JPH04269896A - Soldering method for printed board - Google Patents
Soldering method for printed boardInfo
- Publication number
- JPH04269896A JPH04269896A JP11570191A JP11570191A JPH04269896A JP H04269896 A JPH04269896 A JP H04269896A JP 11570191 A JP11570191 A JP 11570191A JP 11570191 A JP11570191 A JP 11570191A JP H04269896 A JPH04269896 A JP H04269896A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- soldering
- solder
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 230000004907 flux Effects 0.000 claims abstract description 26
- 239000011261 inert gas Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- 239000006071 cream Substances 0.000 description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、新しいプリント基板の
半田付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new method for soldering printed circuit boards.
【０００２】0002
【従来技術とその課題】従来、リフロー炉を使用してプ
リント基板に電子部品を半田付けする手段としては、第
５図に示すように、クリーム半田印刷機１にてプリント
基板にクリーム半田を印刷し、次いでマウンター２にて
その上に電子部品を搭載し、リフロー炉３で半田を加熱
溶融してプリント基板と電子部品間の接合を行っていた
。[Prior Art and its Problems] Conventionally, as a means of soldering electronic components to a printed circuit board using a reflow oven, cream solder is printed on the printed circuit board using a cream solder printing machine 1, as shown in FIG. Then, an electronic component is mounted thereon using a mounter 2, and solder is heated and melted in a reflow oven 3 to bond the printed circuit board and the electronic component.
【０００３】しかしながら、近年技術の向上に伴い、電
子部品のリードピッチが０．３ｍｍ以下と狭くなり、こ
のようなファインピッチの部品用のクリーム半田印刷が
技術的に不可能に近い状況となっている。即ち、一般に
使用されているクリーム半田の粒径が２０〜５０μであ
り、一方、プリント基板にクリーム半田を印刷するメタ
ルマスクに設ける版穴が小さく薄くなっている。例えば
、メタルマスクの版穴の厚みが１００μのものがあるが
、この１００μの版穴の厚みに対して、２０〜５０μの
半田粒が通過して印刷される半田量は、クリーム半田中
に含まれているロジンなどの粘性も影響してきわめて微
量で、そのため半田付け不良の原因となることから、現
在ファインピッチの電子部品用としては、メタルマスク
によるクリーム半田の印刷手段が行われないのが実情で
ある。However, as technology has improved in recent years, the lead pitch of electronic components has become narrower to 0.3 mm or less, making cream solder printing for such fine-pitch components technically impossible. There is. That is, the grain size of commonly used cream solder is 20 to 50 microns, and on the other hand, the holes provided in the metal mask for printing cream solder on a printed circuit board are small and thin. For example, some metal masks have holes with a thickness of 100μ, but the amount of solder printed when solder grains of 20 to 50μ pass through this 100μ thickness is included in the cream solder. Due to the viscosity of the rosin used in the soldering process, the amount is extremely small, which can cause soldering defects.Currently, cream solder printing using a metal mask is not used for fine-pitch electronic components. This is the reality.
【０００４】従って現情では、プリント基板の銅箔面に
半田をメッキし、洗浄，乾燥処理されたものがプリント
基板製造業者から電子機器製造業者に納品され、この電
子機器製造業者では、メッキ半田面に接着型フラックス
を塗布してこの上に電子部品を搭載し、リフロー炉にて
半田付けを行っている。しかしながらこのような手段で
は、メッキ半田面の酸化による半田付け不良を生じるこ
とが避けられないことからフラックスの使用が必要で、
半田付け終了後、フラックス中に含まれている溶剤やロ
ジンなどによる残渣の洗浄除去作業が要求されるなどの
課題が残されている。[0004] Therefore, at present, the copper foil surface of a printed circuit board is plated with solder, washed and dried, and then delivered from a printed circuit board manufacturer to an electronic device manufacturer. Adhesive flux is applied to the surface, electronic components are mounted on top, and soldered in a reflow oven. However, with this method, it is inevitable that soldering defects will occur due to oxidation of the plated solder surface, so it is necessary to use flux.
Problems remain, such as the need to clean and remove residues from solvents, rosin, etc. contained in the flux after soldering is completed.
【０００５】本発明の目的は、電子部品をプリント基板
にリフロー半田付けするに際し、フラックスを全く使用
しないか、あるいは、残渣洗浄除去手段を必要としない
ロジン（固形分）の量を２ｗｔ％程度とした弱いフラッ
クスを使用し、残渣の除去や半田ボール除去のための洗
浄手段を必要としない半田付け方法、および、クリーム
半田の印刷が不可能な半田付けリードピッチが０．３ｍ
ｍ〜０．１５ｍｍでもリフローが可能なプリント基板の
半田付け方法を提供せんとするものである。[0005] An object of the present invention is to reduce the amount of rosin (solid content) to about 2 wt% without using any flux or requiring no means for cleaning and removing residue when reflow soldering electronic components to printed circuit boards. A soldering method that uses a weak flux that does not require cleaning methods to remove residue or solder balls, and a soldering lead pitch of 0.3 m that makes it impossible to print cream solder.
It is an object of the present invention to provide a method for soldering a printed circuit board that can be reflowed even if the thickness is 0.15 mm.
【０００６】[0006]
【課題を解決するための手段】従来技術の課題を解決す
る本発明の構成は、不活性ガス雰囲気中でプリント基板
に半田のコーチングを行う第１行程、大気雰囲気中で上
記プリント基板を半転する第２行程、プリント基板の所
要個所に電子部品仮固定用の接着剤を塗布する第３行程
、上記接着剤を介し電子部品をプリント基板に仮固定す
る第４行程、不活性ガス雰囲気中でリフロー半田付けす
る第５行程を一連のライン中で連続して行うこと、およ
び、上記第１行程の前行程として、プリント基板に弱い
フラックスを塗布するものである。[Means for Solving the Problems] The structure of the present invention which solves the problems of the prior art is such that during the first step of coating the printed circuit board with solder in an inert gas atmosphere, the printed circuit board is rotated halfway in an air atmosphere. The second step is to apply an adhesive for temporarily fixing electronic components to the required locations on the printed circuit board, and the fourth step is to temporarily fix the electronic components to the printed circuit board using the adhesive, in an inert gas atmosphere. The fifth step of reflow soldering is performed continuously in a series of lines, and a weak flux is applied to the printed circuit board as a step before the first step.
【０００７】[0007]
【実施例】次に、図面について本発明実施例の詳細を説
明する。図１は本発明方法を実施するに当り使用する装
置の説明図、図２は別実施例装置の説明図、図３は半田
コーチング機の説明図、図４は半田膜厚と残存酸素濃度
の関係を示す特性図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, details of embodiments of the present invention will be explained with reference to the drawings. FIG. 1 is an explanatory diagram of the apparatus used to carry out the method of the present invention, FIG. 2 is an explanatory diagram of another embodiment of the apparatus, FIG. 3 is an explanatory diagram of a solder coating machine, and FIG. 4 is an explanatory diagram of the solder film thickness and residual oxygen concentration. It is a characteristic diagram showing a relationship.
【０００８】図１は、請求項１記載の半田付け方法を実
施する装置を示しており、１１は半田付け機，１２は反
転機，１３は接着剤塗布機（ディスペンサー），１４は
電子部品搭載機（マウンター），１５はリフロー炉であ
り、夫々独立したプリント基板１６の搬送体１１ａ，１
２ａ，１３ａ，１４ａ，１５ａを備えるとともに、一連
のライン上に連設されている。FIG. 1 shows an apparatus for carrying out the soldering method according to claim 1, in which 11 is a soldering machine, 12 is a reversing machine, 13 is an adhesive applicator (dispenser), and 14 is an electronic component mounting device. The mounter 15 is a reflow oven, and the carriers 11a and 1 of the printed circuit boards 16 are independent of each other.
2a, 13a, 14a, and 15a, and are connected on a series of lines.
【０００９】上記半田付け機１１は、図１，図３から明
らかなように、密閉可能なハウジング１７内に上記搬送
体１１ａを設け、一方から他方に向けプリント基板１６
が搬送されるようにしてある。そして、上記搬送体１１
ａの下側には、プリント基板１６を予熱するプリヒータ
１８，噴流ノズルをもつ半田槽１９が配設してある。ま
た、上記ハウジング１７の内部は窒素ガスなどの不活性
雰囲気が保たれるように構成されており、プリント基板
１６の供給口，排出口部には外気がハウジング内に流入
するのを防止するためのシャッター機構が設けてある。
尚、この実施例ではハウジング全体を不活性ガス雰囲気
とするように図示されているが、プリント基板１６の搬
送体１１ａをハウジング１７内に設けたドーム（図示略
）内に配設し、このドームを不活性ガス雰囲気とするこ
とにより、使用する不活性ガスの使用量を節減するとい
う便法もある。As is clear from FIGS. 1 and 3, the soldering machine 11 includes the carrier 11a in a hermetically sealed housing 17, and carries the printed circuit board 16 from one side to the other.
is transported. Then, the carrier 11
A preheater 18 for preheating the printed circuit board 16 and a solder tank 19 having a jet nozzle are disposed below a. Further, the inside of the housing 17 is configured to maintain an inert atmosphere such as nitrogen gas, and the supply port and the discharge port of the printed circuit board 16 are provided to prevent outside air from flowing into the housing. A shutter mechanism is provided. In this embodiment, the entire housing is shown to be in an inert gas atmosphere, but the carrier 11a of the printed circuit board 16 is disposed in a dome (not shown) provided in the housing 17, and this dome There is also an expedient method of reducing the amount of inert gas used by creating an inert gas atmosphere.
【００１０】上記リフロー炉１５は、プリント基板１６
の予熱部２０，加熱部２１，冷却部２２から構成されて
おり、これらを収容するハウジング２３内は不活性ガス
雰囲気とする。The reflow oven 15 has a printed circuit board 16.
It is composed of a preheating section 20, a heating section 21, and a cooling section 22, and the inside of the housing 23 that accommodates these is an inert gas atmosphere.
【００１１】図２は、請求項２記載の半田付け方法を実
施する装置を示しており、図１の半田付け機１１の上手
側に、弱いフラックスをプリント基板１６に塗布するフ
ラックス塗布機２４を連設したもので、他の構成は図１
と同様である。上記フラックス塗布機２４は、プリント
基板１６の搬送体２４ａと、フラックスアトマイザー２
５を内蔵したハウジング２６によって構成されている。
上述した弱いフラックスの性状について説明すると、通
常のフラックスの中にはロジン（固形分）が約３０ｗｔ
％程度含まれている。ロジンを約１０ｗｔ％程度にする
と弱いフラックスとなるが、この程度であると残渣除去
のための洗浄手段が要求される。本発明のように無洗浄
にするには、ロジンの含有量は２ｗｔ％程度である。FIG. 2 shows an apparatus for carrying out the soldering method according to claim 2, in which a flux applicator 24 for applying a weak flux to the printed circuit board 16 is installed on the upper side of the soldering machine 11 in FIG. The other configuration is shown in Figure 1.
It is similar to The flux applicator 24 includes a carrier 24a for the printed circuit board 16 and a flux atomizer 2.
It is constituted by a housing 26 containing 5. To explain the properties of the above-mentioned weak flux, normal flux contains about 30wt of rosin (solid content).
Contains about %. When the rosin content is about 10 wt %, it becomes a weak flux, but at this level, a cleaning means is required to remove the residue. For non-washing as in the present invention, the rosin content is about 2 wt%.
【００１２】0012
【作用の説明】上記のように構成された図１に示すプリ
ント基板の半田付け装置を使用した本発明方法の実施例
を説明すると、プリント基板１６は半田付け機１１の搬
送体１１ａに支持されて不活性ガス雰囲気のハウジング
１７内に導入され、プリヒータ１８にて予熱されたのち
プリント基板１６の銅箔面に半田がコーチングされる。
半田がコーチングされたプリント基板１６は反転機１２
にとり込まれて反転され、半田コーチング面を上面とし
たプリント基板はディスペンサー１３の搬送体１３ａに
移され、搬送体１３ａを一時停止された状態でプリント
基板１６の所要個所に接着剤が付設せしめられ、更に、
搬送体１３ａの作用によりプリント基板１６はマウンタ
ー１４の搬送体１４ａに受け渡しされてマウンター１４
内にとり込まれて停止する。この停止状態で所要の電子
部品がプリント基板１６の所要個所に接着剤を介して仮
固定される。このように電子部品が仮固定されたプリン
ト基板１６は、リフロー炉１５の搬送体１５ａに受け渡
しされ、不活性ガス雰囲気のハウジング２３内にとり込
まれ、予熱部２０にて充分予熱されたのち加熱部２１で
半田を溶融して電子部品とプリント基板の銅箔面との間
の接合を行わせ、次いで冷却部２２に冷却して接合を固
定したのちプリント基板１６を外部に誘導回収して作業
は終る。[Description of operation] An embodiment of the method of the present invention using the printed circuit board soldering apparatus shown in FIG. The solder is introduced into the housing 17 in an inert gas atmosphere, preheated by the preheater 18, and then the copper foil surface of the printed circuit board 16 is coated with solder. The printed circuit board 16 coated with solder is transferred to the reversing machine 12
The printed circuit board is taken in and turned over, and the printed circuit board with the solder coating side facing upward is transferred to the conveyor 13a of the dispenser 13, and with the conveyor 13a temporarily stopped, adhesive is applied to the desired locations of the printed circuit board 16. , furthermore,
Due to the action of the carrier 13a, the printed circuit board 16 is transferred to the carrier 14a of the mounter 14 and transferred to the mounter 14.
It gets taken in and stops. In this stopped state, required electronic components are temporarily fixed to required locations on the printed circuit board 16 via an adhesive. The printed circuit board 16 on which the electronic components are temporarily fixed in this way is delivered to the carrier 15a of the reflow oven 15, taken into the housing 23 in an inert gas atmosphere, and sufficiently preheated in the preheating section 20, and then transferred to the heating section. At 21, the solder is melted to bond the electronic component and the copper foil surface of the printed circuit board, and then the solder is cooled in the cooling section 22 to fix the bond, and then the printed circuit board 16 is guided to the outside and collected, and the work is continued. end.
【００１３】半田のコーチングからリフロー炉１５にプ
リント基板１６が流れてくるまでの時間は約４〜５分間
であり、コーチングされた半田面には殆んど酸化がみら
れず再溶融しやすい状態であるが、リフロー炉１５では
最高２５０℃程度まで過熱されるため、溶融前に半田表
面の酸化が行われ、必ずしも良好な半田付けが得られな
いが、不活性ガス雰囲気内で加熱処理を行うことから酸
化がなく、良好な半田付けが可能となる。The time from solder coating until the printed circuit board 16 flows into the reflow oven 15 is approximately 4 to 5 minutes, and the coated solder surface is in a state where almost no oxidation is observed and it is easy to remelt. However, since the reflow oven 15 heats up to a maximum of about 250°C, the solder surface is oxidized before melting, and good soldering is not necessarily obtained, but heat treatment is performed in an inert gas atmosphere. Therefore, there is no oxidation and good soldering is possible.
【００１４】図２は、請求項２の半田付け方法を実施す
る装置を示しており、この装置による半田付け手段を説
明すると、プリント基板１６をフラックス塗布機２４の
搬送体２４ａにとりつけ、ハウジング２６を搬送移動さ
せながらフラックスアトマイザー２５によって弱いフラ
ックスを霧状にして付着させる。弱いフラックスが塗布
されたプリント基板１６は半田付け機１１の搬送体１１
ａに受け渡しされ、ハウジング１７内にとり込まれ、上
述のようにリフロー炉１５に送られる。このように、低
酸素濃度の不活性ガス雰囲気中において半田のコーチン
グを行うことから、弱いフラックス、詳しくは、ロジン
含有量２ｗｔ％程度のフラックスが使用できたものであ
る。FIG. 2 shows an apparatus for carrying out the soldering method of claim 2. To explain the soldering means using this apparatus, the printed circuit board 16 is attached to the carrier 24a of the flux applicator 24, and the housing 26 is While conveying and moving, a weak flux is atomized by a flux atomizer 25 and attached. The printed circuit board 16 coated with weak flux is transferred to the conveyor 11 of the soldering machine 11.
a, taken into the housing 17, and sent to the reflow oven 15 as described above. As described above, since solder coating is performed in an inert gas atmosphere with a low oxygen concentration, a weak flux, specifically a flux with a rosin content of about 2 wt%, can be used.
【００１５】[0015]
【発明の効果】上述のように本発明の構成によれば、次
のような効果が得られる。
（ａ）不活性ガス雰囲気中における半田のコーチングに
引き続き、プリント基板の反転，接着剤の付設，電子部
品の搭載仮固定、および、不活性ガス雰囲気中における
リフローにより連続的な半田付けが、ノンフラックス、
または、弱いフラックス塗布条件下で行われ、従来技術
のように、プリント基板製造業者による半田印刷による
トラブルが解消でき、加えて、フラックス使用による残
渣の除去、半田ボールの除去のための洗浄手段が省略で
き、半田付け効率の向上が図れる。
（ｂ）半田付けリードピッチが０．３ｍｍ〜０．１５ｍ
ｍと狭いファインピッチの電子部品でもきわめて容易な
リフローが可能である。
（ｃ）図４に示すように、第１行程における残存酸素濃
度を調整することにより、プリント基板表面の半田膜厚
を均一にコントロールすることができ、リフロー炉によ
る半田付け可能な半田コーチングされたプリント基板の
製造が可能である。According to the configuration of the present invention as described above, the following effects can be obtained. (a) Following solder coating in an inert gas atmosphere, continuous soldering is achieved by reversing the printed circuit board, applying adhesive, temporarily mounting and fixing the electronic components, and reflowing in an inert gas atmosphere. flux,
Alternatively, it is performed under weak flux application conditions, which eliminates the troubles caused by solder printing by printed circuit board manufacturers as in the prior art, and in addition, removes residue due to the use of flux and cleaning means for removing solder balls. It can be omitted and the soldering efficiency can be improved. (b) Soldering lead pitch is 0.3mm to 0.15m
Even electronic components with a fine pitch as narrow as m can be reflowed extremely easily. (c) As shown in Figure 4, by adjusting the residual oxygen concentration in the first step, the solder film thickness on the surface of the printed circuit board can be controlled uniformly, and the solder coated surface can be soldered in a reflow oven. It is possible to manufacture printed circuit boards.
【図１】半田付け装置の説明図である。FIG. 1 is an explanatory diagram of a soldering device.
【図２】半田付け装置の別例の説明図である。FIG. 2 is an explanatory diagram of another example of a soldering device.
【図３】半田付け機の説明図である。FIG. 3 is an explanatory diagram of a soldering machine.
【図４】半田膜厚と残存酸素濃度との特性図である。FIG. 4 is a characteristic diagram of solder film thickness and residual oxygen concentration.
【図５】従来の半田付け装置の説明図である。FIG. 5 is an explanatory diagram of a conventional soldering device.
１１ 半田付け機
１２ 反転機
１３ 接着剤塗布機（ディスペンサー）１４ 電子
部品搭載機（マウンター）１５ リフロー炉
１６ プリント基板
１７ ハウジング
１８ プリヒータ
１９ 噴流ノズルをもつ半田槽
２４ フラックス塗布機11 Soldering machine 12 Reversing machine 13 Adhesive applicator (dispenser) 14 Electronic component mounting machine (mounter) 15 Reflow oven 16 Printed circuit board 17 Housing 18 Preheater 19 Solder tank with jet nozzle 24 Flux applicator
Claims (2)
半田のコーチングを行う第１行程、大気雰囲気中で上記
プリント基板を半転する第２行程、プリント基板の所要
個所に電子部品仮固定用の接着剤を塗布する第３行程、
上記接着剤を介し電子部品をプリント基板に仮固定する
第４行程、不活性ガス雰囲気中でリフロー半田付けする
第５行程を一連のライン中で連続して行うことを特徴と
するプリント基板の半田付け方法。Claim 1: A first step of coating the printed circuit board with solder in an inert gas atmosphere, a second step of turning the printed circuit board in half in an air atmosphere, and a second step of coating the printed circuit board with solder in an inert gas atmosphere. The third step of applying adhesive,
Soldering of printed circuit boards, characterized in that the fourth step of temporarily fixing the electronic components to the printed circuit board via the adhesive and the fifth step of reflow soldering in an inert gas atmosphere are performed continuously in a series of lines. How to attach.
ト基板に弱いフラックスを塗布することを特徴とする請
求項１記載のプリント基板の半田付け方法。2. The method of soldering a printed circuit board according to claim 1, wherein a weak flux is applied to the printed circuit board as a step before the first step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11570191A JPH0758830B2 (en) | 1991-02-26 | 1991-02-26 | Printed circuit board soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11570191A JPH0758830B2 (en) | 1991-02-26 | 1991-02-26 | Printed circuit board soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04269896A true JPH04269896A (en) | 1992-09-25 |
| JPH0758830B2 JPH0758830B2 (en) | 1995-06-21 |
Family
ID=14669091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11570191A Expired - Lifetime JPH0758830B2 (en) | 1991-02-26 | 1991-02-26 | Printed circuit board soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758830B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07135063A (en) * | 1993-11-09 | 1995-05-23 | Kuroda Denki Kk | Soldering method of connecting terminal for resin coating wire |
| US5992729A (en) * | 1996-10-02 | 1999-11-30 | Mcnc | Tacking processes and systems for soldering |
| DE4443372B4 (en) * | 1993-12-24 | 2005-06-16 | Mitsubishi Denki K.K. | soldering flux |
-
1991
- 1991-02-26 JP JP11570191A patent/JPH0758830B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07135063A (en) * | 1993-11-09 | 1995-05-23 | Kuroda Denki Kk | Soldering method of connecting terminal for resin coating wire |
| DE4443372B4 (en) * | 1993-12-24 | 2005-06-16 | Mitsubishi Denki K.K. | soldering flux |
| US5992729A (en) * | 1996-10-02 | 1999-11-30 | Mcnc | Tacking processes and systems for soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0758830B2 (en) | 1995-06-21 |
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