TWI356797B - - Google Patents

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Publication number
TWI356797B
TWI356797B TW096134036A TW96134036A TWI356797B TW I356797 B TWI356797 B TW I356797B TW 096134036 A TW096134036 A TW 096134036A TW 96134036 A TW96134036 A TW 96134036A TW I356797 B TWI356797 B TW I356797B
Authority
TW
Taiwan
Prior art keywords
mask
box
reticle
holding device
holding
Prior art date
Application number
TW096134036A
Other languages
English (en)
Chinese (zh)
Other versions
TW200821235A (en
Inventor
Imura Kazuhisa
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200821235A publication Critical patent/TW200821235A/zh
Application granted granted Critical
Publication of TWI356797B publication Critical patent/TWI356797B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741Handling masks outside exposure position, e.g. reticle libraries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67359Closed carriers specially adapted for containing masks, reticles or pellicles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Library & Information Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW096134036A 2006-09-29 2007-09-12 Mask case, mask cassette, pattern transfer method, manufacturing method for display apparatus and installation method of phto-mask TW200821235A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269609A JP4855885B2 (ja) 2006-09-29 2006-09-29 マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法

Publications (2)

Publication Number Publication Date
TW200821235A TW200821235A (en) 2008-05-16
TWI356797B true TWI356797B (enExample) 2012-01-21

Family

ID=39254845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096134036A TW200821235A (en) 2006-09-29 2007-09-12 Mask case, mask cassette, pattern transfer method, manufacturing method for display apparatus and installation method of phto-mask

Country Status (4)

Country Link
JP (1) JP4855885B2 (enExample)
KR (1) KR101094502B1 (enExample)
CN (1) CN101152919B (enExample)
TW (1) TW200821235A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760062B (zh) * 2020-05-14 2022-04-01 家登精密工業股份有限公司 提供有保持銷組件之光罩盒及固持光罩的方法
TWI853622B (zh) * 2023-06-28 2024-08-21 日商協同股份有限公司 光罩收納盒

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052106B2 (ja) * 2006-11-22 2012-10-17 旭化成イーマテリアルズ株式会社 ペリクルの収納方法
KR101121176B1 (ko) * 2008-04-23 2012-03-23 피엠씨글로벌 주식회사 포토마스크 케이스의 구조
JP5149207B2 (ja) * 2009-01-13 2013-02-20 株式会社荏原製作所 基板搭載装置
KR101067818B1 (ko) * 2009-08-14 2011-09-27 (주)아이콘 반도체 장비용 트레이 클램프 장치
JP2011203309A (ja) * 2010-03-24 2011-10-13 Shin-Etsu Chemical Co Ltd ペリクルの収納容器およびペリクル収納容器の搬送用台車
JP5586559B2 (ja) * 2011-10-28 2014-09-10 信越化学工業株式会社 ペリクル収容容器
TWI622538B (zh) * 2012-05-11 2018-05-01 Nikon Corp Substrate box, substrate transfer box, case cover, substrate transfer system, and substrate transfer method
JP2014218328A (ja) * 2013-05-08 2014-11-20 新東エスプレシジョン株式会社 メタルマスクシート供給システム
KR102242065B1 (ko) * 2015-01-26 2021-04-19 가부시키가이샤 니콘 마스크 케이스, 보관 장치 및 방법, 반송 장치 및 방법, 그리고 노광 장치
TWI658532B (zh) * 2017-08-09 2019-05-01 明安國際企業股份有限公司 基板承置匣
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
WO2021133553A1 (en) * 2019-12-24 2021-07-01 Entegris, Inc. Reticle pod having retention through baseplate
US11703754B2 (en) 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod
TWI779505B (zh) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 光罩盒及防止光罩污染之方法
US11874596B2 (en) * 2020-09-30 2024-01-16 Gudeng Precision Industrial Co., Ltd Workpiece container system
JP7313498B1 (ja) 2022-02-18 2023-07-24 株式会社協同 フォトマスク収納ケース、及び、フォトマスク収納ケース用のフォトマスク用クッション部材

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188446A (ja) 1989-09-05 1991-08-16 Konica Corp カセット供給装置
KR100383260B1 (ko) 2001-03-08 2003-05-09 삼성전자주식회사 레티클 위치감지장치기능을 갖는 포크 암을 구비한 레이클이송장치
JP2005032886A (ja) * 2003-07-10 2005-02-03 Nikon Corp マスクフレーム、露光方法及び露光装置
JP4581681B2 (ja) * 2004-12-27 2010-11-17 株式会社ニコン レチクル保護装置および露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760062B (zh) * 2020-05-14 2022-04-01 家登精密工業股份有限公司 提供有保持銷組件之光罩盒及固持光罩的方法
TWI853622B (zh) * 2023-06-28 2024-08-21 日商協同股份有限公司 光罩收納盒

Also Published As

Publication number Publication date
CN101152919B (zh) 2013-07-31
JP4855885B2 (ja) 2012-01-18
JP2008087811A (ja) 2008-04-17
KR20080029876A (ko) 2008-04-03
KR101094502B1 (ko) 2011-12-19
TW200821235A (en) 2008-05-16
CN101152919A (zh) 2008-04-02

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