WO2019056224A1 - 电连接器、移动终端及电连接器的制作方法 - Google Patents

电连接器、移动终端及电连接器的制作方法 Download PDF

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Publication number
WO2019056224A1
WO2019056224A1 PCT/CN2017/102505 CN2017102505W WO2019056224A1 WO 2019056224 A1 WO2019056224 A1 WO 2019056224A1 CN 2017102505 W CN2017102505 W CN 2017102505W WO 2019056224 A1 WO2019056224 A1 WO 2019056224A1
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WO
WIPO (PCT)
Prior art keywords
plating layer
conductive terminal
tape
electrical connector
support member
Prior art date
Application number
PCT/CN2017/102505
Other languages
English (en)
French (fr)
Inventor
胡睢宁
苏天杰
张诗豪
雷高兵
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ES21214109T priority Critical patent/ES2967002T3/es
Priority to JP2020516603A priority patent/JP7007470B2/ja
Priority to KR1020207008281A priority patent/KR102314570B1/ko
Priority to EP21214109.7A priority patent/EP4060821B1/en
Priority to EP23197637.4A priority patent/EP4310225A3/en
Priority to US16/648,577 priority patent/US11128074B2/en
Priority to CN201910722120.5A priority patent/CN110492281A/zh
Priority to MYPI2019007665A priority patent/MY188816A/en
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PL17926015T priority patent/PL3664224T3/pl
Priority to EP17926015.3A priority patent/EP3664224B1/en
Priority to PCT/CN2017/102505 priority patent/WO2019056224A1/zh
Priority to CN201780013716.7A priority patent/CN108701926B/zh
Publication of WO2019056224A1 publication Critical patent/WO2019056224A1/zh
Priority to US17/382,050 priority patent/US11626702B2/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement

Definitions

  • the present application relates to the field of electrical connection devices, and in particular, to an electrical connector, a mobile terminal, and a method of fabricating the electrical connector.
  • the embodiments of the present application provide a method for manufacturing an electrical connector, a mobile terminal, and an electrical connector.
  • an embodiment of the present application provides an electrical connector.
  • the electrical connector includes a plurality of conductive terminals.
  • the plurality of conductive terminals include at least one first conductive terminal and at least one second conductive terminal.
  • the first conductive terminal and the second conductive terminal are made of a conductive material to achieve electrical connection.
  • the outer surface of the first conductive terminal is provided with a first plating layer.
  • the first plating layer has corrosion resistance for preventing corrosion of the first conductive terminal.
  • the outer surface of the second conductive terminal is provided with a second plating layer.
  • the second plating layer has corrosion resistance for preventing corrosion of the second conductive terminal.
  • the material of the second plating layer is different from the material of the first plating layer.
  • the corrosion resistance of the different plating layers of the material is different.
  • the material of the first plating layer of the electrical connector is different from the material of the second plating layer, such that the first conductive terminal and the second conductive terminal have corrosion resistance.
  • the conductive terminals of the electrical connector can be selectively plated to meet the requirements of different application environments by different electroplating, for example, plating a corrosion-resistant conductive terminal with a corrosion-resistant plating layer (for example, having an anti-corrosion) Electroplated layer of corrosive noble metal), electroplating layer which is more corrosion-resistant to conductive terminals which are less corrosive, so that all the conductive terminals of the electrical connector have good corrosion resistance and long corrosion resistance The electrical connector has a longer service life.
  • the electrical connector can minimize the amount of the corrosion-resistant plating material by selective plating, thereby reducing the electrical connector. Electroplating costs, so the electrical connector has both good corrosion resistance and low cost.
  • first plating layer described in the embodiment of the present application may be a single layer structure or a composite layer structure.
  • the second plating layer may be a single layer structure or a composite layer structure.
  • the embodiment of the present application is described by taking the first plating layer as a composite layer structure and the second plating layer as a composite layer structure as an example.
  • the first conductive terminal and the second conductive terminal may adopt a split type tape design,
  • the plating requirements of the first plating layer and the second plating layer are respectively plated, thereby greatly reducing the amount of high-cost plating materials (for example, precious metals with high corrosion resistance), thereby reducing the plating cost and preventing corrosion resistance.
  • the split type tape design means that all of the first conductive terminals are connected to the first tape, and all of the second conductive terminals are connected to the second tape, the first tape Carrying all of the first conductive terminals to perform immersion plating to form the first plating layer on the first conductive terminals, and the second tape carrying all of the second conductive terminals for immersion plating Forming a second plating layer on the second conductive terminal, and then assembling the first tape and the second tape to regularly arrange the first conductive terminal and the second conductive terminal.
  • the energization potential of the first conductive terminal is higher than the energization potential of the second conductive terminal.
  • the first conductive terminal can be a high potential pin (PIN), such as VBUS, CC, and SBU.
  • the second conductive terminal can be a low potential pin (PIN).
  • the corrosion resistance of the first plating layer is higher than the corrosion resistance of the second plating layer.
  • the corrosion resistance of the first plating layer is higher than that of the second plating layer because the first conductive terminal having a high energization potential is more susceptible to corrosion than the second conductive terminal having a lower energization potential. Corrosion resistance is capable of balancing the overall corrosion resistance of the electrical connector, which has a long corrosion resistance and a long service life.
  • the first plating layer has a noble metal such as platinum-based metal rhodium/iridium/palladium.
  • the first plating layer has a tantalum alloy material. Since the first plating layer is stacked with a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance, the first plating layer can greatly improve the electrolytic corrosion resistance of the first conductive terminal. Capacity and service life, especially resistance to electrolytic corrosion in humid live environments.
  • the first plating layer is plated on an outer surface of the first conductive terminal
  • the second plating layer plated on an outer surface of the second conductive terminal is different from the first plating layer, thus the Even if the first plating layer is immersed by the inherent properties of the plating solution, the amount of precious metal required can be reasonably controlled, thereby preventing the electrical connector from sharply increasing due to the increase in the amount of precious metal, so that the platinum system is made.
  • Metal (eg, antimony) electroplating anti-electrolysis solutions can be widely used and promoted.
  • a platinum group metal (for example, germanium) in the first plating layer may be formed in one or several layers in the stacked layer structure of the first plating layer.
  • the embodiment of the present application is described by taking one of the layers of the stacked layer structure of the first plating layer as a platinum-based metal (for example, ruthenium).
  • a platinum group metal e.g., tantalum
  • the first plating layer includes a copper plating layer, a tungsten nickel plating layer, a gold plating layer, a palladium plating layer, and a ruthenium plating layer which are sequentially laminated on the outer surface of the first conductive terminal.
  • the first plating layer is formed by a series of processes such as water washing, activation, copper plating, tungsten-plated nickel plating, gold plating, palladium plating, rhodium plating, water washing, and air drying, so that the ruthenium plating layer is deposited on the first conductive layer.
  • the terminal surface and the first plating layer are away from the outermost side of the first conductive terminal, thereby achieving the effect of improving the corrosion resistance of the first conductive terminal.
  • the thickness of the ruthenium plating layer is 0.25 ⁇ m to 2 ⁇ m to ensure the corrosion resistance of the first plating layer.
  • the thickness of the other layers in the stacked layer structure of the first plating layer is: the thickness of the copper plating layer is 1 ⁇ m to 3 ⁇ m; the thickness of the tungsten nickel plating layer is 0.75 ⁇ m to 3 ⁇ m; The thickness is from 0.05 ⁇ m to 0.5 ⁇ m; and the thickness of the palladium plating layer is from 0.5 ⁇ m to 2 ⁇ m.
  • the second plating layer includes a nickel plating layer and a gold plating layer which are stacked.
  • the second plating layer can be formed by a series of processes such as water washing, activation, nickel plating, gold plating, water washing and air drying.
  • the thickness of the nickel plating layer The degree is approximately 2.0 ⁇ m, and the thickness of the gold plating layer is approximately 0.076 ⁇ m.
  • the second plating layer is low in plating cost and can satisfy the corrosion resistance requirement of the second conductive terminal as a low potential conductive terminal.
  • the electrical connector in the embodiment of the present application is a TYPE-C type USB (Universal Serial Bus) interface.
  • the electrical connector is a USB female.
  • the USB female seat includes a middle spacer and an upper row of conductive terminal sets and a lower row of conductive terminal sets fixed on opposite sides of the intermediate spacer.
  • the upper row of conductive terminal sets includes a first terminal assembly that is secured by a first support.
  • the first terminal assembly includes at least one of the first conductive terminals and at least one of the second conductive terminals.
  • the lower row of conductive terminal sets includes a second terminal assembly that is secured by a second support.
  • the second terminal assembly is identical in structure to the first terminal assembly.
  • the electrical connector is a USB male.
  • the USB male body includes a latch and an upper row of conductive terminal sets and a lower row of conductive terminal sets fixed on opposite sides of the buckle.
  • the upper row of conductive terminal sets includes a first terminal assembly that is secured by a first support.
  • the first terminal assembly includes at least one of the first conductive terminals and at least one of the second conductive terminals.
  • the lower row of conductive terminal sets includes a second terminal assembly that is secured by a second support.
  • the second terminal assembly is identical in structure to the first terminal assembly.
  • the first support member snaps the second support member.
  • the buckle is used to fasten a female seat corresponding to the USB male.
  • the embodiment of the present application further provides a mobile terminal.
  • the mobile terminal includes the electrical connector described in the above embodiments.
  • the mobile terminal involved in the embodiment of the present application may be any device having communication and storage functions, such as: a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer, a notebook computer, an in-vehicle device, a network television, a wearable device, etc.
  • a smart device with network capabilities such as: a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer, a notebook computer, an in-vehicle device, a network television, a wearable device, etc.
  • a smart device with network capabilities such as: a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer, a notebook computer, an in-vehicle device, a network television, a wearable device, etc.
  • a smart device with network capabilities such as: a tablet computer
  • an embodiment of the present application further provides a method for fabricating an electrical connector.
  • the method of fabricating the electrical connector can be used to fabricate the electrical connector described in the above embodiments.
  • the manufacturing method of the electrical connector includes:
  • a first tape and at least one first conductive terminal connected to the first tape are provided.
  • a first plating layer is plated on the first conductive terminal.
  • the first strip and the first conductive terminal may be formed by stamping a single conductive plate member, such as a copper plate.
  • the first tape carries all of the first conductive terminals for electroplating to form the first plating layer on the first conductive terminals.
  • a second tape and at least one second conductive terminal connected to the second tape are provided.
  • a second plating layer is plated on the second conductive terminal, the material of the second plating layer being different from the material of the first plating layer.
  • the second tape and the second conductive terminal may be formed by stamping a single conductive plate member such as a copper plate.
  • the second tape carries all of the second conductive terminals for electroplating to form the second plating layer on the second conductive terminals.
  • the material of the second plating layer of the electrical connector is different from the material of the second plating layer such that the first conductive terminal and the second conductive terminal have different corrosion resistance properties.
  • the first tape and the second tape are laminated such that the first conductive terminal and the second conductive terminal are arranged in a row on the same plane at intervals to form a first terminal assembly.
  • the second tape adopts the same structural design as the first tape to quickly achieve alignment with each other and improve stacking precision at the time of lamination.
  • the first support member is made of an insulating material.
  • the first conductive terminal is connected to the first tape, the second conductive end Sub-connecting on the second tape, so that the first conductive terminal and the second conductive terminal can be respectively plated to meet the plating requirements of the first plating layer and the second plating layer Therefore, the amount of high-cost plating materials (such as precious metals with high corrosion resistance) is greatly reduced, thereby achieving the purpose of reducing the plating cost and achieving the corrosion resistance.
  • Forming the first support member on the first terminal assembly by a buried molding method thereby improving processing precision of the first support member and between the first conductive terminal and the second conductive terminal The connection is firm.
  • the energization potential of the first conductive terminal is higher than the energization potential of the second conductive terminal, and the corrosion resistance of the first plating layer is higher than the corrosion resistance of the second plating layer.
  • the first conductive terminal can be a high potential pin (PIN), such as VBUS, CC, and SBU.
  • PIN high potential pin
  • the corrosion resistance of the first plating layer is higher than that of the second plating layer because the first conductive terminal having a high energization potential is more susceptible to corrosion than the second conductive terminal having a lower energization potential.
  • Corrosion resistance is capable of balancing the overall corrosion resistance of the electrical connector, which has a long corrosion resistance and a long service life.
  • the process of plating the first plating layer on the first conductive terminal comprises:
  • a copper plating layer is plated on the outer surface of the first conductive terminal.
  • the copper plating layer has a thickness of 1 ⁇ m to 3 ⁇ m.
  • a tungsten nickel plating layer is electroplated on the copper plating layer.
  • the tungsten-nickel plating layer has a thickness of 0.75 ⁇ m to 3 ⁇ m.
  • a gold plating layer is electroplated on the tungsten nickel plating layer.
  • the gold plating layer has a thickness of 0.05 ⁇ m to 0.5 ⁇ m.
  • a palladium plating layer is electroplated on the gold plating layer.
  • the palladium plating layer has a thickness of 0.5 ⁇ m to 2 ⁇ m.
  • the ruthenium plating layer has a thickness of 0.25 ⁇ m to 2 ⁇ m.
  • the first plating layer is stacked with a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance, the first plating layer can greatly enhance the first plating layer.
  • a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance
  • the first plating layer can greatly enhance the first plating layer.
  • the resistance to electrolysis and the service life of the conductive terminals especially the resistance to electrolytic corrosion in humid live environments. Since the first plating layer is plated on an outer surface of the first conductive terminal, the second plating layer plated on an outer surface of the second conductive terminal is different from the first plating layer, thus the Even if the first plating layer is immersed by the inherent properties of the plating solution, the amount of precious metal required can be reasonably controlled, thereby preventing the electrical connector from sharply increasing due to the increase in the amount of precious metal, so that the platinum system is made.
  • Metal (eg, antimony) electroplating anti-electrolysis solutions can be
  • the process of plating the first plating layer on the first conductive terminal before plating the copper plating layer further includes:
  • the outer surface of the first conductive terminal is washed with water. At this time, the outer surface of the first conductive terminal has a high degree of cleanliness to meet the cleanliness requirements of subsequent processes.
  • the process of plating the first plating layer on the first conductive terminal further includes:
  • the ruthenium plating layer is washed with water and air dried to form a first plating layer.
  • the first plating layer is formed by a series of processes such as water washing, activation, copper plating, tungsten-plated nickel plating, gold plating, palladium plating, rhodium plating, water washing, and air drying to deposit the ruthenium plating layer.
  • the surface of the first conductive terminal and the first plating layer are away from the outermost side of the first conductive terminal, thereby achieving the effect of improving the corrosion resistance of the first conductive terminal.
  • the process of plating the second plating layer on the second conductive terminal comprises:
  • a nickel plating layer is electroplated on the outer surface of the second conductive terminal.
  • the nickel plating layer has a thickness of approximately 2.0 ⁇ m.
  • the outer surface of the second conductive terminal is washed with water, and the oxide film on the outer surface of the second conductive terminal is activated.
  • a gold plating layer is electroplated on the nickel plating layer to form a second plating layer.
  • the thickness of the gold plating layer is approximately 0.076 ⁇ m. After the gold plating is formed, the gold plating layer is washed with water and air dried.
  • the second plating layer is low in plating cost and can satisfy the corrosion resistance requirement of the second conductive terminal as a low potential conductive terminal.
  • the providing the first tape and the at least one first conductive terminal connected to the first tape comprises stamping a first conductive plate to form a first tape and at least one first conductive terminal.
  • the first tape has a first portion and a first connecting portion, and the first connecting portion is connected between the first portion and the first conductive terminal.
  • the first conductive terminal is offset from the first portion by a first distance (that is, a gap between the first conductive terminal and the first portion is a first distance).
  • the first portion has a first thickness.
  • the providing the second tape and the at least one second conductive terminal connected to the second tape includes stamping the second conductive plate to form a second tape and at least one second conductive terminal.
  • the second tape has a second portion and a second connecting portion, and the second connecting portion is connected between the second portion and the second conductive terminal.
  • the second conductive terminal is offset from the second portion of the second portion (that is, the gap between the second conductive terminal and the second portion is a second distance).
  • the second distance is equal to a sum or difference of the first distance and the first thickness.
  • the second tape When stacking the first tape and the second tape, if the second distance is equal to a sum of the first distance and the first thickness, the second tape is laminated on the first a side of the strip remote from the first conductive terminal, the second conductive terminal passing through the first strip and juxtaposed with the first conductive terminal. If the second distance is equal to a difference between the first distance and the first thickness, the second tape is laminated on a side of the first tape adjacent to the first conductive terminal, A first conductive terminal passes through the second strip and is juxtaposed with the second conductive terminal.
  • the first tape has a first positioning hole
  • the second tape has a second positioning hole.
  • the first positioning holes are aligned with the second positioning holes when the first tape and the second tape are stacked.
  • the first positioning hole and the second positioning hole may be aligned by a feed mechanism ejector on the molding machine such that the first conductive terminal and the second conductive terminal are in contact with each other.
  • the positioning is accurate, and both can be accurately positioned on the molding machine, thereby ensuring that the size of the first support member formed by the embedding molding process satisfies the specification requirement, the first support member itself is sized, the first a relative position between a support member and the first conductive terminal and a relative position between the first support member and the second conductive terminal have higher precision, which improves the electrical connector Product yield.
  • the manufacturing method of the electrical connector further includes:
  • the first tape and the second tape are cut to form an electrical connector.
  • the electrical connector is fabricated by separately plating the first conductive terminal and the second conductive terminal, and then assembling the first conductive terminal and the second conductive terminal, and then molding Forming the first support member, and finally cutting the first tape and the second tape to form the electrical connector, so that the electrical connector greatly reduces plating while achieving corrosion resistance cost.
  • the manufacturing method of the electrical connector further includes:
  • a third strip and at least one third conductive terminal connected to the third strip are provided.
  • a third plating layer is plated on the third conductive terminal.
  • the third strip and the third conductive terminal may be stamped by a single conductive plate (eg Copper plate) is formed.
  • the third strip carries all of the third conductive terminals for electroplating to form the third plating layer on the third conductive terminals.
  • a fourth tape and at least one fourth conductive terminal connected to the fourth tape are provided. And plating a fourth plating layer on the fourth conductive terminal, the material of the fourth plating layer being different from the material of the third plating layer.
  • the fourth tape and the fourth conductive terminal may be formed by stamping a single conductive plate member such as a copper plate.
  • the fourth tape carries all of the fourth conductive terminals for electroplating to form the fourth plating layer on the fourth conductive terminals.
  • the material of the fourth plating layer of the electrical connector is different from the material of the third plating layer such that the fourth conductive terminal and the third conductive terminal have different corrosion resistance properties.
  • the third tape and the fourth tape are laminated such that the third conductive terminal and the fourth conductive terminal are arranged in a row on the same plane at intervals to form a second terminal assembly.
  • the fourth tape adopts the same structural design as the third tape to quickly achieve alignment with each other and improve stacking precision at the time of lamination.
  • a second support member is formed on the second terminal assembly by a buried molding method, and the second support member fixedly connects the third conductive terminal and the fourth conductive terminal.
  • the second support member is made of an insulating material.
  • first support member and the second support member such that the first terminal assembly and the second terminal assembly are disposed back to back.
  • the first support member and the second support member insulate the first terminal assembly and the second terminal assembly from each other.
  • an electrical connector having a double row of conductive terminals can be formed by the manufacturing method of the electrical connector.
  • the first conductive terminal, the second conductive terminal, the third conductive terminal, and the fourth conductive terminal can be respectively plated to meet the plating of each of the conductive terminals.
  • the demand thereby greatly reducing the amount of high-cost plating materials (such as precious metals with high corrosion resistance), to achieve the purpose of reducing the plating cost and the corrosion resistance.
  • Forming the first support member on the first terminal assembly by a buried molding method, forming the second support member on the second terminal assembly, and improving the first support member and the second support member The processing accuracy of the support, thereby increasing the product yield of the electrical connector.
  • the assembling the first support member and the second support member comprises:
  • the first support, the intermediate spacer, and the second support are laminated in this order.
  • first support member, the intermediate spacer, and the second support member are fixed to each other by a buried molding method.
  • the method of fabricating the electrical connector is used to make an electrical connector as a female base.
  • the assembling the first support and the second support comprises:
  • the buckle is used to fasten a mating connector corresponding to the electrical connector.
  • first support member and the second support member are respectively fastened on opposite sides of the buckle.
  • the first support member snaps the second support member.
  • the first support member is provided with a protrusion
  • the second support member is provided with a groove, and the protrusion passes through the buckle to be caught in the groove, thereby achieving mutual fixation.
  • the method of fabricating the electrical connector is used to make an electrical connector as a male connector.
  • the manufacturing method of the electrical connector further includes:
  • the first tape, the second tape, the third tape, and the fourth tape are cut to form an electrical connector.
  • the first tape, the second tape, the third tape, and the fourth tape are taken Designed with the same structure and stacked on each other, the first tape, the second tape, the third tape and the fourth tape can be removed by one-time cutting, cutting efficiency high.
  • the first support member and the second support member are assembled first, and then the first tape, the second tape, the third tape, and the fourth tape are cut off.
  • the method is suitable for the process of making an electrical connector as a male or an electrical connector as a female.
  • the electrical connector after forming the first support member and the second support member, respectively, and before assembling the first support member and the second support member, the electrical connector
  • the production method also includes:
  • the first tape, the second tape, the third tape, and the fourth tape are cut.
  • the manufacturing method of the electrical connector is performed by first cutting the first tape, the second tape, the third tape, and the fourth tape, and then assembling the first
  • the electrical connector is formed in a manner that a support member and the second support member. This embodiment is applicable to a process of making an electrical connector as a male.
  • the first terminal assembly is the same as the second terminal assembly such that the electrical connector forms a TYPE-C type USB interface.
  • the first conductive terminal is the same as the third conductive terminal, and the first plating layer is the same material as the third plating layer.
  • the second conductive terminal is the same as the fourth conductive terminal, and the second plating layer is the same as the fourth plating layer.
  • the arrangement of the first conductive terminal and the second conductive terminal is the same as the arrangement of the third conductive terminal and the fourth conductive terminal.
  • FIG. 1 is a first schematic diagram of a method of fabricating an electrical connector according to an embodiment of the present application
  • FIG. 2 is a second schematic diagram of a method for fabricating an electrical connector according to an embodiment of the present application
  • FIG. 3 is a third schematic diagram of a method for fabricating an electrical connector according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram 4 of a method for fabricating an electrical connector according to an embodiment of the present application.
  • FIG. 5 is a first schematic diagram of a method for fabricating another electrical connector according to an embodiment of the present application.
  • FIG. 6 is a second schematic diagram of a method for fabricating another electrical connector according to an embodiment of the present application.
  • FIG. 7 is a third schematic diagram of another method for fabricating an electrical connector according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram 4 of another method for fabricating an electrical connector according to an embodiment of the present application.
  • FIG. 9 is a schematic structural view of a first conductive terminal and a first plating layer provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural view of a second conductive terminal and a second plating layer provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a mobile terminal according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural diagram of a data line according to an embodiment of the present disclosure.
  • Figure 13 is a side view of the first view of Figure 1 and a side view of the second view;
  • Figure 14 is a side elevational view of the first view and the second view of Figure 5;
  • the electrical connector 100 includes a plurality of conductive terminals.
  • the plurality of conductive terminals include at least one first conductive terminal 1 and at least one second conductive terminal 2.
  • the first conductive terminal 1 and the second conductive terminal 2 are made of a conductive material to achieve electrical connection.
  • the outer surface of the first conductive terminal 1 is provided with a first plating layer 11.
  • the first plating layer 11 has corrosion resistance for preventing corrosion of the first conductive terminal 1.
  • the outer surface of the second conductive terminal 2 is provided with a second plating layer 21.
  • the second plating layer 21 has corrosion resistance for preventing corrosion of the second conductive terminal 2.
  • the material of the second plating layer 21 is different from the material of the first plating layer 11.
  • the corrosion resistance of the different plating layers of the material is different.
  • the material of the first plating layer 11 of the electrical connector 100 is different from the material of the second plating layer 21, such that the first conductive terminal 1 and the second conductive terminal
  • the corrosion resistance of the electrical connector 100 is different, so that the conductive terminals of the electrical connector 100 can be selectively electroplated, and different electroplating can meet the requirements of different application environments, for example, the corrosion-resistant conductive terminals are electroplated with high corrosion resistance.
  • An electroplated layer for example, a plating layer having a noble metal having high corrosion resistance
  • a plating layer having a relatively high corrosion resistance to a conductive terminal which is less susceptible to corrosion so that the entire corrosion resistance of all the conductive terminals of the electrical connector 100 is corrosion-resistant
  • the performance is good, the corrosion resistance time is long, and the electrical connector 100 has a longer service life.
  • the cost of the corrosion-resistant plating layer is relatively high, the electrical connector 100 can minimize the amount of the plating material having a high corrosion resistance by selective plating, thereby reducing the electrical connector.
  • the electroplating cost of 100 therefore, the electrical connector 100 has both good corrosion resistance and low cost.
  • first plating layer 11 described in the embodiment of the present application may be a single layer structure or a composite layer structure.
  • the second plating layer 21 may be a single layer structure or a composite layer structure. The embodiment of the present application is described by taking the first plating layer 11 as a composite layer structure and the second plating layer 21 as a composite layer structure.
  • the first conductive terminal 1 and the second conductive terminal 2 may adopt a split type strip design to satisfy the plating of the first plating layer 11 and the respectively
  • the electroplating requirement of the second electroplated layer 21 greatly reduces the amount of high-cost electroplating materials (for example, precious metals having high corrosion resistance), thereby achieving the purpose of reducing the electroplating cost and the corrosion resistance.
  • the split type tape design means that all of the first conductive terminals 1 are connected to the first tape 10, and all of the second conductive terminals 2 are connected to the second tape 20,
  • the first tape 10 carries all of the first conductive terminals 1 for immersion plating to form the first plating layer 11 on the first conductive terminals 1, and the second tape 20 carries all of the first layers
  • the second conductive terminal 2 is immersed to form a second plating layer 21 on the second conductive terminal 2, and then the first tape 10 and the second tape 20 are assembled to make the first conductive terminal 1 And the second conductive terminal 2 is regularly arranged.
  • the energization potential of the first conductive terminal 1 is higher than the energization potential of the second conductive terminal 2 .
  • the first conductive terminal 1 can be a high potential pin (PIN), such as VBUS, CC, and SBU.
  • the second conductive terminal 2 can be a low potential pin (PIN).
  • the corrosion resistance of the first plating layer 11 is higher than the corrosion resistance of the second plating layer 21.
  • the corrosion resistance of the first plating layer 11 is made higher than the second The corrosion resistance of the plating layer 21 can balance the overall corrosion resistance of the electrical connector 100, which has a long corrosion resistance time and a long service life.
  • the first plating layer 11 has a noble metal such as platinum-based metal ruthenium/iridium/palladium.
  • the first plating layer 11 has a tantalum alloy material. Since the first plating layer 11 is stacked with a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance, the first plating layer 11 can greatly enhance the first conductive terminal 1 Resistance to electrolytic corrosion and service life, especially resistance to electrolytic corrosion in humid live environments.
  • the plating layer 11 is plated on the outer surface of the first conductive terminal 1, and the second plating layer 21 plated on the outer surface of the second conductive terminal 2 is different from the first plating layer 11, thus the Even if the first plating layer 11 is immersed by the inherent properties of the plating solution, the amount of precious metal required can be reasonably controlled, thereby preventing the electrical connector 100 from sharply increasing due to an increase in the amount of precious metal.
  • Platinum-based metal (such as antimony) electroplating anti-electrolytic corrosion scheme can be widely applied and popularized.
  • a platinum group metal (for example, germanium) in the first plating layer 11 may be formed in one or several layers in the stacked layer structure of the first plating layer 11.
  • the embodiment of the present application is described by taking one of the stacked layer structures of the first plating layer 11 formed of a platinum-based metal (for example, ruthenium) as an example.
  • a platinum group metal such as tantalum is formed in two or more of the stacked layer structures of the first plating layer 11 to meet higher corrosion resistance performance requirements.
  • the first plating layer 11 includes a copper plating layer 111 , a tungsten nickel plating layer 112 , a gold plating layer 113 , a palladium plating layer 114 , and a copper plating layer 112 , which are sequentially stacked on the outer surface of the first conductive terminal 1 . ⁇ plating 115.
  • the first plating layer 11 is formed by a series of processes such as water washing, activation, copper plating, tungsten-plated nickel plating, gold plating, palladium plating, rhodium plating, water washing, and air drying, so that the ruthenium plating layer 115 is deposited on the first layer.
  • the surface of the conductive terminal 1 and the first plating layer 11 are away from the outermost side of the first conductive terminal 1 to achieve the effect of improving the corrosion resistance of the first conductive terminal 1.
  • the thickness of the ruthenium plating layer 115 is 0.25 ⁇ m to 2 ⁇ m to ensure the corrosion resistance of the first plating layer 11.
  • the thickness of the other layers in the stacked layer structure of the first plating layer 11 is: the thickness of the copper plating layer 111 is 1 ⁇ m to 3 ⁇ m; the thickness of the tungsten nickel plating layer 112 is 0.75 ⁇ m to 3 ⁇ m; The gold plating layer 113 has a thickness of 0.05 ⁇ m to 0.5 ⁇ m; and the palladium plating layer 114 has a thickness of 0.5 ⁇ m to 2 ⁇ m.
  • the second plating layer 21 includes a nickel plating layer 211 and a gold plating layer 212 which are stacked.
  • the second plating layer 21 can be formed by a series of processes such as water washing, activation, nickel plating, gold plating, water washing, and air drying.
  • the nickel plating layer 211 has a thickness of approximately 2.0 ⁇ m
  • the gold plating layer 212 has a thickness of approximately 0.076 ⁇ m.
  • the second plating layer 21 is low in plating cost and can satisfy the corrosion resistance requirement of the second conductive terminal 2 as a low potential conductive terminal.
  • the electrical connector 100 in the embodiment of the present application may be a male or female.
  • the electrical connector 100 can be applied to a mobile terminal 200, which is a female base.
  • the electrical connector 100 can be applied to a data line 300 that is a female of the data line 300 and that connects the transmission line of the data line 300.
  • the electrical connector 100 can also be used in devices such as chargers, mobile power supplies, and lighting fixtures.
  • the electrical connector 100 of the embodiment of the present application is a TYPE-C type USB (Universal Serial Bus) interface.
  • the electrical connector 100 is a USB female socket.
  • the USB female base includes a middle plate 8 and an upper row of conductive terminal sets and a lower row of conductive terminal sets fixed on opposite sides of the intermediate spacer 8.
  • the upper row of conductive terminal sets includes first terminal assemblies (1, 2) that are secured by a first support member 5.
  • the first terminal assembly (1, 2) includes at least one of the first conductive terminals 1 and at least one of the second conductive terminals 2.
  • the lower row of conductive terminal sets includes a second terminal assembly (3, 4) that is secured by a second support member 6.
  • the second terminal assembly (3, 4) is identical in structure to the first terminal assembly (1, 2).
  • the electrical connector 100 is a USB male connector.
  • the USB The male head includes a latch 7 and an upper row of conductive terminal sets and a lower row of conductive terminal sets fixed to opposite sides of the buckle 7.
  • the upper row of conductive terminal sets includes first terminal assemblies (1, 2) that are secured by a first support member 5.
  • the first terminal assembly (1, 2) includes at least one of the first conductive terminals 1 and at least one of the second conductive terminals 2.
  • the lower row of conductive terminal sets includes a second terminal assembly (3, 4) that is secured by a second support member 6.
  • the second terminal assembly (3, 4) is identical in structure to the first terminal assembly (1, 2).
  • the first support member 5 snaps the second support member 6.
  • the buckle 7 is used to fasten a female seat corresponding to the USB male.
  • the arrangement of the conductive terminals, the structure of the first support member 5 and the structure of the second support member 6 in the terminal assembly of the USB female and the USB male are not limited, but are The specific needs are designed independently.
  • an embodiment of the present application further provides a mobile terminal 200.
  • the mobile terminal 200 includes the electrical connector 100 described in the above embodiments.
  • the mobile terminal 200 involved in the embodiment of the present application may be any device having communication and storage functions, such as a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), a notebook computer, an in-vehicle device, and a network.
  • a smart device with network capabilities such as TVs and wearable devices.
  • the embodiment of the present application further provides a manufacturing method of an electrical connector.
  • the manufacturing method of the electrical connector can be used to fabricate the electrical connector 100 described in the above embodiments.
  • the manufacturing method of the electrical connector includes:
  • S01 providing a first tape 10 and at least one first conductive terminal 1 connected to the first tape 10.
  • a first plating layer 11 is plated on the first conductive terminal 1.
  • the first tape 10 and the first conductive terminal 1 may be formed by stamping a single conductive plate member such as a copper plate.
  • the first tape 10 carries all of the first conductive terminals 1 for electroplating to form the first plating layer 11 on the first conductive terminals 1.
  • S02 providing a second tape 20 and at least one second conductive terminal 2 connected to the second tape 20.
  • a second plating layer 21 is plated on the second conductive terminal 2, and the material of the second plating layer 21 is different from the material of the first plating layer 11.
  • the second tape 20 and the second conductive terminal 2 may be formed by stamping a single conductive plate member such as a copper plate.
  • the second tape 20 carries all of the second conductive terminals 2 for electroplating to form the second plating layer 21 on the second conductive terminals 2.
  • the material of the second plating layer 21 of the electrical connector 100 is different from the material of the second plating layer 21 such that the corrosion resistance of the first conductive terminal 1 and the second conductive terminal 2 are different.
  • S03 laminating the first tape 10 and the second tape 20 such that the first conductive terminal 1 and the second conductive terminal 2 are arranged in a row on the same plane to form a first One terminal assembly (1, 2).
  • the second tape 20 is designed in the same manner as the first tape 10 to quickly achieve alignment with each other and improve stacking precision at the time of lamination.
  • the first support member 5 is made of an insulating material.
  • the first conductive terminal 1 is connected to the first tape 10 and the second conductive terminal 2 is connected to the second tape 20
  • the The first conductive terminal 1 and the second conductive terminal 2 are plated to meet the plating requirements of the first plating layer 11 and the second plating layer 21, thereby greatly reducing the costly plating material (for example, corrosion resistance)
  • the use of strong precious metals achieves the goal of reducing plating costs and achieving corrosion resistance.
  • Forming the first branch on the first terminal assembly (1, 2) by a buried molding method The support member 5 can thereby improve the processing accuracy of the first support member 5 and the connection fastness with the first conductive terminal 1 and the second conductive terminal 2.
  • the energization potential of the first conductive terminal 1 is higher than the energization potential of the second conductive terminal 2, and the corrosion resistance of the first plating layer 11 is higher than that of the second plating layer 21 Sex.
  • the first conductive terminal 1 can be a high potential pin (PIN), such as VBUS, CC, and SBU. Since the first conductive terminal 1 having a high energization potential is more susceptible to corrosion than the second conductive terminal 2 having a lower energization potential, the corrosion resistance of the first plating layer 11 is made higher than the second The corrosion resistance of the plating layer 21 can balance the overall corrosion resistance of the electrical connector 100, which has a long corrosion resistance time and a long service life.
  • the process of plating the first plating layer 11 on the first conductive terminal 1 includes:
  • the copper plating layer 111 has a thickness of 1 ⁇ m to 3 ⁇ m.
  • a tungsten-nickel plating layer 112 is plated on the copper plating layer 111.
  • the tungsten-nickel plating layer 112 has a thickness of 0.75 ⁇ m to 3 ⁇ m.
  • the gold plating layer 113 has a thickness of 0.05 ⁇ m to 0.5 ⁇ m.
  • the palladium plating layer 114 has a thickness of 0.5 ⁇ m to 2 ⁇ m.
  • a ruthenium plating layer 115 is plated on the palladium plating layer 114.
  • the thickness of the ruthenium plating layer 115 is 0.25 ⁇ m to 2 ⁇ m.
  • the first plating layer 11 is stacked with a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance, the first plating layer 11 can greatly enhance the The first conductive terminal 1 is resistant to electrolytic corrosion and has a service life, in particular, an electrolytic corrosion resistance in a humidified charged environment. Since the first plating layer 11 is plated on the outer surface of the first conductive terminal 1, the second plating layer 21 plated on the outer surface of the second conductive terminal 2 is different from the first plating layer 11.
  • a noble metal such as platinum-based metal ruthenium/iridium/palladium having corrosion resistance
  • the amount of precious metal required can be reasonably controlled, thereby preventing the electrical connector 100 from being plated due to an increase in the amount of precious metal.
  • the sharp increase in cost has made platinum-based metal (such as antimony) electroplating anti-electrolytic corrosion schemes widely available and popularized.
  • the process of plating the first plating layer 11 on the first conductive terminal 1 before plating the copper plating layer 111 further includes:
  • the process of plating the first plating layer 11 on the first conductive terminal 1 further includes:
  • the first plating layer 11 is formed by a series of processes such as water washing, activation, copper plating, tungsten-plated nickel plating, gold plating, palladium plating, rhodium plating, water washing, and air drying, so that the ruthenium plating layer is formed.
  • 115 is deposited on the surface of the first conductive terminal 1 and the first plating layer 11 is away from the outermost side of the first conductive terminal 1 to achieve the effect of improving the corrosion resistance of the first conductive terminal 1.
  • the process of plating the second plating layer 21 on the second conductive terminal 2 includes:
  • S021 Electroplating a nickel plating layer 211 on the outer surface of the second conductive terminal 2.
  • the nickel plating layer 211 has a thickness of approximately 2.0 ⁇ m. Before plating the nickel plating layer 211, the outer surface of the second conductive terminal 2 is washed with water, and the oxide film on the outer surface of the second conductive terminal 2 is activated.
  • S022 plating a gold plating layer 212 on the nickel plating layer 211 to form a second plating layer 21.
  • the gold plating layer 212 has a thickness of approximately 0.076 ⁇ m. After the gold plating layer 212 is formed, the gold plating layer 212 is washed with water and air dried.
  • the second plating layer 21 has low plating cost and can meet the corrosion resistance requirement of the second conductive terminal 2 as a low potential conductive terminal.
  • the providing the first tape 10 and the at least one first conductive terminal 1 connected to the first tape 10 comprises: stamping first
  • the conductive plate forms a first tape 10 and at least one first conductive terminal 1.
  • the first tape 10 has a first portion 101 and a first connecting portion 102 , and the first connecting portion 102 is connected between the first portion 101 and the first conductive terminal 1 .
  • the first conductive terminal 1 is offset from the first portion 101 by a first distance S1.
  • the first body portion 101 has a first thickness T.
  • the providing the second tape 20 and the at least one second conductive terminal 2 connected to the second tape 20 comprises: stamping the second conductive plate to form the second tape 20 and At least one second conductive terminal 2.
  • the second tape 20 has a second main portion 201 and a second connecting portion 202 , and the second connecting portion 202 is connected between the second main portion 201 and the second conductive terminal 2 .
  • the second conductive terminal 2 is offset from the second portion 201 by a second distance S2.
  • the thickness of the second portion 201 is equal to the first thickness T.
  • the second distance S2 is equal to the sum or difference of the first distance S1 and the first thickness T.
  • the second distance S2 is equal to the sum of the first distance S1 and the first thickness T
  • the second conductive terminal 2 passes through the first tape 10 and is juxtaposed with the first conductive terminal 1.
  • the second tape 20 is laminated on the first tape 10 adjacent to the first conductive terminal 1
  • the first conductive terminal 1 passes through the second tape 20 and is juxtaposed with the second conductive terminal 2.
  • the first conductive plate may be a copper plate.
  • the second conductive plate may be a copper plate.
  • the first tape 10 has a first positioning hole 103
  • the second tape 20 has a second positioning hole 203 .
  • the first positioning holes 103 are aligned with the second positioning holes 203.
  • the first positioning hole 103 and the second positioning hole 203 may be aligned by a feeding mechanism ejector pin 9 on the molding machine to make the first conductive terminal 1 and the second conductive
  • the terminals 2 are positioned accurately with each other and can be accurately positioned on the molding machine, thereby ensuring that the size of the first support member 5 formed by the embedding molding process satisfies the specification, the first support member 5 itself, the relative position between the first support member 5 and the first conductive terminal 1 and the relative position between the first support member 5 and the second conductive terminal 2 are both high Accuracy improves the product yield of the electrical connector 100.
  • the manufacturing method of the electrical connector further includes:
  • the manufacturing method of the electrical connector is performed by separately plating the first conductive terminal 1 and the first Two conductive terminals 2, then assembling the first conductive terminal 1 and the second conductive terminal 2, then forming the first support member 5, and finally cutting the first tape 10 and the second tape 20
  • the manner in which the electrical connector 100 is formed is such that the electrical connector 100 greatly reduces the plating cost while achieving both corrosion resistance.
  • the manufacturing method of the electrical connector further includes:
  • S01' a third tape 30 and at least one third conductive terminal 3 connected to the third tape 30 are provided.
  • a third plating layer 31 is plated on the third conductive terminal 3.
  • the third tape 30 and the third conductive terminal 3 may be formed by stamping a single conductive plate member such as a copper plate.
  • the third strip 30 carries all of the third conductive terminals 3 for electroplating to form the third plating layer 31 on the third conductive terminals 3.
  • S02' a fourth tape 40 and at least one fourth conductive terminal 4 connected to the fourth tape 40 are provided.
  • a fourth plating layer 41 is plated on the fourth conductive terminal 4, and the material of the fourth plating layer 41 is different from the material of the third plating layer 31.
  • the fourth tape 40 and the fourth conductive terminal 4 may be formed by stamping a single conductive plate member such as a copper plate.
  • the fourth tape 40 carries all of the fourth conductive terminals 4 for electroplating to form the fourth plating layer 41 on the fourth conductive terminals 4.
  • the material of the fourth plating layer 41 of the electrical connector 100 is different from the material of the third plating layer 31 such that the corrosion resistance of the fourth conductive terminal 4 and the third conductive terminal 3 are different.
  • S03' laminating the third tape 30 and the fourth tape 40 such that the third conductive terminal 3 and the fourth conductive terminal 4 are arranged in a row on the same plane at intervals to form Second terminal assembly (3, 4).
  • the fourth tape 40 is designed in the same manner as the third tape 30 to quickly achieve alignment with each other and improve stacking precision at the time of lamination.
  • S04' forming a second support member 6 on the second terminal assembly (3, 4) by means of insert molding, the second support member 6 fixedly connecting the third conductive terminal 3 and the The fourth conductive terminal 4 is described.
  • the second support member 6 is made of an insulating material.
  • the positioning holes 303 of the third tape 30 and the positioning holes 403 of the fourth tape 40 can be aligned by the feed mechanism ejector pin 9 on the molding machine.
  • S051 assembling the first support member 5 and the second support member 6 such that the first terminal assembly (1, 2) and the second terminal assembly (3, 4) are disposed back to back.
  • the first support member 5 and the second support member 6 insulate the first terminal assembly (1, 2) from the second terminal assembly (3, 4) from each other.
  • the electrical connector 100 having the double row of conductive terminals can be formed by the manufacturing method of the electrical connector.
  • the first conductive terminal 1, the second conductive terminal 2, the third conductive terminal 3, and the fourth conductive terminal 4 are respectively plated to meet the respective conductive states.
  • the respective plating requirements of the terminals greatly reduce the amount of high-cost plating materials (such as precious metals with high corrosion resistance), thereby achieving the purpose of reducing the plating cost and the corrosion resistance.
  • the processing precision of the first support member 5 and the second support member 6 is improved, thereby improving the product yield of the electrical connector 100.
  • the first auxiliary strip 12 is further connected to an end of the first conductive terminal 1 remote from the first strip 10 .
  • the first conductive terminal 1 is connected between the first tape 10 and the first secondary tape 12, and the first secondary tape 12 is used to hold the first conductive terminal 1
  • the processing accuracy of the first conductive terminal 1 and the subsequent assembly quality are improved.
  • the first secondary strip 12 can be cut after the first support 5 is formed.
  • the first sub-wrap 12 is cut off after the first support 5 is formed and before the first support 5 and the second support 6 are assembled (step S051).
  • the second auxiliary strip 22 may also be connected to an end of the second conductive terminal 2 remote from the second strip 20.
  • the second sub-bing strip 22 is cut after forming the first support member 5.
  • a third auxiliary strip may be connected to an end of the third conductive terminal 3 remote from the third strip 30.
  • the third secondary strip is cut after the second support 6 is formed.
  • a fourth auxiliary strip may be connected to an end of the fourth conductive terminal 4 remote from the fourth strip 40. The fourth secondary strip is cut after the second support 6 is formed.
  • the assembling the first support member 5 and the second support member 6 includes:
  • the method of fabricating the electrical connector is used to make the electrical connector 100 as a female base.
  • the assembling the first support member 5 and the second support member 6 includes:
  • S0511 Provide a buckle 7 (latch).
  • the buckle 7 is used to fasten a mating connector corresponding to the electrical connector 100.
  • the first support member 5 and the second support member 6 are respectively fastened on opposite sides of the buckle 7.
  • the first support member 5 snaps the second support member 6.
  • the first support member 5 is provided with a protrusion
  • the second support member 6 is provided with a groove, and the protrusion passes through the buckle 7 to snap into the groove, thereby realizing each other. fixed.
  • the method of fabricating the electrical connector is used to make the electrical connector 100 as a male connector.
  • the manufacturing method of the electrical connector further includes:
  • S052 cutting the first tape 10, the second tape 20, the third tape 30, and the fourth tape 40 to form an electrical connector 100.
  • the first tape 10, the second tape 20, the third tape 30, and the fourth tape 40 have the same structural design and are stacked on each other, The first tape 10, the second tape 20, the third tape 30, and the fourth tape 40 are removed by a one-time cutting method, and the cutting efficiency is high.
  • the first support member 5 and the second support member 6 are assembled first, and then the first tape 10, the second tape 20, the third tape 30 and the The manner in which the fourth tape 40 is described is applicable to the process of making the electrical connector 100 as a male or the electrical connector 100 as a female, as shown in FIGS. 3, 4, 7, and 8.
  • the manufacturing method of the electrical connector further includes:
  • the first tape 10, the second tape 20, the third tape 30, and the fourth tape 40 are cut.
  • the electrical connector is manufactured by first cutting the first tape 10, the second tape 20, the third tape 30, and the fourth tape 40, and then The electrical connector 100 is formed in such a manner that the first support 5 and the second support 6 are assembled.
  • This embodiment is applicable to the process of making the electrical connector 100 as a male.
  • the first terminal component (1, 2) is the same as the second terminal component (3, 4), so that the electrical connector 100 forms a TYPE-C type USB (Universal Serial Bus) Line bus) interface.
  • the first conductive terminal 1 is the same as the third conductive terminal 3, and the first plating layer 11 and the third plating layer 31 are The materials are the same.
  • the second conductive terminal 2 is the same as the fourth conductive terminal 4, and the second plating layer 21 is the same as the fourth plating layer 41.
  • the arrangement of the first conductive terminal 1 and the second conductive terminal 2 is the same as the arrangement of the third conductive terminal 3 and the fourth conductive terminal 4.
  • the upper and lower rows of terminals of the connector base are of the same strip design.
  • the terminal is stamped with a split type tape (refer to the first tape 10 and the second tape 20), and is respectively subjected to ⁇ (refer to the first plating layer 11) and a conventional plating layer (refer to the second Electroplated layer 21).
  • the process is carried out in the following steps:
  • the positioning holes on the top of the feeding mechanism on the forming machine are positioned to position the conductive terminals of the split strips, and then the embedded terminals are positioned to ensure burying.
  • the dimensions after molding are in compliance with the specifications.
  • the upper and lower rows of the male connector of the connector are stamped separately using the split tape (refer to the first tape 10 and the second tape 20). ⁇ (refer to the first plating layer 11) and conventional (refer to the second plating layer 21) plating, the process is carried out in the following steps:
  • the positioning holes on the top of the feeding mechanism on the forming machine are positioned to position the conductive terminals of the split strips, and then the embedded terminals are positioned to ensure burying.
  • the dimensions after molding are in compliance with the specifications.
  • the upper and lower rows of terminals are formed, the upper and lower rows of terminals and the latches are assembled and the strips are cut (or the strips are cut and assembled with the buckles) to complete the three-in-one and finished products of the male end of the connector.
  • the VBUS terminal is plated with ruthenium, and the other terminals are conventionally plated. The difference between the two is shown in Fig. 8. The detailed process is shown in Figures 5-8.

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Abstract

一种电连接器（100），包括至少一个第一导电端子（1）和至少一个第二导电端子（2），第一导电端子（1）的外表面设有第一电镀层（11），第二导电端子（2）的外表面设有第二电镀层（21），第二电镀层（21）的材料与第一电镀层（11）的材料不同。上述电连接器（100）在兼顾抗腐蚀性的同时降低了电镀成本。还公开一种移动终端（200）和一种电连接器（100）的制作方法。

Description

电连接器、移动终端及电连接器的制作方法 技术领域
本申请涉及电连接设备技术领域，尤其涉及一种电连接器、一种移动终端以及一种电连接器的制作方法。
背景技术
终端产品越来越苛刻的使用环境(快充、防水等)对输入/输出(input/output，IO)连接器的质量有更高的要求。而众多失效中，因连接器的导电端子腐蚀，而导致充电慢、充电图标闪烁、无铃声和OTG(On The Go)不识别等失效问题尤为突出。现有技术中提出采用抗腐蚀性能强的贵金属进行电镀，然而，由于贵金属成本高，电镀药水的固有属性又只能采用浸镀的方式，因此增加了贵金属用量从而导致电镀成本急剧上升。
发明内容
本申请实施例提供一种电连接器、移动终端及电连接器的制作方法。
本申请实施例采用如下技术方案：
第一方面，本申请实施例提供一种电连接器。所述电连接器包括多个导电端子。所述多个导电端子中包括至少一个第一导电端子和至少一个第二导电端子。所述第一导电端子和所述第二导电端子采用导电材质制成，以实现电连接作用。所述第一导电端子的外表面设有第一电镀层。所述第一电镀层具有抗腐蚀性，用于防止所述第一导电端子腐蚀。所述第二导电端子的外表面设有第二电镀层。所述第二电镀层具有抗腐蚀性，用于防止所述第二导电端子腐蚀。所述第二电镀层的材料与所述第一电镀层的材料不同。材料不同的电镀层的抗腐蚀性能(材料抵抗周围介质腐蚀破坏作用的能力)不同。
在本申请实施例中，所述电连接器的所述第一电镀层的材料与所述第二电镀层的材料不同，使得所述第一导电端子和所述第二导电端子的抗腐蚀性能不同，因此所述电连接器的导电端子可实现选择性电镀，以不同的电镀满足不同应用环境下的要求，例如对较为容易腐蚀的导电端子电镀抗腐蚀性较强的电镀层(例如具有抗腐蚀性强的贵金属的电镀层)、对较为不容易腐蚀的导电端子电镀抗腐蚀性较为一般的电镀层，从而使得所述电连接器的所有导电端子的整体抗腐蚀性能良好，抗腐蚀时间长，所述电连接器的使用寿命更长。同时，虽然抗腐蚀性较强的电镀层的成本较高，但是所述电连接器通过选择性电镀能够最大程度地降低抗腐蚀性较强的电镀材料的用量，从而降低所述电连接器的电镀成本，故而所述电连接器既具有良好抗腐蚀性能且成本低。
可以理解的是，本申请实施例所述第一电镀层可为单一层结构，也可以为复合层结构。所述第二电镀层可为单一层结构，也可以为复合层结构。本申请实施例以所述第一电镀层为复合层结构、所述第二电镀层为复合层结构为例进行说明。
一种实施方式中，所述第一导电端子和所述第二导电端子可采用分体式料带设计，从 而满足分别电镀所述第一电镀层和所述第二电镀层的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，从而达到降低电镀成本和兼顾抗腐蚀性能的目的。其中，分体式料带设计是指，所有的所述第一导电端子均连接在第一料带上，所有的所述第二导电端子均连接在第二料带上，所述第一料带携带所有的所述第一导电端子进行浸镀以在所述第一导电端子上形成所述第一电镀层，所述第二料带携带所有的所述第二导电端子进行浸镀以在所述第二导电端子上形成第二电镀层，而后组装所述第一料带和所述第二料带以使所述第一导电端子和所述第二导电端子规律排列。
一种实施方式中，所述第一导电端子的通电电位高于所述第二导电端子的通电电位。所述第一导电端子可为高电位引脚(PIN)，例如VBUS、CC及SBU。所述第二导电端子可为低电位引脚(PIN)。所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性。由于通电电位高的所述第一导电端子相较于通电电位低的所述第二导电端子更容易发生腐蚀，因此使所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性能够均衡所述电连接器的整体抗腐蚀性能，所述电连接器的抗腐蚀时间长，使用寿命长。
一种实施方式中，所述第一电镀层具有铂系金属铑/钌/钯等贵金属。例如，所述第一电镀层具有铑钌合金材料。由于所述第一电镀层采用具有抗腐蚀能力的铂系金属铑/钌/钯等贵金属进行镀层方案的堆叠，因此所述第一电镀层能够大幅度提升所述第一导电端子的抗电解腐蚀能力和使用寿命，特别是潮湿带电环境下的抗电解腐蚀能力。由于所述第一电镀层被电镀在所述第一导电端子的外表面，所述第二导电端子的外表面所电镀的所述第二电镀层不同与所述第一电镀层，因此所述第一电镀层即使因电镀药水的固有属性而采用浸镀的方式，所需要的贵金属用量也能够得到合理控制，从而防止所述电连接器因贵金属用量增加而导致电镀成本急剧上升，使得铂系金属(例如铑钌)电镀抗电解腐蚀方案能够得到广泛应用和推广。
可以理解的是，所述第一电镀层中的铂系金属(例如铑钌)可形成在所述第一电镀层的堆叠层结构中的其中一层或几层。本申请实施例以铂系金属(例如铑钌)形成在所述第一电镀层的堆叠层结构中的其中一层为例进行说明。但是在其他实施例中，铂系金属(例如铑钌)形成在所述第一电镀层的堆叠层结构中的其中两层或更多层，以满足更高的抗腐蚀性能要求。
一种实施方式中，所述第一电镀层包括依次层叠在所述第一导电端子的外表面上的铜镀层、钨镍镀层、金镀层、钯镀层及铑钌镀层。所述第一电镀层通过水洗、活化、镀铜、镀钨镍、镀金、镀钯、镀铑钌、水洗及风干等一系列工艺制成，使所述铑钌镀层沉积在所述第一导电端子表面、所述第一电镀层远离所述第一导电端子的最外侧，从而达到提高所述第一导电端子抗腐蚀性的效果。
其中，所述铑钌镀层的厚度为0.25μm～2μm，以保证所述第一电镀层的抗腐蚀性能。
其中，所述第一电镀层的堆叠层结构中的其他各层结构厚度为：所述铜镀层的厚度为1μm～3μm；所述钨镍镀层的厚度为0.75μm～3μm；所述金镀层的厚度为0.05μm～0.5μm；所述钯镀层的厚度为0.5μm～2μm。
一种实施方式中，所述第二电镀层包括层叠设置的镍镀层和金镀层。所述第二电镀层可通过水洗、活化、镀镍、镀金、水洗及风干等一系列工艺制成。其中，所述镍镀层的厚 度大致为2.0μm，所述金镀层的厚度大致为0.076μm。所述第二电镀层电镀成本低，且能够满足所述第二导电端子作为低电位导电端子的抗腐蚀性需求。
可选的，本申请实施例所述电连接器为TYPE-C型USB(Universal Serial Bus，通用串行总线)接口。
在一种实施例中，所述电连接器为USB母座。所述USB母座包括中隔片及固定在所述中隔片相对两侧的上排导电端子组和下排导电端子组。所述上排导电端子组包括由第一支撑件固定的第一端子组件。所述第一端子组件包括至少一个所述第一导电端子和至少一个所述第二导电端子。所述下排导电端子组包括由第二支撑件固定的第二端子组件。所述第二端子组件与所述第一端子组件结构相同。
在另一种实施例中，所述电连接器为USB公头。所述USB公头包括卡扣(latch)和固定在所述卡扣相对两侧的上排导电端子组和下排导电端子组。所述上排导电端子组包括由第一支撑件固定的第一端子组件。所述第一端子组件包括至少一个所述第一导电端子和至少一个所述第二导电端子。所述下排导电端子组包括由第二支撑件固定的第二端子组件。所述第二端子组件与所述第一端子组件结构相同。所述第一支撑件扣合所述第二支撑件。所述卡扣用于扣入与所述USB公头对应的母座。
第二方面，本申请实施例还提供一种移动终端。所述移动终端包括上述实施例所述的电连接器。本申请实施例涉及的移动终端可以是任何具备通信和存储功能的设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
第三方面，本申请实施例还提供一种电连接器的制作方法。所述电连接器的制作方法可用于制作上述实施例所述的电连接器。
所述电连接器的制作方法包括：
提供第一料带和连接至所述第一料带的至少一个第一导电端子。在所述第一导电端子上电镀第一电镀层。所述第一料带和所述第一导电端子可通过冲压单一导电板件(例如铜板)形成。所述第一料带携带所有的所述第一导电端子进行电镀，以在所述第一导电端子上形成所述第一电镀层。
提供第二料带和连接至所述第二料带的至少一个第二导电端子。在所述第二导电端子上电镀第二电镀层，所述第二电镀层的材料与所述第一电镀层的材料不同。所述第二料带和所述第二导电端子可通过冲压单一导电板件(例如铜板)形成。所述第二料带携带所有的所述第二导电端子进行电镀，以在所述第二导电端子上形成所述第二电镀层。所述电连接器的所述第二电镀层的材料与所述第二电镀层的材料不同，使得所述第一导电端子和所述第二导电端子的抗腐蚀性能不同。
层叠所述第一料带和所述第二料带，以使所述第一导电端子和所述第二导电端子在同一平面上间隔地排列为一排，以形成第一端子组件。所述第二料带采用与所述第一料带相同的结构设计，以在层叠时快速实现彼此对位并提高层叠精度。
以及，通过埋入成型方式在所述第一端子组件上形成第一支撑件，所述第一支撑件固定连接所述第一导电端子和所述第二导电端子。所述第一支撑件采用绝缘材料。
在本申请实施例中，由于所述第一导电端子连接在所述第一料带上、所述第二导电端 子连接在所述第二料带上，因此能够分别对所述第一导电端子和所述第二导电端子进行电镀，以满足所述第一电镀层和所述第二电镀层各自的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，达到降低电镀成本和兼顾抗腐蚀性能的目的。通过埋入成型方式在所述第一端子组件上形成所述第一支撑件，从而能够提高所述第一支撑件的加工精度及与所述第一导电端子和所述第二导电端子之间的连接牢固度。
一种实施方式中，所述第一导电端子的通电电位高于所述第二导电端子的通电电位，所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性。所述第一导电端子可为高电位引脚(PIN)，例如VBUS、CC及SBU。由于通电电位高的所述第一导电端子相较于通电电位低的所述第二导电端子更容易发生腐蚀，因此使所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性能够均衡所述电连接器的整体抗腐蚀性能，所述电连接器的抗腐蚀时间长，使用寿命长。
一种实施方式中，在所述第一导电端子上电镀第一电镀层的过程包括：
在所述第一导电端子的外表面上电镀铜镀层。所述铜镀层的厚度为1μm～3μm。
在所述铜镀层上电镀钨镍镀层。所述钨镍镀层的厚度为0.75μm～3μm。
在所述钨镍镀层上电镀金镀层。所述金镀层的厚度为0.05μm～0.5μm。
在所述金镀层上电镀钯镀层。所述钯镀层的厚度为0.5μm～2μm。
以及，在所述钯镀层上电镀铑钌镀层。所述铑钌镀层的厚度为0.25μm～2μm。
在本实施例中，由于所述第一电镀层采用具有抗腐蚀能力的铂系金属铑/钌/钯等贵金属进行镀层方案的堆叠，因此所述第一电镀层能够大幅度提升所述第一导电端子的抗电解腐蚀能力和使用寿命，特别是潮湿带电环境下的抗电解腐蚀能力。由于所述第一电镀层被电镀在所述第一导电端子的外表面，所述第二导电端子的外表面所电镀的所述第二电镀层不同与所述第一电镀层，因此所述第一电镀层即使因电镀药水的固有属性而采用浸镀的方式，所需要的贵金属用量也能够得到合理控制，从而防止所述电连接器因贵金属用量增加而导致电镀成本急剧上升，使得铂系金属(例如铑钌)电镀抗电解腐蚀方案能够得到广泛应用和推广。
一种实施方式中，在电镀所述铜镀层之前，在所述第一导电端子上电镀第一电镀层的过程还包括：
对所述第一导电端子的外表面进行水洗。此时，所述第一导电端子的外表面具有较高的洁净度，以满足后续工艺的洁净需求。
以及，活化所述第一导电端子的外表面上的氧化膜。
在电镀所述铑钌镀层之后，在所述第一导电端子上电镀第一电镀层的过程还包括：
对所述铑钌镀层进行水洗和风干，以形成第一电镀层。
在本实施例中，所述第一电镀层通过水洗、活化、镀铜、镀钨镍、镀金、镀钯、镀铑钌、水洗及风干等一系列工艺制成，使所述铑钌镀层沉积在所述第一导电端子表面、所述第一电镀层远离所述第一导电端子的最外侧，从而达到提高所述第一导电端子抗腐蚀性的效果。
一种实施方式中，在所述第二导电端子上电镀第二电镀层的过程包括：
在所述第二导电端子的外表面上电镀镍镀层。所述镍镀层的厚度大致为2.0μm。在电 镀所述镍镀层之前，对所述第二导电端子的外表面进行水洗，并活化所述第二导电端子的外表面上的氧化膜。
以及，在所述镍镀层上电镀金镀层，以形成第二电镀层。所述金镀层的厚度大致为0.076μm。在形成所述金镀层后，对所述金镀层进行水洗和风干。
在本实施例中，所述第二电镀层电镀成本低，且能够满足所述第二导电端子作为低电位导电端子的抗腐蚀性需求。
一种实施方式中，所述提供第一料带和连接至所述第一料带的至少一个第一导电端子包括：冲压第一导电板以形成第一料带和至少一个第一导电端子。其中，所述第一料带具有第一本部及第一连接部，所述第一连接部连接在所述第一本部与所述第一导电端子之间。所述第一导电端子偏离所述第一本部第一距离(也即所述第一导电端子与所述第一本部之间的间隙宽为第一距离)。所述第一本部具有第一厚度。
所述提供第二料带和连接至所述第二料带的至少一个第二导电端子包括：冲压第二导电板以形成第二料带和至少一个第二导电端子。其中，所述第二料带具有第二本部及第二连接部，所述第二连接部连接在所述第二本部与所述第二导电端子之间。所述第二导电端子偏离所述第二本部第二距离(也即所述第二导电端子与所述第二本部之间的间隙宽为第二距离)。所述第二距离等于所述第一距离与所述第一厚度的和或差。
层叠所述第一料带和所述第二料带时，若所述第二距离等于所述第一距离与所述第一厚度的和，则所述第二料带层叠在所述第一料带的远离所述第一导电端子的一侧，所述第二导电端子穿过所述第一料带并与所述第一导电端子并排。若所述第二距离等于所述第一距离与所述第一厚度的差，则所述第二料带层叠在所述第一料带的靠近所述第一导电端子的一侧，所述第一导电端子穿过所述第二料带并与所述第二导电端子并排。
一种实施方式中，所述第一料带上具有第一定位孔，所述第二料带上具有第二定位孔。层叠所述第一料带和所述第二料带时，所述第一定位孔对齐所述第二定位孔。在一种实施例中，可通过成型机上的送料机构顶针来对位所述第一定位孔和所述第二定位孔，以使所述第一导电端子与所述第二导电端子彼此之间的定位准确，并且均能够准确地定位在所述成型机上，从而保证通过埋入成型工艺所形成的所述第一支撑件的尺寸满足规格要求，所述第一支撑件本身尺寸、所述第一支撑件与所述第一导电端子之间的相对位置以及所述第一支撑件与所述第二导电端子之间的相对位置均具有较高的精确度，提高了所述电连接器的产品良率。
一种实施方式中，所述电连接器的制作方法还包括：
在形成所述第一支撑件后，切除所述第一料带和所述第二料带，以形成电连接器。
在本实施例中，所述电连接器的制作方法通过分别电镀所述第一导电端子和所述第二导电端子，然后组装所述第一导电端子和所述第二导电端子，接着成型所述第一支撑件，最后切除所述第一料带和所述第二料带的方式形成所述电连接器，使得所述电连接器在兼顾抗腐蚀性的同时，大幅度地降低了电镀成本。
一种实施方式中，所述电连接器的制作方法还包括：
提供第三料带和连接在所述第三料带上的至少一个第三导电端子。在所述第三导电端子上电镀第三电镀层。所述第三料带和所述第三导电端子可通过冲压单一导电板件(例如 铜板)形成。所述第三料带携带所有的所述第三导电端子进行电镀，以在所述第三导电端子上形成所述第三电镀层。
提供第四料带和连接在所述第四料带上的至少一个第四导电端子。在所述第四导电端子上电镀第四电镀层，所述第四电镀层的材料与所述第三电镀层的材料不同。所述第四料带和所述第四导电端子可通过冲压单一导电板件(例如铜板)形成。所述第四料带携带所有的所述第四导电端子进行电镀，以在所述第四导电端子上形成所述第四电镀层。所述电连接器的所述第四电镀层的材料与所述第三电镀层的材料不同，使得所述第四导电端子和所述第三导电端子的抗腐蚀性能不同。
层叠所述第三料带和所述第四料带，以使所述第三导电端子和所述第四导电端子在同一平面上间隔地排列为一排，以形成第二端子组件。所述第四料带采用与所述第三料带相同的结构设计，以在层叠时快速实现彼此对位并提高层叠精度。
通过埋入成型方式在所述第二端子组件上形成第二支撑件，所述第二支撑件固定连接所述第三导电端子和所述第四导电端子。所述第二支撑件采用绝缘材料。
以及，组装所述第一支撑件与所述第二支撑件，以使所述第一端子组件与所述第二端子组件背对背设置。所述第一支撑件和所述第二支撑件使所述第一端子组件与所述第二端子组件之间彼此绝缘。
在本申请实施例中，通过所述电连接器的制作方法能够形成具有双排导电端子的电连接器。由于所述电连接器的制作方法能够分别对所述第一导电端子、所述第二导电端子、所述第三导电端子、所述第四导电端子进行电镀，以满足各个导电端子各自的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，达到降低电镀成本和兼顾抗腐蚀性能的目的。通过埋入成型方式在所述第一端子组件上形成所述第一支撑件，在所述第二端子组件上形成所述第二支撑件，能够提高所述第一支撑件和所述第二支撑件的加工精度，从而提高所述电连接器的产品良率。
其中，所述组装所述第一支撑件和所述第二支撑件包括：
依次层叠所述第一支撑件、中隔片及所述第二支撑件。
以及，将通过埋入成型方式使所述第一支撑件、所述中隔片及所述第二支撑件彼此固定。
在本实施例中，所述电连接器的制作方法用于制成作为母座的电连接器。
或者，所述组装所述第一支撑件和所述第二支撑件包括：
提供卡扣。所述卡扣用于扣入与所述电连接器对应的配合连接器。
以及，将所述第一支撑件与所述第二支撑件分别扣合在所述卡扣的相对两侧。所述第一支撑件扣合所述第二支撑件。例如，所述第一支撑件上设有凸起，所述第二支撑件上设有凹槽，所述凸起穿过所述卡扣以卡入所述凹槽，从而实现彼此固定。
在本实施例中，所述电连接器的制作方法用于制成作为公头的电连接器。
一种实施方式中，在组装完所述第一支撑件与所述第二支撑件后，所述电连接器的制作方法还包括：
切除所述第一料带、所述第二料带、所述第三料带及所述第四料带，以形成电连接器。
在本实施例中，由于所述第一料带、所述第二料带、所述第三料带及所述第四料带采 用相同的结构设计且彼此层叠设置，因此可通过一次性裁切方式去除所述第一料带、所述第二料带、所述第三料带及所述第四料带，裁切效率高。本申请实施例中先组装所述第一支撑件和所述第二支撑件、后切除所述第一料带、所述第二料带、所述第三料带及所述第四料带的方式，适用于制成作为公头的电连接器或制成作为母头的电连接器的过程。
当然，在其他实施方式中，在分别形成所述第一支撑件和所述第二支撑件后，且在组装所述第一支撑件与所述第二支撑件之前，所述电连接器的制作方法还包括：
切除所述第一料带、所述第二料带、所述第三料带及所述第四料带。
在本实施例中，所述电连接器的制作方法通过先切除所述第一料带、所述第二料带、所述第三料带及所述第四料带，后组装所述第一支撑件与所述第二支撑件的方式形成所述电连接器。本实施例适用于制成作为公头的电连接器的过程。
一种实施方式中，所述第一端子组件与所述第二端子组件相同，以使所述电连接器形成TYPE-C型USB接口。具体而言，所述第一导电端子与所述第三导电端子相同，所述第一电镀层与所述第三电镀层的材料相同。所述第二导电端子与所述第四导电端子相同，所述第二电镀层与所述第四电镀层相同。所述第一导电端子和所述第二导电端子的排布规律，与所述第三导电端子和所述第四导电端子的排布规律相同。
附图说明
图1是本申请实施例提供的一种电连接器的制作方法的示意图一；
图2是本申请实施例提供的一种电连接器的制作方法的示意图二；
图3是本申请实施例提供的一种电连接器的制作方法的示意图三；
图4是本申请实施例提供的一种电连接器的制作方法的示意图四；
图5是本申请实施例提供的另一种电连接器的制作方法的示意图一；
图6是本申请实施例提供的另一种电连接器的制作方法的示意图二；
图7是本申请实施例提供的另一种电连接器的制作方法的示意图三；
图8是本申请实施例提供的另一种电连接器的制作方法的示意图四；
图9是本申请实施例提供的第一导电端子和第一电镀层的结构示意图；
图10是本申请实施例提供的第二导电端子和第二电镀层的结构示意图；
图11是本申请实施例提供的一种移动终端的结构示意图；
图12是本申请实施例提供的一种数据线的结构示意图；
图13是图1中第一图的侧视图和第二图的侧视图；
图14是图5中第一图的侧视图和第二图的侧视图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请结合参阅图4和图8，本申请实施例提供一种电连接器100。所述电连接器100包括多个导电端子。所述多个导电端子中包括至少一个第一导电端子1和至少一个第二导电端子2。所述第一导电端子1和所述第二导电端子2采用导电材质制成，以实现电连接作用。 所述第一导电端子1的外表面设有第一电镀层11。所述第一电镀层11具有抗腐蚀性，用于防止所述第一导电端子1腐蚀。所述第二导电端子2的外表面设有第二电镀层21。所述第二电镀层21具有抗腐蚀性，用于防止所述第二导电端子2腐蚀。所述第二电镀层21的材料与所述第一电镀层11的材料不同。材料不同的电镀层的抗腐蚀性能(材料抵抗周围介质腐蚀破坏作用的能力)不同。
在本申请实施例中，所述电连接器100的所述第一电镀层11的材料与所述第二电镀层21的材料不同，使得所述第一导电端子1和所述第二导电端子2的抗腐蚀性能不同，因此所述电连接器100的导电端子可实现选择性电镀，以不同的电镀满足不同应用环境下的要求，例如对较为容易腐蚀的导电端子电镀抗腐蚀性较强的电镀层(例如具有抗腐蚀性强的贵金属的电镀层)、对较为不容易腐蚀的导电端子电镀抗腐蚀性较为一般的电镀层，从而使得所述电连接器100的所有导电端子的整体抗腐蚀性能良好，抗腐蚀时间长，所述电连接器100的使用寿命更长。同时，虽然抗腐蚀性较强的电镀层的成本较高，但是所述电连接器100通过选择性电镀能够最大程度地降低抗腐蚀性较强的电镀材料的用量，从而降低所述电连接器100的电镀成本，故而所述电连接器100既具有良好抗腐蚀性能且成本低。
可以理解的是，本申请实施例所述第一电镀层11可为单一层结构，也可以为复合层结构。所述第二电镀层21可为单一层结构，也可以为复合层结构。本申请实施例以所述第一电镀层11为复合层结构、所述第二电镀层21为复合层结构为例进行说明。
可选的，请结合参阅图1和图5，所述第一导电端子1和所述第二导电端子2可采用分体式料带设计，从而满足分别电镀所述第一电镀层11和所述第二电镀层21的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，从而达到降低电镀成本和兼顾抗腐蚀性能的目的。其中，分体式料带设计是指，所有的所述第一导电端子1均连接在第一料带10上，所有的所述第二导电端子2均连接在第二料带20上，所述第一料带10携带所有的所述第一导电端子1进行浸镀以在所述第一导电端子1上形成所述第一电镀层11，所述第二料带20携带所有的所述第二导电端子2进行浸镀以在所述第二导电端子2上形成第二电镀层21，而后组装所述第一料带10和所述第二料带20以使所述第一导电端子1和所述第二导电端子2规律排列。
作为一种可选实施例，请结合参阅图1、图5、图9以及图10，所述第一导电端子1的通电电位高于所述第二导电端子2的通电电位。所述第一导电端子1可为高电位引脚(PIN)，例如VBUS、CC及SBU。所述第二导电端子2可为低电位引脚(PIN)。所述第一电镀层11的耐腐蚀性高于所述第二电镀层21的耐腐蚀性。
由于通电电位高的所述第一导电端子1相较于通电电位低的所述第二导电端子2更容易发生腐蚀，因此使所述第一电镀层11的耐腐蚀性高于所述第二电镀层21的耐腐蚀性能够均衡所述电连接器100的整体抗腐蚀性能，所述电连接器100的抗腐蚀时间长，使用寿命长。
可选的，所述第一电镀层11具有铂系金属铑/钌/钯等贵金属。例如，所述第一电镀层11具有铑钌合金材料。由于所述第一电镀层11采用具有抗腐蚀能力的铂系金属铑/钌/钯等贵金属进行镀层方案的堆叠，因此所述第一电镀层11能够大幅度提升所述第一导电端子1的抗电解腐蚀能力和使用寿命，特别是潮湿带电环境下的抗电解腐蚀能力。由于所述第一 电镀层11被电镀在所述第一导电端子1的外表面，所述第二导电端子2的外表面所电镀的所述第二电镀层21不同与所述第一电镀层11，因此所述第一电镀层11即使因电镀药水的固有属性而采用浸镀的方式，所需要的贵金属用量也能够得到合理控制，从而防止所述电连接器100因贵金属用量增加而导致电镀成本急剧上升，使得铂系金属(例如铑钌)电镀抗电解腐蚀方案能够得到广泛应用和推广。
可以理解的是，所述第一电镀层11中的铂系金属(例如铑钌)可形成在所述第一电镀层11的堆叠层结构中的其中一层或几层。本申请实施例以铂系金属(例如铑钌)形成在所述第一电镀层11的堆叠层结构中的其中一层为例进行说明。但是在其他实施例中，铂系金属(例如铑钌)形成在所述第一电镀层11的堆叠层结构中的其中两层或更多层，以满足更高的抗腐蚀性能要求。
可选的，如图9所示，所述第一电镀层11包括依次层叠在所述第一导电端子1的外表面上的铜镀层111、钨镍镀层112、金镀层113、钯镀层114及铑钌镀层115。所述第一电镀层11通过水洗、活化、镀铜、镀钨镍、镀金、镀钯、镀铑钌、水洗及风干等一系列工艺制成，使所述铑钌镀层115沉积在所述第一导电端子1表面、所述第一电镀层11远离所述第一导电端子1的最外侧，从而达到提高所述第一导电端子1抗腐蚀性的效果。
其中，所述铑钌镀层115的厚度为0.25μm～2μm，以保证所述第一电镀层11的抗腐蚀性能。
进一步地，所述第一电镀层11的堆叠层结构中的其他各层结构厚度为：所述铜镀层111的厚度为1μm～3μm；所述钨镍镀层112的厚度为0.75μm～3μm；所述金镀层113的厚度为0.05μm～0.5μm；所述钯镀层114的厚度为0.5μm～2μm。
可选的，如图10所示，所述第二电镀层21包括层叠设置的镍镀层211和金镀层212。所述第二电镀层21可通过水洗、活化、镀镍、镀金、水洗及风干等一系列工艺制成。其中，所述镍镀层211的厚度大致为2.0μm，所述金镀层212的厚度大致为0.076μm。所述第二电镀层21电镀成本低，且能够满足所述第二导电端子2作为低电位导电端子的抗腐蚀性需求。
可以理解的是，本申请实施例所述电连接器100可为公头或母座。例如，如图11所示，所述电连接器100可应用在移动终端200，所述电连接器100为母座。如图12所示，所述电连接器100可应用于数据线300中，所述电连接器100为数据线300的母座，连接数据线300的传输线。所述电连接器100还可应用在充电器、移动电源、灯具等设备中。
可选的，本申请实施例所述电连接器100为TYPE-C型USB(Universal Serial Bus，通用串行总线)接口。
在一种实施例中，请结合参阅图1至图4，所述电连接器100为USB母座。所述USB母座包括中隔片8(Midplate)及固定在所述中隔片8相对两侧的上排导电端子组和下排导电端子组。所述上排导电端子组包括由第一支撑件5固定的第一端子组件(1、2)。所述第一端子组件(1、2)包括至少一个所述第一导电端子1和至少一个所述第二导电端子2。所述下排导电端子组包括由第二支撑件6固定的第二端子组件(3、4)。所述第二端子组件(3、4)与所述第一端子组件(1、2)结构相同。
在另一种实施例中，请结合参阅图5至图8，所述电连接器100为USB公头。所述USB 公头包括卡扣7(latch)和固定在所述卡扣7相对两侧的上排导电端子组和下排导电端子组。所述上排导电端子组包括由第一支撑件5固定的第一端子组件(1、2)。所述第一端子组件(1、2)包括至少一个所述第一导电端子1和至少一个所述第二导电端子2。所述下排导电端子组包括由第二支撑件6固定的第二端子组件(3、4)。所述第二端子组件(3、4)与所述第一端子组件(1、2)结构相同。所述第一支撑件5扣合所述第二支撑件6。所述卡扣7用于扣入与所述USB公头对应的母座。
可以理解的是，所述USB母座和USB公头的端子组件中导电端子的排布、第一支撑件5的结构及第二支撑件6的结构并不限定是一致的，而是依据各自的具体需求进行独立设计。
请参阅图11，本申请实施例还提供一种移动终端200。所述移动终端200包括上述实施例所述的电连接器100。本申请实施例涉及的移动终端200可以是任何具备通信和存储功能的设备，例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
本申请实施例还提供一种电连接器的制作方法。所述电连接器的制作方法可用于制作上述实施例所述的电连接器100。
请参阅图1和图5，所述电连接器的制作方法包括：
S01：提供第一料带10和连接至所述第一料带10的至少一个第一导电端子1。在所述第一导电端子1上电镀第一电镀层11。所述第一料带10和所述第一导电端子1可通过冲压单一导电板件(例如铜板)形成。所述第一料带10携带所有的所述第一导电端子1进行电镀，以在所述第一导电端子1上形成所述第一电镀层11。
S02：提供第二料带20和连接至所述第二料带20的至少一个第二导电端子2。在所述第二导电端子2上电镀第二电镀层21，所述第二电镀层21的材料与所述第一电镀层11的材料不同。所述第二料带20和所述第二导电端子2可通过冲压单一导电板件(例如铜板)形成。所述第二料带20携带所有的所述第二导电端子2进行电镀，以在所述第二导电端子2上形成所述第二电镀层21。所述电连接器100的所述第二电镀层21的材料与所述第二电镀层21的材料不同，使得所述第一导电端子1和所述第二导电端子2的抗腐蚀性能不同。
S03：层叠所述第一料带10和所述第二料带20，以使所述第一导电端子1和所述第二导电端子2在同一平面上间隔地排列为一排，以形成第一端子组件(1、2)。所述第二料带20采用与所述第一料带10相同的结构设计，以在层叠时快速实现彼此对位并提高层叠精度。
S04：通过埋入成型(Insert molding)方式在所述第一端子组件(1、2)上形成第一支撑件5，所述第一支撑件5固定连接所述第一导电端子1和所述第二导电端子2。所述第一支撑件5采用绝缘材料。
在本申请实施例中，由于所述第一导电端子1连接在所述第一料带10上、所述第二导电端子2连接在所述第二料带20上，因此能够分别对所述第一导电端子1和所述第二导电端子2进行电镀，以满足所述第一电镀层11和所述第二电镀层21各自的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，达到降低电镀成本和兼顾抗腐蚀性能的目的。通过埋入成型方式在所述第一端子组件(1、2)上形成所述第一支 撑件5，从而能够提高所述第一支撑件5的加工精度及与所述第一导电端子1和所述第二导电端子2之间的连接牢固度。
可选的，所述第一导电端子1的通电电位高于所述第二导电端子2的通电电位，所述第一电镀层11的耐腐蚀性高于所述第二电镀层21的耐腐蚀性。所述第一导电端子1可为高电位引脚(PIN)，例如VBUS、CC及SBU。由于通电电位高的所述第一导电端子1相较于通电电位低的所述第二导电端子2更容易发生腐蚀，因此使所述第一电镀层11的耐腐蚀性高于所述第二电镀层21的耐腐蚀性能够均衡所述电连接器100的整体抗腐蚀性能，所述电连接器100的抗腐蚀时间长，使用寿命长。
可选的，请参阅图9，在所述第一导电端子1上电镀第一电镀层11的过程包括：
S013：在所述第一导电端子1的外表面上电镀铜镀层111。所述铜镀层111的厚度为1μm～3μm。
S014：在所述铜镀层111上电镀钨镍镀层112。所述钨镍镀层112的厚度为0.75μm～3μm。
S015：在所述钨镍镀层112上电镀金镀层113。所述金镀层113的厚度为0.05μm～0.5μm。
S016：在所述金镀层113上电镀钯镀层114。所述钯镀层114的厚度为0.5μm～2μm。
S017：在所述钯镀层114上电镀铑钌镀层115。所述铑钌镀层115的厚度为0.25μm～2μm。
在本实施例中，由于所述第一电镀层11采用具有抗腐蚀能力的铂系金属铑/钌/钯等贵金属进行镀层方案的堆叠，因此所述第一电镀层11能够大幅度提升所述第一导电端子1的抗电解腐蚀能力和使用寿命，特别是潮湿带电环境下的抗电解腐蚀能力。由于所述第一电镀层11被电镀在所述第一导电端子1的外表面，所述第二导电端子2的外表面所电镀的所述第二电镀层21不同与所述第一电镀层11，因此所述第一电镀层11即使因电镀药水的固有属性而采用浸镀的方式，所需要的贵金属用量也能够得到合理控制，从而防止所述电连接器100因贵金属用量增加而导致电镀成本急剧上升，使得铂系金属(例如铑钌)电镀抗电解腐蚀方案能够得到广泛应用和推广。
在电镀所述铜镀层111之前，在所述第一导电端子1上电镀第一电镀层11的过程还包括：
S011：对所述第一导电端子1的外表面进行水洗。此时，所述第一导电端子1的外表面具有较高的洁净度，以满足后续工艺的洁净需求。
S012：活化所述第一导电端子1的外表面上的氧化膜。
在电镀所述铑钌镀层115之后，在所述第一导电端子1上电镀第一电镀层11的过程还包括：
S018：对所述铑钌镀层115进行水洗和风干，以形成第一电镀层11。
在本实施例中，所述第一电镀层11通过水洗、活化、镀铜、镀钨镍、镀金、镀钯、镀铑钌、水洗及风干等一系列工艺制成，使所述铑钌镀层115沉积在所述第一导电端子1表面、所述第一电镀层11远离所述第一导电端子1的最外侧，从而达到提高所述第一导电端子1抗腐蚀性的效果。
可选的，请结合参阅图10，在所述第二导电端子2上电镀第二电镀层21的过程包括：
S021：在所述第二导电端子2的外表面上电镀镍镀层211。所述镍镀层211的厚度大致为2.0μm。在电镀所述镍镀层211之前，对所述第二导电端子2的外表面进行水洗，并活化所述第二导电端子2的外表面上的氧化膜。
S022：在所述镍镀层211上电镀金镀层212，以形成第二电镀层21。所述金镀层212的厚度大致为0.076μm。在形成所述金镀层212后，对所述金镀层212进行水洗和风干。
在本实施例中，所述第二电镀层21电镀成本低，且能够满足所述第二导电端子2作为低电位导电端子的抗腐蚀性需求。
可选的，请结合参阅图1、图5、图13以及图14，所述提供第一料带10和连接至所述第一料带10的至少一个第一导电端子1包括：冲压第一导电板以形成第一料带10和至少一个第一导电端子1。其中，所述第一料带10具有第一本部101及第一连接部102，所述第一连接部102连接在所述第一本部101与所述第一导电端子1之间。所述第一导电端子1偏离所述第一本部101第一距离S1。所述第一本部101具有第一厚度T。
请结合参阅图3和图12，所述提供第二料带20和连接至所述第二料带20的至少一个第二导电端子2包括：冲压第二导电板以形成第二料带20和至少一个第二导电端子2。其中，所述第二料带20具有第二本部201及第二连接部202，所述第二连接部202连接在所述第二本部201与所述第二导电端子2之间。所述第二导电端子2偏离所述第二本部201第二距离S2。所述第二本部201的厚度与所述第一厚度T相等。所述第二距离S2等于所述第一距离S1与所述第一厚度T的和或差。
层叠所述第一料带10和所述第二料带20时，若所述第二距离S2等于所述第一距离S1与所述第一厚度T的和，则所述第二料带20层叠在所述第一料带10的远离所述第一导电端子1的一侧，所述第二导电端子2穿过所述第一料带10并与所述第一导电端子1并排。若所述第二距离S2等于所述第一距离S1与所述第一厚度T的差，则所述第二料带20层叠在所述第一料带10的靠近所述第一导电端子1的一侧，所述第一导电端子1穿过所述第二料带20并与所述第二导电端子2并排。所述第一导电板可为铜板。所述第二导电板可为铜板。
可选的，请参阅图1和图5，所述第一料带10上具有第一定位孔103，所述第二料带20上具有第二定位孔203。层叠所述第一料带10和所述第二料带20时，所述第一定位孔103对齐所述第二定位孔203。在一种实施例中，可通过成型机上的送料机构顶针9来对位所述第一定位孔103和所述第二定位孔203，以使所述第一导电端子1与所述第二导电端子2彼此之间的定位准确，并且均能够准确地定位在所述成型机上，从而保证通过埋入成型工艺所形成的所述第一支撑件5的尺寸满足规格要求，所述第一支撑件5本身尺寸、所述第一支撑件5与所述第一导电端子1之间的相对位置以及所述第一支撑件5与所述第二导电端子2之间的相对位置均具有较高的精确度，提高了所述电连接器100的产品良率。
在一种实施例中，所述电连接器的制作方法还包括：
S05：在形成所述第一支撑件5后，切除所述第一料带10和所述第二料带20，以形成电连接器100。
在本实施例中，所述电连接器的制作方法通过分别电镀所述第一导电端子1和所述第 二导电端子2，然后组装所述第一导电端子1和所述第二导电端子2，接着成型所述第一支撑件5，最后切除所述第一料带10和所述第二料带20的方式形成所述电连接器100，使得所述电连接器100在兼顾抗腐蚀性的同时，大幅度地降低了电镀成本。
在另一种实施例中，请结合参阅图1至图8，所述电连接器的制作方法还包括：
S01’：提供第三料带30和连接在所述第三料带30上的至少一个第三导电端子3。在所述第三导电端子3上电镀第三电镀层31。所述第三料带30和所述第三导电端子3可通过冲压单一导电板件(例如铜板)形成。所述第三料带30携带所有的所述第三导电端子3进行电镀，以在所述第三导电端子3上形成所述第三电镀层31。
S02’：提供第四料带40和连接在所述第四料带40上的至少一个第四导电端子4。在所述第四导电端子4上电镀第四电镀层41，所述第四电镀层41的材料与所述第三电镀层31的材料不同。所述第四料带40和所述第四导电端子4可通过冲压单一导电板件(例如铜板)形成。所述第四料带40携带所有的所述第四导电端子4进行电镀，以在所述第四导电端子4上形成所述第四电镀层41。所述电连接器100的所述第四电镀层41的材料与所述第三电镀层31的材料不同，使得所述第四导电端子4和所述第三导电端子3的抗腐蚀性能不同。
S03’：层叠所述第三料带30和所述第四料带40，以使所述第三导电端子3和所述第四导电端子4在同一平面上间隔地排列为一排，以形成第二端子组件(3、4)。所述第四料带40采用与所述第三料带30相同的结构设计，以在层叠时快速实现彼此对位并提高层叠精度。
S04’：通过埋入成型(Insert molding)方式在所述第二端子组件(3、4)上形成第二支撑件6，所述第二支撑件6固定连接所述第三导电端子3和所述第四导电端子4。所述第二支撑件6采用绝缘材料。可通过成型机上的送料机构顶针9来对位所述第三料带30的定位孔303和所述第四料带40的定位孔403。
S051：组装所述第一支撑件5与所述第二支撑件6，以使所述第一端子组件(1、2)与所述第二端子组件(3、4)背对背设置。所述第一支撑件5和所述第二支撑件6使所述第一端子组件(1、2)与所述第二端子组件(3、4)之间彼此绝缘。
在本申请实施例中，通过所述电连接器的制作方法能够形成具有双排导电端子的电连接器100。由于所述电连接器的制作方法能够分别对所述第一导电端子1、所述第二导电端子2、所述第三导电端子3、所述第四导电端子4进行电镀，以满足各个导电端子各自的电镀需求，从而大大降低成本高的电镀材料(例如抗腐蚀性强的贵金属)的用量，达到降低电镀成本和兼顾抗腐蚀性能的目的。通过埋入成型方式在所述第一端子组件(1、2)上形成所述第一支撑件5，在所述第二端子组件(3、4)上形成所述第二支撑件6，能够提高所述第一支撑件5和所述第二支撑件6的加工精度，从而提高所述电连接器100的产品良率。
可选的，如图1所示，在步骤S01中，所述第一导电端子1的远离所述第一料带10的一端还连接有第一副料带12。换言之，所述第一导电端子1连接在所述第一料带10与所述第一副料带12之间，所述第一副料带12用以保持所述第一导电端子1，从而提高所述第一导电端子1的加工精度及后续的装配质量。在形成所述第一支撑件5后即可切除所述第一副料带12。例如，在形成所述第一支撑件5后且在组装所述第一支撑件5与所述第二支撑件6(步骤S051)之前，先切除所述第一副料带12。
当然，在步骤S02中，所述第二导电端子2的远离所述第二料带20的一端也可连接有第二副料带22。在形成所述第一支撑件5后切除所述第二副料带22。在步骤S01’中，所述第三导电端子3的远离所述第三料带30的一端也可连接有第三副料带。在形成所述第二支撑件6后切除所述第三副料带。在步骤S02’中，所述第四导电端子4的远离所述第四料带40的一端也可连接有第四副料带。在形成所述第二支撑件6后切除所述第四副料带。
在一种可选实施例中，请结合参阅图1至图3，所述组装所述第一支撑件5和所述第二支撑件6包括：
S0511：依次层叠所述第一支撑件5、中隔片8(Midplate)及所述第二支撑件6。
S0512：通过埋入成型方式使所述第一支撑件5、所述中隔片8及所述第二支撑件6彼此固定。
在本实施例中，所述电连接器的制作方法用于制成作为母座的电连接器100。
另一种可选实施例中，请结合参阅图5至图7所示，所述组装所述第一支撑件5和所述第二支撑件6包括：
S0511：提供卡扣7(latch)。所述卡扣7用于扣入与所述电连接器100对应的配合连接器。
S0512：将所述第一支撑件5与所述第二支撑件6分别扣合在所述卡扣7的相对两侧。所述第一支撑件5扣合所述第二支撑件6。例如，所述第一支撑件5上设有凸起，所述第二支撑件6上设有凹槽，所述凸起穿过所述卡扣7以卡入所述凹槽，从而实现彼此固定。
在本实施例中，所述电连接器的制作方法用于制成作为公头的电连接器100。
可选的，在组装完所述第一支撑件5与所述第二支撑件6后，所述电连接器的制作方法还包括：
S052：切除所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40，以形成电连接器100。
在本实施例中，由于所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40采用相同的结构设计且彼此层叠设置，因此可通过一次性裁切方式去除所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40，裁切效率高。本申请实施例中先组装所述第一支撑件5和所述第二支撑件6、后切除所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40的方式，适用于制成作为公头的电连接器100或制成作为母头的电连接器100的过程，如图3、图4、图7以及图8所示。
当然，在其他实施方式中，在分别形成所述第一支撑件5和所述第二支撑件6后，且在组装所述第一支撑件5与所述第二支撑件6之前，所述电连接器的制作方法还包括：
切除所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40。
在本实施例中，所述电连接器的制作方法通过先切除所述第一料带10、所述第二料带20、所述第三料带30及所述第四料带40，后组装所述第一支撑件5与所述第二支撑件6的方式形成所述电连接器100。本实施例适用于制成作为公头的电连接器100的过程。
可选的，所述第一端子组件(1、2)与所述第二端子组件(3、4)相同，以使所述电连接器100形成TYPE-C型USB(Universal Serial Bus，通用串行总线)接口。具体而言，所述第一导电端子1与所述第三导电端子3相同，所述第一电镀层11与所述第三电镀层31 的材料相同。所述第二导电端子2与所述第四导电端子4相同，所述第二电镀层21与所述第四电镀层41相同。所述第一导电端子1和所述第二导电端子2的排布规律，与所述第三导电端子3和所述第四导电端子4的排布规律相同。
换言之，在一种实施方式中，连接器母座的上、下排端子采用同样的料带设计。端子采用分体式料带(参考所述第一料带10和所述第二料带20)冲压后，分别进行铑钌(参考所述第一电镀层11)和常规镀层(参考所述第二电镀层21)。制程上以下列几步进行成型：
1.在进行上、下排端子埋入成型时，以成型机上的送料机构顶针对位分体式料带的定位孔，使分体式料带的导电端子定位后，在进行埋入成型以确保埋入成型后的尺寸满足规格要求。
2.上下成型件再与中隔片(midplate)一起进行舌片成型，完成成型后切除料带。完成的舌片如图4所示，相较于过去全镀常规电镀的舌片，在VBUS、CC、SBU端子上采用铑钌电镀，其他端子为常规电镀，两者之间的差异见图4。细部的制程见图1至图4。
在另一种实施方式中，连接器公头的上排和下排端子，一样采用分体式料带(参考所述第一料带10和所述第二料带20)冲压后，分别进行铑钌(参考所述第一电镀层11)和常规(参考所述第二电镀层21)镀层，制程上以下列几步进行成型：
1.在进行上、下排端子埋入成型时，以成型机上的送料机构顶针对位分体式料带的定位孔，使分体式料带的导电端子定位后，在进行埋入成型以确保埋入成型后的尺寸满足规格要求。
2.完成上下排端子的成型后，上下排端子与卡扣(latch)组装后裁切料带(或将料带裁切后与卡扣进行组装)，完成连接器公端的三合一半成品。相较过去全镀常规电镀的公头，在VBUS端子上采用铑钌电镀，其余端子都是常规电镀，两者之间的差异见图8。细部的制程见图5至图8。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种电连接器，其特征在于，包括至少一个第一导电端子和至少一个第二导电端子，所述第一导电端子的外表面设有第一电镀层，所述第二导电端子的外表面设有第二电镀层，所述第二电镀层的材料与所述第一电镀层的材料不同。
  2. 根据权利要求1所述的电连接器，其特征在于，所述第一导电端子的通电电位高于所述第二导电端子的通电电位，所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性。
  3. 根据权利要求2所述的电连接器，其特征在于，所述第一电镀层具有铑钌合金材料。
  4. 根据权利要求3所述的电连接器，其特征在于，所述第一电镀层包括依次层叠在所述第一导电端子的外表面上的铜镀层、钨镍镀层、金镀层、钯镀层及铑钌镀层。
  5. 根据权利要求3或4所述的电连接器，其特征在于，所述铑钌镀层的厚度为0.25μm～2μm。
  6. 根据权利要求2～4任一项所述的电连接器，其特征在于，所述第二电镀层包括层叠设置的镍镀层和金镀层。
  7. 一种移动终端，其特征在于，包括权利要求1～6任一项所述的电连接器。
  8. 一种电连接器的制作方法，其特征在于，包括：
    提供第一料带和连接至所述第一料带的至少一个第一导电端子，在所述第一导电端子上电镀第一电镀层；
    提供第二料带和连接至所述第二料带的至少一个第二导电端子，在所述第二导电端子上电镀第二电镀层，所述第二电镀层的材料与所述第一电镀层的材料不同；
    层叠所述第一料带和所述第二料带，以使所述第一导电端子和所述第二导电端子在同一平面上间隔地排列为一排，以形成第一端子组件；以及
    通过埋入成型方式在所述第一端子组件上形成第一支撑件，所述第一支撑件固定连接所述第一导电端子和所述第二导电端子。
  9. 根据权利要求8所述的电连接器的制作方法，其特征在于，所述第一导电端子的通电电位高于所述第二导电端子的通电电位，所述第一电镀层的耐腐蚀性高于所述第二电镀层的耐腐蚀性。
  10. 根据权利要求9所述的电连接器的制作方法，其特征在于，在所述第一导电端子上电镀第一电镀层的过程包括：
    在所述第一导电端子的外表面上电镀铜镀层；
    在所述铜镀层上电镀钨镍镀层；
    在所述钨镍镀层上电镀金镀层；
    在所述金镀层上电镀钯镀层；以及
    在所述钯镀层上电镀铑钌镀层。
  11. 根据权利要求10所述的电连接器的制作方法，其特征在于，在电镀所述铜镀层之前，在所述第一导电端子上电镀第一电镀层的过程还包括：
    对所述第一导电端子的外表面进行水洗；
    活化所述第一导电端子的外表面上的氧化膜；
    在电镀所述铑钌镀层之后，在所述第一导电端子上电镀第一电镀层的过程还包括：
    对所述铑钌镀层进行水洗和风干，以形成第一电镀层。
  12. 根据权利要求9～11任一项所述的电连接器的制作方法，其特征在于，在所述第二导电端子上电镀第二电镀层的过程包括：
    在所述第二导电端子的外表面上电镀镍镀层；和
    在所述镍镀层上电镀金镀层，以形成第二电镀层。
  13. 根据权利要求8所述的电连接器的制作方法，其特征在于，所述提供第一料带和连接至所述第一料带的至少一个第一导电端子包括：
    冲压第一导电板以形成第一料带和至少一个第一导电端子，其中，所述第一料带具有第一本部及第一连接部，所述第一连接部连接在所述第一本部与所述第一导电端子之间，所述第一导电端子偏离所述第一本部第一距离，所述第一本部具有第一厚度；
    所述提供第二料带和连接至所述第二料带的至少一个第二导电端子包括：
    冲压第二导电板以形成第二料带和至少一个第二导电端子，其中，所述第二料带具有第二本部及第二连接部，所述第二连接部连接在所述第二本部与所述第二导电端子之间，所述第二导电端子偏离所述第二本部第二距离，所述第二距离等于所述第一距离与所述第一厚度的和或差。
  14. 根据权利要求8或13所述的电连接器的制作方法，其特征在于，所述第一料带上具有第一定位孔，所述第二料带上具有第二定位孔，层叠所述第一料带和所述第二料带时，所述第一定位孔对齐所述第二定位孔。
  15. 根据权利要求8所述的电连接器的制作方法，其特征在于，所述电连接器的制作方法还包括：
    在形成所述第一支撑件后，切除所述第一料带和所述第二料带，以形成电连接器。
  16. 根据权利要求8所述的电连接器的制作方法，其特征在于，所述电连接器的制作方法还包括：
    提供第三料带和连接在所述第三料带上的至少一个第三导电端子，在所述第三导电端子上电镀第三电镀层；
    提供第四料带和连接在所述第四料带上的至少一个第四导电端子，在所述第四导电端子上电镀第四电镀层，所述第四电镀层的材料与所述第三电镀层的材料不同；
    层叠所述第三料带和所述第四料带，以使所述第三导电端子和所述第四导电端子在同一平面上间隔地排列为一排，以形成第二端子组件；
    通过埋入成型方式在所述第二端子组件上形成第二支撑件，所述第二支撑件固定连接所述第三导电端子和所述第四导电端子；以及
    组装所述第一支撑件与所述第二支撑件，以使所述第一端子组件与所述第二端子组件背对背设置。
  17. 根据权利要求16所述的电连接器的制作方法，其特征在于，所述组装所述第一支撑件和所述第二支撑件包括：
    依次层叠所述第一支撑件、中隔片及所述第二支撑件；和
    通过埋入成型方式使所述第一支撑件、所述中隔片及所述第二支撑件彼此固定。
  18. 根据权利要求16所述的电连接器的制作方法，其特征在于，所述组装所述第一支撑件和所述第二支撑件包括：
    提供卡扣；和
    将所述第一支撑件与所述第二支撑件分别扣合在所述卡扣的相对两侧。
  19. 根据权利要求17或18所述的电连接器的制作方法，其特征在于，在组装完所述第一支撑件与所述第二支撑件后，所述电连接器的制作方法还包括：
    切除所述第一料带、所述第二料带、所述第三料带及所述第四料带，以形成电连接器。
  20. 根据权利要求18所述的电连接器的制作方法，其特征在于，在分别形成所述第一支撑件和所述第二支撑件后，且在组装所述第一支撑件与所述第二支撑件之前，所述电连接器的制作方法还包括：
    切除所述第一料带、所述第二料带、所述第三料带及所述第四料带。
  21. 根据权利要求16～18任一项所述的电连接器的制作方法，其特征在于，所述第一电镀层与所述第三电镀层的材料相同。
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