JP4855885B2 - マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法 - Google Patents
マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法 Download PDFInfo
- Publication number
- JP4855885B2 JP4855885B2 JP2006269609A JP2006269609A JP4855885B2 JP 4855885 B2 JP4855885 B2 JP 4855885B2 JP 2006269609 A JP2006269609 A JP 2006269609A JP 2006269609 A JP2006269609 A JP 2006269609A JP 4855885 B2 JP4855885 B2 JP 4855885B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- cassette
- case
- photomask
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 32
- 238000007667 floating Methods 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000032258 transport Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006269609A JP4855885B2 (ja) | 2006-09-29 | 2006-09-29 | マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法 |
| TW096134036A TW200821235A (en) | 2006-09-29 | 2007-09-12 | Mask case, mask cassette, pattern transfer method, manufacturing method for display apparatus and installation method of phto-mask |
| CN2007101630075A CN101152919B (zh) | 2006-09-29 | 2007-09-28 | 掩膜壳体、掩膜盒、图案转录方法及显示装置的制造方法 |
| KR1020070097765A KR101094502B1 (ko) | 2006-09-29 | 2007-09-28 | 마스크 케이스, 마스크 카세트, 패턴 전사 방법, 표시장치의 제조 방법 및 포토마스크의 설치 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006269609A JP4855885B2 (ja) | 2006-09-29 | 2006-09-29 | マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008087811A JP2008087811A (ja) | 2008-04-17 |
| JP4855885B2 true JP4855885B2 (ja) | 2012-01-18 |
Family
ID=39254845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006269609A Expired - Fee Related JP4855885B2 (ja) | 2006-09-29 | 2006-09-29 | マスクケース、マスクカセット、パターン転写方法及び表示装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4855885B2 (enExample) |
| KR (1) | KR101094502B1 (enExample) |
| CN (1) | CN101152919B (enExample) |
| TW (1) | TW200821235A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5052106B2 (ja) * | 2006-11-22 | 2012-10-17 | 旭化成イーマテリアルズ株式会社 | ペリクルの収納方法 |
| KR101121176B1 (ko) * | 2008-04-23 | 2012-03-23 | 피엠씨글로벌 주식회사 | 포토마스크 케이스의 구조 |
| JP5149207B2 (ja) * | 2009-01-13 | 2013-02-20 | 株式会社荏原製作所 | 基板搭載装置 |
| KR101067818B1 (ko) * | 2009-08-14 | 2011-09-27 | (주)아이콘 | 반도체 장비용 트레이 클램프 장치 |
| JP2011203309A (ja) * | 2010-03-24 | 2011-10-13 | Shin-Etsu Chemical Co Ltd | ペリクルの収納容器およびペリクル収納容器の搬送用台車 |
| JP5586559B2 (ja) * | 2011-10-28 | 2014-09-10 | 信越化学工業株式会社 | ペリクル収容容器 |
| TWI622538B (zh) * | 2012-05-11 | 2018-05-01 | Nikon Corp | Substrate box, substrate transfer box, case cover, substrate transfer system, and substrate transfer method |
| JP2014218328A (ja) * | 2013-05-08 | 2014-11-20 | 新東エスプレシジョン株式会社 | メタルマスクシート供給システム |
| JP6418421B2 (ja) * | 2015-01-26 | 2018-11-07 | 株式会社ニコン | マスクケース、保管装置、搬送装置、露光装置、及びデバイス製造方法 |
| TWI658532B (zh) * | 2017-08-09 | 2019-05-01 | 明安國際企業股份有限公司 | 基板承置匣 |
| US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
| EP4579721A3 (en) * | 2019-12-24 | 2025-12-10 | Entegris, Inc. | Reticle pod having retention through baseplate |
| TWI760062B (zh) * | 2020-05-14 | 2022-04-01 | 家登精密工業股份有限公司 | 提供有保持銷組件之光罩盒及固持光罩的方法 |
| US11703754B2 (en) | 2020-05-14 | 2023-07-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Particle prevention method in reticle pod |
| TWI779505B (zh) * | 2020-05-14 | 2022-10-01 | 台灣積體電路製造股份有限公司 | 光罩盒及防止光罩污染之方法 |
| US11874596B2 (en) * | 2020-09-30 | 2024-01-16 | Gudeng Precision Industrial Co., Ltd | Workpiece container system |
| JP7313498B1 (ja) | 2022-02-18 | 2023-07-24 | 株式会社協同 | フォトマスク収納ケース、及び、フォトマスク収納ケース用のフォトマスク用クッション部材 |
| TWI853622B (zh) * | 2023-06-28 | 2024-08-21 | 日商協同股份有限公司 | 光罩收納盒 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03188446A (ja) | 1989-09-05 | 1991-08-16 | Konica Corp | カセット供給装置 |
| KR100383260B1 (ko) | 2001-03-08 | 2003-05-09 | 삼성전자주식회사 | 레티클 위치감지장치기능을 갖는 포크 암을 구비한 레이클이송장치 |
| JP2005032886A (ja) * | 2003-07-10 | 2005-02-03 | Nikon Corp | マスクフレーム、露光方法及び露光装置 |
| JP4581681B2 (ja) * | 2004-12-27 | 2010-11-17 | 株式会社ニコン | レチクル保護装置および露光装置 |
-
2006
- 2006-09-29 JP JP2006269609A patent/JP4855885B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-12 TW TW096134036A patent/TW200821235A/zh unknown
- 2007-09-28 CN CN2007101630075A patent/CN101152919B/zh not_active Expired - Fee Related
- 2007-09-28 KR KR1020070097765A patent/KR101094502B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080029876A (ko) | 2008-04-03 |
| KR101094502B1 (ko) | 2011-12-19 |
| TWI356797B (enExample) | 2012-01-21 |
| CN101152919B (zh) | 2013-07-31 |
| CN101152919A (zh) | 2008-04-02 |
| JP2008087811A (ja) | 2008-04-17 |
| TW200821235A (en) | 2008-05-16 |
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