WO2018196112A1 - Ltps阵列基板及其制作方法 - Google Patents

Ltps阵列基板及其制作方法 Download PDF

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Publication number
WO2018196112A1
WO2018196112A1 PCT/CN2017/087785 CN2017087785W WO2018196112A1 WO 2018196112 A1 WO2018196112 A1 WO 2018196112A1 CN 2017087785 W CN2017087785 W CN 2017087785W WO 2018196112 A1 WO2018196112 A1 WO 2018196112A1
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WIPO (PCT)
Prior art keywords
layer
pressure
pressure sensing
touch signal
substrate
Prior art date
Application number
PCT/CN2017/087785
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English (en)
French (fr)
Inventor
杨成奥
Original Assignee
武汉华星光电技术有限公司
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Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/578,109 priority Critical patent/US10281758B2/en
Publication of WO2018196112A1 publication Critical patent/WO2018196112A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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    • G02F1/1343—Electrodes
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G02F1/13685—Top gates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/10—Materials and properties semiconductor
    • G02F2202/104—Materials and properties semiconductor poly-Si
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

Definitions

  • the present invention relates to the field of liquid crystal display technologies, and in particular, to an LTPS array substrate and a method for fabricating the LTPS array substrate.
  • the pressure touch technology mainly presses the touch panel according to the finger, such as a mobile phone or a tablet computer, and the surface of the touch panel is deformed, and the pressure sensor detects the change of the capacitance or the resistance caused by the deformation to realize the pressure touch sensing.
  • the prior art generally adopts an external pressure touch structure, the pressure sensor There is an air layer on the upper side or the lower side, resulting in lower sensitivity of the pressure sensing, and a new substrate needs to be introduced during the preparation of the pressure sensor.
  • Increasing the number of fittings and additional flexible circuit boards increase the manufacturing cost of the display panel.
  • the thickness and weight of the entire display module will increase, which is inconsistent with the ultra-thin and light weight pursued by the mobile phone and the mobile office, and is not ideal for pressure touch sensing.
  • the prior art external pressure touch panel has low pressure sensing sensitivity, requires additional components during production, thereby increasing the weight and thickness of the panel, and it is difficult to achieve high quality built-in pressure touch. Control panel.
  • the invention provides an LTPS array substrate, which can integrate the pressure sensor in the panel in a friendly manner, so as to solve the existing external pressure touch panel, the pressure sensing sensitivity is low, and additional devices are needed in the production, thereby increasing the number of devices.
  • the weight and thickness of the panel, and the technical problems of the high-quality built-in pressure touch panel are difficult to achieve.
  • the invention provides an LTPS array substrate, comprising:
  • the pressure sensing layer being a piezoelectric material; the pressure sensing layer being patterned into a plurality of pressure sensing plates;
  • the planar touch signal line and the pressure touch signal line are formed, and the pressure touch signal line is connected to the pressure sensing board;
  • a dielectric layer formed on a surface of the organic film layer, wherein the dielectric layer is formed with a touch through hole;
  • a passivation layer is formed on a surface of the dielectric layer, a common electrode layer is formed in the passivation layer, and the common electrode layer is patterned to form a plurality of common electrode plates, and the planar touch signal line passes through the touch a control via is connected to the common electrode plate;
  • the organic film layer includes a first planarization layer and a second planarization layer formed on a surface of the first planarization layer, the pressure sensing plate being located at the first planarization layer and the second planarization layer Between the layers, the second planarization layer is provided with a pressure sensitive through hole, and the pressure sensing plate is connected to the pressure touch signal line through the pressure sensitive through hole.
  • the common electrode includes a plurality of common electrode plates distributed in an array, and each of the common electrode plates is connected to one of the planar touch signal lines;
  • the pressure sensing plates are arranged in an array, and each of the pressure sensing plates is connected to one of the pressure touch signal lines.
  • a pressure sensing plate is disposed directly below each of the common electrode plates.
  • a light shielding layer is formed in the substrate, a surface of the substrate is formed with a polysilicon layer, the polysilicon layer forms a channel region, and a source doped region located on both sides of the channel region Forming, with the drain doping region, the insulating gate layer, the surface of the insulating gate layer forming a gate electrode, and the interlayer insulating layer, the surface of the insulating layer forming a source and a drain, The source is in contact with the source doped region through a source via, the drain is in contact with the drain doped region through a drain via, and a passivation layer is formed on the surface of the dielectric layer.
  • a surface of the passivation layer is formed with a pixel electrode, and the pixel electrode is connected to the drain through a pixel electrode via.
  • the common electrode and the pressure touch signal line are both transparent metal electrodes.
  • the present invention also provides another LTPS array substrate, comprising:
  • the pressure sensing layer being a piezoelectric material; the pressure sensing layer being patterned into a plurality of pressure sensing plates;
  • the planar touch signal line and the pressure touch signal line are formed, and the pressure touch signal line is connected to the pressure sensing board;
  • a dielectric layer formed on a surface of the organic film layer, wherein the dielectric layer is formed with a touch through hole;
  • a passivation layer is formed on a surface of the dielectric layer, a common electrode layer is formed in the passivation layer, and the common electrode layer is patterned to form a plurality of common electrode plates, and the planar touch signal line passes through the touch A control via is connected to the common electrode plate.
  • the common electrode includes a plurality of common electrode plates distributed in an array, and each of the common electrode plates is connected to one of the planar touch signal lines;
  • the pressure sensing plates are arranged in an array, and each of the pressure sensing plates is connected to one of the pressure touch signal lines.
  • a pressure sensing plate is disposed directly below each of the common electrode plates.
  • the pressure sensing plate is formed on the surface of the organic film layer
  • the pressure touch signal line is formed on the surface of the pressure sensing plate
  • the pressure touch signal line is in contact with the pressure sensing plate. connection.
  • a light shielding layer is formed in the substrate, a surface of the substrate is formed with a polysilicon layer, the polysilicon layer forms a channel region, and a source doped region located on both sides of the channel region Forming, with the drain doping region, the insulating gate layer, the surface of the insulating gate layer forming a gate electrode, and the interlayer insulating layer, the surface of the insulating layer forming a source and a drain, The source is in contact with the source doped region through a source via, the drain is in contact with the drain doped region through a drain via, and a passivation layer is formed on the surface of the dielectric layer.
  • a surface of the passivation layer is formed with a pixel electrode, and the pixel electrode is connected to the drain through a pixel electrode via.
  • the common electrode and the pressure touch signal line are both transparent metal electrodes.
  • the invention also provides a method for fabricating an LTPS array substrate, the manufacturing method comprising:
  • the organic film layer forms a plurality of pressure sensitive plates insulated from each other;
  • the step of forming an organic film layer on the substrate, forming a pressure sensing layer in the organic film layer, and then forming a pressure sensitive via hole on the organic film layer includes:
  • a second planarization layer is formed on the substrate, and the pressure sensitive through hole is formed on the second planarization layer.
  • the planar touch signal line and the pressure touch signal line are transparent metal electrodes.
  • the invention has the beneficial effects that the present invention provides an LTPS array substrate with a pressure touch function compared with the existing pressure touch panel, and the pressure sensor is fabricated in the film structure of the LTPS array substrate, thereby getting closer.
  • the distance between the pressure sensor and the glass cover of the display panel improves the pressure touch sensitivity.
  • the production of the pressure touch panel is compatible with the flat touch panel, thereby avoiding interference of the touch signal in the panel; and solving the existing external pressure touch
  • the control panel has low sensitivity to pressure sensing and requires additional components during production, which increases the weight and thickness of the panel, and makes it difficult to achieve the technical problems of high-quality built-in pressure touch panels.
  • FIG. 1 is a cross-sectional view showing the structure of a LTPS array substrate of the present invention
  • FIG. 2 is a top plan view showing a structure of a planar touch panel and a pressure sensing touch panel of the LTPS array substrate of the present invention.
  • 3A to 3M are flowcharts showing a method of manufacturing an LTPS array substrate according to an embodiment of the present invention.
  • the invention is directed to the existing external pressure touch panel, has low pressure sensing sensitivity, requires additional devices during production, thereby increasing the weight and thickness of the panel, and is difficult to realize a high quality built-in pressure touch panel.
  • the embodiment of the present invention can solve the drawback.
  • FIG. 1 is a cross-sectional view showing the structure of an LTPS array substrate according to an embodiment of the present invention.
  • the present invention provides an LTPS array substrate, comprising: a substrate 101; an insulating gate layer 102 formed on a surface of the substrate 101; an interlayer insulating layer 103 formed on a surface of the insulating gate layer 102; A layer 104 is formed on the surface of the interlayer insulating layer 103.
  • a pressure sensing layer is formed on the organic film layer 104, the pressure sensing layer is a piezoelectric material; the pressure sensing layer is graphically processed into a plurality of pressure sensing plates 105;
  • a metal layer is formed on the organic film layer 104.
  • the metal layer is patterned to form a planar insulated touch signal line 106 and a pressure touch signal line 107.
  • the pressure touch signal line is formed.
  • 107 is connected to the pressure sensing plate 105;
  • a dielectric layer 109 is formed on the surface of the organic film layer 104, and the dielectric layer 109 is formed with a touch through hole.
  • a passivation layer 112 is formed on a surface of the dielectric layer 109.
  • a metal layer of a common electrode is formed in the passivation layer 112.
  • the metal layer of the common electrode is patterned to form a plurality of common electrode plates 110.
  • the touch signal line 106 is connected to the common electrode plate 110 through the touch through hole.
  • the piezoelectric material used in the pressure sensing plate 105 refers to a crystal material which generates a voltage between both end faces when subjected to pressure.
  • the piezoelectric material may generate an electric field due to mechanical deformation, or may cause mechanical deformation due to an electric field.
  • a pressure is applied to the piezoelectric material, it generates a potential difference, that is, a positive piezoelectric effect.
  • applying a voltage generates a mechanical stress, which is called an inverse piezoelectric effect.
  • the pressure sensing signal line 107 and the pressure sensing plate 105 form a pressure sensing touch panel; when the finger is pressed against the outer protective glass of the display, the display panel is deformed, and the pressure sensing plate 105 is deformed accordingly, that is, An electrical signal is generated in the direction of the force of the panel, and the detected current is input to the control end through the pressure touch signal line 107 through the pressure sensing point corresponding to the position of the panel, thereby correspondingly performing the corresponding position of the panel.
  • Functional feedback is provided.
  • the planar touch signal line 106 and the common electrode plate 110 form a planar touch panel to implement a planar touch operation on the panel.
  • the capacitance value on the common electrode plate 110 is detected. And transmitting the signal to the control end through the planar touch signal line 106, thereby implementing a planar touch function; at the same time, the common electrode plate 110 is further configured to form a storage capacitor with the pixel electrode of the LTPS array substrate.
  • the pressure touch signal line 107 is fabricated in the same layer as the planar touch signal line 106, and can be formed by using a single mask. Therefore, when the signal line is configured for the pressure sensing board 105, no additional metal wires are introduced. The manufacturing process is saved, and the cost of the process modification is reduced. Moreover, the pressure touch signal line 107 and the planar touch signal line 106 are insulated from each other, thereby avoiding interference between the pressure touch signal and the planar touch signal. .
  • the common electrode layer includes a plurality of common electrode plates 110 distributed in an array, and each of the common electrode plates 110 is connected to one of the planar touch signal lines 106; each of the common electrode plates 110 is insulated from each other.
  • the planar touch signal line 106 is connected to the common electrode plate 110. Therefore, each of the common electrode plates 110 can simultaneously and independently generate a planar touch signal, thereby implementing multi-point planar touch.
  • a plurality of the pressure sensing plates 105 distributed in an array are formed on the organic film layer 104, and each of the pressure sensing plates 105 is connected to one of the pressure touch signal lines 107; therefore, each of the pressure sensing plates 105
  • the pressure touch signal can be generated simultaneously and independently to realize multi-point pressure sensing touch.
  • Each of the pressure sensing plates 105 is located below a common electrode plate 110; and each of the pressure sensing plates 105 has a size of 3 mm ⁇ 4 mm, and the distance between adjacent pressure sensing plates 105 is 2.5. Mm.
  • a light shielding layer 113 is further formed in the substrate 101.
  • the surface of the substrate 101 is formed with a polysilicon layer 114.
  • the polysilicon layer 114 forms a channel region, and source doped regions and drains on both sides of the channel region.
  • a surface of the substrate 101 forming the insulating gate layer 102, a surface of the insulating gate layer 102 forming a gate electrode 115, and the interlayer insulating layer 103, the surface of the insulating layer 103 forming a source 116 and a drain electrode 117, the source electrode 116 is in contact connection with the source doping region through a source via, and the drain electrode 117 is in contact connection with the drain doping region through a drain via, the dielectric layer A surface of the passivation layer 112 is formed with a passivation layer 112 having a pixel electrode 108 formed thereon, and the pixel electrode 108 is connected to the drain electrode 117 through a via hole of the pixel electrode 108.
  • the pressure sensing layer may be located inside the organic film layer 104; for example, the organic film layer 104 includes a first planarization layer, and a second planarization layer formed on a surface of the first planarization layer, The pressure sensing layer is located between the first planarization layer and the second planarization layer, and the second planarization layer is provided with a pressure sensitive through hole, the pressure sensing plate 105 and the pressure touch signal The line 107 is connected through the pressure sensitive through hole; thus, the pressure sensing layer is prepared inside the organic film layer 104, which can avoid the signal line misconnecting the pressure sensing layer due to the process tolerance, thereby causing a signal error. Passing, making the pressure touch function malfunction.
  • the pressure sensing layer may also be located on an upper surface of the organic film layer 104; for example, the pressure sensing plate 105 is formed on a surface of the organic film layer 104, and the pressure sensing line is formed on the pressure sensing plate 105.
  • the pressure sensing line is in contact with the pressure sensing plate 105.
  • the pressure sensing plate 105 is closer to the protective cover of the display panel, and the pressure detection is more sensitive, and the manufacturing process saves the through hole. Process.
  • FIG. 2 is a top plan view showing a structure of a planar touch panel and a pressure sensing touch panel of the LTPS array substrate of the present invention.
  • the LTPS array substrate includes a pressure sensing plate 202 corresponding to the display panel display area 201, a common electrode plate 203, a planar touch signal line 204, and a pressure touch signal line 205.
  • the touch signal line 204 and the pressure touch signal line 205 are parallel to each other and alternately disposed; and corresponding to the driving chip 207 located in the non-display area 206 of the display panel, the pressure sensing plate 202 is located below the common electrode plate 203.
  • Each of the pressure sensing boards 202 is connected to one of the pressure touch signal lines 205, and each of the common electrode boards 203 is connected to one of the planar touch signal lines 204, and the pressure touch signal lines 205 are opposite.
  • the other end is connected to the first area of the driving chip 207, and the other end of the planar touch signal line 204 is connected to the second area of the driving chip 207.
  • 3A to 3M are flowcharts showing a method of manufacturing an LTPS array substrate according to an embodiment of the present invention.
  • the method for fabricating the LTPS array substrate provided by the present invention is as follows:
  • a substrate 301 is provided.
  • a light shielding layer 302 is formed at a position where the substrate 301 corresponds to a thin film transistor.
  • a buffer layer 303 is formed on the substrate 301 to cover the light shielding layer 302.
  • a polysilicon layer 304 is formed on the substrate 301, and the polysilicon layer 304 is ion-implanted to form a channel and a source-drain doped region, respectively.
  • an insulating gate layer 305, a gate 306, and a scan line are formed on the substrate 301, wherein the gate 306 is connected to a corresponding scan line.
  • an insulating layer 307 is formed on the substrate 301, and a source via 322 and a drain via 323 are formed on the insulating layer 307.
  • a first metal layer is deposited on the substrate 301, and a source 308 of the thin film transistor is formed on the interlayer insulating layer 307 by patterning the first metal layer.
  • a drain 309 of the thin film transistor and a data line the source 308 is connected to one side of the channel through the source via 322, and the drain 309 passes through the drain 309 The other side of the channel is connected; wherein the source 308 of the thin film transistor is connected to a corresponding data line.
  • a first planarization layer 321 is deposited on the substrate 301.
  • a pressure sensing layer is formed on the substrate 301, and a plurality of pressure sensing plates 310 are formed on the surface of the first planarizing layer 321 by patterning the pressure sensing layer.
  • a second planarization layer 312 is deposited on the substrate 301, and a pressure sensitive via 311 is formed on the pressure sensing plate 310.
  • a second metal layer is deposited on the substrate 301, and a planar touch is formed on the second planarization layer 312 by patterning the second metal layer.
  • the signal line 313 and the pressure touch signal line 314 are connected to the pressure sensing plate 310 through the pressure sensitive through hole 311.
  • a dielectric layer 315 and a common electrode layer are formed on the substrate 301, and a touch via 316 is formed on the dielectric layer 315, and the common electrode layer is patterned to form a plurality of The common electrode plate 317 is connected to the common electrode plate 317 through the touch through hole 316.
  • a passivation layer 318 and a pixel electrode 319 are formed on the substrate 301, and pixel electrode via holes are formed on the passivation layer 318, the dielectric layer 315, and the organic film layer.
  • the electrode 319 is connected to the drain 309 through the pixel electrode via.

Abstract

一种LTPS阵列基板，包括层叠设置的基板（101）、绝缘栅层（102）、间绝缘层（103）以及有机膜层（104），有机膜层上设置有压力感应板（105）；有机膜层上形成有金属层，经图形化处理后形成平面触控信号线（106）与压力触控信号线（107），压力触控信号线连接压力感应板；钝化层（112），钝化层内形成有公共电极板（110），平面触控信号线通过触控通孔与公共电极板连接。

Description

LTPS阵列基板及其制作方法 技术领域
本发明涉及液晶显示技术领域，尤其涉及一种LTPS阵列基板及所述LTPS阵列基板的制作方法。
 背景技术
随着智能手机的飞速发展，基本取代了传统的非智能手机，手机屏幕的尺寸也越来越大，手机的操作模式也从传统的按键操作模式向触控操作模式转变，随之而来是压力触控技术的迅速发展。
压力触控技术主要根据手指按压触控面板，如手机、平板电脑，触控面板表面会产生形变，利用压力传感器检测形变导致的电容或电阻的变化实现压力触控感应，这种技术方案虽然能有效的实现压力触控感应，但其触控层集成在显示面板内时，会面临触控信号干扰的问题；为避免上述问题，现有技术通常采用外挂式的压力触控结构，压力传感器的上侧或下侧会有空气层，导致压力感应灵敏度较低，并且，在压力传感器制备过程中需要引入新的基板，增加贴合次数和额外的柔性电路板都增大了显示面板的制造成本，不仅如此，在完成压力传感器与显示面板的贴合后，整个显示模组的厚度和重量都会增加，与手机和移动办公所追求的超薄化、轻量化不符，不是压力触控感应最理想的技术解决方案。
综上所述，现有技术的外挂式压力触控面板，压力感应灵敏度较低，在制作时需要增加额外的器件，从而增加了面板的重量及厚度，并且难以实现高品质的内置式压力触控面板。
 技术问题
本发明提供一种LTPS阵列基板，能够将压力传感器友好地集成在面板内，以解决现有的外挂式压力触控面板，压力感应灵敏度较低，在制作时需要增加额外的器件，从而增加了面板的重量及厚度，并且难以实现高品质的内置式压力触控面板的技术问题。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种LTPS阵列基板，包括：
基板；
绝缘栅层，形成于所述基板表面；
间绝缘层，形成于所述绝缘栅层表面；
有机膜层，形成于所述间绝缘层表面；以及
压力感应层，形成于所述有机膜层上，所述压力感应层为压电材料；所述压力感应层经图形化处理为若干压力感应板；以及
金属层，形成于所述有机膜层上；其中，
所述金属层经图形化处理后，形成相互绝缘的平面触控信号线与压力触控信号线，所述压力触控信号线与所述压力感应板相连接；
介质层，形成于所述有机膜层表面，所述介质层上形成有触控通孔；
钝化层，形成于所述介质层表面，所述钝化层内形成有公共电极层，所述公共电极层经图形化处理形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极板相连接；
所述有机膜层包括第一平坦化层、及形成于所述第一平坦化层表面的第二平坦化层，所述压力感应板位于所述第一平坦化层与所述第二平坦化层之间，所述第二平坦化层开设有压感通孔，所述压力感应板与所述压力触控信号线通过所述压感通孔连接。
根据本发明一优选实施例，所述公共电极包括多个呈阵列分布的公共电极板，每一所述公共电极板对应连接一条所述平面触控信号线；所述有机膜层上形成有多个呈阵列分布的所述压力感应板，每一所述压力感应板对应连接一条所述压力触控信号线。
根据本发明一优选实施例，每一所述公共电极板的正下方对应设置一所述压力感应板。
根据本发明一优选实施例，所述基板内形成有遮光层，所述基板表面形成有多晶硅层，所述多晶硅层形成沟道区、及位于所述沟道区两侧的源极掺杂区与漏极掺杂区，所述基板表面形成所述绝缘栅层，所述绝缘栅层表面形成栅极、以及所述间绝缘层，所述间绝缘层表面形成源极与漏极，所述源极通过源极通孔与所述源极掺杂区接触连接，所述漏极通过漏极通孔与所述漏极掺杂区接触连接，所述介质层表面形成有钝化层，所述钝化层表面形成有像素电极，所述像素电极通过像素电极通孔连接所述漏极。
根据本发明一优选实施例，所述公共电极与所述压力触控信号线均为透明金属电极。
本发明还提供另一种LTPS阵列基板，包括：
基板；
绝缘栅层，形成于所述基板表面；
间绝缘层，形成于所述绝缘栅层表面；
有机膜层，形成于所述间绝缘层表面；以及
压力感应层，形成于所述有机膜层上，所述压力感应层为压电材料；所述压力感应层经图形化处理为若干压力感应板；以及
金属层，形成于所述有机膜层上；其中，
所述金属层经图形化处理后，形成相互绝缘的平面触控信号线与压力触控信号线，所述压力触控信号线与所述压力感应板相连接；
介质层，形成于所述有机膜层表面，所述介质层上形成有触控通孔；
钝化层，形成于所述介质层表面，所述钝化层内形成有公共电极层，所述公共电极层经图形化处理形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极板相连接。
根据本发明一优选实施例，所述公共电极包括多个呈阵列分布的公共电极板，每一所述公共电极板对应连接一条所述平面触控信号线；所述有机膜层上形成有多个呈阵列分布的所述压力感应板，每一所述压力感应板对应连接一条所述压力触控信号线。
根据本发明一优选实施例，每一所述公共电极板的正下方对应设置一所述压力感应板。
根据本发明一优选实施例，所述压力感应板形成于所述有机膜层表面，所述压力触控信号线形成于所述压力感应板表面，所述压力触控信号线与压力感应板接触连接。
根据本发明一优选实施例，所述基板内形成有遮光层，所述基板表面形成有多晶硅层，所述多晶硅层形成沟道区、及位于所述沟道区两侧的源极掺杂区与漏极掺杂区，所述基板表面形成所述绝缘栅层，所述绝缘栅层表面形成栅极、以及所述间绝缘层，所述间绝缘层表面形成源极与漏极，所述源极通过源极通孔与所述源极掺杂区接触连接，所述漏极通过漏极通孔与所述漏极掺杂区接触连接，所述介质层表面形成有钝化层，所述钝化层表面形成有像素电极，所述像素电极通过像素电极通孔连接所述漏极。
根据本发明一优选实施例，所述公共电极与所述压力触控信号线均为透明金属电极。
本发明还一种LTPS阵列基板制作方法，所述制作方法包括：
提供一基板；
在所述基板上制作缓冲层；
在所述基板上制作薄膜晶体管的沟道；
在所述基板上制作绝缘栅层、栅极以及扫描线，其中所述栅极与对应的扫描线连接；
在所述基板上制作间绝缘层，并在所述间绝缘层上形成源极通孔与漏极通孔；
在所述基板上沉积第一金属层，并通过对所述第一金属层进行图形化处理，在所述间绝缘层上形成所述薄膜晶体管的源极、所述薄膜晶体管的漏极、以及数据线；所述源极通过所述源极通孔与所述沟道的一侧连接，所述漏极通过所述漏极通过与所述沟道的另一侧连接；其中所述薄膜晶体管的源极与对应的数据线连接；
在所述基板上制作有机膜层，并在所述有机膜层内形成压力感应层，然后在所述有机膜层上形成压感通孔；通过对所述压力感应层进行图像化处理，在所述有机膜层形成若干相互绝缘的压力感应板；
在所述有基板上沉积第二金属层，并通过对所述第二金属层进行图形化处理，在所述有机膜层上形成相互绝缘的平面触控信号线与压力触控信号线；所述压力触控信号线通过所述压感通孔与所述压力感应板连接；
在所述基板上制作介质层以及公共电极层，并在所述介质层上形成触控通孔，通过对所述公共电极层进行图形化处理，形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极相连接；以及
在所述基板上制作钝化层以及像素电极，并在所述钝化层、介质层以及所述有机膜层上形成像素电极通孔，所述像素电极通过所述像素电极通孔与所述漏极连接。
根据本发明一优选实施例，所述在所述基板上制作有机膜层，并在所述有机膜层内形成压力感应层，然后在所述有机膜层上形成压感通孔的步骤包括：
在所述基板上制作第一平坦化层，并在所述第一平坦化层上制作所述压力感应层；
在所述基板上制作第二平坦化层，并在所述第二平坦化层上形成所述压感通孔。
根据本发明一优选实施例，所述平面触控信号线与所述压力触控信号线均为透明金属电极。
 有益效果
本发明的有益效果为：相较于现有的压力触控面板，本发明提供了具有压力触控功能的LTPS阵列基板，将压力传感器制作在LTPS阵列基板的膜层结构中，从而拉近了压力传感器与显示面板的玻璃盖板间距离，提高压力触控灵敏度，压力触控板的制作与平面触控板相兼容，避免了面板内触控信号干扰；解决了现有的外挂式压力触控面板，压力感应灵敏度较低，在制作时需要增加额外的器件，从而增加了面板的重量及厚度，并且难以实现高品质的内置式压力触控面板的技术问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明LTPS阵列基板结构剖视图；
图2为本发明LTPS阵列基板的平面触控面板与压力感应触控面板结构的俯视图。
图3A至图3M为本发明实施例的LTPS阵列基板的制造方法流程图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的外挂式压力触控面板，压力感应灵敏度较低，在制作时需要增加额外的器件，从而增加了面板的重量及厚度，并且难以实现高品质的内置式压力触控面板的技术问题，本发明实施例能够解决该缺陷。
图1为本发明实施例的LTPS阵列基板结构剖视图。
如图1所示，本发明提供一种LTPS阵列基板，包括：基板101；绝缘栅层102，形成于所述基板101表面；间绝缘层103，形成于所述绝缘栅层102表面；有机膜层104，形成于所述间绝缘层103表面。
压力感应层，形成于所述有机膜层104上，所述压力感应层为压电材料；所述压力感应层经图形化处理为若干压力感应板105；
金属层，形成于所述有机膜层104上；其中，所述金属层经图形化处理后，形成相互绝缘的平面触控信号线106与压力触控信号线107，所述压力触控信号线107与所述压力感应板105相连接；介质层109，形成于所述有机膜层104表面，所述介质层109上形成有触控通孔。
钝化层112，形成于所述介质层109表面，所述钝化层112内形成有公共电极的金属层，所述公共电极的金属层经过图像化处理形成若干公共电极板110，所述平面触控信号线106通过所述触控通孔与所述公共电极板110相连接。
所述压力感应板105所使用的压电材料，是指受到压力作用时会在两端面间出现电压的晶体材料，压电材料可以因机械变形产生电场，也可以因电场作用产生机械变形，如果对压电材料施加压力，它便会产生电位差，即正压电效应，反之，施加电压则产生机械应力，即称为逆压电效应。
所述压力触控信号线107与所述压力感应板105形成压力感应触控面板；当手指按压在显示器的外保护玻璃时，显示面板发生形变，所述压力感应板105随之产生形变，即在面板受力的方向上产生电信号，通过手指接触面板位置相对应的压力感应点，将检测到的电流通过所述压力触控信号线107输入至控制端，进而使得面板的相应位置执行相应的功能反馈。
所述平面触控信号线106与所述公共电极板110形成平面触控面板，以实现对面板的平面触控操作，当手指触摸面板时，通过检测所述公共电极板110上的电容值变化，并通过所述平面触控信号线106将信号传递至控制端，进而实现平面触控功能；同时，所述公共电极板110，还用于与LTPS阵列基板的像素电极形成存储电容。
将所述压力触控信号线107与所述平面触控信号线106同层制作，使用一次光罩即可成型，因此，在为所述压力感应板105配置信号线时，不用额外引入金属导线，节省制作工序，以及降低了制程改造的成本；并且，所述压力触控信号线107与所述平面触控信号线106相互绝缘，避免了压力触控信号与平面触控信号之间的干扰。
所述公共电极层包括多个呈阵列分布的公共电极板110，每一所述公共电极板110对应连接一条所述平面触控信号线106；各公共电极板110之间相互绝缘，每一所述平面触控信号线106对应连接一所述公共电极板110，因此各所述公共电极板110能够同时且独立产生平面触控信号，从而实现多点平面触控。
所述有机膜层104上形成有多个呈阵列分布的所述压力感应板105，每一所述压力感应板105对应连接一条所述压力触控信号线107；因此各所述压力感应板105能够同时且独立产生压力触控信号，以实现多点压力感应触控。
每一所述压力感应板105对应位于一所述公共电极板110的下方；且每一所述压力感应板105的尺寸为3mm×4mm，相邻所述压力感应板105之间间隔距离为2.5μm。
所述基板101内还形成有遮光层113，所述基板101表面形成有多晶硅层114，所述多晶硅层114形成沟道区、及位于所述沟道区两侧的源极掺杂区与漏极掺杂区，所述基板101表面形成所述绝缘栅层102，所述绝缘栅层102表面形成栅极115、以及所述间绝缘层103，所述间绝缘层103表面形成源极116与漏极117，所述源极116通过源极通孔与所述源极掺杂区接触连接，所述漏极117通过漏极通孔与所述漏极掺杂区接触连接，所述介质层109表面形成有钝化层112，所述钝化层112表面形成有像素电极108，所述像素电极108通过像素电极108通孔连接所述漏极117。
所述压力感应层可以位于所述有机膜层104的内部；例如，所述有机膜层104包括第一平坦化层、及形成于所述第一平坦化层表面的第二平坦化层，所述压力感应层位于所述第一平坦化层与所述第二平坦化层之间，所述第二平坦化层开设有压感通孔，所述压力感应板105与所述压力触控信号线107通过所述压感通孔连接；如此，将所述压力感应层制备于所述有机膜层104内部，能够避免因制程容差导致的信号线误连压力感应层，从而导致信号的错误传递，使得压力触控功能失常。
所述压力感应层还可以位于所述有机膜层104的上表面；例如，所述压力感应板105形成于所述有机膜层104表面，所述压力传感线形成于所述压力感应板105表面，所述压力传感线与压力感应板105接触连接，此方案中，所述压力感应板105距离显示面板的保护盖板较近，压力检测更加灵敏，在制作工艺上节省了制作通孔的工序。
图2为本发明LTPS阵列基板的平面触控面板与压力感应触控面板结构的俯视图。
如图2所示，所述LTPS阵列基板中，包括有对应位于显示面板显示区201的压力感应板202、公共电极板203、平面触控信号线204与压力触控信号线205，所述平面触控信号线204与压力触控信号线205相互平行，且交替设置；以及对应位于显示面板的非显示区206的驱动芯片207，所述压力感应板202位于所述公共电极板203的下方，每一所述压力感应板202对应连接一条所述压力触控信号线205，每一所述公共电极板203对应连接一条所述平面触控信号线204，所述压力触控信号线205的相对另一端连接所述驱动芯片207的第一区域，所述平面触控信号线204的相对另一端连接所述驱动芯片207的第二区域。
图3A至图3M为本发明实施例的LTPS阵列基板的制造方法流程图。
本发明提供的LTPS阵列基板制作方法如下：
如图3A所示，提供一基板301。
如图3B所示，在所述基板301对应薄膜晶体管的位置制作遮光层302。
如图3C所示，在所述基板301上制作缓冲层303，以覆盖所述遮光层302。
如图3D所示，在所述基板301上制作多晶硅层304，并对所述多晶硅层304进行离子注入，分别形成沟道及源漏极掺杂区域。
如图3E所示，在所述基板301上制作绝缘栅层305、栅极306以及扫描线，其中所述栅极306与对应的扫描线连接。
如图3F所示，在所述基板301上制作间绝缘层307，并在所述间绝缘层307上形成源极通孔322与漏极通孔323。
如图3G所示，在所述基板301上沉积第一金属层，并通过对所述第一金属层进行图形化处理，在所述间绝缘层307上形成所述薄膜晶体管的源极308、所述薄膜晶体管的漏极309、以及数据线；所述源极308通过所述源极通孔322与所述沟道的一侧连接，所述漏极309通过所述漏极309通过与所述沟道的另一侧连接；其中所述薄膜晶体管的源极308与对应的数据线连接。
如图3H所示，在所述基板301上沉积第一平坦化层321。
如图3I所示，在所述基板301上制作压力感应层，并通过对所述压力感应层进行图形化处理再所述第一平坦化层321表面形成若干压力感应板310。
如图3J所示，在所述基板301上沉积第二平坦化层312，并在所述压力感应板310上形成压感通孔311。
如图3K所示，在所述有基板301上沉积第二金属层，并通过对所述第二金属层进行图形化处理，在所述第二平坦化层312上形成相互绝缘的平面触控信号线313与压力触控信号线314；所述压力触控信号线314通过所述压感通孔311与所述压力感应板310连接。
如图3L所示，在所述基板301上制作介质层315以及公共电极层，并在所述介质层315上形成触控通孔316，通过对所述公共电极层进行图形化处理，形成若干公共电极板317，所述平面触控信号线313通过所述触控通孔316与所述公共电极板317相连接。
如图3M所示，在所述基板301上制作钝化层318以及像素电极319，并在所述钝化层318、介质层315以及所述有机膜层上形成像素电极通孔，所述像素电极319通过所述像素电极通孔与所述漏极309连接。
至此，形成了如图3M所示的LTPS阵列基板。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (14)

  1. 一种LTPS阵列基板，其包括：
    基板；
    绝缘栅层，形成于所述基板表面；
    间绝缘层，形成于所述绝缘栅层表面；
    有机膜层，形成于所述间绝缘层表面；以及
    压力感应层，形成于所述有机膜层上，所述压力感应层为压电材料；所述压力感应层经图形化处理形成若干压力感应板；以及
    金属层，形成于所述有机膜层上；其中，
    所述金属层经图形化处理后，形成相互绝缘的平面触控信号线与压力触控信号线，所述压力触控信号线与所述压力感应板相连接；
    介质层，形成于所述有机膜层表面，所述介质层上形成有触控通孔；
    钝化层，形成于所述介质层表面，所述钝化层内形成有公共电极层，所述公共电极层经图形化处理形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极板相连接；
    所述有机膜层包括第一平坦化层、及形成于所述第一平坦化层表面的第二平坦化层，所述压力感应板位于所述第一平坦化层与所述第二平坦化层之间，所述第二平坦化层开设有压感通孔，所述压力感应板与所述压力触控信号线通过所述压感通孔连接。
  2. 根据权利要求1所述的LTPS阵列基板，其中，
    所述公共电极层包括多个呈阵列分布的公共电极板，每一所述公共电极板对应连接一条所述平面触控信号线；
    所述有机膜层上形成有多个呈阵列分布的所述压力感应板，每一所述压力感应板对应连接一条所述压力触控信号线。
  3. 根据权利要求2所述的LTPS阵列基板，其中，每一所述公共电极板的正下方对应设置一所述压力感应板。
  4. 根据权利要求1所述的LTPS阵列基板，其中，所述基板内形成有遮光层，所述基板表面形成有多晶硅层，所述多晶硅层形成沟道区、及位于所述沟道区两侧的源极掺杂区与漏极掺杂区，所述基板表面形成所述绝缘栅层，所述绝缘栅层表面形成栅极、以及所述间绝缘层，所述间绝缘层表面形成源极与漏极，所述源极通过源极通孔与所述源极掺杂区接触连接，所述漏极通过漏极通孔与所述漏极掺杂区接触连接，所述介质层表面形成有钝化层，所述钝化层表面形成有像素电极，所述像素电极通过像素电极通孔连接所述漏极。
  5. 根据权利要求1所述的LTPS阵列基板，其中，所述平面触控信号线与所述压力触控信号线均为透明金属电极。
  6. 一种LTPS阵列基板，其包括：
    基板；
    绝缘栅层，形成于所述基板表面；
    间绝缘层，形成于所述绝缘栅层表面；
    有机膜层，形成于所述间绝缘层表面；以及
    压力感应层，形成于所述有机膜层上，所述压力感应层为压电材料；所述压力感应层经图形化处理形成若干压力感应板；以及
    金属层，形成于所述有机膜层上；其中，
    所述金属层经图形化处理后，形成相互绝缘的平面触控信号线与压力触控信号线，所述压力触控信号线与所述压力感应板相连接；
    介质层，形成于所述有机膜层表面，所述介质层上形成有触控通孔；
    钝化层，形成于所述介质层表面，所述钝化层内形成有公共电极层，所述公共电极层经图形化处理形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极板相连接。
  7. 根据权利要求6所述的LTPS阵列基板，其中，所述公共电极层包括多个呈阵列分布的公共电极板，每一所述公共电极板对应连接一条所述平面触控信号线；
    所述有机膜层上形成有多个呈阵列分布的所述压力感应板，每一所述压力感应板对应连接一条所述压力触控信号线。
  8. 根据权利要求7所述的LTPS阵列基板，其中，每一所述公共电极板的正下方对应设置一所述压力感应板。
  9. 根据权利要求6所述的LTPS阵列基板，其中，所述压力感应板形成于所述有机膜层表面，所述压力触控信号线形成于所述压力感应板表面，所述压力触控信号线与压力感应板接触连接。
  10. 根据权利要求6所述的LTPS阵列基板，其中，所述基板内形成有遮光层，所述基板表面形成有多晶硅层，所述多晶硅层形成沟道区、及位于所述沟道区两侧的源极掺杂区与漏极掺杂区，所述基板表面形成所述绝缘栅层，所述绝缘栅层表面形成栅极、以及所述间绝缘层，所述间绝缘层表面形成源极与漏极，所述源极通过源极通孔与所述源极掺杂区接触连接，所述漏极通过漏极通孔与所述漏极掺杂区接触连接，所述介质层表面形成有钝化层，所述钝化层表面形成有像素电极，所述像素电极通过像素电极通孔连接所述漏极。
  11. 根据权利要求6所述的LTPS阵列基板，其中，所述平面触控信号线与所述压力触控信号线均为透明金属电极。
  12. 一种LTPS阵列基板制作方法，其中，所述制作方法包括：
    提供一基板；
    在所述基板上制作缓冲层；
    在所述基板上制作薄膜晶体管的沟道；
    在所述基板上制作绝缘栅层、栅极以及扫描线，其中所述栅极与对应的扫描线连接；
    在所述基板上制作间绝缘层，并在所述间绝缘层上形成源极通孔与漏极通孔；
    在所述基板上沉积第一金属层，并通过对所述第一金属层进行图形化处理，在所述间绝缘层上形成所述薄膜晶体管的源极、所述薄膜晶体管的漏极、以及数据线；所述源极通过所述源极通孔与所述沟道的一侧连接，所述漏极通过所述漏极通过与所述沟道的另一侧连接；其中所述薄膜晶体管的源极与对应的数据线连接；
    在所述基板上制作有机膜层，并在所述有机膜层内形成压力感应层，然后在所述有机膜层上形成压感通孔；通过对所述压力感应层进行图像化处理，在所述有机膜层形成若干相互绝缘的压力感应板；
    在所述有基板上沉积第二金属层，并通过对所述第二金属层进行图形化处理，在所述有机膜层上形成相互绝缘的平面触控信号线与压力触控信号线；所述压力触控信号线通过所述压感通孔与所述压力感应板连接；
    在所述基板上制作介质层以及公共电极层，并在所述介质层上形成触控通孔，通过对所述公共电极层进行图形化处理，形成若干公共电极板，所述平面触控信号线通过所述触控通孔与所述公共电极相连接；以及
    在所述基板上制作钝化层以及像素电极，并在所述钝化层、介质层以及所述有机膜层上形成像素电极通孔，所述像素电极通过所述像素电极通孔与所述漏极连接。
  13. 根据权利要求12所述的LTPS阵列基板制作方法，其中，所述在所述基板上制作有机膜层，并在所述有机膜层内形成压力感应层，然后在所述有机膜层上形成压感通孔的步骤包括：
    在所述基板上制作第一平坦化层，并在所述第一平坦化层上制作所述压力感应层；
    在所述基板上制作第二平坦化层，并在所述第二平坦化层上形成所述压感通孔。
  14. 根据权利要求12所述的LTPS阵列基板制作方法，其中，所述平面触控信号线与所述压力触控信号线均为透明金属电极。
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