WO2018225441A1 - 感光性樹脂組成物、ドライフィルム、及びプリント配線板 - Google Patents

感光性樹脂組成物、ドライフィルム、及びプリント配線板 Download PDF

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Publication number
WO2018225441A1
WO2018225441A1 PCT/JP2018/017810 JP2018017810W WO2018225441A1 WO 2018225441 A1 WO2018225441 A1 WO 2018225441A1 JP 2018017810 W JP2018017810 W JP 2018017810W WO 2018225441 A1 WO2018225441 A1 WO 2018225441A1
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Prior art keywords
resin composition
photosensitive resin
group
carboxyl group
acid
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PCT/JP2018/017810
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English (en)
French (fr)
Japanese (ja)
Inventor
倫也 樋口
勇佐 藤原
橋本　壯一
貴 荒井
浩信 川里
真司 稲葉
Original Assignee
互応化学工業株式会社
新日鉄住金化学株式会社
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Application filed by 互応化学工業株式会社, 新日鉄住金化学株式会社 filed Critical 互応化学工業株式会社
Priority to CN201880003707.4A priority Critical patent/CN109791354B/zh
Priority to KR1020197007360A priority patent/KR102208828B1/ko
Priority to JP2019518116A priority patent/JP6733929B2/ja
Publication of WO2018225441A1 publication Critical patent/WO2018225441A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Definitions

  • the present invention relates to a photosensitive resin composition, a dry film, and a printed wiring board.
  • an electrically insulating layer formed from such a resin composition has fine through holes and opening patterns.
  • a photosensitive resin composition is used as a resin composition for forming an electrically insulating layer.
  • Patent Document 1 discloses (A) a carboxyl group-containing resin obtained by reacting a diol compound and a polyvalent carboxylic acid, having a weight average molecular weight of 2000 to 40000 and an acid value of 50 to 200 mgKOH / g, B) Photosensitive resin composition for insulating film containing unsaturated compound containing at least one photopolymerizable ethylenically unsaturated bond in one molecule, (C) epoxy compound, and (D) photopolymerization initiator And discloses that the adhesion to the plating metal can be improved by adding a rubber component to the photosensitive resin composition for an insulating film.
  • An object of the present invention is to contain a photosensitive resin composition having high copper plating adhesion and having low resolution after desmearing and having excellent resolution, and this photosensitive resin composition. It is intended to provide a printed wiring board provided with a dry film, an interlayer insulating layer containing a cured product of the photosensitive resin composition, and a solder resist layer containing a cured product of the photosensitive resin composition.
  • the photosensitive resin composition which concerns on one Embodiment of this invention is a photosensitive resin composition which has photocurability, and carboxyl group-containing resin (A) which has an aromatic ring, and an average primary particle diameter are 1 micrometer or less.
  • An organic filler (B) having a carboxyl group, at least one atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom, and two or more functional groups Includes a coupling agent (C) containing at least one group selected from the group consisting of an alkoxy group, an acyloxy group and an alkoxide, and a silica filler (D) having an average primary particle diameter in the range of 1 to 150 nm. contains.
  • a dry film according to an embodiment of the present invention contains the photosensitive resin composition.
  • a printed wiring board according to an embodiment of the present invention includes an interlayer insulating layer containing a cured product of the photosensitive resin composition.
  • a printed wiring board according to an embodiment of the present invention includes a solder resist layer containing a cured product of the photosensitive resin composition.
  • FIG. 1A is a cross-sectional view showing one step of the steps of manufacturing a multilayer printed wiring board.
  • FIG. 1B is a cross-sectional view showing one step in the steps of manufacturing a multilayer printed wiring board.
  • FIG. 1C is a cross-sectional view showing one step in the process of manufacturing a multilayer printed wiring board.
  • FIG. 1D is a cross-sectional view showing one step in the steps of manufacturing a multilayer printed wiring board.
  • FIG. 1E is a cross-sectional view illustrating one of the steps of manufacturing a multilayer printed wiring board.
  • the present invention relates to a photosensitive resin composition, a dry film, and a printed wiring board.
  • a photosensitive resin composition suitable for forming a film, a dry film containing the photosensitive resin composition, a printed wiring board including an interlayer insulating layer containing a cured product of the photosensitive resin composition, and the photosensitive resin composition The present invention relates to a printed wiring board including a solder resist layer containing a cured product.
  • (meth) acryl means at least one of “acryl” and “methacryl”.
  • (meth) acrylate means at least one of acrylate and methacrylate.
  • the photosensitive resin composition according to the present embodiment has photocurability.
  • the photosensitive resin composition according to the present embodiment includes a carboxyl group-containing resin (A) having an aromatic ring, an average primary particle diameter of 1 ⁇ m or less, an organic filler (B) having a carboxyl group, a silicon atom, and aluminum.
  • a coupling agent (C) having at least one atom selected from the group consisting of an atom, a titanium atom, and a zirconium atom, and two or more functional groups, and an average primary particle size in the range of 1 to 150 nm.
  • the functional group includes at least one functional group selected from the group consisting of an alkoxy group, an acyloxy group, and an alkoxide.
  • the photosensitive resin composition contains the organic filler (B), the cured product of the photosensitive resin composition has high copper plating adhesion.
  • the photosensitive resin composition contains a carboxyl group-containing resin (A) having an aromatic ring, an organic filler (B), a coupling agent (C), and a silica filler (D).
  • the functional resin composition has high transparency despite containing the organic filler (B). For this reason, resolution improves.
  • turbidity will arise in the photosensitive resin composition and transparency will fall. When the transparency of the photosensitive resin composition is low, light is likely to be scattered when the photosensitive resin composition is exposed, and good resolution cannot be obtained.
  • the photosensitive resin composition according to the present embodiment contains a carboxyl group-containing resin (A) having an aromatic ring, an organic filler (B), a coupling agent (C), and a silica filler (D). Therefore, it can have high transparency. For this reason, the resolution of the photosensitive resin composition is improved, and a fine through hole, an opening pattern, or the like can be formed in a layer made of a cured product of the photosensitive resin composition. Moreover, the surface roughness of the cured product after the desmear treatment of the cured product of the photosensitive resin composition can be reduced. That is, the photosensitive resin composition can form a cured product having low roughness after desmearing.
  • A carboxyl group-containing resin
  • B organic filler
  • C coupling agent
  • D silica filler
  • a printed wiring board including a layer made of the cured product can have excellent high-frequency characteristics. Furthermore, when the photosensitive resin composition contains the silica filler (D), the glass transition point of the cured product of the photosensitive resin composition can be increased and the thermal expansion coefficient can be reduced. For this reason, since the layer which consists of hardened
  • cured material of the photosensitive resin composition is hard to warp even if the stress by heat is applied, and it is excellent also in a thermal cycle crack resistance, it can be used for the printed wiring board reduced in thickness.
  • cured material of the photosensitive resin composition can be reduced because the photosensitive resin composition contains a silica filler (D). For this reason, the high frequency transmission performance of a printed wiring board provided with the layer which consists of hardened
  • the photosensitive resin composition contains a carboxyl group-containing resin (A), an organic filler (B), a coupling agent (C), and a silica filler (D), silica
  • the filler (D) interacts with or binds to the carboxyl group of the carboxyl group-containing resin (A) and the carboxyl group of the organic filler (B) via the coupling agent (C) to form a composite or It is thought to be hybridized. For this reason, the glass transition point of the hardened
  • the photosensitive resin composition has photocurability. Since the photosensitive resin composition has photocurability, the photosensitive resin composition can be cured by irradiating the photosensitive resin composition with light. Photocurability of the photosensitive resin composition is imparted, for example, when the carboxyl group-containing resin (A) has a photopolymerizable unsaturated group. Moreover, the photocurability of the photosensitive resin composition is also provided by the photosensitive resin composition containing an unsaturated compound (E) as described later.
  • the carboxyl group-containing resin (A) has an aromatic ring. Since the carboxyl group-containing resin (A) has an aromatic ring, the photosensitive resin composition can have good transparency.
  • the carboxyl group-containing resin (A) is not particularly limited as long as it is a resin having an aromatic ring and a carboxyl group.
  • the carboxyl group-containing resin (A) preferably has a hydroxyl group.
  • the carboxyl group-containing resin (A) has a hydroxyl group, the reactivity with the coupling agent (C) is particularly increased, and the transparency of the photosensitive resin composition is further improved.
  • the carboxyl group-containing resin (A) preferably includes a resin obtained by a reaction between a polyalcohol resin, a polyvalent carboxylic acid, and at least one compound selected from the group consisting of acid anhydrides thereof.
  • the polyalcohol resin preferably has an aromatic ring, and at least one compound selected from the group consisting of a polyvalent carboxylic acid and an anhydride thereof preferably has an aromatic ring.
  • the carboxyl group-containing resin (A) contains a copolymer obtained by a reaction between a polyalcohol resin and an acid dianhydride.
  • the polyalcohol resin preferably has an aromatic ring, and the acid dianhydride preferably has an aromatic ring.
  • the photosensitive resin composition is provided with high alkali developability, and the photosensitive resin composition High heat resistance and insulation can be imparted to the cured product.
  • the carboxyl group-containing resin (A) preferably contains a carboxyl group-containing resin having an ethylenically unsaturated group. Since the carboxyl group-containing resin (A) includes a carboxyl group-containing resin having an ethylenically unsaturated group, the carboxyl group-containing resin (A) has photoreactivity. For this reason, photocurability can be provided to the photosensitive resin composition containing the carboxyl group-containing resin (A).
  • the carboxyl group-containing resin having an ethylenically unsaturated group is, for example, an intermediate that is a reaction product of an epoxy compound (g1) having two or more epoxy groups in one molecule and an ethylenically unsaturated compound (g2),
  • a resin (referred to as a first resin (g)), which is a reaction product with at least one compound (g3) selected from the group of polyvalent carboxylic acids and anhydrides thereof, is contained.
  • the first resin (g) has an aromatic ring derived from at least one of the epoxy compound (g1), the ethylenically unsaturated compound (g2), and the compound (g3).
  • the first resin (g) is prepared by combining the compound (g3) with an intermediate having a hydroxyl group obtained by reacting an epoxy group in the epoxy compound (g1) with a carboxyl group in the ethylenically unsaturated compound (g2). ) Is added.
  • the epoxy compound (g1) can contain an appropriate epoxy resin such as a cresol novolac epoxy resin or a phenol novolac epoxy resin.
  • the epoxy compound (g1) preferably contains an epoxy compound having an aromatic ring.
  • the epoxy compound (g1) may contain a polymer of the ethylenically unsaturated compound (h).
  • the ethylenically unsaturated compound (h) contains a compound (h1) having an epoxy group such as glycidyl (meth) acrylate, or further has no epoxy group such as 2- (meth) acryloyloxyethyl phthalate.
  • the ethylenically unsaturated compound (g2) preferably contains at least one of acrylic acid and methacrylic acid.
  • the compound (g3) contains one or more compounds selected from the group consisting of polyvalent carboxylic acids such as phthalic acid, tetrahydrophthalic acid, and methyltetrahydrophthalic acid, and anhydrides of these polyvalent carboxylic acids. .
  • the compound (g3) preferably contains an acid dianhydride.
  • the acid dianhydride preferably contains an acid dianhydride having an aromatic ring. In this case, the transparency of the photosensitive resin composition is further improved, and the resolution is further improved accordingly.
  • the carboxyl group-containing resin having an ethylenically unsaturated group is a reaction product of a polymer of an ethylenically unsaturated monomer containing an ethylenically unsaturated compound having a carboxyl group and an ethylenically unsaturated compound having an epoxy group.
  • a certain resin referred to as second resin (i)
  • the ethylenically unsaturated monomer may further contain an ethylenically unsaturated compound having no carboxyl group.
  • the second resin (i) can be obtained by reacting an ethylenically unsaturated compound having an epoxy group with a part of the carboxyl group in the polymer.
  • the second resin (i) has an aromatic ring derived from at least one of a polymer of an ethylenically unsaturated monomer and an ethylenically unsaturated compound having an epoxy group.
  • a polymer of an ethylenically unsaturated monomer and an ethylenically unsaturated compound having an epoxy group.
  • the ethylenically unsaturated compound having a carboxyl group include acrylic acid, methacrylic acid, ⁇ -carboxy-polycaprolactone (n ⁇ 2) monoacrylate, 2- (meth) acryloyloxyethyl phthalate, and 2- (meth) acryloyl. Contains compounds such as loxyethyl-2-hydroxyethyl phthalate.
  • the ethylenically unsaturated compound having no carboxyl group is, for example, a linear or branched aliphatic or alicyclic (however, the ring may have a partially unsaturated bond) (meth) acrylic acid ester Etc. are contained.
  • the ethylenically unsaturated compound having an epoxy group preferably contains glycidyl (meth) acrylate.
  • the carboxyl group-containing resin (A) preferably has a benzene ring. That is, the aromatic ring included in the carboxyl group-containing resin (A) is preferably a benzene ring. When the carboxyl group-containing resin (A) has a benzene ring, the transparency of the photosensitive resin composition becomes higher, and the photosensitive resin composition has excellent resolution.
  • the carboxyl group-containing resin (A) more preferably includes a carboxyl group-containing resin having at least one polycyclic aromatic ring selected from the group consisting of a biphenyl skeleton, a naphthalene skeleton, a fluorene skeleton, and an anthracene skeleton.
  • the carboxyl group-containing resin (A) further preferably contains a carboxyl group-containing resin having at least one of a biphenyl skeleton and a bisphenol fluorene skeleton, and particularly preferably contains a carboxyl group-containing resin having a bisphenol fluorene skeleton.
  • the dielectric loss tangent in the cured product of the photosensitive resin composition containing the carboxyl group-containing resin (A) can be further reduced.
  • the carboxyl group-containing resin (A) is represented by the following formula (1), and in the formula (1), R 1 to R 8 are each independently hydrogen, an alkyl group having 1 to 5 carbon atoms, or a bisphenolfluorene skeleton.
  • carboxyl group-containing resin (A1) the transparency of the photosensitive resin composition is further improved.
  • the carboxyl group-containing resin (A1) has an aromatic ring derived from the epoxy compound (a1) having a bisphenolfluorene skeleton.
  • the carboxyl group-containing resin (A1) has an ethylenically unsaturated group derived from the carboxylic acid (a2) including the unsaturated group-containing carboxylic acid (a2-1).
  • the carboxyl group-containing resin (A1) reacts an epoxy compound (a1) having a bisphenolfluorene skeleton represented by the following formula (1) with a carboxylic acid (a2) containing an unsaturated group-containing carboxylic acid (a2-1). And an intermediate obtained thereby and the acid anhydride (a3) are reacted.
  • R 1 ⁇ R 8 is independently hydrogen, alkyl or halogen having 1 to 5 carbon atoms. That is, each of R 1 to R 8 in Formula (1) may be hydrogen, but may be an alkyl group having 1 to 5 carbon atoms or halogen. Even if the hydrogen in the aromatic ring is substituted with a low molecular weight alkyl group or halogen, the physical properties of the carboxyl group-containing resin (A1) are not adversely affected. This is because the heat resistance or flame retardancy of the cured product of the conductive resin composition may be improved.
  • the carboxyl group-containing resin (A1) has a bisphenolfluorene skeleton represented by the formula (1) derived from the epoxy compound (a1), it can impart high heat resistance and insulation to the cured product of the photosensitive resin composition. Moreover, the developability excellent in the photosensitive resin composition can be provided because carboxyl group-containing resin (A1) has a carboxyl group derived from an acid anhydride (a3).
  • the carboxyl group-containing resin (A1) will be described more specifically.
  • An intermediate is synthesized by reacting the carboxylic acid (a2) containing 1).
  • the synthesis of the intermediate is defined as the first reaction.
  • the intermediate has a secondary hydroxyl group generated by a ring-opening addition reaction between an epoxy group and a carboxylic acid (a2) containing an unsaturated group-containing carboxylic acid (a2-1).
  • the acid anhydride (a3) can include an acid monoanhydride and an acid dianhydride.
  • the acid monoanhydride is a compound having one acid anhydride group in which two carboxyl groups in one molecule are dehydrated and condensed.
  • An acid dianhydride is a compound having two acid anhydride groups obtained by dehydration condensation of four carboxyl groups in one molecule.
  • the carboxyl group-containing resin (A1) may contain unreacted components in the intermediate.
  • the carboxyl group-containing resin (A1) includes a component in the intermediate, a component in the acid monoanhydride, and an acid dianhydride.
  • any of the reactant in the intermediate with the component in the acid monoanhydride, and the reactant in the intermediate with the component in the acid dianhydride One or both may be contained. That is, the carboxyl group-containing resin (A1) may be a mixture containing a plurality of compounds having different structures.
  • the carboxyl group-containing resin (A1) has photoreactivity by having an ethylenically unsaturated group derived from the unsaturated group-containing carboxylic acid (a2-1). For this reason, carboxyl group-containing resin (A1) can provide photosensitivity, specifically, ultraviolet curability, to the photosensitive resin composition. Moreover, carboxyl group-containing resin (A1) has a carboxyl group derived from an acid anhydride (a3), so that the photosensitive resin composition contains at least one of an alkali metal salt and an alkali metal hydroxide. The developability by alkaline aqueous solution can be provided.
  • the weight average molecular weight of the carboxyl group-containing resin (A1) is preferably in the range of 700 to 10,000.
  • the weight average molecular weight is 700 or more, the insulating property of the cured product of the photosensitive resin composition can be improved and the dielectric loss tangent can be reduced.
  • the developability by the alkaline aqueous solution of the photosensitive resin composition improves especially that a weight average molecular weight is 10,000 or less.
  • the weight average molecular weight is more preferably in the range of 900 to 8000, and particularly preferably in the range of 1000 to 5000.
  • the polydispersity of the carboxyl group-containing resin (A1) is preferably in the range of 1.0 to 4.8. In this case, the developability excellent in the photosensitive resin composition can be provided, ensuring the favorable insulation of the hardened
  • the polydispersity of the carboxyl group-containing resin (A1) is more preferably 1.1 to 4.0, and still more preferably 1.2 to 2.8.
  • the number average molecular weight and molecular weight distribution of the carboxyl group-containing resin (A1) as described above are such that the carboxyl group-containing resin (A1) is an unreacted component in the intermediate, a component in the intermediate and an acid monoanhydride.
  • the polydispersity is the value (Mw / Mn) of the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the carboxyl group-containing resin (A1).
  • the solid content acid value of the carboxyl group-containing resin (A1) is preferably in the range of 60 to 140 mgKOH / g. In this case, the developability of the photosensitive resin composition is particularly improved.
  • the acid value is more preferably in the range of 80 to 135 mgKOH / g, and the acid value is more preferably in the range of 90 to 130 mgKOH / g.
  • the molecular weight of the carboxyl group-containing resin (A1) can be adjusted by crosslinking of acid dianhydride. In this case, a carboxyl group-containing resin (A1) having an adjusted acid value and molecular weight is obtained. That is, the molecular weight and acid value of the carboxyl group-containing resin (A1) can be easily adjusted by controlling the amount of acid dianhydride contained in the acid anhydride (a3). In addition, the molecular weight of carboxyl group-containing resin (A1) is calculated from the measurement results under the following conditions by gel permeation chromatography.
  • GPC device SHODEX SYSTEM 11, manufactured by Showa Denko KK
  • the epoxy compound (a1) has a structure represented by the following formula (2), for example.
  • N in the formula (2) is, for example, an integer in the range of 0-20.
  • the average of n is particularly preferably in the range of 0-1. When the average of n is in the range of 0 to 1, even when the acid anhydride (a3) contains an acid dianhydride, an excessive increase in molecular weight is likely to be suppressed.
  • the carboxylic acid (a2) includes an unsaturated group-containing carboxylic acid (a2-1).
  • the carboxylic acid (a2) may contain only the unsaturated group-containing carboxylic acid (a2-1).
  • the carboxylic acid (a2) may contain a carboxylic acid other than the unsaturated group-containing carboxylic acid (a2-1) and the unsaturated group-containing carboxylic acid (a2-1).
  • the unsaturated group-containing carboxylic acid (a2-1) can contain, for example, a compound having only one ethylenically unsaturated group. More specifically, the unsaturated group-containing carboxylic acid (a2-1) is, for example, acrylic acid, methacrylic acid, ⁇ -carboxy-polycaprolactone (n ⁇ 2) monoacrylate, crotonic acid, cinnamic acid, 2-acryloyloxy Ethyl succinic acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, 2-methacryloyloxyethyl phthalic acid, 2-acryloyloxypropyl phthalic acid, 2-methacryloyloxypropyl phthalic acid, 2-acryloyloxyethyl malein Acid, 2-methacryloyloxyethyl maleic acid, ⁇ -carboxyethyl acrylate, 2-acryloyloxyethyl
  • the carboxylic acid (a2) may contain a polybasic acid (a2-2).
  • the polybasic acid (a2-2) is an acid capable of substituting two or more hydrogen atoms with metal atoms in one molecule.
  • the polybasic acid (a2-2) preferably has two or more carboxyl groups.
  • the epoxy compound (a1) reacts with both the unsaturated group-containing carboxylic acid (a2-1) and the polybasic acid (a2-2).
  • the polybasic acid (a2-1) cross-links the epoxy groups present in the two molecules of the epoxy compound (a1), thereby increasing the molecular weight.
  • the polybasic acid (a2-2) preferably contains a dicarboxylic acid.
  • a dicarboxylic acid For example, 4-cyclohexene-1,2-dicarboxylic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid
  • One or more compounds selected from the group consisting of acid and terephthalic acid can be contained.
  • the polybasic acid (a2-2) contains 4-cyclohexene-1,2-dicarboxylic acid.
  • the reactive solution is obtained by adding the carboxylic acid (a2) to the solvent solution of the epoxy compound (a1), further adding a thermal polymerization inhibitor and a catalyst as necessary, and stirring and mixing.
  • An intermediate can be obtained by reacting this reactive solution at a temperature of preferably 60 to 150 ° C., particularly preferably 80 to 120 ° C., by a conventional method.
  • Solvents include, for example, ketones such as methyl ethyl ketone and cyclohexanone, and aromatic hydrocarbons such as toluene and xylene, and ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, diethylene glycol monoethyl ether It can contain at least one component selected from the group consisting of acetates, acetate esters such as propylene glycol monomethyl ether acetate, and dialkyl glycol ethers.
  • the thermal polymerization inhibitor contains, for example, at least one of hydroquinone and hydroquinone monomethyl ether.
  • the catalyst is at least selected from the group consisting of tertiary amines such as benzyldimethylamine and triethylamine, quaternary ammonium salts such as trimethylbenzylammonium chloride and methyltriethylammonium chloride, triphenylphosphine, and triphenylstibine.
  • tertiary amines such as benzyldimethylamine and triethylamine
  • quaternary ammonium salts such as trimethylbenzylammonium chloride and methyltriethylammonium chloride
  • triphenylphosphine triphenylstibine.
  • a kind of component can be contained.
  • the catalyst contains triphenylphosphine. That is, it is preferable to react the epoxy compound (a1) and the carboxylic acid (a2) in the presence of triphenylphosphine. In this case, the ring-opening addition reaction between the epoxy group and the carboxylic acid (a2) in the epoxy compound (a1) is particularly accelerated, and a reaction rate (conversion rate) of 95% or more, 97% or more, or almost 100% is achieved. Is possible. Moreover, generation
  • the amount of the carboxylic acid (a2) relative to 1 mol of the epoxy group of the epoxy compound (a1) is in the range of 0.5 to 1.2 mol. Is preferred. In this case, excellent photosensitivity and stability of the photosensitive resin composition can be obtained. From the same viewpoint, the amount of the unsaturated group-containing carboxylic acid (a2-1) relative to 1 mol of the epoxy group of the epoxy compound (a1) is preferably in the range of 0.5 to 1.2 mol.
  • the carboxylic acid (a2) contains a carboxylic acid other than the unsaturated group-containing carboxylic acid (a2-1), the unsaturated group-containing carboxylic acid (a2-) with respect to 1 mol of the epoxy group of the epoxy compound (a1).
  • the amount of 1) may be in the range of 0.5 to 0.95 mol.
  • the carboxylic acid (a2) contains a polybasic acid (a2-1)
  • the amount of the polybasic acid (a2-1) relative to 1 mol of the epoxy group of the epoxy compound (a1) is 0.025 to 0.25. It is preferably within the molar range. In this case, excellent photosensitivity and stability of the photosensitive resin composition can be obtained.
  • the intermediate obtained in this way has a hydroxyl group produced by the reaction of the epoxy group in the epoxy compound (a1) and the carboxyl group in the carboxylic acid (a2).
  • the acid anhydride (a3) preferably contains an acid monoanhydride.
  • An acid monoanhydride is a compound having one acid anhydride group.
  • the acid monoanhydride can contain an anhydride of dicarboxylic acid.
  • the acid monoanhydride include 1,2,3,6-tetrahydrophthalic anhydride, phthalic anhydride, succinic anhydride, methyl succinic anhydride, maleic anhydride, citraconic anhydride, glutaric anhydride, Itaconic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride, and methylhexahydrophthalic anhydride
  • One or more compounds selected from the group consisting of products can be contained.
  • the acid monoanhydride preferably contains 1,2,3,6-tetrahydrophthalic anhydride.
  • the insulating property of the cured product of the photosensitive resin composition can be improved while ensuring good developability of the photosensitive resin composition.
  • 1,2,3,6-Tetrahydrophthalic anhydride is preferably in the range of 20 to 100 mol%, more preferably in the range of 40 to 100 mol%, based on the entire acid monoanhydride. However, it is not limited to this.
  • the acid anhydride (a3) preferably contains an acid dianhydride.
  • An acid dianhydride is a compound having two acid anhydride groups.
  • the acid dianhydride can contain an anhydride of tetracarboxylic acid.
  • Examples of the acid dianhydride include 1,2,4,5-benzenetetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, methylcyclohexene tetracarboxylic dianhydride, tetracarboxylic dianhydride, naphthalene-1 , 4,5,8-tetracarboxylic dianhydride, ethylenetetracarboxylic dianhydride, 9,9'-bis (3,4-dicarboxyphenyl) fluorene dianhydride, glycerin bisanhydro trimellitate mono Acetate, ethylene glycol bisanhydro trimellitate, 3,3 ′, 4,4′-diphenylsulfone
  • the acid dianhydride preferably contains an acid dianhydride having an aromatic ring.
  • the acid dianhydride preferably contains 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride.
  • the insulating property of the cured product of the photosensitive resin composition can be improved while ensuring good developability of the photosensitive resin composition.
  • the transparency of the photosensitive resin composition is improved, and the resolution is improved accordingly.
  • 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is preferably in the range of 20 to 100 mol%, and in the range of 40 to 100 mol%, based on the entire acid dianhydride. Although it is more preferable that there is, it is not limited to this.
  • a known method can be employed.
  • a reactive solution is obtained by adding an acid anhydride (a3) to a solvent solution of an intermediate, further adding a thermal polymerization inhibitor and a catalyst as necessary, and stirring and mixing.
  • a temperature of preferably 60 to 150 ° C., particularly preferably 80 to 120 ° C. a carboxyl group-containing resin (A1) can be obtained by a conventional method.
  • the solvent, catalyst and polymerization inhibitor appropriate ones can be used, and the solvent, catalyst and polymerization inhibitor used in the synthesis of the intermediate can also be used as they are.
  • the catalyst contains triphenylphosphine. That is, it is preferable to react the intermediate and the acid anhydride (a3) in the presence of triphenylphosphine. In this case, the reaction between the secondary hydroxyl group and the acid anhydride (a3) in the intermediate is particularly accelerated, and a reaction rate (conversion rate) of 90% or more, 95% or more, 97% or more, or almost 100% is achieved. Is possible. Moreover, generation
  • the intermediate and the acid anhydride (a3) are also preferable to react the intermediate and the acid anhydride (a3) under air bubbling.
  • the developability by the alkaline aqueous solution of the photosensitive resin composition improves especially by suppressing the excessive molecular weight increase of the produced
  • the carboxyl group-containing resin (A) may include a carboxyl group-containing resin having an aromatic ring and not having photopolymerizability.
  • the carboxyl group-containing resin having an aromatic ring and not having photopolymerizability contains, for example, a polymer of an ethylenically unsaturated monomer including an ethylenically unsaturated compound having a carboxyl group.
  • Ethylenically unsaturated compounds having a carboxyl group include acrylic acid, methacrylic acid, ⁇ -carboxy-polycaprolactone (n ⁇ 2) monoacrylate, 2- (meth) acryloyloxyethyl phthalate, 2- (meth) acryloyloxy Compounds such as ethyl-2-hydroxyethyl phthalate can be contained.
  • the ethylenically unsaturated compound having a carboxyl group can also contain a reaction product of pentaerythritol triacrylate, pentaerythritol trimethacrylate and the like with a dibasic acid anhydride.
  • the ethylenically unsaturated monomer is a carboxyl group such as a linear or branched aliphatic or alicyclic (however, the ring may have a partially unsaturated bond) (meth) acrylic acid ester, etc. You may further contain the ethylenically unsaturated compound which does not have.
  • the carboxyl group-containing resin (A) may contain only the carboxyl group-containing resin (A1), or may contain a carboxyl group-containing resin (A1) and a carboxyl group-containing resin other than the carboxyl group-containing resin (A1). Only a carboxyl group-containing resin other than the group-containing resin (A1) may be included.
  • the carboxyl group-containing resin (A) is 30 masses of the carboxyl group-containing resin (A1). % Or more, preferably 60% by mass or more, more preferably 100% by mass.
  • the content of the carboxyl group-containing resin (A) is preferably in the range of 5 to 85% by mass, more preferably in the range of 10 to 75% by mass, based on the solid content of the photosensitive resin composition. It is preferably in the range of 26 to 60% by mass, more preferably in the range of 30 to 45% by mass.
  • the content of the carboxyl group-containing resin (A1) is in the range of 5 to 85% by mass with respect to the solid content of the photosensitive resin composition. Is preferably within the range of 10 to 75% by mass, more preferably within the range of 26 to 60% by mass, and particularly preferably within the range of 30 to 45% by mass. preferable.
  • solid content is a total amount of all components remove
  • the solid content acid value of the carboxyl group-containing resin (A) is preferably in the range of 40 to 160 mgKOH / g. In this case, the stability of the photosensitive resin composition is particularly improved.
  • the acid value is more preferably in the range of 60 to 140 mgKOH / g, the acid value is more preferably in the range of 80 to 135 mgKOH / g, and the acid value is particularly preferably in the range of 90 to 130 mgKOH / g. .
  • Organic filler (B) has a carboxyl group.
  • the carboxyl group of the organic filler (B) can be obtained by, for example, polymerizing or crosslinking a carboxylic acid monomer having a polymerizable unsaturated double bond such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, and itaconic acid. can get.
  • the organic filler (B) can impart high copper plating adhesion to the cured product of the photosensitive resin composition. Furthermore, the organic filler (B) increases the thixotropy of the photosensitive resin composition and improves the stability (particularly storage stability).
  • the organic filler (B) has a carboxyl group, the developability of the cured product of the photosensitive resin composition is improved, and when the photosensitive resin composition contains a crystalline epoxy compound, a crystalline epoxy is used. Crystallization can be prevented by improving the compatibility of the compound.
  • the carboxyl group content of the organic filler (B) is not particularly limited, but the acid value of the organic filler (B) is preferably 1 to 60 mgKOH / g as the acid value by acid-base titration. If the acid value is less than 1 mgKOH / g, the stability of the photosensitive resin composition and the developability of the cured product may be reduced. If the acid value is larger than 60 mgKOH / g, the moisture resistance reliability of the cured product may be lowered.
  • the acid value of the organic filler (B) is more preferably 3 to 40 mgKOH / g.
  • the organic filler (B) has a hydroxyl group.
  • the dispersibility of the organic filler (B) in the photosensitive resin composition is improved.
  • the average primary particle diameter of the organic filler (B) is 1 ⁇ m or less.
  • the lower limit of the average primary particle diameter of the organic filler (E1) is not particularly limited, but is preferably 0.001 ⁇ m or more, for example.
  • the average primary particle size of the organic filler (B) is a laser diffraction particle size distribution measuring device, is measured as D 50.
  • the average primary particle diameter of the organic filler (B) is preferably 0.1 ⁇ m or less. In this case, the stability of the photosensitive resin composition is further improved and the resolution is further improved since scattering during exposure is suppressed.
  • the organic filler (B) is preferably contained in the photosensitive resin composition in a state where the particle diameter is 10 ⁇ m or less.
  • An organic filler (B) may contain a secondary particle by aggregating in the photosensitive resin composition.
  • the particle diameter of the organic filler (B) in the photosensitive resin composition means the particle diameter of the particles including secondary particles.
  • the particle diameter of the organic filler (B) in the photosensitive resin composition can be measured using a laser diffraction / scattering particle size distribution analyzer or an optical microscope. If the organic filler (B) is contained in the photosensitive resin composition with a particle size of 10 ⁇ m or less, the stability of the photosensitive resin composition is further improved and scattering during exposure is suppressed. The image quality is further improved.
  • the organic filler (B) is more preferably contained in the photosensitive resin composition in a state where the particle diameter is 5 ⁇ m or less, more preferably in a state where the particle diameter is 1 ⁇ m or less, and 0.5 ⁇ m. It is particularly preferable that it is contained in the following state. In this case, the stability of the photosensitive resin composition is further improved and the resolution is further improved since scattering during exposure is suppressed.
  • the minimum of the particle diameter of the organic filler (B) in the photosensitive resin composition is not specifically limited, For example, it may be 0.01 micrometer or more.
  • the organic filler (B) preferably contains a rubber component.
  • the rubber component can impart flexibility to the cured product of the photosensitive resin composition.
  • the photosensitive resin composition according to this embodiment can have high resolution even if it contains a rubber component.
  • the rubber component can be composed of a resin.
  • the rubber component preferably contains at least one polymer selected from the group consisting of crosslinked acrylic rubber, crosslinked NBR, crosslinked MBS, and crosslinked SBR.
  • the photosensitive resin composition can have high transparency and can improve resolution.
  • flexibility can be provided to the hardened
  • NBR is generally a copolymer of butadiene and acrylonitrile, and is classified as a nitrile rubber.
  • MBS is generally a copolymer composed of three components of methyl methacrylate, butadiene, and styrene, and is classified as a butadiene rubber.
  • SBR is generally a copolymer of styrene and butadiene, and is classified as styrene rubber.
  • Specific examples of the organic filler (B) include product number XER-91-MEK manufactured by JSR Corporation. This organic filler is a crosslinked rubber (NBR) having a carboxyl group having an average primary particle diameter of 0.07 ⁇ m, and is provided as a methyl ethyl ketone dispersion having a content of crosslinked rubber of 15% by weight, and its acid value is 10.0 mgKOH / g.
  • an organic filler (B) may be mix
  • the rubber component can be blended in a dispersion.
  • specific examples of the organic filler (B) include product numbers XER-32 and XER-92 manufactured by JSR Corporation.
  • a dispersion of a crosslinked rubber (SBR) having a carboxyl group and a hydroxyl group product number XSK-500 manufactured by JSR Corporation may be mentioned.
  • the organic filler (B) may contain a particle component other than the rubber component.
  • the organic filler (B) can contain at least one particle component selected from the group consisting of acrylic resin fine particles having a carboxyl group and cellulose fine particles having a carboxyl group.
  • the acrylic resin fine particles having a carboxyl group can contain at least one particle component selected from the group consisting of non-crosslinked styrene / acrylic resin fine particles and crosslinked styrene / acrylic resin fine particles.
  • product number FS-201 average primary particle size 0.5 ⁇ m
  • Nippon Paint Industrial Coatings Co., Ltd. may be mentioned.
  • the organic filler (B) may contain a particle component other than the particle component selected from the rubber component, acrylic resin fine particles, and cellulose fine particles.
  • the organic filler (B) can contain a particle component having a carboxyl group. That is, the particle component having a carboxyl group may be different from the particle component selected from the rubber component, the acrylic resin fine particles, and the cellulose fine particles.
  • the photosensitive resin composition may further contain an organic filler other than the organic filler (B).
  • the organic filler other than the organic filler (B) may not have a carboxyl group, and the average primary particle diameter may be larger than 1 ⁇ m.
  • the photosensitive resin composition contains the organic filler (B) and an organic filler other than the organic filler (B)
  • the total content of the organic filler (B) and the organic filler other than the organic filler (B) is used.
  • the content of the organic filler (B) is preferably 30% by mass or more, and more preferably 50% by mass or more.
  • the content of the organic filler (B) is preferably in the range of 1 to 50 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A). Good copper plating adhesion of the cured product of the photosensitive resin composition because the content of the organic filler (B) is 1 part by mass or more with respect to 100 parts by mass of the carboxyl group-containing resin (A). Can be obtained. Moreover, the outstanding resolution of the photosensitive resin composition can be obtained because content of an organic filler (B) is 50 mass parts or less. Moreover, when the content of the organic filler (B) is in the above range, the thixotropy of the photosensitive resin composition is increased and the stability is improved.
  • the content of the organic filler (B) is more preferably in the range of 5 to 30 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A), and is preferably in the range of 10 to 20 parts by mass. More preferably.
  • the coupling agent (C) has at least one atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom.
  • the coupling agent (C) further has two or more functional groups, and the functional groups include at least one group selected from the group consisting of alkoxy groups, acyloxy groups, and alkoxides.
  • the coupling agent (C) may have two or more alkoxy groups, two or more acyloxy groups, or two or more alkoxides.
  • the coupling agent (C) may have two or more different functional groups selected from the group consisting of an alkoxy group, an acyloxy group, and an alkoxide.
  • the coupling agent (C) increases the dispersibility of the organic filler (B) and the silica filler (D) in the photosensitive resin composition
  • the transparency and thixotropy of the photosensitive resin composition can be improved.
  • the photosensitive resin composition has excellent resolution and stability (particularly storage stability).
  • Two or more functional groups including at least one group selected from the group consisting of an alkoxy group, an acyloxy group and an alkoxide are at least one atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom. Direct bonding is preferred.
  • examples of the coupling agent (C) include tetraethoxysilane, tetramethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldiethoxysilane, and vinylmethyldimethoxy.
  • examples of the coupling agent (C) include acetoalkoxy aluminum diisopropylate, aluminum diisopropoxy monoethyl acetoacetate, and aluminum trisethyl acetoacetate.
  • examples of the coupling agent (C) include isopropyl tristearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraoctyl bis (ditridecyl phosphate titanate), tetra (2 -2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphate titanate, bis (dioctylpyrophosphate) oxyacetate titanate, and bis (dioctylpyrophosphate) ethylene titanate.
  • examples of the coupling agent (C) include zirconium tetranormal propoxide and zirconium tetranormal butoxide.
  • the coupling agent (C) can contain at least one component selected from the group consisting of the above components.
  • the coupling agent (C) preferably has a silicon atom. That is, the coupling agent (C) is preferably a silane coupling agent.
  • the coupling agent (C) has a silicon atom, the reactivity with the silica filler (D) is particularly increased, and the dispersibility of the silica filler (D) in the photosensitive resin composition is further efficiently increased. Therefore, the transparency and stability of the photosensitive resin composition are further improved.
  • a coupling agent (C) has a silicon atom, while further raising the glass transition point of the hardened
  • the coupling agent (C) preferably has at least one group selected from the group consisting of a methoxy group, an ethoxy group, and an acetoxy group.
  • a methoxy group and an ethoxy group are classified into alkoxy groups.
  • the acetoxy group is classified as an acyloxy group.
  • the coupling agent (C) may have only a methoxy group, may have only an ethoxy group, or may have only an acetoxy group.
  • the coupling agent (C) may have two or more different functional groups selected from the group consisting of a methoxy group, an ethoxy group, and an acetoxy group.
  • the coupling agent (C) has at least one group selected from the group consisting of a methoxy group, an ethoxy group, and an acetoxy group, a carboxyl group-containing resin (A) having an aromatic ring, an organic filler (B), and silica
  • the reactivity between the filler (D) and the coupling agent (C) is improved, and aggregation of the organic filler (B) and the silica filler (D) in the photosensitive resin composition is less likely to occur. Therefore, the transparency and stability of the photosensitive resin composition are further improved.
  • the coupling agent (C) preferably has 2 to 4 functional groups selected from the group consisting of alkoxy groups, acyloxy groups and alkoxides.
  • the coupling agent (C) may have 2 to 4 alkoxy groups, may have 2 to 4 acyloxy groups, and may have 2 to 4 alkoxides.
  • the coupling agent (C) may have 2 to 4 methoxy groups, 2 to 4 ethoxy groups, or 2 to 4 acetoxy groups.
  • the coupling agent (C) may have two to four different functional groups selected from the group consisting of alkoxy groups, acyloxy groups, and alkoxides.
  • the coupling agent (C) has two to four functional groups selected from the group consisting of an alkoxy group, an acyloxy group and an alkoxide, the reaction between the organic filler (B) and the coupling agent (C), or An excessive crosslinking reaction due to the reaction between the coupling agent (C) and the silica filler (D) can be suppressed, and the dispersibility of the organic filler (B) and the silica filler (D) in the photosensitive resin composition is improved. At the same time, gelation can be suppressed.
  • the coupling agent (C) preferably has at least one group selected from the group consisting of an amino group, an epoxy group, a vinyl group, a methacryl group, a mercapto group, an isocyanate group, and a sulfide group.
  • the carboxyl group contained in the carboxyl group-containing resin (A) and the carboxyl group contained in the organic filler (B) can be reacted, and the dispersibility of the organic filler (B) in the photosensitive resin composition is further increased. Increases efficiently. Therefore, the transparency and stability of the photosensitive resin composition are further improved.
  • the coupling agent (C) may have an amino group by having an aminoalkyl group. Moreover, a coupling agent (C) may have an epoxy group by having a glycidoxy group. When the coupling agent (C) contains a vinyl group, the vinyl group is directly bonded to a silicon atom, for example. Since the coupling agent (C) has an amino group, an epoxy group, or a vinyl group, the reactivity with the carboxyl group contained in the carboxyl group-containing resin (A) and the carboxyl group contained in the organic filler (B) is improved. This increases the dispersibility of the organic filler (B) in the photosensitive resin composition more efficiently. It is preferable that the coupling agent (C) has an epoxy group or a vinyl group. In this case, the insulating property of the photosensitive resin composition is increased and the stability is further improved.
  • the photosensitive resin composition may further contain a coupling agent other than the coupling agent (C).
  • the coupling agent other than the coupling agent (C) may not have at least one atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom.
  • the coupling agent other than the coupling agent (C) may not have two or more functional groups containing at least one group selected from the group consisting of an alkoxy group, an acyloxy group, and an alkoxide.
  • the photosensitive resin composition is a coupling agent.
  • Coupling agents other than (C) may not be included.
  • the photosensitive resin composition contains a coupling agent (C) and a coupling agent other than the coupling agent (C), a coupling agent other than the coupling agent (C) and the coupling agent (C);
  • the content of the coupling agent (C) is preferably 30% by mass or more, and more preferably 50% by mass or more with respect to the total content. In this case, good dispersibility of the organic filler (B) and the silica filler (D) in the photosensitive resin composition can be obtained.
  • the content of the coupling agent (C) is within a range of 0.01 to 10 parts by mass with respect to a total of 100 parts by mass of the content of the organic filler (B) and the content of the silica filler (D). It is preferable. When the content of the coupling agent (C) falls within this range, aggregation of the organic filler (B) and the silica filler (D) in the photosensitive resin composition is prevented, and dispersibility is improved.
  • the content of the coupling agent (C) is in the range of 0.05 to 5 parts by mass with respect to 100 parts by mass in total of the content of the organic filler (B) and the content of the silica filler (D). It is more preferable.
  • Silica filler (D) has an average primary particle diameter in the range of 1 to 150 nm. When the average primary particle diameter of the silica filler (D) is within this range, the transparency of the photosensitive resin composition containing the organic filler (B) is efficiently increased. Therefore, the resolution of the photosensitive resin composition is further improved.
  • the average primary particle diameter of the silica filler (D) is measured using a dynamic light scattering method.
  • the silica filler (D) preferably has an average primary particle diameter in the range of 1 to 60 nm, and more preferably in the range of 1 to 30 nm. In this case, the transparency and resolution of the photosensitive resin composition are further improved.
  • the silica filler (D) preferably contains silica particles derived from silica sol.
  • the transparency of the photosensitive resin composition containing the organic filler (B) is further increased, and the resolution of the photosensitive resin composition is further improved.
  • the silica sol include a spherical silica sol and a chain silica sol.
  • silica filler (D) examples include organosilica sols manufactured by Nissan Chemical Industries, Ltd .: part numbers MA-ST-M, MA-ST-L, IPA-ST, IPA-ST-ZL, IPA-ST-UP, EG -ST, NPC-ST-30, PGM-ST, DMAC-ST, MEK-ST-40, MIBK-ST, MIBK-ST-L, CHO-ST-M, EAC-ST, TOL-ST, MEK-AC -4130Y, MEK-AC-5140Z, PGM-AC-2140Y, PGM-AC-4130Y, MIBK-AC-2140Z, MIKB-SD-L, MEK-EC-6150P, MEK-EC-7150P, EP-F2130Y, EP -F6140P, EP-F7150P, PMA-ST, MEK-EC-2130Y, MEK-AC-2140Z, M KNOST-L, MEK-ST-ZL, MEK-ST-UP; NANOC
  • the photosensitive resin composition may further contain an inorganic filler other than the silica filler (D).
  • the inorganic filler other than the silica filler (D) may include a silica filler whose average primary particle diameter is not within the range of 1 to 150 nm, or may include an inorganic filler other than the silica filler.
  • examples of inorganic fillers other than the silica filler (D) include barium sulfate, crystalline silica, nano silica, carbon nanotube, talc, bentonite, aluminum hydroxide, magnesium hydroxide, and titanium oxide.
  • the photosensitive resin composition contains a white material such as titanium oxide or zinc oxide, the photosensitive resin composition and its cured product can be whitened.
  • the photosensitive resin composition may not contain an inorganic filler other than the silica filler (D).
  • the photosensitive resin composition contains an inorganic filler other than the silica filler (D) and the silica filler (D)
  • the content of the silica filler (D) is preferably 30% by mass or more, and more preferably 50% by mass or more. In this case, good transparency and resolution of the photosensitive resin composition can be obtained.
  • the content of the silica filler (D) is preferably in the range of 5 to 200 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A).
  • the content of the silica filler (D) is 5 parts by mass or more, the transparency of the photosensitive resin composition is further increased.
  • the photosensitive resin composition can have further excellent resolution because the content of the silica filler (D) is 200 parts by mass or less.
  • content of a silica filler (D) becomes in this range, while further raising the glass transition point of the hardened
  • the content of the silica filler (D) is more preferably in the range of 20 to 150 parts by mass, and preferably 40 to 100 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A). Particularly preferred.
  • the photosensitive resin composition preferably further contains an unsaturated compound (E) having at least one ethylenically unsaturated bond in one molecule.
  • the unsaturated compound (E) can impart photocurability to the photosensitive resin composition.
  • the unsaturated compound (E) is, for example, a monofunctional (meth) acrylate such as 2-hydroxyethyl (meth) acrylate; and diethylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) Acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ⁇ -caprolactone modified pentaerythritol hexaacrylate, tricyclo
  • the unsaturated compound (E) preferably contains at least one compound selected from the group consisting of trimethylolpropane tri (meth) acrylate and tricyclodecane dimethanol di (meth) acrylate.
  • the photosensitive resin composition can have excellent transparency and stability.
  • the unsaturated compound (E) more preferably contains tricyclodecane dimethanol di (meth) acrylate. In this case, the dielectric loss tangent of the cured product of the photosensitive resin composition can be further reduced.
  • the unsaturated compound (E) contains a trifunctional compound, that is, a compound having three unsaturated bonds in one molecule.
  • the resolution of the photosensitive resin composition is further improved, and the developability of the photosensitive resin composition with an alkaline aqueous solution is particularly improved.
  • Trifunctional compounds include, for example, trimethylolpropane tri (meth) acrylate, EO modified trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated isocyanuric acid tri (meth) acrylate and ⁇ -caprolactone modified At least one compound selected from the group consisting of tris- (2-acryloxyethyl) isocyanurate and ethoxylated glycerin tri (meth) acrylate.
  • the unsaturated compound (E) contains a phosphorus-containing compound (phosphorus-containing unsaturated compound).
  • Phosphorus-containing unsaturated compounds include, for example, 2-methacryloyloxyethyl acid phosphate (specific examples: product number light ester P-1M and light ester P-2M manufactured by Kyoeisha Chemical Co., Ltd.), 2-acryloyloxyethyl acid phosphate (Specific examples are product number light acrylate P-1A manufactured by Kyoeisha Chemical Co., Ltd.), diphenyl-2-methacryloyloxyethyl phosphate (specific examples are product number MR-260 manufactured by Daihachi Industry Co., Ltd.), and Showa Polymer Co., Ltd.
  • HFA series (specifically, product numbers HFA-6003 and HFA-6007, which are addition reaction products of dipentaerystol hexaacrylate and HCA, are addition reaction products of caprolactone-modified dipentaerystol hexaacrylate and HCA) Part number HFA 003, and may contain HFA-6127, etc.) one or more compounds selected from the group consisting of.
  • the unsaturated compound (E) may contain a prepolymer.
  • the prepolymer is at least one selected from the group consisting of, for example, a prepolymer obtained by polymerizing a monomer having an ethylenically unsaturated bond and then adding an ethylenically unsaturated group, and oligo (meth) acrylate prepolymers These compounds can be contained.
  • Oligo (meth) acrylate prepolymers include, for example, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spirane resin (meth) acrylate At least one component selected from the group consisting of:
  • the content of the unsaturated compound (E) is in the range of 1 to 50% by mass with respect to the content of the carboxyl group-containing resin (A). Preferably, it is in the range of 10 to 45% by mass, and more preferably in the range of 21 to 40% by mass.
  • the photosensitive resin composition preferably further contains a photopolymerization initiator (F).
  • a photoinitiator (F) contains an acyl phosphine oxide type photoinitiator, for example. That is, the photosensitive resin composition contains, for example, an acyl phosphine oxide photopolymerization initiator.
  • F photopolymerization initiator
  • when exposing the photosensitive resin composition high photosensitivity can be imparted to the photosensitive resin composition.
  • cured material of the photosensitive resin composition is suppressed, and the insulation of the layer containing hardened
  • Acylphosphine oxide photopolymerization initiators include monoacylphosphine oxides such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and 2,4,6-trimethylbenzoyl-ethyl-phenyl-phosphinate.
  • Photopolymerization initiator bis- (2,6-dichlorobenzoyl) phenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -2,5-dimethylphenylphosphine oxide, bis- (2,6- Dichlorobenzoyl) -4-propylphenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -1-naphthylphosphine oxide, bis- (2,6-dimethoxybenzoyl) phenylphosphine oxide, bis- (2, 6-Dimethoxybenzoyl -2,4,4-trimethylpentylphosphine oxide, bis- (2,6-dimethoxybenzoyl) -2,5-dimethylphenylphosphine oxide, bis- (2,4,6-trimethylbenzoyl) phenylphosphine oxide And one or more components selected from the group consisting of bisacylphosphine
  • the acyl phosphine oxide photopolymerization initiator preferably includes 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and the acyl phosphine oxide photopolymerization initiator includes 2,4,6-trimethylbenzoyl. Only diphenyl-phosphine oxide may be included.
  • the photopolymerization initiator (F) preferably contains a hydroxyketone photopolymerization initiator in addition to the acylphosphine oxide photopolymerization initiator. That is, the photosensitive resin composition preferably contains a hydroxyketone photopolymerization initiator. In this case, higher photosensitivity can be imparted to the photosensitive resin composition as compared with the case where no hydroxyketone photopolymerization initiator is contained. Thereby, when hardening the photosensitive resin composition by exposure, it becomes possible to make it fully harden
  • hydroxyketone-based photopolymerization initiation examples include 1-hydroxy-cyclohexyl-phenyl-ketone, phenylglyoxyc acid methyl ester, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl -1-propan-1-one, 2-hydroxy-1- ⁇ 4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl ⁇ -2-methyl-propan-1-one and 2- Includes hydroxy-2-methyl-1-phenyl-propan-1-one.
  • the mass ratio between the acylphosphine oxide photopolymerization initiator and the hydroxyketone photopolymerization initiator is , Preferably in the range of 1: 0.01 to 1:10.
  • the curability in the vicinity of the surface of the coating film formed from the photosensitive resin composition and the curability in the deep portion can be improved in a well-balanced manner.
  • the photopolymerization initiator (F) contains bis (diethylamino) benzophenone. That is, the photosensitive resin composition contains an acyl phosphine oxide photopolymerization initiator and bis (diethylamino) benzophenone, or an acyl phosphine oxide photopolymerization initiator, a hydroxyketone photopolymerization initiator, and bis (diethylamino). It is also preferable to contain benzophenone. In this case, when developing after partially exposing the coating film formed from the photosensitive resin composition, the resolution is particularly enhanced by suppressing the curing of the unexposed portion.
  • the content of bis (diethylamino) benzophenone is 0. 0 relative to the acyl phosphine oxide photopolymerization initiator. It is preferably in the range of 5 to 20% by mass. When the content of bis (diethylamino) benzophenone is 0.5% by mass or more, the resolution is particularly high. Further, when the content of bis (diethylamino) benzophenone is 20% by mass or less, bis (diethylamino) benzophenone hardly inhibits the electrical insulation of the cured product of the photosensitive resin composition.
  • the content of the photopolymerization initiator (F) is preferably in the range of 0.1 to 30% by mass with respect to the content of the carboxyl group-containing resin (A), preferably in the range of 1 to 25% by mass. More preferably.
  • the photosensitive resin composition preferably further contains an epoxy compound (G).
  • the epoxy compound (G) can impart thermosetting properties to the photosensitive resin composition.
  • the epoxy compound (G) preferably contains a crystalline epoxy resin.
  • the crystalline epoxy resin is an epoxy resin having a melting point.
  • the crystalline epoxy resin can impart thermosetting properties to the photosensitive resin composition.
  • the crystalline epoxy resin improves the heat resistance and developability of the cured product.
  • the crystalline epoxy resin is, for example, 1,3,5-tris (2,3-epoxypropyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, hydroquinone type crystal Epoxy resin (specifically, product name YDC-1312 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), biphenyl type crystalline epoxy resin (specifically, product name YX-4000 manufactured by Mitsubishi Chemical Corporation), diphenyl ether type crystalline epoxy resin (specifically For example, Nippon Steel & Sumikin Chemical Co., Ltd., product number YSLV-80DE), bisphenol type crystalline epoxy resin (specifically, Nippon Steel & Sumikin Chemical Co., Ltd.
  • product name YSLV-80XY tetrakisphenol ethane type crystalline epoxy resin Nippon Kayaku Co., Ltd. product number GTR-1800
  • bisphenolfluorene type Preferably includes one or more components selected from the group consisting of (epoxy resin having a structure represented by the formula (2) as a specific example) sex epoxy resin.
  • the crystalline epoxy resin may have two epoxy groups in one molecule. In this case, it is possible to make it hard to generate cracks in the cured product while the temperature change is repeated.
  • the crystalline epoxy resin preferably has an epoxy equivalent of 150 to 300 g / eq. This epoxy equivalent is the gram weight of a crystalline epoxy resin containing 1 gram equivalent of epoxy groups.
  • the melting point of the crystalline epoxy resin examples include 70 to 180 ° C.
  • the crystalline epoxy resin preferably contains a crystalline epoxy resin having a melting point of 110 ° C. or lower. In this case, the developability of the photosensitive resin composition with an alkaline aqueous solution is particularly improved. Crystalline epoxy resins having a melting point of 110 ° C.
  • biphenyl type epoxy resins specifically, product number YX4000 manufactured by Mitsubishi Chemical Corporation
  • biphenyl ether type epoxy resins specifically, product number YSLV- manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. 80DE
  • a bisphenol type epoxy resin part number YSLV-80XY manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. as a specific example
  • a bisphenol fluorene type crystalline epoxy resin an epoxy resin having a structure represented by the formula (2) as a specific example.
  • the epoxy compound (G) may contain an epoxy compound other than the crystalline epoxy resin.
  • the epoxy compound other than the crystalline epoxy resin includes an amorphous epoxy resin.
  • An amorphous epoxy resin is an epoxy resin having no melting point.
  • the amorphous epoxy resin can impart thermosetting properties to the photosensitive resin composition.
  • the amorphous epoxy resin preferably has at least two epoxy groups in one molecule.
  • Amorphous epoxy resins include, for example, phenol novolac type epoxy resins (specifically, product number EPICLON N-775 manufactured by DIC Corporation) and cresol novolac type epoxy resins (specific examples, product number EPICLON N-695 manufactured by DIC Corporation).
  • Bisphenol A novolac type epoxy resin (specific example, product number EPICLON N-865 manufactured by DIC Corporation), bisphenol A type epoxy resin (specific example, product number jER1001 manufactured by Mitsubishi Chemical Corporation), bisphenol F type epoxy resin (specific example As product number jER4004P manufactured by Mitsubishi Chemical Co., Ltd.), bisphenol S type epoxy resin (specifically, product number EPICLON EXA-1514 manufactured by DIC Corporation), bisphenol AD type epoxy resin, biphenyl novolac Type epoxy resin (part number NC-3000 manufactured by Nippon Kayaku Co., Ltd.), hydrogenated bisphenol A type epoxy resin (part number ST-4000D manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), naphthalene type epoxy resin (particular Examples include DIC Corporation part numbers EPICLON HP-4032, EPICLON HP-4700, EPICLON HP-4770), tertiary butyl catechol type epoxy resin (specific examples DIC Corporation part number EPICLON HP-820), dicyclopentad
  • Type epoxy resin (specifically, product number EPICLON HP-7200 manufactured by DIC), adamantane type epoxy resin (specific example, product number ADAMANTATE X-E-201 manufactured by Idemitsu Kosan Co., Ltd.), special bifunctional epoxy resin (tool)
  • product numbers YL7175-500 and YL7175-1000 manufactured by Mitsubishi Chemical Corporation product numbers EPICLON TSR-960, EPICLON TER-601, EPICLON TSR-250-80BX, EPICLON 1650-75MPX, EPICLON EXA- manufactured by DIC Corporation 4850, EPICLON EXA-4816, EPICLON EXA-4822, and EPICLON EXA-9726
  • product number YSLV-120TE manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. rubber core-shell polymer modified bisphenol A type epoxy resin (specifically, manufactured by Kaneka Corporation) Product number MX-156), and rubber core-shell polymer modified bis
  • the epoxy compound (G) may contain a phosphorus-containing epoxy resin.
  • phosphorus-containing epoxy resins include phosphoric acid-modified bisphenol F-type epoxy resins (specific examples of product numbers EPICLON EXA-9726 and EPICLON EXA-9710 manufactured by DIC Corporation), and product number Epototo FX-305 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Is mentioned.
  • the epoxy compound (G) preferably contains only a crystalline epoxy resin or a crystalline epoxy resin and an amorphous epoxy resin.
  • the epoxy compound (G) preferably contains 10% by mass or more of a crystalline epoxy resin, more preferably 30% by mass or more, and still more preferably 50% by mass. In this case, the developability of the photosensitive resin composition with an alkaline aqueous solution can be improved, and the heat resistance and insulation of the cured product of the photosensitive resin composition can be particularly improved.
  • the content of the epoxy compound (G) is such that the total of equivalents of epoxy groups contained in the epoxy compound (G) is 0.7 to 2.5 with respect to 1 equivalent of carboxyl groups contained in the carboxyl group-containing resin (A). Is preferably in the range of 0.7 to 2.3, more preferably in the range of 0.7 to 2.0. Further, when the epoxy compound (G) contains a crystalline epoxy resin, the total of the equivalents of epoxy groups contained in the crystalline epoxy resin is 0. 0 with respect to 1 equivalent of carboxyl groups contained in the carboxyl group-containing resin (A). It is preferably within the range of 7 to 2.5, more preferably within the range of 0.7 to 2.3, and even more preferably within the range of 0.7 to 2.0.
  • the photosensitive resin composition may contain melamine.
  • the adhesion between the cured product of the photosensitive resin composition and a metal such as copper is increased.
  • the photosensitive resin composition is particularly suitable as an insulating material for a printed wiring board.
  • the plating resistance of the cured product of the photosensitive resin composition that is, the whitening resistance during the electroless nickel / gold plating process is improved.
  • the melamine is preferably in the range of 0.1 to 10% by mass with respect to the content of the carboxyl group-containing resin (A), preferably 0.5 to 5% by mass. % Is more preferable.
  • the photosensitive resin composition may contain an organic solvent.
  • the organic solvent is used for the purpose of liquefaction or varnishing of the photosensitive resin composition, viscosity adjustment, application property adjustment, film formation property adjustment, and the like.
  • Organic solvents include, for example, linear, branched, secondary or polyhydric alcohols such as ethanol, propyl alcohol, isopropyl alcohol, hexanol and ethylene glycol; ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene and xylene Petroleum aromatic mixed solvents such as Swazol series (manufactured by Maruzen Petrochemical Co., Ltd.) and Solvesso series (manufactured by Exxon Chemical Co.); cellosolves such as cellosolve and butylcellosolve; Tolls; propylene glycol alkyl ethers such as propylene glycol methyl ether; polypropylene glycol alkyl ethers such as dipropylene glycol methyl ether; ethyl acetate, butyl acetate, cellosolve acetate, cal Acetic acid esters such as tall acetate; as well as one or more compounds
  • the amount of the organic solvent is determined so that the organic solvent is volatilized quickly when the coating film formed from the photosensitive resin composition is dried, that is, the organic solvent is dried. It is preferable to adjust so as not to remain in the film.
  • the organic solvent is preferably in the range of 0 to 99.5% by mass and more preferably in the range of 15 to 60% by mass with respect to the entire photosensitive resin composition.
  • a ratio is suitably adjusted according to the application method.
  • the photosensitive resin composition may further contain components other than the said component.
  • the photosensitive resin composition may further contain a known photopolymerization accelerator, sensitizer and the like.
  • the photosensitive resin composition includes benzoin and its alkyl ethers; acetophenones such as acetophenone and benzyldimethyl ketal; anthraquinones such as 2-methylanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2- Thioxanthones such as isopropylthioxanthone, 4-isopropylthioxanthone and 2,4-diisopropylthioxanthone; benzophenones such as benzophenone and 4-benzoyl-4′-methyldiphenyl sulfide; xanthones such as 2,4-diisopropylxanthone; ⁇ -hydroxyketones such as hydroxy-2-methyl-1-phenyl-propan-1-one; 2-methyl-1- [4-
  • the photosensitive resin composition is known in combination with a photopolymerization initiator (C), such as tertiary amines such as p-dimethylbenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ester and 2-dimethylaminoethylbenzoate.
  • C photopolymerization initiator
  • you may contain a photoinitiator, a sensitizer, etc.
  • the photosensitive resin composition may contain at least one of a photopolymerization initiator for visible light exposure and a photopolymerization initiator for near-infrared exposure.
  • the photosensitive resin composition contains a photopolymerization initiator (F) and a coumarin derivative such as 7-diethylamino-4-methylcoumarin, which is a sensitizer for laser exposure, a carbocyanine dye system, a xanthene dye system, and the like. May be.
  • F photopolymerization initiator
  • a coumarin derivative such as 7-diethylamino-4-methylcoumarin, which is a sensitizer for laser exposure, a carbocyanine dye system, a xanthene dye system, and the like. May be.
  • Photosensitive resin composition comprising tolylene diisocyanate, morpholine diisocyanate, isophorone diisocyanate and hexamethylene diisocyanate blocked isocyanates blocked with caprolactam, oxime, malonic acid ester, etc .; melamine resin, n-butylated melamine resin , Amino resins such as isobutylated melamine resin, butylated urea resin, butylated melamine urea cocondensation resin, benzoguanamine-based cocondensation resin; various other thermosetting resins; ultraviolet curable epoxy (meth) acrylates; , Phenol novolak type, cresol novolak type, alicyclic type and other epoxy resins obtained by adding (meth) acrylic acid; and diallyl phthalate resin, phenoxy resin, urethane resin, fluorine resin It may contain one or more resins that are selected from the group consisting of a polymer compound.
  • the photosensitive resin composition may contain a curing agent for curing the epoxy compound (G).
  • the curing agent include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- (2 Imidazole derivatives such as -cyanoethyl) -2-ethyl-4-methylimidazole; dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine, Amine compounds such as 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic hydrazide and sebacic acid hydrazide; phosphorus compounds such as
  • Examples of commercially available products of these components include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (both trade names of imidazole compounds) manufactured by Shikoku Kasei Co., Ltd., U-CAT3503N, U -CAT3502T (all are trade names of blocked isocyanate compounds of dimethylamine), DBU, DBN, U-CATSA102, U-CAT5002 (all are bicyclic amidine compounds and salts thereof).
  • the photosensitive resin composition may contain an adhesion-imparting agent other than melamine.
  • adhesion-imparting agent include guanamine, acetoguanamine, benzoguanamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-4,6-diamino-S-triazine, 2-vinyl- Examples thereof include S-triazine derivatives such as 4,6-diamino-S-triazine / isocyanuric acid adduct and 2,4-diamino-6-methacryloyloxyethyl-S-triazine / isocyanuric acid adduct.
  • Photosensitive resin composition includes a curing accelerator; a colorant; a copolymer such as silicone and acrylate; a leveling agent; an adhesion-imparting agent; a thixotropic agent; a polymerization inhibitor; an antihalation agent; a flame retardant; One or more components selected from the group consisting of an inhibitor; a surfactant; and a polymer dispersant may be contained.
  • the content of the amine compound in the photosensitive resin composition is preferably as small as possible. In this case, the electrical insulation of the layer made of a cured product of the photosensitive resin composition is unlikely to be impaired.
  • the amine compound is preferably 8% by mass or less, and more preferably 5% by mass or less, based on the content of the carboxyl group-containing resin (A).
  • the photosensitive resin composition can be prepared by blending the raw materials of the photosensitive resin composition as described above and kneading by a known kneading method using, for example, a three roll, ball mill, sand mill or the like.
  • the raw material of the photosensitive resin composition contains a liquid component, a low viscosity component, etc.
  • the part of the raw material excluding the liquid component, the low viscosity component, etc. is first kneaded
  • the photosensitive resin composition may be prepared by adding and mixing a liquid component, a component having a low viscosity, and the like.
  • the first agent may be prepared by mixing a part of the components of the photosensitive resin composition
  • the second agent may be prepared by mixing the rest of the components.
  • the photosensitive resin composition may include a first agent and a second agent.
  • the first agent is prepared by mixing and dispersing a part of the components of the photosensitive resin composition in advance, and the remaining part of the components of the photosensitive resin composition is mixed and dispersed.
  • a second agent may be prepared. In this case, it is possible to prepare a mixed solution by mixing the necessary amount of the first agent and the second agent in a timely manner and curing the mixed solution to obtain a cured product.
  • the photosensitive resin composition according to the present embodiment is suitable as an electrically insulating material for a printed wiring board.
  • the photosensitive resin composition is suitable for forming an electrically insulating layer such as a solder resist layer, a plating resist layer, an etching resist layer, and an interlayer insulating layer.
  • FIGS. 1A to 1E an example of a method for producing a printed wiring board including an interlayer insulating layer formed from the photosensitive resin composition according to the present embodiment will be described with reference to FIGS. 1A to 1E.
  • a through hole is formed in the interlayer insulating layer by photolithography.
  • a core material 1 is prepared as shown in FIG. 1A.
  • the core material 1 includes, for example, at least one insulating layer 2 and at least one conductor wiring 3.
  • the conductor wiring 3 provided on one surface of the core material 1 is hereinafter referred to as a first conductor wiring 3.
  • membrane 4 is formed from the photosensitive resin composition on the surface in which the 1st conductor wiring 3 of the core material 1 is provided. Examples of the method for forming the film 4 include a coating method and a dry film method.
  • a photosensitive resin composition is coated on the core material 1 to form a wet coating film.
  • the method for applying the photosensitive resin composition is selected from the group consisting of known methods such as dipping, spraying, spin coating, roll coating, curtain coating, and screen printing.
  • the wet coating film is dried at a temperature in the range of 60 to 120 ° C., for example, and the coating film 4 can be obtained.
  • a photosensitive resin composition is applied on an appropriate support made of polyester or the like, and then dried to form a dry film containing the photosensitive resin composition on the support.
  • the dry film with a support provided with a dry film and the support body which supports a dry film is obtained.
  • the dry film with a support the dry film is laminated on the core material 1, then pressure is applied to the dry film and the core material 1, and then the support is peeled off from the dry film, whereby the dry film is cored on the support. Transfer onto material 1.
  • the coating 4 made of a dry film is provided on the core material 1.
  • the film 4 is exposed to light and partially cured as shown in FIG. 1C.
  • a negative mask is applied to the film 4 and then the film 4 is irradiated with ultraviolet rays through the negative mask.
  • the negative mask includes an exposure part that transmits ultraviolet rays and a non-exposure part that blocks ultraviolet rays.
  • the negative mask is a photo tool such as a mask film or a dry plate.
  • ultraviolet light sources include chemical lamps, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, metal halide lamps, LEDs, g-line (436 nm), h-line (405 nm), i-line (365 nm), and It is selected from the group consisting of a combination of two or more of g-line, h-line and i-line.
  • the film may be exposed by a direct drawing method in which ultraviolet rays emitted from a light source are irradiated only on a portion to be exposed on the film 4.
  • Light sources applied to the direct drawing method include, for example, chemical lamps, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultrahigh-pressure mercury lamps, xenon lamps, metal halide lamps, LEDs, g-line (436 nm), h-line (405 nm), i-line. (365 nm) and a group consisting of a combination of two or more of g-line, h-line and i-line.
  • the support 4 is allowed to pass through and the ultraviolet ray is irradiated onto the coating 4 made of the dry film without peeling off the support. Then, the coating 4 may be exposed to light, and then the support may be peeled off from the coating 4 before the development treatment.
  • the coating 4 is developed to remove the unexposed portion 5 of the coating 4 shown in FIG. 1C, whereby the hole 6 is formed at the position where the through hole 10 is formed as shown in FIG. 1D.
  • an appropriate developer according to the composition of the photosensitive resin composition can be used.
  • the developer is, for example, an alkaline aqueous solution containing at least one of an alkali metal salt and an alkali metal hydroxide, or an organic amine.
  • the alkaline aqueous solution is, for example, sodium carbonate, potassium carbonate, ammonium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, ammonium hydrogen carbonate, sodium hydroxide, potassium hydroxide, ammonium hydroxide, tetramethyl ammonium hydroxide and water. It contains at least one component selected from the group consisting of lithium oxide.
  • the solvent in the alkaline aqueous solution may be water alone or a mixture of water and a hydrophilic organic solvent such as lower alcohols.
  • the organic amine contains, for example, at least one component selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine and triisopropanolamine.
  • the developer is preferably an alkaline aqueous solution containing at least one of an alkali metal salt and an alkali metal hydroxide, and particularly preferably an aqueous sodium carbonate solution. In this case, it is possible to improve the work environment and reduce the burden of waste disposal.
  • the coating 4 is thermally cured by heating.
  • the heating conditions are, for example, within a heating temperature range of 120 to 200 ° C. and a heating time range of 30 to 150 minutes.
  • the performance of the interlayer insulating layer 7 such as strength, hardness, and chemical resistance is improved.
  • the coating film 4 may be further irradiated with ultraviolet rays before or after heating. In this case, photocuring of the film 4 can be further advanced.
  • the thickness of the interlayer insulating layer 7 is not particularly limited, but may be in the range of 10 to 50 ⁇ m.
  • the interlayer insulating layer 7 made of a cured product of the photosensitive resin composition is provided on the core material 1.
  • the second conductor wiring 8 and the hole plating 9 can be provided on the interlayer insulating layer 7 by a known method such as an additive method.
  • a printed wiring board 11 having a through hole 10 for electrically connecting the first conductor wiring 3 and the second conductor wiring 8 is obtained.
  • the hole plating 9 has a cylindrical shape that covers the inner surface of the hole 6, but the entire inner side of the hole 6 may be filled with the hole plating 9.
  • the core material includes, for example, at least one insulating layer and at least one conductor wiring.
  • a film is formed from the photosensitive resin composition on the surface of the core material where the conductor wiring is provided.
  • Examples of the method for forming the film include a coating method and a dry film method.
  • the coating method and the dry film method the same method as that for forming the interlayer insulating layer can be employed.
  • the film is partially photocured by exposure. The exposure method can be the same as the method for forming the interlayer insulating layer.
  • the film is subjected to a development process to remove the unexposed part of the film, whereby the exposed part of the film remains on the core material.
  • the coating on the core material is heated and cured.
  • the developing method and the heating method can be the same as the method for forming the interlayer insulating layer.
  • the film may be further irradiated with ultraviolet rays before or after heating. In this case, photocuring of the film can be further advanced.
  • the thickness of the solder resist layer is not particularly limited, but may be in the range of 10 to 50 ⁇ m.
  • a solderless resist layer made of a cured product of the photosensitive resin composition is provided on the core material.
  • a printed wiring board provided with the core material provided with an insulating layer and the conductor wiring on it, and the soldering resist layer which partially covers the surface in which the conductor wiring in a core material is provided is obtained.
  • the intermediate solution in the flask was charged with 58.8 parts by mass of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 60.8 parts by mass of tetrahydrophthalic anhydride, and propylene glycol monomethyl. 38.7 parts by mass of ether acetate was added, and the mixture was heated at 115 ° C. for 6 hours while stirring under air bubbling, and further heated at 80 ° C. for 1 hour. This obtained a 65 mass% solution of carboxyl group-containing resin A-1.
  • the weight average molecular weight of the carboxyl group-containing resin A-1 was 3096, and the acid value was 105 mgKOH / g.
  • photosensitive resin compositions of Examples 1 to 18 and Comparative Examples 1 to 5 were prepared as follows. The components shown in the following table were blended in a flask and stirred and mixed at a temperature of 35 ° C. for 2 hours to obtain a photosensitive resin composition (see Tables 1 to 3). The photosensitive resin composition was filtered through a 300 mesh filter, and then filtered through a filter having a hole diameter of 10 ⁇ m.
  • surface shows the mass part of the solid content of the description component.
  • methyl ethyl ketone is blended as a diluent in the photosensitive resin composition.
  • -Dispersion of organic filler B Crosslinked rubber (SBR) having an average primary particle size of 0.07 ⁇ m and having a carboxyl group and a hydroxyl group, manufactured by JSR Corporation, product number XSK-500, a methyl ethyl ketone dispersion having a content of 15% by weight of crosslinked rubber .
  • Coupling agent A tetraethoxysilane.
  • Coupling agent B methyltrimethoxysilane.
  • Coupling agent C 3-glycidoxypropyltrimethoxysilane.
  • Coupling agent D N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane.
  • Coupling agent E Vinyltrimethoxysilane.
  • Silica filler A manufactured by Nissan Chemical Industries, Ltd., product number PMA-ST, propylene glycol monomethyl ether acetate dispersed silica sol, solid content concentration of 30% by mass, average primary particle size of 10 to 15 nm.
  • Silica filler B manufactured by Nissan Chemical Industries, Ltd., product number MEK-EC-2130Y, methyl ethyl ketone-dispersed silica sol, grade with improved compatibility with epoxy resin, solid content concentration of 30% by mass, average primary particle size of 10 to 15 nm.
  • Silica filler C Nissan Chemical Industries, Ltd., product number MEK-AC-2140Z, methyl ethyl ketone-dispersed silica sol, grade with improved compatibility with acrylic resin, solid content concentration 40 mass%, average primary particle size 10-15 nm.
  • Silica filler D manufactured by Nissan Chemical Industries, Ltd., product number MEK-ST-L, methyl ethyl ketone-dispersed silica sol, solid content concentration of 30% by mass, average primary particle size of 40 to 50 nm.
  • Silica filler E manufactured by Nissan Chemical Industries, Ltd., product number MEK-ST-ZL, methyl ethyl ketone-dispersed silica sol, solid content concentration of 30% by mass, average primary particle size of 70 to 100 nm.
  • Silica filler F manufactured by Nissan Chemical Industries, Ltd., product number MEK-ST-UP, methyl ethyl ketone-dispersed chain silica sol, solid content concentration 20% by mass, average primary particle size 40-100 nm.
  • Silica filler G manufactured by Tatsumori Co., Ltd., product number Imsil A8, crystalline silica, average primary particle size 2 ⁇ m.
  • Unsaturated compound A tricyclodecane dimethanol diacrylate.
  • Unsaturated compound B trimethylolpropane triacrylate.
  • Unsaturated compound C a mixture of dipentaerystol pentaacrylate and dipentaerystol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd., product number KAYARAD DPHA.
  • Photopolymerization initiator A 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, manufactured by BASF, product number Irgacure TPO.
  • Photopolymerization initiator B 1-hydroxy-cyclohexyl-phenyl-ketone, manufactured by BASF, product number Irgacure 184
  • Photopolymerization initiator C 4,4′-bis (diethylamino) benzophenone
  • Epoxy compound Bisphenol type crystalline epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., product number YSLV-80XY, melting point 75 to 85 ° C., epoxy equivalent 192 g / eq.
  • Antioxidant A hindered phenol antioxidant, manufactured by BASF, product number IRGANOX 1010.
  • Surface conditioner DIC Corporation, product number MegaFuck F-477.
  • test pieces were prepared as follows.
  • the photosensitive resin composition was coated on a polyethylene terephthalate film with an applicator and then dried by heating at 95 ° C. for 25 minutes to form a dry film having a thickness of 30 ⁇ m on the film.
  • a glass epoxy copper clad laminate (FR-4 type) provided with a copper foil having a thickness of 17.5 ⁇ m was prepared.
  • a comb-shaped electrode having a line width / space width of 50 ⁇ m / 50 ⁇ m was formed as a conductor wiring on this glass epoxy copper clad laminate by a subtractive method, thereby obtaining a core material.
  • the conductor layer was roughened by dissolving and removing the surface layer portion of the core material having a thickness of about 1 ⁇ m with an etching agent (organic acid type micro-etching agent, product number CZ-8101 manufactured by MEC Co., Ltd.).
  • a dry film was laminated by heating with a vacuum laminator over the entire surface of the core material.
  • the conditions for heat lamination are 0.5 MPa, 80 ° C., and 1 minute.
  • a 30 ⁇ m-thick film made of a dry film was formed on the core material.
  • the film In a state where a negative mask having a non-exposed portion of a pattern including a circular shape having a diameter of 30 ⁇ m, 40 ⁇ m, and 50 ⁇ m is directly applied to this film from a polyethylene terephthalate film, the film is 250 mJ / cm through the negative mask. Ultraviolet rays were irradiated under the conditions of 2 .
  • the film made from a polyethylene terephthalate was peeled from the dry film (coating) after exposure and before development. The exposed film was developed.
  • Comparative Example 5 in which the evaluation of developability is C, the following evaluations (6-5) to (6-11) are not performed. Further, in Example 17 and Comparative Example 6 in which the evaluation of developability is B, in the following (6-6) evaluation test for roughness after post-smear, all of the film remaining on the non-exposed portion on the core material was removed.
  • the surface of the layer made of the cured product is roughened at 70 ° C. for 10 minutes.
  • the surface of the layer made of the cured product was roughened.
  • the surface of the layer made of the roughened cured product was washed with hot water.
  • cured material was removed for 5 minutes at 40 degreeC using the neutralization liquid (Atotech Japan Co., Ltd. product, Reduction Solution Securigant P).
  • Ra is less than 0.2 ⁇ m.
  • B Ra is 0.2 ⁇ m or more and less than 0.25 ⁇ m.
  • C Ra is 0.25 ⁇ m or more and less than 0.3 ⁇ m.
  • D Ra is 0.3 ⁇ m or more.
  • the adhesion between the copper plating layer and the layer made of the cured product on the test piece was evaluated as follows.
  • the peel strength between the copper plating layer and the layer made of the cured product is determined according to JIS-C6481. Measured according to A: The peel strength of the copper plating layer is 0.4 kN / m or more.
  • C The peel strength of the copper plating layer is less than 0.3 kN / m.
  • D Blister was generated during heating after the electroless copper plating treatment or during heating after the electrolytic copper plating treatment.
  • C The electric resistance value was always maintained at 10 6 ⁇ or more until 70 hours passed from the start of the test, but the electric resistance value became less than 10 6 ⁇ before 85 hours passed from the start of the test.
  • D The electrical resistance value was less than 10 6 ⁇ before 70 hours passed from the start of the test.
  • the photosensitive resin composition was coated on a polyethylene terephthalate film with an applicator, and then dried by heating at 95 ° C. for 25 minutes to form a dry film having a thickness of 30 ⁇ m on the film.
  • This dry film was heat-laminated with a vacuum laminator over the entire surface of a Teflon (registered trademark) film.
  • the conditions for heat lamination are 0.5 MPa, 80 ° C., and 1 minute.
  • a 30 ⁇ m-thick film made of a dry film was formed on a Teflon (registered trademark) film.
  • the film was irradiated with ultraviolet rays under the condition of 250 mJ / cm 2 through the mask in a state where a mask having a 3 mm ⁇ 15 mm rectangular exposed portion was directly applied to the film from a polyethylene terephthalate film. .
  • the film made from a polyethylene terephthalate was peeled from the dry film (coating) after exposure and before development.
  • the exposed film was developed. In the development process, a 1% Na 2 CO 3 aqueous solution at 30 ° C. was sprayed onto the film for 90 seconds at a spray pressure of 0.2 MPa. Subsequently, the film was cleaned by spraying pure water with a spray pressure of 0.2 MPa for 90 seconds.
  • the film was irradiated with ultraviolet rays under the condition of 1000 mJ / cm 2 .
  • a cured product of the photosensitive resin composition was formed on a film made of Teflon (registered trademark).
  • the cured product was peeled from the film made of Teflon (registered trademark) to obtain a test piece.
  • TMA test equipment (Thermoplus EVOII TMA8310, manufactured by Rigaku Corporation) measurement is performed under the conditions of a temperature range of 25 to 250 ° C., a heating / cooling rate of 10 ° C./min, and a load of 5 g.
  • the glass transition point (Tg) of the piece was determined. The results were evaluated as follows. A: Tg is 160 ° C. or higher. B: Tg is 145 ° C. or higher and lower than 160 ° C. C: Tg is 130 ° C. or higher and lower than 145 ° C. D: Tg is less than 130 ° C.
  • test pieces were prepared as follows using the photosensitive resin compositions of Examples 1 to 18 and Comparative Examples 1 to 4 and 6.
  • the photosensitive resin composition was coated on a polyethylene terephthalate film with an applicator and then dried by heating at 95 ° C. for 25 minutes to form a dry film having a thickness of 50 ⁇ m on the film.
  • This dry film was heat-laminated with a vacuum laminator over the entire surface of a Teflon (registered trademark) film.
  • the conditions for heat lamination are 0.5 MPa, 80 ° C., and 1 minute. Thereby, a film having a thickness of 50 ⁇ m made of a dry film was formed on a film made of Teflon (registered trademark).
  • the film was irradiated with ultraviolet rays under the condition of 250 mJ / cm 2 through the mask in a state where a mask having a 3 mm ⁇ 85 mm rectangular exposed portion was directly applied to the film from a polyethylene terephthalate film. .
  • the film made from a polyethylene terephthalate was peeled from the dry film (coating) after exposure and before development.
  • the exposed film was developed. In the development process, a 1% Na 2 CO 3 aqueous solution at 30 ° C. was sprayed onto the film for 90 seconds at a spray pressure of 0.2 MPa. Subsequently, the film was cleaned by spraying pure water with a spray pressure of 0.2 MPa for 90 seconds.
  • the film was irradiated with ultraviolet rays under the condition of 1000 mJ / cm 2 .
  • a cured product of the photosensitive resin composition was formed on a film made of Teflon (registered trademark).
  • the cured product was peeled from the film made of Teflon (registered trademark) to obtain a test piece.
  • the dielectric loss tangent of the test piece at a frequency of 1 GHz was measured by a cavity resonator method using a dielectric constant measuring apparatus (ADMS01O manufactured by AET Co., Ltd.). The results were evaluated as follows.
  • D tan ⁇ is 0.030 or more.
  • the photosensitive resin composition of the first aspect according to the present invention is a photosensitive resin composition having photocurability, and is a carboxyl group-containing resin (A ), An organic filler (B) having an average primary particle size of 1 ⁇ m or less, a carboxyl group, and at least one atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom, A functional group having at least one group selected from the group consisting of an alkoxy group, an acyloxy group, and an alkoxide; and an average primary particle diameter of 1 to 150 nm.
  • Silica filler (D) which is within the range.
  • the first aspect it is possible to form a cured product having high copper plating adhesion and low roughness after desmearing and having excellent resolution.
  • the coupling agent (C) has a silicon atom.
  • the dispersibility of the silica filler (D) in the photosensitive resin composition is efficiently increased, and the transparency and stability of the photosensitive resin composition are improved. While increasing the glass transition point of the hardened
  • the silica filler (D) includes silica particles derived from silica sol.
  • the transparency of the photosensitive resin composition is increased, and the resolution of the photosensitive resin composition is improved.
  • the silica filler (D) has an average primary particle diameter in the range of 1 to 60 nm. .
  • the transparency and resolution of the photosensitive resin composition are improved.
  • the photosensitive resin composition according to the fifth aspect of the present invention any one of the first to fourth aspects.
  • the content of the organic filler (B) is in the range of 1 to 50 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin (A).
  • good copper plating adhesion of the cured product of the photosensitive resin composition can be obtained.
  • the outstanding resolution of the photosensitive resin composition can be obtained.
  • the thixotropy of the photosensitive resin composition is increased and the stability is improved.
  • the content of the silica filler (D) is the content of the carboxyl group-containing resin (A).
  • the amount is in the range of 5 to 200 parts by mass with respect to 100 parts by mass.
  • the transparency of the photosensitive resin composition increases, and the photosensitive resin composition can have excellent resolution.
  • the glass transition point of the cured product of the photosensitive resin composition can be increased, and the thermal expansion coefficient and dielectric loss tangent can be reduced.
  • the surface roughness of the cured product after the desmear treatment of the cured product of the photosensitive resin composition can be further reduced.
  • the carboxyl group-containing resin (A) is a carboxyl group-containing resin having an ethylenically unsaturated group. including.
  • photocurability can be imparted to the photosensitive resin composition.
  • the content of the coupling agent (C) is the content of the organic filler (B).
  • the content of the silica filler (D) is in the range of 0.01 to 10 parts by mass with respect to 100 parts by mass in total.
  • the eighth aspect aggregation of the organic filler (B) and the silica filler (D) in the photosensitive resin composition is prevented, and dispersibility is improved.
  • the organic filler (B) has a particle diameter of 10 ⁇ m or less in the photosensitive resin composition. Is included in the state.
  • the stability of the photosensitive resin composition is improved and the resolution is improved because scattering at the time of exposure is suppressed.
  • the organic filler (B) contains a rubber component.
  • flexibility can be imparted to the cured product of the photosensitive resin composition.
  • the rubber component is at least one polymer selected from the group consisting of crosslinked acrylic rubber, crosslinked NBR, crosslinked MBS, and crosslinked SBR. including.
  • the photosensitive resin composition can have high transparency, and the resolution of the photosensitive resin composition can be improved.
  • the carboxyl group-containing resin (A) includes a carboxyl group-containing resin having a benzene ring.
  • the transparency of the photosensitive resin composition is increased, and the photosensitive resin composition has excellent resolution.
  • the carboxyl group-containing resin (A) is a reaction between a polyalcohol resin and an acid dianhydride.
  • the copolymer obtained by this is included.
  • high alkali developability can be imparted to the photosensitive resin composition, and high heat resistance and insulation can be imparted to the cured product of the photosensitive resin composition.
  • the acid dianhydride contains an acid dianhydride having an aromatic ring.
  • high alkali developability can be imparted to the photosensitive resin composition, and high heat resistance and insulation can be imparted to the cured product of the photosensitive resin composition.
  • the carboxyl group-containing resin (A) is at least one of a biphenyl skeleton and a bisphenolfluorene skeleton. Containing a carboxyl group-containing resin.
  • the dielectric loss tangent in the cured product of the photosensitive resin composition can be further reduced.
  • the photosensitive resin composition according to the sixteenth aspect of the present invention in any one of the first to fifteenth aspects, comprises an unsaturated compound (E) having at least one ethylenically unsaturated bond in one molecule; And a photopolymerization initiator (F).
  • high photosensitivity can be imparted to the photosensitive resin composition. Moreover, generation
  • the unsaturated compound (E) is trimethylolpropane tri (meth) acrylate and tricyclodecane dimethanol di (meth) acrylate.
  • the photosensitive resin composition can have excellent transparency and stability.
  • the photosensitive resin composition of the eighteenth aspect according to the present invention further contains an epoxy compound (G) in any one of the first to seventeenth aspects.
  • thermosetting can be imparted to the photosensitive resin composition.
  • the dry film of the nineteenth aspect according to the present invention contains the photosensitive resin composition of any one of the first to eighteenth aspects.
  • a cured film having high copper plating adhesion and low desmear roughness can be formed, and a dry film having excellent resolution can be obtained.
  • a printed wiring board according to a twentieth aspect of the present invention includes an interlayer insulating layer containing a cured product of the photosensitive resin composition according to any one of the first to eighteenth aspects.
  • the twentieth aspect it is possible to obtain a printed wiring board having an interlayer insulating layer having high copper plating adhesion and low roughness after desmearing.
  • the printed wiring board according to the twenty-first aspect of the present invention includes a solder resist layer containing a cured product of the photosensitive resin composition according to any one of the first to thirteenth aspects.
  • a printed wiring board having a solder resist layer having high copper plating adhesion and low roughness after desmearing can be obtained.

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  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
PCT/JP2018/017810 2017-06-09 2018-05-08 感光性樹脂組成物、ドライフィルム、及びプリント配線板 WO2018225441A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020197603A (ja) * 2019-05-31 2020-12-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112526823A (zh) * 2019-09-19 2021-03-19 株式会社田村制作所 感光性树脂组合物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064276A (ja) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及び多層プリント配線基板
JP2002357895A (ja) * 2001-05-31 2002-12-13 Mitsubishi Gas Chem Co Inc レジスト樹脂組成物
JP2008225244A (ja) * 2007-03-14 2008-09-25 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010197996A (ja) * 2009-01-30 2010-09-09 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びに絶縁膜の製造方法
JP2012041452A (ja) * 2010-08-19 2012-03-01 Hitachi Chem Co Ltd ポリヒドロキシウレタン化合物及びその製造方法、並びに、硬化性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
JP2016188985A (ja) * 2015-03-30 2016-11-04 日立化成株式会社 感光性樹脂組成物、感光性エレメント、硬化物、半導体装置及びレジストパターンの形成方法
JP2017090494A (ja) * 2015-11-02 2017-05-25 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3496674B2 (ja) * 1997-11-28 2004-02-16 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
JP4508929B2 (ja) 2005-03-31 2010-07-21 新日鐵化学株式会社 絶縁膜用感光性樹脂組成物
JP5571990B2 (ja) * 2009-06-04 2014-08-13 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5723958B1 (ja) * 2013-12-02 2015-05-27 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN107250198B (zh) * 2015-01-28 2020-02-21 互应化学工业株式会社 含羧基树脂、感光性树脂组合物、干膜、印刷布线板以及含羧基树脂的制造方法
JP6704224B2 (ja) * 2015-04-15 2020-06-03 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI620012B (zh) * 2015-11-02 2018-04-01 互應化學工業股份有限公司 感光性樹脂組成物、乾膜及印刷線路板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064276A (ja) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及び多層プリント配線基板
JP2002357895A (ja) * 2001-05-31 2002-12-13 Mitsubishi Gas Chem Co Inc レジスト樹脂組成物
JP2008225244A (ja) * 2007-03-14 2008-09-25 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010197996A (ja) * 2009-01-30 2010-09-09 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びに絶縁膜の製造方法
JP2012041452A (ja) * 2010-08-19 2012-03-01 Hitachi Chem Co Ltd ポリヒドロキシウレタン化合物及びその製造方法、並びに、硬化性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2012136693A (ja) * 2010-12-08 2012-07-19 Ajinomoto Co Inc 樹脂組成物
JP2016188985A (ja) * 2015-03-30 2016-11-04 日立化成株式会社 感光性樹脂組成物、感光性エレメント、硬化物、半導体装置及びレジストパターンの形成方法
JP2017090494A (ja) * 2015-11-02 2017-05-25 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020197603A (ja) * 2019-05-31 2020-12-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法
JP7251323B2 (ja) 2019-05-31 2023-04-04 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法

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