WO2020090518A1 - 基板供給システムおよび基板加工装置 - Google Patents

基板供給システムおよび基板加工装置 Download PDF

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Publication number
WO2020090518A1
WO2020090518A1 PCT/JP2019/041058 JP2019041058W WO2020090518A1 WO 2020090518 A1 WO2020090518 A1 WO 2020090518A1 JP 2019041058 W JP2019041058 W JP 2019041058W WO 2020090518 A1 WO2020090518 A1 WO 2020090518A1
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WIPO (PCT)
Prior art keywords
cassette
substrate
supply system
wafer
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/041058
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English (en)
French (fr)
Japanese (ja)
Inventor
奥田　修
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Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to CN201980036023.9A priority Critical patent/CN112912998A/zh
Priority to JP2020553785A priority patent/JP7432243B2/ja
Publication of WO2020090518A1 publication Critical patent/WO2020090518A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate supply system for supplying a substrate.
  • semiconductor devices widely used in electronic equipment are manufactured from wafers in which optical devices are incorporated in each of the areas divided into a plurality of areas.
  • the semiconductor device is manufactured, for example, by the following steps. First, the outer peripheral surface of the single crystal ingot is ground so that the diameter of the single crystal ingot is uniform and sliced into a disk shape having a thickness of about 1 mm. This is a so-called wafer. Both sides of the wafer are ground to a predetermined thickness (grinding step). Subsequently, both surfaces of the wafer are polished, and mirror-finished with high flatness is performed (polishing step). Then, the polished wafer is cleaned (cleaning step) to complete the wafer. After that, a circuit pattern is printed on the surface of the wafer and divided along predetermined lines.
  • Patent Document 1 discloses a cutting device that cuts a wafer along a predetermined line provided on the wafer.
  • This cutting device has a cassette that stores a plurality of wafers (unprocessed wafers) before being cut and a cassette that stores wafers that have been cut (processed wafers) on the chuck table. Placed on. The unprocessed wafers are sequentially transferred from the cassette, cut, and then transferred to the cassette that accommodates the processed wafers.
  • Patent Document 1 when all the unprocessed wafers are unloaded from the cassette and the cassette is emptied, the cassette is removed from the apparatus and a new unprocessed wafer is stored in the cassette. Then, the cassette is mounted on the apparatus again, and the wafer cutting process is newly executed.
  • the safety mechanism is activated during the removal of the cassette in order to prevent accidental access to the interior of the device. In this case, the time required for removing and mounting the cassette to the device becomes longer, and as a result, the operating rate of the device is further reduced.
  • an object of the present invention is to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
  • the first aspect of the present invention relates to a substrate supply system that supplies the substrates from a cassette that accommodates a plurality of substrates in a stacked state at predetermined intervals to a transfer path.
  • a first storage unit that detachably stores the first cassette a second storage unit that detachably stores the second cassette, and the substrate are the first storage unit.
  • a drawer mechanism that draws out in a direction perpendicular to the stacking direction of the substrates and transfers it to the transport path, and the drawer mechanism between the first storage section and the second storage section.
  • a moving mechanism for moving is the first storage unit that accommodates a plurality of substrates in a stacked state at predetermined intervals to a transfer path.
  • a first storage unit that detachably stores the first cassette a second storage unit that detachably stores the second cassette, and the substrate are the first storage unit.
  • a drawer mechanism that draws out in a direction perpendicular to the stacking direction of the substrates and transfers it to the transport path,
  • the first cassette that has finished supplying the substrate is first stored.
  • the first cassette can be stored in the first storage portion, and the first cassette can be stored in the first storage portion again.
  • the substrates are accommodated in the first cassette without temporarily stopping the supply operation by the drawing mechanism, and the first cassette is transferred to the first cassette.
  • the number of storage devices that detachably stores the cassettes is not limited to two, and three or more storage devices may be provided.
  • the substrate supplied from the second cassette to the transfer path may be processed by a predetermined device and then returned to the second cassette through the same transfer path.
  • the second cassette is taken out of the second storage section and the processed substrate is removed from the second cassette.
  • the unprocessed substrate can be stored in the second cassette and stored again in the second storage section.
  • the pulling-out mechanism supports and guides the hand that holds the substrate, a drive mechanism that moves the hand in a direction perpendicular to the stacking direction, and the pulled-out substrate.
  • a guide part, and the moving mechanism may be configured to position the hand so as to face the substrate to be supplied when the hand pulls the substrate out of the first cassette and the second cassette.
  • substrates such as semiconductor wafers are thin, brittle, and weak against impact.
  • the storage unit or the cassette is moved vertically or horizontally, the substrate may be damaged in the cassette due to shaking or vibration.
  • the storage unit and the cassette do not move, and the hand moves in the stacking direction by the moving mechanism to pull out the substrate to be supplied from the cassette.
  • the drawer mechanism includes a guide portion.
  • the first storage unit and the second storage unit are arranged side by side in the stacking direction, and the moving mechanism is configured to move the drawer mechanism in the stacking direction. Can be done.
  • the drawing mechanism by moving the drawing mechanism only in the stacking direction, the drawing mechanism can be positioned at the accommodation position of each substrate of the first cassette and the second cassette. Therefore, the configuration and control of the moving mechanism can be simplified.
  • the stacking direction may be configured to be a vertical direction.
  • the substrate can be stored in the cassette in a stable state. Further, since the substrate is pulled out horizontally from the cassette, the substrate can be stably pulled out from the cassette.
  • a control unit that controls the moving mechanism may be provided, and the control unit may be configured to move the drawing mechanism in one direction of the stacking direction by the moving mechanism.
  • the drawer mechanism moves in one direction without moving back and forth in the stacking direction.
  • the substrates are sequentially supplied to the transport path from one of the first cassette and the second cassette.
  • the empty cassette can be quickly taken out of the storage device, a new substrate can be stored in the cassette, and the new substrate can be stored in the storage device again.
  • the processed substrate is processed after the substrate supplied to the transfer path is processed by a predetermined device and transferred to the original cassette.
  • the cassette in which the is stored is removed from the storage device. Then, similarly to the above, the unprocessed substrate can be stored in the cassette and then stored again in the storage device. In this way, the substrate can be supplied smoothly and efficiently.
  • the stacking direction is an up-down direction
  • the control unit may be configured to move the pull-out mechanism in one direction from the lower side to the upper side by the moving mechanism.
  • the drawer mechanism is configured such that the substrate housed at the bottom of the cassette arranged at the lower side is moved to the substrate housed at the top of the cassette arranged at the upper side. Until the board is pulled out in order. As a result, the substrate can be efficiently supplied from one cassette to the transfer path. Therefore, it is possible to expedite the cycle of the work of taking out the cassette containing the empty or processed substrate from the storage device, storing the unprocessed substrate in the cassette, and storing it again in the storage device. it can.
  • the second aspect of the present invention relates to a substrate processing apparatus for processing a substrate.
  • a substrate processing apparatus is a substrate supply system that supplies the substrates to a transport path from a cassette that accommodates a plurality of substrates in a stacked state at a predetermined interval, and detachably accommodates the first cassette.
  • a first storage portion, a second storage portion that detachably stores the second cassette, and the substrate is drawn from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrates.
  • a moving mechanism for moving the pullout mechanism between the first storage section and the second storage section.
  • the substrate processing apparatus of the present aspect a scribe unit that forms a scribe line on the surface of the substrate, a film laminating unit that attaches a film to the surface of the substrate on which the scribe line is formed, and the film is attached.
  • a reversing unit for reversing the substrate so that the face is on the lower side a break unit for dividing the substrate along the scribe line by applying a predetermined force to the surface on which the film is not attached, And a transport unit that transports the substrate to a predetermined position.
  • the present invention it is possible to provide a substrate supply system capable of increasing the operating rate of the device, and a substrate processing apparatus including the substrate supply system.
  • FIG. 1A to 1C are perspective views showing the configuration of the substrate supply system according to the embodiment.
  • FIG. 1A is a perspective view showing the configuration of the substrate supply system.
  • FIG. 1B is a perspective view showing the configuration of the cassette housed in the substrate supply system.
  • FIG. 1C is a perspective view showing the configuration of the storage device of the substrate supply system, and corresponds to FIG.
  • FIG. 2A and FIG. 2B are perspective views showing the configurations of the drawing mechanism and the moving mechanism of the substrate supply system according to the embodiment.
  • 3A and 3B are perspective views showing the substrate supply system and the transfer path according to the embodiment.
  • 4A and 4B are perspective views showing the substrate supply system and the transfer path according to the embodiment.
  • FIG. 5A is a block diagram showing the configuration of the substrate supply system according to the embodiment.
  • FIG. 5B is a flowchart showing the operation of the substrate supply system according to the embodiment.
  • 6A to 6C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 7 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 8 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 9 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 10A to 10C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment. 10A and 10B are enlarged views around the link mechanism.
  • FIG. 10C is a perspective view corresponding to FIG. 9. FIG.
  • FIG. 11 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 12A to 12C are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 12A and 12B are enlarged views around the link mechanism.
  • FIG. 12C is a perspective view corresponding to FIG. 11.
  • FIG. 13 is a perspective view showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • 14A and 14B are perspective views showing the configuration of the storage device of the substrate supply system according to the embodiment.
  • FIG. 14A is an enlarged view around the link mechanism.
  • FIG. 14B is a perspective view corresponding to FIG. 13.
  • FIG. 15 is a perspective view showing the configuration of a substrate processing apparatus including the substrate supply system according to the embodiment.
  • X-axis, Y-axis, and Z-axis orthogonal to each other are added to each drawing.
  • the XY plane is parallel to the horizontal plane
  • the Z-axis direction is the vertical direction.
  • the Z-axis positive side is the upper side
  • the Z-axis negative side is the lower side.
  • the Z-axis direction is the “stacking direction” described in the claims. In the present embodiment, this stacking direction may be referred to as the “vertical direction”.
  • the Y-axis direction is the “direction perpendicular to the stacking direction” described in the claims. This Y-axis direction may be described as “horizontal direction” in the present embodiment.
  • the substrate supply system 1 is used for supplying a wafer to a transfer path for transferring the wafer to a predetermined device when manufacturing a semiconductor wafer which is a material of a semiconductor device widely used in electronic devices and the like.
  • the substrate to be supplied by the substrate supply system 1 is a semiconductor wafer attached to an annular frame with a dicing tape.
  • the "semiconductor wafer attached to the annular frame with the dicing tape" is simply referred to as "wafer W".
  • the position where the wafer W is completely pulled out from the substrate supply system 1 is referred to as a “drawing position”, and the position where the wafer W is transferred to the transfer path is referred to as a “transfer position”. ..
  • Examples of the material of the wafer W include single crystal silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide (GaSa).
  • the above-mentioned material, thickness, and size of the semiconductor wafer are appropriately selected and designed according to the type, function, etc. of the semiconductor device to be manufactured.
  • FIG. 1A to 1C are perspective views showing the configuration of the substrate supply system 1.
  • 1A is a perspective view of the substrate supply system 1
  • FIG. 1B is a perspective view showing a cassette in which a wafer W is stored
  • FIG. 1C is a perspective view of a storage device 100. It is a figure.
  • the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300.
  • the entire storage device 100 is covered with a housing, this housing is omitted for convenience of description.
  • the casing that covers the entire storage device 100 is omitted.
  • the storage device 100 stores the wafer W supplied to the transfer path. Specifically, as shown in FIG. 1B, a plurality of wafers W are stacked and stored in a cassette, and the cassette is stored in the storage device 100. In this embodiment, two cassettes, the first cassette 10 and the second cassette 20, are prepared. Grooves 12 are provided at predetermined intervals on the inner surfaces of the side walls 11a and 11b of the first cassette 10. The wafer W is accommodated while being supported inside the first cassette 10 by being inserted into the groove 12.
  • a handle 13 used by an operator to carry the first cassette 10 is provided above the first cassette 10. Since the second cassette 20 has the same configuration as the first cassette 10, the description will be omitted. In the above description, the first cassette 10 and the second cassette 20 are described as a common cassette, but the first cassette 10 and the second cassette 20 are provided on the inner side surfaces of the side walls 11a and 11b. The intervals of the grooves 12 may be different, and the number of wafers W to be accommodated may be different.
  • the storage device 100 stores the first cassette 10 and the second cassette 20 described above. As shown in FIG. 1C, the storage device 100 includes a first storage portion 101 and a second storage portion 102 that are arranged side by side in the stacking direction of the wafers W, that is, in the vertical direction. Further, the storage device 100 includes a mounting portion 110 on which the first cassette 10 is detachably mounted, a housing 103 that covers the first storage portion 101, and a door 104 in the first storage portion 101. A handle 112 installed on the placement unit 110 and a shutter 140 that shuts off the storage device 100 from the pulled-out position are provided.
  • the first storage portion 101 is covered with the housing 103, and the door 104 that opens and closes in the horizontal direction is provided.
  • the door 104 is attached to a casing (not shown in FIGS. 1A and 1C) that covers the entire storage device 100.
  • the door 104 can be made of a transparent member so that the operator can visually recognize the first cassette 10 and the second cassette 20 during the operation of the substrate supply system 1.
  • FIG. 1C illustrates the case where the door 104 is transparent.
  • the case 103, the door 104, the mounting portion 110, and the handle 112 described above are similarly provided for the second storage portion 102.
  • the storage device 100 includes the first storage portion 101 and the second storage portion 102, and the door 104 is provided in each of the first storage portion 101 and the second storage portion 102. .. Therefore, for example, while the wafer W is being supplied from the first cassette 10 stored in the first storage unit 101 to the transfer path, the operator opens the door 104 of the second storage unit 102 to The mounting portion 110 of the second storage portion 102 can be pulled out in the Y-axis negative direction. At this time, when the second cassette 20 is not stored in the second storage section 102 or when the wafer W is not stored in the second cassette 20 (that is, all the wafers from the second cassette 20 are stored).
  • the operator When W is supplied to the transfer path), the operator stores the wafer W in the second cassette 20 and appropriately mounts the second cassette 20 on the mounting unit 110 of the second storage unit 102. After that, the mounting portion 110 of the second storage portion 102 is pulled in the Y-axis positive direction. In this way, the second cassette 20 can be stored in the second storage section 102.
  • the shutter 140 is opened in the storage device 100 when the wafer W is supplied to the transfer path.
  • the shutter 140 since the wafer W is supplied from the first storage unit 101 to the transfer path, the shutter 140 provided in the first storage unit 101 is open.
  • the second storage section 102 the second cassette 20 is being taken out.
  • the operator's hand may accidentally enter the back (Y-axis positive side) of the second storage unit 102, which is dangerous.
  • the wafer W may jump out of the second cassette 20 and fall.
  • the shutter 140 of the second storage unit 102 is closed in order to block the space between the second storage unit 102 and the pulled-out position.
  • 1A and 1C for convenience of description, the shutter 140 of the first storage unit 101 and the shutter 140 of the second storage unit 102 are illustrated so that the inside of each storage unit can be seen. The open state is shown, but it does not correspond to the actual operation. This is the same in FIGS. 3A to 4B.
  • the storage device 100 includes a moving unit 120, a restricting unit 130, an elevating mechanism 150, a supporting unit 160, a link mechanism 170, and a detecting unit 180.
  • the moving unit 120 is not shown in FIG. 1C but is shown in FIG. The detailed configuration of the storage device 100 will be described later with reference to FIGS. 6 to 14B.
  • FIGS. 2A and 2B are perspective views showing the configurations of the drawer mechanism 200 and the movement mechanism 300.
  • the drawing mechanism 200 draws the wafer W from the first cassette 10 and the second cassette 20 in order to supply the wafer W to the transfer path.
  • the drawer mechanism 200 includes a hand 210, a drive mechanism 220, a guide section 230, a retracting mechanism 240, and a sensor 250.
  • the hand 210 holds the peripheral edge of the wafer W.
  • the drive mechanism 220 moves the hand 210 in the horizontal direction.
  • the guide unit 230 guides the wafer W pulled out from the cassette to the transfer path while supporting the wafer W.
  • the guide portion 230 includes rails 231a and 231b and guide support members 232a to 232c that support the rails 231a and 231b.
  • the rails 231a and 231b are arranged on the X-axis positive side and the negative side.
  • the guide support members 232a and 232b are in contact with the lower portions of the rails 231a and 231b, respectively.
  • a guide support member 232c is connected to the lower portion of each of the guide support members 232a and 232b.
  • the guide support members 232a to 232c are rectangular plate members. 2A and 2B, the guide support member 232a is divided into two bodies, but the guide support member 232a may be integrated into one body.
  • the retracting mechanism 240 the wafer W pulled out from the storage device 100 is used as a transfer path. When the wafer is delivered, the interference between a member that receives the wafer W at the delivery position (for example, a holding member on the transfer path side) and the hand 210 is avoided.
  • the sensor 250 detects the wafer W to be supplied when the hand 210 pulls out the wafer W from the cassette.
  • the hand 210, the sensor 250, and the retracting mechanism 240 are connected in this order from the Y-axis negative side via a connecting member. Further, the retracting mechanism 240 is arranged below the hand 210 and the sensor 250.
  • the retracting mechanism 240 is specifically an air cylinder.
  • the retracting mechanism 240 and the hand 210 and the sensor 250 connected via the connecting member move integrally downward.
  • the air cylinder drive unit 405 is illustrated in FIG.
  • the drive mechanism 220 moves the wafer W held by the hand 210 in the horizontal direction.
  • the drive mechanism 220 includes a drawing guide part 221 that moves the wafer W in the horizontal direction, and a moving member 222 that moves the drawing guide part 221.
  • the drawer guide portion 221 is arranged in the space surrounded by the guide support members 232a to 232c, and is attached to the guide support member 232c.
  • a retracting mechanism 240 is attached to the moving member 222.
  • the retracting mechanism 240, the sensor 250, the hand 210, the guide part 230, and the wafer W integrally move in the horizontal direction.
  • the moving mechanism 300 moves the drawer mechanism 200 up and down between the first storage unit 101 and the second storage unit 102.
  • the moving mechanism 300 includes an elevating guide 310 that elevates the drawer mechanism 200, and an elevating member 320 that elevates the elevating guide 310.
  • the lifting member 320 is attached to the guide support member 232b.
  • the raising / lowering member 320 moves the raising / lowering guide 310, so that the drawer mechanism 200 is integrally raised / lowered via the raising / lowering member 320.
  • the substrate supply system 1 will be described on the assumption that the wafer W is supplied to the transfer path 500.
  • the wafers W stored in the lowermost part of the first cassette 10 stored in the first storage unit 101 are sequentially supplied to the transfer path.
  • FIGS. 3A to 4B are perspective views showing the configurations of the substrate supply system 1 and the transfer path 500.
  • FIG. 3A shows the case where the wafer W is drawn out by the drawing mechanism 200
  • FIG. 3B shows the case where the drawing of the wafer W by the drawing mechanism 200 is completed.
  • 4A shows a state immediately before the drawing mechanism 200 delivers the wafer W to the delivery position of the transfer path 500
  • FIG. 4B shows that the delivery of the wafer W to the delivery position of the transfer path 500 is completed. The case is shown.
  • the transport path 500 includes a transport mechanism 510, two transport rails 520, a guide member 530, and a transport hand 540.
  • the transfer hand 540 holds the wafer W transferred from the substrate supply system 1.
  • the transport hand 540 is attached to the guide member 530 of the transport rail 520, and when the transport mechanism 510 is driven, the guide member 530 moves along the guide of the transport mechanism 510. As a result, the wafer W is transferred along the transfer rail 520.
  • the moving mechanism 300 integrally moves the pull-out mechanism 200 downward and positions it at a predetermined height position.
  • the moving mechanism 300 integrally moves the pulling mechanism 200 to a position where the hand 210 faces the wafer W to be supplied, which is accommodated in the first cassette 10 or the second cassette 20.
  • the hand 210 positioned at the height position of the wafer W to be supplied moves to the Y-axis negative side by the drive mechanism 220 and holds the wafer W to be supplied.
  • the sensor 250 detects the wafer W to be supplied. This operation of the substrate supply system 1 is referred to as "drawing operation".
  • the drive mechanism 220 pulls the wafer W to the Y axis positive side.
  • the pulled-out wafer W is supported by rails 231a and 231b and positioned at the pull-out position while being guided.
  • the hand 210 is in a state of holding the wafer W.
  • This operation of the substrate supply system 1 is referred to as "drawing completion operation”.
  • the moving mechanism 300 integrally moves the extraction mechanism 200 upward.
  • the moving mechanism 300 integrally moves the drawer mechanism 200 so that the height positions of the rails 231a and 231b and the height position of the transport rail 520 of the transport path 500 match.
  • the hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is referred to as "delivery preparation operation".
  • the transfer mechanism 510 is driven to move the guide member 530 to which the transfer hand 540 is attached along the guide of the transfer mechanism, and the transfer hand 540 holds the wafer W. Then, the wafer W is transported to a predetermined place while being supported by the transport rail 520.
  • the substrate supply system 1 supplies the wafer W to the transfer path as described above.
  • the substrate supply system 1 repeatedly executes the above-mentioned drawing operation, drawing completion operation, delivery preparation operation, and delivery completion operation while the wafer W to be supplied is present.
  • the pull-out mechanism 200 and the moving mechanism 300 are the second storage units stored in the second storage unit 102.
  • the wafer W is pulled out from the cassette 20 and is supplied to the transfer path.
  • the pull-out mechanism 200 and the moving mechanism 300 sequentially pull out the wafer W stored in the lowermost part of the second cassette 20.
  • the operator While the substrate supply system 1 pulls out the wafer W from the second cassette 20 and supplies the wafer W to the transfer path, the operator opens the door 104 of the first storage unit 101 to set the mounting unit of the first storage unit 101. 110 is pulled out in the negative direction of the Y-axis, and the mounting portion 110 is positioned at the mounting / removing position. Then, the operator takes out the first cassette 10 from the mounting portion 110 of the first storage portion 101, stores a new wafer W in the first cassette 10, and places the mounting portion of the first storage portion 101. After being mounted on 110, the first storage unit 101 can be positioned again at the storage position. In this way, even while the first cassette is being taken out from the first storage unit 101, the wafer W is pulled out from the second cassette 20 and the supply operation to the transfer path is continued. Therefore, the operating rate of the substrate supply system 1 can be increased.
  • the delivery of the wafer W on the transfer path may be performed by holding the wafer W by the hand as described above, or by sucking and holding the wafer W by, for example, a member having a suction pad.
  • FIG. 5A is a block diagram showing the configuration of the substrate supply system 1.
  • the substrate supply system 1 includes a storage device 100, a drawer mechanism 200, and a movement mechanism 300, and further includes a control unit 400, an input unit 401, and a detection unit 402. , Is provided.
  • a pull-out guide drive unit 403, which is a drive unit of each of the pull-out guide unit 221, the elevating guide 310, and the retracting mechanism 240, an elevating guide drive unit 404, and an air cylinder drive unit 405 are provided.
  • the control unit 400 includes an arithmetic processing circuit such as a CPU and a memory such as a ROM, a RAM, and a hard disk.
  • the control unit controls each unit according to the program stored in the memory.
  • the input unit 401 receives a start when the substrate supply system 1 supplies the wafer W to the transfer path.
  • the detection unit 402 detects the position of the wafer W to be supplied in the substrate supply system 1. Further, the detection unit 402 may be configured to detect that the wafer W has been supplied to the transfer path.
  • the detection unit 402 can use, for example, a sensor, an imaging device, or the like.
  • FIG. 5B is a flowchart showing the operation of the substrate supply system 1 according to this embodiment. This control is executed by the control unit 400 shown in FIG. Here, similarly to the above, the operation when the wafer W is supplied from the substrate supply system 1 to the transfer path 500 will be described.
  • start is the time when the input unit receives the supply start of the wafer W to the transfer path.
  • the first storage unit 101 and the second storage unit 102 of the storage device 100 respectively store the first cassette 10 and the second cassette 20 in which the wafer W is stored. Further, the wafers W stored in the lowermost part of the first cassette 10 are sequentially supplied to the upper wafers W.
  • step S11 the elevating guide driving unit 404 drives the elevating guide 310 to move the extraction mechanism 200 to the height position of the wafer W to be supplied, and the sensor 250 to detect the wafer W to be supplied. This is the above-mentioned drawing operation, and corresponds to the state shown in FIG.
  • step S12 when the sensor 250 detects the supply target wafer W, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210 to hold the supply target wafer W and to extract the supply target wafer W in the horizontal direction. Position in position. This is the above-mentioned drawing completion operation, and corresponds to the state shown in FIG.
  • step S13 the control unit 400 causes the elevating guide driving unit 404 to drive the elevating guide 310 to position the drawer mechanism 200 at the height position of the conveying rail 520 of the conveying path 500.
  • This is the delivery preparation operation described above, and corresponds to the state shown in FIG.
  • step S ⁇ b> 14 when the detection unit 402 detects that the wafer W is located at the height position of the transfer rail 520, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210, and the hand 210 operates. The gripping of the wafer W is stopped. Then, the control unit 400 causes the air cylinder drive unit 405 to apply a predetermined pressure to the retracting mechanism 240, and moves the hand 210 downward. This avoids interference between the hand 210 and the transport hand 540. This is the delivery completion operation described above, and corresponds to the state shown in FIG.
  • step S14 the wafer W is transferred to the transfer path 500 (see FIG. 4B) and transferred to a predetermined place.
  • step S15 when the detection unit 402 detects that the delivery of the wafer W is completed, the control unit 400 determines whether the wafer W to be supplied is in the first cassette 10 or the second cassette 20. .. When there is a wafer W to be supplied (S15; YES), the operations in steps S11 to S14 described above are repeatedly executed. When there is no wafer W to be supplied (S15; NO), the supply of the wafer W to the transfer path by the substrate supply system 1 ends.
  • the substrate supply system 1 may be configured to include a display unit that displays the states of the first cassette 10 and the second cassette 20. For example, when a display screen (not shown) is connected to the substrate supply system 1 and unprocessed, that is, the wafer W to be supplied remains in both the first cassette 10 and the second cassette 20, "Processing" is displayed on the screen. From this display, the operator can grasp that the wafer W is being supplied from the first cassette 10 or the second cassette 20 to the transfer path.
  • a display screen not shown
  • processing completed is displayed. From this display, the operator can know that the supply of the wafer W is completed.
  • the operator can quickly grasp the states of the first cassette 10 and the second cassette 20 stored in the storage device 100, and thus the operation can be performed smoothly. be able to.
  • 6A to 6C are perspective views showing different states of the storage device 100, and the left side view and the right side view correspond to each other.
  • FIGS. 6A to 6C the storage device 100 has four main states.
  • FIG. 6A shows a state (first state) in which the mounting portion 110 is pulled out from the second storage portion 102. At this time, since the shutter 140 of the second storage unit 102 is closed, the operator cannot put his or her hand in the storage device 100.
  • FIG. 6B shows a state (second state) in which the mounting portion 110 is accommodated in the second storage portion 102.
  • FIG. 6C shows a preparation state (third state) for opening the shutter 140 of the second storage section 102.
  • the state where the opening of the shutter 140 of the second storage unit 102 is completed corresponds to FIGS. 1A and 1C.
  • the configuration of the storage device 100 will be described separately for these four states.
  • the shutter 140 of the first storage unit 101 is opened upward, and the shutter 140 of the second storage unit 102 is opened downward.
  • the opening direction is different between the upper and lower sides, the structure for opening the shutter 140 is the same. Therefore, in the following description, the description will focus on the second storage section 102 arranged in the upper stage.
  • the second cassette 20 is detachably mounted on the mounting portion 110 of the second storage portion 102.
  • the position of the placement unit 110 of the second storage unit 102 is referred to as the “attachment / detachment position”.
  • the second cassette 20 is in the state of being mounted on the mounting portion 110 of the second storage portion 102, and the second storage It is stored in the unit 102.
  • the position of the placement unit 110 of the second storage unit 102 at this time is referred to as a “storage position”.
  • the placement unit 110 is located at the attachment / detachment position.
  • FIGS. 7 and 8 are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the first state.
  • the second cassette 20, the housing 103, and the door 104 are omitted in FIGS. 7 and 8, and the detection unit 180 is further omitted in FIG.
  • the storage device 100 includes the mounting portion 110, the moving portion 120, the regulating portion 130, the shutter 140, the elevating mechanism 150, the supporting portion 160, and the link mechanism 170 described above.
  • a pedestal 190 is provided in addition to the detection means 180.
  • the portion surrounded by the broken line is an area where the second cassette 20 is mounted.
  • the mounting part 110 On the upper surface of the mounting part 110 , four positioning members 111 for positioning the second cassette 20 are provided. When mounting the second cassette 20 on the mounting portion 110, both ends of the side walls 11a and 11b of the second cassette 20 are fitted to the four positioning members 111 (see FIG. 1C).
  • the moving unit 120 moves the placing unit 110 in the horizontal direction between the attachment / detachment position and the storage position.
  • the moving unit 120 includes a link member 121, horizontal slide members 122a and 122b, a guide member 123, and a protruding member 124.
  • the link member 121 is not shown in FIG. 7, but is shown in FIG.
  • the link member 121 includes a member 121a having a stepped cross section in the X-axis direction and a transfer roller 121b.
  • a hole is formed in the lower part of the member 121a in the X-axis direction, and the rotation shaft of the transfer roller 121b is passed through the hole.
  • the shutter 140 is attached to the rising portion above the member 121a (see FIG. 10C).
  • the horizontal slide member 122a is provided on the mounting portion 110 side, and the horizontal slide member 122b is provided on the pedestal 190 side.
  • the mounting part 110 moves in the horizontal direction
  • the horizontal slide member 122a moves with respect to the horizontal slide member 122b.
  • the mounting unit 110 can move in the horizontal direction.
  • the guide member 123 is an elongated rectangular member and is installed on the pedestal 190.
  • the Y-axis positive side and the negative side of the guide member 123 are formed with a gentle slope toward the center, and a V-shaped recess 123a is formed at the end on the Y-axis positive side.
  • the lower end of the protruding member 124 provided on the mounting portion 110 is formed in a hemispherical shape (not shown).
  • the mounting portion 110 is appropriately braked, and the pedestal 190 can smoothly move while decelerating. Further, the hemispherical portion of the projecting member 124 is fitted into the recess 123 a, whereby the mounting portion 110 is positioned in the second storage portion 102.
  • the restriction unit 130 moves the mounting unit 110 to the storage position while the mounting unit 110 moves in the horizontal direction between the attachment / detachment position (first state) and the storage position (second state).
  • the wafer W is prevented from jumping out and falling from the second cassette 20 (on the Y-axis positive side).
  • the restricting portion 130 contacts the inner end surface of the second cassette 20. That is, it abuts the wafer W stored in the second cassette 20.
  • the restriction part 130 is a plate-shaped member, and in the present embodiment, two are provided.
  • the restriction portion 130 is supported by the support plate 131.
  • the shutter 140 blocks between the second storage unit 102 and the pull-out position.
  • the shutter 140 In the second storage unit 102, when the wafer W is pulled out from the second cassette 20, the shutter 140 is opened, and when the mounting unit 110 is moved from the storage position to the attachment / detachment position, the shutter 140 is closed.
  • the lifting mechanism 150 moves the shutter 140 up and down.
  • the elevating mechanism 150 includes a drive unit 151, a receiving member 152, and elevating slide members 153a and 153b.
  • the drive unit 151 is a cylinder.
  • the receiving member 152 is connected to the lower end of the rod 151a of the drive unit 151.
  • the receiving member 152 is composed of a frame-shaped member whose Y-axis negative side is open.
  • the upper and lower gaps 152a of the receiving member 152 fit into the above-mentioned transfer rollers 121b.
  • the transfer roller 121b is fitted in the gap 152a of the receiving member 152 (for example, see FIG. 10C). Since the receiving member 152 is connected to the rod 151a, when the driving unit 151 drives, the receiving member 152 moves up and down together with the driving unit 151.
  • the elevating slide members 153a and 153b are provided between the shutter 140 and the support 160, and elevate the shutter 140.
  • An elevating slide member 153a is attached to the shutter 140, and an elevating slide member 153b is attached to the support part 160.
  • the support part 160 is a member having a stepwise cross section in the Y-axis direction (see FIG. 9) and is installed on the mounting part 110.
  • the restriction unit 130 is supported via a link mechanism 170 described below.
  • the link mechanism 170 includes a link base 171, a link plate 172, two link bars 173, and a link roller 174.
  • the link base 171 and the link plate 172 are plate-shaped members and are connected by two link bars 173.
  • the link base 171 is attached to the shutter 140, and the link plate 172 is attached to the support plate 131.
  • a link roller 174 is rotatably provided below the link plate 172.
  • the link roller 174 is in contact with the horizontal surface below the support 160.
  • the two link bars 173 are not shown in FIG. 7, but are shown in FIG.
  • the shutter 140 is supported by the support portion 160 via the horizontal slide members 122a and 122b.
  • a link base 171 is attached to the shutter 140, and a link plate 172 connected to the link base 171 via a link bar 173 is attached to the support plate 131.
  • the link base 171 and the link plate 172 form a four-bar link with the two link bars 173.
  • the link plate 172 slides while maintaining the vertical state.
  • the support plate 131 supports the restriction portion 130. Therefore, the restriction unit 130 is supported by the shutter 140 via the link mechanism 170, and the restriction unit 130 is supported by the support unit 160 via the link mechanism 170.
  • the link bar 173 of the link mechanism 170 is horizontal with respect to the mounting portion 110. Therefore, the link base 171 and the link plate 172 are slightly separated from each other. That is, the shutter 140 to which the link base 171 is attached and the support plate 131 to which the link plate 172 is attached are separated from each other. Since the restriction portion 130 is mounted on the support plate 131, the shutter 140 and the restriction portion 130 are separated from each other.
  • the detection means 180 is a sensor provided on the Y-axis positive side of the pedestal 190.
  • the detection unit 180 detects whether the wafer W is protruding from the second cassette 20.
  • the restricting portion 130, the support plate 131, and the shutter 140 also move horizontally along with the mounting portion 110. Move to.
  • This is a state in which the restricting portion 130 is in contact with the wafer W, as shown in FIG. 6A, particularly the right side diagram of FIG. 6A. Therefore, when taking out the second cassette 20 from the placing section 110 and when placing the second cassette 20 on the placing section 110, the operator puts his / her hand only within the area of the placing section 110. Therefore, the operator's hand does not enter the transport path. Therefore, the operator can safely attach and detach the second cassette 20.
  • the storage device 100 is in the second state, that is, the placement unit 110 is located at the storage position will be described.
  • FIGS. 9 and 10A to 10C are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the second state.
  • 10A and 10B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 10B.
  • FIG. 10C is a perspective view corresponding to FIG. 9. Further, in FIGS. 9 and 10A to 10C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the linking member 121, the restriction section 130, the support plate 131, the shutter 140, and the support section 160 are in the states shown in FIGS. 7 and 8. While maintaining, it moves horizontally together with the mounting part 110.
  • the transfer roller 121b of the linking member 121 horizontally moved together with the shutter 140 fits into the gap 152a of the receiving member 152.
  • the width of the transfer roller 121b is set to be wider so that the transfer roller 121b can continuously transfer to the receiving member 152.
  • FIGS. 10A and 10C the upper frame of the receiving member 152 and the shutter 140 do not interfere with each other.
  • the link mechanism 170 is the same as in the first state. It is slightly separated, and the restriction portion 130 is in contact with the wafer W. This is shown in FIG. 6B, in which the restricting portion 130 is in contact with the wafer W.
  • the mounting unit 110 horizontally moves from the attachment / detachment position to the storage position from the first state to the second state, the positional relationship between the restriction unit 130 and the shutter 140 does not change, It horizontally moves together with the mounting unit 110. Therefore, while the mounting part 110 is horizontally moved from the attachment / detachment position to the storage position, the restriction part 130 continues to contact the wafer W. Therefore, there is no possibility that the wafer W jumps out of the second cassette 20 toward the supply region side and falls. Further, since the shutter 140 closes the supply area side, it is possible to reliably prevent the operator's hand from entering the storage device 100.
  • FIGS. 11 and 12 (a) to (c) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the third state.
  • 12A and 12B are enlarged views around the link mechanism, and the shutter 140 is omitted in FIG. 12B.
  • FIG. 12C is a perspective view corresponding to FIG. 11. Further, in FIGS. 11 and 12A to 12C, the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the storage device 100 prepares to open the shutter 140 so that the wafer W can be supplied from the second cassette 20.
  • the restriction unit 130 also moves up and down together with the shutter 140. Since the regulating portion 130 is in contact with the wafer W, the regulating portion 130 moves up and down while rubbing the wafer W. Since the quality of the wafer W deteriorates, it is necessary to raise the shutter 140 after separating the wafer W and the restriction unit 130. Therefore, as shown in FIGS. 7 and 8A to 8C, in the storage device 100, in preparation for opening the shutter 140, the wafer W and the restriction unit 130 are separated (third state).
  • a link base 171 is attached to the shutter 140.
  • the link base 171 also moves up, and the two link bars 173 (see FIG. 10B) maintained in the horizontal direction rotate.
  • the link roller 174 rotatably provided on the link plate 172 rolls on the horizontal surface of the lower portion of the support portion 160 to the Y axis positive side, and moves the link plate 172 to the Y axis positive side. Since the link plate 172 is attached to the support plate 131, the support plate 131 also moves to the Y axis positive side.
  • the link plate 172 moves horizontally while maintaining a vertical state by a four-bar link.
  • the restriction portion 130 supported by the support plate 131 slightly moves from the state shown in FIGS. 9, 10 (a) to (c) to the Y-axis positive side. Then, the restriction portion 130 also moves in the horizontal direction, and the restriction portion 130 is separated from the wafer W. Accordingly, the restriction portion 130 can be lifted after being separated from the wafer W without contacting the wafer W, that is, without shifting the position of the wafer W.
  • the storage device 100 is in the fourth state, that is, the mounting unit 110 is located at the storage position and the shutter 140 is opened will be described.
  • FIGS. 13, 14 (a) and (b) are perspective views showing the configuration of the storage device 100, showing the storage device 100 in the fourth state.
  • 14A is an enlarged view around the link mechanism 170
  • FIG. 14B is a perspective view corresponding to FIG.
  • the second cassette 20, the housing 103, the door 104, and the detection unit 180 are omitted.
  • the shutter 140 of the first storage unit 101 moves downward.
  • the first storage unit 101 is composed of members and mechanisms similar to those of the second storage unit 102.
  • the support section 160 and the link mechanism 170 are provided upside down with respect to the support section 160 and the link mechanism 170 of the second storage section 102.
  • Other configurations are provided similarly to the second storage section 102.
  • the link mechanism 170 is provided upside down from the state in which it was provided in the second storage unit 102. Due to its own weight, the link roller 174 of the second storage portion 102 can be stably positioned on the horizontal plane of the step portion of the support portion 160 without providing the link mechanism 170 with the biasing member.
  • the link roller 174 is located below the horizontal surface of the step portion of the support portion 160. As a result, the link roller 174 can be moved by its own weight. When the link roller 174 moves, the link plate 172 also moves, and the link mechanism 170 becomes unstable. Therefore, the link mechanism 170 of the second storage unit 102 is provided with an urging member (not shown) for urging the link roller 174 upward. As a result, the link mechanism 170 of the first storage unit 101 is stabilized.
  • the regulation portion 130 and the shutter 140 are also pulled out. The same applies when returning the placing part 110 to the storage position. For this reason, the restriction unit 130 continues to face the wafer W during the movement of the mounting unit 110, and it is possible to reliably prevent the wafer W from dropping from the cassette. Further, when the mounting portion 110 is positioned at the attachment / detachment position, the back of each storage portion is closed by the shutter 140, so that it is possible to prevent the operator from inserting a hand into the storage device 100.
  • the board supply system 1 does not move the storage device 100 vertically or horizontally.
  • a semiconductor wafer is a thin film, is brittle, and is vulnerable to impact. Therefore, when the storage device 100 moves, the wafer W to be supplied may be damaged due to shaking or vibration.
  • the wafer W is pulled out by the pulling mechanism 200 and the moving mechanism 300. Therefore, it is possible to reliably prevent the wafer W from being damaged in the storage device 100.
  • the drawer mechanism 200 also includes rails 231a and 231b.
  • the wafer W is pulled out while being supported by the rails 231a and 231b. Therefore, the wafer W can be pulled out smoothly.
  • the first storage section 101 and the second storage section 102 are arranged side by side in the stacking direction of the wafers W.
  • the pull-out mechanism 200 can be moved only in the stacking direction to position the hand 210 on the wafer W of the first cassette 10 and the second cassette 20. Therefore, the configuration and control of the moving mechanism 300 can be simplified.
  • the wafer W supplied to the transfer path may be returned to the cassette stored before the supply.
  • the wafer W is delivered to the hand 210 of the pullout mechanism 200 at the delivery position of the transfer path.
  • the moving mechanism 300 positions the drawing mechanism 200 at the position before the supply of the wafer W. Then, the drawing mechanism 200 inserts the wafer W into the cassette.
  • the stacking direction is the vertical direction.
  • the wafer W can be accommodated in the first cassette 10 and the second cassette 20 in a stable state. Further, the wafer W can be stably pulled out in the horizontal direction from the first cassette 10 and the second cassette 20.
  • the wafer W is supplied from the first cassette 10 of the first storage unit 101. That is, the pull-out mechanism 200 moves in one direction from the lower side to the upper side without moving back and forth in the stacking direction. Therefore, when the first cassette 10 becomes empty, the first cassette 10 is promptly taken out from the storage device 100, a new wafer W is stored in the first cassette 10, and the first storage 10 is again stored. It can be stored in the unit 101. Therefore, the supply of the wafer W is performed smoothly and efficiently.
  • the wafer W may be supplied from the second cassette 20.
  • the wafers W stored in the uppermost part of the second cassette 20 may be sequentially supplied so that the drawing mechanism 200 moves in one direction in the stacking direction.
  • the wafer W when the wafer W is supplied from the first cassette 10 of the one storage unit 101 via the horizontal slide members 122a and 122b, the wafer stored in the lowermost part of the first cassette 10 is used. Wafers W are supplied in order from W. As a result, the wafer W can be efficiently supplied from one cassette to the transfer path. Therefore, a cycle in which the cassette containing the wafer W that has become empty or has been processed is taken out from the storage device 100, the unprocessed wafer W is stored in the cassette, and the wafer W is stored again in the storage device 100. Can be accelerated.
  • the substrate supply system 1 described above can be combined with a plurality of units for processing a wafer to configure the substrate processing apparatus 30.
  • FIG. 15 is a perspective view showing the configuration of the substrate processing apparatus 30 including the substrate supply system 1.
  • the substrate processing apparatus 30 includes a scribe unit 40 that forms a scribe line on the surface of the wafer W, a film laminating unit 50 that attaches a film to the surface of the wafer W on which the scribe line is formed, and a film.
  • the reversing unit 60 for reversing the wafer W so that the surface on which the film is adhered is on the lower side, and the break unit 70 for dividing the wafer W along the scribe line by applying a predetermined force to the surface on which the film is not adhered.
  • a transfer unit 80 that transfers the wafer W to a predetermined position.
  • the substrate supply system 1 is covered with a housing.
  • the substrate processing apparatus 30 having the above-described configuration supplies the wafer W smoothly by the substrate supply system 1, so that the operation rate of the apparatus is increased. Can be increased.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
PCT/JP2019/041058 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置 Ceased WO2020090518A1 (ja)

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TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置

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CN112912998A (zh) 2021-06-04

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