WO2021024542A1 - 被着体の剥離方法および粘着剤組成物 - Google Patents

被着体の剥離方法および粘着剤組成物 Download PDF

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Publication number
WO2021024542A1
WO2021024542A1 PCT/JP2020/012200 JP2020012200W WO2021024542A1 WO 2021024542 A1 WO2021024542 A1 WO 2021024542A1 JP 2020012200 W JP2020012200 W JP 2020012200W WO 2021024542 A1 WO2021024542 A1 WO 2021024542A1
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Prior art keywords
pressure
sensitive adhesive
adhesive layer
gas
adherend
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PCT/JP2020/012200
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English (en)
French (fr)
Japanese (ja)
Inventor
みずほ 永田
悠 立川
平野　敬祐
松下　喜一郎
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日東電工株式会社
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Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to EP20851186.5A priority Critical patent/EP4011995A4/en
Priority to KR1020227003123A priority patent/KR20220046557A/ko
Priority to CN202080056441.7A priority patent/CN114207065A/zh
Priority to US17/633,368 priority patent/US20220280986A1/en
Publication of WO2021024542A1 publication Critical patent/WO2021024542A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23—Azo-compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present invention relates to a method for peeling an adherend and an adhesive composition.
  • an adhesive sheet having a heat-peeling type adhesive layer is known.
  • the heat release type pressure-sensitive adhesive layer contains, for example, a heat foaming agent that can be heated and foamed. After the pressure-sensitive adhesive sheet is attached to the adherend by the heat-release type pressure-sensitive adhesive layer, when the pressure-sensitive adhesive sheet is peeled off from the adherend, the pressure-sensitive adhesive layer is heated and the heat-foaming agent is foamed. As a result, the adhesive strength of the pressure-sensitive adhesive layer is reduced, and the adherend and the pressure-sensitive adhesive layer are separated from each other.
  • a heat-peeling type pressure-sensitive adhesive sheet is described in, for example, Patent Document 1 below.
  • the entire pressure-sensitive adhesive sheet adhesive layer is heated.
  • the bonded body is heated on a heat stage having a built-in heating block, and the entire pressure-sensitive adhesive layer is heated.
  • the laminating body is heated in the heating furnace to heat the entire pressure-sensitive adhesive layer.
  • the present invention is a peeling method suitable for selectively peeling a part of an adherend among a plurality of adherends bonded to the pressure-sensitive adhesive layer from the pressure-sensitive adhesive layer, and a pressure-sensitive adhesive composition used thereto. I will provide a.
  • the present invention [1] comprises a first step of preparing a bonded body containing a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive component and a gas generating agent, and a plurality of adherends bonded to the pressure-sensitive adhesive layer.
  • the method of peeling an adherend is included, which includes a second step of irradiating a side of the pressure-sensitive adhesive layer in the bonded body with a laser beam to heat a part of the pressure-sensitive adhesive layer.
  • the laser beam is applied to the adhesive layer to which the plurality of adherends are bonded.
  • Irradiation of laser light which is a highly directional energy ray, is suitable for locally heating a part of the pressure-sensitive adhesive layer, and therefore heats a gas generator in a part of the pressure-sensitive adhesive layer to release gas. Suitable for generating.
  • the method in which such laser light irradiation is performed is suitable for selectively heating a region in the pressure-sensitive adhesive layer to which some of the adherends are bonded, and therefore, It is suitable for selectively peeling a part of the adherend from the pressure-sensitive adhesive layer by reducing the adhesive force against the adherend in the region.
  • the present invention [2] includes the method for peeling an adherend according to the above [1], wherein the laser light transmittance in the pressure-sensitive adhesive layer is 85% or less.
  • Such a configuration is suitable for efficiently heating the pressure-sensitive adhesive layer and the gas generating agent contained therein by laser irradiation to generate gas in the pressure-sensitive adhesive layer, and therefore peeling the adherend from the pressure-sensitive adhesive layer. Suitable for suppressing the energy to do.
  • the present invention [3] includes the method for peeling an adherend according to the above [1] or [2], wherein the wavelength of the laser light is 351 nm or 355 nm.
  • Laser light with such a wavelength is practical as laser light with high directivity.
  • the present invention [4] includes a pressure-sensitive adhesive composition used for forming the pressure-sensitive adhesive layer in the method for peeling an adherend according to any one of the above [1] to [3].
  • the present invention [5] includes the pressure-sensitive adhesive composition according to the above [4], wherein the pressure-sensitive adhesive layer contains a component capable of absorbing the laser beam.
  • Such a configuration is suitable for efficiently raising the temperature of the pressure-sensitive adhesive layer by irradiating the laser beam in the second step, and is therefore suitable for efficiently heating the gas generating agent in the pressure-sensitive adhesive layer to generate gas. ..
  • the present invention [6] includes the pressure-sensitive adhesive composition according to the above [5], wherein the component is an ultraviolet absorber.
  • Such a configuration is suitable for efficiently raising the temperature of the pressure-sensitive adhesive layer by laser light irradiation, particularly when an ultraviolet laser is used as the laser light in the second step, and therefore, the gas generating agent in the pressure-sensitive adhesive layer is used. Suitable for efficient heating to generate gas.
  • the present invention [7] includes the pressure-sensitive adhesive composition according to any one of the above [4] to [6], wherein the gas generating agent is gas generating particles.
  • gas generating particles as a gas generating agent realizes good adhesive strength to the adherend by suppressing the gas generating agent content ratio in the pressure-sensitive adhesive layer to secure the adhesive component content ratio, and also contains the gas generating agent. It is suitable for securing the amount of gas generated when the adherend is peeled off, while suppressing the ratio.
  • the present invention [8] includes the pressure-sensitive adhesive composition according to the above [7], wherein the gas-generating particles contain azo compound particles.
  • the azo compound particles can be suitably used as gas generating particles having a high gas generating rate.
  • FIG. 1A shows the first step in which the bonded body is prepared
  • FIG. 1B shows the second step in which the bonded body is irradiated with laser light
  • FIG. 1C shows the adherend peeling from the adhesive layer.
  • FIG. 2A shows a step of preparing the pressure-sensitive adhesive layer, an adherend, and a transparent base material
  • FIG. 2B shows a step of bonding the transparent base material and the pressure-sensitive adhesive layer
  • FIG. 2C shows a transparent group. It represents a process in which the pressure-sensitive adhesive layer on the material and the adherend are bonded together.
  • a modified example of one of the bonded bodies is shown.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of the method for peeling an adherend of the present invention.
  • the method includes the following first and second steps.
  • the bonded body 100 is prepared.
  • the bonded body 100 includes a pressure-sensitive adhesive layer 10 and a plurality of adherends 20, and in the present embodiment, also includes a transparent base material 30, and has a laminated structure including these.
  • the pressure-sensitive adhesive layer 10 has a surface 11 and an opposite surface 12.
  • Each adherend 20 is arranged so as to be in contact with the surface 11 of the pressure-sensitive adhesive layer 10.
  • the plurality of adherends 20 are arranged on the surface 11 at intervals in the plane direction orthogonal to the thickness direction of the pressure-sensitive adhesive layer 10.
  • the adherend 20 is, for example, a component or member that is bonded to the transparent base material 30 via the pressure-sensitive adhesive layer 10 and is detached from the transparent base material 30 after undergoing a predetermined process.
  • Predetermined processes include, for example, processing and inspection of the adherend 20.
  • Examples of such an adherend 20 include electronic components such as semiconductor components.
  • the transparent base material 30 is arranged on the surface 12 side of the pressure-sensitive adhesive layer 10, and is preferably arranged so as to be in contact with the entire surface of the surface 12.
  • the transparent base material 30 functions as a support for supporting the adherend 20, and is, for example, a transparent glass substrate or a transparent resin substrate.
  • the thickness of the transparent base material 30 is, for example, 50 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 10 mm or less, preferably 5 mm or less.
  • the total light transmittance of the transparent base material 30 is, for example, 90% or more, preferably 95% or more, and more preferably 99% or more.
  • the bonded body 100 can be prepared, for example, as shown in FIG. First, as shown in FIG. 2A, a pressure-sensitive adhesive sheet X having a pressure-sensitive adhesive layer 10, a plurality of adherends 20, and a transparent base material 30 are prepared. Next, as shown in FIG. 2B, the pressure-sensitive adhesive sheet X is attached to the transparent base material 30 on one side of the pressure-sensitive adhesive layer 10. Next, as shown in FIG. 2C, a plurality of adherends 20 are attached to the other surface side of the pressure-sensitive adhesive layer 10 on the transparent base material 30. In the adherend bonding step, a plurality of adherends 20 may be collectively bonded to the surface 11 of the pressure-sensitive adhesive layer 10, or a plurality of adherends 20 may be bonded to each of the adherends 20. You may go over.
  • the pressure-sensitive adhesive layer 10 is a layer formed from a first pressure-sensitive adhesive composition containing a pressure-sensitive adhesive component and a gas generating agent that is vaporized by heating.
  • the adhesive component develops adhesiveness in the first adhesive composition.
  • the adhesive component include adhesive polymers (base polymers) such as acrylic polymers, rubber-based polymers, silicone-based polymers, polyester-based polymers, polyamide-based polymers, urethane-based polymers, and styrene-dienblock-based polymers.
  • the adhesive component is preferably an acrylic polymer.
  • the acrylic polymer is, for example, a polymer obtained by polymerizing a monomer component containing a (meth) acrylic acid alkyl ester as a main monomer and a polar group-containing vinyl monomer as a sub-monomer.
  • (Meta) acrylic acid shall mean acrylic acid and / or methacrylic acid.
  • Examples of the (meth) acrylic acid alkyl ester include a (meth) acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 18 carbon atoms.
  • Examples of such (meth) acrylic acid alkyl esters include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, and n- (meth) acrylic acid.
  • the (meth) acrylic acid alkyl ester may be used alone or in combination of two or more.
  • methyl methacrylate (MMA) and an acrylic acid alkyl ester having an alkyl group having 2 to 18 carbon atoms are preferably used in combination, and more preferably MMA, ethyl acrylate and acrylic. It is used in combination with 2-ethylhexyl acid.
  • the polar group-containing vinyl monomer is a copolymerizable monomer that can be copolymerized with the main monomer.
  • the polar group-containing vinyl monomer include hydroxyl group-containing vinyl monomers such as hydroxymethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate. Be done.
  • the polar group-containing vinyl monomer include a carboxyl group-containing vinyl monomer such as (meth) acrylic acid, an amide group-containing vinyl monomer such as (meth) acrylamide, and an amino group-containing vinyl monomer such as aminoethyl (meth) acrylic acid.
  • Examples thereof include a glycidyl group-containing vinyl monomer such as glycidyl acrylate, a cyano group-containing vinyl monomer such as (meth) acrylonitrile, and a heterocycle-containing vinyl monomer such as N-vinyl-2-pyrrolidone.
  • a polar group-containing vinyl monomer a hydroxyl group-containing vinyl monomer is preferably used, and hydroxyethyl acrylate is more preferably used.
  • the ratio of the main monomer in the monomer component for forming the acrylic polymer is preferably 50% by mass or more, more preferably 60% by mass or more, from the viewpoint of appropriately expressing basic properties such as adhesiveness in the pressure-sensitive adhesive layer 10. Further, it is preferably 99% by mass or less, more preferably 95% by mass or less.
  • the ratio of the submonomer in the monomer component is preferably 1% by mass or more, and preferably 20% by mass or less.
  • the blending ratio of the base polymer in the first pressure-sensitive adhesive composition is preferably 10% by mass or more, more preferably 20% by mass or more, from the viewpoint of ensuring the adhesiveness of the first pressure-sensitive adhesive composition.
  • the same ratio is preferably 99% by mass or less, more preferably 95% by mass or less.
  • the adhesive component may contain other components in addition to the base polymer.
  • Other components include, for example, cross-linking agents and tackifiers.
  • cross-linking agent examples include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, and metal ion-based cross-linking agents, and preferably isocyanate-based cross-linking agents.
  • the blending ratio of the cross-linking agent is preferably 0.01 part by mass or more, more preferably 0.3 part by mass or more, and preferably 10 parts by mass or less, based on 100 parts by mass of the base polymer of the adhesive component. It is preferably 3 parts by mass or less.
  • the tackifier examples include rosin-based resin, rosin-phenol-based resin, terpene-based resin, and petroleum-based resin, and preferably rosin-phenol-based resin.
  • the blending ratio of the tackifier is preferably 1 part by mass or more, more preferably 5 parts by mass or more, and preferably 30 parts by mass or less with respect to 100 parts by mass of the base polymer of the adhesive component.
  • the blending ratio of the pressure-sensitive component in the first pressure-sensitive adhesive composition is preferably 10% by mass or more, more preferably 20% by mass or more.
  • the same ratio is preferably 99% by mass or less, more preferably 95% by mass or less.
  • gas generating agent examples include gas generating particles that are dispersed as particles without being dissolved in the adhesive component, and a dissolved gas generating agent that is dissolved in the adhesive component.
  • Examples of the gas generating particles include particles of a heating foaming agent that are easily gasified by heating.
  • Examples of the heat foaming agent include an organic foaming agent and an inorganic foaming agent.
  • the heating foaming agent may be used alone or in combination of two or more.
  • Examples of the organic foaming agent include an azo foaming agent, an N-nitroso foaming agent, a hydrazide foaming agent, a semicarbazide foaming agent, an alkane fluoride foaming agent, and a triazole foaming agent.
  • Examples of the azo-based foaming agent include azodicarbonamide (ADCA), barium azodicarboxylate, azobisisobutyronitrile (AIBN), azocyclohexylnitrile, and azodiaminobenzene.
  • N-nitroso-based foaming agent examples include N, N'-dinitrosopentamethylenetetramine (DTP), N, N'-dimethyl-N, N'-dinitrosoterephthalamide, and trinitrosotrimethyltriamine.
  • hydrazide-based effervescent agent examples include 4,4'-oxybis (benzenesulfonyl hydrazide) (OBSH), paratoluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 2,4-toluenedisulfonylhydrazide, and the like.
  • Examples thereof include p, p-bis (benzenesulfonyl hydrazide) ether, benzene-1,3-disulfonylhydrazide, and allylbis (sulfonylhydrazide).
  • Examples of the semicarbazide-based foaming agent include p-toluylenesulfonyl semicarbazide and 4,4'-oxybis (benzenesulfonyl semicarbazide).
  • Examples of the fluorinated alkane-based foaming agent include trichloromonofluoromethane and dichloromonofluoromethane.
  • Examples of the triazole-based foaming agent include 5-morpholyl-1,2,3,4-thiatriazole.
  • Examples of the inorganic foaming agent include hydrogen carbonates such as sodium hydrogen carbonate and ammonium hydrogen carbonate, carbonates such as sodium carbonate and ammonium carbonate, nitrites such as sodium nitrite and ammonium nitrite, and sodium borohydride. Hydrogenated boron salt of.
  • the gas generating particles are preferably organic foaming agent particles, more preferably azo foaming agent particles (azo compound particles), and even more preferably ADCA particles.
  • azo foaming agent particles azo compound particles
  • ADCA particles examples include the Binihole series and the FE series (all manufactured by Eiwa Kasei Kogyo Co., Ltd.).
  • ethylene foaming agent residue after heat foaming a small amount of foaming agent residue after heat foaming, and are therefore suitable for suppressing adherent contamination described later.
  • Examples of the shape of the gas-generating particles include a substantially spherical shape, a substantially plate (flat) shape, a substantially needle shape, and an amorphous shape.
  • the average particle size of the gas-generating particles is, for example, 1000 ⁇ m or less, preferably 100 ⁇ m or less, more preferably 10 ⁇ m or less, particularly preferably 7.5 ⁇ m or less, and most preferably 7.5 ⁇ m or less, from the viewpoint of homogenizing the generated gas in the pressure-sensitive adhesive layer 10. It is 5 ⁇ m or less.
  • the average particle size of the gas-generating particles is preferably 0.1 ⁇ m or more from the viewpoint of reducing the mixing ratio of the dispersant described later for finely dispersing the gas-generating particles.
  • dissolved gas generating agent examples include azide group-containing polymers such as glycidyl azide polymer obtained by ring-opening polymerization of 3-azidomethyl-3-methyloxetane.
  • azide group-containing polymers such as glycidyl azide polymer obtained by ring-opening polymerization of 3-azidomethyl-3-methyloxetane.
  • the dissolved gas generating agent described in JP-A-2003-231867 may be used.
  • the amount of gas generated by the gas generating agent is, for example, 50 ml / g or more, preferably 100 ml / g or more, more preferably 125 ml / g or more, and for example, 1000 ml / g or less.
  • the mixing ratio of the gas generating agent is preferably 1 part by mass or more, more preferably 10 parts by mass or more, based on 100 parts by mass of the base polymer of the adhesive component. More preferably, it is 20 parts by mass or more. Further, the blending ratio is preferably 100 parts by mass or less, more preferably 80 parts by mass or less, based on 100 parts by mass of the base polymer of the pressure-sensitive adhesive component, from the viewpoint of securing the amount of the pressure-sensitive adhesive component blended in the pressure-sensitive adhesive layer 10. More preferably, it is 60 parts by mass or less.
  • the first pressure-sensitive adhesive composition may contain other components in addition to the pressure-sensitive component and the gas generating agent.
  • Other components include, for example, dispersants, laser light absorbers, and pigments.
  • the dispersant improves the dispersibility of the gas-generating particles in the first pressure-sensitive adhesive composition.
  • the dispersant include polymer-type dispersants.
  • Commercially available dispersants include, for example, Floren DOPA series (manufactured by Kyoeisha Chemical Co., Ltd.), Solsparse series (manufactured by Japan Lubrizol Co., Ltd.), EFKA series (manufactured by Fuka Adidibs), and DisperBYK series (manufactured by Big Chemie Japan). (Made by Co., Ltd.) and Disparon series (Kusumoto Kasei Co., Ltd.).
  • the mixing ratio of the dispersant is preferably 10 parts by mass or more, more preferably 30 parts by mass or more, and preferably 100 parts by mass or less, more preferably 70 parts by mass or less, based on 100 parts by mass of the gas-generating particles. Is.
  • the laser light absorber is a component that can absorb the laser light used in the second step described later and can emit the absorbed energy by converting it into heat or infrared rays.
  • the laser light absorber is preferably an ultraviolet absorber.
  • the blending ratio of the laser light absorber is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and preferably 40 parts by mass or less, more preferably more preferably, with respect to 100 parts by mass of the base polymer of the adhesive component. It is 30 parts by mass or less.
  • the ultraviolet absorber examples include benzophenone-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, salicylic acid ester-based ultraviolet absorbers, and cyanoacrylate-based ultraviolet absorbers, and benzophenone-based ultraviolet absorbers are preferable.
  • the adhesive component may contain one kind of ultraviolet absorber, or may contain two or more kinds of ultraviolet absorbers.
  • benzophenone-based ultraviolet absorber examples include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-octyloxybenzophenone, and the like.
  • 4-Dodecyloxy-2-hydroxybenzophenone, 4-benzyloxy-2-hydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2', 4,4'-tetrahydroxybenzophenone, and 2,2 '-Dihydroxy-4,4'-dimethoxybenzophenone can be mentioned.
  • benzotriazole-based ultraviolet absorber examples include 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole and benzenepropanoic acid 3- (2H-benzotriazole-2-yl) -5-(.
  • salicylate ester-based ultraviolet absorber examples include phenyl2-acryloyloxybenzoate, phenyl2-acryloyloxy-3-methylbenzoate, phenyl2-acryloyloxy-4-methylbenzoate, and phenyl2-acryloyloxy-5-methylbenzoate.
  • Examples of the cyanoacrylate-based ultraviolet absorber include alkyl2-cyanoacrylate, cycloalkyl2-cyanoacrylate, alkoxyalkyl2-cyanoacrylate, alkenyl2-cyanoacrylate, and alkynyl2-cyanoacrylate.
  • the blending ratio of the laser light absorber such as the ultraviolet absorber is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and preferably 50 parts by mass or less with respect to 100 parts by mass of the base polymer of the adhesive component. , More preferably 20 parts by mass or less.
  • the maximum amount of gas generated per cm 2 of the pressure-sensitive adhesive layer 10 containing the gas generating agent is preferably 2 ⁇ l / cm 2 or more, more preferably 2 ⁇ l / cm 2 or more, from the viewpoint of ensuring the adherend peelability in the second step described later. Is 5 ⁇ l / cm 2 or more.
  • the maximum gas generation amount is, for example, 50 ⁇ l / cm 2 or less, preferably 40 ⁇ l / cm 2 or less.
  • the maximum amount of gas generated per 1 cm 2 of the adhesive layer 10, all of the gas generating agent contained per 1 cm 2 in the pressure-sensitive adhesive layer 10 is the amount of gas generated in the assumption that gasified, 0 ° C. and It is expressed as a volume under the condition of 1 atm. The specific method for obtaining the maximum gas generation amount is as described with respect to the examples described later.
  • the maximum amount of gas generated per 1 g of solid content of the first pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 10 is preferably 5 ml / g or more from the viewpoint of ensuring the detachability of the adherend in the second step described later. , More preferably 10 ml / g or more.
  • the amount of gas generated is preferably 50 ml / g or less, more preferably 40 ml / g or less.
  • the maximum amount of gas generated per 1 g of the solid content of the first pressure-sensitive adhesive composition is the amount of gas generated on the assumption that all of the gas generating agents contained per 1 g of the solid content of the first pressure-sensitive adhesive composition are gasified. The quantity is expressed as a volume under the conditions of 0 ° C. and 1 atm.
  • the thickness of the pressure-sensitive adhesive layer 10 is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, still more preferably 10 ⁇ m or more, and particularly preferably 20 ⁇ m or more, from the viewpoint of ensuring the adhesive force to the adherend 20. From the viewpoint of ensuring the transmittance of the laser light irradiated in the second step described later, it is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less, and further preferably 50 ⁇ m or less.
  • the thickness of the pressure-sensitive adhesive layer 10 is the distance between the surfaces 11 and 12 of the pressure-sensitive adhesive layer 10.
  • the transmittance of the laser light described later in the pressure-sensitive adhesive layer 10 is preferably 85% or less, more preferably 60% or less, more preferably 55% or less, more preferably 40% or less, more preferably 20% or less, more preferably. Is 5% or less, more preferably 2% or less.
  • the transmittance of the pressure-sensitive adhesive layer 10 is determined by, for example, the monomer composition and blending amount of the base polymer in the pressure-sensitive adhesive layer 10, the type and blending amount of the gas generating agent in the pressure-sensitive adhesive layer 10, and the thickness of the pressure-sensitive adhesive layer 10. By doing so, it is possible to adjust.
  • the first pressure-sensitive adhesive composition can be prepared by preparing a pressure-sensitive adhesive component, a gas generating agent, and other components to be blended as needed, and then mixing them.
  • gas generating particles are used as the gas generating agent
  • the first pressure-sensitive adhesive composition is prepared by mixing the dispersion liquid obtained by dispersing the gas-generating particles in an organic solvent (dispersion medium) and the pressure-sensitive adhesive component. Can be done.
  • organic solvent examples include ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, methanol, ethanol, isopropanol, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, dichloromethane, and chloroform.
  • organic solvent examples include ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, methanol, ethanol, isopropanol, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, dichloromethane, and chloroform. Can be mentioned.
  • the content ratio of the gas-generating particles in the dispersion liquid is, for example, 1% by mass or more, preferably 5% by mass or more, and for example, 50% by mass or less, preferably 30% by mass or less. Is adjusted so that.
  • the gas-generating particles may be dispersed in an organic solvent in the presence of the above-mentioned dispersant. Further, the gas-generating particles may be dispersed in an organic solvent, preferably together with a dispersant, using a disperser such as a mill such as a bead mill.
  • the first pressure-sensitive adhesive composition thus obtained is applied onto a base sheet to form a coating film, and then the coating film is dried to remove an organic solvent as needed to obtain a pressure-sensitive adhesive.
  • the pressure-sensitive adhesive layer 10 made of the solid content of the composition can be formed as the pressure-sensitive adhesive sheet X.
  • the exposed surface of the pressure-sensitive adhesive layer 10 on the base sheet may be covered with another base sheet.
  • These base material sheets are peeled off from the adhesive sheet X when the above-mentioned bonded body 100 is prepared.
  • the base sheet include plastic base sheets such as polyethylene terephthalate (PET) sheets, polyethylene sheets and polypropylene sheets, polyvinyl chloride sheets, polyimide sheets, polyamide sheets and rayon sheets.
  • the side of the pressure-sensitive adhesive layer 10 of the bonded body 100 is irradiated with laser light L to heat a part of the region of the pressure-sensitive adhesive layer 10.
  • the laser beam L is applied to a partial region of the pressure-sensitive adhesive layer 10 to which some of the adherends 20 of the plurality of adherends 20 are bonded.
  • the laser beam irradiation site may be swept over a predetermined area in the pressure-sensitive adhesive layer 10.
  • the partial adherend 20 may be one adherend 20 or two or more adherends 20.
  • FIG. 1B shows an example of the second step in which the laser beam L is irradiated to a partial region of the pressure-sensitive adhesive layer 10 to which one of the plurality of adherends 20 is adhered. Shown as.
  • the laser light used in this step is preferably an ultraviolet laser, and more preferably a laser light having a wavelength of 351 nm or a laser light having a wavelength of 355 nm.
  • Laser light having a wavelength in the ultraviolet region is practical as laser light having high directivity.
  • the gas generating agent in the heated region is heated by the partial heating in the pressure-sensitive adhesive layer 11 to generate gas, and the adhesive force to the adherend 20 in the region of the pressure-sensitive adhesive layer 10 is reduced.
  • the adherend 20 is selectively peeled from the pressure-sensitive adhesive layer 10.
  • two or more predetermined adherends 20 may be selectively peeled off in a desired order.
  • the laser beam L is applied to the pressure-sensitive adhesive layer 10 to which the plurality of adherends 20 are bonded.
  • Irradiation of the laser beam L which is a highly directional energy ray, is suitable for partially heating the pressure-sensitive adhesive layer 10. Therefore, the gas generating agent is heated in a partial region of the pressure-sensitive adhesive layer 10 to generate gas. Suitable for.
  • a region in which a part of the adherends 20 among the plurality of adherends 20 are bonded is selectively heated. Suitable, and therefore suitable for selectively peeling a portion of the adherend 20 from the pressure-sensitive adhesive layer 10 by reducing the adhesion to the adherend in the region.
  • the transmittance of the laser light L (irradiated laser light in the second step) in the pressure-sensitive adhesive layer 10 is preferably 85% or less, more preferably 60% or less, more preferably 55% or less, more preferably. Is 40% or less, more preferably 20% or less, more preferably 5% or less, and more preferably 2% or less.
  • Such a configuration is suitable for efficiently heating the pressure-sensitive adhesive layer 10 and the gas generating agent contained therein by laser irradiation to generate gas in the pressure-sensitive adhesive layer 10, and therefore, adhered from the pressure-sensitive adhesive layer 10. It is suitable for suppressing the energy for selectively peeling the body 20.
  • Laser irradiation energy used in the second step is preferably 1500 mJ / cm 2 or less, more preferably 850mJ / cm 2 or less, more preferably 650 mJ / cm 2 or less, particularly preferably 400 mJ / cm 2 or less.
  • the laser light L for heating is irradiated to the pressure-sensitive adhesive layer 10 (irradiation laser light transmittance 60% or less) side of the bonded body 100.
  • Such a configuration is suitable for suppressing the heat load of the adherend 20.
  • the first pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer 10 preferably contains a component capable of absorbing laser light L.
  • the component is preferably an ultraviolet absorber, especially when an ultraviolet laser is used as the above-mentioned laser light L.
  • These configurations are suitable for efficiently raising the temperature of the pressure-sensitive adhesive layer 10 by irradiating a laser beam L such as an ultraviolet laser in the second step, and therefore, efficiently heat the gas generating agent in the pressure-sensitive adhesive layer 10. Suitable for generating gas.
  • the gas generating agent in the pressure-sensitive adhesive layer 10 is preferably gas generating particles, and more preferably azo compound particles.
  • the configuration in which the pressure-sensitive adhesive layer 10 contains a gas generating agent having a large amount of gas generated is good adhesion to an adherend by suppressing the gas generating agent content ratio in the pressure-sensitive adhesive layer 10 and securing the pressure-sensitive adhesive component content ratio. It is suitable for realizing the force and securing the amount of gas generated at the time of peeling the adherend while suppressing the gas generating agent content ratio.
  • the pressure-sensitive adhesive layer 10 of the bonded body 100 is located on the first layer 10A located on the adherend 20 side and the transparent base material 30 side as shown in FIG. 3, instead of the single-layer structure as described above. It may have a two-layer structure with the second layer 10B.
  • the first layer 10A is a layer formed from the above-mentioned first pressure-sensitive adhesive composition, and the composition thereof is the same as that described above for the pressure-sensitive adhesive layer 10.
  • the second layer 10B is a layer that does not contain a gas generating agent, and is, for example, a layer formed from a second pressure-sensitive adhesive composition having the same composition as the first pressure-sensitive adhesive composition except that it does not contain a gas generating agent. is there.
  • the pressure-sensitive adhesive layer 10 is secured while ensuring the adhesive strength of the pressure-sensitive adhesive layer 10 with respect to the adherend 20 by ensuring the thickness of the pressure-sensitive adhesive layer 10. It is possible to appropriately reduce the adhesive force on the adherend 20 side.
  • the maximum amount of gas generated per 1 cm 2 of the pressure-sensitive adhesive layer 10 means that all the gas generators contained per 1 cm 2 in the pressure-sensitive adhesive layer 10 including the first layer 10A and the second layer 10B are included.
  • the amount of generated gas under the assumption of gasification is expressed by volume under the conditions of 0 ° C. and 1 atm.
  • the mixture containing 10 g and 70 g of ethyl acetate was stirred with a bead mill for 1 hour, and the gas-generating particles were pulverized.
  • a gas-generating particle dispersion containing ADCA particles having an average particle diameter of 0.5 ⁇ m as gas-generating particles was obtained.
  • a coating liquid (crocodile) was prepared by mixing uniformly.
  • a coating liquid is applied onto a first base material sheet (a PET separator having a thickness of 38 ⁇ m) to form a coating film, and then the coating film is dried on the base material sheet to form a first pressure-sensitive adhesive layer.
  • a layer thickness 5 ⁇ m
  • the second layer of the pressure-sensitive adhesive layer was formed in the same manner as the first layer of the pressure-sensitive adhesive layer, except that the gas-generating particle dispersion was not used and the thickness was set to 20 ⁇ m instead of 5 ⁇ m.
  • a second base material sheet a PET separator having a thickness of 38 ⁇ m.
  • Example 1 The composition of the first layer of the pressure-sensitive adhesive layer in Example 1 is shown in Table 1 (the same applies to each of the examples and comparative examples described later). In Table 1, the unit of each numerical value representing the composition is "part by mass”.
  • the adhesive sheet was cut into a size of 3 cm square to obtain an adhesive sheet piece.
  • the adhesive sheet is placed on the second layer side of the glass substrate (trade name "Large slide glass S9111", thickness 1 mm, Matsunami. It was attached to Glass Industry Co., Ltd.), and the glass and the adhesive sheet piece were crimped by a crimping operation in which a 2 kg hand roller was reciprocated once.
  • a plurality of silicon chips were attached as adherends to the first layer of the pressure-sensitive adhesive layer exposed thereby.
  • the bonded body of Example 1 has a structure in which a transparent glass base material and a plurality of silicon chips are bonded by an adhesive layer, and the adhesive layer is a first layer (5 ⁇ m) on the silicon chip side and glass. It has a laminated structure with a second layer (20 ⁇ m) on the base material side.
  • Example 2 and 3 Similar to the bonded body of Example 1 except that the thickness of the first layer of the pressure-sensitive adhesive sheet (adhesive layer) was changed from 5 ⁇ m to 10 ⁇ m (Example 2) or 20 ⁇ m (Example 3). , Each of Examples 2 and 3 was prepared.
  • Example 4 In the formation of the first layer of the pressure-sensitive adhesive sheet, 5 parts by mass of an ultraviolet absorber (trade name "KEMISORB 111", a benzophenone-based ultraviolet absorber, manufactured by Chemipro Kasei Co., Ltd.) was added to the coating liquid, and the first layer was formed.
  • the bonded body of Example 4 was produced in the same manner as the bonded body of Example 1 except that the thickness was changed from 5 ⁇ m to 10 ⁇ m.
  • Example 5 In the formation of the first layer of the pressure-sensitive adhesive sheet, the amount of gas-generating particles blended was 50 parts by mass instead of 25 parts by mass, and the coating liquid was an ultraviolet absorber (trade name "KEMISORB 111", manufactured by Chemipro Kasei Co., Ltd.).
  • the laminated body of Example 5 was prepared in the same manner as the bonded body of Example 1 except that 20 parts by mass was blended and the thickness of the first layer was set from 5 ⁇ m to 10 ⁇ m.
  • Example 6 In the formation of the first layer of the pressure-sensitive adhesive sheet, the bonded body of Example 6 was formed in the same manner as the bonded body of Example 1 except that the blending amount of the gas-generating particles was 10 parts by mass instead of 25 parts by mass. Was produced.
  • Comparative Example 1 A bonded body of Comparative Example 1 was produced in the same manner as the bonded body of Example 1 except that the gas-generating particle dispersion was not used in forming the first layer of the pressure-sensitive adhesive sheet.
  • Comparative Example 2 No gas-generating particle dispersion was used in the formation of the first layer of the pressure-sensitive adhesive sheet, and 20 parts by mass of an ultraviolet absorber (trade name "KEMISORB 111", manufactured by Chemipro Kasei Co., Ltd.) was added to the coating liquid.
  • a bonded body of Comparative Example 2 was produced in the same manner as the bonded body of Example 1 except for.
  • ⁇ Maximum gas generation amount> The maximum amount of gas generated was examined for each of the pressure-sensitive adhesive sheets in Examples and Comparative Examples. Specifically, a 2-3 mg adhesive sheet piece (adhesive layer) cut out from the adhesive sheet was attached with aluminum foil and then heated using a heating furnace type pyrolyzer (DSP). In this heating, the heating rate was 2 ° C./min and the final temperature was 250 ° C. Then, the amount of gas generated by the DSP was measured by gas chromatography-mass spectrometry.
  • DSP heating furnace type pyrolyzer
  • a gas chromatography device (trade name “6890Plus”, manufactured by Agilent Technologies) is used for gas chromatography, and a mass spectrometer (trade name “5793N”, manufactured by Agilent Technologies) is used for mass spectrometry.
  • the amount of gas generated was calculated as a decan conversion value. Then, from the amount of gas generated per unit mass (1 g) of the adhesive sheet (adhesive layer), the maximum amount of gas generated per 1 g of the solid content of the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer (at 0 ° C. and 1 atm). After determining the volume), the maximum gas generation amount (volume under the conditions of 0 ° C. and 1 atm) per unit area (1 cm 2 ) of the adhesive sheet was determined. Table 1 shows the maximum amount of gas generated ( ⁇ l / cm 2 ) per unit area (1 cm 2 ) of the adhesive sheet.
  • the first base material sheet was peeled off from the adhesive sheet sample piece, and the exposed first layer side was attached to a SUS plate (SUS304) as an adherend in an environment of 23 ° C., and a 2 kg roller was applied.
  • the sample piece and the adherend were crimped by one reciprocating crimping operation.
  • the adhesive strength (N) of the adhesive sheet sample piece to the SUS plate. / 20 mm) was measured. In this measurement, the measurement temperature was 23 ° C., the peeling angle of the sample piece with respect to the SUS plate was 180 °, and the tensile speed of the adhesive sheet sample piece was 300 mm / min.
  • Table 1 The results are listed in Table 1.
  • ⁇ Transmittance> The transmittance of each pressure-sensitive adhesive sheet (adhesive layer) in Examples and Comparative Examples was examined.
  • the transmittance of the adhesive sheet (adhesive layer) was examined in the state of the laminated body after being pressure-bonded to the glass and after the first base material sheet was peeled off and before the silicon chip was attached.
  • a spectrophotometer (trade name "Spectrophotometer U-4100", manufactured by Hitachi High-Tech Science) was used to determine the light transmittance of the adhesive sheet on glass over the wavelength range of 280 nm to 800 nm. It was measured.
  • Table 1 shows the transmittance (%) of the adhesive sheet itself at a wavelength of 355 nm.
  • Partial heating of one silicon chip attachment region (0.5 mm ⁇ 0.5 mm) was performed by sweeping the irradiation site of the laser beam over the entire region. Specifically, a rectangular sweep that sweeps the laser beam irradiation point so that the laser beam irradiation point forms the four sides of a square of a predetermined size is formed as a concentric rectangle that extends from the central part to the outermost part of the silicon chip attachment area. , Performed multiple times over different square sizes.
  • the method for peeling an adherend of the present invention can be used, for example, to peel off an adhesive sheet attached to an electronic component such as a semiconductor component in the manufacturing process of the electronic component.
  • the pressure-sensitive adhesive composition of the present invention can be used to prepare a pressure-sensitive adhesive sheet used in the method.
  • Adhesive sheet 10 Adhesive layers 11, 12 sides 10A 1st layer 10B 2nd layer 20 Adhesive body 30 Transparent base material L Laser light

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PCT/JP2020/012200 2019-08-08 2020-03-19 被着体の剥離方法および粘着剤組成物 WO2021024542A1 (ja)

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CN202080056441.7A CN114207065A (zh) 2019-08-08 2020-03-19 被粘物的剥离方法及粘合剂组合物
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