TWI805823B - 基板供給系統及基板加工裝置 - Google Patents

基板供給系統及基板加工裝置 Download PDF

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Publication number
TWI805823B
TWI805823B TW108128524A TW108128524A TWI805823B TW I805823 B TWI805823 B TW I805823B TW 108128524 A TW108128524 A TW 108128524A TW 108128524 A TW108128524 A TW 108128524A TW I805823 B TWI805823 B TW I805823B
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TW
Taiwan
Prior art keywords
cassette
substrate
loading
supply system
wafer
Prior art date
Application number
TW108128524A
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English (en)
Chinese (zh)
Other versions
TW202018846A (zh
Inventor
奥田修
Original Assignee
日商三星鑽石工業股份有限公司
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Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW202018846A publication Critical patent/TW202018846A/zh
Application granted granted Critical
Publication of TWI805823B publication Critical patent/TWI805823B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
TW108128524A 2018-10-31 2019-08-12 基板供給系統及基板加工裝置 TWI805823B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2018-205614 2018-10-31
JP2018205614 2018-10-31

Publications (2)

Publication Number Publication Date
TW202018846A TW202018846A (zh) 2020-05-16
TWI805823B true TWI805823B (zh) 2023-06-21

Family

ID=70463152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108128524A TWI805823B (zh) 2018-10-31 2019-08-12 基板供給系統及基板加工裝置

Country Status (4)

Country Link
JP (1) JP7432243B2 (enExample)
CN (1) CN112912998A (enExample)
TW (1) TWI805823B (enExample)
WO (1) WO2020090518A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
KR20250078502A (ko) * 2023-02-03 2025-06-02 야마하하쓰도키 가부시키가이샤 레이저 가공 장치, 반도체칩 및 반도체칩의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050245051A1 (en) * 2002-04-01 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Parting method for fragile material substrate and parting device using the method
JP2009010287A (ja) * 2007-06-29 2009-01-15 Tokyo Electron Ltd 基板の処理システム
TW200917356A (en) * 2003-09-18 2009-04-16 Nec Lcd Technologies Ltd Method of processing substrate and chemical used in the
TW201201313A (en) * 2010-06-23 2012-01-01 Hitachi High Tech Corp Vacuum processing apparatus
TW201816872A (zh) * 2016-10-14 2018-05-01 日商迪思科股份有限公司 晶圓之加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347036A (ja) * 1986-08-15 1988-02-27 Toshiba Corp 物品の移載装置
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
JPH0778794A (ja) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd ダイシング装置のカセットテーブル
JPH09199575A (ja) * 1996-01-18 1997-07-31 Toshiba Mechatronics Kk 半導体ペレットボンディング装置
JP5675378B2 (ja) * 2011-01-13 2015-02-25 株式会社ディスコ 樹脂塗布装置
JP5686469B2 (ja) 2011-01-28 2015-03-18 富士機械製造株式会社 ダイ供給装置
US9545724B2 (en) 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
JP2015138856A (ja) 2014-01-22 2015-07-30 株式会社ディスコ 切削装置
JP2017175029A (ja) 2016-03-25 2017-09-28 富士機械製造株式会社 ウエハ搬送装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050245051A1 (en) * 2002-04-01 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Parting method for fragile material substrate and parting device using the method
TW200917356A (en) * 2003-09-18 2009-04-16 Nec Lcd Technologies Ltd Method of processing substrate and chemical used in the
JP2009010287A (ja) * 2007-06-29 2009-01-15 Tokyo Electron Ltd 基板の処理システム
TW201201313A (en) * 2010-06-23 2012-01-01 Hitachi High Tech Corp Vacuum processing apparatus
TW201816872A (zh) * 2016-10-14 2018-05-01 日商迪思科股份有限公司 晶圓之加工方法

Also Published As

Publication number Publication date
JPWO2020090518A1 (ja) 2021-09-16
TW202018846A (zh) 2020-05-16
JP7432243B2 (ja) 2024-02-16
CN112912998A (zh) 2021-06-04
WO2020090518A1 (ja) 2020-05-07

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