WO2021084842A1 - Ｉｃ検査用ソケット - Google Patents

Ｉｃ検査用ソケット Download PDF

Info

Publication number
WO2021084842A1
WO2021084842A1 PCT/JP2020/030591 JP2020030591W WO2021084842A1 WO 2021084842 A1 WO2021084842 A1 WO 2021084842A1 JP 2020030591 W JP2020030591 W JP 2020030591W WO 2021084842 A1 WO2021084842 A1 WO 2021084842A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide plate
cover
pin block
screw
inspection socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/030591
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
康平 甘田
勇輝 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Yokowo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd, Yokowo Mfg Co Ltd filed Critical Yokowo Co Ltd
Priority to US17/773,036 priority Critical patent/US20240168054A1/en
Priority to CN202080075470.8A priority patent/CN114616725A/zh
Publication of WO2021084842A1 publication Critical patent/WO2021084842A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/508—Bases; Cases composed of different pieces assembled by a separate clip or spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/512—Bases; Cases composed of different pieces assembled by screw or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only

Definitions

  • the present invention relates to an IC (Integrated Circuit) inspection socket.
  • An IC inspection socket is used for inspecting an IC package (see, for example, Patent Document 1).
  • the IC inspection socket has a pin block in which a plurality of contact probes corresponding to each of the electrode terminals of the IC are erected, and a guide member provided above the pin block.
  • the guide member of the conventional IC inspection socket is a method of being fixed to a pin block with a screw as disclosed in Patent Document 2.
  • the IC inspection socket has the following problems. Since the arrangement of the electrode terminals is the same, we want to share the pin block, but since the outer shape of the IC package is different, it is necessary to replace the guide member. However, there is a problem that this replacement work is troublesome. In order to replace the guide member, it is troublesome to remove the screw fixing the guide member to the pin block, take out the guide member, and then fix the guide member to be replaced to the pin block with the screw. ..
  • An example of an object of the present invention is to facilitate the work of inspecting an IC package having a different outer shape of the package in the socket for IC inspection.
  • One aspect of the present invention includes a pin block having a contact probe array, a guide plate for guiding an IC (Integrated Circuit) package to be inspected to the contact probe array, and an engaging portion that engages with the pin block.
  • a cover that holds the guide plate by engaging the engaging portion is provided, and the pin block is provided on a support portion that detachably supports the guide plate and a guide plate supported by the support portion.
  • This is an IC inspection socket having an engaged portion with which the engaging portion engages when the cover slides to move.
  • the cover is not fixed to the pin block with screws, and the guide plate can be removed simply by sliding the cover. Therefore, when inspecting an IC package having a different outer shape of the package, the work of exchanging the guide plate becomes easy.
  • the external view which shows the structural example of the socket for IC inspection.
  • Top view showing a configuration example of a socket body.
  • Top view showing a configuration example of a pin block.
  • Top view showing a configuration example of a guide plate.
  • Top view showing a configuration example of a cover.
  • the bottom view which shows the structural example of a cover.
  • Vertical sectional views of VIII-VIII cross sections of FIGS. 6 and 7. The figure (1) for demonstrating the assembly procedure of a socket body.
  • FIG. 1 is an external view showing a configuration example of the IC inspection socket 10 of the present embodiment.
  • the IC inspection socket 10 includes a lid 14 and a pressurizing mechanism 16 above the socket body 12.
  • the socket body 12 is attached to the inspection device 5.
  • the lid body 14 is swingably supported by a lid body swing shaft 18 along the X-axis direction, and a pressurizing mechanism 16 is supported above the socket body 12.
  • the pressurizing mechanism 16 applies a load downward to the IC package 9 to be inspected contained in the socket body 12.
  • a hook 20 is provided on the minus side in the Y-axis direction (to the right when facing FIG. 1), which is the side of the lid 14 opposite to the side where the lid swing shaft 18 is provided.
  • the hook 20 is swingably supported by the hook swing shaft 22 along the X-axis direction, and is urged by the coil spring 24 in the hook swing shaft 22 in the clockwise direction when viewed from the minus side in the X-axis direction. ing.
  • the hook 20 maintains a state in which the lid 14 covers the upper part of the socket body 12 by engaging the engaging claw 21 with the socket body 12. By swinging the lid 14 by removing the hook 20, the inside of the socket body 12 is exposed, and the IC package 9 to be inspected can be taken in and out.
  • FIG. 2 is a top view showing a configuration example of the socket body 12.
  • FIG. 3 is a vertical cross-sectional view of the III-III cross section of FIG. 2 as viewed from the minus side in the Y-axis direction.
  • the socket body 12 has a pin block 30, a guide plate 40, and a cover 50.
  • FIG. 4 is a top view showing a configuration example of the pin block 30.
  • the pin block 30 serves as a base for the socket body 12.
  • the pin block 30 has an accommodating recess 32 having a bottom surface along the XY plane, and a contact probe array 60 is provided at the center of the accommodating recess 32.
  • the pin block 30 has a restraining elastic portion 82 constituting the displacement suppressing portion 80.
  • the contact probe array 60 is configured by arranging a plurality of contact probes along the XY plane so as to correspond to the arrangement of the electrode terminals of the IC package 9 to be inspected. Each contact probe of the contact probe array 60 is erected in the accommodating recess 32 so that the longitudinal direction is along the Z-axis direction.
  • the top view outer shape of the accommodating recess 32 is set to be similar to or substantially similar to the top view outer shape of the guide plate 40.
  • the guide plate 40 can be placed in the accommodating recess 32 in a posture substantially parallel to the XY plane and fitted into the recess from above.
  • the accommodating recess 32 functions as a guide accommodating mechanism for guiding and accommodating the lower portion (the portion on the minus side in the Z-axis direction) of the guide plate 40 to a predetermined position.
  • the pin block 30 has a plurality of support portions 70 at both ends of the accommodating recess 32 in the Y-axis direction.
  • the support portion 70 has a spring 72 installed inside the pin block 30, and a spring cap 74 that is placed on the upper portion of the spring 72 and is urged upward by the spring 72 (see FIG. 3).
  • the head (upper end) of the spring cap 74 projects from the bottom surface of the accommodating recess 32.
  • the support portion 70 elastically supports the guide plate 40.
  • a parallel pin 34 is erected on the bottom surface of the accommodating recess 32 in parallel with the Z-axis direction.
  • two parallel pins 34 are erected.
  • the guide plate 40 is provided with an insertion hole 42 through which the parallel pin 34 is inserted.
  • the guide plate 40 supported by the support portion 70 is elastically supported so as to be movable up and down along the Z-axis direction by the parallel pin 34 being inserted into the insertion hole 42 and the guide accommodating mechanism of the accommodating recess 32. To. As a result, the guide plate 40 is elastically supported with respect to the contact probe array 60 so that it can be approached / separated.
  • An engaged portion 36 with which the cover 50 is slidably engaged is provided on the upper surface of the pin block 30 which corresponds to the outer edge of the accommodating recess 32.
  • the engaged portion 36 includes a screw 36a, a screw hole 36b provided on the upper surface of the pin block 30, and a protrusion protruding from the upper surface of the pin block 30 at the outer peripheral portion of the screw hole 36b. It has 36c and.
  • the screw 36a is a small screw having a flat head and a seat surface substantially orthogonal to the screw portion.
  • the screw 36a may be a tapping screw. In that case, it is not necessary to form a female screw in the screw hole 36b.
  • FIG. 5 is a top view showing a configuration example of the guide plate 40.
  • the guide plate 40 is a plate-shaped guide member that guides the IC package 9 to be inspected to the contact probe array 60 of the pin block 30. Since it is elastically supported by the support portion 70, it can also be called a floating plate.
  • the guide plate 40 has an outer edge portion 46, a window portion 44, a guide surface 48 inclined from the upper end surface of the outer edge portion 46 toward the edge of the window portion 44, and a shelf-shaped positioning portion 49.
  • the window portion 44 is a space provided in the central portion of the guide plate 40 in the top view in order to expose the contact probe array 60 of the pin block 30 in the top view.
  • the positioning portion 49 has an elevation surface 49a along the Z axis that falls below the lower end of the guide surface 48, and a shelf-shaped portion 49b extending along the XY plane toward the inside of the window portion of the window portion 44. ..
  • the IC package 9 to be inspected is inserted from above into the window 44 of the guide plate 40 with the electrode terminals facing down.
  • the inserted IC package 9 to be inspected slides down while the outer edge portion abuts on the guide surface 48 and the posture at the time of insertion is substantially maintained.
  • the IC package 9 to be inspected stops with the outer edge fitted in the elevation surface 49a of the positioning portion 49 and the four corners resting on the shelf-shaped portion 49b.
  • the IC package 9 to be inspected in this state is positioned so that one contact probe of the corresponding contact probe array 60 is located directly under each of the electrode terminals on the bottom surface.
  • FIG. 6 is a top view showing a configuration example of the cover 50.
  • FIG. 7 is a bottom view showing a configuration example of the cover 50.
  • FIG. 8 is a vertical sectional view of a cross section of VIII-VIII of FIGS. 6 and 7.
  • the cover 50 is a member that holds the guide plate 40 in a state of being elastically supported by being placed on the support portion 70 in the accommodating recess 32 from above.
  • the cover 50 is a member having a window portion 51 larger than the window portion 44 of the guide plate 40 and smaller than the top view outer shape of the guide plate 40 at the center of the plate-shaped member in the upper view.
  • the cover 50 can be said to be a frame body having a small thickness (thin in the Z direction) and having an opening at the center.
  • a facing recess 52 that faces and contacts the upper surface of the guide plate 40 is recessed.
  • the facing recess 52 is a portion shown by hatching in FIG. 7, and is provided on the lower surface of the cover 50 on the side portion on the X-axis plus side and the side portion on the X-axis minus side of the window portion 51.
  • the step depth D1 (concave size: see FIG. 8) of the facing recess 52 is the same as or equal to the dimension in which the upper portion of the guide plate 40 in a state of being elastically supported by the support portion 70 projects upward from the upper surface of the pin block 30. It is set slightly larger.
  • the width of the facing recess 52 in the Y-axis direction is set to be slightly larger than the width of the guide plate 40 (two-dot chain line in FIG. 7) in the Y-axis direction.
  • the width in the X-axis direction of the facing recess 52 is set to be slightly larger than the sum of the width in the X-axis direction of the guide plate 40 and the slide distance by the slide operation of the cover 50, which will be described later.
  • the cover 50 has a first fixing portion 53 at the end on the minus side of the X-axis (lower side toward FIGS. 6 and 7), and the end on the plus side of the X-axis (upper side toward FIGS. 6 and 7).
  • the portion has a second fixing portion 54.
  • One first fixing portion 53 is provided at each corner of the upper surface viewing angle on the minus side of the X axis of the cover 50.
  • the first fixing portion 53 has an introduction opening 53a, a narrow width portion 53b, and a first engaging portion 53c.
  • the introduction opening 53a is a notch that opens on the side surface of the cover 50 on the minus side of the X axis.
  • the opening width W3 of the introduction opening 53a in the Y-axis direction in the top view is slightly larger than the outer shape of the head of the screw 36a.
  • the narrow width portion 53b is a portion where the opening width is narrower than that of the introduction opening portion 53a on the positive side (the back side of the notch) in the X-axis direction of the first fixing portion 53.
  • the opening width W4 of the narrow width portion 53b in the Y-axis direction in the top view is smaller than the outer shape of the head of the screw 36a and slightly larger than the outer shape of the screw portion of the screw 36a.
  • the first engaging portion 53c is a portion one step lower than the upper surface of the cover 50 provided around the narrow width portion 53b, in other words, a portion having a partially thin thickness.
  • the thickness T1 (see FIG. 8) of the first engaging portion 53c is set to be slightly smaller than the height of the protruding portion 36c of the pin block 30.
  • the height of the protrusion 36c of the pin block 30 is larger than the thickness of the first engaging portion 53c.
  • the height of the protrusion 36c of the pin block 30 is smaller than the thickness of the cover 50.
  • the second fixing portion 54 is provided at each of the upper viewing angle corners on the X-axis plus side of the cover 50.
  • the second fixing portion 54 has a through opening portion 54a and a second engaging portion 54d.
  • the through opening 54a is a through hole penetrating the top and bottom of the cover 50, and has an insertion portion 54b and a narrow width portion 54c.
  • the narrow portion 54c communicates with the end of the circular insertion portion 54b on the plus side of the X axis to form a united shape.
  • the opening diameter D4 (width in the Y-axis direction and width in the X-axis direction) of the insertion portion 54b is slightly larger than the outer shape of the head of the screw 36a.
  • the opening width D5 of the narrow width portion 54c in the Y-axis direction in the top view is smaller than the outer shape of the head of the screw 36a and slightly larger than the outer shape of the screw portion of the screw 36a.
  • the second engaging portion 54d is a portion one step lower than the upper surface of the cover 50 provided around the narrow width portion 54c, in other words, a portion having a partially thin thickness.
  • the thickness of the second engaging portion 54d is the same as the thickness T1 of the first engaging portion 53c (see FIG. 8), and is set to be slightly smaller than the height of the protruding portion 36c of the pin block 30.
  • the height of the protrusion 36c of the pin block 30 is larger than the thickness of the second engaging portion 54d.
  • the height of the protrusion 36c of the pin block 30 is smaller than the thickness of the cover 50.
  • the displacement suppressing portion 80 has a restraining elastic portion 82 (see FIG. 3) that elastically protrudes upward from the upper surface of the pin block 30, and a through hole 84 (see FIG. 6) that is provided in the cover 50 and penetrates vertically. ..
  • the restraining elastic portion 82 has an urged member 82b urged upward by a spring 82a inside the pin block 30 on the plus side of the X-axis (for example, the urged member 82b is made of a metal cylindrical material. It is tilted down along the Y-axis direction).
  • the through hole 84 is located above the restraining elastic portion 82.
  • the cover 50 is prevented from being displaced in the X-axis direction by the portion of the restraining elastic portion 82 protruding from the upper surface of the pin block 30 being fitted and engaged with the inside of the through hole 84 (see FIG. 3).
  • the procedure for assembling the socket body 12 will be described.
  • the operator fits the guide plate 40 into the accommodating recess 32 of the pin block 30 from above.
  • the parallel pin 34 is inserted into the insertion hole 42.
  • the lower surface of the guide plate 40 comes into contact with the upper surface of the support portion 70, and the guide plate 40 is elastically supported by the support portion 70.
  • the lower surface of the guide plate 40 (the side surface on the minus side of the Z axis) is inside the accommodating recess 32, and the guide plate 40 does not move along the XY plane with respect to the pin block 30.
  • the upper surface of the guide plate 40 (the side surface on the Z-axis plus side) does not fit into the accommodating recess 32 and protrudes above the upper surface of the pin block 30. Further, in this state, the guide plate 40 can be pushed downward (Z-axis minus direction) against the elastic bearing force of the support portion 70.
  • the operator puts the cover 50 on the guide plate 40. Specifically, the operator is in a posture in which the through hole 84 of the cover 50 is on the X-axis plus side, and the insertion portion 54b (see FIG. 6) of the second fixing portion 54 is on the X-axis plus side (toward FIG. 10).
  • the cover 50 is put on the guide plate 40 so that the engaged portion 36 (upper side) is inserted.
  • the upper surface of the guide plate 40 is accommodated in the window portion 51 and the facing recess 52 of the cover 50.
  • the guide plate 40 is located at the relative position shown by the alternate long and short dash line in FIG. 7, and is housed in the facing recess 52.
  • the engaged portion 36 on the minus side of the X-axis (lower side toward FIG. 10) is not included in the introduction opening 53a of the first fixing portion 53.
  • the through hole 84 of the displacement suppressing portion 80 does not reach above the suppressing elastic portion 82.
  • the restraining elastic portion 82 is in a state of being pressed downward by the lower surface of the cover 50 because the cover 50 is covered by the operator. That is, the through hole 84 and the restraining elastic portion 82 are not engaged with each other, and the displacement suppressing portion 80 is not functioning.
  • the screw portion of the screw 36a on the plus side of the X axis is introduced into the narrow width portion 54c, and the seat surface of the screw 36a is formed.
  • the second engaging portion 54d fits into the gap between the pin block 30 and the upper surface. This makes it difficult for the end of the cover 50 on the plus side of the X-axis to move in the Z-axis direction (vertical direction).
  • the suppressing elastic portion 82 is located directly under the through hole 84, and the urged member 82b enters the through hole 84.
  • the operator gets a click feeling and knows that the cover 50 has slid to the correct position. Then, when the urged member 82b enters the through hole 84, the suppressing function of the displacement suppressing portion 80 comes into effect.
  • the width W7 (see FIG. 7) of the facing recess 52 in the X-axis direction slides during the slide movement so that the guide plate 40 can slide relative to the cover 50 with the slide movement. It is set larger than the range. Therefore, the cover 50 can smoothly slide on the guide plate 40 even during the sliding movement.
  • the bulging portion 55 of the cover 50 (see FIG. 6) is contained in the recess 45 (see FIG. 5) recessed in the upper surface of the Y-axis plus side end portion and the upper surface of the Y-axis minus side end portion of the guide plate 40. ) Is inserted and slides.
  • the bulging portion 55 is a convex portion formed so as to project from the inner side surface of the window portion 51 on the Y-axis plus side and the inner side surface on the Y-axis minus side toward the center of the window portion 51. Therefore, the cover 50 can smoothly slide on the guide plate 40 even during the sliding movement.
  • the guide plate 40 is covered by the cover 50 at both ends in the X-axis direction and both ends in the Y-axis direction so as not to fall out of the accommodating recess 32 of the pin block 30. Focusing on the fact that the guide plate 40 is elastically supported, the cover 50 does not move the guide plate 40 in the XY plane direction, and determines the upper limit position of the elastic support by the support portion 70 in the Z-axis direction. ..
  • a guide plate 40 for each IC package may be prepared separately.
  • the positioning unit 49 is configured to have a shape suitable for the outer shape of the corresponding other type of IC package.
  • the four corner positions, the window portion 44, the guide surface 48, and the like are configured to be compatible with other types of IC packages.
  • the attached guide plate 40 is taken out from the pin block 30 by following the above assembly procedure in reverse.
  • the user then reattaches another guide plate 40 to the pin block 30 using the assembly procedure described above.
  • the IC inspection socket 10 of the present embodiment it is possible to facilitate the work when inspecting an IC package having a different outer shape of the package.
  • the guide plate 40 can function as a floating plate.
  • the cover 50 has a facing recess 52 in contact with the facing surface of the guide plate 40.
  • the facing recess 52 is set to a size that allows it to slide on the facing surface of the guide plate 40 along the direction of slide movement. Therefore, in the work of assembling and disassembling, it is not necessary to keep pushing the guide plate 40 elastically supported so as to protrude above the upper surface of the pin block 30 (the slide surface on which the cover 50 is slid), which is excellent. It provides workability.
  • the engaged portion 36 is a shaft body having a head (specifically, a screw 36a), and the cover 50 has an insertion portion 54b through which the shaft body is inserted, and the second fixing portion 54 is engaged with the second portion 54b.
  • the portion 54d engages with the lower surface (screw seating surface) of the head of the shaft body.
  • the presence of the insertion portion 54b functions as a guide for adjusting the start position relationship and the start posture of the correct attachment of the cover 50, and makes the assembly work easy to understand.
  • the pin block 30 has a screw hole 36b corresponding to the screw 36a and a protrusion 36c that contacts the lower surface of the head of the screw 36a inserted into the screw hole 36b, and the height of the protrusion 36c is the first. It is larger than the thickness of the engaging portion 53c and the second engaging portion 54d (see FIGS. 6 and 8).
  • the screw 36a is screwed into the screw hole 36b, the seating surface of the screw hits the protrusion 36c, and no further screwing is possible.
  • the height from the upper surface of the pin block 30 to the screw seat surface can be accurately determined by the protrusion 36c.
  • the pin block 30 has a displacement suppressing portion 80 that suppresses the cover 50 in a state where the first engaging portion 53c and the second engaging portion 54d are engaged with the engaged portion 36 from being displaced in the direction of slide movement. Therefore, it is possible to prevent the cover 50 from coming off.
  • aspects of the present disclosure include a pin block having a contact probe array, a guide plate for guiding an IC package to be inspected to the contact probe array, and an engaging portion that engages with the pin block.
  • the pin block includes a support portion that detachably supports the guide plate, and the cover slides on the guide plate supported by the support portion. It is an IC inspection socket having an engaged portion with which the engaging portion engages by moving.
  • the cover is not fixed to the pin block with screws, and the guide plate can be removed simply by sliding the cover. Therefore, when inspecting an IC package having a different outer shape of the package, the work of exchanging the guide plate becomes easy.
  • the support portion may elastically support the guide plate in a direction opposite to the direction in which the cover holds the guide plate.
  • the cover has a recess in contact with the facing surface of the guide plate, and the recess may be of a size slidable on the facing surface along the direction of the slide movement.
  • the cover can slide smoothly on the guide plate even while the slide is moving.
  • the engaged portion is a shaft body having a head
  • the cover has an insertion portion through which the shaft body is inserted at a position continuous with the engaging portion
  • the engaging portion is the head. It may be engaged with the lower surface of the portion.
  • the shaft body is a screw
  • the pin block has a screw hole corresponding to the screw and a protrusion that contacts the lower surface of the head of the screw inserted into the screw hole.
  • the height of the engaging portion may be larger than the thickness of the engaging portion.
  • the pin block may have a displacement suppressing portion that prevents the cover in a state where the engaging portion is engaged with the engaged portion from being displaced in the direction of the slide movement.
  • the cover is less likely to be displaced in the direction of slide movement.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/JP2020/030591 2019-10-31 2020-08-11 Ｉｃ検査用ソケット Ceased WO2021084842A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/773,036 US20240168054A1 (en) 2019-10-31 2020-08-11 Ic inspection socket
CN202080075470.8A CN114616725A (zh) 2019-10-31 2020-08-11 Ic检查用插座

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019198311A JP7390161B2 (ja) 2019-10-31 2019-10-31 Ｉｃ検査用ソケット
JP2019-198311 2019-10-31

Publications (1)

Publication Number Publication Date
WO2021084842A1 true WO2021084842A1 (ja) 2021-05-06

Family

ID=75713367

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/030591 Ceased WO2021084842A1 (ja) 2019-10-31 2020-08-11 Ｉｃ検査用ソケット

Country Status (5)

Country Link
US (1) US20240168054A1 (https=)
JP (1) JP7390161B2 (https=)
CN (1) CN114616725A (https=)
TW (1) TW202119035A (https=)
WO (1) WO2021084842A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7716919B2 (ja) * 2021-07-26 2025-08-01 株式会社ヨコオ ソケット、治具、ソケットメンテナンスセット及び分解方法
KR102891617B1 (ko) * 2021-08-09 2025-11-28 (주)테크윙 전자부품 테스터용 소켓가이더
TWI833331B (zh) * 2022-06-08 2024-02-21 南亞科技股份有限公司 測試半導體晶片的晶片插座、系統及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133398A (ja) * 1998-10-22 2000-05-12 Five Islands:Kk ソケット
JP2004006170A (ja) * 2002-06-03 2004-01-08 Tokyo Cosmos Electric Co Ltd 内部観察窓付きｉｃソケット
JP2012015024A (ja) * 2010-07-02 2012-01-19 Enplas Corp 電気部品用ソケット
JP2017208306A (ja) * 2016-05-20 2017-11-24 株式会社エンプラス 電気部品用ソケットのガイド部材および電気部品用ソケット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3460919B2 (ja) * 1997-02-11 2003-10-27 株式会社エンプラス 電気部品用ソケット
JP5530312B2 (ja) * 2010-09-03 2014-06-25 株式会社エンプラス 電気部品用ソケット
JP2012229923A (ja) * 2011-04-25 2012-11-22 Micronics Japan Co Ltd 電気的接続装置
JP2019070562A (ja) * 2017-10-06 2019-05-09 株式会社日本マイクロニクス 電気的接続装置
JP6998752B2 (ja) * 2017-12-14 2022-02-04 モレックス エルエルシー コネクタ及びコネクタアセンブリ
KR102073167B1 (ko) * 2018-03-30 2020-02-04 주식회사 엔티에스 카메라모듈 분리장치
JP7057499B2 (ja) * 2018-05-08 2022-04-20 山一電機株式会社 検査用ソケット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133398A (ja) * 1998-10-22 2000-05-12 Five Islands:Kk ソケット
JP2004006170A (ja) * 2002-06-03 2004-01-08 Tokyo Cosmos Electric Co Ltd 内部観察窓付きｉｃソケット
JP2012015024A (ja) * 2010-07-02 2012-01-19 Enplas Corp 電気部品用ソケット
JP2017208306A (ja) * 2016-05-20 2017-11-24 株式会社エンプラス 電気部品用ソケットのガイド部材および電気部品用ソケット

Also Published As

Publication number Publication date
US20240168054A1 (en) 2024-05-23
TW202119035A (zh) 2021-05-16
CN114616725A (zh) 2022-06-10
JP2021072212A (ja) 2021-05-06
JP7390161B2 (ja) 2023-12-01

Similar Documents

Publication Publication Date Title
WO2021084842A1 (ja) Ｉｃ検査用ソケット
JP6627655B2 (ja) ソケット
JP2006059600A (ja) カード用コネクタ装置
JP4472748B2 (ja) Ｉｃキャリア，ｉｃソケット及びｉｃデバイスの試験方法
JP2000182696A (ja) 電源コネクタ構造
JP6062594B1 (ja) 測定用ソケットおよびコンタクト装置
JP2010114043A (ja) モジュール及びモジュールの実装構造
US20090075514A1 (en) Test socket
TW201526412A (zh) 安裝構件及電氣零件用插座
KR101690017B1 (ko) 카메라 모듈 포커싱용 지그
US20050194985A1 (en) Compliance module, particularly for a manipulator for positioning a test head, and one such manipulator
JP5564304B2 (ja) 電気部品用ソケット
CN111623738B (zh) 计量器检查夹具及计量器检查机
JP2018195696A (ja) 電子装置および電子装置の組み立て方法
JP4525716B2 (ja) カード用コネクタ装置
JP3105831B2 (ja) プリント基板検査装置のガイドピン部およびプリント基板検査装置のガイドピン固定方法
JP2008311045A (ja) 蛍光管ソケット
TW202607374A (zh) 片狀接觸器插座
KR102872036B1 (ko) 전지 팩의 스펙 검사 지그
JP4647335B2 (ja) Ｉｃソケット
JP6495665B2 (ja) チップ部品の固定用治具
JP2805551B2 (ja) 実装プリント基板の機能検査装置
JP2024137041A (ja) 投写型表示装置およびプリズム交換方法
KR200225840Y1 (ko) 집적회로칩의 테스트보드
JP4458130B2 (ja) カード用コネクタ装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20883105

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 17773036

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20883105

Country of ref document: EP

Kind code of ref document: A1