GB2009012A - Removing Excess Solder for Soldered p.c.b. Joints - Google Patents

Removing Excess Solder for Soldered p.c.b. Joints

Info

Publication number
GB2009012A
GB2009012A GB7847116A GB7847116A GB2009012A GB 2009012 A GB2009012 A GB 2009012A GB 7847116 A GB7847116 A GB 7847116A GB 7847116 A GB7847116 A GB 7847116A GB 2009012 A GB2009012 A GB 2009012A
Authority
GB
United Kingdom
Prior art keywords
soldered
joints
removing excess
excess solder
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7847116A
Other versions
GB2009012B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLIS ENG Inc
Original Assignee
HOLLIS ENG Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOLLIS ENG Inc filed Critical HOLLIS ENG Inc
Publication of GB2009012A publication Critical patent/GB2009012A/en
Application granted granted Critical
Publication of GB2009012B publication Critical patent/GB2009012B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
GB7847116A 1977-12-02 1978-12-04 Wave soldering system Expired GB2009012B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85675977A 1977-12-02 1977-12-02
US85676077A 1977-12-02 1977-12-02
US89749278A 1978-04-18 1978-04-18
US89749378A 1978-04-18 1978-04-18

Publications (2)

Publication Number Publication Date
GB2009012A true GB2009012A (en) 1979-06-13
GB2009012B GB2009012B (en) 1982-10-13

Family

ID=27505924

Family Applications (2)

Application Number Title Priority Date Filing Date
GB23564/78A Expired GB1602779A (en) 1977-12-02 1978-05-26 Methods and apparatus for mass soldering of printed circuit boards
GB7847116A Expired GB2009012B (en) 1977-12-02 1978-12-04 Wave soldering system

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB23564/78A Expired GB1602779A (en) 1977-12-02 1978-05-26 Methods and apparatus for mass soldering of printed circuit boards

Country Status (7)

Country Link
JP (2) JPS5495955A (en)
DE (1) DE2852132A1 (en)
FR (1) FR2410938A1 (en)
GB (2) GB1602779A (en)
HK (1) HK83388A (en)
IT (1) IT1107979B (en)
NL (1) NL184862C (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0096967A1 (en) * 1982-06-11 1983-12-28 Hollis Automation, Inc. Soldering apparatus exhaust system
EP0119157A1 (en) * 1983-03-15 1984-09-19 Siemens Aktiengesellschaft Method of soldering printed circuit boards in an inert gas atmosphere
GB2150064A (en) * 1983-11-23 1985-06-26 Treiber Automation Limited Solder method and apparatus
FR2572970A1 (en) * 1984-11-15 1986-05-16 Outillages Scient Lab HEATING DEVICE FOR GENERATING A WELDING WAVE FOR A WAVE WELDING MACHINE
WO1994020253A1 (en) * 1990-07-09 1994-09-15 Electrovert Ltd. Solder nozzle with gas knife jet
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
WO2002045898A1 (en) * 2000-12-08 2002-06-13 Messer Griesheim Gmbh Method and device for soldering electronic components onto printed boards

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897894A (en) * 1981-12-07 1983-06-10 日本電気株式会社 Soldering device
DE3539585A1 (en) * 1985-10-11 1987-07-02 Kaspar Eidenberg METHOD FOR SOLDERING THE CONNECTIONS OF COMPONENTS TO THE CIRCUIT LAYERS AND SOLDERING EYES OF CIRCUIT BOARDS, AND DEVICE FOR CARRYING OUT THIS METHOD
JPH039263U (en) * 1989-06-08 1991-01-29
JP2506695Y2 (en) * 1990-08-04 1996-08-14 三菱電機株式会社 Printed circuit board cooling device
DE4416788C2 (en) * 1994-05-06 1999-08-19 Siemens Ag Process for wave soldering of printed circuit boards

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605244A (en) * 1966-04-20 1971-09-20 Electrovert Mfg Co Ltd Soldering methods and apparatus
US3398873A (en) * 1966-09-07 1968-08-27 Hollis Engineering Sumps and nozzles for soldering machines
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3773261A (en) * 1969-06-13 1973-11-20 North American Rockwell Material removing device
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
US3948212A (en) * 1972-03-30 1976-04-06 Robert Bosch G.M.B.H. Coating apparatus
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
JPS5258042A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Dip soldering device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0096967A1 (en) * 1982-06-11 1983-12-28 Hollis Automation, Inc. Soldering apparatus exhaust system
EP0119157A1 (en) * 1983-03-15 1984-09-19 Siemens Aktiengesellschaft Method of soldering printed circuit boards in an inert gas atmosphere
GB2150064A (en) * 1983-11-23 1985-06-26 Treiber Automation Limited Solder method and apparatus
FR2572970A1 (en) * 1984-11-15 1986-05-16 Outillages Scient Lab HEATING DEVICE FOR GENERATING A WELDING WAVE FOR A WAVE WELDING MACHINE
EP0186538A2 (en) * 1984-11-15 1986-07-02 Outillages Scientifiques Et De Laboratoires O.S.L. S.A. Wave-soldering machine
EP0186538A3 (en) * 1984-11-15 1986-10-15 Outillages Scientifiques Et De Laboratoires O.S.L. S.A. Wave-soldering machine
US4659003A (en) * 1984-11-15 1987-04-21 Outillages Scientifiques Et De Laboratories O.S.L. S.A. Heating device for generating a wave of solder in a wave soldering machine
WO1994020253A1 (en) * 1990-07-09 1994-09-15 Electrovert Ltd. Solder nozzle with gas knife jet
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
WO2002045898A1 (en) * 2000-12-08 2002-06-13 Messer Griesheim Gmbh Method and device for soldering electronic components onto printed boards

Also Published As

Publication number Publication date
HK83388A (en) 1988-10-21
JPS5495955A (en) 1979-07-28
GB1602779A (en) 1981-11-18
FR2410938B1 (en) 1984-11-02
NL184862C (en) 1989-11-16
JPS63268563A (en) 1988-11-07
IT7852160A0 (en) 1978-12-01
DE2852132C2 (en) 1989-08-10
GB2009012B (en) 1982-10-13
FR2410938A1 (en) 1979-06-29
DE2852132A1 (en) 1979-06-07
NL7811803A (en) 1979-06-06
IT1107979B (en) 1985-12-02

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Effective date: 19981203