FR2423956A1 - Procede et appareil de montage de composants sur une plaque de circuit imprime - Google Patents
Procede et appareil de montage de composants sur une plaque de circuit imprimeInfo
- Publication number
- FR2423956A1 FR2423956A1 FR7909754A FR7909754A FR2423956A1 FR 2423956 A1 FR2423956 A1 FR 2423956A1 FR 7909754 A FR7909754 A FR 7909754A FR 7909754 A FR7909754 A FR 7909754A FR 2423956 A1 FR2423956 A1 FR 2423956A1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- components
- mounting components
- predetermined positions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1763—Magazine stack directly contacting separate work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1776—Means separating articles from bulk source
- Y10T156/1778—Stacked sheet source
- Y10T156/1783—Translating picker
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53252—Means to simultaneously fasten three or more parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53478—Means to assemble or disassemble with magazine supply
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
L'invention concerne un procédé et un appareil de montage de composants du type plat sur des positions prédéterminées d'une plaque de circuit imprimé. L'appareil comporte un dispositif à succion qui aspire chaque composant empilé dans un magasin tubulaire vertical et qui transfère et positionne uniformément les composantes dans les positions prédéterminées de la plaque de circuit imprimé qui porte des conducteurs sur sa surface supérieure. Le procédé et l'appareil sont destinés particulièrement à monter des composants plats ne comportant aucun fil de connexion.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1978050220U JPS5633200Y2 (fr) | 1978-04-18 | 1978-04-18 | |
JP1978050219U JPS5633199Y2 (fr) | 1978-04-18 | 1978-04-18 | |
JP5481678U JPS54156755U (fr) | 1978-04-25 | 1978-04-25 | |
JP5481778U JPS54156756U (fr) | 1978-04-25 | 1978-04-25 | |
JP11874878U JPS5537210U (fr) | 1978-08-30 | 1978-08-30 | |
JP1978160112U JPS58312Y2 (ja) | 1978-11-22 | 1978-11-22 | 電子部品押し上げピン機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2423956A1 true FR2423956A1 (fr) | 1979-11-16 |
FR2423956B1 FR2423956B1 (fr) | 1982-11-19 |
Family
ID=27550390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7909754A Granted FR2423956A1 (fr) | 1978-04-18 | 1979-04-18 | Procede et appareil de montage de composants sur une plaque de circuit imprime |
Country Status (10)
Country | Link |
---|---|
US (1) | US4292116A (fr) |
AT (1) | AT377673B (fr) |
AU (1) | AU524769B2 (fr) |
CA (1) | CA1130477A (fr) |
CH (1) | CH640993A5 (fr) |
DE (1) | DE2915366A1 (fr) |
FR (1) | FR2423956A1 (fr) |
GB (1) | GB2025910B (fr) |
IT (1) | IT1166750B (fr) |
NL (1) | NL172293C (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2494070A1 (fr) * | 1980-11-13 | 1982-05-14 | Philips Nv | Dispositif servant a la mise en place simultanee de plusieurs pieces electriques et/ou electroniques sur un panneau de cablage imprime |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2935021A1 (de) * | 1979-08-30 | 1981-03-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung und verfahren zur bestueckung von leiterplatten mit elektrischen bauelementen |
DE2935082A1 (de) * | 1979-08-30 | 1981-03-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zum auftrag viskoser fluessigkeit auf einem flaechigen traegerkoerper |
DE2935081C2 (de) * | 1979-08-30 | 1985-12-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zur Bestückung von Leiterplatten. |
US4353481A (en) * | 1979-10-23 | 1982-10-12 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Magazine for storing and supplying circuit elements |
JPS5694800A (en) * | 1979-12-28 | 1981-07-31 | Taiyo Yuden Kk | Method and device for mounting electronic part |
FR2474270A1 (fr) * | 1980-01-21 | 1981-07-24 | Radiotechnique Compelec | Procede et dispositif d'assemblage simultane de composants sur un support |
US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
US4461610A (en) * | 1980-06-02 | 1984-07-24 | Tdk Corporation | Apparatus for mounting chip type circuit elements on printed circuit boards |
IT1131749B (it) * | 1980-07-22 | 1986-06-25 | Ferco Spa | Procedimento e relativo dispositivo di alimentazione di oggetti pressappoco parallelepipedi di dimensioni diverse il quale fornisce serie consecutive di oggetti su un piano di deposito unico |
IT1193984B (it) * | 1980-10-03 | 1988-08-31 | Ferco Spa | Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati |
NL8006058A (nl) * | 1980-11-06 | 1982-06-01 | Philips Nv | Inrichting voor het opschuiven van in magazijnen opgenomen onderdelen. |
DE3043749A1 (de) * | 1980-11-20 | 1982-07-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren und vorrichtung zum bestuecken von leiterplatten |
JPS57211430A (en) * | 1981-06-16 | 1982-12-25 | Sony Corp | Method for supplying parts to automatic assembly machine and carrier for it |
US4569305A (en) * | 1981-10-09 | 1986-02-11 | Ferco S.R.L. | Apparatus to provide the application of glue on preselected zones of printed circuit boards |
NL8201532A (nl) * | 1982-04-13 | 1983-11-01 | Philips Nv | Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer. |
NL8201653A (nl) * | 1982-04-21 | 1983-11-16 | Philips Nv | Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat. |
US4449282A (en) * | 1982-08-18 | 1984-05-22 | At&T Technologies, Inc. | Assembling components such as lids to chip enclosures |
US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
SE454643B (sv) * | 1983-06-13 | 1988-05-16 | Sincotron Aps | Sett och anordning for att pa ett kretskort montera elektroniska komponenter |
US4696351A (en) * | 1983-08-26 | 1987-09-29 | C O D Inter Techniques Sa | Assembly robot with reaction absorbing platform |
DE3410130C1 (de) * | 1984-03-20 | 1985-10-10 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Werkstuecktraeger fuer Leiterplatten |
US4626167A (en) * | 1984-03-22 | 1986-12-02 | Thomson Components-Mostek Corporation | Manipulation and handling of integrated circuit dice |
US4548667A (en) * | 1984-03-28 | 1985-10-22 | Wical Robert M | Planned coordinate component placement system |
US4531277A (en) * | 1984-04-12 | 1985-07-30 | At&T Technologies, Inc. | Assembling components having mating faces |
US4573254A (en) * | 1984-12-24 | 1986-03-04 | Sperry Corporation | Apparatus for maintaining electronic component pin alignment |
GB2173426A (en) * | 1985-04-09 | 1986-10-15 | Dynapert Precima Ltd | Component placement machine |
EP0208492A3 (fr) * | 1985-07-12 | 1989-02-08 | AB Electronic Components Limited | Assemblage de composants montés en surface |
US4832784A (en) * | 1986-06-02 | 1989-05-23 | Motorola Inc. | Positive stop, pick up tool |
US4817273A (en) * | 1987-04-30 | 1989-04-04 | Reliability Incorporated | Burn-in board loader and unloader |
US4985107A (en) * | 1988-03-01 | 1991-01-15 | Sci Systems, Inc. | Component location device and method for surface-mount printed circuit boards |
US4941255A (en) * | 1989-11-15 | 1990-07-17 | Eastman Kodak Company | Method for precision multichip assembly |
US5040291A (en) * | 1990-05-04 | 1991-08-20 | Universal Instruments Corporation | Multi-spindle pick and place method and apparatus |
US5117555A (en) * | 1991-01-17 | 1992-06-02 | International Business Machines Corporation | Modular system and method for populating circuit boards |
JP2811613B2 (ja) * | 1991-09-02 | 1998-10-15 | ティーディーケイ株式会社 | 電子部品の製造方法及び装置 |
US5670009A (en) * | 1995-02-28 | 1997-09-23 | Eastman Kodak Company | Assembly technique for an image sensor array |
KR100262844B1 (ko) * | 1996-04-01 | 2000-09-01 | 모리시타 요이찌 | 도전성 보올의 탑재장치 및 방법 |
US6161749A (en) * | 1998-07-13 | 2000-12-19 | Ericsson, Inc. | Method and apparatus for holding a printed circuit board during assembly |
US6346154B1 (en) * | 1999-08-25 | 2002-02-12 | Herve Briend | Suction plate for holding and supporting electronic circuit boards during printing operation |
JP3588444B2 (ja) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | 電子部品、部品実装装置及び部品実装方法 |
US7886430B2 (en) * | 2002-12-13 | 2011-02-15 | Hewlett-Packard Development Company, L.P. | Method of installing circuit board component |
JP3833997B2 (ja) * | 2002-12-17 | 2006-10-18 | オリオン電機株式会社 | プリント回路板の製造方法 |
US7604451B2 (en) * | 2003-03-10 | 2009-10-20 | Honeywell Federal Manufacturing & Technologies, Llc | Feed mechanism and method for feeding minute items |
JP4319220B2 (ja) * | 2004-02-24 | 2009-08-26 | 株式会社 大昌電子 | マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法 |
JP5110163B2 (ja) * | 2008-07-17 | 2012-12-26 | 株式会社村田製作所 | 部品内蔵モジュールの製造方法 |
US8297472B2 (en) * | 2010-11-24 | 2012-10-30 | Texas Instruments Incorporated | Pellet loader with pellet separator for molding IC devices |
DE102012218322A1 (de) | 2012-10-09 | 2014-04-10 | Continental Automotive Gmbh | Verfahren zur Bestückung einer Leiterplatte und Bestückungsvorrichtung |
CN105438885B (zh) * | 2015-11-24 | 2017-05-31 | 宁波普利达智能科技应用有限公司 | 贴双面胶的机构 |
CN111180374A (zh) * | 2018-09-01 | 2020-05-19 | 温州市科泓机器人科技有限公司 | 芯片的智能化传送系统 |
CN115802639B (zh) * | 2022-12-14 | 2023-06-09 | 深圳市星迅电子科技有限公司 | 一种异形插件机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3718800A (en) * | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
US4009785A (en) * | 1974-10-02 | 1977-03-01 | Motorola, Inc. | Fixture and system for handling plate like objects |
DE2716330A1 (de) * | 1976-04-12 | 1977-12-08 | Matsushita Electric Ind Co Ltd | Verfahren zur bestueckung von schaltungsplatinen mit plaettchenfoermigen schaltungsbauteilen und vorrichtung zur durchfuehrung desselben |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3155936A (en) * | 1958-04-24 | 1964-11-03 | Motorola Inc | Transistor device with self-jigging construction |
US3009560A (en) * | 1960-02-15 | 1961-11-21 | Pacific Semiconductors Inc | Dice positioner |
US3479716A (en) * | 1966-12-05 | 1969-11-25 | Kulicke & Soffa Ind Inc | Automatic dice dispenser for semiconductor bonding |
US3757995A (en) * | 1971-05-20 | 1973-09-11 | Sperry Rand Corp | Small particle dispenser |
US3992245A (en) * | 1974-11-19 | 1976-11-16 | Franklin Earl E | Machine for delivering secondary work-pieces to primary work-pieces |
JPS52124168A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of assembling electronic device circuit |
-
1979
- 1979-04-10 US US06/028,924 patent/US4292116A/en not_active Expired - Lifetime
- 1979-04-11 GB GB7912687A patent/GB2025910B/en not_active Expired
- 1979-04-14 DE DE19792915366 patent/DE2915366A1/de not_active Withdrawn
- 1979-04-18 FR FR7909754A patent/FR2423956A1/fr active Granted
- 1979-04-18 AU AU46178/79A patent/AU524769B2/en not_active Ceased
- 1979-04-18 CH CH364379A patent/CH640993A5/de not_active IP Right Cessation
- 1979-04-18 NL NLAANVRAGE7903043,A patent/NL172293C/xx not_active IP Right Cessation
- 1979-04-18 AT AT0291679A patent/AT377673B/de not_active IP Right Cessation
- 1979-04-18 CA CA325,743A patent/CA1130477A/fr not_active Expired
- 1979-04-18 IT IT7921952A patent/IT1166750B/it active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3718800A (en) * | 1968-03-05 | 1973-02-27 | Argus Eng Co | Infrared heating apparatus |
US4009785A (en) * | 1974-10-02 | 1977-03-01 | Motorola, Inc. | Fixture and system for handling plate like objects |
DE2716330A1 (de) * | 1976-04-12 | 1977-12-08 | Matsushita Electric Ind Co Ltd | Verfahren zur bestueckung von schaltungsplatinen mit plaettchenfoermigen schaltungsbauteilen und vorrichtung zur durchfuehrung desselben |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2494070A1 (fr) * | 1980-11-13 | 1982-05-14 | Philips Nv | Dispositif servant a la mise en place simultanee de plusieurs pieces electriques et/ou electroniques sur un panneau de cablage imprime |
Also Published As
Publication number | Publication date |
---|---|
ATA291679A (de) | 1984-08-15 |
CH640993A5 (de) | 1984-01-31 |
NL172293C (nl) | 1984-12-17 |
AU4617879A (en) | 1979-10-25 |
AT377673B (de) | 1985-04-25 |
CA1130477A (fr) | 1982-08-24 |
IT7921952A0 (it) | 1979-04-18 |
NL172293B (nl) | 1983-03-01 |
FR2423956B1 (fr) | 1982-11-19 |
DE2915366A1 (de) | 1979-10-31 |
GB2025910A (en) | 1980-01-30 |
IT1166750B (it) | 1987-05-06 |
GB2025910B (en) | 1982-06-09 |
US4292116A (en) | 1981-09-29 |
NL7903043A (nl) | 1979-10-22 |
AU524769B2 (en) | 1982-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |