚さに半田をコーティングできる。またプリ
ント配線板のソルダーレジスト等の印刷装置を用いて印
刷できるので、特別な装置を導入する必要がない。Effects of the Invention As detailed above, according to the solder coating method for printed wiring boards of the present invention, even thin printed wiring boards can be soldered to a uniform thickness with an appropriate amount of solder without being damaged. can be coated. Further, since printing can be performed using a printing device such as a solder resist for a printed wiring board, there is no need to introduce a special device.
【図１】本発明のプリント配線板への半田コーティング
方法の一実施例の説明図である。FIG. 1 is an explanatory diagram of an embodiment of the method for coating a printed wiring board with solder according to the present invention.
１ 印刷装置 ２ テーブル ３ プリント配線板 ４ テトロンスクリーン ５ ソルダーペースト ６ 印刷用スキージー 1 Printing device 2 Table 3 Printed wiring board 4 Tetron screen 5 Solder paste 6 Printing squeegee
Claims (1)
し、次にプリント配線板上にソルダーペーストをスクリ
ーン印刷し、然る後ソルダーペーストをリフローして溶
融することを特徴とするプリント配線板への半田コーテ
ィング方法。Claim 1: A method for producing a printed wiring board characterized by setting a printed wiring board on a table, then screen printing a solder paste on the printed wiring board, and then reflowing and melting the solder paste. Solder coating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13958391A JPH04338693A (en) | 1991-05-15 | 1991-05-15 | Coating method for printed wiring board with solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13958391A JPH04338693A (en) | 1991-05-15 | 1991-05-15 | Coating method for printed wiring board with solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04338693A true JPH04338693A (en) | 1992-11-25 |
Family
ID=15248646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13958391A Pending JPH04338693A (en) | 1991-05-15 | 1991-05-15 | Coating method for printed wiring board with solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04338693A (en) |
-
1991
- 1991-05-15 JP JP13958391A patent/JPH04338693A/en active Pending
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