JP7432243B2 - 基板供給システムおよび基板加工装置 - Google Patents

基板供給システムおよび基板加工装置 Download PDF

Info

Publication number
JP7432243B2
JP7432243B2 JP2020553785A JP2020553785A JP7432243B2 JP 7432243 B2 JP7432243 B2 JP 7432243B2 JP 2020553785 A JP2020553785 A JP 2020553785A JP 2020553785 A JP2020553785 A JP 2020553785A JP 7432243 B2 JP7432243 B2 JP 7432243B2
Authority
JP
Japan
Prior art keywords
cassette
substrate
section
supply system
storage section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020553785A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020090518A1 (ja
JPWO2020090518A5 (enExample
Inventor
修 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of JPWO2020090518A1 publication Critical patent/JPWO2020090518A1/ja
Publication of JPWO2020090518A5 publication Critical patent/JPWO2020090518A5/ja
Application granted granted Critical
Publication of JP7432243B2 publication Critical patent/JP7432243B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
JP2020553785A 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置 Active JP7432243B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018205614 2018-10-31
JP2018205614 2018-10-31
PCT/JP2019/041058 WO2020090518A1 (ja) 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置

Publications (3)

Publication Number Publication Date
JPWO2020090518A1 JPWO2020090518A1 (ja) 2021-09-16
JPWO2020090518A5 JPWO2020090518A5 (enExample) 2022-10-03
JP7432243B2 true JP7432243B2 (ja) 2024-02-16

Family

ID=70463152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553785A Active JP7432243B2 (ja) 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置

Country Status (4)

Country Link
JP (1) JP7432243B2 (enExample)
CN (1) CN112912998A (enExample)
TW (1) TWI805823B (enExample)
WO (1) WO2020090518A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
CN120693226A (zh) * 2023-02-03 2025-09-23 雅马哈发动机株式会社 激光加工装置、半导体芯片及半导体芯片的制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (fr) 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede
JP2012146872A (ja) 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd 樹脂塗布装置
JP2012156413A (ja) 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2016514376A (ja) 2013-03-14 2016-05-19 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347036A (ja) * 1986-08-15 1988-02-27 Toshiba Corp 物品の移載装置
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
JPH0778794A (ja) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd ダイシング装置のカセットテーブル
JPH09199575A (ja) * 1996-01-18 1997-07-31 Toshiba Mechatronics Kk 半導体ペレットボンディング装置
JP2005159295A (ja) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理装置及び処理方法
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP2012009519A (ja) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp 真空処理装置
JP6707291B2 (ja) * 2016-10-14 2020-06-10 株式会社ディスコ ウェーハの加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082542A1 (fr) 2002-04-01 2003-10-09 Mitsuboshi Diamond Industrial Co., Ltd. Procede de sectionnement d'un substrat constitue d'un materiau fragile et dispositif de sectionnement faisant appel a ce procede
JP2012146872A (ja) 2011-01-13 2012-08-02 Disco Abrasive Syst Ltd 樹脂塗布装置
JP2012156413A (ja) 2011-01-28 2012-08-16 Fuji Mach Mfg Co Ltd ダイ供給装置
JP2016514376A (ja) 2013-03-14 2016-05-19 ブルックス オートメーション インコーポレイテッド ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置

Also Published As

Publication number Publication date
CN112912998A (zh) 2021-06-04
WO2020090518A1 (ja) 2020-05-07
TW202018846A (zh) 2020-05-16
JPWO2020090518A1 (ja) 2021-09-16
TWI805823B (zh) 2023-06-21

Similar Documents

Publication Publication Date Title
US6726526B2 (en) Cutting machine
TWI356797B (enExample)
CN108336007B (zh) 框架单元搬送系统
JP7432243B2 (ja) 基板供給システムおよび基板加工装置
JP6218600B2 (ja) 加工装置
JP2014116461A (ja) 分割装置
JP2019204821A (ja) 加工装置
JP7432242B2 (ja) 収納装置および基板加工装置
JP7408335B2 (ja) ワーク収容機構
JP2020205343A (ja) 加工装置
JP2006019354A (ja) 加工装置
JP2011192863A (ja) 収容カセット
JP6522476B2 (ja) 搬送機構
JP2013093530A (ja) ユニット搬出入装置
JP2011060898A (ja) ワーク収納カセット
JP5308218B2 (ja) 加工装置
JP6448456B2 (ja) 加工装置
JP4095917B2 (ja) トレー式部品供給装置及びそのパレット位置決め方法
JP6158002B2 (ja) 切削装置
JP6607744B2 (ja) 供給装置および供給方法
JP4993173B2 (ja) ドレスカセット
JP2024014456A (ja) 処理装置
JP2025183547A (ja) 処理装置および処理方法
JP2021086913A (ja) カセット
JP2019050257A (ja) 収容カセット

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220920

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220922

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230926

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240116

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240129

R150 Certificate of patent or registration of utility model

Ref document number: 7432243

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150