JPS5593294A - Reflow soldering method - Google Patents
Reflow soldering methodInfo
- Publication number
- JPS5593294A JPS5593294A JP47679A JP47679A JPS5593294A JP S5593294 A JPS5593294 A JP S5593294A JP 47679 A JP47679 A JP 47679A JP 47679 A JP47679 A JP 47679A JP S5593294 A JPS5593294 A JP S5593294A
- Authority
- JP
- Japan
- Prior art keywords
- reflow soldering
- soldering method
- reflow
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47679A JPS5593294A (en) | 1979-01-05 | 1979-01-05 | Reflow soldering method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47679A JPS5593294A (en) | 1979-01-05 | 1979-01-05 | Reflow soldering method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5593294A true JPS5593294A (en) | 1980-07-15 |
Family
ID=11474825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47679A Pending JPS5593294A (en) | 1979-01-05 | 1979-01-05 | Reflow soldering method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5593294A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153495A (en) * | 1981-03-18 | 1982-09-22 | Sharp Kk | Method of producing printed circuit board |
JPS60191346U (en) * | 1984-05-28 | 1985-12-18 | ロ−ム株式会社 | thermal printing head |
JPS6113891U (en) * | 1984-06-29 | 1986-01-27 | 関西日本電気株式会社 | Thin film EL panel |
JPS6247189A (en) * | 1985-08-26 | 1987-02-28 | 日立コンデンサ株式会社 | Manufacture of printed wiring board |
JPS62128671U (en) * | 1986-02-08 | 1987-08-14 | ||
JPH02136361U (en) * | 1989-04-19 | 1990-11-14 | ||
JPH03101190A (en) * | 1989-09-14 | 1991-04-25 | Minolta Camera Co Ltd | Method of connecting printed wiring board |
JPH0593071U (en) * | 1992-05-20 | 1993-12-17 | 株式会社東芝 | Board connection structure |
JPH0832195A (en) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | Connection structure of composite printed board |
JP2008205132A (en) * | 2007-02-19 | 2008-09-04 | Nec Corp | Printed wiring board, and solder connection structure and method between the structure and flexible printed board |
JP2008210993A (en) * | 2007-02-26 | 2008-09-11 | Nec Corp | Printed wiring board and method of manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5334501U (en) * | 1976-08-30 | 1978-03-27 |
-
1979
- 1979-01-05 JP JP47679A patent/JPS5593294A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5334501U (en) * | 1976-08-30 | 1978-03-27 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57153495A (en) * | 1981-03-18 | 1982-09-22 | Sharp Kk | Method of producing printed circuit board |
JPS60191346U (en) * | 1984-05-28 | 1985-12-18 | ロ−ム株式会社 | thermal printing head |
JPS6113891U (en) * | 1984-06-29 | 1986-01-27 | 関西日本電気株式会社 | Thin film EL panel |
JPH0228546Y2 (en) * | 1984-06-29 | 1990-07-31 | ||
JPS6247189A (en) * | 1985-08-26 | 1987-02-28 | 日立コンデンサ株式会社 | Manufacture of printed wiring board |
JPS62128671U (en) * | 1986-02-08 | 1987-08-14 | ||
JPH02136361U (en) * | 1989-04-19 | 1990-11-14 | ||
JPH03101190A (en) * | 1989-09-14 | 1991-04-25 | Minolta Camera Co Ltd | Method of connecting printed wiring board |
JPH0593071U (en) * | 1992-05-20 | 1993-12-17 | 株式会社東芝 | Board connection structure |
JPH0832195A (en) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | Connection structure of composite printed board |
JP2008205132A (en) * | 2007-02-19 | 2008-09-04 | Nec Corp | Printed wiring board, and solder connection structure and method between the structure and flexible printed board |
JP2008210993A (en) * | 2007-02-26 | 2008-09-11 | Nec Corp | Printed wiring board and method of manufacturing the same |
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