WO2017171509A1 - 배터리 모듈 - Google Patents
배터리 모듈 Download PDFInfo
- Publication number
- WO2017171509A1 WO2017171509A1 PCT/KR2017/003612 KR2017003612W WO2017171509A1 WO 2017171509 A1 WO2017171509 A1 WO 2017171509A1 KR 2017003612 W KR2017003612 W KR 2017003612W WO 2017171509 A1 WO2017171509 A1 WO 2017171509A1
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- WIPO (PCT)
- Prior art keywords
- resin layer
- flame retardant
- resin
- battery module
- less
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/233—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions
- H01M50/24—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/12—Organic materials containing phosphorus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/211—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present application relates to a battery module.
- the secondary battery includes a nickel cadmium battery, a nickel hydrogen battery, a nickel zinc battery or a lithium secondary battery, and a lithium secondary battery is typical.
- Lithium secondary batteries mainly use lithium oxide and carbon materials as positive electrode active materials and negative electrode active materials, respectively.
- the lithium secondary battery includes a positive electrode plate and a negative electrode plate coated with a positive electrode active material and a negative electrode active material respectively, and an electrode assembly disposed with a separator interposed therebetween, and an exterior member sealingly storing the electrode assembly together with an electrolyte solution.
- pouch type secondary batteries In the present specification, a single secondary battery may be referred to as a battery cell.
- a large number of battery cells When used in medium and large devices such as automobiles and power storage devices, a large number of battery cells may be electrically connected to each other to increase capacity and output, thereby forming a battery module or a battery pack.
- the present application can provide a battery module.
- the battery module of the present application includes a module case and a battery cell.
- the battery cell may be stored in the module case.
- One or more battery cells may exist in the module case, and a plurality of battery cells may be stored in the module case.
- the number of battery cells housed in the module case is not particularly limited to be adjusted according to the use. Battery cells stored in the module case may be electrically connected to each other.
- the module case may include at least a side wall and a bottom plate forming an inner space in which the battery cells can be stored.
- the module case may further include a top plate for sealing the inner space.
- the side wall, the lower plate and the upper plate may be integrally formed with each other, or separate sidewalls, the lower plate and / or the upper plate may be assembled to form the module case.
- the shape and size of the module case is not particularly limited and may be appropriately selected according to the use, the shape and number of battery cells housed in the internal space, and the like.
- FIG. 1 is a diagram showing an exemplary module case 10 and is an example of a box-shaped case 10 including one bottom plate 10a and four sidewalls 10b.
- the module case 10 may further include a top plate 10c that seals the internal space.
- FIG. 2 is a schematic view of the module case 10 of FIG. 1 in which the battery cells 20 are housed.
- a hole may be formed in the lower plate, the side wall, and / or the upper plate (hereinafter, referred to as a lower plate) of the module case.
- a hole may be formed in a lower plate or the like that is in contact with the resin layer, which will be described later, and may be formed in a lower plate or the like, which is in contact with the resin layer with a contact area of 80% or more, as described later.
- the hole may be an injection hole for injecting a forming material (resin composition) of the resin layer when the resin layer is formed by an injection process as described below. At this time, the shape, number and position of the holes can be adjusted in consideration of the injection efficiency of the material forming the resin layer.
- the hole may be formed in at least the lower plate.
- the hole may be formed at about 1/4 to 3/4 or about 3/8 to 7/8 of the entire length of the side wall, the bottom plate or the top plate, or about the middle portion.
- the 1/4, 3/4, 3/8 or 7/8 point is the total length measured based on any one end surface E of the lower plate or the like, as shown in FIG. L) is the ratio of the distance A to the formation position of the hole.
- the terminal (E) in which the length (L) and the distance (A) are formed in the above may be any terminal (E) as long as the length (L) and the distance (A) are measured from the same terminal (E). have.
- the injection hole 50a is located at an approximately middle portion of the lower plate 10a.
- the size and shape of the injection hole are not particularly limited and can be formed in consideration of the injection efficiency of the resin layer material described later.
- the hole may be polygonal or amorphous, such as a circle, an oval, a triangle or a rectangle.
- the number and spacing of the injection holes are not particularly limited, and as described above, the resin layer may be adjusted to have a wide contact area with the lower plate.
- Observation holes may be formed at ends of the lower plate and the like, in which the injection holes are formed.
- the observation hole may be for observing whether the injected material is well injected to the end of the side wall, the lower plate or the upper plate when the resin layer material is injected through the injection hole.
- the position, shape, size, and number of the observation holes are not limited as long as they are formed to confirm that the injected material is properly injected.
- the module case may be a thermally conductive case.
- thermally conductive case means a case in which the thermal conductivity of the entire case is 10 W / mk or more, or at least includes a portion having such thermal conductivity.
- at least one of the above-described sidewalls, bottom plate and top plate may have the thermal conductivity described above.
- at least one of the sidewall, the bottom plate, and the top plate may include a portion having the thermal conductivity.
- the thermal conductivity is, in another example, 20 W / mk or more, 30 W / mk or more, 40 W / mk or more, 50 W / mk or more, 60 W / mk or more, 70 W / mk or more, 80 W / mk or more , 90 W / mk or more, 100 W / mk or more, 110 W / mk or more, 120 W / mk or more, 130 W / mk or more, 140 W / mk or more, 150 W / mk or more, 160 W / mk or more, 170 W / mk or more, 180 W / mk or more, 190 W / mk or more, or 195 W / mk or more.
- the thermal conductivity is about 1,000 W / mK or less, 900 W / mk or less, 800 W / mk or less, 700 W / mk or less, 600 W / mk or less, 500 W / mk or less, 400 W / mk or less, It may be 300 W / mk or 250 W / mK or less, but is not limited thereto.
- the kind of the material which exhibits the above thermal conductivity is not particularly limited, and examples thereof include metal materials such as aluminum, gold, pure silver, tungsten, copper, nickel or platinum.
- the module case may be entirely made of such a thermally conductive material, or at least a part of the module case may be a portion of the thermally conductive material. Accordingly, the module case may have a thermal conductivity in the above-mentioned range, or may include at least a portion having the above-mentioned thermal conductivity.
- a portion having thermal conductivity in the above range may be a portion in contact with a resin layer and / or an insulating layer, which will be described later.
- the portion having the thermal conductivity may be a portion in contact with a cooling medium such as cooling water. According to this structure, a structure capable of effectively dissipating heat generated from the battery cell to the outside may be implemented.
- the physical properties may be physical properties measured at room temperature.
- room temperature may refer to any temperature in the range of about 10 ° C. to 30 ° C., for example, about 25 ° C., about 23 ° C., or about 20 ° C.
- the standard of the liquid phase and solid phase which are the states of the substance mentioned in this specification is also normal temperature. Therefore, the substance referred to as liquid in the present specification is a case of liquid at room temperature, and the substance referred to as a solid state is a case of solid at room temperature.
- the type of battery cell accommodated in the module case is not particularly limited, and various known battery cells may be applied.
- the battery cell may be a pouch type.
- the pouch-type battery cell 100 may typically include an electrode assembly, an electrolyte, and a pouch sheath.
- FIG. 4 is an exploded perspective view schematically illustrating the configuration of an exemplary pouch-type cell
- FIG. 5 is a combined perspective view of the configuration of FIG. 4.
- the electrode assembly 110 included in the pouch-type cell 100 may have a form in which one or more positive electrode plates and one or more negative electrode plates are disposed between the separators.
- the electrode assembly 110 may be divided into a winding type in which one positive electrode plate and one negative electrode plate are wound together with a separator, or a plurality of positive electrode plates and a plurality of negative electrode plates alternately stacked with a separator interposed therebetween.
- the pouch packaging material 120 may be configured to include, for example, an outer insulating layer, a metal layer, and an inner adhesive layer.
- the exterior member 120 may include a metal thin film such as aluminum in order to protect internal elements such as the electrode assembly 110 and the electrolyte, and to compensate for the electrochemical properties of the electrode assembly 110 and the electrolyte and to provide heat dissipation. Can be.
- the metal thin film may be interposed between an insulating layer formed of an insulating material in order to ensure electrical insulation between the electrode assembly 110 and other elements such as an electrolyte or other elements outside the battery 100.
- the exterior member 120 may include an upper pouch 121 and a lower pouch 122, and at least one of the upper pouch 121 and the lower pouch 122 may have a concave inner space I. This can be formed.
- the electrode assembly 110 may be accommodated in the internal space I of the pouch. Sealing portions S may be provided on the outer circumferential surfaces of the upper pouch 121 and the lower pouch 122, and the sealing portions S may be adhered to each other to seal an inner space in which the electrode assembly 110 is accommodated.
- Each electrode plate of the electrode assembly 110 includes an electrode tab, and one or more electrode tabs may be connected to the electrode lead.
- the electrode lead is interposed between the sealing portion S of the upper pouch 121 and the lower pouch 122 to be exposed to the outside of the exterior member 120, thereby functioning as an electrode terminal of the secondary battery 100.
- the shape of the pouch-type cell is one example, and the battery cell applied in the present application is not limited to the above kind. In the present application, various well-known pouch-type cells or other types of batteries may be applied as battery cells.
- the battery module of the present application may further include a resin layer.
- the term resin layer is a layer containing a resin component, and in one example, the resin layer may be an adhesive layer.
- the battery module includes the case and the battery cell, and may be in contact with any one of the side wall, the bottom plate or the top plate of the case. At this time, the side wall, the bottom plate or the top plate which is in contact with the resin layer may be the above-described heat conductive side wall, the bottom plate or the top plate.
- the contact means thermal contact, wherein the resin layer is in direct contact with the lower plate or the like, or other elements between the resin layer and the lower plate, for example, insulation described later.
- the other element may mean the state which does not prevent the transfer of heat from the said resin layer to the said lower board etc. In the above, not impeding the transfer of heat, even if there is another element (eg an insulating layer or a guiding part described later) between the resin layer and the lower plate, the overall thermal conductivity of the other element and the resin layer.
- another element eg an insulating layer or a guiding part described later
- the thermal conductivity of the thermal contact is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, 10 W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK or less.
- Such thermal contact can be achieved by controlling the thermal conductivity and / or thickness of the other element, if such other element is present.
- the resin layer may be in contact with the lower plate or the like and may also be in contact with the battery cell.
- the contact between the battery cell and the resin layer is also the thermal contact described above.
- a module may be configured to accommodate more battery cells per unit volume. Accordingly, in the present application, it is possible to provide a battery module having a smaller size, light weight, and high power.
- the module may include a case 10 including a side wall 10b and a bottom plate 10a as shown in 6 and 7; It may be a form including a plurality of battery cells 20 stored in the case and the resin layer 30 in contact with (thermal contact) both the battery cell 20 and the case 10.
- the lower plate and the like contacting with the resin layer 30 may be a thermally conductive lower plate and the like as described above.
- the contact area of the resin layer and the lower plate may be about 70% or more, about 75% or more, about 80% or more, about 85% or more, about 90% or more or about 95% or more relative to the total area of the lower plate or the like.
- the upper limit of the contact area is not particularly limited, and may be, for example, 100% or less or less than about 100%.
- the contact area may be a ratio of the contact area with respect to the thermally conductive portion, that is, the total area of the thermally conductive portion.
- the thermally conductive portion or the thermally conductive bottom plate may be a portion contacting a cooling medium such as cooling water. That is, as shown schematically in FIG. 6, heat (H) can be easily discharged to the lower plate by the above structure, and by contacting the lower plate or the like with the cooling medium (CW), even in a more simplified structure The heat can be released easily.
- a cooling medium such as cooling water
- the resin layer 30 may be in the form of a relatively thin layer, or may fill the inner space of the case 10 as shown in FIG. 7.
- the battery cell 20 may exist in a state of being inserted into the resin layer.
- the thickness of the resin layer may be, for example, in the range of about 100 ⁇ m to 5 mm or in the range of about 200 ⁇ m to 5 mm.
- an appropriate thickness can be set in consideration of this point.
- the thickness may be the thickness of the thinnest portion, the thickness of the thickest portion, or the average thickness of the resin layer.
- the surface 10a in contact with the resin layer 30 may guide the battery cell 20 stored therein.
- the guiding part 10d may exist.
- the shape of the guiding part 10d is not particularly limited, and an appropriate shape may be adopted in consideration of the shape of the battery cell to be applied, and the guiding part 10d is integrally formed with the lower plate. Or may be attached separately.
- the guiding part 10d may be formed using a thermally conductive material, for example, a metal material such as aluminum, gold, pure silver, tungsten, copper, nickel or platinum in consideration of the thermal contact described above.
- a gap sheet or an adhesive layer may exist between the battery cells 20 to be accommodated.
- the interleaver may serve as a buffer when charging and discharging the battery cell.
- the resin layer or the battery module to which the resin layer is applied may have at least one or more of physical properties described below. Each physical property mentioned later is independent and does not give priority to the physical property of any one, and the resin layer can satisfy
- the resin layer is a thermally conductive resin layer, the thermal conductivity of about 1.5 W / mK or more, about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more or 4 It may be at least W / mK.
- the thermal conductivity is 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk Or less, 10 W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK or less.
- the resin layer is a thermally conductive resin layer as described above, the lower plate, etc., to which the resin layer is attached, may have the above-described thermal conductivity of 10 W / mK or more.
- the portion of the module case showing the thermal conductivity may be a portion in contact with a cooling medium, for example, cooling water.
- the thermal conductivity of a resin layer is a numerical value measured according to ASTMD5470 standard or ISO 22007-2 standard, for example.
- the manner in which the thermal conductivity of the resin layer is in the above range is not particularly limited.
- the thermal conductivity of the resin layer can be adjusted through the use of the type and / or filler of the resin used in the resin layer.
- acrylic resins, urethane resins, and silicone resins have similar thermal conductivity to each other, and epoxy resins have superior thermal conductivity
- olefin resins are epoxy resins.
- the thermal resistance of the resin layer or the battery module to which the resin layer is applied in the battery module is 5 K / W or less, 4.5 K / W or less, 4 K / W or less, 3.5 K / W or less, 3 K / W or less, or about 2.8 K / W or less.
- the method of measuring the thermal resistance is not particularly limited. For example, it can measure according to ASTM D5470 standard or ISO 22007-2 standard.
- the resin layer may have an appropriate adhesive force in consideration of effective fixing of the battery cell, impact resistance and vibration resistance in the process of using the module.
- the resin layer has an adhesive force of about 1,000 gf / 10 mm or less, about 950 gf / 10 mm or less, about 900 gf / 10 mm or less, about 850 gf / 10 mm or less, about 800 gf / 10 mm or less, about 750 gf / 10 mm Or about 700 gf / 10 mm or less, about 650 gf / 10 mm or less, or about 600 gf / 10 mm or less.
- the adhesive force of the resin layer may be about 50 or more, about 70 gf / 10 mm or more, about 80 gf / 10 mm or more, or about 90 gf / 10 mm or more.
- the adhesive force may be a value measured at a peel rate of about 300 mm / min and a peel angle of 180 degrees.
- the adhesive force may be adhesive force to the module case that the resin layer is in contact. For example, when an insulating layer is formed between the lower plate and the resin layer in contact with the resin layer in the module case as described below, the adhesive force to the module case is the module case in which the insulating layer is formed. May be adhesion to.
- the adhesive force as described above can be secured, excellent adhesion to various materials, for example, a case or a battery cell included in the battery module may appear excellent.
- the battery module may be prevented from being peeled off due to volume change, change in the use temperature of the battery module, or curing shrinkage of the resin layer, etc. at the time of charging and discharging the battery cell, thereby ensuring excellent durability.
- Such adhesive force can be ensured by, for example, configuring the resin layer with an adhesive layer.
- the adhesive force that a known adhesive material can exhibit is well known, and a material can be selected in consideration of such adhesive force.
- the resin layer is also subjected to a thermal shock test, for example, after a thermal shock test in which the cycle is repeated 100 times with one cycle of maintaining the temperature at 80 ° C. for 30 minutes and then maintaining the temperature at 80 ° C. for 30 minutes. It may be required to be formed so as not to be peeled or peeled from the module case or the battery cell of the module. For example, when the battery module is applied to a product that requires a long warranty period (about 15 years or more in the case of an automobile) such as an automobile, the above level of performance may be required to ensure durability.
- the resin layer may be an electrically insulating resin layer.
- the electrically insulating resin layer has an insulation breakdown voltage measured according to ASTM D149 of about 3 kV / mm or more, about 5 kV / mm or more, about 7 kV / mm or more, 10 kV / mm or more, 15 kV / mm or more 20 kV / mm or more.
- the resin layer is not particularly limited to exhibit excellent insulating properties, but considering the composition of the resin layer, it is about 50 kV / mm or less, 45 kV / mm or less, 40 kV / mm or less. , 35 kV / mm or less, 30 kV / mm or less.
- the dielectric breakdown voltage as described above can also be controlled by controlling the insulation of the resin component of the resin layer.
- the dielectric breakdown voltage can be adjusted by applying an insulating filler in the resin layer.
- the ceramic filler as described later is known as a component capable of ensuring insulation.
- a flame retardant resin layer may be applied in consideration of stability.
- the term flame retardant resin layer may refer to a resin layer exhibiting flame retardancy of V-0 or higher in UL 94 V Test (Vertical Burning Test). This ensures stability against fire and other accidents that may occur in the battery module.
- the resin layer may have a specific gravity of 5 or less.
- the specific gravity may be 4.5 or less, 4 or less, 3.5 or less, or 3 or less.
- the resin layer exhibiting specific gravity in this range is advantageous for the production of a lighter battery module.
- the specific gravity may be about 1.5 or more or 2 or more.
- components added to the resin layer may be adjusted. For example, when the thermally conductive filler is added, a filler capable of securing the desired thermal conductivity even at the lowest specific gravity, that is, a filler having a low specific gravity or a surface-treated filler may be used. have.
- the resin layer does not contain a volatile substance if possible.
- the resin layer may have a ratio of nonvolatile content of 90 wt% or more, 95 wt% or more, or 98 wt% or more.
- the nonvolatile component and its ratio may be defined in the following manner. That is, the non-volatile portion may be defined as the non-volatile content of the remaining portion after maintaining the resin layer at 100 ° C for about 1 hour, and thus the ratio is maintained for about 1 hour at the initial weight of the resin layer and the 100 ° C It can measure based on a later ratio.
- the resin layer may have excellent resistance to deterioration as necessary, but stability may be required in which the surface of the module case or the battery cell does not react as chemically as possible.
- the resin layer also has a low shrinkage rate after curing or after curing. Through this, it is possible to prevent peeling or the generation of voids that may occur during the manufacture or use of the module.
- the shrinkage rate may be appropriately adjusted in a range capable of exhibiting the above-described effects, for example, may be less than 5%, less than 3% or less than about 1%. Since the said shrinkage rate is so advantageous that the numerical value is low, the minimum in particular is not restrict
- the resin layer also has a low coefficient of thermal expansion (CTE).
- CTE coefficient of thermal expansion
- the coefficient of thermal expansion can be appropriately adjusted in a range capable of exhibiting the above-described effects, for example, less than 300 ppm / K, less than 250 ppm / K, less than 200 ppm / K, less than 150 ppm / K or about 100 may be less than ppm / K. Since the said coefficient of thermal expansion is so advantageous that the numerical value is low, the minimum in particular is not restrict
- Tensile strength of the resin layer can be appropriately adjusted, through which excellent impact resistance and the like can be secured to provide a module showing appropriate durability.
- Tensile strength can be adjusted, for example, in the range of about 1.0 MPa or more.
- Elongation of the resin layer can be appropriately adjusted, through which excellent impact resistance and the like can be secured, it is possible to provide a module showing appropriate durability. Elongation can be adjusted, for example, in the range of at least about 10% or at least about 15%.
- the resin layer also exhibits an appropriate hardness. For example, if the hardness of the resin layer is too high, the resin layer may be too brittle and adversely affect the reliability. In addition, by controlling the hardness of the resin layer it is possible to ensure impact resistance, vibration resistance, and ensure the durability of the product.
- the resin layer may, for example, have a hardness in Shore A type of less than 100, 99 or less, 98 or less, 95 or less, or 93 or less, or hardness in Shore D type of less than about 80, about 70 or less, or about 65 or less or about 60 or less.
- the lower limit of the hardness is not particularly limited.
- the hardness may be about 60 or more in Shore A type, or about 5 or about 10 or more in Shore OO type.
- the hardness of a resin layer is normally influenced by the kind or ratio of the filler contained in the resin layer, and when an excess filler is included, hardness will usually become high.
- the resin component contained in the resin layer also affects the hardness, as silicone-based resins generally exhibit lower hardness than other resins such as epoxy or urethane.
- the resin layer may also have a 5% weight loss temperature in the thermogravimetric analysis (TGA) of at least 400 ° C., or a residual amount of 800 ° C. at least 70% by weight. This characteristic can further improve stability at high temperatures of the battery module.
- the remaining 800 ° C. may be at least about 75 wt%, at least about 80 wt%, at least about 85 wt%, or at least about 90 wt%, in another example.
- the residual amount of 800 ° C. may be about 99 wt% or less in another example.
- the thermogravimetric analysis (TGA) can be measured within a range of 25 ° C. to 800 ° C.
- thermogravimetric analysis (TGA) results can also be achieved through control of the composition of the resin layer.
- the residual amount of 800 ° C is usually influenced by the type or proportion of the filler contained in the resin layer, and when the excess filler is included, the remaining amount increases.
- the silicone resin generally has higher heat resistance than other resins such as epoxy or urethane, the remaining amount is higher, and thus the resin component contained in the resin layer also affects its hardness.
- the type of the resin layer is not particularly limited as long as it can effectively fix the battery cell, and the above-mentioned physical properties can be imparted as necessary, and all known curable resin materials can be used.
- the said resin layer can harden
- the resin component that can be used include acrylic resins, epoxy resins, urethane resins, olefin resins, urethane resins, EVA (Ethylene vinyl acetate) resins, silicone resins, and the like. It may include.
- the said resin layer can contain the said resin as a main component in a resin component. That is, about 70% of the acrylic resin, epoxy resin, urethane resin, olefin resin, urethane resin, EVA (Ethylene vinyl acetate) resin or silicone resin among the total resin components included in the resin layer. At least about 75%, at least about 80%, at least about 85%, or at least about 90%. The ratio may be about 99% or less or about 95% or less.
- the material for forming the resin layer may be an adhesive material as described above, and may be a solvent type, an aqueous type, or a solventless type, but may be appropriately a solventless resin layer in consideration of convenience of the manufacturing process described later. Can be.
- the resin layer material may be an active energy ray curing type, a moisture curing type, a thermosetting type or a room temperature curing type, or the like, and may be appropriate to be a room temperature curing type in consideration of the convenience of the manufacturing process described later.
- the resin layer may include a filler in consideration of the above-described thermal conductivity, insulation, heat resistance (TGA analysis) or specific gravity.
- the filler may be a thermally conductive filler.
- thermally conductive filler means a material having a thermal conductivity of about 1 W / mK or more, about 5 W / mK or more, about 10 W / mK or more, or about 15 W / mK or more.
- the thermal conductivity of the thermally conductive filler may be about 400 W / mK or less, about 350 W / mK or less or about 300 W / mK or less.
- thermally conductive filler that can be used is not particularly limited, but a ceramic filler may be applied in consideration of insulation properties and the like.
- ceramic particles such as alumina, aluminum nitride (AlN), boron nitride (BN), silicon nitride, SiC, or BeO may be used.
- carbon fillers such as graphite can also be considered.
- the form or ratio of the filler contained in the resin layer is not particularly limited and is selected in consideration of the viscosity of the resin composition, the possibility of sedimentation in the resin layer, the desired thermal resistance or thermal conductivity, insulation, filling effect or dispersibility, and the like. Can be.
- the smaller the size the higher the heat resistance tends to be. Therefore, in consideration of the above-mentioned, an appropriate kind of filler may be selected, and if necessary, two or more fillers may be used.
- the resin layer may include a thermally conductive filler having an average particle diameter in the range of 0.001 ⁇ m to 80 ⁇ m.
- the average particle diameter of the filler may be 0.01 ⁇ m or more, 0.1 or more, 0.5 ⁇ m or more, 1 ⁇ m or more, 2 ⁇ m or more, 3 ⁇ m or more, 4 ⁇ m or more, 5 ⁇ m or more, or about 6 ⁇ m or more.
- the average particle diameter of the filler is, in another example, about 75 ⁇ m or less, about 70 ⁇ m or less, about 65 ⁇ m or less, about 60 ⁇ m or less, about 55 ⁇ m or less, about 50 ⁇ m or less, about 45 ⁇ m or less, about 40 ⁇ m or less, about 35 ⁇ m or less, about 30 ⁇ m or less, about 25 ⁇ m or less, about 20 ⁇ m or less, about 15 ⁇ m or less, about 10 ⁇ m or less, or about 5 ⁇ m or less.
- the ratio of the filler contained in the resin layer may be selected in consideration of the properties of the resin layer so that the above-described properties, for example, thermal conductivity, insulation, and the like can be secured.
- the filler may be included in the range of about 50 parts by weight or more relative to 100 parts by weight of the resin component of the resin layer.
- the weight part of the filler in another example is about 100 parts by weight or more, about 150 parts by weight or more, about 200 parts by weight or more, about 250 parts by weight or more, about 300 parts by weight or more, about 350 parts by weight or more, about 400 parts by weight or more, About 500 parts by weight, about 550 parts by weight, about 600 parts by weight, about 650 parts by weight or about 700 parts by weight or more.
- the upper limit of the ratio of the filler is not particularly limited, and for example, it can be controlled within a range that can satisfy the thermal conductivity of the resin layer described above.
- the filler is about 2,000 parts by weight, 1,800 parts by weight, 1,600 parts by weight, 1,400 parts by weight, 1,200 parts by weight, 1,000 parts by weight or less, 950 parts by weight or less with respect to 100 parts by weight of the resin component. Or 900 parts by weight or less.
- the resin layer or resin composition may contain a flame retardant for the satisfaction of the above-mentioned flame retardant grade.
- the present inventors have found that the type of flame retardant should be selected in order to satisfy the flame retardant grade while the resin layer or resin composition exhibits the desired physical properties, and in one example, the ratio should be controlled. That is, in order to provide flame retardancy simply, a large amount of flame retardants may be blended into the resin composition or the resin layer, but in such a case, the physical properties of the resin may be impaired.
- the inventors have confirmed that the phosphorus-based flame retardant should be applied to achieve the above object through various confirmations.
- the said resin layer or resin composition of this application contains a phosphorus flame retardant.
- a phosphorus flame retardant a mixture of a phosphorus-based flame retardant that is liquid at room temperature and a phosphorus-based flame retardant that is solid at room temperature may be used. The combination of these two specific flame retardants ensures a high flame retardant rating without compromising thixotropy, thermal conductivity and curability.
- the liquid phosphorus flame retardant is a flame retardant exhibiting a liquid state at room temperature, for example, a melting point of less than room temperature, for example, less than about 30 °C, less than 25 °C, less than 20 °C, less than 23 °C, less than 15 °C, 10 It may be a flame retardant less than or less than 8 ° C.
- the solid phosphorus-based flame retardant is a flame retardant exhibiting a solid phase at room temperature, for example, the melting point is above room temperature, for example, above about 20 °C, above about 25 °C, above about 30 °C, above about 40 °C or Flame retardant greater than about 50 ° C.
- the liquid phosphorus-based flame retardant may include, for example, phosphite such as resorcinol bis (diphenyl phosphate).
- Flame retardants can be applied.
- the solid phosphorus-based flame retardant may be used a phosphinate-based flame retardant such as aluminum phosphinate (aluminum phophinate).
- the solid phosphorus-based flame retardant may be used in the form of a powder flame retardant, in this case may be used in the form of a powder flame retardant having a particle size distribution (Particle Size Distribution) 50% particle size (D50) in the range of about 1 ⁇ m to 10 ⁇ m.
- the particle diameter (D50) is, in another example, at least about 2 ⁇ m, at least about 3 ⁇ m, at least about 4 ⁇ m or at least about 4.5 ⁇ m, or at most about 9 ⁇ m, at most 8 ⁇ m, at most 7 ⁇ m, at most 6 ⁇ m or at 5.5 ⁇ m. It may be:
- the ratio of the flame retardant may be controlled.
- the said resin layer or resin composition contains a resin component, and can contain a phosphorus flame retardant in the ratio of 20-40 weight part with respect to 100 weight part of said resin components.
- the resin component includes a substance in a resin state and a substance in a resin state by curing.
- the proportion of the phosphorus flame retardant may be about 22 parts by weight, 24 parts by weight, 26 parts by weight or 28 parts by weight or more, or 38 parts by weight, 36 parts by weight, 34 parts by weight, or 32 parts by weight. It may be about the following.
- the ratio (A / B) of the weight (A) of the liquid phosphorus flame retardant and the weight (B) of the solid phosphorus flame retardant may be adjusted within a range of 0.5 to 1.5.
- the ratio A / B may be about 0.6 or more, 0.7 or more, 0.8 or more, 0.9 or more, or 0.95 or more, or 1.4 or less, 1.3 or less, 1.2 or less, 1.1 or less, or 1.05 or less in another example.
- the resin layer or resin composition of a desired physical property can be formed more efficiently.
- the resin layer or the resin composition may include only a phosphorus flame retardant, for example, a combination of the above-mentioned phosphorus flame retardants as a flame retardant.
- the resin layer may be a viscosity modifier such as a thixotropic agent, a diluent, a dispersant, a surface treatment agent or a coupling agent to adjust the viscosity as necessary, for example to increase or decrease the viscosity or to adjust the viscosity according to shear force. And the like may be further included.
- a viscosity modifier such as a thixotropic agent, a diluent, a dispersant, a surface treatment agent or a coupling agent to adjust the viscosity as necessary, for example to increase or decrease the viscosity or to adjust the viscosity according to shear force. And the like may be further included.
- the thixotropic agent may adjust the viscosity according to the shear force of the resin composition so that the manufacturing process of the battery module is effectively performed.
- examples of the thixotropic agent that can be used include fumed silica and the like.
- Diluents or dispersants are generally used for lowering the viscosity of the resin composition, and any one of various kinds known in the art can be used without limitation as long as the diluent or dispersant is capable of exhibiting the above functions.
- the surface treating agent is for surface treatment of the filler introduced into the resin layer, and various kinds known in the art can be used without limitation as long as it can exhibit the above-described action.
- the coupling agent for example, it can be used to improve the dispersibility of a thermally conductive filler such as alumina, and various kinds known in the art can be used without limitation as long as it can exhibit the above action.
- the resin layer may further include a flame retardant or a flame retardant aid.
- a resin layer can form a flame-retardant resin layer.
- various flame retardants known in the art may be applied without particular limitation.
- a solid filler type flame retardant or a liquid flame retardant may be applied.
- Flame retardants include, for example, organic flame retardants such as melamine cyanurate, inorganic flame retardants such as magnesium hydroxide, and the like, but is not limited thereto.
- a liquid type flame retardant material TEP, Triethyl phosphate or TCPP, tris (1,3-chloro-2-propyl) phosphate, etc.
- TEP Triethyl phosphate
- TCPP tris (1,3-chloro-2-propyl) phosphate
- silane coupling agent may be added that can act as a flame retardant synergist.
- the resin layer may contain any one or two or more of the above components.
- the battery module may further include an insulating layer between the module case and the battery cell or between the resin layer and the module case.
- FIG. 8 shows an example in which the insulating layer 40 is formed between the resin layer 30 and the guiding portion 10d formed on the lower plate 10c of the case.
- the insulating layer may be formed using an insulating sheet having high insulation and thermal conductivity, or may be formed by coating or injecting a material exhibiting insulation. For example, in the method of manufacturing a battery module described below, a process of forming an insulating layer may be performed before the injection of the resin composition.
- the insulating layer may be formed of an adhesive material, and for example, the insulating layer may be formed using a resin layer having little or no filler such as a thermally conductive filler.
- the resin component that can be used to form the insulating layer include acrylic resins, olefin resins such as PVC (poly (vinyl chloride)) and PE (polyethylene), epoxy resin, silicone, and EPDM rubber (ethylene propylene diene monomer rubber). Rubber components, such as, but not limited to, etc.
- the insulating layer has an insulation breakdown voltage measured in accordance with ASTM D149 of about 5 kV / mm or more, about 10 kV / mm or more, about 15 kV / kmm or more, 20 kV / mm or more, 25 kV / mm or more or 30 kV / mm or more
- the breakdown voltage is not particularly limited as the value shows higher insulation.
- the dielectric breakdown voltage of the insulating layer may be about 100 kV / mm or less, 90 kV / mm or less, 80 kV / mm or less, 70 kV / mm or less, or 60 kV / mm or less. It can be set in an appropriate range in consideration of insulation and thermal conductivity.
- it may be about 5 ⁇ m or more, about 10 ⁇ m or more, 20 ⁇ m or more, 30 ⁇ m or more, 40 ⁇ m or more, 50 ⁇ m or more, 60 ⁇ m or more, 70 ⁇ m or more, 80 ⁇ m or more or 90 ⁇ m or more.
- the upper limit of the thickness is not particularly limited, and may be, for example, about 1 mm or less, about 200 ⁇ m or less, 190 ⁇ m or less, 180 ⁇ m or less, 170 ⁇ m or less, 160 ⁇ m or less, or 150 ⁇ m or less.
- the present application also relates to a method for manufacturing a battery module, for example the battery module mentioned above.
- Manufacturing method of the present application the step of injecting the resin composition in the above-described module case; And storing the battery cell in the module case and curing the resin composition to form the resin layer.
- the order of injecting the resin composition into the module case and accommodating the battery cells in the module case are not particularly limited.
- the resin composition may be first injected into the module case, and the battery cell may be stored in that state, or the resin composition may be injected after the battery cell is first stored inside the module case.
- resin composition in this application means the state of the resin layer before hardening
- resin layer can mean the state of the resin layer after hardening
- the method of injecting the resin composition into the module case is not particularly limited, and a known method may be applied.
- the resin composition is poured into the opening of the module case to inject the resin composition, or the resin composition is injected through the above-described injection hole formed in the module case, and the resin composition is injected into both the battery cell and the battery module.
- the method of coating may be applied.
- the implantation process may be performed while constantly vibrating the battery module or battery cell for proper fixation.
- the kind of resin composition injected above is not restrict
- the resin composition injected above may be a resin composition capable of satisfying the above-described physical properties such as thermal conductivity or forming a resin layer containing a component therefor.
- Such a resin composition may be the above-described solvent type, aqueous or solvent-free resin composition, and may be suitably a solvent-free resin composition.
- the resin composition may be an active energy ray-curable, moisture-curable, thermosetting or room temperature curing type resin composition, or the like, and may be suitably room temperature curing type resin composition.
- the resin composition may be a resin composition including at least one of various additives such as the above-described thermal conductive filler.
- Such a resin composition may be composed of one-component, two-component, or three-component.
- the manner in which the battery cells are housed in the module case in which the resin composition is injected or in the module case before the composition is injected is not particularly limited.
- the storage of the battery cells can be performed by arranging the battery cells at suitable positions in the module case in consideration of the desired arrangement and the like.
- the above steps may be performed by positioning the battery cell at a proper position of the cartridge structure, or inserting the cartridge structure in which the battery cell is located in the module case.
- the adhesion between the battery cells or the adhesion between the battery cells and the module case may be formed by curing the injected resin composition.
- the manner of curing the resin composition is not particularly limited.
- the resin composition is an active energy ray-curable type
- a method of irradiating active energy rays such as ultraviolet rays to the resin composition a method of keeping it under appropriate moisture when it is a moisture curable type, and applying appropriate heat in the case of a thermosetting type.
- the above steps may be performed by maintaining the resin composition at room temperature.
- short time heat may be applied, for example, to about 40 ° C. to 50 ° C. under conditions that do not affect the stability of the battery cell in terms of tack time and fairness before curing or before storage or storage of the battery cell. It may be.
- the present application also relates to a resin composition that can be used to form the above manufacturing method or the battery module of the aforementioned structure.
- the resin composition is not particularly limited as long as it can effectively fix the battery cell to the module case, and if the above-mentioned physical properties can be imparted as necessary, all known resin compositions can be used. .
- Such resin compositions include, but are not limited to, acrylic resin compositions, epoxy resin compositions, urethane resin compositions, olefin resin compositions, urethane resin compositions, EVA (Ethylene vinyl acetate) resin compositions or silicone resin compositions. .
- the resin composition may be a solvent-type resin composition, an aqueous resin composition or a solvent-free resin composition, and may be a solvent-free resin composition as appropriate.
- the resin composition may be an active energy ray curable resin composition, a moisture curable resin composition, a thermosetting resin composition, a room temperature curable resin composition, or the like, and may be an ambient temperature curable resin composition.
- the additives such as the above-mentioned filler
- the resin composition which can form a well-known acrylic adhesive, an epoxy adhesive, a urethane adhesive, an olefin adhesive, an EVA (Ethylene vinyl acetate) adhesive, or a silicone adhesive.
- a suitable amount can be applied to the above-described method.
- the resin composition as described above may include a radical initiator and a catalyst thereof in consideration of room temperature curability and the like.
- the resin composition may comprise an acyl peroxide initiator such as benzoyl peroxide and the like and a catalyst for such an initiator such as a toluidine compound, whereby a suitable curing system can be implemented.
- the resin composition may further include various components as necessary in addition to the above components.
- the present application also relates to a battery pack, for example, a battery pack including two or more battery modules described above.
- the battery modules may be electrically connected to each other.
- the method of configuring the battery pack by electrically connecting two or more battery modules is not particularly limited, and all known methods may be applied.
- the present application also relates to a device including the battery module or the battery pack.
- a device including the battery module or the battery pack examples include, but are not limited to, automobiles such as electric vehicles, and may include all applications requiring a secondary battery as an output.
- a method of configuring the vehicle using the battery module or the battery pack is not particularly limited, and a general method may be applied.
- the present application may provide a battery module having excellent output to volume, excellent heat dissipation characteristics, etc. while being manufactured at a simple process and low cost, a manufacturing method thereof, and a resin composition applied to the manufacturing method.
- FIG. 1 is a view showing an exemplary module case that can be applied in the present application.
- FIG. 2 is a view illustrating a battery cell housed in a module case.
- FIG 3 is a view of an exemplary bottom plate in which an injection hole and an observation hole are formed.
- FIGS. 4 and 5 illustrate exemplary battery pouches that can be used as battery cells.
- 6 to 8 show the structure of an exemplary battery module.
- the thermal conductivity of the resin layer was measured according to the ASTM D5470 standard. That is, after placing the resin layer between two copper bars according to the specification of ASTM D 5470, one of the two copper bars is in contact with the heater and the other is in contact with the cooler. The heater was kept at a constant temperature and the capacity of the cooler was adjusted to create a thermal equilibrium (state showing a temperature change of about 0.1 ° C. or less in 5 minutes). The temperature of each copper rod was measured in the thermal equilibrium state, and thermal conductivity (K, unit: W / mK) was evaluated according to the following formula. When the thermal conductivity was evaluated, the pressure applied to the resin layer was adjusted to about 11 Kg / 25 cm 2, and the thermal conductivity was calculated based on the final thickness when the thickness of the resin layer was changed during the measurement.
- K thermal conductivity (W / mK)
- Q heat transferred per unit time (unit: W)
- dx thickness of resin layer (unit: m)
- A is cross-sectional area of resin layer (unit: m2)
- dT is the temperature difference (unit: K) of the copper rod.
- the flame retardant grade of the resin layer was confirmed according to the UL 94V test method of the UL plastic test method.
- the resin composition prepared in the following Examples was about 2 to 3 mm thick, and cured to have lengths of 125 mm and 13 mm in length and width, respectively, to prepare bar-shaped specimens.
- a flame of 20 mm length is contacted with the specimen for 10 seconds, and the combustion time t1 and the combustion pattern of the specimen are confirmed (primary contact salt).
- the burning time t2 and the glowing time t3 of the specimen after contacting for 10 seconds are measured again, and the combustion profile is recorded.
- the time (t1, t2, t3) and the combustion pattern are determined, and the grade is calculated according to the following criteria.
- Class V0 individual combustion time (t1 or t2) is 10 seconds or less, total combustion time (previous t1 + t2 for five specimens) by pretreatment conditions is 50 seconds or less, and the time of combustion and sparks after the second inking Is less than 30 seconds, and there is no combustion until clamp (125mm display), and there is no ignition of cotton wool by dripping
- Class V1 The individual burn time (t1 or t2) is greater than 10 seconds and less than 30 seconds, and the total burn time (total of t1 + t2 for five specimens) for each pretreatment condition is greater than 50 seconds and less than 250 seconds, When burning and sparking time is more than 30 seconds and less than 60 seconds, there is no combustion until the clamp (125mm mark), and there is no burning of cotton wool by dripping
- Class V2 The individual combustion time (t1 or t2) is greater than 10 seconds and less than 30 seconds, and the total combustion time (total of t1 + t2 for five specimens) for each pretreatment condition is greater than 50 seconds and less than 250 seconds, When burning and sparking time is more than 30 seconds and less than 60 seconds, there is no combustion until the clamp (125mm mark), and there is ignition of cotton wool by dripping
- the resin composition is loaded on a poly (ethylene terephthalate) film to a thickness of about 30 mm, and then the loaded film is placed vertically for 1 hour, and the resin composition flows. The distance taken was measured and evaluated. When the flowed-out distance of the said resin composition is 50 mm or more, thixotropy was evaluated and flow was confirmed, and when it was less than 50 mm, it was judged that thixotropy was confirmed.
- Alumina particle size distribution: 1 ⁇ m to 60 ⁇ m
- topic HP-3753 (KPX Chemical)
- curing agent TLA-100 (made by Asaika)
- the mixture was mixed in an amount capable of exhibiting a thermal conductivity of about 3 W / mK (within a range of about 600 to 900 parts by weight based on 100 parts by weight of the total two-component resin component).
- about 15 parts by weight of resorcinol bis (diphenylphosphate) and also about 15 parts by weight of aluminum phosphinate based on 100 parts by weight of the total amount of the two-component resin component of the adhesive composition was added to the two-component urethane adhesive composition (topic: HP-3753 (KPX Chemical), curing agent: TLA-100 (made by Asaika)).
- the mixture was mixed in an amount capable of exhibiting a thermal conductivity of about 3 W / mK (within a range of about 600 to 900 parts by weight based on 100 parts by
- Resorcinol bis (diphenyl phosphite) is a liquid phosphorus flame retardant having a phosphorus (P) content of about 10 to 12%, aluminum phosphinate has a phosphorus (P) content of about 23 to 24%
- a solid flame retardant it is a solid phosphorus flame retardant whose particle size distribution 50% particle diameter (D50) is about 5 micrometers, and a decomposition temperature is about 350 degreeC.
- a module case having a shape as shown in FIG. 1 a module case having a lower plate, a side wall, and an upper plate made of aluminum was used.
- the inner surface of the lower plate of the module case is formed with a guiding part for guiding the mounting of the battery cell, the injection hole for the injection of the resin composition is formed at a predetermined interval in the center of the lower plate of the module case, An observation hole is formed at the end.
- a bundle of pouches in which a plurality of battery pouches were stacked was stored in the module case.
- the top plate was then covered on the upper surface of the module case. Thereafter, the prepared resin composition was injected into the injection hole until it was confirmed that the injected composition reached the observation hole, and then cured to prepare a battery module.
- a battery module was manufactured in the same manner as in Example 1, except that a flame retardant was not mixed at the time of preparing the resin composition.
- a battery module was manufactured in the same manner as in Example 1, except that only resorcinol bis (diphenylphosphite) was mixed at about 30 parts by weight based on 100 parts by weight of the total amount of the two-liquid resin component as a flame retardant in preparing the resin composition. .
- a battery module was manufactured in the same manner as in Example 1, except that only chloro alkyl diphosphonate ester (C13H24Cl6O8P2) was mixed at about 30 parts by weight based on 100 parts by weight of the total two-component resin component as a flame retardant in the preparation of the resin composition.
- the chloroalkyl diphosphonate ester (C13H24CL6O8P2) is a solid flame retardant having a particle size distribution of 50% particle size (D50) of about 10 ⁇ m and a decomposition temperature exceeding about 280 ° C.
- a battery module was manufactured in the same manner as in Example 1, except that only aluminum phosphinate was mixed at about 30 parts by weight based on 100 parts by weight of the total two-component resin component as a flame retardant in the preparation of the resin composition.
- a battery module was manufactured in the same manner as in Example 1, except that only aluminum polyphosphite-based flame retardant was mixed at about 30 parts by weight based on 100 parts by weight of the total amount of the two-liquid resin component as a flame retardant in preparing the resin composition.
- the aluminum polyphosphite flame retardant is a solid flame retardant having a particle size distribution of 50% particle size (D50) of about 18 ⁇ m and a decomposition temperature of more than about 275 ° C.
- a battery module was manufactured in the same manner as in Example 1, except that only a thermoplastic elastomer (ether-ester) type flame retardant was mixed at about 30 parts by weight based on 100 parts by weight of the total amount of the two-component resin component as a flame retardant in preparing the resin composition.
- the flame retardant is a solid flame retardant having a particle size distribution 50% particle size (D50) of about 10 ⁇ m and a decomposition temperature of greater than about 280 ° C.
- Example 2 It is the same as that of Example 1 except having changed the compounding ratio of the resorcinol bis (diphenyl phosphite) flame retardant into 10 weight part at the time of manufacture of a resin composition, and changing the compounding ratio of the aluminum phosphinate flame retardant to 10 weight part.
- Example 2 It is the same as that of Example 1 except having changed the compounding ratio of the resorcinol bis (diphenyl phosphite) flame retardant into 10 weight part at the time of manufacture of a resin composition, and changing the compounding ratio of the aluminum phosphinate flame retardant to 10 weight part.
- a battery module was manufactured in the same manner as in Example 1, except that 15 parts by weight of resorcinol bis (diphenylphosphite) flame retardant and 15 parts by weight of aluminum polyphosphite-based flame retardant were mixed. .
- a battery module was manufactured in the same manner as in Example 1, except that 15 parts by weight of the resorcinol bis (diphenylphosphite) flame retardant and 15 parts by weight of the flame retardant of Comparative Example 6 were combined.
- the resin composition was prepared having only thixotropy and exhibiting high thermal conductivity and satisfying flame retardant grade V0.
- no flame retardant was added so that the flame retardant grade was decreased, and the resin composition did not exhibit thixotropy.
- thixotropy was not confirmed, and even though fillers of the same content were blended, the thermal conductivity was lowered.
- Comparative Examples 3 and 4 thixotropy was confirmed, but high thermal conductivity and flame retardant grade were not satisfied at the same time.
- Comparative Examples 5, 6, 8 and 9 thixotropy was not obtained, and high thermal conductivity and flame retardant grade were not satisfied at the same time.
- thixotropy was also confirmed, but high thermal conductivity and flame retardant grade were not satisfied at the same time.
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Abstract
Description
열전도도(단위: W/mK) | 요변성 | 난연등급 | |
실시예1 | 3.03 | 요변성 확인 | V0 |
비교예1 | 3.05 | 흐름 | V1 |
비교예2 | 2.91 | 흐름 | V1 |
비교예3 | 3.04 | 요변성 확인 | V1 |
비교예4 | 2.57 | 요변성 확인 | V1 |
비교예5 | 3.25 | 흐름 | V2 |
비교예6 | 3.14 | 흐름 | V1 |
비교예7 | 3.01 | 요변성 확인 | V2 |
비교예8 | 3.01 | 흐름 | V2 |
비교예9 | 2.96 | 흐름 | V1 |
Claims (16)
- 내부 공간을 형성하는 하부판과 측벽을 가지는 모듈 케이스; 상기 모듈 케이스의 내부 공간에 존재하는 복수의 배터리셀; 및 상기 모듈 케이스의 내부 공간에 존재하는 수지층을 포함하고,상기 수지층은, UL 94 V 테스트에서 V-0 등급 이상의 난연성을 가지며, 수지 성분과 인계 난연제를 포함하는 배터리 모듈.
- 제 1 항에 있어서, 수지층은, 복수의 배터리셀과 접촉하고 있고, 또한 모듈 케이스의 하부판 또는 측벽과 접촉하고 있는 배터리 모듈.
- 제 1 항에 있어서, 수지층과 접촉하고 있는 측벽 또는 하부판은 열전도성 영역을 포함하는 배터리 모듈.
- 제 3 항에 있어서, 수지층과 열전도성 영역의 접촉 비율은, 상기 열전도성 영역의 전체 면적 대비 80% 이상인 배터리 모듈.
- 제 1 항에 있어서, 수지층은 열전도도가 1.5 W/mK 이상인 배터리 모듈.
- 제 1 항에 있어서, 인계 난연제는, 액상 인계 난연제와 고상 인계 난연제를 포함하는 배터리 모듈.
- 제 6 항에 있어서, 액상 인계 난연제는 포스파이트계 난연제인 배터리 모듈.
- 제 6 항에 있어서, 고상 인계 난연제는 포스피네이트계 난연제인 배터리 모듈.
- 제 6 항에 있어서, 고상 인계 난연제는 입도 분포 50% 입경(D50)이 1μm 내지 10μm의 범위 내에 있는 분말 형태인 배터리 모듈.
- 제 1 항에 있어서, 수지층은 수지 성분을 포함하고, 인계 난연제는 상기 수지 성분 100 중량부에 대해서 20 내지 40 중량부의 비율로 포함되어 있는 배터리 모듈.
- 제 10 항에 있어서, 액상 인계 난연제의 중량(A)과 고상 인계 난연제의 중량(B)의 비율(A/B)이 0.5 내지 1.5의 범위 내에 있는 배터리 모듈.
- 제 1 항에 있어서, 수지층은 난연제로서는 인계 난연제만을 포함하는 배터리 모듈.
- 제 1 항에 있어서, 수지층은, 아크릴 수지, 에폭시 수지, 우레탄 수지, 올레핀 수지, EVA 수지 또는 실리콘 수지를 포함하는 배터리 모듈.
- 제 1 항에 있어서, 수지층은 필러를 포함하는 배터리 모듈.
- 제 14 항에 있어서, 필러는, 세라믹 입자 또는 탄소계 필러인 배터리 모듈.
- 서로 전기적으로 연결되어 있는, 제 1 항의 배터리 모듈을 2개 이상 포함하는 배터리팩.
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JP2018566180A JP6656430B2 (ja) | 2016-04-01 | 2017-04-03 | バッテリモジュール |
EP17775933.9A EP3419082B1 (en) | 2016-04-01 | 2017-04-03 | Battery module |
US16/081,150 US10998598B2 (en) | 2016-04-01 | 2017-04-03 | Battery module having resin layer in module case |
CN201780019749.2A CN108886121B (zh) | 2016-04-01 | 2017-04-03 | 电池模块 |
US16/552,525 US11342627B2 (en) | 2016-04-01 | 2019-08-27 | Method of manufacturing a battery module |
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US16/081,150 A-371-Of-International US10998598B2 (en) | 2016-04-01 | 2017-04-03 | Battery module having resin layer in module case |
US16/552,525 Division US11342627B2 (en) | 2016-04-01 | 2019-08-27 | Method of manufacturing a battery module |
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US20180358592A1 (en) | 2018-12-13 |
JP2019508871A (ja) | 2019-03-28 |
US11342627B2 (en) | 2022-05-24 |
US10998598B2 (en) | 2021-05-04 |
CN108886121A (zh) | 2018-11-23 |
KR20170113466A (ko) | 2017-10-12 |
JP6656430B2 (ja) | 2020-03-04 |
EP3419082B1 (en) | 2021-06-16 |
KR102062831B1 (ko) | 2020-01-07 |
US20200144573A1 (en) | 2020-05-07 |
EP3419082A1 (en) | 2018-12-26 |
CN108886121B (zh) | 2021-11-30 |
EP3419082A4 (en) | 2019-03-13 |
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