WO2019138946A1 - 導電材料および処理方法 - Google Patents

導電材料および処理方法 Download PDF

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Publication number
WO2019138946A1
WO2019138946A1 PCT/JP2018/048550 JP2018048550W WO2019138946A1 WO 2019138946 A1 WO2019138946 A1 WO 2019138946A1 JP 2018048550 W JP2018048550 W JP 2018048550W WO 2019138946 A1 WO2019138946 A1 WO 2019138946A1
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WIPO (PCT)
Prior art keywords
conductive material
acid
layer
metal
copper
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PCT/JP2018/048550
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English (en)
French (fr)
Japanese (ja)
Inventor
寛彦 後閑
直哉 西村
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三菱製紙株式会社
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Priority claimed from JP2018002751A external-priority patent/JP2019121580A/ja
Priority claimed from JP2018108717A external-priority patent/JP2019212524A/ja
Application filed by 三菱製紙株式会社 filed Critical 三菱製紙株式会社
Priority to CN201880079681.1A priority Critical patent/CN111448621B/zh
Priority to US16/770,975 priority patent/US20210165511A1/en
Priority to KR1020207023153A priority patent/KR20200108042A/ko
Publication of WO2019138946A1 publication Critical patent/WO2019138946A1/ja

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes

Definitions

  • the present invention relates to a conductive material with improved resistance variation and a method of processing the same.
  • touch panel sensors are widely used as input means for these displays.
  • Touch panel sensors include an optical method, an ultrasonic method, a resistive film method, a surface capacitance method, a projected capacitance method, etc. depending on the position detection method, and in the display application described above, the resistive film method and the projection type
  • the capacitance method is preferably used.
  • the resistive film type touch panel sensor has a structure in which two conductive materials having a light transmitting conductive layer on a support are used, and these conductive materials are disposed opposite to each other via a dot spacer.
  • the light transmitting conductive layers are brought into contact with each other by applying a force to a point, and the voltage applied to the light transmitting conductive layer is measured through the other light transmitting conductive layer to detect the position to which the force is applied. To do.
  • a projected capacitive touch panel uses one conductive material having two light transmission conductive layers or two conductive materials having one light transmission conductive layer, a finger or the like Changes in capacitance between the light-transmissive conductive layers when the light source is brought close to each other, and detection of the position where the finger approaches is detected.
  • the latter is particularly widely used in smartphones, tablet PCs, and the like, because it is excellent in durability because it has no movable part and can simultaneously detect multiple points.
  • the light transmitting conductive layer is generally formed of a conductive film containing a transparent conductive oxide such as ITO (indium-tin oxide).
  • a transparent conductive oxide such as ITO (indium-tin oxide).
  • Patent Document 1 discloses a touch panel sensor member using a transparent conductor such as ITO, IZO (indium-zinc oxide), ZnO (zinc oxide) or the like as a material of the light transmitting conductive layer.
  • Patent Document 2 forms a reticulated metallic silver fine line pattern by printing an ink containing silver fine particles, or a method of printing a resin paint containing an electroless plating catalyst and then performing electroless plating. It is described that it can be formed by various methods such as a subtractive method in which a photoresist layer is provided on a metal layer, a resist pattern is formed, and then the metal layer is etched away and a method using a silver salt photosensitive material.
  • a conductive material laminate having a pressure-sensitive adhesive layer on a light-transmitting conductive layer having a mesh-like metallic silver fine line pattern and a functional material on the pressure-sensitive adhesive layer is also known. It is disclosed that malfunction in a wide temperature environment can be suppressed by a pressure-sensitive adhesive layer having a low temperature dependence of relative dielectric constant on a touch panel sensor and a laminate for a touch panel having a protective substrate on the pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer is generally used to closely contact members such as a display device and a touch panel sensor.
  • the conductive material laminate as described above is used in various places, for example, in places where sunlight is irradiated.
  • a pressure-sensitive adhesive layer is provided on a light-transmitting conductive layer having a mesh-like metallic silver fine line pattern to form a conductive material laminate
  • the resistance value of the light-transmitting conductive layer fluctuates when it is irradiated with sunlight. There was a problem and there was a need for improvement.
  • Patent Document 4 As a method of improving the resistance value fluctuation of the light transmitting conductive layer accompanying the irradiation of sunlight, in Patent Document 4, the undercoat layer of the light transmitting conductive layer contains a compound having an amino group, and the pressure-sensitive adhesive layer A conductive material laminate containing a cationically polymerizable photocurable resin is disclosed.
  • Patent Document 5 discloses that the undercoat layer of the light transmitting conductive layer contains a compound having an amino group, and the pressure-sensitive adhesive layer is an acylphosphine compound.
  • a conductive material laminate containing a resin polymerized using or a trihaloalkyl compound Disclosed is a conductive material laminate containing a resin polymerized using or a trihaloalkyl compound.
  • Patent Document 6 an interlayer filler material for a touch panel containing an acrylic pressure-sensitive adhesive obtained by polymerizing an acrylic monomer or the like having a molecular skeleton having ultraviolet absorbing ability or light stabilizing ability is stuck on the light transmitting layer conductive layer.
  • Patent Document 7 discloses a film (conductive material laminate) having a metal fiber and a resin layer containing a metal additive such as metal particles and metal oxide particles.
  • Patent Document 9 uses transition metal salts or coordination complexes such as Fe (II), Fe (III), Co (II), Co (III) and Mn (II) as optical stabilizers. Is described. However, further improvement is desired with respect to the resistance value variation of the light transmitting conductive layer accompanying the irradiation of sunlight.
  • electroless plating may be mentioned as a method of precipitating a metal element on a support, but in the case of copper strike plating which is thin copper plating as an example, as shown in Patent Document 10,
  • the lower limit is 0.01 ⁇ m or more, and generally about 90 mg / m 2 or more in weight conversion.
  • the minimum of the coated amount of metal microparticles is 50 mg / m. It is generally 2 or more.
  • Conductive material characterized by (2) A treatment method for obtaining the conductive material according to the above (1), wherein the surface of the conductive material having a mesh-like metal silver fine line pattern on the support side has a mesh-like metal silver fine line pattern of the conductive material
  • a treatment method comprising treatment with a treatment solution containing a metal salt of copper.
  • the treatment method according to (2) above, wherein the treatment liquid containing a metal salt of copper further contains a hydroxy acid.
  • the present invention it is possible to provide a conductive material in which the resistance value variation associated with the irradiation of sunlight is improved, and a processing method for obtaining the conductive material. Moreover, in addition to the improvement of resistance value fluctuation
  • the conductive material of the present invention is a conductive material having a reticulated metallic silver fine wire pattern on a support, and the copper material is further added to the surface of the conductive material having the reticulated metallic silver fine wire pattern at 1 mg / m 2. It is characterized by having the above.
  • the copper element in the present invention is present in the form of ions, salts or colloids on the support surface on the side having the reticulated metallic silver fine wire pattern and the fine wire surface of the reticulated metallic silver fine wire pattern, and the reticulated metallic silver fine wire pattern
  • the amount of copper element on the side having the is 1 mg / m 2 or more.
  • the amount of copper element is 1 mg / m 2 or more, the effect obtained is not increased and it is uneconomical, and the coloring of the support is not good because the optical characteristics (haze, total light transmittance etc.) are also reduced. It is preferable that it is 15 mg / m ⁇ 2 > or less, and 10 mg / m ⁇ 2 > or less is more preferable.
  • the above-described conductive material can be produced by treating a conductive material having a mesh-like metallic silver fine line pattern on a support using the following treatment liquid.
  • the metal salt of copper contained in the treatment solution containing a metal salt of copper includes water-soluble inorganic copper salts such as copper sulfate, nitrate, and chloride, water-soluble salts such as copper formate, and acetate.
  • An organic copper salt etc. can be illustrated.
  • these metal salts of copper can be used individually by 1 type or in mixture of 2 or more types.
  • the content of the metal salt of copper contained in the above-mentioned treatment liquid can be effectively 0.0001 / mol or more that the resistance value fluctuation of the light transmitting conductive layer of the conductive material accompanied by the irradiation of sunlight can be effectively suppressed. Therefore, it is preferably 0.0003 mol / L or more, more preferably.
  • the content of the metal salt of copper contained in the treatment liquid is 0.4 mol / L or less from the viewpoint that the effect to be obtained is not increased and it is uneconomical and it takes time to dissolve the metal salt of copper. It is preferably 0.1 mol / L or less.
  • the pH of the treatment liquid containing a metal salt of copper is not particularly limited, but it is 2 to 9 from the viewpoint of effectively suppressing the resistance value fluctuation of the light transmitting conductive layer of the conductive material accompanying the irradiation of sunlight.
  • the treatment liquid containing a metal salt of copper may contain a pH adjuster such as hydrochloric acid, sulfuric acid, acetic acid, sodium hydroxide, potassium hydroxide, phosphate, carbonate or ammonium salt for pH adjustment.
  • the processing solution containing the copper element in the present invention contains known additives such as surfactant, antifoaming agent, foam inhibitor, thickener, preservative, etc., as necessary, in addition to the pH adjuster. May be
  • the processing solution containing a metal salt of copper contains a complexing agent or a brightener, the fluctuation of the resistance value of the light transmitting conductive layer of the conductive material caused by the irradiation of sunlight can not be effectively suppressed. Not desirable.
  • the above complexing agent is a component effective for preventing the precipitation of metal salts in a general electroless plating solution and further suppressing the decomposition of the plating bath by setting the deposition reaction of the plating metal at an appropriate speed.
  • These are various complexing agents used in known electroless plating solutions.
  • complexing agents include oxycarboxylic acids such as tartaric acid and malic acid, and soluble salts thereof; amino compounds such as ethylenediamine and triethanolamine; ethylenediaminetetraacetic acid (EDTA), versenol (N-hydroxyethyl ethylenediamine) Ethylenediamine derivatives such as -N, N ', N'-triacetic acid), quadrole (N, N, N', N'-tetrahydroxyethylethylenediamine), soluble salts thereof; 1-hydroxyethane-1,1-diphosphone Examples thereof include acids, phosphonic acids such as ethylenediaminetetra (methylene phosphonic acid), and soluble salts thereof.
  • oxycarboxylic acids such as tartaric acid and malic acid, and soluble salts thereof
  • amino compounds such as ethylenediamine and triethanolamine
  • EDTA ethylenediaminetetraacetic acid
  • versenol N-hydroxyethyl
  • the above-mentioned brighteners are effective components for obtaining the gloss of the plating surface in a general electrolytic plating solution, and are various brighteners used in known electrolytic plating solutions.
  • organic thio compounds, oxygen-containing high molecular weight organic compounds and the like are known, and as organic thio compounds, 3-mercaptopropanesulfonic acid and its sodium salt, bis (3-sulfo) Examples include propyl) disulfide and its disodium salt, N, N-dimethyldithiocarbamic acid (3-sulfopropyl) ester, and its sodium salt.
  • an oxyalkylene polymer polyethylene glycol, polypropylene glycol, a copolymer of ethylene oxide and propylene oxide, and the like are exemplified.
  • the treatment liquid containing a metal salt of copper further contains a hydroxy acid. While being able to improve the resistance value fluctuation
  • the hydroxy acids contained in the treatment solution containing a metal salt of copper include glycolic acid, lactic acid, thalthronic acid, glyceric acid, leucine acid, malic acid, tartaric acid, gluconic acid, citric acid, isocitric acid, mevalonic acid, pantoic acid , Ricinoleic acid, quinic acid, salicylic acid, creosote acid (homosalicylic acid, hydroxy (methyl) benzoic acid), vanillic acid, silicic acid, hydroxypentanoic acid, hydroxyhexanoic acid, hydroxyheptanoic acid, hydroxyoctanoic acid, hydroxynonanoic acid, Hydroxydecanoic acid, Hydroxyundecanoic acid, Hydroxydodecanoic acid, Hydroxytridecanoic acid, Hydroxytetradecanoic acid, Hydroxypentadecanoic acid, Hydroxyheptadecanoic acid, Hydroxyheptadecanoic
  • hydroxy acids aliphatic hydroxy acids and salts thereof are preferable because they can further suppress the decrease in reliability of the conductive material due to ion migration between the reticulated metal silver fine line patterns, and citric acid and tartaric acid are preferable. Are more preferred, and citric acid and its salts are particularly preferred. Moreover, these hydroxy acids can be used individually by 1 type or in mixture of 2 or more types.
  • the content of the hydroxy acid contained in the treatment liquid containing the metal salt of copper described above is 0.0002 mol / L or more and the reliability of the conductive material is lowered by the ion migration between the reticulated metal silver fine wire patterns And preferably 0.002 mol / L or more.
  • the content of the hydroxy acid contained in the treatment liquid containing the metal salt of copper is 0.4 mol /, from the viewpoint that the effect to be obtained is not increased and it is uneconomical and the dissolution of the hydroxy acid takes time. It is preferable that it is L or less, and 0.1 mol / L or less is more preferable.
  • the method for treating a conductive material having a reticulated metallic silver fine wire pattern on a support using a treatment liquid containing a metal salt of copper is not particularly limited, and a conductive material having a reticulated metallic silver fine wire pattern on a support
  • a processing solution containing a metal salt of copper may be brought into contact with the surface on the side having the reticulated metallic silver fine line pattern of Specifically, a method of immersing the conductive material in a treatment solution containing a metal salt of copper, bar coating method, spin coating method, die coating method, blade coating method, gravure coating method, curtain coating method, spray coating method, Method of applying a treatment liquid containing a metal salt of copper to the surface of the conductive material having a reticulated metallic silver fine line pattern on a support side by a known application method such as a kiss coat method, gravure
  • the contact time with the treating solution containing the metal salt of copper is 1 Seconds or more are preferable because fluctuation of the resistance value of the light transmitting conductive layer can be effectively suppressed, more preferably 3 seconds or more, and particularly preferably 5 seconds or more.
  • the upper limit of the time for which the surface having the reticulated metal silver fine line pattern and the treatment liquid containing a metal salt of copper are in contact with each other is preferably 10 minutes or less.
  • the temperature of the treatment liquid at the time of bringing the treatment liquid containing the metal salt of copper into contact with the surface on the side having the reticulated metallic silver fine line pattern is not particularly limited, but that the temperature is 10 ° C. or higher Preferably, the temperature is 30 ° C. or higher because the resistance value fluctuation can be effectively suppressed.
  • the upper limit is preferably 70 ° C. or less.
  • the conductive material having the reticulated metallic silver fine wire pattern on the support is treated with the treatment solution containing the metal salt of copper by the method described above, removing the treatment solution containing the excess metal salt of copper
  • the washing may be carried out with washing water consisting only of water, washing water containing pH adjuster such as phosphate, carbonate etc., washing water containing preservative for the purpose of preventing decay. You may go.
  • the washing method is not particularly limited, a method of jetting a washing water shower using a scrubbing roller or the like, and a method of jetting washing water by a nozzle or the like can be exemplified.
  • a plurality of showers or nozzles can be provided to increase the removal efficiency.
  • the conductive material may be immersed in the flush water. After washing with water, the water remaining in the conductive material is preferably dried by heating or natural drying.
  • the support of the conductive material of the present invention is not particularly limited, but when the conductive material is used for applications requiring light transmission such as a touch panel sensor, since the conductive material is required to have transparency, the support is transparent to light It is particularly preferred to have the property.
  • the light transmitting support includes polyolefin resins such as polyethylene and polypropylene, vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymer, epoxy resin, polyarylate, polysulfone, polyether sulfone, polyimide, Various resin films such as fluorine resin, phenoxy resin, triacetyl cellulose, polyethylene terephthalate, polyimide, polyphenylene sulfide, polyethylene naphthalate, polycarbonate, acrylic resin, cellophane, nylon, polystyrene resin, ABS resin, quartz glass, alkali-free glass Glass etc. can be illustrated.
  • polyolefin resins such as polyethylene and polypropylene
  • vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymer
  • epoxy resin polyarylate
  • polysulfone polyether sulfone
  • polyimide polyimide
  • Various resin films such as fluorine resin, phenoxy resin, tri
  • the total light transmittance of the support is preferably 60% or more, particularly preferably 70% or more, and the haze of the support is preferably 0 to 3% because the transparency of the conductive material is excellent, in particular Preferably the haze of the support is 0-2%.
  • the support has an easily adhesive layer, a hard coat layer, an antireflective layer, an antiglare layer, and an ITO on the surface having the light transmitting conductive layer and the surface opposite to the surface having the light transmitting conductive layer. And a known layer such as a layer containing a nonmetallic conductive material such as polythiophene.
  • the metal composition of the metallic silver fine wire constituting the reticulated metallic silver fine wire pattern is such that the mass ratio of silver to the total metal amount is preferably 50% by mass or more, more preferably 80% by mass or more, 90 Mass% or more is particularly preferable. Moreover, it is preferable that the mass ratio of the binder component which comprises a metal silver fine wire is less than 20 mass%, More preferably, it is less than 10 mass%.
  • the method of forming the reticulated metal silver fine wire pattern on the support is not particularly limited.
  • a conductive metal ink and a conductive paste containing a metal and a binder are used.
  • a silver halide emulsion layer was provided on the support according to the method of forming a reticulated metallic silver fine line pattern by applying a method such as printing on the support or the method disclosed in JP-A-2007-59270.
  • a silver halide photosensitive material provided with a silver halide emulsion layer on a support is used as a conductive material precursor, and a network metal silver fine line pattern is formed using a direct development method.
  • a direct development method According to the method disclosed in JP-A 2003-77350, JP-A 2005-250169, JP-A 2007-188655, JP-A 2004-207001, etc., physical development nuclei are formed on a support.
  • a silver halide photosensitive material having at least a silver halide emulsion layer in this order as a conductive material precursor, and using a so-called silver salt diffusion transfer method in which a soluble silver salt forming agent and a reducing agent
  • a photosensitive resist material in which an underlayer and a photosensitive resist layer are laminated on a support according to the method disclosed in JP-A-2014-197531 is used as a conductive material precursor
  • After exposing the photosensitive resist layer to an arbitrary pattern it is developed to form a resist image, and then electroless plating is performed to form a resist image.
  • JP-A-2015-82178 a method of localizing a metal on an uncoated underlayer and thereafter removing a resist image to form a reticulated metallic silver fine line pattern, Forming a metal film and a resist film on the substrate, exposing and developing the resist film to form an opening, and etching and removing the metal film at the opening to form a reticulated metal silver fine wire pattern;
  • a layer containing metal nanowires may be formed on a support, and the layer may be patterned to form a network metal silver fine wire pattern.
  • the method of using a silver salt photosensitive material as a conductive material precursor and the method of using a photosensitive resist material as a conductive material precursor are reticulated metal silver fine wire patterns containing silver excellent in conductivity. It is preferable because it can be easily formed, and a method using a silver salt diffusion transfer method using a silver salt photosensitive material as a conductive material precursor is particularly preferable, because it is easy to miniaturize metal silver fine lines.
  • the light transmitting conductive layer may be subjected to known metal surface treatment before and after treatment with a treatment solution containing a metal salt of copper.
  • a treatment solution containing a metal salt of copper for example, a reducing substance as described in JP-A-2008-34366, a water-soluble phosphorus oxo acid compound, or a water-soluble halogen compound may be allowed to act, as described in JP-A-2013-196779.
  • a triazine having two or more mercapto groups in the molecule or a derivative thereof may be allowed to act, and a blackening treatment by a sulfurization reaction may be performed as described in JP-A-2011-209626.
  • the light transmitting conductive layer may be treated with a treatment solution containing an enzyme such as a proteolytic enzyme to reduce the remaining gelatin and the like.
  • the conductive material of the present invention is used for a touch panel sensor, it is preferable to form a light transmitting conductive layer with a reticulated metal silver fine wire pattern, and the reticulated metal silver fine wire pattern arranges a plurality of unit lattices in a reticulated shape It is preferable from the viewpoint of the sensitivity of the sensor, visibility (low visibility), etc. to have the above-mentioned geometrical shape.
  • the shape of the unit cell may, for example, be a triangle such as an equilateral triangle, an isosceles triangle or a right triangle, a square, a rectangle, a rhombus, a parallelogram, a quadrangle such as a trapezoid, a hexagon, an octagon, a dodecagon, a dodecagon etc.
  • the shape which combined the n-gon, the star shape, etc. of S is mentioned, Moreover, the single repetition of these shapes, or the combination of two or more types of several shapes is mentioned. Above all, the shape of the unit cell is preferably square or rhombus.
  • irregular geometric shapes represented by Voronoi figures, Delaunay figures, Penrose tile figures and the like are also preferred shapes of the reticulated metallic silver fine line pattern.
  • the light transmitting conductive layer When the conductive material of the present invention is used for a touch panel sensor, it is preferable that the light transmitting conductive layer have a sensor section having a plurality of sensors formed by a mesh-like metallic silver fine line pattern. Further, from the viewpoint of making the sensor portion inconspicuous (invisibility), the light transmitting conductive layer may have a dummy portion electrically insulated from the sensor. In addition to the sensor portion and the dummy portion, the light transmissive conductive layer may have a terminal portion provided for extracting an electric signal to the outside, and a peripheral wiring portion electrically connecting the sensor portion and the terminal portion. Good. The terminal portion and the peripheral wiring portion may be made of a mesh-like metal silver fine line pattern, or may be a fill pattern.
  • the line width of the metal silver fine wire constituting the mesh-like metal silver fine wire pattern is preferably 1.0 to 20 ⁇ m, more preferably 1.5 to 20 ⁇ m from the viewpoint of achieving both light transmittance and conductivity. It is 15 ⁇ m.
  • the repeating period of the unit cells is preferably 100 to 1000 ⁇ m, more preferably 100 to 400 ⁇ m.
  • a functional material can be provided on the side having the reticulated metallic silver fine line pattern of the conductive material of the present invention or the other side via an adhesive layer to form a conductive material laminate.
  • the pressure-sensitive adhesive layer means a layer containing a known pressure-sensitive adhesive such as a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, or a urethane-based pressure-sensitive adhesive.
  • the thickness of the pressure-sensitive adhesive layer is preferably 5 to 500 ⁇ m because the transparency of the conductive material laminate is excellent, and more preferably 10 to 250 ⁇ m.
  • the total light transmittance of the pressure-sensitive adhesive layer is preferably 90% or more, particularly preferably 95% or more, and the haze of the pressure-sensitive adhesive layer is preferably 0 to 3%, particularly preferably 0 to 2%.
  • Adhesive tapes for optical use and curable resins having high transparency are both commercially available, and as the adhesive tape for the former optical use, high transparency adhesive transfer tape (8171CL / 8172CL / 8146-1 / 8146) from Sumitomo 3M Ltd.
  • transparent adhesive sheet for optics (LUCIACS (registered trademark) CS 9622 T / CS 9862 UA etc.) etc. are commercially available from Nitto Denko Co., Ltd., and Dexerials Co., Ltd. as the cured product of the latter. More photoelastic resin SVR (registered trademark) series (SVR 1150, SVR 1320, etc.), KYORITE CHEMICAL INDUSTRIES LTD.
  • the conductive material of the present invention a glass such as chemically strengthened glass, soda glass, quartz glass, non-alkali glass, a film containing various resins such as polyethylene terephthalate, and at least one of the above-described glass and films
  • a glass such as chemically strengthened glass, soda glass, quartz glass, non-alkali glass
  • a film containing various resins such as polyethylene terephthalate
  • at least one of the above-described glass and films examples thereof include materials having known functional layers such as a hard coat layer, an antireflective layer, an antiglare layer, a polarizing layer, and an ITO conductive film on the surface.
  • a physical development nucleus layer coating solution having the following composition was uniformly coated by gravure coating on a support and dried to form a physical development nucleus layer.
  • an intermediate layer of the following composition, a silver halide emulsion layer, and a protective layer are applied in the order from the side closer to the support by slide coating uniformly on the physical development nucleus layer and dried to obtain the conductive material precursor. Obtained.
  • the silver halide emulsion contained in the silver halide emulsion layer was produced by a controlled double jet method.
  • the silver halide grains contained in this silver halide emulsion were prepared so as to have an average particle size of 0.15 ⁇ m with 95 mol% of silver chloride and 5 mol% of silver bromide.
  • the silver halide grains thus obtained were subjected to gold-sulfur sensitization using sodium thiosulfate and chloroauric acid according to a conventional method.
  • the silver halide emulsion thus obtained contains 0.5 g of gelatin per 1 g of silver as a protective colloid (binder).
  • the conductive material precursor was brought into close contact with the positive-type transparent original shown in FIG. 1 and exposed through a resin filter that cuts light of 400 nm or less with a contact printer using a mercury lamp as a light source.
  • the positive-type transparent original has test patterns 13 (five lines 13a to 13e) composed of a mesh pattern 11 and fill patterns 12 and 12 '. Filled patterns 12 and 12 'constituting test pattern 13 are connected via a mesh pattern 11 having a line width of 5.0 ⁇ m, a side length of 300 ⁇ m, and a narrow angle of 60 °. There is.
  • the broken line represents the bonding area
  • the conductive material 1 was obtained.
  • the shape, line width, and the like of the pattern of the obtained conductive material 1 were the same as those of the above-described positive-type transparent original.
  • the conductive material 1 obtained as described above is immersed in ion-exchange water in the metal salt-containing treatment solutions 1 to 8 shown in Table 1 at 40 ° C. for 1 minute and then contains excess metal salt by showering with water.
  • the treatment liquid was removed and dried to obtain conductive materials 2 to 9.
  • the pH of the treatment solution containing each metal salt was adjusted to 5.0 with ammonium chloride.
  • the amounts of metal elements of the conductive materials 2 to 9 measured by fluorescent X-ray analysis are described in Table 2. The measurement was carried out at two places of the reticulated pattern part and the non-image part where the pattern does not exist, but no significant difference was observed between them.
  • a conductive material 2 ′ was obtained in the same manner as in the preparation of the conductive material 2 except that copper acetate monohydrate was used in place of the copper sulfate pentahydrate contained in the metal salt-containing treatment liquid 1.
  • the conductive material 2 ′ was subjected to the resistance value evaluation in the same manner as the above-described conductive materials 1 to 15, the same result as the conductive material 2 was obtained.
  • the conductive material precursor mentioned above is brought into close contact with a positive-type transparent original having a mesh-like fine line pattern, a peripheral wiring pattern and a terminal pattern, and exposed through a resin filter that cuts light of 400 nm or less with a contact printer using a mercury lamp as a light source. did. Then, after immersing in the diffusion transfer developer described above at 20 ° C. for 60 seconds, the silver halide emulsion layer, the intermediate layer, and the protective layer were washed with warm water at 40 ° C. and dried. Thus, a conductive material A shown in FIG. 2 was obtained.
  • the conductive material A In the conductive material A, all of the sensor portions 31 (eight central parts in the figure), peripheral wirings 32 (eight left and eight right sides in the figure), and terminals 33 (eight left and eight right sides in the figure) It corresponds to a conductive metal silver fine line pattern.
  • the sensor unit 31 In the conductive material A, the sensor unit 31 is formed of a mesh-like metallic silver fine line pattern having a line width of 4.5 ⁇ m, a side length of 300 ⁇ m, and a narrow angle of 60 °.
  • the wirings 32 and the terminals 33 are all solid patterns (filled patterns).
  • the line widths of the peripheral wires 32 are all 20 ⁇ m, and the shortest distance between adjacent peripheral wires is 20 ⁇ m.
  • ⁇ Ion migration evaluation> One stack of laminates 16 to 23 was placed in an environment of 85 ° C. and 85% relative humidity. Under this environment, a migration tester (MIG-8600B manufactured by IMV) is used, and the odd terminals (33-1, 33-3, etc.) and the even terminals (33-2, 33-4, etc.) of each laminate are used. A voltage of 1 V was applied for 24 hours. Use the software provided with the migration tester to record the occurrence of shorts between the odd terminals and the even terminals during voltage application, and automatically stop the voltage application to the corresponding conductive material stack if a short circuit occurs 10 times in total. The After the voltage application was completed, the appearance of the peripheral wiring coated with the pressure-sensitive adhesive layer was observed using a confocal microscope. The ion migration evaluation was performed based on the following criteria.
  • the resistance value change rate (unit:%) before and after irradiation with the xenon lamp light is calculated in the same manner as the previous resistance value evaluation, and the resistance value change rates of the test patterns 13a to 13e are averaged to obtain the conductive material 16 '.
  • the average resistance value change rate (unit:%) of to 23 ' was calculated, none of them exceeded 2.0%.
  • the treatment liquid containing a metal salt of copper further contains a hydroxy acid, whereby ion migration can be further suppressed in addition to suppression of resistance value fluctuation accompanying solar light irradiation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
PCT/JP2018/048550 2018-01-11 2018-12-28 導電材料および処理方法 WO2019138946A1 (ja)

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US16/770,975 US20210165511A1 (en) 2018-01-11 2018-12-28 Conductive material and treatment method
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218096A (ja) * 2007-03-01 2008-09-18 Mitsubishi Paper Mills Ltd 導電性材料前駆体および導電性材料
JP2008290354A (ja) * 2007-05-25 2008-12-04 Panasonic Corp 導電シート及びその製造方法
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
JP2010251734A (ja) * 2009-03-25 2010-11-04 Fujifilm Corp 透光性電磁波シールドフィルタ及びその製造方法、並びに導電膜
JP2011054382A (ja) * 2009-09-01 2011-03-17 Tohoku Univ 導電性膜の製造方法、及び、導電性膜
WO2013157420A1 (ja) * 2012-04-18 2013-10-24 コニカミノルタ株式会社 透光性導電パターン部材及びこれを用いた透光性電磁遮蔽・アンテナ部材
JP2017076206A (ja) * 2015-10-14 2017-04-20 三菱製紙株式会社 導電材料

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001256834A (ja) 2000-03-10 2001-09-21 Fuji Photo Film Co Ltd 低反射透明導電性フイルム
US20110081527A1 (en) * 2008-06-10 2011-04-07 Yo Yamato Layered product having porous layer and functional layered product made with the same
KR101203965B1 (ko) * 2009-11-25 2012-11-26 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP5885993B2 (ja) * 2011-10-17 2016-03-16 関東化學株式会社 エッチング液組成物およびエッチング方法
US9920207B2 (en) * 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
CN103031044B (zh) * 2013-01-07 2015-07-08 张跃进 一种减缓或阻止导电银离子迁移的保护涂料、制备方法及其应用
JP5689931B2 (ja) 2013-03-13 2015-03-25 富士フイルム株式会社 粘着シート、タッチパネル用積層体、静電容量式タッチパネル
JP2015032183A (ja) 2013-08-05 2015-02-16 大日本印刷株式会社 タッチパネルセンサ部材
KR101551879B1 (ko) 2013-11-19 2015-09-10 경운대학교 산학협력단 비교데이터 프루닝과 가우시안 혼합 모델의 유사도 추정을 이용한 유해 동영상 필터링 시스템 및 방법
JP2015133239A (ja) 2014-01-14 2015-07-23 三菱製紙株式会社 電極パターンシートの製造方法
KR20150106500A (ko) 2014-03-11 2015-09-22 주식회사 포스코건설 담수를 원수로 이용할 수 있는 해수 담수화 장치
JP2015187303A (ja) 2014-03-13 2015-10-29 オリエンタル鍍金株式会社 接続部品用導電部材及びその製造方法
SG10201906316UA (en) 2014-03-20 2019-08-27 Cambrios Film Solutions Corp Improved light stability of nanowire-based transparent conductors
JP6333086B2 (ja) 2014-06-26 2018-05-30 株式会社不二工機 三方電磁弁
JP2016021170A (ja) 2014-07-15 2016-02-04 日立化成株式会社 静電容量結合方式タッチパネル入力装置付き表示装置
JP2016210916A (ja) 2015-05-11 2016-12-15 積水化学工業株式会社 （メタ）アクリル系粘着剤及びタッチパネル用層間充填材料
JP6612668B2 (ja) * 2016-03-30 2019-11-27 三菱製紙株式会社 光透過性電極積層体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218096A (ja) * 2007-03-01 2008-09-18 Mitsubishi Paper Mills Ltd 導電性材料前駆体および導電性材料
JP2008290354A (ja) * 2007-05-25 2008-12-04 Panasonic Corp 導電シート及びその製造方法
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
JP2010251734A (ja) * 2009-03-25 2010-11-04 Fujifilm Corp 透光性電磁波シールドフィルタ及びその製造方法、並びに導電膜
JP2011054382A (ja) * 2009-09-01 2011-03-17 Tohoku Univ 導電性膜の製造方法、及び、導電性膜
WO2013157420A1 (ja) * 2012-04-18 2013-10-24 コニカミノルタ株式会社 透光性導電パターン部材及びこれを用いた透光性電磁遮蔽・アンテナ部材
JP2017076206A (ja) * 2015-10-14 2017-04-20 三菱製紙株式会社 導電材料

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TWI696552B (zh) 2020-06-21
US20210165511A1 (en) 2021-06-03

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