Classifications

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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/226—Mixtures of di-epoxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/24—Di-epoxy compounds carbocyclic
  • C08G59/245—Di-epoxy compounds carbocyclic aromatic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/3227—Compounds containing acyclic nitrogen atoms
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/50—Amines
  • C08G59/5046—Amines heterocyclic
  • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
  • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/04—Carbon
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
  • C08K5/3445—Five-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
  • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
  • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
  • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/003—Additives being defined by their diameter

Definitions

• the present invention relates to a liquid resin composition for compression molding and an electronic component device.
• a wafer level chip size package that performs resin sealing at the wafer stage is attracting attention.
• this wafer level chip size package a large number of elements are sealed at a wafer stage by compression molding (compression molding) using a solid epoxy resin composition or printing molding using a liquid epoxy resin composition. Divide into pieces. Therefore, the productivity can be greatly improved as compared with the method of sealing after the element is singulated.
• the sealed silicon wafer tends to warp, and this warpage is a problem in the subsequent steps of conveyance, grinding, inspection, and singulation, and there may be a problem that the device characteristics may vary depending on the device. .
• Patent Document 1 describes a liquid epoxy resin composition for sealing containing a liquid bisphenol-type epoxy resin, silicone rubber fine particles, a silicone-modified epoxy resin, an aromatic amine curing agent, an inorganic filler, and an organic solvent.
• Patent Document 2 a liquid epoxy resin, an aromatic amine curing agent, a core-shell silicone polymer fine particle comprising a solid silicone polymer core and an organic polymer shell, an inorganic filler and an organic solvent are contained.
• a liquid epoxy resin composition is described.
• Patent Document 3 discloses a liquid molding agent containing an epoxy resin, an acid anhydride curing agent, and an inorganic filler.
• Patent Document 1 using silicone rubber fine particles and silicone-modified epoxy resin
• Patent Document 2 using fine particles of a core-shell silicone polymer
• the elastic modulus of the cured epoxy resin can be lowered and the stress can be reduced.
• patent document 3 which uses an acid anhydride hardening
• the elastic modulus of the cured epoxy resin is high, and the warp of a large silicon wafer may not be sufficiently reduced.
• silicon wafers tend to have larger diameters and thinner thicknesses in the future, and it is necessary to reduce the warpage of these silicon wafers.
• the problem of warpage of a silicon wafer is considered to be a problem that can occur in all semiconductor wafers such as compound semiconductor wafers such as SiC (silicon carbide) wafers, sapphire wafers, and GaAs (gallium arsenide) wafers.
• One form of this invention is made in view of this situation, and it aims at providing the liquid resin composition for compression molding which can suppress generation
• a liquid resin composition for compression molding comprising (A) an aliphatic epoxy compound, (B) an epoxy compound having an aromatic ring in the molecule, (C) a nitrogen-containing heterocyclic compound and (D) an inorganic filler.
• a liquid resin composition for compression molding comprising (A) an aliphatic epoxy compound, (B) an epoxy compound having an aromatic ring in the molecule, (C) a nitrogen-containing heterocyclic compound and (D) an inorganic filler.
• n is an integer of 1 to 15.
• the epoxy compound (B) having an aromatic ring in the molecule is N, N-diglycidyl orthotoluidine and N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy )
• liquid resin composition for compression molding according to any one of ⁇ 1> to ⁇ 4>, comprising (E) a coupling agent.
• An electronic component device comprising an element sealed with the liquid resin composition for compression molding according to any one of ⁇ 1> to ⁇ 5>.
• liquid resin composition for compression molding capable of suppressing the occurrence of warpage of a semiconductor wafer and an electronic component device using the same.
• each component may contain a plurality of corresponding substances.
• the content or content of each component is the total content or content of the multiple types of substances present in the composition unless otherwise specified.
• a plurality of particles corresponding to each component may be included.
• the particle diameter of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
• the term “layer” or “film” includes only a part of the region in addition to the case where the layer or film is formed over the entire region. The case where it is formed is also included.
• the liquid resin composition for compression molding of the present disclosure includes (A) an aliphatic epoxy compound, (B) an epoxy compound having an aromatic ring in the molecule, (C) a nitrogen-containing heterocyclic compound, and (D) an inorganic filler. .
• the liquid resin composition for compression molding of the present disclosure may contain other components other than the above components as necessary. According to the liquid resin composition for compression molding of the present disclosure, it is possible to suppress the occurrence of warpage of the semiconductor wafer. Hereinafter, each component which comprises the liquid resin composition for compression molding is demonstrated.
• the liquid resin composition for compression molding contains (A) an aliphatic epoxy compound.
• the (A) aliphatic epoxy compound means an aliphatic compound having at least one epoxy group in the molecule and having no cyclic structure other than the epoxy group in the molecule. Even if the liquid resin composition for compression molding contains the (A) aliphatic epoxy compound, even if the liquid resin composition for compression molding is used in a state of being applied to a semiconductor wafer and cured, the warpage of the semiconductor wafer is more likely to occur. There is a tendency to be effectively suppressed.
• (A) As an aliphatic epoxy compound a well-known thru
• Specific examples of (A) aliphatic epoxy compounds include alkyl alcohol glycidyl ether [butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.], alkenyl alcohol glycidyl ether [vinyl glycidyl ether, allyl glycidyl ether, etc.] Monofunctional aliphatic epoxy compound having one group; bifunctional aliphatic epoxy compound having two epoxy groups in a molecule such as alkylene glycol diglycidyl ether, poly (alkylene glycol) diglycidyl ether, alkenylene glycol diglycidyl ether; Polyglycidyl ethers of tri- or higher functional alcohols such as trimethylolpropane, pentaerythritol, dipentaeryth
• a bifunctional aliphatic epoxy compound is preferable in that the warpage of the semiconductor wafer when a cured product is formed on the semiconductor wafer is more efficiently suppressed.
• the bifunctional aliphatic epoxy compound ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,3-propanediol diglycidyl ether, 2-methyl-1,3-propanediol diglycidyl ether 2-butyl-2-ethyl-1,3-propanediol diglycidyl ether, 1,4-butanediol diglycidyl ether (tetramethylene glycol diglycidyl ether), neopentyl glycol diglycidyl ether, 3-methyl-2, 4-pentanediol diglycidyl ether, 2,4-pentanediol diglycidyl ether,
• polyalkylene glycol diglycidyl ether is preferable in some embodiments in that warpage of a semiconductor wafer is highly suppressed, and polyalkylene glycol diglycidyl ether having 1 to 20 alkylene glycol (alkyleneoxy) units (particularly, More preferred are alkylene glycol diglycidyl ethers having 1 to 20 alkylene glycol units and 2 to 4 carbon atoms in the alkylene glycol unit. In another embodiment, polyalkylene glycol diglycidyl ether having 2 to 20 alkylene glycol (alkyleneoxy) units (particularly, the number of alkylene glycol units having 2 to 20 carbon atoms in the alkylene glycol unit). 2 to 4 alkylene glycol diglycidyl ether).
• the molecular weight of the aliphatic epoxy compound (in the case of a polymer, the number average molecular weight in terms of standard polystyrene by gel permeation chromatography (GPC) using tetrahydrofuran as an elution solvent) is not particularly limited, and is 200 to 10,000. It is preferably 200 to 1200, more preferably 200 to 1000, and particularly preferably 300 to 900.
• GPC gel permeation chromatography
• (A) aliphatic epoxy compound a compound represented by the following general formula (I) (diglycidyl ether of tetramethylene glycol or diglycidyl ether of polytetramethylene glycol) is preferably exemplified.
• a compound represented by the following general formula (I) diglycidyl ether of tetramethylene glycol or diglycidyl ether of polytetramethylene glycol
• n is an integer of 1 to 15.
• the (A) aliphatic epoxy compound may be used alone or in combination of two or more.
• the compound represented by the general formula (I) commercially available products such as trade name “Epogosei PT (general grade)” (Yokkaichi Gosei Co., Ltd., polytetramethylene glycol diglycidyl ether, number average molecular weight 700 to 800), etc. Can also be used.
• the content of the (A) aliphatic epoxy compound contained in the liquid resin composition for compression molding is not particularly limited, and the total amount of the compound having an epoxy group contained in the liquid resin composition for compression molding (total epoxy compound ; 100% by mass), preferably 3% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, and still more preferably 10% by mass to 30% by mass.
• total epoxy compound 100% by mass
• total epoxy compound 100% by mass
• the liquid resin composition for compression molding contains (B) an epoxy compound having an aromatic ring in the molecule.
• numerator a well-known thru
• Specific examples of epoxy compounds having an aromatic ring in the molecule include glycidyl ethers of phenols such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S, catechol and resorcinol, and hydroxycarboxylic acids such as p-hydroxybenzoic acid.
• Glycidyl ether esters of acids monoglycidyl esters or polyglycidyl esters of carboxylic acids such as benzoic acid, phthalic acid, terephthalic acid, diglycidyl aniline, diglycidyl toluidine, triglycidyl-p-aminophenol, tetraglycidyl-m-xylylene Epoxy compounds having a naphthalene skeleton such as glycidylamine type epoxy compounds such as amines, glycidyl esters of naphthol, glycidyl ether esters such as ⁇ -hydroxynaphthoic acid, etc. And the like. Moreover, you may use the novolak compound which made novolak-ized phenols, such as phenol, catechol, and resorcinol. Among these, glycidylamine type epoxy compounds are preferable.
• the epoxy compound having an aromatic ring in the molecule (B) contained in the liquid resin composition for compression molding preferably has a viscosity of 30 mPa ⁇ s to 5000 mPa ⁇ s at 25 ° C., preferably 30 mPa ⁇ s to 1000 mPa ⁇ s. Those exhibiting a viscosity of are more preferred.
• the viscosity at 25 ° C. refers to a value measured at a shear rate of 10 rotations / minute using a rotary shear viscometer equipped with a cone plate (diameter 48 mm, cone angle 1 °).
• N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline and N, N— are used as epoxy compounds having an aromatic ring in the molecule.
• Diglycidyl orthotoluidine is preferably exemplified.
• N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline and N, N-diglycidyl orthotoluidine are used together as an epoxy compound having an aromatic ring in the molecule
• the content ratio of N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline and N, N-diglycidyl orthotoluidine based on mass (N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline / N, N-diglycidyl orthotoluidine) is preferably from 0.5 to 13.0, preferably from 0.7 to It is more preferably 8.0, and further preferably 1.0 to 3.5.
• the content of the epoxy compound having an aromatic ring in the molecule (B) contained in the liquid resin composition for compression molding is not particularly limited, and the compound having an epoxy group contained in the liquid resin composition for compression molding is not limited. It is preferably 45% to 95% by mass, more preferably 55% to 90% by mass, and still more preferably 65% to 85% by mass with respect to the total amount (total epoxy compound; 100% by mass). It is. (B) When the content of the epoxy compound having an aromatic ring in the molecule is 45% by mass or more, curability tends to be improved. On the other hand, when the content of the epoxy compound having an aromatic ring in the molecule (B) is 95% by mass or less, the warp of the semiconductor wafer tends to be suppressed.
• the epoxy compound having an aromatic ring therein is preferably 0.05 to 1.22, more preferably 0.11 to 0.82, and preferably 0.17 to 0.54. Further preferred.
• the liquid resin composition for compression molding contains (C) a nitrogen-containing heterocyclic compound.
• a nitrogen-containing heterocyclic compound any known or commonly used nitrogen-containing heterocyclic compound may be used as long as it allows the polymerization of (A) an aliphatic epoxy compound and (B) an epoxy compound having an aromatic ring in the molecule. It can be used and is not particularly limited.
• Specific examples of the nitrogen-containing heterocyclic compound include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4.
• (C) As the nitrogen-containing heterocyclic compound, those adducted or microencapsulated with an epoxy resin or an isocyanate resin can be used. Of these, 2-phenyl-4-methylimidazole is preferred from the viewpoint of reactivity and storage stability.
• the compounding quantity of a nitrogen-containing heterocyclic compound is a total of 100 mass parts of (A) an aliphatic epoxy compound, (B) the epoxy compound which has an aromatic ring in a molecule
• the amount is preferably 2 to 20 parts by weight, more preferably 3 to 12 parts by weight.
• the compounding amount of the nitrogen-containing heterocyclic compound is 2 parts by mass or more, the curing time of the liquid resin composition for compression molding does not become too long, and the productivity of the electronic component device tends to be improved. .
• the compounding quantity of a nitrogen-containing heterocyclic compound is 20 mass parts or less, there exists a tendency for the storage stability of the liquid resin composition for compression molding to improve.
• a curing agent such as a liquid acid anhydride, a liquid phenol, an aromatic amine or the like can be used in combination within the range not impairing the effects of the present invention.
• the curing agent other than (C) the nitrogen-containing heterocyclic compound is less than 0.1 equivalent with respect to 1 equivalent of the epoxy compound in the liquid resin composition for compression molding.
• the liquid resin composition for compression molding contains (D) an inorganic filler.
• an inorganic filler a well-known thru
• silica such as fused silica, crystalline silica, calcium carbonate, clay, alumina, silicon nitride, silicon carbide, boron nitride, calcium silicate, potassium titanate, aluminum nitride, beryllia, zirconia, zircon
• examples thereof include powders such as fosterite, steatite, spinel, mullite, titania, beads spheroidized from these, and glass fibers.
• examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, and zinc molybdate.
• fused silica is preferable from the viewpoint of reducing the linear expansion coefficient
• alumina is preferable from the viewpoint of high thermal conductivity.
• the shape of the (D) inorganic filler is preferably spherical from the viewpoints of (D) high filling of the inorganic filler and fluidity and permeability into the fine gaps of the liquid resin composition for compression molding.
• the average particle diameter of the inorganic filler is preferably 1 ⁇ m to 20 ⁇ m, more preferably 1.5 ⁇ m to 15 ⁇ m, even more preferably 2 ⁇ m to 10 ⁇ m, particularly in the case of spherical silica.
• the average particle diameter refers to the particle diameter at which the volume cumulative particle size distribution measured using a laser diffraction method is 50%. If the average particle diameter of the (D) inorganic filler is 1 ⁇ m or more, it tends to be easy to disperse the (D) inorganic filler in the liquid resin composition for compression molding at a high concentration.
• the average particle size of the inorganic filler is 20 ⁇ m or less, the coarse particle component of the (D) inorganic filler is reduced, and the filling of the liquid resin composition for compression molding into the fine gaps or streaks during printing is reduced.
• the shape defect tends to be suppressed, and the surface smoothness tends to be improved.
• the content of the inorganic filler is preferably in the range of 73 to 93% by mass, more preferably in the range of 78 to 91% by mass, with respect to the total amount of the liquid resin composition for compression molding.
• (D) If the content rate of an inorganic filler is 73 mass% or more, the reduction effect of the thermal expansion coefficient of the hardened
• the content rate of an inorganic filler is 93 mass% or less, the raise of the viscosity of the liquid resin composition for compression molding can be suppressed, and there exists a tendency for coating workability
• the liquid resin composition for compression molding may contain (E) a coupling agent as necessary in order to strengthen the adhesion between the resin and the inorganic filler or between the resin and the component of the electronic component.
• E As a coupling agent, a well-known thru
• Examples of coupling agents include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxy.
• Silane ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldimethoxysilane, vinyltriacetoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropylmethyldimethoxysilane , ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropylmethyldiethoxysilane, ⁇ -anilinopropyltrimethoxysilane, ⁇ -anilinopropyltriethoxysilane, ⁇ - (N, N-dimethyl) aminopro Rutrimethoxysilane, ⁇ - (N, N-diethyl) aminopropyltrimethoxysilane, ⁇ - (N, N-dibutyl) aminopropyltrimethoxysilane, ⁇ - (N-methyl) an
• the content of (E) coupling agent is 0. 0 with respect to the total amount of (D) inorganic filler and (E) coupling agent.
• the content is preferably 1% by mass to 2.0% by mass, and more preferably 0.2% by mass to 1.5% by mass. If the content rate of (E) coupling agent is 0.1 mass% or more, the effect of improving the dispersibility of (D) inorganic filler by (E) coupling agent tends to be easily obtained.
• the content rate of a coupling agent is 2.0 mass% or less, there exists a tendency for a void to be hard to generate
• the liquid resin composition for compression molding may contain (F) an organic solvent as needed.
• (F) As an organic solvent a well-known thru
• the content of (F) organic solvent may be less than 5% by mass with respect to the total amount of components (A) to (F). preferable.
• the liquid resin composition for compression molding may contain other components other than the components (A) to (F) as necessary.
• the liquid resin composition for compression molding may contain (A) an aliphatic epoxy compound and (B) another epoxy compound other than an epoxy compound having an aromatic ring in the molecule.
• (A) aliphatic epoxy compounds and (B) known or conventional epoxy compounds other than epoxy compounds having an aromatic ring in the molecule can be used, and are not particularly limited.
• the content of other epoxy compounds is the total amount of compounds having epoxy groups contained in the liquid resin composition for compression molding (total epoxy compounds; 100% by mass). ) Is preferably more than 0% by mass and 40% by mass or less, more preferably more than 0% by mass and 30% by mass or less, and still more preferably more than 0% by mass and 20% by mass or less.
• the liquid resin composition for compression molding preferably contains an ion trap agent as another component.
• an ion trap agent A well-known thru
• the ion trapping agent include hydrotalcites, hydrous oxides of elements such as magnesium, aluminum, titanium, zirconium and bismuth. These ion trapping agents may be used alone or in combination of two or more. Specific examples include DHT-4A (Kyowa Chemical Industry Co., Ltd., trade name), IXE500 (Toa Gosei Co., Ltd., trade name), and the like.
• the content of the ion trapping agent in the liquid resin composition for compression molding is not particularly limited as long as it is a sufficient amount capable of capturing anions such as halogen ions and cations such as sodium, and 1 mass with respect to the total amount of the epoxy compound. % To 10% by mass is preferable.
• the liquid resin composition for compression molding includes, as other components, a curing accelerator; a coloring agent such as a dye, a pigment, and carbon black; a silicone oil; a surfactant; an antioxidant; a phosphate ester; a melamine, a melamine derivative, and a triazine.
• nitrogen-containing compounds such as cyanuric acid derivatives and isocyanuric acid derivatives; phosphorus nitrogen-containing compounds such as cyclophosphazene; metal compounds such as zinc oxide, iron oxide, molybdenum oxide and ferrocene; antimony trioxide, antimony tetraoxide, It is preferable to contain antimony oxides such as antimony pentoxide and conventionally known flame retardants such as brominated epoxy resins as necessary.
• the liquid resin composition for compression molding may be prepared by any method as long as the above various components can be uniformly dispersed and mixed.
• a general method for preparing a liquid resin composition for compression molding is to weigh a predetermined amount of ingredients and disperse them with a three-roll, crushed machine, planetary mixer, hard mixer, homomixer, etc. The method of kneading can be mentioned.
• distribution and preheating of each compounding component is preferable from the point of uniform dispersibility and fluidity
• the curing conditions for the liquid resin composition for compression molding of the present disclosure are not particularly limited.
• the temperature of the heat treatment is preferably 120 ° C. to 200 ° C., more preferably 130 ° C. to 180 ° C., and further preferably 140 ° C. to 170 ° C.
• the heat treatment time is preferably 15 minutes to 3 hours, more preferably 30 minutes to 2 hours.
• the glass transition temperature measured by the DMA method for the cured product of the liquid resin composition for compression molding of the present disclosure is preferably 125 ° C. or higher, and more preferably 150 ° C. or higher.
• the elastic modulus at a temperature lower than the glass transition temperature measured by the DMA method for the cured product of the liquid resin composition for compression molding of the present disclosure is preferably 20 GPa or less, and more preferably 16 GPa or less.
• the linear expansion coefficient at a temperature lower than the glass transition temperature of the cured product of the liquid resin composition for compression molding according to the present disclosure is preferably 15 ppm / ° C. or less, and more preferably 12 ppm / ° C. or less.
• the viscosity at 25 ° C. of the liquid resin composition for compression molding of the present disclosure is preferably less than 1000 Pa ⁇ s, more preferably 800 Pa ⁇ s or less, and further preferably 500 Pa ⁇ s or less.
• An electronic component device includes an element sealed with the liquid resin composition for compression molding according to the present disclosure.
• Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers and other supporting members, semiconductor chips, transistors, diodes, thyristors and other active elements, capacitors, resistors, resistor arrays, coils
• An electronic component device obtained by mounting an electronic component such as a passive element such as a switch and sealing a necessary portion with the liquid resin composition for compression molding of the present disclosure can be given.
• the liquid resin composition for compression molding of the present disclosure is effective for an electronic component device that requires low warpage and high reliability, and is particularly suitable for a wafer level chip size package.
• Examples of a method for sealing an element using the liquid resin composition for compression molding according to the present disclosure include a dispensing method, a casting method, a printing method, and the like, and a printing method is particularly preferable.
• Example 1 and 2 and Comparative Example 1 Each material shown in Table 1 was mixed for 2 hours using a planetary mixer, and further stirred and degassed for 1 hour at a vacuum degree of 80 Pa to 90 Pa using a hard mixer to produce a liquid resin composition for compression molding.
• component, B) component, (C) component and (D) component are respectively (A) an aliphatic epoxy compound, (B) an epoxy compound having an aromatic ring in the molecule, (C) A nitrogen-containing heterocyclic compound and (D) an inorganic filler are meant.
• the unit of a composition of each component of Table 1 is a mass part.
• the manufactured liquid resin composition for compression molding was evaluated by the following tests. The obtained results are summarized in Table 1.
• Viscosity and thickness index Using a Brookfield HB viscometer, the viscosity of the produced liquid resin composition for compression molding was measured at 25 ° C. and 10 rpm. When the viscosity at 25 ° C. is less than 1000 Pa ⁇ s, high productivity can be obtained by using an ordinary compression molding apparatus. Further, the value obtained by dividing the measured value of the viscosity of the liquid resin composition for compression molding under the condition of 25 ° C. and 1 revolution / minute by dividing the measured value of the viscosity measured under the condition of 25 ° C. and 10 revolutions / minute is changed. It was an index.
• Linear expansion coefficient A cured product obtained by heat-curing the liquid resin composition for compression molding at 150 ° C. for 60 minutes is subjected to 50 to 70 ° C. and 180 ° C. to 180 ° C. by TMA (Thermal Mechanical Analysis) using Bruker ASX's TMA4000SA series. The linear expansion coefficient was measured at 200 ° C., respectively. When the linear expansion coefficient at a temperature lower than Tg is 12 ppm / ° C. or less, the warp of the semiconductor wafer can be sufficiently reduced.
• Glass transition temperature (Tg) and elastic modulus About the hardened
• DMA Dynamic Mechanical Analysis, dynamic viscoelasticity measurement
• a liquid resin composition layer for compression molding having a diameter of 292 mm and a thickness of 300 ⁇ m was formed on a silicon wafer having a diameter of 300 mm and a thickness of 300 ⁇ m by using a mold, and was heated and cured at 150 ° C. for 60 minutes to prepare a sample. After curing, the difference in height between the center and end of the silicon wafer was measured as a warp using a ruler.
• Example 2 The average particle size of all silica fillers contained in Example 2 and Comparative Example 1 was 8 ⁇ m.
• liquid resin composition for compression molding As described above, by using the liquid resin composition for compression molding according to the present disclosure, a large number of elements can be collectively sealed even for a thinner silicon wafer or a silicon wafer having a size of 12 inches or larger. can do. Furthermore, even when the liquid resin composition for compression molding according to the present disclosure is applied to a compound semiconductor wafer such as a SiC (silicon carbide) wafer, a sapphire wafer, or a GaAs (gallium arsenide) wafer, the warpage of the semiconductor wafer is generated. It is thought that it can be suppressed.
• SiC silicon carbide
• sapphire wafer a sapphire wafer
• GaAs gallium arsenide

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• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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