JPS5593294A - Reflow soldering method - Google Patents

Reflow soldering method

Info

Publication number
JPS5593294A
JPS5593294A JP47679A JP47679A JPS5593294A JP S5593294 A JPS5593294 A JP S5593294A JP 47679 A JP47679 A JP 47679A JP 47679 A JP47679 A JP 47679A JP S5593294 A JPS5593294 A JP S5593294A
Authority
JP
Japan
Prior art keywords
reflow soldering
soldering method
reflow
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47679A
Other languages
Japanese (ja)
Inventor
Kazuo Deguchi
Futoshi Matsui
Seiji Oikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP47679A priority Critical patent/JPS5593294A/en
Publication of JPS5593294A publication Critical patent/JPS5593294A/en
Pending legal-status Critical Current

Links

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP47679A 1979-01-05 1979-01-05 Reflow soldering method Pending JPS5593294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47679A JPS5593294A (en) 1979-01-05 1979-01-05 Reflow soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47679A JPS5593294A (en) 1979-01-05 1979-01-05 Reflow soldering method

Publications (1)

Publication Number Publication Date
JPS5593294A true JPS5593294A (en) 1980-07-15

Family

ID=11474825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47679A Pending JPS5593294A (en) 1979-01-05 1979-01-05 Reflow soldering method

Country Status (1)

Country Link
JP (1) JPS5593294A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153495A (en) * 1981-03-18 1982-09-22 Sharp Kk Method of producing printed circuit board
JPS60191346U (en) * 1984-05-28 1985-12-18 ロ−ム株式会社 thermal printing head
JPS6113891U (en) * 1984-06-29 1986-01-27 関西日本電気株式会社 Thin film EL panel
JPS6247189A (en) * 1985-08-26 1987-02-28 日立コンデンサ株式会社 Manufacture of printed wiring board
JPS62128671U (en) * 1986-02-08 1987-08-14
JPH02136361U (en) * 1989-04-19 1990-11-14
JPH03101190A (en) * 1989-09-14 1991-04-25 Minolta Camera Co Ltd Method of connecting printed wiring board
JPH0593071U (en) * 1992-05-20 1993-12-17 株式会社東芝 Board connection structure
JPH0832195A (en) * 1994-07-11 1996-02-02 Nippondenso Co Ltd Connection structure of composite printed board
JP2008205132A (en) * 2007-02-19 2008-09-04 Nec Corp Printed wiring board, and solder connection structure and method between the structure and flexible printed board
JP2008210993A (en) * 2007-02-26 2008-09-11 Nec Corp Printed wiring board and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334501U (en) * 1976-08-30 1978-03-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334501U (en) * 1976-08-30 1978-03-27

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153495A (en) * 1981-03-18 1982-09-22 Sharp Kk Method of producing printed circuit board
JPS60191346U (en) * 1984-05-28 1985-12-18 ロ−ム株式会社 thermal printing head
JPS6113891U (en) * 1984-06-29 1986-01-27 関西日本電気株式会社 Thin film EL panel
JPH0228546Y2 (en) * 1984-06-29 1990-07-31
JPS6247189A (en) * 1985-08-26 1987-02-28 日立コンデンサ株式会社 Manufacture of printed wiring board
JPS62128671U (en) * 1986-02-08 1987-08-14
JPH02136361U (en) * 1989-04-19 1990-11-14
JPH03101190A (en) * 1989-09-14 1991-04-25 Minolta Camera Co Ltd Method of connecting printed wiring board
JPH0593071U (en) * 1992-05-20 1993-12-17 株式会社東芝 Board connection structure
JPH0832195A (en) * 1994-07-11 1996-02-02 Nippondenso Co Ltd Connection structure of composite printed board
JP2008205132A (en) * 2007-02-19 2008-09-04 Nec Corp Printed wiring board, and solder connection structure and method between the structure and flexible printed board
JP2008210993A (en) * 2007-02-26 2008-09-11 Nec Corp Printed wiring board and method of manufacturing the same

Similar Documents

Publication Publication Date Title
GB2058335B (en) Soldering apparatus
DE3265496D1 (en) Fluxless soldering process
JPS5593294A (en) Reflow soldering method
DE3171729D1 (en) Soldering apparatus
JPS575396A (en) Soldering method
JPS5476975A (en) Soldering method
DE3067140D1 (en) Soldering apparatus
JPS53112241A (en) Solder welding method
JPS5352264A (en) Soldering method
JPS54118361A (en) Soldering method
JPS5567190A (en) Soldering method
JPS5372756A (en) Soldering method
JPS57104294A (en) Solder connecting method
JPS55124296A (en) Soldering method
GB2063135B (en) Soldering and desoldering apparatus
JPS56102088A (en) Automatically soldering method
JPS5593293A (en) Method of soldering
GB1553069A (en) Soldering fluxes
JPS52156750A (en) Soldering method
JPS52128564A (en) Soldering method
JPS5661196A (en) Soldering method
JPS5598894A (en) Soldering method
JPS5389847A (en) Parts soldering method
JPS53106653A (en) Soldering method
JPS54133448A (en) Soldering flux