CN112912998A - 基板供给系统及基板加工装置 - Google Patents

基板供给系统及基板加工装置 Download PDF

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Publication number
CN112912998A
CN112912998A CN201980036023.9A CN201980036023A CN112912998A CN 112912998 A CN112912998 A CN 112912998A CN 201980036023 A CN201980036023 A CN 201980036023A CN 112912998 A CN112912998 A CN 112912998A
Authority
CN
China
Prior art keywords
cassette
substrate
supply system
wafer
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980036023.9A
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English (en)
Chinese (zh)
Inventor
奥田修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN112912998A publication Critical patent/CN112912998A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
CN201980036023.9A 2018-10-31 2019-10-18 基板供给系统及基板加工装置 Pending CN112912998A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-205614 2018-10-31
JP2018205614 2018-10-31
PCT/JP2019/041058 WO2020090518A1 (ja) 2018-10-31 2019-10-18 基板供給システムおよび基板加工装置

Publications (1)

Publication Number Publication Date
CN112912998A true CN112912998A (zh) 2021-06-04

Family

ID=70463152

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036023.9A Pending CN112912998A (zh) 2018-10-31 2019-10-18 基板供给系统及基板加工装置

Country Status (4)

Country Link
JP (1) JP7432243B2 (enExample)
CN (1) CN112912998A (enExample)
TW (1) TWI805823B (enExample)
WO (1) WO2020090518A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
KR20250078502A (ko) * 2023-02-03 2025-06-02 야마하하쓰도키 가부시키가이샤 레이저 가공 장치, 반도체칩 및 반도체칩의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347036A (ja) * 1986-08-15 1988-02-27 Toshiba Corp 物品の移載装置
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
JPH0778794A (ja) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd ダイシング装置のカセットテーブル
JPH09199575A (ja) * 1996-01-18 1997-07-31 Toshiba Mechatronics Kk 半導体ペレットボンディング装置
ATE458597T1 (de) * 2002-04-01 2010-03-15 Mitsuboshi Diamond Ind Co Ltd Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung
JP2005159295A (ja) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理装置及び処理方法
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP2012009519A (ja) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp 真空処理装置
JP5675378B2 (ja) * 2011-01-13 2015-02-25 株式会社ディスコ 樹脂塗布装置
JP5686469B2 (ja) 2011-01-28 2015-03-18 富士機械製造株式会社 ダイ供給装置
US9545724B2 (en) 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置
JP6707291B2 (ja) * 2016-10-14 2020-06-10 株式会社ディスコ ウェーハの加工方法

Also Published As

Publication number Publication date
JPWO2020090518A1 (ja) 2021-09-16
TW202018846A (zh) 2020-05-16
JP7432243B2 (ja) 2024-02-16
TWI805823B (zh) 2023-06-21
WO2020090518A1 (ja) 2020-05-07

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