TW202119035A - Ic檢查用插座 - Google Patents

Ic檢查用插座 Download PDF

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Publication number
TW202119035A
TW202119035A TW109127749A TW109127749A TW202119035A TW 202119035 A TW202119035 A TW 202119035A TW 109127749 A TW109127749 A TW 109127749A TW 109127749 A TW109127749 A TW 109127749A TW 202119035 A TW202119035 A TW 202119035A
Authority
TW
Taiwan
Prior art keywords
cover
guide plate
buckled
aforementioned
needle block
Prior art date
Application number
TW109127749A
Other languages
English (en)
Chinese (zh)
Inventor
甘田康平
松井勇輝
Original Assignee
日商友華股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商友華股份有限公司 filed Critical 日商友華股份有限公司
Publication of TW202119035A publication Critical patent/TW202119035A/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/508Bases; Cases composed of different pieces assembled by a separate clip or spring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/512Bases; Cases composed of different pieces assembled by screw or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
TW109127749A 2019-10-31 2020-08-14 Ic檢查用插座 TW202119035A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019198311A JP7390161B2 (ja) 2019-10-31 2019-10-31 Ic検査用ソケット
JP2019-198311 2019-10-31

Publications (1)

Publication Number Publication Date
TW202119035A true TW202119035A (zh) 2021-05-16

Family

ID=75713367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109127749A TW202119035A (zh) 2019-10-31 2020-08-14 Ic檢查用插座

Country Status (5)

Country Link
US (1) US20240168054A1 (https=)
JP (1) JP7390161B2 (https=)
CN (1) CN114616725A (https=)
TW (1) TW202119035A (https=)
WO (1) WO2021084842A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807953B (zh) * 2021-08-09 2023-07-01 韓商泰克元股份有限公司 用於電子部件測試的插座引導件
TWI833331B (zh) * 2022-06-08 2024-02-21 南亞科技股份有限公司 測試半導體晶片的晶片插座、系統及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7716919B2 (ja) * 2021-07-26 2025-08-01 株式会社ヨコオ ソケット、治具、ソケットメンテナンスセット及び分解方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3460919B2 (ja) * 1997-02-11 2003-10-27 株式会社エンプラス 電気部品用ソケット
JP2000133398A (ja) 1998-10-22 2000-05-12 Five Islands:Kk ソケット
JP4065724B2 (ja) 2002-06-03 2008-03-26 東京コスモス電機株式会社 内部観察窓付きicソケット
JP5563911B2 (ja) 2010-07-02 2014-07-30 株式会社エンプラス 電気部品用ソケット
JP5530312B2 (ja) * 2010-09-03 2014-06-25 株式会社エンプラス 電気部品用ソケット
JP2012229923A (ja) * 2011-04-25 2012-11-22 Micronics Japan Co Ltd 電気的接続装置
JP2017208306A (ja) 2016-05-20 2017-11-24 株式会社エンプラス 電気部品用ソケットのガイド部材および電気部品用ソケット
JP2019070562A (ja) * 2017-10-06 2019-05-09 株式会社日本マイクロニクス 電気的接続装置
JP6998752B2 (ja) * 2017-12-14 2022-02-04 モレックス エルエルシー コネクタ及びコネクタアセンブリ
KR102073167B1 (ko) * 2018-03-30 2020-02-04 주식회사 엔티에스 카메라모듈 분리장치
JP7057499B2 (ja) * 2018-05-08 2022-04-20 山一電機株式会社 検査用ソケット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807953B (zh) * 2021-08-09 2023-07-01 韓商泰克元股份有限公司 用於電子部件測試的插座引導件
TWI833331B (zh) * 2022-06-08 2024-02-21 南亞科技股份有限公司 測試半導體晶片的晶片插座、系統及方法

Also Published As

Publication number Publication date
US20240168054A1 (en) 2024-05-23
WO2021084842A1 (ja) 2021-05-06
CN114616725A (zh) 2022-06-10
JP2021072212A (ja) 2021-05-06
JP7390161B2 (ja) 2023-12-01

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