WO2017157211A1 - 摄像模组及其感光组件和制造方法 - Google Patents

摄像模组及其感光组件和制造方法 Download PDF

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Publication number
WO2017157211A1
WO2017157211A1 PCT/CN2017/076041 CN2017076041W WO2017157211A1 WO 2017157211 A1 WO2017157211 A1 WO 2017157211A1 CN 2017076041 W CN2017076041 W CN 2017076041W WO 2017157211 A1 WO2017157211 A1 WO 2017157211A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
camera module
circuit board
chip
photosensitive member
Prior art date
Application number
PCT/CN2017/076041
Other languages
English (en)
French (fr)
Inventor
王明珠
赵波杰
田中武彦
栾仲禹
陈振宇
黄桢
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201620191631.0U external-priority patent/CN205792874U/zh
Priority claimed from CN201620191969.6U external-priority patent/CN205792875U/zh
Priority claimed from CN201610142925.9A external-priority patent/CN105704354B/zh
Priority claimed from CN201610143457.7A external-priority patent/CN105744130B/zh
Priority claimed from CN201620269534.9U external-priority patent/CN205545597U/zh
Priority claimed from CN201610202500.2A external-priority patent/CN105721754B/zh
Priority claimed from CN201610278035.0A external-priority patent/CN105827916B/zh
Priority claimed from CN201620373323.XU external-priority patent/CN205961266U/zh
Priority claimed from CN201610430615.7A external-priority patent/CN107516651B/zh
Priority claimed from CN201620590779.1U external-priority patent/CN206040618U/zh
Priority to KR1020217005344A priority Critical patent/KR102294537B1/ko
Priority to KR1020217005352A priority patent/KR102360319B1/ko
Priority to EP17765753.3A priority patent/EP3429183A4/en
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to JP2018548099A priority patent/JP7071926B2/ja
Priority to US16/082,533 priority patent/US20190148429A1/en
Priority to KR1020187029304A priority patent/KR20180132684A/ko
Publication of WO2017157211A1 publication Critical patent/WO2017157211A1/zh
Priority to US17/847,569 priority patent/US12021097B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Definitions

  • the invention relates to the field of camera modules, and further relates to a camera module, a photosensitive component thereof and a manufacturing method thereof.
  • the COB (Chip On Board) process is an extremely important process in the assembly and manufacturing process of a camera module.
  • the camera module made by the traditional COB process is assembled by components such as a circuit board, a photosensitive chip, a lens holder, a motor drive, and a lens.
  • FIG. 1 it is a schematic diagram of a camera module manufactured by a conventional COB process.
  • the camera module includes a circuit board 101P, a light sensor chip 102P, a bracket 103P, a filter 104P, a motor 105P and a lens 106P.
  • the photosensitive chip 102P is mounted on the wiring board 101P
  • the filter 104P is mounted on the bracket 103P
  • the lens 106P is mounted to the motor 105P
  • the motor 105P is mounted on the bracket 103P, so that the lens 106P is located on the photosensitive path of the photosensitive chip 102P.
  • circuit devices 1011P such as resistors, capacitors, etc.
  • circuit devices 1011P are usually mounted on the circuit board 101P.
  • These circuit devices 1011P protrude from the surface of the circuit board 101P, and the bracket 103P needs to be Mounted on the circuit board 101P having the circuit device 1011P, and the assembly coordination relationship between the circuit board 101P, the circuit device 1011P, and the bracket 103P in the conventional COB process has some disadvantages, and To a certain extent, it has limited the development of the camera module to lighter and thinner.
  • the photosensitive chip 102P is usually electrically connected to the wiring board 101P through some gold wires 1021P to facilitate information transmission between the photosensitive chip 102P and the wiring board 101P.
  • the gold wire 1021P is generally curved in an arc shape and protrudes from the surface of the circuit board 101P. Therefore, the assembly process of the photosensitive chip 102P is also the circuit.
  • the device 1011P there are similar influencing factors for the camera module.
  • the circuit device 1011P and the gold wire 1021P are directly exposed to the surface of the circuit board 101P, so in the process of subsequent assembly, such as bonding the bracket 103P, soldering the motor 105P, and the like.
  • the solder resist, dust, and the like at the time of soldering are likely to adhere to the circuit device 1011P, and the circuit device 1011P and the photosensor chip 102P are located in a space in which they communicate with each other, so dust and dust are very It is easy to affect the photosensitive chip 102P. Such an effect may cause undesirable phenomena such as black spots on the assembled camera module, and the product yield is lowered.
  • the bracket 103P is located outside the circuit device 1011P, so when the bracket 103P and the circuit board 101P are mounted, a certain safety distance needs to be reserved between the bracket 103P and the circuit device 1011P. And the safety distance needs to be reserved in the horizontal direction and the upward direction, which increases the demand for the thickness of the camera module to a certain extent, so that the thickness thereof is difficult to reduce.
  • the bracket 103P or the motor 105P is pasted to the circuit board 101P by a sticker such as glue, and an AA (Active Arrangement) process is usually performed when pasting, that is, adjustment
  • AA Active Arrangement
  • the central axes of the photosensitive chip 102P and the lens 106P are made to be consistent in the horizontal direction and the vertical direction. Therefore, in order to satisfy the AA process, the bracket 103P and the circuit board 101P and the bracket are required.
  • a large amount of glue needs to be preset, so that there is room for adjustment between each other, and this requirement increases the thickness requirement of the camera module to a certain extent, making the thickness difficult.
  • the multiple-paste assembly process easily causes the tilt of the assembly to be inconsistent, and the flatness of the mirror mount 103P, the wiring board 101P, and the motor 105P is required to be high.
  • the bracket 103P is usually manufactured by injection molding, and the surface of the bracket 103P itself is poor in flatness due to the selection of materials and manufacturing processes, so that the bracket is made on the one hand.
  • the bonding flatness and stability between the 103P and the circuit board 101P are poor, and on the other hand, the bracket 3P is made of other components, such as the mounting plane provided by the motor 105P and/or the lens 106P.
  • the flatness is poor, and these factors will affect the final quality of the camera module and the yield of the mass production.
  • the circuit board 101P provides the most basic fixing and supporting carrier, and therefore, the circuit board 101P itself is required to have a certain structural strength, and this requirement makes the circuit board 101P have a large
  • the thickness pre-adds the thickness requirement of the camera module.
  • camera modules are increasingly moving toward high performance, lightness and thinness, and in the face of high-performance development requirements such as high pixel and high image quality, electronic circuits in circuits More and more components, larger and larger chip areas, and more passive components such as drive resistors and capacitors, which make the specifications of electronic devices larger and larger, the difficulty of assembly increases, and the overall size of camera modules
  • the larger the volume is, the traditional assembly method of the mirror base, the circuit board, and the circuit components is also a great limitation to the development of the thin and light camera module.
  • the mass production is an indispensable part. How to improve the performance of products and improve the yield of products, so that a technology can be put into production applications. Camera module technology researchers and manufacturers are extremely important.
  • the conventional mobile phone camera module package circuit board is usually provided with a capacitor and a plastic member, and the resistive container member and the plastic member are independent, and do not overlap in space, and the plastic member serves as a support.
  • the main problems of this type of scheme are as follows:
  • the plastic bracket is separately molded and glued to the circuit board by glue. It is easy to tilt the module due to the unevenness of the plastic bracket itself and the assembly of the patch. 2.
  • the resistive container and the photosensitive chip are in the same space. The dust of the container part is not easy to clean, which affects the final black spot of the module; 3, the structural strength of the circuit board is not strong; 4, the size is difficult to achieve small, especially the horizontal size, two camera modes The size between the groups is wasteful, affecting the overall size.
  • the MOC (Molding On Chip) packaging process applied to the camera module industry has been developed.
  • the MOC packaging process encapsulates the sensor chip and the circuit together in the process of packaging the camera module to maximize the camera mode.
  • the structural strength of the group, the reduction of the size of the camera module, and the reduction of dustiness occur.
  • the photosensitive chip is first mounted on the circuit board, and the photosensitive chip and the circuit board are electrically connected by a gold wire, and then the Inserting the circuit board into the molding die and facing the photosensitive region of the photosensitive chip toward the molding die, forming a bracket by filling the molding die with a molding material, wherein the bracket causes the photosensitive chip and the The circuit board is integrated.
  • the photosensitive chip improves the photosensitivity of the photosensitive chip by a microlens that is matched one by one with each pixel, and the microlens is usually of a micron order, which makes the microlens extremely easy. Damaged or scratched, especially in a high temperature and high pressure state, the microlens is more likely to be damaged or scratched, and generally any of the microlenses in the photosensitive chip is damaged or scratched Therefore, it is necessary to cause the imaging quality of the camera module to be affected.
  • there is a tolerance in the mounting of the photosensitive chip and the circuit board which results in a gap between the photosensitive chip and the molding die after the molding die is pressed against the non-photosensitive area of the photosensitive chip.
  • the molding material flows into the gap formed between the photosensitive chip and the molding die, resulting in a "flash" of the stent formed by the molding material, on the one hand due to the molding material.
  • the temperature is relatively high, and once the forming material flows to the photosensitive region of the photosensitive chip, damage to the microlens provided in the photosensitive region of the photosensitive chip is caused, and on the other hand, the bracket is formed.
  • the flash edge may partially block the photosensitive area of the photosensitive chip and cause a defective product.
  • the consistency of the optical axis is an important factor affecting the imaging quality of the camera module, and the consistency of the optical axis mainly refers to the sensitivity.
  • the central axis of the chip is coaxial with the main optical axis of the lens, so the D/A (Die/Attach chip attach) process is an important process in the assembly and manufacturing process of the camera module.
  • a chip 501P is usually attached to a circuit board 502P, that is, a D/A process, that is, a thermosetting conductive adhesive or an insulating rubber is coated on a specific shape of the circuit board surface 502P.
  • a dot or a cross or a cross is drawn in a dispensing manner, and the chip 501P is attached to the circuit board 502P.
  • the glue is spread out by a pressing action in the attaching process to adhere the chip 501P. Finally, the glue is dried and solidified by heat baking so that the chip 501P is fixed on the surface of the wiring board 502P.
  • a predetermined and less colloid 503P is formed on the circuit board 502P, and a result of the bonding is that a floating area 504P appears in an edge region of the chip 501P opposite to the circuit board 502P, and the surrounding area is usually surrounded by the floating area 504P. Area 504P.
  • the presence of the floating region 504P easily causes the chip 501P to be tilted.
  • the chip 501P and the circuit board 502P have an angle ⁇ ° as shown in FIG. 81B.
  • the pressed colloid 503P is unevenly distributed and has poor flatness. For example, the error is about 20 ⁇ m.
  • the MOC (Molding On Chip) process is an important chip assembly process that has recently been developed.
  • the main flow of this process is to first attach the chip 501P to the line.
  • the board 502P, and then the gold wire 505P, and then a molded bracket 506P is molded on the circuit board 502P and the chip 501P, and the edge of the chip 501P and the connection area of the circuit board 502P are molded and packaged.
  • the edge region of the chip 501P is subjected to the pressing action of the mold, and the chip 501P and the line passing through the conventional D/A process.
  • the floating region 504P exists between the plates 502P, and such pressing easily causes the chip 501P to have a tilting problem, and even the edge of the chip 501P is broken due to uneven force. Therefore, in order to ensure better optical axis consistency and reliability of the chip, on the one hand, the chip and the circuit board are required to be flattened, and on the other hand, the precision of the pressing process of the molding process is high, but these still cannot be It completely solves the problems that the traditional D/A process brings about possible optical axis inconsistency, poor analysis, abnormal curve, and abnormal motor CODE for the camera module.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive member includes a package portion and a photosensitive portion, and the package portion is packaged and formed on the photosensitive portion.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method, wherein the package portion is integrally formed on the photosensitive portion to provide a flat mounting surface.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive portion includes a photosensitive chip and a circuit board body, and the photosensitive chip is electrically connected to the circuit board through at least one connecting line The main body, the encapsulation portion covers the connecting line so as not to be directly exposed to the outside.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method, wherein the connecting wire is integrally wrapped inside the package portion by a molding manufacturing method.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive member includes at least one circuit component, and the circuit component is covered in the package portion so that it is not directly exposed Externally.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method, wherein the circuit component is integrally wrapped inside the package portion by a molding manufacturing method.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive chip has a photosensitive region and a non-sensitive region, and the package portion is molded in a non-photosensitive region of the photosensitive chip. The length and width dimensions of the photosensitive member and the camera module assembled therefrom are reduced.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the circuit board body has an inner groove, and the photosensitive chip is disposed in the inner groove, thereby reducing the The height requirements of the package.
  • An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the package portion includes a covering portion and a filter mounting portion, and the filter mounting portion is integrally molded and connected
  • the wrapper segment is adapted to be mounted with a filter so that no additional filter mounting brackets need to be provided.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method, wherein the package portion includes a lens mounting portion integrally extending upwardly for mounting a lens therein.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive member includes a filter, and the filter is moldedly disposed above the photosensitive chip, thereby passing through The filter protects the photosensitive chip and can reduce the back focal length of the camera module assembled therefrom, so that the height of the camera module is smaller.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive member includes a reinforcing layer, and the reinforcing laminated layer is connected to a bottom side of the circuit board main body, thereby adding the
  • the structural strength of the main body of the circuit board is such that the main body of the circuit board having a smaller thickness is used, and the heat dissipation capability of the main body of the circuit board can be improved.
  • An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the circuit body has at least one reinforcing hole, and the package portion extends into the reinforcing hole, thereby enhancing the package portion and the The adhesive force between the photosensitive members is increased, and the structural strength of the wiring board main body is increased.
  • An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the package portion is adapted to be mounted with a motor or a lens, and can be used as a conventional bracket to provide the motor or the lens.
  • the fixing position is supported, and by the molding molding advantage of the encapsulating portion, the flatness is better, thereby reducing the tilt error of the assembly of the image pickup film assembly.
  • An object of the present invention is to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein the camera module is assembled and manufactured by molding, thereby changing a conventional camera module COB process.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method for manufacturing the photosensitive wiring module by molding, thereby obtaining a molded and integrated photosensitive member.
  • An object of the present invention is to provide an image pickup module, a photosensitive member thereof, and a manufacturing method thereof, wherein the package portion at least partially integrally encapsulates the circuit board main body and the photosensitive chip, and expands the settable portion of the package portion inwardly The position allows the size of the camera module to be further reduced.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the package portion at least partially integrally encapsulates the circuit board main body and the photosensitive chip, so that the photosensitive chip is more stably connected to The circuit board body.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the package portion at least partially integrally encapsulates the circuit board body and the photosensitive chip, and increases the package portion and the photosensitive portion The connection area of the portion, thereby making the connection of the package portion more stable.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method, wherein a joint area of the package portion and the photosensitive portion is large, and the structural strength of the photosensitive portion is enhanced.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the photosensitive member is suitable for manufacturing a multi-lens, high-pixel camera module.
  • An object of the present invention is to provide an image pickup module, a photosensitive member thereof, and a manufacturing method thereof, wherein the package portion forms an inner side surface with a controllable inclination, which helps to reduce stray light reflection on the photosensitive chip, thereby improving image quality.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the camera module is suitable for being applied to an actual production process, improving the mass production yield of the product, and reducing the production cost.
  • An object of the present invention is to provide a camera module based on an integrated packaging process, which can enhance the force strength of the module by using a side or bottom molding scheme of the circuit board.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which can increase the cutting efficiency of the circuit board by using a side molding method of the circuit board.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side molding scheme of the circuit board to make the module design more flexible.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which can enhance the structural strength of the module by using a circuit board bottom molding scheme.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side or bottom molding scheme of the circuit board, which can improve the heat dissipation efficiency of the module.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side or bottom molding scheme of a circuit board, which can improve the parallelism of the surface of the photosensitive chip of the module and the upper surface of the package, and the package portion. The flatness of the surface.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side or bottom molding scheme of the circuit board, which can reduce the processing steps and improve the production efficiency.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side or bottom molding scheme of the circuit board, which can make the overall size of the module smaller.
  • Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts a side or bottom molding scheme of the circuit board to prevent dust from entering the affected performance after the module is formed.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the camera module provides a protective frame, and the protective frame is disposed on an outer peripheral side of the photosensitive region of the photosensitive chip to be integrated in a package.
  • the protective frame prevents the forming material for forming the integral package holder from damaging the photosensitive region of the photosensitive chip during molding.
  • An object of the present invention is to provide a camera module and a method of manufacturing the same, wherein the protective frame prevents a "flash" from appearing inside the integrated package when the integral package is formed.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame is disposed on an outer peripheral side of the filter element, and the protective frame is blocked in the integrated package when the integrated package is formed A "flash" occurs on the inside of the bracket.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame is convexly disposed on an outer peripheral side of a photosensitive region of the photosensitive chip, and a molding die for molding the integrated package is applied Pressing the protective frame to prevent the molding die from directly contacting the photosensitive chip by the protective frame, thereby preventing the photosensitive region of the photosensitive chip from being damaged or being scratched by being pressed.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame has elasticity to provide a buffering capability, and can be sufficiently contacted with the molding die after the protective frame is pressed to serve as a sealing function.
  • the photosensitive region of the photosensitive chip is isolated from the external environment, thereby preventing damage to the photosensitive region of the photosensitive chip during molding of the integrated package.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protection frame has elasticity to provide a buffering capability, thereby reducing the requirement for the flatness of the camera module, and reducing the camera module. Assembly requirements for various agencies.
  • An object of the present invention is to provide a camera module and a method of manufacturing the same, wherein the protective frame is overlaid on the photosensitive chip after molding to improve the manufacturing efficiency of the camera module.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the upper surface of the mold of the molding die is provided with at least one cover film, and when the upper portion of the mold of the molding die is pressed, the cover film can also be Further protection is provided to the photosensitive chip.
  • the cover film can also increase the difficulty of demolding and increase the sealing property to prevent "flash".
  • An object of the present invention is to provide a camera module and a method of manufacturing the same, wherein the molding die corresponds to the feeling
  • the photosensitive region of the optical chip can be recessed to provide a safe distance between the photosensitive region of the photosensitive chip and the molding die, thereby further reducing the influence on the photosensitive chip.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame is covered with a protective film to facilitate the protection frame to be disposed on the photosensitive chip, and the protective film can also be The photosensitive area and the external environment of the photosensitive chip are isolated.
  • An object of the present invention is to provide a photosensitive assembly and a camera module, and a method of manufacturing the same, the photosensitive assembly comprising a photosensitive chip and a circuit board body, wherein the photosensitive chip is connected to the circuit board body through a connection medium, and The connecting medium and the photosensitive chip are matched in shape.
  • An object of the present invention is to provide a photosensitive module, a camera module, and a manufacturing method thereof, wherein an area between the photosensitive chip and the circuit board main body is completely filled by the connection medium, and there is no floating area, thereby improving the light sensitivity.
  • the flatness of the chip reduces the occurrence of tilting of the photosensitive chip relative to the main body of the circuit board.
  • An object of the present invention is to provide a photosensitive module and a camera module, and a manufacturing method thereof, wherein the photosensitive chip has a front surface and a back surface, and the connecting medium can be sprayed on the back surface of the photosensitive chip when the photosensitive member is manufactured. And removing the excess of the connecting medium such that the connecting medium and the shape of the photosensitive chip match.
  • An object of the present invention is to provide a photosensitive member, a camera module, and a manufacturing method thereof, which are applied by rolling to the back surface of the photosensitive chip by rolling, and cutting off excess
  • the connecting medium is arranged such that the connecting medium is flatly attached to the back surface of the photosensitive chip, and the bonding flatness of the photosensitive chip and the wiring board main body is ensured.
  • An object of the present invention is to provide a photosensitive member, a camera module, and a manufacturing method thereof, the connection medium comprising a circuit board film attached to the circuit board main body, the circuit board film and The photosensitive chip shapes are matched.
  • An object of the present invention is to provide a photosensitive member, a camera module and a method of manufacturing the same, wherein when the photosensitive member is manufactured, the connecting medium can be disposed on the back side of a full-size chip, and then the entire chip can be cut and formed.
  • a plurality of the respective photosensitive chips further respectively attach a plurality of the photosensitive chips to the corresponding circuit board main body, which is suitable for mass production, shortens the assembly man-hour of the photosensitive assembly, and improves the production efficiency of the chip attachment.
  • An object of the present invention is to provide a photosensitive member, a camera module and a method of manufacturing the same, wherein the photosensitive member includes a molded body integrally formed on the wiring board and the photosensitive chip, and the chip is attached flatly
  • the main body of the circuit board is such that when the molded body is formed, the photosensitive chip is not tilted to ensure the consistency of the optical axis of the camera module.
  • an aspect of the present invention provides a photosensitive assembly of a camera module, comprising: a package portion and a photosensitive portion; the photosensitive portion includes a circuit board body And a photosensitive chip, the package portion is packaged on the circuit board main body and the photosensitive chip.
  • the encapsulation portion of the photosensitive member forms a through hole, and the through hole is opposite to the photosensitive chip to provide a light path of the photosensitive chip.
  • the bottom of the through hole of the encapsulation portion of the photosensitive member has an inclined shape that gradually increases from bottom to top.
  • the top end of the encapsulation portion of the photosensitive module is adapted to mount a lens, a motor or a filter of the camera module.
  • the top end of the encapsulation portion of the photosensitive module is planar for mounting a lens, a motor or a filter of the camera module.
  • the top of the package portion has a mounting slot, and the mounting slot communicates with the through hole for mounting a filter and a lens of the camera module. Or motor.
  • the package portion includes a covering portion, a filter mounting portion and a lens mounting portion, and the filter mounting portion and the lens mounting portion are in turn
  • the covering section is upwardly molded and extended, and the inside is stepped to facilitate mounting the filter and the lens of the camera module.
  • the lens mounting section has a lens inner wall, and the inner wall surface of the lens is flat to be suitable for mounting a threadless Lens.
  • the lens mounting section of the photosensitive assembly has a lens inner wall, and the inner wall surface of the lens is threaded to be adapted to mount a threaded lens.
  • the photosensitive portion includes at least one connecting wire electrically connecting the photosensitive chip and the circuit board main body, and the encapsulating portion covers the connection Line so that the connecting line is not directly exposed to the outside.
  • the connecting line in the photosensitive member is selected from the group consisting of: a gold wire, a silver wire, a copper wire or an aluminum wire.
  • the connecting line of the photosensitive member is connected to the wiring board main body and the photosensitive chip in an arc shape.
  • the photosensitive chip includes a photosensitive area and a non-sensitive area, the non-sensitive area surrounds a periphery of the photosensitive area, and the package part is molded to extend to the The non-photosensitive area of the photosensitive chip is used to expand the inward moldable range of the package portion, and to reduce the peripheral size of the package portion.
  • the photosensitive portion includes at least one circuit component, the circuit component protrudes from the circuit board body, and the package portion covers the circuit component such that The circuit components are not directly exposed to the outside.
  • the circuit component in the photosensitive component selectively combines one or more of a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, and a relay.
  • the photosensitive portion includes a filter, the filter covers the photosensitive chip, and the package portion is formed on the circuit board body, The photosensitive chip and the filter are arranged to protect the photosensitive chip by the filter, and reduce a back focus of the camera module to reduce its height.
  • the photosensitive portion includes a reinforcing layer, and the reinforcing laminated layer is disposed at a bottom of the circuit board main body to enhance structural strength of the circuit board main body.
  • the reinforcing layer in the photosensitive member is a metal plate to enhance heat dissipation performance of the photosensitive portion.
  • the photosensitive portion includes a shielding layer, and the shielding layer wraps the circuit board main body and the encapsulating portion to enhance electromagnetic interference resistance of the photosensitive member.
  • the shielding layer in the photosensitive component is a metal plate or a metal mesh.
  • the circuit board main body has at least one reinforcing hole, and the encapsulation portion extends into the reinforcing hole to enhance the structural strength of the circuit board main body.
  • the reinforcing hole in the photosensitive member is in a groove shape.
  • the reinforcing hole in the photosensitive member is a through hole, so that a molding material of the encapsulating portion is in sufficient contact with the wiring board main body, and is easy to manufacture.
  • the material of the circuit board main body in the photosensitive assembly may be selected from a combination: a soft and hard bonding board, a ceramic substrate, a PCB hard board or an FPC.
  • the material of the encapsulation portion in the photosensitive member is selected from the group consisting of one or more of nylon, LCP, PP or resin.
  • Another aspect of the present invention provides a method of fabricating a photosensitive module of a camera module, comprising the steps of: packaging a package portion on a circuit board body and a photosensitive chip.
  • the method of manufacturing the photosensitive member includes the steps of: attaching the photosensitive chip to a circuit board body, and electrically connecting through at least one connecting line.
  • the method of manufacturing the photosensitive member includes the step of coating the connecting line by the encapsulation portion.
  • the method of fabricating the photosensitive member includes the steps of extending the package portion to a non-photosensitive region of the photosensitive chip.
  • the method of manufacturing the photosensitive member includes the steps of: forming a top end of the package portion Install a slot for easy installation of a filter, motor or lens.
  • the method of manufacturing the photosensitive member includes the steps of: extending the package portion upward, and forming a two-step stepped structure inside to facilitate mounting a filter or a lens.
  • the method of manufacturing the photosensitive member includes the steps of: providing a threaded structure on the inner wall of the package portion to facilitate mounting the threaded lens.
  • the method of manufacturing the photosensitive member includes the steps of: providing at least one groove-shaped reinforcing hole on the circuit board main body, and extending the encapsulating portion into the reinforcing hole.
  • the method of manufacturing the photosensitive member includes the steps of: providing at least one through hole-shaped reinforcing hole on the circuit board main body, and extending the encapsulating portion into the reinforcing hole.
  • the method for manufacturing a photosensitive member includes the steps of: attaching a reinforcing layer to the bottom layer of the circuit board main body to enhance the structural strength of the circuit board main body.
  • the method for manufacturing a photosensitive member includes the steps of: coating a shielding layer on the circuit board main body and the packaging portion to enhance electromagnetic interference resistance of the photosensitive member.
  • Another aspect of the present invention provides a photosensitive assembly of a camera module, comprising a package portion and a photosensitive portion; the photosensitive portion includes a circuit board body, a photosensitive chip and a filter, and the package portion is packaged and formed The circuit board main body, the photosensitive chip, and the filter.
  • the package portion in a photosensitive assembly of a camera module, has a lens mounting slot, and the lens mounting slot communicates with the through hole to facilitate providing a lens or a motor of the camera module.
  • Another aspect of the present invention provides a method of fabricating a photosensitive module of a camera module, comprising the steps of: packaging a package portion on a circuit board body, a light sensor chip, and a filter.
  • the method of manufacturing the photosensitive member includes the steps of attaching the photosensitive chip to a circuit board body and electrically connecting through at least one connecting wire.
  • the method of fabricating the photosensitive member includes the steps of: covering the filter on the photosensitive chip to protect the photosensitive chip.
  • the method of manufacturing the photosensitive member includes the step of coating the connecting line and the filter through the encapsulation portion.
  • the method of fabricating the photosensitive member includes the step of extending the package portion to the edge of the filter.
  • a camera module comprising: the photosensitive member; and a lens; the lens being located in a photosensitive path of the photosensitive chip of the photosensitive member.
  • the camera module includes a bracket, the bracket is mounted to the photosensitive component, and the lens is mounted to the bracket.
  • the camera module includes a motor, the lens is mounted to the motor, and the motor is mounted to the photosensitive assembly.
  • the camera module includes a filter, and the filter is mounted on the photosensitive component.
  • the camera module includes a filter, and the filter is mounted on the bracket.
  • FIG. 1 is a cross-sectional view of a camera module of a conventional COB process.
  • Figure 2 is a perspective view of a photosensitive member in accordance with a first preferred embodiment of the present invention.
  • Figure 3 is a cross-sectional view of a photosensitive member in accordance with a first preferred embodiment of the present invention.
  • Figure 4 is a schematic illustration of the manufacturing process of a photosensitive member in accordance with a first preferred embodiment of the present invention.
  • Figure 5 is a schematic view showing a method of manufacturing a photosensitive member in accordance with a first preferred embodiment of the present invention.
  • Figure 6 is a cross-sectional view of a camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 7 is an exploded view of a camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 8 is a cross-sectional view of another camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 9 is an exploded view of another camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 10A is a cross-sectional view of a photosensitive member in accordance with a second preferred embodiment of the present invention.
  • Figure 10B is a variant embodiment of a second preferred embodiment of the present invention.
  • Figure 11 is a cross-sectional view of a camera module in accordance with a second preferred embodiment of the present invention.
  • Figure 12 is a cross-sectional view of a photosensitive member in accordance with a third preferred embodiment of the present invention.
  • Figure 13 is a cross-sectional view of a camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 14 is a cross-sectional view showing another camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 15 is a cross-sectional view of a photosensitive member in accordance with a fourth preferred embodiment of the present invention.
  • Figure 16 is a schematic view showing a method of manufacturing a photosensitive member in accordance with a fourth preferred embodiment of the present invention.
  • Figure 17 is a cross-sectional view of a camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 18 is a cross-sectional view showing another camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 19A is a cross-sectional view of a photosensitive member in accordance with a fifth preferred embodiment of the present invention.
  • Figure 19B is a variant embodiment of a fifth preferred embodiment of the present invention.
  • Figure 20A is a cross-sectional view of a camera module in accordance with a fifth preferred embodiment of the present invention.
  • Figure 20B is a schematic view of a photosensitive member in accordance with a fifth preferred embodiment of the present invention.
  • Figure 21 is a cross-sectional view of a photosensitive member in accordance with a sixth preferred embodiment of the present invention.
  • Figure 22 is a cross-sectional view of a camera module in accordance with a sixth preferred embodiment of the present invention.
  • Figure 23 is a cross-sectional view of a photosensitive member in accordance with a seventh preferred embodiment of the present invention.
  • Figure 24 is an exploded view of a photosensitive member in accordance with a seventh preferred embodiment of the present invention.
  • Figure 25 is a cross-sectional view showing a photosensitive module of a module in accordance with an eighth preferred embodiment of the present invention.
  • Figure 26 is a cross-sectional view of a camera module in accordance with a ninth preferred embodiment of the present invention.
  • Figure 27 is a cross-sectional view of a camera module in accordance with a tenth preferred embodiment of the present invention.
  • Figure 28 is a schematic view of a photosensitive member in accordance with an eleventh preferred embodiment of the present invention.
  • Figure 29 is a schematic view of a photosensitive member in accordance with a twelfth preferred embodiment of the present invention.
  • Figure 30 is a modified embodiment of a photosensitive member in accordance with a twelfth preferred embodiment of the present invention.
  • Figure 31 is a schematic view of a photosensitive member in accordance with a thirteenth preferred embodiment of the present invention.
  • Figure 32A is a schematic view of a photosensitive member in accordance with a fourteenth preferred embodiment of the present invention.
  • Fig. 32B is a schematic view showing a modified embodiment of the fourteenth preferred embodiment of the wood hair UJJ.
  • Figure 33 is a schematic illustration of different array camera modules of the composition of the preferred embodiment of the present invention.
  • Figure 34 is a schematic illustration of another array of camera modules in accordance with the above-described preferred embodiment of the present invention.
  • Figure 35 is a schematic illustration of an application of a camera module in accordance with the above-described preferred embodiment of the present invention.
  • 36A and 36B are comparison diagrams of advantageous effects of the camera module according to the above preferred embodiment of the present invention.
  • Figure 37 is a perspective view of a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 38 is a cross-sectional view of a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 39 is a schematic view showing a manufacturing process of a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 40 is a schematic view showing a method of manufacturing a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • 41A, 41B and 41C are schematic views of different embodiments of a motor connecting structure of a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 42 is a cross-sectional view of a camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 43 is an exploded view of a camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 44 is a cross-sectional view showing another camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 45 is an exploded view of another camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 46 is a cross-sectional view of a photosensitive member in accordance with a seventeenth preferred embodiment of the present invention.
  • Figure 47 is a cross-sectional view of a camera module in accordance with a seventeenth preferred embodiment of the present invention.
  • Figure 48 is a cross-sectional view of a photosensitive member in accordance with an eighteenth preferred embodiment of the present invention.
  • Figure 49 is a cross-sectional view of a camera module in accordance with an eighteenth preferred embodiment of the present invention.
  • Figure 50 is a cross-sectional view showing another camera module in accordance with an eighteenth preferred embodiment of the present invention.
  • Figure 51 is a cross-sectional view showing a photosensitive member in accordance with a nineteenth preferred embodiment of the present invention.
  • Figure 52 is a schematic view showing a manufacturing method of a photosensitive member in accordance with a nineteenth preferred embodiment of the present invention.
  • Figure 53 is a cross-sectional view of a camera module in accordance with a nineteenth preferred embodiment of the present invention.
  • Figure 54 is a cross-sectional view showing another camera module in accordance with a nineteenth preferred embodiment of the present invention.
  • Figure 55 is a cross-sectional view of a photosensitive member in accordance with a twentieth preferred embodiment of the present invention.
  • Figure 56 is an exploded view of a photosensitive member in accordance with a twentieth preferred embodiment of the present invention.
  • Figure 57 is a cross-sectional view showing a photosensitive member of a module in accordance with a twenty-first preferred embodiment of the present invention.
  • Figure 58 is a cross-sectional view of a camera module in accordance with a twenty-first preferred embodiment of the present invention.
  • Figure 59 is a cross-sectional view of a camera module in accordance with a twenty-second preferred embodiment of the present invention.
  • Figure 60 is a side cross-sectional view of a preferred embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 61 is a side cross-sectional view showing another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 62A is a schematic view of a molded image forming module formed by a comparative technique.
  • Figure 62B is a schematic view of a conventional molded image forming module in the comparative art.
  • Figure 62C is a schematic view of a conventional molded image forming module in the comparative art.
  • Figure 62D is a schematic view of a conventional molded image forming module in the comparative art.
  • Figure 62E is a schematic view of a conventional molded image forming module in the comparative art.
  • 63A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 63B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 64 is a side cross-sectional view showing another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 65 is a side cross-sectional view showing another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 66A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 66B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 67A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 67B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 68A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • 68B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process in accordance with the present invention.
  • Figure 69 is a side cross-sectional view showing the motor and circuit board conduction mode of the above embodiment of the camera module based on the integrated package process according to the present invention.
  • Figure 70 is a side cross-sectional view showing another conductive mode of the motor and the circuit board of the above embodiment of the camera module based on the integrated package process according to the present invention.
  • Figure 71 is a side cross-sectional view showing another conduction mode of the motor and the wiring board of the above embodiment of the camera module based on the integrated package process according to the present invention.
  • Figure 72 is a schematic diagram showing the internal structure of the camera module according to a preferred embodiment of the present invention, taken along the intermediate position.
  • Figure 73 is a perspective view showing the structural relationship between a circuit board, a photosensitive chip and a protective frame of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74A is a cross-sectional view showing the first step of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74B is a cross-sectional view showing the second step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74C is a cross-sectional view showing the third step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74D is a cross-sectional view showing the fourth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74E is a cross-sectional view showing the fifth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 74F is a cross-sectional view showing the sixth step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention. Figure.
  • Figure 75A is a cross-sectional view showing a modified embodiment of the third step of the above-described manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 75B is a cross-sectional view showing a modified embodiment of the fourth step of the above manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 76 is a cross-sectional view showing another modified embodiment of the fourth step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 77A is a cross-sectional view showing the first step of another manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • 77B is a cross-sectional view showing the second step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 77C is a cross-sectional view showing the third step of the above manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 77D is a cross-sectional view showing the fourth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 77E is a cross-sectional view showing the fifth step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 77F is a cross-sectional view showing the sixth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 77G is a cross-sectional view showing the seventh step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • FIG. 78 is a schematic diagram showing the internal structure of the camera module according to another preferred embodiment of the present invention, which is cut along the intermediate position.
  • 79 is a perspective view showing the structural relationship between a circuit board, a photosensitive chip, a filter element, and a protective frame of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80A is a cross-sectional view showing the first step of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80B is a cross-sectional view showing the second step of the manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80C is a cross-sectional view showing the third step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80D is a cross-sectional view showing the fourth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80E is a cross-sectional view showing the fifth step of the above manufacturing process of the camera module according to the above preferred embodiment of the present invention.
  • Figure 80F is a cross-sectional view showing the sixth step of the above manufacturing process of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 80G is a cross-sectional view showing the camera module of the above preferred embodiment of the invention.
  • 81A, 81B, and 81C are chips and wiring boards assembled by a conventional D/A process.
  • Figure 82 is a schematic cross-sectional view of a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 83 is a schematic illustration of a first manufacturing process of a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 84 is a block diagram showing a first manufacturing method of a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 85 is a schematic illustration of a second manufacturing process of a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 86 is a block diagram showing a second method of fabricating a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 87A is a schematic illustration of a third manufacturing process of a photosensitive member in accordance with a preferred embodiment of the present invention.
  • Figure 87B is a schematic illustration of a fourth manufacturing process of a photosensitive assembly in accordance with a preferred embodiment of the present invention.
  • Figure 88 is a block diagram of a third method of fabricating a photosensitive assembly in accordance with a preferred embodiment of the present invention.
  • Figure 89 is a cross-sectional view of a camera module to which the photosensitive member is applied, in accordance with a preferred embodiment of the present invention.
  • Figure 90 is a cross-sectional view of a photosensitive member in accordance with another preferred embodiment of the present invention.
  • Figure 91 is a cross-sectional view showing a camera module to which the photosensitive member is applied, in accordance with another preferred embodiment of the present invention.
  • the photosensitive assembly 1010 is used to assemble and manufacture the camera module.
  • the photosensitive member 1010 includes a package portion 1011 and a photosensitive portion 1012.
  • the package portion 1011 is integrally connected to the photosensitive portion 1012, such as moldedly connected to the photosensitive portion 1012.
  • the photosensitive portion 1012 includes a circuit board main body 10122 and a photosensitive chip 10121.
  • the photosensitive chip 10121 is disposed on the circuit board main body 10122.
  • the photosensitive chip 10121 is moldedly connected to the wiring board main body 10122.
  • the package portion 1011 is molded to the photosensitive portion 1012 by molding on a chip (MOC).
  • the package portion 1011 at least partially integrally encapsulates the circuit board main body 10122 and the photosensitive chip 10121.
  • the photosensitive portion 1012 includes a connection line and at least one circuit component 10123.
  • the connection line is preset to the circuit board main body 10122, and the circuit component 10123 is electrically connected to the connection line and the photosensitive chip 10121 for the photosensitive operation process of the photosensitive chip 10121.
  • the circuit component 10123 is convexly disposed on the wiring board main body 10122.
  • the circuit component 10123 can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011 encloses the circuit component 10123 inside thereof, thus making the circuit component 10123 not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 10121 is in communication, when the camera module is assembled, the circuit component 10123 is not contaminated with dust or the like, and does not affect the sensor chip 10121, which is different from the circuit in the conventional camera module.
  • the device is exposed to exist in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123 by means of molding, avoiding contamination of the sensor chip 10121 and causing black spots on the camera module. unpleasant sight.
  • the encapsulation portion 1011 is integrally formed on the circuit board main body 10122 and the photosensitive chip 10121 brings many advantages. For example, but not limited to, first, the encapsulation portion 1011 is integrally molded on the circuit board. The main body 10122 and the photosensitive chip 10121, so that the bracket 3P in the conventional COB module does not need to be adhered to the circuit board 1P, which saves the glue space, and does not need to perform AA adjustment on the package portion 1011; Secondly, the encapsulation portion 1011 is integrally molded on the circuit board main body 10122 and the photosensitive chip 10121, so that the surface of the encapsulation portion 1011 is better in planarity, which is superior to the conventional injection molding.
  • the package portion 1011 is integrally molded in the circuit board main body 10122 and the photosensitive chip 10121, so that the moldable or configurable area of the package portion 1011 is expanded inward, thereby The overall size of the camera module is compressed inwardly to further provide a possible range of size reduction of the camera module.
  • the package portion 1011 is integrally molded in the circuit board body 10122 and The photosensitive chip 10121 is configured such that the photosensitive chip 10121 is more stably fixed to the circuit board main body 10122 by the encapsulating portion 1011, thereby increasing the service life of the imaging module.
  • the encapsulating portion 1011 Molded integrally formed on the wiring board main body 10122 and the photosensitive chip 10121, the encapsulation portion 1011 is enlarged
  • the connection area of the photosensitive portion 1012 as a whole is such that the connection portion 1011 is more stably connected.
  • the package portion 1011 is integrally molded into the circuit board main body 10122 and the photosensitive chip 10121 in a molded manner.
  • the interconnecting area of the encapsulating portion 1011 and the photosensitive portion 1012 is large, so that the structural strength of the photosensitive portion 1012 is enhanced by the encapsulating portion 1011.
  • the encapsulating portion 1011 is integrally molded in the molding.
  • circuit board main body 10122 and the photosensitive chip 10121 enables the photosensitive member 1010 to be applied to manufacture a multi-lens, high-pixel camera module, so that the molding and packaging process can be applied to actual production, and is suitable for existing ones.
  • the manner in which the encapsulation portion 1011 is integrally molded in the circuit board main body 10122 can flexibly control the height and width of the encapsulation portion 1011, thereby flexibly controlling the The back focal length of the camera module, and the modules forming different volumes to adapt to different types of camera modules; ninth, the molded part 1011 is molded Formed on the circuit board main body 10122, the connection medium is not required to be glued, and is closely connected to the circuit board main body to enhance the structural strength of the circuit board main body 10122, so that the thickness of the circuit board main body 10122 can be further reduced. small.
  • the camera module as a small size product has a small component size, so any small difference may have a greater impact on the camera module, so even these changes, even The macro concept is small, but it is extremely important for the actual production process of the camera module, and even affects whether a concept can be put into the actual production process.
  • the camera module as a whole is composed of many components, such as a sensor chip, a lens, a motor, etc., which are adapted to each other. That is to say, the development of each component is not independent, but related, such as the improvement of the pixel, related to the sensor chip, and also related to the lens, and the lens needs installation conditions, related to the support member. In this actual state of production development, the performance of the early photosensitive chip is lower, and the number of lenses of the lens is also reduced. For example, there may be only one piece or two pieces, so the requirements for the bracket are correspondingly low, and the flatness and the electronic device are required. The exposure and size of the camera are not the main considerations for the overall impact of the camera module.
  • the camera module corresponding to the rapid development stage of the smart phone has continuously improved its requirements on various aspects such as pixel, size and precision, such as the number of lenses reaching 4, 5, 6 and 7 pieces.
  • the development of the camera module is more and more detailed.
  • the manner in which the package portion 1011 of the present invention integrally encapsulates the circuit board main body 10122 and the photosensitive chip 10121 may be configured for a lens of one or two lenses.
  • the camera module does not need to be improved, or the improvement does not show its advantages, but for the lens structure with more lenses
  • the camera module this improvement has become the development trend of improvement suitable, it may be apparent advantage, and therefore more suitable for investment in the actual production process.
  • an important factor in the actual production process is the product yield, that is to say the stability of the overall performance of the product during mass production, and the camera module of the embodiment of the invention is relatively traditional COB.
  • the camera module of the structure has a significantly improved product yield, so even with the same size camera module, the camera module of the invention has the advantages, is suitable for mass production, reduces production cost, and is suitable for the entire camera mode.
  • the development area of the group industry Of course, the manner in which the package portion 1011 integrally encapsulates the circuit board main body 10122 and the photosensitive chip 10121 has other advantages, and will not be enumerated here.
  • the circuit component 10123 is protruded from the circuit board main body 10122 as an example, and in other embodiments of the present invention, the circuit component 10123 The circuit board main body 10122 may be embedded in the circuit board main body 10122 without being protruded from the circuit board main body 10122 or mounted on the back surface of the circuit board main body 10122. It is understood by those skilled in the art that the circuit component The shape, type, and location of the 10123 are not a limitation of the present invention.
  • the encapsulation portion 1011 defines a through hole 101100 to provide a photosensitive path for the photosensitive chip 10121.
  • the encapsulation portion 1011 provides a light window to provide a light path for the photosensitive chip 10121, so that light passing through the lens 1030 (subsequently proposed) located above the package portion 1011 can reach the light sensitivity.
  • the chip 10121 is not blocked by the package portion 1011.
  • the photosensitive portion 1012 includes at least one connecting wire 10124 for electrically connecting the photosensitive chip 10121 and the wiring board main body 10122.
  • the connecting line 10124 can be implemented as, but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wires 10124 are connected in an arc shape The photosensitive chip 10121 and the circuit board main body 10122.
  • the connecting wire 10124 is molded inside the encapsulating portion 1011, so that the connecting wire 10124 can be covered by the encapsulating portion 1011 without being directly exposed to the outside, thereby When the camera module is assembled, the connecting wire 10124 is not subjected to any contact damage, and the influence of environmental factors on the connecting wire 10124, such as temperature, is caused, such that the photosensitive chip 10121 and the circuit board are reduced.
  • the communication connection between the main bodies 10122 is stable, which is completely different from the prior art.
  • the bottom of the through hole 101100 of the encapsulation portion 1011 is inclined from the bottom to the top, but the shape is not to be construed as limiting the present invention.
  • the encapsulation portion 1011 has an inner side surface 101200, and the inner side surface 101200 surrounds the through hole 101100.
  • the inner side surface 101200 is obliquely disposed such that the through hole 101100 is inclined from gradually increasing from bottom to top.
  • the inner side surface 101200 has an inclination angle ⁇ , that is, an angle between an oblique direction of the inner side surface 10200 and a vertical direction.
  • the encapsulation portion 1011 is integrally formed by a molding die (subsequently proposed), and after the encapsulation portion 1011 is molded, the molding die needs to be separated from the photosensitive member 1010, that is, the demolding process.
  • the molding die Due to the interaction force between the molding die and the encapsulation portion 1011, such as pressing force, friction force, etc., the molding die is difficult to be pulled out on the one hand during the drawing process, on the other hand Affecting the shape of the package portion 1011, burrs, and even more serious phenomena, which seriously plague the actual production, so that the product yield is extremely low, and in the present invention, the package portion 1011 is obliquely disposed, so that As long as the molding die is displaced from the encapsulation portion 1011, a gap is formed between the encapsulation portion 1011 and the molding die, thereby reducing the influence of the molding die on the encapsulation portion 1011, so that the imaging device Modules can be put into practical mass production applications. It is worth noting that the improvement of these smaller design points needs to be obtained through a long experimental process, and some of the determinants between whether a theoretically feasible solution can be put into production may be these imperceptible. Small improvements.
  • the magnitude of the tilt angle ⁇ can be designed according to actual needs.
  • the arrangement of the inner side surface 101200 of the encapsulation portion 1011 and the inclined structure of the inner side surface 10200 have many advantages, such as, but not limited to, first, the inner side surface 101200 is obliquely disposed to be suitable for actual production.
  • the arrangement of the inner side surface 101200 increases the direct contact area of the air enclosed by the lens, and The influence of the characteristics of the integrally formed material of the encapsulation portion 1011, so that the fine dust in the inner space is more likely to stay on the inner side surface 101200 of the encapsulation portion 1011, that is, to have the function of capturing fine dust;
  • the inclined arrangement of the inner side surface 101200 changes the reflection angle of the incoming light on the inner side surface 101200, reduces the reflection of stray light to the photosensitive area of the photosensitive chip 10121, and reduces the influence of stray light on the image quality.
  • the The inner side surface 101200 is obliquely disposed, and the upper port of the package portion 1011 is increased to increase the amount of light entering the photosensitive chip 10121.
  • An object of the present invention is to provide a camera module, a photosensitive member thereof, and a manufacturing method thereof, wherein the camera module is suitable for being applied to an actual production process, improving product mass production yield and reducing production cost.
  • the encapsulation portion 1011 encloses the circuit component 10123 and the connection line 10124, and has a camera module for protecting the circuit component 10123 and the connection line 10124 and obtaining better performance.
  • the package portion 1011 is not limited to encasing the circuit component 10123 or the connection line 10124. That is, in other embodiments of the present invention, the package portion 1011 may be directly molded to the circuit board main body 10122 of the circuit component 10123 that is not protruded, or may be molded on the circuit component. 10123 outside, around and other different locations.
  • the photosensitive chip 10121 has a photosensitive area 101211 and a non-sensitive area 101212, and the non-sensitive area 101212 surrounds the periphery of the photosensitive area 101211.
  • the photosensitive region 101211 is used for photoreceptive action, and the connecting line 10124 is connected to the non-photosensitive region 101212.
  • the encapsulation portion 1011 extends from the non-photosensitive region 101212 of the photosensitive chip 10121, thereby laminating the photosensitive chip 10121 to the main body of the circuit board by molding. 10122.
  • the package is expanded, such as by Molding on Chip (MOC).
  • MOC Molding on Chip
  • the encapsulation portion 1011 is convexly surrounding the outside of the photosensitive region 101211 of the photosensitive chip 10121.
  • the encapsulation portion 1011 is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010 is used to assemble the camera module, the photosensitive chip 10121 is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122, and the photosensitive chip 10121 is disposed on the circuit board main body 10122, and the photosensitive chip 10121 is passed.
  • the connecting wires 10124 are electrically connected, and then molded on the printed circuit board main body 10122 and the photosensitive chip 10121 components after preliminary assembly, such as forming the encapsulating portion 1011 by a molding process commonly used in a semiconductor package, or
  • the circuit board main body 10122 may be selected to mold the circuit board after performing an SMT process (Surface Mount Technology surface mount process) by an injection molding machine to form the package portion 1011.
  • SMT process Surface Mount Technology surface mount process
  • the circuit board body 10122 can be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011 may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the photosensitive member 1010 is more suitable for the imposition operation, and a large amount of the photosensitive member 1010 is manufactured at a time, for example, up to 90
  • the traditional injection molding department that is, the mirror holder, needs to be painted with glue first, and generally only one can be placed at a time. In the injection molding process, 4-8 pieces are generally produced at one time, and at most 32 pieces can be produced.
  • the encapsulation portion 1011 encloses the circuit component 10123 and the connection line 10124 brings many advantages. For example, but not limited to, first, the encapsulation portion 1011 encloses the circuit component 10123 and the connection. The line 10124 is therefore not required to reserve an additional safety space for the circuit component 10123 and the connecting line 10124, and the possibility of the camera module being reduced in size is provided. Second, the encapsulating portion 1011 covers the The circuit component 10123 and the connecting wire 10124 enable the circuit component 10123 and the connecting wire 10124 to be stably fixed inside, avoid unnecessary influence such as contact during assembly, and reduce the use process of the camera module.
  • the encapsulation portion 1011 encloses the circuit component 10123 and the connecting line 10124 such that the circuit component 10123 and the connecting wire 10124 and other components and Separating from each other, reducing external and mutual electromagnetic influences, making its operation more stable; fourth, the encapsulation portion 1011 encloses the circuit component 10123 and the connection 10124, so that the circuit component 10123 and the connecting wire 10124 are not directly exposed to the inner space of the lens, thereby preventing the dust of the dust on the circuit component 10123 and the connecting wire 10124 from entering the inner space.
  • the imaging quality is affected, and the circuit element 10123 and the connecting line 10124 are prevented from reflecting the stray light to the imaging chip 10121 to affect the imaging quality.
  • the encapsulating portion 1011 covers the connecting gold wire, so that the The integrally molded region of the encapsulation portion 1011 extends inwardly to the non-photosensitive region of the photosensitive chip 10121.
  • the encapsulation portion 1011 includes a cladding portion 10111 and a filter mounting portion 10112.
  • the filter mounting portion 10112 is integrally molded and integrally connected to the cladding portion 10111.
  • the cladding portion 10111 is molded. Plastically connected to the circuit board body 10122 for covering the circuit component 10123 and the connecting line 10124.
  • the filter mounting section 10112 is configured to mount a filter 1020, that is, when the photosensitive component 1010 is used to assemble the camera module, the filter 1020 of the camera module.
  • the filter mounting section 10112 is mounted such that the filter 1020 is positioned on the photosensitive path of the photosensitive chip 10121 without the need to provide an additional filter mounting bracket.
  • the encapsulation portion 1011 has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 10112 can be made to have good flatness by means of a mold-forming process. So that the filter 1020 It is installed flat, which is also superior to the traditional camera module.
  • the filter 1020 is an infrared cut filter IRCF.
  • the filter mounting section 10112 has a mounting slot 101121, and the mounting slot 101211 communicates with the through hole 101100 to provide sufficient installation space for the filter 1020, so that the filter 1020 It does not protrude from the top surface 101122 of the filter mounting section 10112. That is, the mounting groove 101121 is disposed at the upper end of the encapsulation portion 1011, so that the filter 1020 can be installed therein.
  • the mounting slot 101121 can be used to mount a filter, and in other implementations of the invention, the mounting slot 101121 can be used to mount the camera module.
  • the components of the motor or lens, etc. it will be understood by those skilled in the art that the use of the mounting slot 101121 is not a limitation of the present invention.
  • the inner wall of the encapsulating portion 1011 may be disposed according to the shape of the connecting line 10124, such as being inclined, so that the photosensitive chip 10121 can be received while covering the connecting line 10124. More light. It will be understood by those skilled in the art that the shape of the package portion 1011 is not a limitation of the present invention.
  • the camera module can be a Fix Focus Model (FFM).
  • the camera module 10100 includes a photosensitive component 1010, a filter 1020, and a lens 1030.
  • the filter 1020 is mounted to the photosensitive member 1010, and the lens 1030 is mounted on the photosensitive member 1010.
  • the filter 1020 is mounted to the mounting groove 101121 of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive member 1010.
  • the lens 1030 is mounted on top of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive member 1010. That is, the filter 1020 is mounted to the mounting groove, and the lens 1030 is mounted on the top end of the package portion 1011.
  • the lens 1030 is mounted on the top of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive component 1010, so that the encapsulation portion 1011 is equivalent to that in a conventional camera module.
  • the function of the bracket provides support and fixed position for the lens 1030, but the assembly is different from the conventional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 1011 is fixed to the circuit board main body 10122 by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the invention has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the encapsulation portion 1011 and the circuit board main body 10122, thereby reducing the conventional camera module AA.
  • Adjusted reserved space, and under the condition of achieving structural strength, the thickness of the circuit board main body 10122 in the molding scheme of the present invention can be smaller, when the filter is directly attached to the molding surface, after the lens The focus can be shorter, such that the thickness of the camera module is reduced; on the other hand, the package portion 1011 encloses the circuit component 10123 and the connecting wire 10124 such that the conventional bracket function and circuit component 10123 and the
  • the connection lines 10124 can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, thereby making the package portion 1011 having a bracket function high.
  • the degree can be set in a smaller range, thereby further providing a space in which the thickness of the camera module can be reduced.
  • the encapsulation portion 1011 replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
  • the encapsulation portion 1011 covers the connection line 10124, and the encapsulation portion 1011 extends to the non-photosensitive region 101212 of the photosensitive chip 10121, so that the encapsulation portion 1011 can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the camera module 10100 can be an automatic focus model (Automatic Focus Model, AFM).
  • the camera module includes a photosensitive component 1010, a filter 1020, a motor 1040, and a lens 1030.
  • the filter 1020 is mounted to the photosensitive member 1010, the lens 1030 is mounted to the motor 1040, and the motor 1040 is mounted on the photosensitive assembly 1010.
  • the filter 1020 is mounted to the mounting groove 101121 of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive member 1010.
  • the motor 1040 is mounted on the top end of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive assembly 1010. That is, the filter 1020 is mounted to the seal
  • the mounting groove of the mounting portion 1011 is attached to the motor 1040, and the motor 1040 is attached to the top end of the package portion 1011.
  • solder wires may be unnecessary to connect the motor 1040 and the circuit board main body 10122 of the photosensitive portion 1012, thereby reducing Motor welding process.
  • the motor 1040 is mounted to the package portion 1011, that is, the motor 1040 is supported at the top end of the package portion 1011. Since the encapsulation portion 1011 is integrally formed on the circuit board main body 10122 by a mold, the motor 1040 can be provided with a flat mounting plane, that is, the flat top surface 101122 is provided, which is convenient in the assembly. In the case of the camera module, the motor 1040 is AA-adjusted so that the camera module can easily meet the requirements of the optical axis.
  • a camera module photosensitive assembly 1010A and a camera module 10100A are provided in accordance with a second preferred embodiment of the present invention.
  • the photosensitive module 1010A is used to assemble and manufacture the camera module 10100A, thereby obtaining a molded camera module.
  • the photosensitive member 1010A includes a package portion 1011A and a photosensitive portion 1012A, and the package portion 1011A is moldedly coupled to the photosensitive portion 1012A.
  • the photosensitive portion 1012A includes a wiring board main body 10122A and a photosensitive chip 10121A, and the photosensitive chip 10121A is disposed on the wiring board main body 10122A. According to this embodiment of the invention, the photosensitive chip 10121A is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012A includes a connection line and at least one circuit component 10123A.
  • the connection line is preset to the circuit board body 10122A, and the circuit component 10123A is electrically connected to the connection line and the photosensitive chip 10121A for the photosensitive operation process of the photosensitive chip 10121A.
  • the circuit component 10123A is convexly disposed on the circuit board main body 10122A.
  • the circuit component 10123A can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011A encapsulates the circuit component 10123A inside thereof, thus making the circuit component 10123A not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 10121A communicates, when the camera module is assembled, the circuit component 10123A is not contaminated with dust or the like, and does not affect the sensor chip 10121A, unlike the circuit in the conventional camera module.
  • the component 10123A is exposed to exist in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123A by molding and covering, thereby avoiding contamination of the sensor chip 10121A and causing blackout of the camera module. And other undesirable phenomena.
  • the encapsulation portion 1011A defines a through hole 101100A to facilitate providing a photosensitive path for the photosensitive chip 10121A.
  • the photosensitive portion 1012A includes at least one connecting wire 10124A for electrically connecting the photosensitive chip 10121A and the wiring board main body 10122A.
  • the connection line 10124A may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124A connects the photosensitive chip 10121A and the wiring board main body 10122A in an arc shape.
  • the connecting wire 10124A is molded inside the encapsulating portion 1011A, so that the connecting wire 10124A can be coated by the encapsulating portion 1011A without being directly exposed to the outside, thereby assembling
  • the connection line 10124A is not subjected to any touch damage, and the influence of environmental factors on the connection line 10124A, such as temperature, is caused, such that the photosensitive chip 10121A and the circuit board are reduced.
  • the communication connection between the main bodies 10122A is stable, which is completely different from the prior art.
  • the encapsulation portion 1011A encloses the circuit component 10123A and the connection line 10124A, and has the aspects of protecting the circuit component 10123A and the connection line 10124A and obtaining a camera module with better performance.
  • the package portion 1011A is not limited to cladding the circuit component 10123A or the connection line 10124A. That is, in other embodiments of the present invention, the package portion 1011A may be directly molded to the circuit board main body 10122A of the circuit component 10123A having no protrusion, or may be molded to the circuit component. 10123A outside, around and other different locations.
  • the circuit board main body 10122A has an inner groove 101222A, and the photosensitive chip 10121A is disposed in the inner groove 101222A, so that the photosensitive chip 10121A and the circuit board
  • the relative height of the main body 10122A is lowered, so that when the encapsulating portion 1011A covers the photosensitive chip 10121A, the height requirement of the encapsulating portion 1011A is reduced, thereby reducing the height of the imaging module assembled by the photosensitive assembly 1010A.
  • the photosensitive chip 10121A has a photosensitive area 101211A and a non-sensitive area 101212A, and the non-sensitive area 101212A surrounds the periphery of the photosensitive area 101211A.
  • the photosensitive region 101211A is used for photoreceptive action, and the connecting line 10124A is connected to the non-photosensitive region 101212A.
  • the encapsulation portion 1011A extends over the non-photosensitive region 101212A of the photosensitive chip 10121A, thereby laminating the photosensitive chip 10121A to the circuit board main body by molding. 10122A.
  • the molding on chip (MOC) enlarges the inward moldable range of the package portion 1011A, so that the circuit board main body 10122A and the package portion 1011A can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the photosensitive member 1012A and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011A is convexly surrounding the outside of the photosensitive region 101211A of the photosensitive chip 10121A, and in particular, the encapsulation portion 1011A is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010A is used to assemble the camera module, the photosensitive chip 10121A is sealed inside to form a closed inner space.
  • the encapsulation portion 1011A includes a cladding portion 10111A and a filter mounting portion 10112A, and the filter mounting portion 10112A is integrally molded and integrally connected to the cladding portion 10111A, and the cladding portion 10111A is molded.
  • the filter mounting section 10112A is used to mount a filter 1020A, that is, when the photosensitive component 1010A is used to assemble the camera module, the filter 1020A of the camera module is installed.
  • the filter mounting section 10112A is such that the filter 1020A is located on the photosensitive path of the photosensitive chip 10121A, and there is no need to provide an additional filter 1020A mounting bracket. That is to say, the encapsulation portion 1011A has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 10112A can be made to have good flatness by means of a mold-forming process. Therefore, the filter 1020A is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 10112A has a mounting slot 101121A, and the mounting slot 101121A communicates with the through hole 101100A to provide sufficient installation space for the filter 1020A, so that the filter 1020A It does not protrude from the top surface 101122A of the filter mounting section 10112A. That is, the mounting groove 101121A is disposed at the upper end of the encapsulating portion 1011A, so that the filter 1020A is stably mounted on the encapsulating portion 1011A without protruding from the top end of the encapsulating portion 1011A.
  • the inner wall of the encapsulation portion 1011A may be disposed according to the shape of the connection line, such as being inclined, so that the photosensitive chip 10121A can be received while covering the connection line 10124A. More light. It will be understood by those skilled in the art that the shape of the package portion 1011A is not a limitation of the present invention.
  • the wiring board main body 10122A of the photosensitive member 1010A has a counter sinking hole 101222A, and the photosensitive chip 10121A is sunkenly disposed on the The hole 101222A is sunken so that the relative height of the photosensitive chip 10121A and the wiring board main body 10122A is lowered, so that when the encapsulating portion 1011A covers the photosensitive chip 10121A, the height of the encapsulating portion 1011A is reduced. It is required to reduce the height of the camera module assembled by the photosensitive unit 1010A.
  • the sinker hole 101222A is a through hole structure that communicates with the space on both sides of the circuit board main body, thereby increasing the sinkable range of the photosensitive chip 10121A.
  • the height relative position of the photosensitive chip 10121A and the circuit board main body 10122A may be selected according to requirements, for example, the top surface height of the photosensitive chip 10121A and the circuit board main body 10122A are the same, the photosensitive chip 10121A and the circuit board
  • the height of the bottom surface of the main body 10122A is uniform, and the heights of the top surface and the bottom surface of the photosensitive chip 10121A and the wiring board main body 10122A are not uniform.
  • One end of the connecting wire 10124A is connected to the photosensitive chip 10121A, and the other end is connected to the circuit board main body 10122A, that is, a peripheral area of the sinking hole 101222A, so that more areas of the sinking hole 101222A are used for setting
  • the photosensitive chip 10121A is adapted to accommodate the photosensitive chip 10121A having a larger area or to reduce the area of the area of the sinker hole 101222A.
  • a camera module 10100A in accordance with a second preferred embodiment of the present invention.
  • the camera module can be a certain focus module.
  • the camera module includes a photosensitive component 1010A, a filter 1020A, and a lens 1030A.
  • the filter 1020A is mounted to the photosensitive member 1010A, and the lens 1030A is mounted on the photosensitive member 1010A.
  • the filter 1020A is mounted to the mounting groove 1111A of the filter mounting section 10111A of the package portion 1011A of the photosensitive member 1010A.
  • the lens 1030A is mounted on the top end of the filter mounting section 10111A of the encapsulation portion 1011A of the photosensitive member 1010A.
  • the filter 1020A is mounted to the mounting 1111A of the package portion 1011A
  • the lens 1030A is mounted to the top end of the package portion 1011A.
  • the photosensitive component 1010A can also be assembled into a dynamic focus camera module. It should be understood by those skilled in the art that the fixed focus camera module is merely illustrative of the present invention and is not a limitation of the present invention.
  • a photosensitive member 1010B and a camera module 10100B according to a third preferred embodiment of the present invention.
  • the photosensitive module 1010B is used for assembling and manufacturing the camera module, thereby obtaining a molded camera module.
  • the photosensitive member 1010B includes a package portion 1011B and a photosensitive portion 1012B, and the package portion 1011B is moldedly connected to the photosensitive portion 1012B.
  • the photosensitive portion 1012B includes a wiring board main body 10122B and a photosensitive chip 10121B, and the photosensitive chip 10121B is disposed on the wiring board main body 10122B. According to this embodiment of the invention, the photosensitive chip 10121B is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012B includes a connection line and at least one circuit component 10123B.
  • the connection line is preset to the circuit board main body 10122B, and the circuit component 10123B is electrically connected to the connection line and the photosensitive chip 10121B for the photosensitive operation process of the photosensitive chip 10121B.
  • the circuit component 10123B is convexly disposed on the circuit board main body 10122B.
  • the circuit component 10123B can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011B encapsulates the circuit component 10123B inside thereof, thus making the circuit component 10123B not directly exposed to the space, more specifically, not exposed to the In the environment in which the photosensitive chip 10121B communicates, when the camera module is assembled, the circuit component 10123B is not contaminated with dust or the like, and does not affect the photosensitive chip 10121B, which is different from the conventional camera module.
  • the circuit element 10123B is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123B by molding and covering, thereby avoiding contamination of the photosensitive chip 10121B and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 1011B defines a through hole 101100B to facilitate providing a photosensitive path for the photosensitive chip 10121B.
  • the photosensitive portion 1012B includes at least one connecting wire 10124B for electrically connecting the photosensitive chip 10121B and the wiring board main body 10122B.
  • the connection line 10124B may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124B connects the photosensitive chip 10121B and the wiring board main body 10122B in an arc shape.
  • the connecting wire 10124B is molded inside the encapsulation portion 1011B, so that the connecting wire 10124B can be covered by the encapsulation portion 1011B without being directly exposed to the outside, thereby assembling
  • the connection line 10124B is not subjected to any touch damage, and the influence of environmental factors on the connection line 10124B, such as temperature, is caused, such that the photosensitive chip 10121B and the circuit board are reduced.
  • the communication connection between the main bodies 10122B is stable, which is not provided at all in the prior art.
  • the encapsulation portion 1011B covers the circuit component 10123B and the connection line 10124B, There is an advantage in protecting the circuit component 10123B and the connecting wire 10124B and the camera module thereof to obtain better performance, but those skilled in the art should understand that the package portion 1011B is not limited to the cladding. Circuit element 10123B or the connection line 10124B. That is, in other embodiments of the present invention, the package portion 1011B may be directly molded to the circuit board main body 10122B without the protruding circuit component 10123B, or may be molded on the circuit component. 10123B outside, around and other different positions.
  • the photosensitive chip 10121B has a photosensitive area 101211B and a non-sensitive area 101212B, and the non-sensitive area 101212B surrounds the periphery of the photosensitive area 101211B.
  • the photosensitive region 101211B is used for photoreceptive action, and the connecting line 10124B is connected to the non-photosensitive region 101212B.
  • the encapsulation portion 1011B extends over the non-photosensitive region 101212B of the photosensitive chip 10121B, thereby laminating the photosensitive chip 10121B to the circuit board main body by molding. 10122B.
  • the molding on chip (MOC) enlarges the inward moldable range of the package portion 1011B, so that the circuit board main body 10122B and the package portion 1011B can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the molded photosensitive portion 1012B and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011B is convexly surrounding the outside of the photosensitive region 101211B of the photosensitive chip 10121B, and in particular, the encapsulation portion 1011B is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010B is used to assemble the camera module, the photosensitive chip 10121B is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122B, and the photosensitive chip 10121B is disposed on the circuit board main body 10122B, and the photosensitive chip 10121B is passed.
  • the connecting wires 10124B are electrically connected, and then molded on the components of the circuit board main body 10122B and the photosensitive chip 10121B after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 1011B, or the package portion 1011B is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122B may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011B is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011B may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the top surface of the encapsulation portion 1011B is flat, and is suitable for mounting a filter 1020B, that is, when the photosensitive member 1010B is used to assemble the camera module, the filter of the camera module.
  • the 1020B is mounted on the top end surface of the package portion 1011B such that the filter 1020B is located on the photosensitive path of the photosensitive chip 10121B, and it is not necessary to provide an additional filter 1020B mounting bracket.
  • the encapsulation portion 1011B has the function of a conventional bracket here, but based on the advantage of the molding process, the mold top 1011B can be made to have good flatness by means of a mold-forming process, thereby The filter 1020B is mounted flat, which is also superior to the conventional camera module.
  • the photosensitive portion 1012B of the photosensitive member 1010B includes a reinforcing layer 10125B, and the reinforcing layer 10125B is laminatedly connected to the wiring board main body.
  • the bottom layer of 10122B is used to enhance the structural strength of the circuit board main body 10122B. That is, the reinforcement layer 10125B is placed on the underlayer of the package portion 1011B and the photosensitive chip 10121B on the circuit board main body 10122B, so that the circuit board main body 10122B stably and reliably supports the package. Portion 1011B and the sensor chip 10121B.
  • the reinforcing layer 10125B is a metal plate attached to the bottom layer of the circuit board main body 10122B to increase the structural strength of the circuit board main body 10122B, and on the other hand, the photosensitive member 1010B is added.
  • the heat dissipation performance can effectively dissipate the heat generated by the photosensitive chip 10121B.
  • the circuit board main body 10122B can adopt an FPC (Flex Print Circuit), and the rigidity of the FPC is enhanced by the reinforcing layer 10125B, so that the FPC with good bending performance can be used.
  • the load bearing requirements of the photosensitive member 1010B are satisfied. That is to say, the circuit board body 10122B has a wider range of options, such as a PCB (Printed Circuit Board), FPC, RF (Rigid Flex, soft and hard board).
  • the structural strength of the wiring board main body 10122B is increased by the reinforcing layer 10125B and the heat dissipation performance is improved, so that the thickness of the wiring board main body 10122B can be reduced, so that the height of the photosensitive member 1010B is further reduced, and assembled by the same The height of the obtained camera module is reduced.
  • the reinforcement layer 10125 is superimposed in a plate shape on the circuit board main body 10122B, and in other embodiments of the present invention, the reinforcement layer 10125B may be extended to The side wall of the encapsulation portion 1011B is wrapped to enhance its anti-electromagnetic interference capability while enhancing the structural strength of the photosensitive member 1010B.
  • the inner wall of the encapsulation portion may be disposed according to the shape of the connecting line, such as being inclined, so that the photosensitive chip 10121B can be received while covering the connecting line 10124B. More light. It will be understood by those skilled in the art that the shape of the package portion 1011B is not a limitation of the present invention.
  • the camera module 10100B may be a Fix Focus Model (FFM).
  • the camera module includes a photosensitive component 1010B, a filter 1020B, and a lens 1030B.
  • the filter 1020B is mounted to the photosensitive member 1010B, and the lens 1030B is mounted on the photosensitive member 1010B.
  • the filter 1020B is mounted on the top end of the package portion 1011B of the photosensitive member 1010B.
  • the lens 1030B is attached to the top end of the package portion 1011B of the photosensitive member 1010B.
  • the specific mounting position of the filter 1020B and the lens 1030B at the encapsulation portion 1011B can be coordinated according to specific needs.
  • the lens 1030B is mounted on the top end of the encapsulation portion 1011B of the photosensitive component 1010B, so that the encapsulation portion 1011B is equivalent to the function of the bracket in the conventional camera module, and is the lens
  • the 1030B provides support and fixed position, but assembly is different from traditional COB processes.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 1011B is fixed to the circuit board main body 10122B by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the invention has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the package portion 1011B and the circuit board main body 10122B, thereby reducing the conventional camera module AA. Adjusting the reserved space, so that the thickness of the camera module is reduced; on the other hand, the encapsulation portion 1011B covers the circuit component 10123B and the connecting wire 10124B, so that the conventional bracket function and the circuit component 10123B and the The connecting lines 10124B can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the package portion 1011B having a bracket function can be set in a small range, thereby Further, a space in which the thickness of the camera module can be reduced is provided.
  • the encapsulation portion 1011B replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reduces the cumulative tolerance of the assembly of the camera module.
  • the encapsulation portion 1011B covers the connection line 10124B, and the encapsulation portion 1011B extends to the non-photosensitive region 101212B of the photosensitive chip 10121B, so that the encapsulation portion 1011B can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the camera module 10100B can be a dynamic focus camera module.
  • the camera module includes a photosensitive component 1010B, a filter 1020B, a motor 1040B, and a lens 1030B.
  • the filter 1020B is mounted to the photosensitive member 1010B, the lens 1030B is mounted to the motor 1040B, and the motor 1040B is mounted on the molded photosensitive member 1010B.
  • the filter 1020B is attached to the top end of the package portion 1011B of the photosensitive member 1010B.
  • the motor 1040B is attached to the top end of the package portion 1011B of the photosensitive member 1010B.
  • the specific mounting position of the filter 1020B and the motor 1040B in the package portion 1011B may be according to specific needs. Coordinate the configuration.
  • the photosensitive module 1010C is used for assembling and manufacturing the camera module, thereby obtaining a molded camera module.
  • the photosensitive member 1010C includes a package portion 1011C and a photosensitive portion 1012C, and the package portion 1011C is moldedly coupled to the photosensitive portion 1012C.
  • the photosensitive portion 1012C includes a circuit board main body 10122C and a photosensitive chip 10121C, and the photosensitive chip 10121C is disposed on the circuit board main body 10122C. According to this embodiment of the invention, the photosensitive chip 10121C is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012C includes a connection line and at least one circuit component 10123C.
  • the connection line is preset to the circuit board main body 10122C, and the circuit component 10123C is electrically connected to the connection line and the photosensitive chip 10121C for the photosensitive operation process of the photosensitive chip 10121C.
  • the circuit component 10123C is convexly disposed on the circuit board main body 10122C.
  • the circuit component 10123C can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011C encapsulates the circuit component 10123C therein, thereby making the circuit component 10123C not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 10121C communicates, when the camera module is assembled, the circuit component 10123C is not contaminated with dust or the like, and does not affect the sensor chip 10121C, which is different from the conventional camera module.
  • the circuit component 10123C is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123C by molding and covering, thereby avoiding contamination of the photosensitive chip 10121C and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 1011C defines a through hole 101100C to provide a photosensitive path for the photosensitive chip 10121C.
  • the photosensitive portion 1012C includes at least one connecting wire 10124C for electrically connecting the photosensitive chip 10121C and the wiring board main body 10122C.
  • the connection line 10124C may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124C connects the photosensitive chip 10121C and the wiring board main body 10122C in an arc shape.
  • the connecting wire 10124C is molded inside the encapsulating portion 1011C, so that the connecting wire 10124C can be coated by the encapsulating portion 1011C without being directly exposed to the outside, thereby assembling
  • the connection line 10124C is not subjected to any touch damage, and the influence of environmental factors on the connection line 10124C, such as temperature, is caused, such that the photosensitive chip 10121C and the circuit board are reduced.
  • the communication connection between the main bodies 10122C is stable, which is not provided at all in the prior art.
  • the encapsulation portion 1011C encloses the circuit component 10123C and the connection line 10124C, and has a camera module for protecting the circuit component 10123C and the connection line 10124C and obtaining better performance.
  • the package portion 1011C is not limited to wrapping the circuit component 10123C or the connection line 10124C. That is, in other embodiments of the present invention, the package portion 1011C may be directly molded to the circuit board main body 10122C of the circuit component 10123C that is not protruded, or may be molded on the circuit component. 10123C outside, around and other different positions.
  • the photosensitive chip 10121C has a photosensitive area 101211C and a non-sensitive area 101212C, and the non-sensitive area 101212C surrounds the periphery of the photosensitive area 101211C.
  • the photosensitive region 101211C is used for photoreceptive action, and the connecting line 10124C is connected to the non-photosensitive region 101212C.
  • the package portion 1011C extends over the non-photosensitive region 101212C of the photosensitive chip 10121C, thereby laminating the photosensitive chip 10121C to the circuit board body by molding. 10122C.
  • the molding of the chip portion 1011C expands the moldable range inward, such as molding on the chip, so that the circuit board main body 10122C and the package portion 1011C can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the photosensitive member and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011C is convexly surrounding the outside of the photosensitive region 101211C of the photosensitive chip 10121C, and in particular, the encapsulation portion 1011C is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010C is used to assemble the camera module, the photosensitive chip 10121C is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122C, and the photosensitive chip 10121C is disposed on the circuit board main body 10122C, and the photosensitive chip 10121C is passed.
  • the connecting wires 10124C are electrically connected, and then molded on the components of the circuit board main body 10122C and the photosensitive chip 10121C after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 1011C, or the package portion 1011C is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122C may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011C is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011C may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the photosensitive member 1010C further includes a filter 1020C, and the filter 1020C is molded and laminated on the photosensitive chip 10121C.
  • the edge of the filter 1020C is molded to the encapsulation portion 1011C, thereby fixing the filter 1020C.
  • the filter 1020C covers the photosensitive chip 10121C, and isolates the photosensitive chip 10121C from the external environment to protect the photosensitive chip 10121C from damage and prevent the entry of dust.
  • the photosensitive chip 10121C is attached to the wiring board main body 10122C, and the photosensitive chip 10121C and the wiring board main body 10122C are connected to the filter.
  • the light sheet 1020C is attached to the photosensitive chip 10121C, and further, the wiring board main body 10122C and the photosensitive chip 10121C and the filter 1020C are molded to form the package portion 1011C.
  • the filter 1020C covers the photosensitive chip 10121C, damage of the molded mold to the photosensitive chip 10121C can be prevented, and the filter 1020C and the photosensitive chip are The distance of the 10121C is reduced, so that the back focal length of the camera module assembled therefrom can be reduced, thereby reducing the height of the camera module, and on the other hand, since there is no need to provide additional support for the filter 1020C.
  • the components therefore also to some extent, further reduce the thickness of the camera module.
  • the inner wall of the encapsulation portion 1010C may be disposed according to the shape of the connection line, such as being disposed in an inclined shape, so that the photosensitive chip 10121C can be received while covering the connection line 10124C. Wait for more light. It will be understood by those skilled in the art that the shape of the package portion 1011C is not a limitation of the present invention.
  • the camera module can be a certain focus module.
  • the camera module includes a photosensitive component 1010C and a lens 1030C.
  • the lens 1030C is mounted on the photosensitive component 1010C and assembled to form the camera module.
  • the lens 1030C can be fixed to the top end of the encapsulation portion 1011C of the photosensitive member 1010C by bonding, and the top end of the encapsulation portion 1011C is made by the characteristics of mold manufacturing in the molding process. Good flatness provides good mounting conditions for the lens 1030C, resulting in a high quality camera module.
  • the lens 1030C is mounted on the top end of the encapsulation portion 1011C of the photosensitive component 1010C, so that the encapsulation portion 1011C is equivalent to the function of the bracket in the conventional camera module, and the lens 1030C is Provide support, fixed position, but assembly is different from traditional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 1011C is fixed to the circuit board main body 10122C by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding. It has better connection stability and controllability of the process, and no AA adjustment is required between the package portion 1011C and the circuit board main body 10122C.
  • the package portion 1011C covers the circuit component 10123C and the connection Line 10124C, such that the conventional bracket function and circuit component 10123C and the connection line 10124C can be spatially overlapped, without requiring a safe distance around the circuit device like a conventional camera module, thereby enabling the bracket function
  • the height of the encapsulation portion 1011C can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced.
  • the encapsulation portion 1011C replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
  • the encapsulation portion 1011C covers the connection line 10124C, and the encapsulation portion 1011C extends to the non-photosensitive region 101212C of the photosensitive chip 10121C, so that the encapsulation portion 1011C can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the photosensitive member 1010C molds the filter 1020C therein, so that when the camera module is assembled, it is not necessary to perform the paste mounting process again, thereby reducing the assembly process of the camera module. To improve work efficiency, these are superior to the prior art.
  • the camera module can be an Automatic Focus Model (AFM).
  • the camera module includes a photosensitive component 1010C, a motor 1040C, and a lens 1030C.
  • the lens 1030C is mounted to the motor 1040C, and the motor 1040C is mounted on the photosensitive assembly 1010C to facilitate adjustment of the camera module focal length by the motor 1040C.
  • the motor 1040C is attached to the top end of the package portion 1011C of the photosensitive member 1010C.
  • the photosensitive module 1010D is used for assembling and manufacturing the camera module, thereby obtaining the camera module of the molding type.
  • the photosensitive member 1010D includes a package portion 1011D and a photosensitive portion 1012D, and the package portion 1011D is moldedly connected to the photosensitive portion 1012D.
  • the package portion is molded to the photosensitive portion 1012D in an MOC manner.
  • the photosensitive portion 1012D includes a circuit board main body 10122D and a photosensitive chip 10121D, and the photosensitive chip 10121D is disposed on the circuit board main body 10122D. According to this embodiment of the invention, the photosensitive chip 10121D is moldedly connected to the wiring board main body 10122D.
  • the photosensitive portion 1012D includes a connection line and at least one circuit component 10123D.
  • the connection line is preset to the circuit board body 10122D, and the circuit component 10123D is electrically connected to the connection line and the photosensitive chip 10121D for the photosensitive operation process of the photosensitive chip 10121D.
  • the circuit component 10123D is convexly disposed on the circuit board main body 10122D.
  • the circuit component 10123D can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011D encapsulates the circuit component 10123D therein, so that the circuit component 10123D is not directly exposed to the space, more specifically, is not exposed to the In the environment where the photosensitive chip 10121D communicates, when the camera module is assembled, the circuit component 10123D is not contaminated with dust or the like, and does not affect the photosensitive chip 10121D, which is different from the conventional camera module.
  • the circuit element 10123D is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123D by molding and covering, thereby avoiding contamination of the photosensitive chip 10121D and causing the camera module to become dirty. Points and other undesirable phenomena.
  • the encapsulation portion 1011D defines a through hole 101100D to provide a photosensitive path for the photosensitive chip 10121D.
  • the photosensitive portion 1012D includes at least one connecting wire 10124D for electrically connecting the photosensitive chip 10121D and the wiring board main body 10122D.
  • the connection line 10124D may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124D connects the photosensitive chip 10121D and the wiring board main body 10122D in an arc shape.
  • the connecting wire 10124D is molded inside the encapsulating portion 1011D, so that the connecting wire 10124D can be coated by the encapsulating portion 1011D without being directly exposed to the outside, thereby assembling
  • the connection line 10124D is not subjected to any touch damage, and environmental factors are reduced to the connection.
  • the encapsulation portion 1011D encloses the circuit component 10123D and the connection line 10124D, and has a camera module for protecting the circuit component 10123D and the connection line 10124D and obtaining better performance.
  • the package portion 1011D is not limited to encasing the circuit component 10123D or the connection line 10124D. That is, in other embodiments of the present invention, the package portion 1011D may be directly molded to the circuit board main body 10122D of the circuit component 10123D having no protrusion, or may be molded to the circuit component. 10123D outside, around and other different positions.
  • the photosensitive member 1010D further includes a filter 1020D, which is molded and laminated on the photosensitive chip 10121D.
  • the edge of the filter 1020D is molded to the encapsulation portion 1011D, thereby fixing the filter 1020D.
  • the filter 1020D covers the photosensitive chip 10121D, and isolates the photosensitive chip 10121D from the external environment to protect the photosensitive chip 10121D from damage and prevent the entry of dust.
  • the photosensitive chip 10121D has a photosensitive area 101211D and a non-sensitive area 101212D, and the non-sensitive area 101212D surrounds the periphery of the photosensitive area 101211D.
  • the photosensitive region 101211D is used for photoreceptive action, and the connecting line 10124D is connected to the non-photosensitive region 101212D.
  • the package portion 1011D extends over the non-photosensitive region 101212D of the photosensitive chip 10121D, thereby laminating the photosensitive chip 10121D to the circuit board body by molding. 10122D.
  • the mold-on mold enlarges the inward moldable range of the package portion 1011D, so that the circuit board main body 10122D and the package portion can be reduced.
  • the outer structural portion of the 1011D further reduces the length and width dimensions of the photosensitive portion 1012D and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011D is convexly surrounding the outside of the photosensitive region 101211D of the photosensitive chip 10121D, and in particular, the encapsulation portion 1011D is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010D is used to assemble the camera module, the photosensitive chip 10121D is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122D, and the photosensitive chip 10121D is disposed on the circuit board main body 10122D, and the photosensitive chip 10121D is passed.
  • the connecting wires 10124D are electrically connected, and then molded on the components of the circuit board main body 10122D and the photosensitive chip 10121D after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 1011D, or the package portion 1011D is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122D may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011D is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011D may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 1011D includes a cladding portion 10111D, a filter mounting portion 10112D, and a lens mounting portion 10113D.
  • the filter mounting portion 10112D and the lens mounting portion 10113D are integrally molded and integrally connected to each other.
  • the covering section 10111D is molded and connected to the circuit board main body 10122D for covering the circuit component 10123D and the connecting wire 10124D.
  • the lens mounting section 10113D is used to mount a lens 1030D, that is, when the photosensitive component 1010D is used to assemble the camera module, the lens 1030D is mounted on the lens of the package part 1011D.
  • the inside of the segment 10113D is mounted to provide a stable mounting position for the lens 1030D.
  • the lens mounting section 10113D has a lens mounting slot 101131D, and the lens mounting slot 101131D communicates with the through hole 101100D to provide sufficient mounting space for the lens 1030D. That is,
  • the package portion 1011D has a filter mounting groove 101121D and a lens mounting groove 101131D.
  • the filter 1020D is mounted on the mounting groove 101121D, and the lens 1030D is mounted on the lens mount. Slot 101131D. As shown in FIG. 19A and FIG. 20, the filter 1020D is integrally packaged in the covered section of the package portion 1011, so that it is not necessary to provide the mounting groove 101121D.
  • the lens mounting section 10113D extends integrally upwardly and internally forms a stepped structure to provide a support fixed position for the lens 1030D, thereby eliminating the need to provide additional components to mount the lens 1030D.
  • the encapsulation portion 1011D integrally extends upwardly and is internally stepped to cover the circuit component and the connecting wire and to support the lens, respectively.
  • the lens mounting section 10113D has a lens inner wall 101132D, and the lens inner wall 101132D has a closed annular shape, which is suitable for providing installation space for the lens 1030D. It is worth mentioning that the surface of the lens inner wall 101132D of the lens mounting section 10113D is flat, so as to be suitable for mounting the lens 1030D without threads to form a fixed focus module. In particular, the lens 1030D can be fixed to the lens mounting section 10113D by bonding.
  • the lens inner wall 201132 may also be an open annular structure, that is, may be a structure with an opening, and those skilled in the art should understand that the structure of the inner lens wall 101132D is not the present invention. limit.
  • the inner wall of the covering section 10111D of the encapsulating portion 1011D may be disposed according to the shape of the connecting line, such as being inclined, thereby making the connecting line 10124D coated.
  • the photosensitive chip 10121D can receive more light. It will be understood by those skilled in the art that the shape of the package portion 1011D is not a limitation of the present invention.
  • the package portion 1011D includes a cladding portion 10111D, a filter mounting portion 10112D, and a lens mounting portion, according to a modified embodiment of the fifth preferred embodiment of the present invention.
  • 10113D, the filter mounting section 10112D and the lens mounting section 10113D are integrally molded and integrally connected to the covering section 10111D, and the covering section 10111D is molded and connected to the wiring board main body 10122D for The circuit component 10123D and the connection line 10124D are covered.
  • the lens mounting section 10113D is used to mount a lens 1030D, that is, when the photosensitive component 1010D is used to assemble the camera module, the lens 1030D is mounted on the lens of the package part 1011D.
  • the inside of the segment 10113D is mounted to provide a stable mounting position for the lens 1030D.
  • the lens mounting section 10113D has a lens mounting slot 101131D, and the lens mounting slot 101131D communicates with the through hole 101100D to provide sufficient mounting space for the lens 1030D. That is, the encapsulation portion 1011D has a mounting slot 101121D and a lens mounting slot 101131D, the filter 1020D is mounted to the mounting slot 101121D, and the lens 1030D is mounted to the lens The slot 101131D is mounted.
  • the lens mounting section 10113D extends integrally upwardly and internally forms a stepped structure to provide a support fixed position for the lens 1030D, thereby eliminating the need to provide additional components to mount the lens 1030D.
  • the encapsulation portion 1011D integrally extends upwardly and is internally stepped to cover the circuit component 10123D and the connection line 10124D, respectively, and to provide the filter 1020D and the lens 1030D. Installation location.
  • the lens mounting section 10113D limits the lens or the motor 1040 such that the lens 1030D or the motor 1040D is quickly and accurately mounted to a corresponding position.
  • the height and structure of the lens mounting section 10113D may be set according to requirements, and may be a closed cylindrical structure, or may be a gap, a spaced limiting wall or a limiting pillar.
  • a camera module 10100D in accordance with a fifth preferred embodiment of the present invention.
  • the camera module can be a certain focus module.
  • the camera module includes a photosensitive component 1010D and a lens 1030D.
  • the lens 1030D is mounted to the lens mounting groove 101131D of the lens mounting section 10113D of the package portion 1011D of the photosensitive member 1010D.
  • the filter 1020D is molded on the photosensitive member 1011D, so that it is not necessary to provide an additional filter, and it is not necessary to separately install the filter when assembling the image molding, thereby reducing the assembly process. And the way of molding the filter is such that the back focus of the camera module can be reduced.
  • the lens 1030D is mounted on the lens mounting section 10113D of the encapsulation portion 1011D of the photosensitive component 1010D, so that the encapsulation portion 1011D is equivalent to a bracket or a mirror in a conventional camera module.
  • the function of the cartridge provides support and fixed position for the lens 1030D, but the assembly is different from the conventional COB process. Pass The bracket of the camera module of the COB process is fixed to the circuit board in a pasting manner, and the package portion 1011D is fixed to the circuit board main body 10122D by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the invention has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the package portion 1011D and the circuit board main body 10122D, thereby reducing the conventional camera module AA.
  • the adjusted reserved space is such that the thickness of the camera module is reduced, and the package portion 1011D of the molding method according to the present invention has better flatness, so that the camera module may not be assembled when the camera module is assembled AA adjustment; on the other hand, the encapsulation portion 1011D covers the circuit component 10123D and the connection line 10124D, so that the conventional bracket function and the circuit component 10123D and the connection line 10124D can be spatially overlapped, without
  • a safe distance is reserved around the circuit device, so that the height of the package portion 1011D having a bracket function can be set to a smaller fan.
  • the circumference further provides a space in which the thickness of the camera module can be reduced.
  • the encapsulation portion 1011D replaces the conventional bracket and provides a mounting position for the lens 1030D, which avoids the tilt error caused by the bracket during the assembly and assembly, and reduces the cumulative tolerance of the assembly of the camera module.
  • the encapsulation portion 1011D covers the connection line 10124D, and the encapsulation portion 1011D extends to the non-photosensitive region 101212D of the photosensitive chip 10121D, so that the encapsulation portion 1011D can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • FIG. 20B is a camera module 10100D according to another modified embodiment of the fifth preferred embodiment of the present invention.
  • the encapsulation portion 1011D includes a cladding portion 10111D, a filter mounting portion 10112D, and a protrusion 10113D.
  • the filter mounting portion 10112D and the protrusion 10113D are integrally molded and integrally coupled to the cladding.
  • the covering segment 10111D is molded and connected to the circuit board main body 10122D for covering the circuit component 10123D and the connecting wire 10124D.
  • the protrusion 10113D extends partially upward from the filter mounting section 1112D, and an outer mounting groove 101131D is formed in the filter mounting section 10112D to facilitate mounting the lens 1030D or the motor 1040D. That is, the protrusion 10113D isolates the lens 1030D or the motor 1040D mounting position from the internal space of the photosensitive component 1010D, so as to block the lens 1030D or the bonding medium of the motor 1040D, such as The glue diffuses to the inside, contaminating the lens in the lens 1030D or the inside of the camera module. That is, the encapsulation portion 1011D has a mounting slot 101121D and an outer mounting slot 101131D. The mounting slot 101121 is located on the inner side for mounting the filter 1020D. The outer mounting slot 101131D is located. The outer side is for mounting the lens 1030D or the motor 1040D.
  • the photosensitive module 1010E is used for assembling and manufacturing the camera module, thereby obtaining the camera module of the molding type.
  • the photosensitive member 1010E includes a package portion 1011E and a photosensitive portion 1012E, and the package portion 1011E is moldedly coupled to the photosensitive portion 1012E.
  • the photosensitive portion 1012E includes a circuit board main body 10122E and a photosensitive chip 10121E, and the photosensitive chip 10121E is disposed on the circuit board main body 10122E. According to this embodiment of the invention, the photosensitive chip 10121E is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012E includes a connection line and at least one circuit component 10123E.
  • the connection line is preset to the circuit board body 10122E, and the circuit component 10123E is electrically connected to the connection line and the photosensitive chip 10121E for the photosensitive operation process of the photosensitive chip 10121E.
  • the circuit component 10123E is convexly disposed on the circuit board body 10122E.
  • the circuit component 10123E can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011E encapsulates the circuit component 10123E inside thereof, thus making the circuit component 10123E not directly exposed to the space, more specifically, not exposed to the
  • the photosensitive chip 10121E communicates with the environment, so that when assembled as the camera module, the circuit component 10123E is not contaminated with dust or the like, and does not affect the sensor chip 10121E, unlike the conventional camera module.
  • the circuit element 10123E is exposed to exist in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123E by molding and covering, thereby avoiding contamination of the photosensitive chip 10121E and causing the camera module to appear dirty. Points and other undesirable phenomena.
  • the encapsulation portion 1011E defines a through hole 101100E to provide a photosensitive path for the photosensitive chip 10121E.
  • the photosensitive portion 1012E includes at least one connecting wire 10124E for electrically connecting the photosensitive chip 10121E and the wiring board main body 10122E.
  • the connection line 10124E can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124E connects the photosensitive chip 10121E and the wiring board main body 10122E in an arc shape.
  • the connecting wire 10124E is molded inside the encapsulating portion 1011E, so that the connecting wire 10124E can be coated by the encapsulating portion 1011E without being directly exposed to the outside, thereby assembling
  • the connection line 10124E is not subjected to any touch damage, and the influence of environmental factors on each of the connection lines 10124E, such as temperature, is caused, such that the photosensitive chip 10121E and the circuit board are reduced.
  • the communication connection between the main bodies 10122E is stable, which is not provided at all in the prior art.
  • the encapsulation portion 1011E encloses the circuit component 10123E and the connection line 10124E, and has the aspects of protecting the circuit component 10123E and the connection line 10124E and obtaining a camera module with better performance.
  • the package portion 1011E is not limited to encasing the circuit component 10123E or the connection line 10124E. That is, in other embodiments of the present invention, the package portion 1011E may be directly molded to the circuit board body 10122E of the circuit component 10123E that is not protruding, or may be molded to the circuit component. 10123E outside, around and other different locations.
  • the photosensitive member 1010E further includes a filter 1020E that is moldedly laminated on the photosensitive chip 10121E.
  • the edge of the filter 1020E is molded to the encapsulation portion 1011E, thereby fixing the filter 1020E.
  • the filter 1020E covers the photosensitive chip 10121E, and isolates the photosensitive chip 10121E from the external environment to protect the photosensitive chip 10121E from damage and prevent the entry of dust.
  • the photosensitive chip 10121E has a photosensitive area 101211E and a non-sensitive area 101212E, and the non-sensitive area 101212E surrounds the periphery of the photosensitive area 101211E.
  • the photosensitive region 101211E is used for photoreceptive action, and the connecting line 10124E is connected to the non-photosensitive region 101212E.
  • the encapsulation portion 1011E extends over the non-photosensitive region 101212E of the photosensitive chip 10121E, thereby laminating the photosensitive chip 10121E to the circuit board main body by molding. 10122E.
  • the molding on chip such as molding on the chip, enlarges the inward moldable range of the package portion 1011E, so that the circuit board main body 10122E and the outer side of the package portion 1011E can be reduced.
  • the structural portion further reduces the length and width dimensions of the molded photosensitive portion 1012E and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011E is convexly surrounding the outside of the photosensitive region 101211E of the photosensitive chip 10121E, and in particular, the encapsulation portion 1011E is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010E is used to assemble the camera module, the photosensitive chip 10121E is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122E, and the photosensitive chip 10121E is disposed on the circuit board main body 10122E, and the photosensitive chip 10121E is passed.
  • the connecting wires 10124E are electrically connected, and then molded on the components of the circuit board main body 10122E and the photosensitive chip 10121E after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 1011E, or the package portion 1011E is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122E may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011E is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011E may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 1011E includes a covering portion 10111E and a lens mounting portion 10113E.
  • the segment 10113E is integrally molded and coupled to the cladding segment 10111E, and the cladding segment 10111E is molded and coupled to the circuit board body 10122E for cladding the circuit component 10123E and the connecting wire 10124E.
  • the lens mounting section 10113E is used to mount a lens 1030E, that is, when the photosensitive component 1010E is used to assemble the camera module, the lens 1030E is mounted on the lens of the package part 1011E.
  • the inside of the segment 10113E is mounted to provide a stable mounting position for the lens 1030E.
  • the lens mounting section 10113E has a lens mounting slot 101131E, and the lens mounting slot 101131E communicates with the through hole 101100E to provide sufficient mounting space for the lens 1030E. That is, the package portion 1011E has one lens mounting groove 101131E, and the lens 1030E is mounted to the lens mounting groove 101131E.
  • the lens mounting section 10113E extends integrally upward along the covering portion 10111E, and internally forms a stepped structure to provide a support fixing position for the lens 1030E, thereby eliminating the need to provide additional components for mounting the lens 1030E.
  • the encapsulation portion 1011E integrally extends upwardly and is internally stepped to cover the circuit component and the connection line 10124E, respectively, and to support the lens 1030E.
  • the lens mounting section 10113E has a lens inner wall 101132E, and the lens inner wall 101132E is in a closed loop shape, and is suitable for providing a mounting space for the lens 1030E. It is worth mentioning that the lens inner wall surface 101132E of the lens mounting section 10113E has a threaded structure, so as to be suitable for mounting the threaded lens 1030E to form a fixed focus module. In particular, the lens 1030E can be fixed to the lens mounting section 10113E by screwing.
  • the inner wall of the covering section 10111E of the encapsulating portion 1011 may be disposed according to the shape of the connecting line, such as being inclined, thereby making the connecting line 10124E coated.
  • the photosensitive chip 10121E can receive a plurality of light rays. It will be understood by those skilled in the art that the shape of the package portion 1011E is not a limitation of the present invention.
  • the camera module can be a certain focus module.
  • the camera module includes a photosensitive component 1010E and a lens 1030E.
  • the lens 1030E is mounted to the lens mounting groove 101131E of the lens mounting section 10113E of the package portion 1011E of the photosensitive member 1010E.
  • the filter 1020E is molded on the photosensitive member 1011E, so that it is not necessary to provide an additional filter, and it is not necessary to separately mount the filter when assembling the image forming mold, thereby reducing the image capturing.
  • the assembly process of the module and the manner in which the filter is molded allows the back focus of the camera module to be reduced.
  • the lens 1030E is mounted on the lens mounting section 10113E of the encapsulation portion 1011E of the photosensitive component 1010E, so that the encapsulation portion 1011E is equivalent to a bracket or a mirror in a conventional camera module.
  • the function of the barrel provides support and fixed position for the lens 1030E, but the assembly is different from the conventional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 1011E is fixed to the circuit board main body 10122E by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the encapsulation portion 1011E covers the circuit component 10123E and the connecting wire 10124E, so that the conventional bracket function and the circuit component 10123E and the The connecting lines 10124E can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the package portion 1011E having a bracket function can be set in a small range, thereby Further, a space in which the thickness of the camera module can be reduced is provided.
  • the encapsulation portion 1011E replaces the conventional bracket, and provides the mounting position of the lens 1030E, which avoids the tilt error caused by the bracket during the assembly and assembly, and reduces the cumulative tolerance of the assembly of the camera module.
  • the encapsulation portion 1011E covers the connection line 10124E, and the encapsulation portion 1011E extends to the non-photosensitive region 101212E of the photosensitive chip 10121E, so that the encapsulation portion 1011E can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the photosensitive member 1010F is used for assembling and manufacturing the camera module, thereby obtaining a molded type The camera module.
  • the photosensitive member 1010F includes a package portion 1011F and a photosensitive portion 1012F, and the package portion 1011F is moldedly connected to the photosensitive portion 1012F.
  • the photosensitive portion 1012F includes a circuit board main body 10122F and a photosensitive chip 10121F, and the photosensitive chip 10121F is disposed on the circuit board main body 10122F. According to this embodiment of the invention, the photosensitive chip 10121F is moldedly connected to the line body 10122F.
  • the photosensitive portion 1012F includes a connection line and at least one circuit component 10123F.
  • the connection line is preset to the circuit board body 10122F, and the circuit component 10123F is electrically connected to the connection line and the photosensitive chip 10121F for the photosensitive operation process of the photosensitive chip 10121F.
  • the circuit component 10123F is convexly disposed on the circuit board main body 10122F.
  • the circuit component 10123F can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011F encapsulates the circuit component 10123F therein, so that the circuit component 10123F is not directly exposed to the space, more specifically, is not exposed to the In the environment where the photosensitive chip 10121F communicates, when the camera module is assembled, the circuit component 10123F is not contaminated with dust or the like, and does not affect the sensor chip 10121F, which is different from the conventional camera module.
  • the circuit element 10123F is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123F by molding and covering, thereby avoiding contamination of the photosensitive chip 10121F and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 1011F defines a through hole 101100F to provide a photosensitive path for the photosensitive chip 10121F.
  • the photosensitive portion 1012F includes at least one connecting wire 10124F for electrically connecting the photosensitive chip 10121F and the wiring board main body 10122F.
  • the connection line 10124F may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124F connects the photosensitive chip 10121F and the wiring board main body 10122F in an arc shape.
  • the connecting wire 10124F is molded inside the encapsulating portion 1011F, so that the connecting wire 10124F can be coated by the encapsulating portion 1011F without being directly exposed to the outside, thereby assembling
  • the connection line 10124F is not subjected to any touch damage, and the influence of environmental factors on the connection line 10124F, such as temperature and humidity, is caused, so that the sensor chip 10121F and the The communication connection between the board main bodies 10122F is stable, which is completely different from the prior art.
  • the encapsulation portion 1011F encloses the circuit component 10123F and the connection line 10124F, and has a camera module for protecting the circuit component 10123F and the connection line 10124F and obtaining better performance.
  • the package portion 1011F is not limited to encasing the circuit component 10123F or the connection line 10124F. That is, in other embodiments of the present invention, the package portion 1011F may be directly molded to the circuit board body 10122F of the circuit component 10123F that is not protruding, or may be molded to the circuit component. 10123F outside, around and other different positions.
  • the photosensitive chip 10121F has a photosensitive area 101211F and a non-sensitive area 101212F, and the non-sensitive area 101212F surrounds the periphery of the photosensitive area 101211F.
  • the photosensitive region 101211F is used for photoreceptive action, and the connecting line 10124F is connected to the non-photosensitive region 101212F.
  • the encapsulation portion 1011F extends over the non-photosensitive region 101212F of the photosensitive chip 10121F, thereby laminating the photosensitive chip 10121F to the circuit board main body by molding. 10122F.
  • the molding on chip such as molding on the chip, enlarges the inward moldable range of the package portion 1011F, so that the circuit board main body 10122F and the outer side of the package portion 1011F can be reduced.
  • the structural portion further reduces the length and width dimensions of the molded photosensitive portion 1012F and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011F is convexly surrounding the outside of the photosensitive region 101211F of the photosensitive chip 10121F, and in particular, the encapsulation portion 1011F is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010F is used to assemble the camera module, the photosensitive chip 10121F is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the main circuit board.
  • the body 10122F is provided with a photosensitive chip 10121F on the circuit board main body 10122F, and the photosensitive chip 10121F is electrically connected through the connecting wire 10124F, and further, the circuit board main body 10122F and the photosensitive chip 10121F after preliminary assembly.
  • the part is molded, for example, by an injection molding machine, a circuit board after performing an SMT process (Surface Mount Technology surface mount process) is molded by the molding process to form the package portion 1011F, or in a semiconductor package.
  • SMT process Surface Mount Technology surface mount process
  • a commonly used molding process forms the package portion 1011F.
  • the circuit board main body 10122F may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011F is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011F may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may adopt heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 1011F includes a cladding portion 10111F and a filter mounting portion 10112F.
  • the filter mounting portion 10112F is integrally molded and integrally connected to the cladding portion 10111F, and the cladding portion 10111F is molded. Plastically connected to the circuit board main body 10122F for covering the circuit component 10123F and the connecting wire 10124F.
  • the filter mounting section 10112F is used to mount a filter 1020F, that is, when the photosensitive component 1010F is used to assemble the camera module, the filter 1020F of the camera module is installed.
  • the filter mounting section 10112F is such that the filter 1020F is located on the photosensitive path of the photosensitive chip 10121F and does not require an additional filter mounting bracket.
  • the encapsulation portion 1011F has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 10112F can be made to have good flatness by means of a mold-forming process. Therefore, the filter 1020F is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 10112F has a mounting slot 101121F, and the mounting slot 101121F communicates with the through hole 101100F to provide sufficient installation space for the filter 1020F, so that the filter 1020F It does not protrude from the top surface 101122F of the filter mounting section 10112F. That is, the mounting groove 101121F is disposed at the upper end of the encapsulation portion 1011F, so that the filter 1020F is mounted on the encapsulation portion 1011F and does not protrude from the top end of the encapsulation portion 1011F.
  • the inner wall of the encapsulation portion 1011F may be disposed according to the shape of the connection line 10124F, such as being disposed in an inclined shape, so that the photosensitive chip 10121F may be made while covering the connection line 10124F. Received more light. It will be understood by those skilled in the art that the shape of the package portion 1011F is not a limitation of the present invention.
  • the circuit board main body 10122F has at least one reinforcing hole 101221F, and the encapsulation portion 1011F extends into the reinforcing hole 101221F, thereby enhancing the structural strength of the circuit board main body 10122F.
  • the two different materials are bonded to each other to form a composite structure, so that the structural strength of the wiring board main body 10122F as a base is enhanced.
  • the position of the reinforcing hole 101221F can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
  • the structural strength of the circuit board main body 10122F is enhanced by the arrangement of the reinforcing holes 101221F, so that the thickness of the circuit board main body 10122F can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the photosensitive member 1010F.
  • the reinforcing hole 101221F is in the shape of a groove, so that when the photosensitive member 1010F is manufactured, the molding material of the sealing portion 1011F is not protected by the reinforcing hole. 101221F leaked out.
  • the photosensitive member 1010F can be assembled into a fixed focus module or a moving focus module, and those skilled in the art should understand that the assembly application mode of the photosensitive assembly 1010F is not a limitation of the present invention. .
  • the photosensitive module 1010G is used for assembling and manufacturing the camera module, thereby obtaining the camera module of the molding type.
  • the photosensitive member 1010G includes a package portion 1011G and a photosensitive portion 1012G, and the package portion 1011G is moldedly coupled to the photosensitive portion 1012G.
  • the photosensitive portion 1012G includes a circuit board main body 10122G and a photosensitive chip 10121G, and the photosensitive chip 10121G is disposed on the circuit board main body 10122G. According to this embodiment of the invention, the photosensitive chip 10121G is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012G includes a connection line and at least one circuit component 10123G.
  • the connection line is preset to the circuit board main body 10122G, and the circuit component 10123G is electrically connected to the connection line and the photosensitive chip 10121G for the photosensitive operation process of the photosensitive chip 10121G.
  • the circuit component 10123G is convexly disposed on the circuit board main body 10122G.
  • the circuit component 10123G can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011G encapsulates the circuit component 10123G therein, so that the circuit component 10123G is not directly exposed to the space, more specifically, is not exposed to the In the environment in which the sensor chip 10121G communicates, when the camera module is assembled, the circuit component 10123G is not contaminated with dust or the like, and does not affect the sensor chip 10121G, which is different from the conventional camera module.
  • the circuit element 10123G is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123G by molding and covering, thereby avoiding contamination of the photosensitive chip 10121G and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 1011G defines a through hole 101100G to facilitate providing a photosensitive path for the photosensitive chip 10121G.
  • the photosensitive portion 1012G includes at least one connecting wire 10124G for electrically connecting the photosensitive chip 10121G and the wiring board main body 10122G.
  • the connection line 10124G may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124G connects the photosensitive chip 10121G and the wiring board main body 10122G in an arc shape.
  • the connecting wire 10124G is molded inside the encapsulating portion 1011G, so that the connecting wire 10124G can be covered by the encapsulating portion 1011G without being directly exposed to the outside, thereby assembling
  • the connection line 10124G is not subjected to any touch damage, and the influence of environmental factors on the connection line 10124G, such as temperature, is caused, such that the photosensitive chip 10121G and the circuit board are reduced.
  • the communication connection between the main bodies 10122G is stable, which is not provided at all in the prior art.
  • the encapsulation portion 1011G encloses the circuit component 10123G and the connection line 10124G, and has a camera module for protecting the circuit component 10123G and the connection line 10124G and obtaining better performance.
  • the package portion 1011G is not limited to cladding the circuit component 10123G or the connection line 10124G. That is, in other embodiments of the present invention, the package portion 1011G may be directly molded to the circuit board body 10122G of the circuit component 10123G that is not protruding, or may be molded to the circuit component. 10123G outside, around and other different positions.
  • the photosensitive chip 10121G has a photosensitive area 101211G and a non-sensitive area 101212G, and the non-sensitive area 101212G surrounds the periphery of the photosensitive area 101211G.
  • the photosensitive region 101211G is used for photoreceptive action, and the connecting line 10124G is connected to the non-photosensitive region 101212G.
  • the encapsulation portion 1011G extends over the non-photosensitive region 101212G of the photosensitive chip 10121G, thereby laminating the photosensitive chip 10121G to the circuit board main body by molding. 10122G.
  • the molding on chip such as molding on the chip, enlarges the inward moldable range of the package portion 1011G, so that the circuit board main body 10122G and the outer side of the package portion 1011G can be reduced.
  • the structural portion further reduces the length and width dimensions of the molded photosensitive portion 1012G and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011G is convexly surrounding the outside of the photosensitive region 101211G of the photosensitive chip 10121G, and in particular, the encapsulation portion 1011G is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010G is used to assemble the camera module, the photosensitive chip 10121G is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122G, and the photosensitive chip 10121G is disposed on the circuit board main body 10122G, and the photosensitive chip 10121G is passed.
  • the connecting wires 10124G are electrically connected, and then molded on the components of the circuit board main body 10122G and the photosensitive chip 10121G after preliminary assembly, such as an injection molding machine, which performs SMT by a molding process.
  • the wiring board after the process (Surface Mount Technology surface mount process) is molded to form the package portion 1011G, or the package portion 1011G is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122G may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011G is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011G may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may adopt heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 1011G includes a cladding portion 10111G and a filter mounting portion 10112G, and the filter mounting portion 10112G is integrally molded and integrally connected to the cladding portion 10111G, and the cladding portion 10111G is molded.
  • the filter mounting section 10112G is used to mount a filter 1020G, that is, when the photosensitive component 1010G is used to assemble the camera module, the filter 1020G of the camera module is installed.
  • the filter mounting section 10112G is such that the filter 1020G is located on the photosensitive path of the photosensitive chip 10121G, and it is not necessary to provide an additional filter 1020G mounting bracket. That is to say, the encapsulation portion 1011G has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 10112G can be made to have good flatness by means of a mold-forming process. Therefore, the filter 1020G is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 10112G has a mounting slot 101121G, and the mounting slot communicates with the through hole 101100G to provide sufficient installation space for the filter 1020G, so that the filter 1020G does not It will protrude from the top surface 101122G of the filter mounting section 10112G. That is, the mounting groove 101121F is disposed at the upper end of the encapsulation portion 1011F, so that the filter 1020F is mounted on the encapsulation portion 1011F and does not protrude from the top end of the encapsulation portion 1011F.
  • the inner wall of the encapsulation portion 1011G may be disposed according to the shape of the connection line, such as being inclined, so that the photosensitive chip 10121G can be received while covering the connection line 10124G. More light. It will be understood by those skilled in the art that the shape of the package portion 1011G is not a limitation of the present invention.
  • the circuit board main body 10122G has at least one reinforcing hole 101221G, and the encapsulation portion 1011G extends into the reinforcing hole 101221G, thereby enhancing the structural strength of the circuit board main body 10122G.
  • two different materials are bonded to each other to form a composite structure, so that the structural strength of the wiring board main body 10122G as a base is enhanced.
  • the position of the reinforcing hole 101221G can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
  • the structural strength of the circuit board main body 10122G is enhanced by the arrangement of the reinforcing holes 101221G, so that the thickness of the circuit board main body 10122G can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the photosensitive member 1010G.
  • the reinforcing hole 101221G is perforated, that is, passes through the circuit board main body 10122G, so that both sides of the circuit board main body 10122G are connected, thereby manufacturing
  • the molding material of the encapsulation portion 1011G is sufficiently combined with the circuit board main body 10122G to form a more firm composite material structure, and the perforation is easier to process than the structure of the groove. Manufacturing.
  • the photosensitive member 1010G can be assembled into a fixed focus module or a moving focus module, and those skilled in the art should understand that the assembly application mode of the photosensitive assembly 1010G is not a limitation of the present invention. .
  • the camera module 10100H can be a Fix Focus Model (FFM).
  • the camera module 10100H includes a photosensitive component 1010H, a bracket 1050H, a filter 1020H, and a lens 1030H.
  • the holder 1050H is mounted on the photosensitive member 1010H, the filter 1020H is mounted on the holder 1050H, and the lens 1030H is mounted on the holder 1050H.
  • the photosensitive member 1010H includes a package portion 1011H and a photosensitive portion 1012H, and the package portion 1011H is molded.
  • the ground is connected to the light receiving portion 1012H.
  • the photosensitive portion 1012H includes a circuit board main body 10122H and a photosensitive chip 10121H, and the photosensitive chip 10121H is disposed on the circuit board main body 10122H. According to this embodiment of the invention, the photosensitive chip 10121H is moldedly connected to the wiring board main body 10122.
  • the photosensitive portion 1012H includes a connection line and at least one circuit component 10123H.
  • the connection line is preset to the circuit board main body 10122H, and the circuit component 10123H is electrically connected to the connection line and the photosensitive chip 10121H for the photosensitive operation process of the photosensitive chip 10121H.
  • the circuit component 10123H is convexly disposed on the circuit board main body 10122H.
  • the circuit component 10123H can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 1011H encapsulates the circuit component 10123H therein, so that the circuit component 10123H is not directly exposed to the space, more specifically, is not exposed to the In the environment in which the sensor chip 10121H communicates, when the camera module is assembled, the circuit component 10123H is not contaminated with dust or the like, and does not affect the sensor chip 10121H, which is different from the conventional camera module.
  • the circuit element 10123H is exposed in a manner such as a resistive container member, thereby preventing dust and debris from staying on the surface of the circuit component 10123H by molding and covering, thereby avoiding contamination of the photosensitive chip 10121H and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 1011H forms a through hole 101100H to provide a photosensitive path for the photosensitive chip 10121H.
  • the photosensitive portion 1012H includes at least one connecting wire 10124H for electrically connecting the photosensitive chip 10121H and the wiring board main body 10122H.
  • the connection line 10124H may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 10124H connects the photosensitive chip 10121H and the wiring board main body 10122H in an arc shape.
  • the connecting wire 10124H is molded inside the encapsulating portion 1011H, so that the connecting wire 10124H can be covered by the encapsulating portion 1011H without being directly exposed to the outside, thereby assembling In the camera module, the connecting wire 10124H is not subjected to any touch damage, and the influence of environmental factors on the connecting wire 10124H, such as temperature, is caused, such that the photosensitive chip 10121H and the circuit board are reduced.
  • the communication connection between the main bodies 10122H is stable, which is not provided at all in the prior art.
  • the encapsulation portion 1011H encloses the circuit component 10123H and the connection line 10124H, and has the aspects of protecting the circuit component 10123H and the connection line 10124H and obtaining a camera module with better performance.
  • the package portion 1011H is not limited to cladding the circuit component 10123H or the connection line 10124H. That is, in other embodiments of the present invention, the package portion 1011H may be directly molded to the circuit board body 10122H of the circuit component 10123H that is not protruding, or may be molded to the circuit component. 10123H outside, around and other different positions.
  • the photosensitive chip 10121H has a photosensitive area 101211H and a non-sensitive area 101212H, and the non-sensitive area 101212H surrounds the periphery of the photosensitive area 101211H.
  • the photosensitive region 101211H is used for photoreceptive action, and the connecting line 10124H is connected to the non-photosensitive region 101212H.
  • the encapsulation portion 1011H extends over the non-photosensitive region 101212H of the photosensitive chip 10121H, thereby laminating the photosensitive chip 10121H to the circuit board main body by molding. 10122H.
  • the moldable on the chip MOC
  • the outer structural portion of the 1011H further reduces the length and width dimensions of the molded photosensitive portion 1012H, and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 1011H is convexly surrounding the outside of the photosensitive region 101211H of the photosensitive chip 10121H, and in particular, the encapsulation portion 1011H is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 1010H is used to assemble the camera module, the photosensitive chip 10121H is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 10122H, and the photosensitive chip 10121H is disposed on the circuit board main body 10122H, and the photosensitive chip is disposed.
  • 10121H is electrically connected through the connecting wire 10124H, and then molded on the printed circuit board main body 10122H and the photosensitive chip 10121H component after preliminary assembly, such as an injection molding machine, and an SMT process is performed by a molding process (Surface)
  • the wiring board after the Mount Technology surface mount process is molded to form the package portion 1011H, or the package portion 1011H is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 10122H may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 1011H is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 1011H may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be heat. Fusible resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 1011H provides a mounting position for the bracket 1050H here. According to the advantages of the molding process, the encapsulation portion 1011H can be made to have good flatness by means of a mold-forming process, so that the bracket is made. The 1050H is installed flat.
  • the inner wall of the encapsulation portion 1011H may be disposed according to the shape of the connection line, such as being inclined, so that the photosensitive chip 10121H can be received while covering the connection line 10124H. More light. It will be understood by those skilled in the art that the shape of the package portion 1011H is not a limitation of the present invention.
  • the photosensitive component can also be assembled into a dynamic focus camera module, so that the focal length of the camera module can be changed.
  • the camera module is Type is not a limitation of the present invention.
  • the photosensitive member 1010 includes a shielding layer 10126I, and the shielding layer 10126I wraps the wiring board main body 10122 and the encapsulating portion 1011, thereby enhancing the structure of the wiring board main body 10122. At the same time as the strength, the anti-electromagnetic interference capability of the photosensitive member 1010 is enhanced.
  • the shielding layer 10126I is a metal layer and may be a plate structure or a mesh structure.
  • the photosensitive assembly 1010 in accordance with an eleventh preferred embodiment of the present invention.
  • the photosensitive assembly 1010 includes a bracket 1050.
  • the bracket 1050 is additionally disposed on the encapsulation portion 1011 to form a closed through hole 101100 with the encapsulation portion 1011.
  • the encapsulation portion 1011 has a notch 101300.
  • the bracket 1050 is additionally disposed on the notch 101300, so that the notch 101300 is closed to form the through hole 101100. That is to say, the encapsulation portion 1011 does not form a closed annular structure, but is formed by the complement of the bracket 1050 to form a closed structure.
  • the bracket 1050 has a filter slot 1051 for mounting the filter 1020.
  • the bracket 1050 is supplemented to the encapsulation portion 1011 to facilitate providing a mounting position for the filter 1020.
  • the bracket 1050 includes an extending leg 1052 supplemented by the notch 101300 and extendedly connected to the circuit board main body 10122 to facilitate closing the notch 101300 to form the closed through hole 101100.
  • the encapsulation portion 1011 forms a platform structure
  • the bracket 1050 is supported by the platform structure
  • the bracket 1050 provides a mounting position for the filter 1020.
  • the encapsulation portion 1011 may have the filter mounting groove for mounting the bracket 1050, and the extension leg 1052 is extendedly connected to the circuit board main body 10122.
  • the structure of the notch 101300 of the encapsulation portion 1011 and the extending leg 1052 of the bracket may be a wedge-shaped structure, so that the bracket 1050 is smoothly and stably mounted on the encapsulation portion 1011.
  • the bracket 1050 may also have other shapes, and those skilled in the art should understand that the structure of the bracket 1050 is not a limitation of the present invention.
  • bracket 1050 is extended downwardly and connected to the circuit board main body 10122, for example, but not limited to, to the circuit board main body 10122 by glue.
  • the non-photosensitive region 101212 of the photosensitive chip 10121 is integrally packaged by the encapsulation portion 1011, and at least a portion of the non-photosensitive region 101212 is not integrated with the encapsulation portion 1011.
  • the non-photosensitive area 101212 that is not integrally encapsulated by the encapsulation portion 1011 corresponds to an extended position of the bracket 1050.
  • the circuit component 10123 is disposed on the back side of the circuit board body 10122.
  • a plurality of the circuit elements 10123 are attached to the back surface of the wiring board main body 10122 at intervals. That is, the circuit component 10123 may not be disposed on the front side of the circuit board main body 10122, that is, may not be disposed around the photosensitive chip 10121, thereby eliminating the need for the front side of the circuit board.
  • the surrounding area of the photosensitive chip reserves the mounting position of the circuit component 10123, thereby reducing the length and width of the circuit board main body 10122, thereby reducing the length and width of the camera module, so that the camera module can It is applied to the electronic device that seeks to be thin and light.
  • the circuit component 10123 is disposed on the back surface of the circuit board main body 10122, that is, the circuit component 10123 may be disposed at a position opposite to the photosensitive chip 10121 on the back surface of the circuit board main body 10122, thereby
  • the circuit element 10123 can be set in a greatly increased area.
  • the circuit component 10123 When the circuit component 10123 is disposed on the front surface of the circuit board main body 10122, it can only be disposed around the photosensitive chip 10121, so the area of the circuit board main body 10122 is required to be large, and the In the encapsulation portion 1011, the encapsulation portion 1011 needs to cover the circuit component 10123, so the area that must be formed is large, which limits the possibility that the photosensitive component 1010 and the camera module are reduced in size to some extent. Sex.
  • a photosensitive element 1010 according to a modified embodiment of the twelfth preferred embodiment of the present invention, the circuit component 10123 is disposed on a back surface of the circuit board main body 10122, and the encapsulation portion 1011 covers the Circuit element 10123.
  • the encapsulation portion 1011 includes a lower cladding portion 10115, and the lower cladding portion 10115 is disposed on a rear surface of the wiring board main body 10122.
  • the covering portion 10115 is integrally formed on the back surface of the wiring board main body 10122 so as to cover the circuit component 10123 located on the back surface of the wiring board main body 10122, so that the circuit components are stably disposed.
  • the lower cladding portion 10115 may be integrally formed with the cladding segment 10111, the filter mounting segment 10112, etc. located above the circuit board body 10122. It can also be set separately. That is, the lower cladding portion 101115 may be formed once on the back surface of the circuit board main body 10122 after being molded once on the circuit board main body 10122. It should be understood by those skilled in the art that the lower portion is The manner in which the covering portion 10115 is formed and the size of the molding region are not limited by the present invention.
  • the circuit board main body 10122 includes a first board body 101223 and a second board body 101224.
  • the first board body 101223 is electrically connected to the second board body 101224.
  • the first plate body 101223 is electrically connected to the second plate body 101224 through a conductive medium 101225.
  • the conductive medium 101225 is exemplified by, but not limited to, an anisotropic conductive paste.
  • the first plate 101223 may be a hard plate
  • the second plate 101224 may be a soft plate.
  • the photosensitive chip 10121 is disposed on the first plate body 101223, and the package portion 1011 at least partially integrally encapsulates the first plate body 101223 and at least a portion of the non-photosensitive area of the photosensitive chip 10121.
  • the photosensitive chip 10121 is electrically connected to the first plate body 101223 through the connecting wire 10124.
  • the second plate body 101224 is overlapped with the front surface of the first plate body 101223, and is electrically connected to the first plate body 101223 by the conductive medium 101225.
  • the second plate body 101224 may be spliced to the first plate body 101223 and electrically connected to the first plate body 101223 through the conductive medium 101225.
  • the second plate body 101224 may be coupled to the back surface of the first plate body 101223 and electrically connected to the first plate body 101223 through the conductive medium 101225.
  • the package portion 1011 may be integrally molded to the first plate body 101223, and then the first plate body 101223 and the second plate may be electrically connected. Body 101224. In another aspect, the first plate body 101223 and the second plate body 101224 may be first electrically connected, and then the package portion 1011 is integrally formed on the first plate body 101223.
  • the encapsulation portion 1011 may be integrally formed at a connection position of the first plate body 101223 and the second plate body 101224, thereby the first plate body 101223 and the first The second plate body 101224 is stably fixed, and it should be understood by those skilled in the art that the connection manner of the first plate body 101223 and the second plate body 101224 and the molding position of the package portion 1011 are not the present invention. limit.
  • the photosensitive member 1010 includes a protective layer 10127, and the protective layer 10127 is disposed on the wiring board main body 10122 such that the surface of the wiring board main body 10122 is flat and manufactured. The board body 10122 is protected during the process.
  • the circuit board main body 10122 includes a substrate 1227 and at least one circuit 1228, and the circuit 1228 is disposed on the substrate 1227.
  • the protective layer 10127 covers the circuit to protect the circuit and fill the rugged regions of the substrate 1227 formed on the surface of the substrate 1227.
  • the protective layer 10127 may be extended to an edge position of the substrate to facilitate the manufacture of the photosensitive member, buffering and supporting the molding die, thereby protecting the circuit board main body 10122, and preventing the molding die from being closed during molding.
  • the pressing force is applied to damage the main body of the circuit board.
  • the protective layer may be disposed on the circuit board main body 10122 after the photosensitive chip 10121 is mounted, or the protective layer 10127 may be disposed on the circuit board main body. Then, the photosensitive chip 10121 is attached.
  • a medium such as ink may be applied to the wiring board main body 10122 to form the protective layer on the wiring board main body 10122 by a medium such as ink.
  • the thickness of the protective layer 10122 and the set area are set as desired.
  • the protective layer 10127 may be disposed in a surrounding area of the photosensitive chip 10121.
  • the photosensitive chip 10121 is mounted on the circuit board main body 10122, and the photosensitive chip 10121 is electrically connected to the circuit board main body 10122 through the connecting wire 10124, and then around the photosensitive chip.
  • the main body region of the wiring board is coated with a medium such as ink to form the protective layer.
  • the protective layer 10127 may be disposed on at least a portion of the non-photosensitive region 101212 of the photosensitive chip to facilitate protection of the photosensitive chip 10121. That is, when the package portion 1011 is formed by the molding die, the molding die may not be directly in contact with the wiring board main body 10122 and the photosensitive chip 10121, but be supported by the protective layer 10127, thereby The wiring board main body 10122 and the photosensitive chip 10121 are protected.
  • Providing the protective layer 10127 on the circuit board main body 10122 and/or the photosensitive chip 10121 brings many advantages, such as, but not limited to, first, filling the uneven area of the circuit board main body 10121, thereby making The surface of the circuit board main body 10121 is flat, which facilitates the integral molding of the encapsulation portion 1011. Secondly, when the encapsulation portion 1011 is formed by the molding die, the molding die is buffered and supported, and the molding die pair is reduced. The punching action of the circuit board main body 10121 and/or the photosensitive chip; thirdly, the protective layer has elasticity, and is in contact with the edge of the molding die to prevent overflow of the molding material during molding.
  • the protective layer 10127 is elastically superior to the encapsulation portion 1011 and the wiring board main body 10122, the encapsulation portion 1011 and the wiring are flexibly buffered.
  • the interaction force between the board main bodies 10122 makes the circuit board main body 10122 not easily detached from the package portion 1011 due to factors such as ambient temperature, and avoids affecting other parts.
  • the arrangement of the protective layer 10127 has many other advantages, which are not enumerated here. It is worth mentioning that the elasticity is compared between the encapsulation portion 1011 and the circuit board main body 10122, and does not affect the imaging quality of the camera module.
  • each camera module of the above preferred embodiment may constitute an array of camera modules.
  • the array camera module includes at least two camera modules 10100, and each of the camera modules 10100 cooperates to realize image collection of the array camera module, and each of the camera modules 10100 is independent.
  • each of the camera modules 10100 is independent of each other and assembled by an outer frame 10400.
  • the components of each of the camera modules 10100 are not connected to each other and can be freely combined.
  • Each of the camera modules 10100 can be fixed to the outer frame body 10400 by glue bonding.
  • the camera module 10100 of each of the above preferred embodiments and each of the photosensitive components 1010 and the groups of features in the embodiments can be used to assemble the array camera module, and is not limited to the manner shown in the figure.
  • each camera module 10100 of the above preferred embodiment may constitute another array of camera modules.
  • the array camera module includes at least two camera modules 10100, and each of the camera modules 10100 cooperates to realize image collection of the array camera module, and each of the camera modules 10100 is connected to each other.
  • circuit board bodies 10122 of the camera modules 10100 are connected to each other to form an integrated circuit board body, so that a common connector can be disposed.
  • the encapsulation portions 1011 of each of the camera modules 10100 are integrally connected to form a connected package portion.
  • the two package parts 1011 are integrally formed on each of the circuit board main body 10122 and each of the photosensitive chips 10121, so that the two camera modules 10100 are described.
  • the photosensitive members 1010 are connected to each other.
  • brackets 1050 of each of the camera modules are integrally connected to form a joint bracket to facilitate connecting the photosensitive members 1010 through the joint brackets.
  • a dual camera array camera module composed of two camera modules 100 is taken as an example, and in the other embodiments of the invention, more camera modules 100 may be included. For example, three or more, those skilled in the art should understand that the number of the camera module 100 is not a limitation of the present invention.
  • the camera module 10100 can be applied to an electronic device body 200 to form an electronic device 300 having an image capturing function in cooperation with the electronic device body 200.
  • the electronic device 300 is embodied as a smartphone.
  • the electronic device body 200 is implemented as a smart phone in FIG. 1B, in other examples of the present invention, the electronic device body 200 can also be implemented as a tablet computer, a notebook computer, a camera, a personal digital assistant, and an electronic device. Any electronic device that can be configured with the camera module 10100, such as a book, MP3/4/5, and the like. Of course, those skilled in the art should understand that it is also possible to configure the camera module 10100 on a conventional home appliance such as a refrigerator, a washing machine, a television, or the like, or to configure the camera module 10100 on a security door, a wall, or the like. It is possible that the application environment and usage of the camera module 10100 should not be considered as limiting the content and scope of the camera module 10100 of the present invention.
  • FIG. 36A and 36B a comparison diagram of a camera module and a conventional camera module according to the above preferred embodiment of the present invention.
  • the left side represents a conventional camera module
  • the right side represents a camera module in the present invention.
  • the left side represents a conventional circuit board manufacturing process
  • the right side represents the photosensitive member manufacturing process of the present invention.
  • the photosensitive module and the camera module of the present invention have the following advantages:
  • the length and width of the camera module can be reduced, and the package part and the circuit component, such as the resistive container part, can overlap in space; the conventional solution bracket needs to be outside the capacitor, and a certain safety distance needs to be reserved, and the solution of the invention can Directly use the capacitor space to fill the plastic directly around the capacitor.
  • the traditional solution capacitor and the base need to reserve the safe space for assembly.
  • the molding process can be left unreserved and the module height can be reduced.
  • the traditional solution capacitor top distance bracket needs to reserve safety clearance to prevent interference.
  • the new scheme can be Fill the plastic directly around the capacitor.
  • the resistor and capacitor parts can be wrapped by molding, which can avoid the bad black spots of the module caused by the flux, dust and the like in the area of the container, and improve the product yield;
  • the photosensitive member of the present invention is more suitable for a large number of imposition operations. Based on the molding method of the photosensitive member of the present invention, the photosensitive member is more suitable for imposition work, and a large amount of photosensitive components can be manufactured at one time, for example, 80 to 90 can be achieved, and the conventional stent can only be used at most once. Production of eight.
  • the photosensitive component 2010 is used to assemble and manufacture the camera module.
  • the photosensitive member 2010 includes a package portion 2011 and a photosensitive portion 2012, and the package portion 2011 is integrally and packagedly connected to the photosensitive portion 2012, for example
  • the molding method forms a unitary structure.
  • the photosensitive portion 2012 includes a circuit board main body 20122 and a photosensitive chip 20121, and the photosensitive chip 20121 is disposed on the circuit board main body 20122.
  • the photosensitive chip 20121 is moldedly connected to the wiring board main body 20122.
  • the package portion 2011 is molded to the photosensitive portion 2012 in a mold-on-chip (MOC).
  • the photosensitive portion 2012 includes a connection line and at least one circuit element 20123.
  • the connection line is preset to the circuit board body 20122, and the circuit component 20123 is electrically connected to the connection line and the photosensitive chip 20121 for the photosensitive operation process of the photosensitive chip 20121.
  • the circuit component 20123 is convexly disposed on the wiring board main body 20122.
  • the circuit component 20123 can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011 encapsulates the circuit component 20123 inside thereof, thus making the circuit component 20123 not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 20121 communicates, when the camera module is assembled, the circuit component 20123 is not contaminated with dust or the like, and does not affect the sensor chip 20121, unlike the circuit in the conventional camera module.
  • the manner in which the device is exposed is, for example, a container member, thereby preventing dust and debris from staying on the surface of the circuit component 20123 by molding and coating, avoiding contamination of the photosensitive chip 20121 and causing black spots on the camera module. unpleasant sight.
  • circuit component 20123 is exemplified by the circuit board main body 20122, and in other embodiments of the present invention, the circuit component 20123
  • the circuit board main body 20123 may be buried without protruding from the circuit board main body, and those skilled in the art will understand that the shape, type, and arrangement position of the circuit element 20123 are not limited by the present invention.
  • the encapsulation portion 2011 forms a through hole 201100 to provide a photosensitive path for the photosensitive chip 20121.
  • the encapsulation portion 2011 provides a light window to provide a light path for the photo sensor chip 20121 so that light passing through the lens 2030 (subsequently proposed) located above the encapsulation portion 2011 can reach the photosensitive light.
  • the chip 20121 is not blocked by the encapsulation portion 2011.
  • the photosensitive portion 2012 includes at least one connecting line 20124 for electrically connecting the photosensitive chip 20121 and the wiring board main body 20122.
  • the connection line 20124 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124 connects the photosensitive chip 20121 and the wiring board main body 20122 in an arc shape.
  • connection line 20124 is molded inside the encapsulation portion 2011, so that the connection line 20124 can be covered by the encapsulation portion 2011 without being directly exposed to the outside. Therefore, when the camera module is assembled, the connection line 20124 is not subjected to any touch damage, and the influence of environmental factors on the connection line 20124, such as temperature and humidity, is caused, so that the sensor chip 20121 is caused.
  • the communication connection with the board main body 20122 is stable, which is completely different from the prior art.
  • the bottom of the through hole 201100 of the encapsulation portion 2011 is inclined from the bottom to the top, and it is understood that the shape of the through hole 201100 in the present invention is not limited to this inclined shape.
  • the encapsulation portion 2011 has an inner side surface 201200, and the inner side surface 201200 surrounds the through hole 201100.
  • the inner side surface 201200 is obliquely disposed such that the through hole 201100 has an inclined shape that gradually increases from bottom to top.
  • the inner side surface 201200 has an inclination angle ⁇ , that is, an angle between the inclination direction of the inner side surface 201200 and the vertical direction.
  • the encapsulation portion 2011 encloses the circuit component 20123 and the connection line 20124, and has a camera module for protecting the circuit component 20123 and the connection line 20124 and obtaining better performance.
  • the package portion 2011 is not limited to wrapping the circuit component 20123 or the connection line 20124. That is, in other embodiments of the present invention, the package portion 2011 may be directly molded to the circuit board main body 20122 of the circuit component 20123 without protruding, or may be molded on the circuit component. 20123 outside, around and other different locations.
  • the photosensitive chip 20121 has a photosensitive area 201211 and a non-sensitive area 201212, and the non-photosensitive area A region 201212 surrounds the periphery of the photosensitive region 201211.
  • the photosensitive region 201211 is used for photoreceptive action, and the connecting line 20124 is connected to the non-photosensitive region 201212.
  • the encapsulation portion 2011 extends over the non-photosensitive region 201212 of the photoreceptor chip 20121, thereby laminating the photoreceptor chip 20121 to the circuit board main body by molding. 20122.
  • the molding on chip (MOC) enlarges the inward moldable range of the package portion 2011, so that the circuit board main body 20122 and the package portion 2011 can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the photosensitive member 2010, and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 2011 is convexly surrounding the outside of the photosensitive region 201211 of the photosensitive chip 20121.
  • the encapsulation portion 2011 is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 2010 is used to assemble the camera module, the photosensitive chip 20121 is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 20122, and the photosensitive chip 20121 is disposed on the circuit board main body 20122, and the photosensitive chip 20121 is passed.
  • the connecting wires 20124 are electrically connected, and then molded on the components of the circuit board main body 20122 and the photosensitive chip 20121 after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 2011, or the package portion 2011 is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 20122 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 2011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 2011 may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the photosensitive member 2010 is more suitable for the imposition operation, and a large amount of the photosensitive member 2010 is manufactured at a time, for example, up to 90
  • the conventional stent injection molding package that is, the mirror holder, needs to be painted with glue first, and generally only one can be placed at a time.
  • 4-8 pieces are generally produced at one time, and at most 32 pieces can be produced.
  • the encapsulation portion 2011 includes a cladding portion 20111 and a filter mounting portion 20112.
  • the filter mounting portion 20112 is integrally molded and integrally connected to the cladding portion 20111.
  • the filter mounting section 20112 is used to mount a filter 2020, that is, when the photosensitive component 2010 is used to assemble the camera module, the filter 2020 of the camera module It is mounted to the filter mounting section 20112 such that the filter 2020 is located on the photosensitive path of the photosensitive chip 20121 and does not require the provision of an additional filter mounting bracket.
  • the encapsulation portion 2011 has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 20112 can be made to have a good flatness by means of a mold-forming process. Therefore, the filter 2020 is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 20112 has a mounting slot 201121, and the mounting slot 201211 communicates with the through hole 201100 to provide sufficient installation space for the filter 2020, so that the filter 2020 It does not protrude from the top surface 201122 of the filter mounting section 20112. That is, the mounting groove 201121 is disposed at the upper end of the encapsulation portion 2011, so that the filter 2020 can be installed therein.
  • the filter 2020 is an infrared cut filter IRCF.
  • the mounting slot 201121 can be used to mount a filter, while in other implementations of the invention, the mounting slot 201121 can be used to mount the camera module.
  • the components of the motor or lens, etc. it will be understood by those skilled in the art that the use of the mounting slot 201121 is not a limitation of the present invention.
  • the inner wall of the encapsulation portion 2011 may be disposed according to the shape of the connecting line 20124, such as being inclined, so that the photosensitive chip 20121 can be received while covering the connecting line 20124. More light. It will be understood by those skilled in the art that the shape of the package portion 2011 is not a limitation of the present invention.
  • the photosensitive assembly 2010 includes a motor connection structure 2013 for connecting a motor 2040 of the camera module.
  • the motor 2040 has at least one motor pin 2041.
  • the motor connection structure 2013 includes at least one lead 20131, each of which is used to electrically connect the motor 2040 and the circuit board body 20122.
  • Each of the leads 20131 is electrically connected to the board main body 20122.
  • the lead wire 20131 is electrically connected to a connection circuit of the circuit board main body 20122.
  • the lead 20131 is disposed on the encapsulation portion 2011 and extends to the top end of the encapsulation portion 2011.
  • the lead 20131 includes a motor connection end 201311 exposed at the top end of the package portion 2011 for electrically connecting the pin 2041 of the motor 2040.
  • the lead wire 20131 may be disposed in an embedded manner when the package portion 2011 is formed.
  • components such as a drive motor are connected to the circuit board by providing separate wires, and the manufacturing process is relatively complicated, and the method of embedding the lead wire 20114 in the molding of the present invention can replace the conventional one. Processes such as motor welding and make the circuit connection more stable.
  • the lead 20131 is a wire embedded in the inside of the package portion 2011.
  • the motor pin 2041 may be connected to the motor connection end 201311 through a conductive adhesive, or may be connected to the motor connection end 201311 by soldering.
  • the buried position of the lead 20131 and the position of the motor connection end 201311 of the lead 20131 in the package portion 2011 can be set as needed.
  • the motor connection end 201311 of the lead 20131 may be disposed at a periphery of the encapsulation portion 2011, that is, a top surface of the encapsulation portion 2011, and the filter is mounted.
  • the top surface 201122 of the segment 20112 and in another embodiment of the present invention, the motor connection end 201311 may be disposed in the inner circumference of the encapsulation portion 2011, that is, the bottom surface of the mounting groove 201121 of the encapsulation portion 2011
  • different mounting positions of the motor 2040 can be provided.
  • the motor connection end 201311 is disposed on the peripheral top surface of the package portion 2011, when the motor 2040 needs to be mounted to the mounting slot 201121
  • the motor connection end 201311 is disposed on the inner circumference of the encapsulation portion 2011, that is, the bottom surface of the installation slot 201121.
  • the photosensitive chip 20121 is first mounted, and then the package portion 2011 is molded in the MOC manner on the wiring board main body 20122 and the photosensitive chip 20121.
  • the lead 20131 may be disposed inside the encapsulation portion 2011 in a buried manner at the time of molding, and the lead 20131 is electrically connected to the wiring board main body 20122, and the motor connection end of the lead 20131 is made 201311 is shown at the top of the package portion 2011 to facilitate connection to the pin 2041 of the motor 2040.
  • each of the pins 2041 of the motor 2040 is connected to the motor connection end 201311 of the lead 20131 by soldering, thereby
  • the motor 2040 is electrically connected to the circuit board body 20122, and a separate wire is required to connect the motor 2040 and the circuit board body 20122, and the length of the pin 2042 of the motor 2040 can be Reduced.
  • the buried position of the lead 20131 can be set as needed.
  • it can be disposed inside the encapsulation portion 2011 to hide the lead 20131.
  • the lead 20131 may be embedded in the surface of the package portion 2011. It will be understood by those skilled in the art that the position of the lead 20131 is not a limitation of the present invention.
  • the motor connection structure 2013 includes at least one lead slot 20133 for accommodating the pin 2041 of the motor 2040 of the camera module.
  • the lead slot 20133 is disposed at an upper end of the encapsulation portion 2011.
  • the motor connection structure 2013 includes at least one lead 20134 for electrically connecting the motor 2040 and the circuit board body 20122.
  • the lead 20134 is disposed on the encapsulation portion 2011 and extends upward to the bottom wall of the pin groove 20133 of the encapsulation portion 2011.
  • the lead 20134 includes a motor connection end 1341 exposed on the bottom wall of the pin slot 20133 of the encapsulation portion 2011 for electrically connecting the pin 2041 of the motor 2040.
  • the motor connection end 1341 can be implemented as a pad.
  • the lead 20134 can be implemented as a wire that is embedded inside the package portion 2011.
  • the photosensitive core 20121 is first attached, and then the package portion 2011 is molded in the MOC manner on the wiring board main body 20122 and the photosensitive chip 20121.
  • the lead slot 20133 of a predetermined length, and the lead wire 20134 may be disposed in a buried manner at the time of molding, and the lead wire 20134 is electrically connected to the circuit board main body 20122, and the lead wire 20134 is caused
  • the motor connection end 1341 is shown on the bottom wall of the pin slot 20133 of the encapsulation portion 2011 to facilitate connection to the pin 2041 of the motor 2040.
  • each of the pins 2041 of the motor 2040 is inserted into the lead groove 20133, and is connected to the lead 20134 by soldering.
  • the motor connection end 1341 such that the motor 2040 is electrically connected to the circuit board body 20122, and a separate wire is required to connect the motor 2040 and the circuit board body 20122, and the motor 2040 is caused
  • the pins 2042 can be stably connected to prevent externally undesired contact with the motor pins 2041.
  • the lead 20134 can be implemented as a wire that is embedded inside the package portion 2011.
  • the buried position of the lead 20134 can be set as needed.
  • it can be disposed inside the package portion 2011 to hide the lead 20134.
  • the lead 20134 may be embedded in the surface of the package portion 2011, and it will be understood by those skilled in the art that the position of the lead 20134 is not a limitation of the present invention.
  • the motor connection structure 2013 includes a lead slot 20135 for receiving the pin 2041 of the motor 2040 of the camera module.
  • the lead groove 20135 is provided in the package portion 2011.
  • the motor connection structure 2013 includes at least one circuit contact 20132, which is preset to the circuit board body 20122 and electrically connected to the connection line of the circuit board body 20122. Further, each of the lead slots 20135 extends from the top end of the package portion 2011 to the circuit board body 20122, and causes the circuit contacts 20132 to be displayed.
  • the motor pin 2041 is adapted to be inserted into the pin slot 20135 and may be soldered to the circuit contact 20132.
  • each of the circuit contacts 20132 is preset on the circuit board main body 20122, and then the photosensitive core 20121 is mounted, and then the circuit board main body 20122 and the On the sensor chip 20121, the package portion 2011 is molded in a MOC manner, and the lead slot 20135 of a predetermined length is preset, and the circuit contact 20132 is displayed through the pin slot 20135 to facilitate connection.
  • the pin 2041 of the motor 2040 For example, when the photosensitive module 2010 is used to assemble the camera module, each of the pins 2041 of the motor 2040 is inserted into the lead slot 20135, and is connected to the circuit board body 20122 by soldering.
  • the motor connection structure 2013 includes at least one engraving line 20136 for electrically connecting the connection line on the circuit board main body 20122, the photosensitive chip 20121, and a motor and the like.
  • the engraving line 20136 can be disposed by laser forming (LDS) in forming the encapsulation portion 2011.
  • LDS laser forming
  • the engraving line 20136 is disposed on the surface of the encapsulation portion 2011 by laser direct molding.
  • the engraving line 20136 may be formed by a process in which the encapsulation portion 2011 is provided with an engraving groove, and then an electric circuit is provided in the engraving groove by electroplating or plating.
  • the camera module may be an automatic focus model (AFM).
  • the camera module 20100 includes a photosensitive component 2010, a filter 2020, a motor 2040, and a lens 2030.
  • the filter 2020 is mounted to the photosensitive member 2010, and the lens 2030 is mounted to the motor 2040.
  • the motor 2040 is mounted on the photosensitive member 2010.
  • the filter 2020 is mounted to the mounting groove 201121 of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive member 2010.
  • the motor 2040 is mounted on the top end of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive member 2010. That is, the filter 2020 is mounted to the mounting groove of the package portion 2011, the lens 2030 is mounted to the motor 2040, and the motor 2040 is mounted at the top of the package portion 2011. .
  • the motor pin 2041 of the motor 2040 is electrically connected to the circuit contact 20132 of the photosensitive member, thereby being electrically connected to the circuit board body 20122 through the lead 20131.
  • the motor pin 2041 may be connected to the motor connection end 201311 of the lead 20131 through a conductive adhesive, or may be connected to the motor connection end 201311 by soldering.
  • soldering wires may be unnecessary to connect the motor 2040 and the circuit board main body 20122 of the photosensitive portion 2012, thereby reducing Motor welding process.
  • the manner in which the motor is connected to the motor 2040 is described in the manner that the lead 20131 is connected to the motor 2040, and in other embodiments of the present invention, it may be selected.
  • the motor connection structure 2013 of different manners is used to connect the motor 2040, for example, the manners exemplified in FIGS. 41A, 41B, and 41C are selected, that is, the corresponding different motor connection structures in the FIGS. 41A, 41B, and 41C are It may be combined with different photosensitive components to provide different motor connections, and those skilled in the art will appreciate that the manner shown in the figures is not a limitation of the present invention.
  • the camera module can be a Fix Focus Model (FFM).
  • the camera module 20100 includes a photosensitive component 2010, a filter 2020, and a lens 2030.
  • the filter 2020 is mounted to the photosensitive member 2010, and the lens 2030 is mounted on the photosensitive member 2010.
  • the filter 2020 is mounted to the mounting groove 201121 of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive member 2010.
  • the lens 2030 is mounted on top of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive member 2010. That is, the filter is mounted to the mounting groove, and the lens 2030 is mounted on the top end of the package portion 2011.
  • the lens 2030 is mounted on the top of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive component 2010, so that the encapsulation portion 2011 is equivalent to that in a conventional camera module.
  • the function of the bracket provides support and fixed position for the lens 2030, but the assembly is different from the conventional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 2011 is fixed to the circuit board main body 20122 by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the invention has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the package part 2011 and the circuit board main body 20122, thereby reducing the traditional camera module AA. Adjusting the reserved space, so that the thickness of the camera module is reduced; on the other hand, the package portion 2011 covers the circuit component 20123 and the connecting line 20124, so that the conventional bracket function and circuit component 20123 and the The connection lines 20124 can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the package portion 2011 having the support function can be set to a small range, thereby Further, a space in which the thickness of the camera module can be reduced is provided.
  • the encapsulation portion 2011 replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
  • the package portion 2011 covers the connection line 20124, and the package portion 2011 extends to the non-photosensitive region 201212 of the photosensitive chip 20121, so that the package portion 2011 can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the photosensitive module 2010A is used to assemble and manufacture the camera module 20100A, thereby obtaining a molded camera module.
  • the photosensitive member 2010A includes an encapsulation portion 2011A and a photosensitive portion 2012A, and the encapsulation portion 2011A is moldedly coupled to the photosensitive portion 2012A.
  • the photosensitive portion 2012A includes a wiring board main body 20122A and a photosensitive chip 20121A, and the photosensitive chip 20121A is disposed on the wiring board main body 20122A. According to this embodiment of the invention, the photosensitive chip 20121A is moldedly connected to the wiring board main body 20122A.
  • the photosensitive portion 2012A includes a connection line and at least one circuit component 20123A.
  • the connection line is preset to the circuit board body 20122A, and the circuit component 20123A is electrically connected to the connection line and the photosensitive chip 20121A for the photosensitive operation process of the photosensitive chip 20121A.
  • the circuit component 20123A is convexly disposed on the wiring board main body 20122A.
  • the circuit component 20123A can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011A encapsulates the circuit element 20123A inside thereof, thus making the circuit element 20123A not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 20121A communicates, when the camera module is assembled, the circuit component 20123A is not contaminated with dust or the like, and does not affect the sensor chip 20121A, which is different from the conventional camera module.
  • the circuit element 20123A is exposed to exist in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 20123A by molding and coating, thereby avoiding contamination of the sensor chip 20121A and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 2011A forms a through hole 201100A to facilitate providing a photosensitive path for the photosensitive chip 20121A.
  • the photosensitive portion 2012A includes at least one connecting line 20124A for electrically connecting the photosensitive chip 20121A and the wiring board main body 20122A.
  • the connection line 20124A may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124A connects the photosensitive chip 20121A and the wiring board main body 20122A in an arc shape.
  • the connecting wire 20124A is molded inside the encapsulating portion 2011A, so that the connecting wire 20124A can be coated by the encapsulating portion 2011A without being directly exposed to the outside, thereby assembling
  • the connection line 20124A is not subjected to any touch damage, and the influence of environmental factors on the connection line 20124A, such as temperature, is caused, so that the sensor chip 20121A and the circuit board are reduced.
  • the communication connection between the main body 20122A is stable, which is completely different from the prior art.
  • the encapsulation portion 2011A encloses the circuit component 20123A and the connection line 20124A, and has the aspects of protecting the circuit component 20123A and the connection line 20124A and obtaining a camera module with better performance.
  • the package portion 2011A is not limited to wrapping the circuit element 20123A or the connection line 20124A. That is, in other embodiments of the present invention, the package portion 2011A may be directly molded to the circuit board body 20122A of the circuit component 20123A that is not protruding, or may be molded to the circuit component. 20123A outside, around and other different locations.
  • the circuit board main body 20122A has an inner groove 201222A, and the photosensitive chip 20121A is disposed in the inner groove 201222A, so that the photosensitive chip 20121A and the circuit board
  • the relative height of the main body 20122A is lowered, so that when the encapsulation portion 2011A covers the photosensor chip 20121A, the height requirement for the encapsulation portion 2011A is reduced, thereby reducing the height of the camera module assembled by the photosensitive member 2010A.
  • the photosensitive chip 20121A has a photosensitive area 201211A and a non-photosensitive area 201212A, and the non-photosensitive area 201212A surrounds the periphery of the photosensitive area 201211A.
  • the photosensitive region 201211A is used for photoreaction, and the connecting line 20124A is connected to the non-photosensitive region 201212A.
  • the package portion 2011A extends over the non-photosensitive region 201212A of the photosensitive chip 20121A, thereby laminating the photosensitive chip 20121A to the circuit board body by molding. 20122A.
  • the molding on chip such as molding on chip (MOC)
  • the outer structural portion further reduces the length and width dimensions of the photosensitive member 2012A and reduces assembly by the same The length and width dimensions of the camera module.
  • the encapsulation portion 2011A is convexly surrounding the outside of the photosensitive region 201211A of the photosensitive chip 20121A, and in particular, the encapsulation portion 2011A is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 2010A is used to assemble the camera module, the photosensitive chip 20121A is sealed inside to form a closed inner space.
  • the encapsulation portion 2011A includes a cladding portion 20111A and a filter mounting portion 20112A, and the filter mounting portion 20112A is integrally molded integrally connected to the cladding portion 20111A, and the cladding portion 20111A is molded. Plastically connected to the circuit board body 20122A for covering the circuit component 20123A and the connection line 20124A.
  • the filter mounting section 20112A is used to mount a filter 2020A, that is, when the photosensitive component 2010A is used to assemble the camera module, the filter 2020A of the camera module is installed.
  • the filter mounting section 20112A is such that the filter 2020A is located on the photosensitive path of the photosensitive chip 20121A, and there is no need to provide an additional filter 2020A mounting bracket.
  • the encapsulation portion 2011A has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 20112A can be made to have good flatness by means of a mold-forming process. Therefore, the filter 2020A is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 20112A has a mounting slot 201121A, and the mounting slot 201121A communicates with the through hole 201100A to provide sufficient installation space for the filter 2020A, so that the filter 2020A It does not protrude from the top surface 201122A of the filter mounting section 20112A. That is, the mounting groove 201121A is disposed at the upper end of the encapsulation portion 2011A, so that the filter 2020A is stably attached to the encapsulation portion 2011A without protruding from the top end of the encapsulation portion 2011A.
  • the molded inner wall may be disposed according to the shape of the connecting line 20124, such as being inclined, so that the photosensitive chip 20121A can be received while covering the connecting line 20124A. More light. It will be understood by those skilled in the art that the shape of the package portion 2011A is not a limitation of the present invention.
  • the camera module can be an Automatic Focus Model (AFM).
  • the camera module includes a photosensitive component 2010A, a filter 2020A, a motor 2040A, and a lens 2030A.
  • the filter 2020A is mounted to the photosensitive member 2010A
  • the lens 2030A is mounted to the motor 2040A
  • the motor 2040A is mounted on the photosensitive member 2010A.
  • the filter 2020A is mounted to the mounting groove 201121A of the filter mounting section 20112A of the encapsulation portion 2011A of the photosensitive member 2010A.
  • the motor 2040A is mounted on the top end of the filter mounting section 20112A of the encapsulation portion 2011A of the photosensitive member 2010A. That is, the filter 2020A is mounted to the mounting groove 201121A of the package portion 2011A, the lens 2030A is mounted to the motor 2040A, and the motor 2040A is mounted to the package portion 2011A. top.
  • the motor 2040A is electrically connected to the photosensitive component 2010A through the motor connection structure 2013, and the motor pin 2041A of the motor 4A0 is electrically connected to the circuit contact 20132 of the photosensitive component 2010, thereby
  • the lead plate 20131 is electrically connected to the circuit board main body 20122.
  • the motor pin 2041 may be connected to the motor connection end 201311 of the lead 20131 through a conductive adhesive film, or may be connected to the motor connection end 201311 by soldering.
  • the solder wire may be omitted to connect the horse 2040A and the circuit board body 20122 of the photosensitive portion 2012, Thereby reducing the process of motor welding.
  • the manner in which the motor is connected to the motor 2040A is described in the manner that the lead 20131 is connected to the motor 2040A, and in other embodiments of the present invention, it may be selected.
  • Different ways of the motor connection structure 2013 are used to connect the motor 2040A, for example, the manners exemplified in FIGS. 41A, 41B, and 41C are selected, that is, the corresponding different motor connection structures in the 41A, 41B, and 41C can be It is combined with the photosensitive member 2010A in this embodiment to provide different motor connection modes, and those skilled in the art should understand that the manner shown in the drawings is not a limitation of the present invention.
  • the photosensitive component 2010A can also be assembled into a fixed focus camera module, and those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.
  • the photosensitive member 2010B is used for assembling and manufacturing the camera module, thereby obtaining a molded camera module.
  • the photosensitive member 2010B includes a package portion 2011B and a photosensitive portion 2012B, and the package portion 2011B is moldedly connected to the photosensitive portion 2012B.
  • the photosensitive portion 2012B includes a wiring board main body 20122B and a photosensitive chip 20121B, and the photosensitive chip 20121B is disposed on the wiring board main body 20122B. According to this embodiment of the invention, the photosensitive chip 20121B is moldedly connected to the wiring board main body 20122B.
  • the photosensitive portion 2012B includes a connection line and at least one circuit element 20123B.
  • the connection line is preset to the circuit board body 20122B, and the circuit element 20123B is electrically connected to the connection line and the photosensitive chip 20121B for the photosensitive operation process of the photosensitive chip 20121B.
  • the circuit component 20123B is convexly disposed on the wiring board main body 20122B.
  • the circuit component 20123B can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011B encapsulates the circuit element 20123B inside thereof, thus making the circuit element 20123B not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 20121B communicates, when the camera module is assembled, the circuit component 20123B is not contaminated with dust or the like, and does not affect the sensor chip 20121B, which is different from the conventional camera module.
  • the circuit element 20123B is exposed to exist in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 20123B by molding and coating, thereby avoiding contamination of the sensor chip 20121B and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 2011B forms a through hole 201100B to facilitate providing a photosensitive path for the photosensitive chip 20121B.
  • the photosensitive portion 2012B includes at least one connecting line 20124B for electrically connecting the photosensitive chip 20121B and the wiring board main body 20122B.
  • the connection line 20124B may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124B connects the photosensitive chip 20121B and the wiring board main body 20122B in an arc shape.
  • the connecting wire 20124B is molded inside the encapsulating portion 2011B, so that the connecting wire 20124B can be covered by the encapsulating portion 2011B without being directly exposed to the outside, thereby assembling
  • the connection line 20124B is not subjected to any touch damage, and the influence of environmental factors on each of the connection lines 20124B, such as temperature and humidity, such that the sensor chip 20121B and the The communication connection between the board main bodies 20122B is stable, which is not provided at all in the prior art.
  • the encapsulation portion 2011B encloses the circuit component 20123B and the connection line 20124B, and has the aspects of protecting the circuit component 20123B and the connection line 20124B and the camera module having better performance.
  • the package portion 2011B is not limited to wrapping the circuit element 20123B or the connection line 20124B. That is, in other embodiments of the present invention, the package portion 2011B may be directly molded to the circuit board main body 20122B of the circuit element 20123B without protrusion, or may be molded on the circuit element. 20123B outside, around and other different locations.
  • the photosensitive chip 20121B has a photosensitive region 201211B and a non-photosensitive region 201212B, and the non-photosensitive region 201212B surrounds the periphery of the photosensitive region 201211B.
  • the photosensitive region 201211B is used for photoreceptive action, and the connecting line 20124B is connected to the non-photosensitive region 201212B.
  • the package portion 2011B extends over the non-photosensitive region 201212B of the photosensitive chip 20121B, thereby laminating the photosensitive chip 20121B to the circuit board body by molding. 20122B.
  • the molding on chip (MOC) enlarges the inward moldable range of the package portion 2011B, so that the circuit board main body 20122B and the package portion 2011B can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the molded photosensitive member 2012B and reduces the length and width dimensions of the image pickup module assembled therefrom.
  • the encapsulation portion 2011B is convexly surrounding the outside of the photosensitive region 201211B of the photosensitive chip 20121B, and in particular, the encapsulation portion 2011B is integrally closedly connected such that the encapsulation portion With There is good sealing property, so that when the photosensitive member 2010B is used to assemble the camera module, the photosensitive chip 20121B is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 20122B, and the photosensitive chip 20121B is disposed on the circuit board main body 20122B, and the photosensitive chip 20121B is passed.
  • the connecting wires 20124B are electrically connected, and then molded on the components of the circuit board main body 20122B and the photosensitive chip 20121B after preliminary assembly, such as an injection molding machine, which performs an SMT process by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 2011B, or the package portion 2011B is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 20122B may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 2011B is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 2011B may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the top surface of the encapsulation portion 2011B is flat, and is suitable for mounting a filter 2020B, that is, when the photosensitive member 2010B is used to assemble the camera module, the filter of the camera module 2020B is mounted on the top end surface of the encapsulation portion 2011B such that the filter 2020B is located on the photosensitive path of the photoreceptor chip 20121B, and it is not necessary to provide an additional filter mounting bracket. That is to say, the encapsulation portion 2011B has the function of a conventional bracket here, but based on the advantage of the molding process, the mold top 2011B can be made to have good flatness by means of a mold-forming process, thereby making the The filter 2020B is mounted flat, which is also superior to the conventional camera module.
  • the photosensitive portion 2012B of the photosensitive member 2010B includes a reinforcing layer 20125B, and the reinforcing layer 20125B is laminatedly connected to the wiring board main body.
  • the 20122B bottom layer is used to enhance the structural strength of the circuit board main body 20122B. That is, the reinforcement layer 20125B is placed on the underlayer of the package portion 2011B and the region where the photosensitive chip 20121B is located on the circuit board main body 20122B, so that the circuit board main body 20122B stably and reliably supports the package. Part 2011B and the sensor chip 20121B.
  • the reinforcement layer 20125B is a metal plate attached to the bottom layer of the circuit board main body 20122B, increasing the structural strength of the circuit board main body 20122B, and on the other hand, adding the photosensitive member 2010B The heat dissipation performance can effectively dissipate the heat generated by the photosensitive chip 20121B.
  • the circuit board main body 20122B can adopt an FPC (Flex Print Circuit), and the rigidity of the FPC is enhanced by the reinforcement layer 20125B, so that the FPC with good bending performance can be The load bearing requirements of the photosensitive member 2010B are satisfied. That is to say, the circuit board body 20122B has a wider range of options, such as PCB (Printed Circuit Board), FPC, RF (Rigid Flex, soft and hard board).
  • FPC Flexible Print Circuit
  • the structural strength of the wiring board main body 20122B is increased by the reinforcement layer 20125B and the heat dissipation performance is improved, so that the thickness of the wiring board main body 20122B can be reduced, so that the height of the photosensitive member 2010B is further reduced, and assembled by the same The height of the obtained camera module is reduced.
  • the reinforcement layer 20125 is superimposed on the circuit board body 20122B in a plate shape, and in other embodiments of the invention, the reinforcement layer 20125B may be extended to The side wall of the encapsulation portion 2011B is wrapped, thereby enhancing the anti-electromagnetic interference capability while enhancing the structural strength of the photosensitive member 2010B.
  • the inner wall of the encapsulation portion may be disposed according to the shape of the connecting line 20124, such as being inclined, so that the photosensor chip 20121B can be received while covering the connection line 20124B. More light. It will be understood by those skilled in the art that the shape of the package portion 2011B is not a limitation of the present invention.
  • the camera module can be a Fix Focus Model (FFM).
  • FFM Fix Focus Model
  • the camera module includes a photosensitive member 2010B, one of the Filter 2020B and a lens 2030B.
  • the filter 2020B is mounted to the photosensitive member 2010B, and the lens 2030B is mounted on the photosensitive member 2010B.
  • the filter 2020B is mounted on the top end of the package portion 2011B of the photosensitive member 2010B.
  • the lens 2030B is press-fitted to the top end of the package portion 2011B of the photosensitive member 2010B.
  • the specific mounting position of the filter 2020B and the lens 2030B at the encapsulation portion 2011B can be coordinated according to specific needs.
  • the lens 2030B is mounted on the top end of the encapsulation portion 2011B of the photosensitive component 2010B, so that the encapsulation portion 2011B is equivalent to the function of the bracket in the conventional camera module, and is the lens
  • the 2030B provides support and fixed position, but assembly is different from traditional COB processes.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 2011B is fixed to the circuit board main body 20122B by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the package portion 2011B covers the circuit component 20123B and the connecting wire 20124B, so that the conventional bracket function and circuit component 20123B and the The connection line 20124B can be spatially overlapped, and does not need to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the package portion 2011B having the bracket function can be set in a small range, thereby Further, a space in which the thickness of the camera module can be reduced is provided.
  • the package portion 2011B replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
  • the package portion 2011B covers the connection line 20124B, and the package portion 2011B extends to the non-photosensitive region 201212B of the photosensitive chip 20121B, so that the package portion 2011B can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the camera module can be a moving focus camera module.
  • the camera module includes a photosensitive component 2010B, a filter 2020B, a motor 2040B, and a lens 2030B.
  • the filter 2020B is mounted to the photosensitive member 2010B
  • the lens 2030B is mounted to the motor 2040B
  • the motor 2040B is mounted on the photosensitive member.
  • the filter 2020B is mounted on the top end of the package portion 2011B of the photosensitive member 2010B.
  • the motor 2040B is mounted on the top end of the package portion 2011B of the photosensitive member 2010B.
  • the specific installation position of the filter 2020B and the motor 2040B at the encapsulation portion 2011B can be coordinated according to specific needs.
  • the motor 2040B is electrically connected to the photosensitive component 2010B through the motor connection structure 2013, and the motor pin 2041B of the motor 2040B is electrically connected to the circuit contact 20132 of the photosensitive component 2010, thereby
  • the lead plate 20131 is electrically connected to the circuit board main body 20122.
  • the motor pin 2041B may be connected to the motor connection end 201311 of the lead 20131 through a conductive adhesive film, or may be connected to the motor connection end 201311 by soldering.
  • the solder wire may be omitted to connect the horse 2040B and the circuit board body 20122 of the photosensitive portion 2012, Thereby reducing the process of motor welding.
  • the manner in which the motor is connected to the motor 2040B is described in the manner that the lead 20131 is connected to the motor 2040B, and in other embodiments of the present invention, it may be selected.
  • the motor connection structure 2013 of different manners is used to connect the motor 2040B, for example, the manners exemplified in FIGS. 41A, 41B, and 41C are selected, that is, the corresponding different motor connection structures of the 41A, 41B, and 41C may be In combination with the photosensitive member 2010B in this embodiment, thereby providing different motor connection modes, it will be understood by those skilled in the art that The manner shown in the figures is not a limitation of the invention.
  • the photosensitive member 2010C is used for assembling and manufacturing the camera module, thereby obtaining a molded camera module.
  • the photosensitive member 2010C includes an encapsulation portion 2011C and a photosensitive portion 2012C, and the encapsulation portion 2011C is moldedly coupled to the photosensitive portion 2012C.
  • the photosensitive portion 2012C includes a wiring board main body 20122C and a photosensitive chip 20121C, and the photosensitive chip 20121C is disposed on the wiring board main body 20122C. According to this embodiment of the invention, the photosensitive chip 20121C is moldedly connected to the wiring board main body.
  • the photosensitive portion 2012C includes a connection line and at least one circuit component 20123C.
  • the connection line is preset to the circuit board body 20122C, and the circuit component 20123C is electrically connected to the connection line and the photosensitive chip 20121C for the photosensitive operation process of the photosensitive chip 20121C.
  • the circuit component 20123C is convexly disposed on the circuit board main body 20122C.
  • the circuit component 20123C can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011C encapsulates the circuit element 20123C inside thereof, thus making the circuit element 20123C not directly exposed to the space, more specifically, not exposed to the In the environment in which the sensor chip 20121C communicates, when the camera module is assembled, the circuit component 20123C is not contaminated with dust or the like, and does not affect the sensor chip 20121C, which is different from the conventional camera module.
  • the circuit element 20123C is exposed in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 20123C by molding and coating, thereby avoiding contamination of the sensor chip 20121C and causing blackout of the camera module. Points and other undesirable phenomena.
  • the encapsulation portion 2011C forms a through hole 201100C to facilitate providing a photosensitive path for the photosensitive chip 20121C.
  • the photosensitive portion 2012C includes at least one connecting line 20124C for electrically connecting the photosensitive chip 20121C and the wiring board main body 20122C.
  • the connection line 20124C may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124C connects the photosensitive chip 20121C and the wiring board main body 20122C in an arc shape.
  • the connecting wire 20124C is molded inside the encapsulating portion 2011C, so that the connecting wire 20124C can be covered by the encapsulating portion 2011C without being directly exposed to the outside, thereby
  • the connection line 20124C is not subjected to any touch damage, and the influence of environmental factors on each of the connection lines 20124C, such as temperature and humidity, is caused, so that the sensor chip 20121C and the The communication connection between the board main body 20122C is stable, which is not provided at all in the prior art.
  • the encapsulation portion 2011C encloses the circuit component 20123C and the connection line 20124C, and has a camera module for protecting the circuit component 20123C and the connection line 20124C and obtaining better performance.
  • the package portion 2011C is not limited to covering the circuit element 20123C or the connection line 20124C. That is, in other embodiments of the present invention, the package portion 2011C may be directly molded to the circuit board body 20122C of the circuit component 20123C that is not protruding, or may be molded to the circuit component. 20123C outside, around and other different locations.
  • the photosensitive chip 20121C has a photosensitive region 201211C and a non-photosensitive region 201212C, and the non-photosensitive region 201212C surrounds the periphery of the photosensitive region 201211C.
  • the photosensitive region 201211C is used for photoreceptive action, and the connecting line 20124C is connected to the non-photosensitive region 201212C.
  • the package portion 2011C extends over the non-photosensitive region 201212C of the photosensitive chip 20121C, thereby laminating the photosensitive chip 20121C to the circuit board body by molding. 20122C.
  • the molding on the chip enlarges the inward moldable range of the package portion 2011C, so that the circuit board main body 20122C and the package portion 2011C can be reduced.
  • the outer structural portion further reduces the length and width dimensions of the photosensitive member and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 2011C is convexly surrounding the outside of the photosensitive region 201211C of the photosensitive chip 20121C, and in particular, the encapsulation portion 2011C is integrally closedly connected such that the encapsulation portion With There is good sealing property, so that when the photosensitive member 2010C is used to assemble the camera module, the photosensitive chip 20121C is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 20122C, and the photosensitive chip 20121C is disposed on the circuit board main body 20122C, and the photosensitive chip 20121C is passed.
  • the connecting wire 20124C is electrically connected, and then molded on the circuit board main body 20122C and the photosensitive chip 20121C component after preliminary assembly, such as an injection molding machine, and an SMT process is performed by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 2011C, or the package portion 2011C is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 20122C may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), a flexible wiring board (FPC), and the like.
  • the manner in which the encapsulation portion 2011C is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 2011C may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the photosensitive member 2010C further includes a filter 2020C, which is molded and laminated on the photosensitive chip 20121C.
  • the edge of the filter 2020C is molded to the encapsulation portion 2011C, thereby fixing the filter 2020C.
  • the filter 2020C covers the photosensitive chip 20121C, and isolates the photosensitive chip 20121C from the external environment to protect the photosensitive chip 20121C from damage and prevent the entry of dust.
  • the photosensitive chip 20121C is attached to the wiring board main body 20122C, and the photosensitive chip 20121C and the wiring board main body 20122C are connected, and the filter is further
  • the light sheet 2020C is attached to the photosensitive chip 20121C, and further, the wiring board main body 20122C and the photosensitive chip 20121C and the filter 2020C are molded to form the package portion 2011C.
  • the filter 2020C is overlaid on the photosensitive chip 20121C, damage of the molded mold to the photosensitive chip 20121C can be prevented, and the filter 2020C and the photosensitive chip are The distance of 20121C is reduced, so that the back focal length of the camera module assembled therefrom can be reduced, thereby reducing the height of the camera module, and on the other hand, since there is no need to provide additional support for the filter 2020C The components, therefore also to some extent, further reduce the thickness of the camera module.
  • the inner wall of the encapsulation portion 2010C may be disposed according to the shape of the connection line 20124, such as being inclined, so that the photosensor chip 20121C can be received while covering the connection line 20124C. More light. It will be understood by those skilled in the art that the shape of the package portion 2011C is not a limitation of the present invention.
  • the camera module can be a certain focus module.
  • the camera module 20100C includes a photosensitive component 2010C and a lens 2030C.
  • the lens 2030C is mounted on the photosensitive component 2010C and assembled to form the camera module.
  • the lens 2030C can be fixed to the top end of the encapsulation portion 2011C of the photosensitive member 2010C by bonding, and the top end of the encapsulation portion 2011C is made by the characteristics of mold manufacturing in the molding process. Good flatness provides good mounting conditions for the lens 2030C, resulting in a high quality camera module.
  • the lens 2030C is mounted on the top end of the encapsulation portion 2011C of the photosensitive component 2010C, so that the encapsulation portion 2011C is equivalent to the function of the bracket in the conventional camera module, and the lens 2030C is Provide support, fixed position, but assembly is different from traditional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the package portion 2011C is fixed to the circuit board main body 20122C by a molding process, and the fixing process is not required, and the molding method is fixed relative to the bonding.
  • the package portion 2011C covers the circuit component 20123C and the connecting line 20124C, so that The conventional bracket function and circuit component 20123C and the connection line 20124C can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, thereby enabling the package portion 2011C having a bracket function.
  • the height can be set in a smaller range, thereby further providing a space in which the thickness of the camera module can be reduced.
  • the encapsulation portion 2011C replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
  • the package portion 2011C covers the connection line 20124C, and the package portion 2011C extends to the non-photosensitive region 201212C of the photosensitive chip 20121C, so that the package portion 2011C can be contracted inward, thereby further reducing the The lateral length and width of the camera module.
  • the photosensitive member 2010C molds the inside of the filter 2020C, so that when the camera module is assembled, it is not necessary to perform the process of attaching and installing the filter again, thereby reducing the assembly process of the camera module. Improve work efficiency, these are better than the existing technology.
  • the camera module 20100C can be an Automatic Focus Model (AFM).
  • the camera module includes a photosensitive component 2010C, a motor 2040C, and a lens 2030C.
  • the lens 2030C is mounted to the motor 2040C, and the motor 2040C is mounted on the photosensitive assembly 2010C to facilitate adjustment of the camera module focal length by the motor 2040C.
  • the motor 2040C is attached to the top end of the package portion 2011C of the photosensitive member 2010C.
  • the motor 2040C is electrically connected to the photosensitive component 2010C through the motor connection structure 2013, and the motor pin 2041C of the motor 2040C is electrically connected to the circuit contact 20132 of the photosensitive component 2010C, thereby
  • the lead plate 20131 is electrically connected to the circuit board main body 20122.
  • the motor pin 2041C may be connected to the motor connection end 201311 of the lead 20131 through a conductive adhesive film, or may be connected to the motor connection end 201311 by soldering.
  • the solder wire may be omitted to connect the horse 2040C and the circuit board body 20122 of the photosensitive portion 2012, Thereby reducing the process of motor welding.
  • the manner in which the motor is connected to the motor 2040C is described in the manner that the lead 20131 is connected to the motor 2040C, and in other embodiments of the present invention, it may be selected.
  • Different ways of the motor connection structure 2013 are used to connect the motor 2040C, for example, the manners exemplified in FIGS. 41A, 41B, and 41C are selected, that is, the corresponding different motor connection structures in the 41A, 41B, and 41C can be It is combined with the photosensitive member 2010C in the present embodiment to provide different motor connection modes, and those skilled in the art should understand that the manner shown in the drawings is not a limitation of the present invention.
  • the photosensitive member 2010F is used for assembling and manufacturing the camera module, thereby obtaining the camera module of the molding type.
  • the photosensitive member 2010F includes an encapsulation portion 2011F and a photosensitive portion 2012F, and the encapsulation portion 2011F is moldedly coupled to the photosensitive portion 2012F.
  • the photosensitive portion 2012F includes a circuit board main body 20122F and a photosensitive chip 20121F, and the photosensitive chip 20121F is disposed on the circuit board main body 20122F. According to this embodiment of the invention, the photosensitive chip 20121F is moldedly connected to the wiring board main body 20122F.
  • the photosensitive portion 2012F includes a connection line and at least one circuit element 20123F.
  • the connection line is preset to the circuit board body 20122F, and the circuit component 20123F is electrically connected to the connection line and the photosensitive chip 20121F for the photosensitive operation process of the photosensitive chip 20121F.
  • the circuit component 20123F is convexly disposed on the circuit board main body 20122F.
  • the circuit component 20123F can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011F encapsulates the circuit element 20123F inside thereof, thus making the circuit element 20123F not directly exposed to the space, more specifically, not exposed to the The environment in which the sensor chip 20121F communicates, so that when assembled as the camera module, the circuit component 20123F is not contaminated with dust and the like.
  • the dye does not affect the sensor chip 20121F, unlike the existing way in which the circuit component 20123F is exposed in the conventional camera module, such as a resistive container member, thereby preventing dust and debris from staying in the circuit by molding coating.
  • the surface of the component 20123F avoids contamination of the photosensitive chip 20121F and causes a bad phenomenon such as a black spot on the camera module.
  • the encapsulation portion 2011F forms a through hole 201100F to provide a photosensitive path for the photosensitive chip 20121F.
  • the photosensitive portion 2012F includes at least one connecting line 20124F for electrically connecting the photosensitive chip 20121F and the wiring board main body 20122F.
  • the connection line 20124F may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124F connects the photosensitive chip 20121F and the wiring board main body 20122F in an arc shape.
  • the connecting wire 20124F is molded inside the encapsulating portion 2011F, so that the connecting wire 20124F can be coated by the encapsulating portion 2011F without being directly exposed to the outside, thereby assembling
  • the connection line 20124F is not subjected to any touch damage, and the influence of environmental factors on each of the connection lines 20124F, such as temperature, is caused, such that the sensor chip 20121F and the circuit board are reduced.
  • the communication connection between the main body 20122F is stable, which is not provided at all in the prior art.
  • the encapsulation portion 2011F encloses the circuit component 20123F and the connection line 20124F, and has a camera module for protecting the circuit component 20123F and the connection line 20124F and obtaining better performance.
  • the encapsulation portion 2011F is not limited to encapsulating the circuit element 20123F or the connection line 20124F. That is, in other embodiments of the present invention, the package portion 2011F may be directly molded to the circuit board main body 20122F of the circuit component 20123F that is not protruding, or may be molded on the circuit component. 20123F outside, around and other different locations.
  • the photosensitive chip 20121F has a photosensitive area 201211F and a non-photosensitive area 201212F, and the non-photosensitive area 201212F surrounds the periphery of the photosensitive area 201211F.
  • the photosensitive region 201211F is used for photoreceptive action, and the connecting line 20124F is connected to the non-photosensitive region 201212F.
  • the package portion 2011F extends over the non-photosensitive region 201212F of the photosensitive chip 20121F, thereby laminating the photosensitive chip 20121F to the circuit board body by molding. 20122F.
  • the molding on chip such as molding on the chip, enlarges the inward moldable range of the package portion 2011F, so that the wiring board main body 20122F and the outer side of the package portion 2011F can be reduced.
  • the structural portion further reduces the length and width dimensions of the molded photosensitive portion 2012F and reduces the length and width dimensions of the camera module assembled therefrom.
  • the encapsulation portion 2011F is convexly surrounding the outside of the photosensitive region 201211F of the photosensitive chip 20121F, and in particular, the encapsulation portion 2011F is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 2010F is used to assemble the camera module, the photosensitive chip 20121F is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 20122F, and the photosensitive chip 20121F is disposed on the circuit board main body 20122F, and the photosensitive chip 20121F is passed.
  • the connecting wire 20124F is electrically connected, and then molded on the circuit board main body 20122F and the photosensitive chip 20121F component after preliminary assembly, such as an injection molding machine, and an SMT process is performed by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 2011F, or the package portion 2011F is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 20122F may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 2011F is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 2011F may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 2011F includes a cladding portion 20111F and a filter mounting portion 20112F.
  • the filter mounting portion 20112F is integrally molded and integrally connected to the cladding portion 20111F, and the cladding portion 20111F is molded.
  • Plastic connection The circuit board main body 20122F is for covering the circuit element 20123F and the connection line 20124F.
  • the filter mounting section 20112F is used to mount a filter 2020F, that is, when the photosensitive component 2010F is used to assemble the camera module, the filter 2020F of the camera module is installed.
  • the filter mounting section 20112F is such that the filter 2020F is located on the photosensitive path of the photosensitive chip 20121F, and there is no need to provide an additional filter 2020F mounting bracket.
  • the encapsulation portion 2011F has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 20112F can be made to have good flatness by means of a mold-forming process. Therefore, the filter 2020F is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 20112F has a mounting slot 201121F, and the mounting slot communicates with the through hole 201100F to provide sufficient installation space for the filter 2020F, so that the filter 2020F does not Will protrude from the top surface of the filter mounting section 20112F. That is, the mounting groove 201121F is disposed at the upper end of the encapsulation portion 2011F, so that the filter 2020F is mounted on the encapsulation portion 2011F and does not protrude from the top end of the encapsulation portion 2011F.
  • the inner wall of the encapsulation portion 2011F may be disposed according to the shape of the connecting line 20124F, such as being inclined, so that the photosensitive chip 20121F can be received while covering the connecting line 20124F. Wait for more light. It will be understood by those skilled in the art that the shape of the package portion 2011F is not a limitation of the present invention.
  • the circuit board main body 20122F has at least one reinforcement hole 201221F, and the encapsulation portion 2011F extends into the reinforcement hole 201221F, thereby enhancing the structural strength of the circuit board main body 20122F.
  • the two different materials are bonded to each other to form a composite structure, so that the structural strength of the wiring board main body 20122F as a base is enhanced.
  • the position of the reinforcement hole 201221F can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
  • the structural strength of the circuit board main body 20122F is enhanced by the arrangement of the reinforcing holes 201221F, so that the thickness of the circuit board main body 20122F can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the photosensitive member 2010F.
  • the reinforcing hole 201221F is in the shape of a groove, so that when the photosensitive member 2010F is manufactured, the molding material of the package portion 2011F is not protected by the reinforcing hole. 201221F leaked out.
  • the photosensitive member 2010F can be assembled into a fixed focus module or a moving focus module, and those skilled in the art should understand that the assembled application mode of the photosensitive member 2010F is not a limitation of the present invention. .
  • the photosensitive member 2010G is used for assembling and manufacturing the camera module, thereby obtaining the camera module of the molding type.
  • the photosensitive member 2010G includes a package portion 2011G and a photosensitive portion 2012G, and the package portion 2011G is moldedly connected to the photosensitive portion 2012G.
  • the photosensitive portion 2012G includes a wiring board main body 20122G and a photosensitive chip 20121G, and the photosensitive chip 20121G is disposed on the wiring board main body 20122G. According to this embodiment of the invention, the photosensitive chip 20121G is moldedly connected to the wiring board main body 20122G.
  • the photosensitive portion 2012G includes a connection line and at least one circuit element 20123G.
  • the connection line is preset to the circuit board body 20122G, and the circuit component 20123G is electrically connected to the connection line and the photosensitive chip 20121G for the photosensitive operation process of the photosensitive chip 20121G.
  • the circuit component 20123G is convexly disposed on the circuit board main body 20122G.
  • the circuit component 20123G can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.
  • the encapsulation portion 2011G encapsulates the circuit element 20123G inside thereof, thus making the circuit element 20123G not directly exposed to the space, more specifically, not exposed to the In the environment where the sensor chip 20121G communicates, when the camera module is assembled, the circuit component 20123G is not contaminated with dust or the like, and does not affect the sensor chip 20121G, which is different from the conventional camera module.
  • the circuit element 20123G is exposed in a manner such as a container member, thereby preventing dust and debris from staying on the surface of the circuit component 20123G by means of molding and coating, thereby avoiding contamination of the sensor chip 20121G and causing the camera module to become dirty. Points and other undesirable phenomena.
  • the encapsulation portion 2011G forms a through hole 201100G to facilitate providing a photosensitive path for the photosensitive chip 20121G.
  • the photosensitive portion 2012G includes at least one connecting line 20124G for electrically connecting the photosensitive chip 20121G and the wiring board main body 20122G.
  • the connection line 20124G may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like.
  • the connecting wire 20124G connects the photosensitive chip 20121G and the wiring board main body 20122G in an arc shape.
  • the connecting wire 20124G is molded inside the encapsulating portion 2011G, so that the connecting wire 20124G can be coated by the encapsulating portion 2011G without being directly exposed to the outside, thereby assembling
  • the connection line 20124G is not subjected to any touch damage, and the influence of environmental factors on the connection line 20124G, such as temperature and humidity, such that the sensor chip 20121G and the The communication connection between the board main body 20122G is stable, which is not provided at all in the prior art.
  • the encapsulation portion 2011G encloses the circuit component 20123G and the connection line 20124G, and has a camera module for protecting the circuit component 20123G and the connection line 20124G and obtaining better performance.
  • the package portion 2011G is not limited to covering the circuit element 20123G or the connection line 20124G. That is, in other embodiments of the present invention, the package portion 2011G may be directly molded to the circuit board main body 20122G of the circuit element 20123G without protrusion, or may be molded on the circuit element. 20123G outside, around and other different locations.
  • the photosensitive chip 20121G has a photosensitive area 201211G and a non-photosensitive area 201212G, and the non-photosensitive area 201212G surrounds the periphery of the photosensitive area 201211G.
  • the photosensitive region 201211G is used for photoreceptive action, and the connecting line 20124G is connected to the non-photosensitive region 201212G.
  • the package portion 2011G extends over the non-photosensitive region 201212G of the photosensitive chip 20121G, thereby laminating the photosensitive chip 20121G to the circuit board body by molding. 20122G.
  • the molding on chip such as molding on the chip, enlarges the inward moldable range of the package portion 2011G, so that the outer side of the wiring board main body 20122G and the package portion 2011G can be reduced.
  • the structural portion further reduces the length and width dimensions of the molded photosensitive portion 2012G and reduces the length and width dimensions of the image pickup module assembled therefrom.
  • the encapsulation portion 2011G is convexly surrounding the outside of the photosensitive region 201211G of the photosensitive chip 20121G, and in particular, the encapsulation portion 2011G is integrally closedly connected such that the encapsulation portion It has a good sealing property, so that when the photosensitive member 2010G is used to assemble the camera module, the photosensitive chip 20121G is sealed inside to form a closed inner space.
  • a conventional circuit board can be selected as the circuit board main body 20122G, and the photosensitive chip 20121G is disposed on the circuit board main body 20122G, and the photosensitive chip 20121G is passed.
  • the connecting wire 20124G is electrically connected, and then molded on the circuit board main body 20122G and the photosensitive chip 20121G component after preliminary assembly, such as an injection molding machine, and an SMT process is performed by a molding process (Surface Mount Technology)
  • the wiring board after the surface mount process is molded to form the package portion 2011G, or the package portion 2011G is formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 20122G may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the encapsulation portion 2011G is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the encapsulating portion 2011G may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the encapsulation portion 2011G includes a cladding portion 20111G and a filter mounting portion 20112G, and the filter mounting portion 20112G is integrally molded and integrally connected to the cladding portion 20111G, and the cladding portion 20111G is molded. Plastically connected to the circuit board body 20122G for covering the circuit component 20123G and the connection line 20124G.
  • the filter mounting section 20112G is used to mount a filter 2020G, that is, when the photosensitive component 2010G is used to assemble the camera module, the filter 2020G of the camera module is installed. In the filter mounting section 20112G, The filter 2020G is located on the photosensitive path of the photosensitive chip 20121G and does not require an additional filter 2020G mounting bracket.
  • the encapsulation portion 2011G has the function of a conventional bracket here, but based on the advantage of the molding process, the top of the filter mounting section 20112G can be made to have good flatness by means of a mold-forming process. Therefore, the filter 2020G is mounted flat, which is also superior to the conventional camera module.
  • the filter mounting section 20112G has a mounting slot 201121G, and the mounting slot 201121G communicates with the through hole 201100G to provide sufficient installation space for the filter 2020G, so that the filter 2020G Does not protrude from the top surface of the filter mounting section 20112G. That is, the mounting groove 201121F is disposed at the upper end of the encapsulation portion 2011F, so that the filter 2020F is mounted on the encapsulation portion 2011F and does not protrude from the top end of the encapsulation portion 2011F.
  • the inner wall of the encapsulation portion 2011G may be disposed according to the shape of the connection line 20124, such as being inclined, so that the photosensor chip 20121G can be received while covering the connection line 20124G. More light. It will be understood by those skilled in the art that the shape of the package portion 2011G is not a limitation of the present invention.
  • the circuit board main body 20122G has at least one reinforcement hole 201221G, and the encapsulation portion 2011G extends into the reinforcement hole 201221G, thereby enhancing the structural strength of the circuit board main body 20122G.
  • the two different materials are bonded to each other to form a composite structure, so that the structural strength of the wiring board main body 20122G as a base is enhanced.
  • the position of the reinforcing hole 201221G can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
  • the structural strength of the circuit board main body 20122G is enhanced by the arrangement of the reinforcing holes 201221G, so that the thickness of the circuit board main body 20122G can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the Heat dissipation performance of photosensitive component 2010G.
  • the reinforcing holes 201221G are perforated, that is, pass through the circuit board main body 20122G, so that both sides of the circuit board main body 20122G are connected, thereby manufacturing
  • the molding material of the encapsulation portion 2011G is sufficiently combined with the circuit board main body 20122G to form a more firm composite material structure, and the perforation is easier to process than the structure of the groove. Manufacturing.
  • the camera module 20100G includes a photosensitive member 2010G, a filter 2020G, a motor 2040G, and a lens 2030G.
  • the filter 2020G is mounted to the photosensitive member 2010G
  • the lens 2030G is mounted to the motor 2040G
  • the motor 2040G is mounted on the photosensitive member 2010G.
  • the filter 2020G is mounted to the mounting groove of the encapsulation portion 2011G of the photosensitive member 2010G.
  • the motor 2040G is mounted on a top end of the encapsulation portion 2011G of the photosensitive member 2010G.
  • the specific installation position of the filter 2020G and the motor 2040G at the encapsulation portion 2011G can be coordinated according to specific needs.
  • the motor 2040G is electrically connected to the photosensitive component 2010G through the motor connection structure 2013, and the motor pin 2041G of the motor 4G0 is electrically connected to the circuit contact 20132 of the photosensitive component 2010, thereby
  • the lead plate 20131 is electrically connected to the circuit board main body 20122.
  • the motor pin 2041G may be connected to the motor connection end 201311 of the lead 20131 through a conductive adhesive film, or may be connected to the motor connection end 201311 by soldering.
  • the solder wire may be omitted to connect the horse 2040G and the circuit board body 20122 of the photosensitive portion 2012, Thereby reducing the process of motor welding.
  • the manner in which the motor is connected to the motor 2040G is described in the manner that the lead 20131 is connected to the motor 2040G, and in other embodiments of the present invention, it may be selected.
  • the motor connection structure 2013 of different manners is used to connect the motor 2040G, for example, the manners exemplified in FIGS. 41A, 41B, and 41C are selected, that is, the corresponding different motor connection structures of the 41A, 41B, and 41C may be In combination with the photosensitive member 2010G in this embodiment, thereby providing different motor connection modes, it will be understood by those skilled in the art that The manner shown in the figures is not a limitation of the invention.
  • the photosensitive member 2010G can be assembled into a fixed focus module or a moving focus module, and those skilled in the art should understand that the assembly application mode of the photosensitive member 2010G is not a limitation of the present invention. .
  • the photosensitive member 2010 includes a shielding layer 20126I, and the shielding layer 20126I wraps the wiring board main body 20122 and the encapsulating portion 2011, thereby enhancing the structure of the wiring board main body 20122. At the same time as the strength, the electromagnetic interference resistance of the photosensitive member 2010 is enhanced.
  • the shielding layer 20126I is a metal layer and may be a plate structure or a mesh structure.
  • the molding process generally has two implementation forms, one is MOB (Molding On Board), which means that the package is formed only on the circuit board of the module; the other is MOC (Molding On Chip), that is to say The package portion is formed on the circuit board of the module and the photosensitive chip.
  • MOB Manufacturing On Board
  • MOC Manufacturing On Chip
  • the molding process generally has injection molding and molding from the standpoint of the equipment. Injection molding can also be divided into injection molding and die casting.
  • Injection molding machine (referred to as injection machine or injection molding machine) is the main molding equipment for making thermoplastic products or thermosetting materials into plastic products of various shapes by using plastic molding die. Injection molding is realized by injection molding machine and mold. Molding is the abbreviation of compression molding, also known as compression molding. A molding material such as a plastic or rubber compound is molded into an article by heating and pressurization in a closed cavity. Molding in the molding process is used in the present invention, but it will be understood by those skilled in the art that the present invention is not limited to the molding process, and other packaging processes, and the present invention is not limited thereto.
  • FIG. 60 shows a preferred embodiment of a camera module based on an integrated packaging process according to the present invention, which adopts an MOB process.
  • the camera module based on the integrated packaging process includes a package photosensitive component 3010, a filter 3020, a lens 3030, and a motor 3040.
  • the motor 3040 may not be present in other embodiments, such as in a fixed focus (FF) module, and the invention is not so limited. That is, this preferred embodiment of the present invention is exemplified by an autofocus (AF) module.
  • the package photosensitive member 3010 includes a package portion 3011 and a photosensitive member 3012.
  • the photosensitive component 3012 further includes a photosensitive chip 30121 and a circuit board 30122, which is provided with a set of electronic components 30123 (eg, resistors, capacitors, drivers, etc., hereinafter referred to as ICs) and a set of leads 30124.
  • the lead wire 30124 is connected to the conductive chip 30121 and the circuit board 30122.
  • the photosensitive chip 30121 and the circuit board 30122 may have other conduction modes.
  • the lead 30124 can be implemented as a gold wire.
  • the encapsulation portion 3011 serves as a support for carrying the filter 3020.
  • the encapsulation portion 3011 can have electrical properties.
  • the engraving line can be electrically connected to the motor 3040 and the photosensitive member 3012, which can replace the traditional motor bonding wire. , reducing the traditional process.
  • the motor 3040 and the circuit board 30122 can also be turned on by conventional soldering.
  • the encapsulation portion 3011 encapsulates the circuit board 30122.
  • the encapsulation portion 3011 encapsulates the circuit board 30122 with the photo sensor 30121 and the A region other than the contact of the lead 30124 is described.
  • the encapsulation portion 3011 not only encapsulates the top surface 301221 of the circuit board 30122, but the package portion 3011 further encapsulates at least one side surface 301222 of the circuit board 30122. It can be understood that the encapsulation portion 3011 can also integrally package the electronic component 30123 during the packaging process.
  • FIG. 62B A molding forming module in the comparative art is shown in Figs. 62A to 62E.
  • the portion on the left side of the package portion 3011P in Fig. 62A is flush with the wiring board 30122P, and the design of the side surface of the wiring board 30122P flush with the side surface of the package portion 3011P is also generally adopted by the comparative art. Therefore, in order to achieve the above design requirements, as shown in FIG. 62B, the structure in the figure needs to be achieved before the module is assembled.
  • the circuit board 30122P is processed as shown in FIG. 62B, that is, two or more pieces are used.
  • the circuit boards 30122P are connected together, molded, and finally machine cut in the middle portion of Fig.
  • the circuit board 30122P in the figure needs to protrude a section for mold pressing, and the circuit board 30122P The projection length is usually 0.1 mm to 10 mm in value.
  • the protruding portion of the circuit board 30122P in this section affects the final size of the module, and the module size is increased by 0.1 mm to 10 mm, which affects the quality of the product.
  • the camera module based on the integrated package process of the present invention retracts the circuit board 30122 so that the side of the package portion 3011 covers the circuit board 30122.
  • the side surface 301222 is such that the side surface of the encapsulating portion 3011 and the circuit board 30122 still reserve a certain dislocation space, and the side surface is not protruded after the molding is completed, thereby reducing the cutting process and improving the product. quality.
  • the encapsulation portion 3011 can encapsulate both sides of the circuit board 30122.
  • the encapsulation portion 3011 can not only encapsulate the side surface 301222 of the circuit board 30122, but in other embodiments, the side surface of the circuit board 30122 can be packaged at the same time.
  • the present invention is not limited by the partial or total area of the two sides.
  • FIG. 61 shows another embodiment of the camera module based on the integrated package process of the present invention.
  • the MOB is also adopted.
  • the camera module based on the integrated packaging process includes a package photosensitive component 3010', a filter 3020', a lens 3030', and a motor 3040'.
  • the motor 3040' is disclosed, but in other FF modules, the motor 3040' may not be required, and the present invention is not limited thereto.
  • the package photosensitive member 3010' includes a package portion 3011' and a photosensitive member 3012'.
  • the photosensitive member 3012' further includes a photosensitive chip 30121', and a wiring board 30122' configured with a set of electronic components 30123' and a set of leads 30124'.
  • the encapsulation portion 3011' serves as a holder for carrying the filter 3020', and the engraving line of the module portion 3011' energizes the motor 3040' and the photosensitive member 3012'.
  • the circuit board 30122' and the electronic component 30123' are packaged except for the package portion 3011', and the package is covered with the circuit board.
  • the package portion 3011' In addition to the top surface 301221' of the 30122' and at least one side surface 301222', the package portion 3011' also molds a bottom portion 301223' of the circuit board 30122'. Therefore, after the molding is completed, the planarity of the camera module based on the integrated packaging process from the overall side and the bottom is also convenient for installation and positioning on other tooling.
  • the encapsulation portion 3011 ′ may encapsulate the entire bottom portion 301 223 ′ of the circuit board 30122 ′, or in other embodiments, package the circuit board according to different needs.
  • a portion of the bottom portion 301223' of 30122', the invention is not so limited.
  • the right side of the circuit board 30122' is The package is not encapsulated, but in other embodiments, the package portion 3011' can simultaneously package two or more sides of the circuit board 30122', and simultaneously package the circuit board 30122'.
  • the present invention is not limited to all or part of the area of the bottom portion 301223'.
  • FIG. 60 and FIG. 61 are disclosed in the form of MOB.
  • the following modified embodiment is replaced by a MOC form, and combined with various module structures to expose the side or bottom surface of the circuit board. Module package is performed.
  • FIG. 63A illustrates another embodiment of the camera module based on the integrated package process of the present invention.
  • the camera module based on the integrated packaging process includes a package portion 3011A, a photosensitive component 3012A, a filter 3020A, and a lens 3030.
  • the photosensitive member 3012A further includes a photosensitive chip 30121A and a wiring board 30122A configured with a set of electronic components 30123A and a set of leads 30124A.
  • the encapsulation portion 3011A is formed as a support for carrying the filter 3020A, and is directly formed on the circuit board 30122A except for the photosensitive region of the chip. That is, this embodiment of the invention takes the form of MOC.
  • the photosensitive chip 30121A includes a photosensitive area 301211A and a non-sensitive area 301212A other than the photosensitive area 301211A.
  • the package portion 3011A does not encapsulate the photosensitive area 301211A during packaging. Instead, the non-photosensitive area 301212A of the photosensitive chip 30121A is packaged.
  • the non-photosensitive area 301212A is further provided with a pin and the lead 30124A connected for conducting the photosensitive chip 30121A.
  • the circuit board 30122A is retracted so that the side of the package portion 3011A covers the circuit board 30122A.
  • the side surface 301222A so that the side surface of the encapsulation portion 3011A and the circuit board 30122A still reserve a certain dislocation space, and the side surface is not protruded after the molding.
  • the encapsulation portion 3011A may encapsulate and coat a plurality of sides of the circuit board 30122A.
  • FIG. 63B illustrates another embodiment of the camera module based on the integrated packaging process of the present invention.
  • the circuit board 30122A' and the electronic component 30123A' are packaged except the package portion 3011A', and the top of the circuit board 30122A' is packaged.
  • the package portion 3011A' also molds a bottom portion 301223A' of the wiring board 30122A'. Therefore, after the molding is completed, the planarity of the camera module based on the integrated packaging process from the overall side and the bottom is also convenient for installation and positioning on other tooling.
  • FIG. 64 shows another embodiment of the camera module based on the integrated package process of the present invention.
  • the top design structure of the package portion 3011B is different.
  • the top of the package portion 3011A protrudes upward, and the side of the filter 3020A.
  • a bottom surface of the circuit board 30122B is in close contact with a reinforcing plate 30125B.
  • the reinforcing plate 30125B can be implemented as a metal plate.
  • the other structure is the same as that in Fig. 63A.
  • the leads 30124B are all encapsulated and molded.
  • FIG. 65 shows another embodiment of the camera module based on the integrated package process of the present invention.
  • the circuit board 30122B' and the reinforcing plate 30125B' except the package portion 3011B', the top surface 301221B' of the circuit board 30122B' and at least In addition to one side 301222B', the encapsulation portion 3011B' also molds the bottom of the reinforcing plate 30125B'. Therefore, after the molding is completed, the planarity of the camera module based on the integrated packaging process from the overall side and the bottom is also convenient for installation and positioning.
  • the module structure shown in FIG. 66A is a modification of the module structure in the embodiment of FIG. 64, and the other structures are the same. The difference is that the filter 3020C is placed on the photosensitive chip 30121C to utilize the package together. The part 3011C performs packaging. This can reduce the damage of the photosensitive chip 30121C during packaging and use, and can reduce the back focus of the lens, thereby making the size smaller.
  • the module structure shown in FIG. 66B is a modification of the module structure in the embodiment of FIG. 65, and other structures are the same, except that the filter 3020C' is placed on the photosensitive chip 30121C'.
  • the package portion 3011C' is used together for packaging. This can reduce the damage of the photosensitive chip 30121C' during packaging and use, and can reduce the back focal length of the lens, thereby making the size smaller, so that the height can also be reduced, and the photosensitive chip 30121C' can be released. Heat, high heat dissipation.
  • Figure 67A is a variation of the modular structure in the embodiment of Figure 66A.
  • the tops of the encapsulation portions 3011D extend upwardly to form a carrier wall 30113D, and the carrier walls 30111D form a receiving slot 301131D for receiving the lens. That is to say, the encapsulation portion 3011D can directly carry the lens, thereby realizing a high-precision fixed focus (FF) module.
  • FF fixed focus
  • Figure 67B is a variation of the modular structure in the embodiment of Figure 66B.
  • the encapsulation portion 3011D' covers the bottom surface of the circuit board 30121D', and its top portion extends upward to form a carrier wall 30111D', and the carrier wall 30111D' forms a receiving groove 1111D' for accommodating the lens. That is, the package portion 3011D' can directly carry the lens, thereby realizing a high-precision fixed focus (FF) module.
  • FF fixed focus
  • 68A and 68B are a variation of the module structure based on the embodiment of Fig. 67A.
  • the circuit board 30121E is provided with one or more through holes 30126E, and the forming material forming the encapsulation portion 3011E enters the through hole 30126E and is buried in the through hole 30126E, thereby further reinforcing the circuit board 30121E. Reinforcement.
  • the encapsulation portion 3011E may be coated not only on the top surface of the circuit board 30121E but also on the side surface and the bottom surface of the circuit board 30121E. It can be understood that the line here The manner in which the plate 30121E is provided with the perforations 30126E can also be applied to other embodiments of the present invention.
  • the structure of a modified embodiment is an MOC process.
  • the camera module based on the integrated packaging process includes a package photosensitive component, a filter 3020F, a lens 3030F and a motor 3040F. That is, this preferred embodiment of the present invention is exemplified by an autofocus (AF) module.
  • the package photosensitive assembly includes a package portion 3011F and a photosensitive member 3012F.
  • the photosensitive component 3012F further includes a photosensitive chip 30121F, a circuit board 30122F, a set of electronic components 30123F, and a set of leads 30124F.
  • the lead 30124F connects and turns on the photosensitive chip 30121F and the wiring board 30122F.
  • the lead 30124F can be implemented as a gold wire.
  • the encapsulation portion 3011F serves as a support for carrying the filter 3020F.
  • the package portion 3011F encapsulates the circuit board 30122F.
  • the package portion 3011F encapsulates the photosensitive region of the circuit board 30122F except the photosensitive chip 30121F. part.
  • the encapsulation portion 3011F not only encapsulates the top surface 301221F of the circuit board 30122F, but the package portion 3011F further encapsulates at least one side surface 301222F of the circuit board 30122F. It can be understood that the encapsulation portion 3011F also integrally encapsulates the electronic component 30123F during the packaging process.
  • a package portion pin 301101F and the motor 3040F of the package portion 3011F are electrically conductive, and at least one motor of the motor 3040F is led through an internal wire 301102F of the package portion 3011F.
  • the foot 3041F is electrically connected to the circuit board 30122F. This embodiment may not require a soldering process.
  • the package portion 3011G has a groove channel 1103G that passes through the upper and lower sides, and can be used to place the motor pin 3041G to pass the motor pin 3041G.
  • the groove channel 1103G is soldered to a circuit board pin 1231G of the circuit board 30122G at a solder joint 3060G.
  • FIG. 71 the structure in FIG. 71 is similar to the structure of FIG. 69 and FIG. 70.
  • the motor pins in the structure of FIG. 69 and FIG. 70 may not be designed to be long.
  • the structure of Fig. 71 can be employed. That is, the groove channel 301103H of the outer wall of the encapsulation portion 301011H is not through to the bottom, but the motor pin 3041H is soldered in the groove channel 301103H with the package portion pin 301101H of the encapsulation portion 3011H.
  • a solder joint is 3060H, and is directly connected to the circuit board 30122H through the inner conductor 301102H of the encapsulation portion 3011H, thereby achieving conduction between the motor and the circuit board.
  • the encapsulation portion may also form a plated conductive line on the surface by a laser direct structuring process for connecting the motor and the circuit board.
  • the package portion may not have the electrical properties mentioned in the above embodiments, but the motor and the circuit board are welded by welding in a conventional manner.
  • the three embodiments illustrated in Figures 69 through 71 are merely illustrative of the different manner in which the motor and the circuit board are conductive in the presence of a motor.
  • the encapsulation portion of the three embodiments does not only encapsulate the top surface and the side surface of the circuit board, but may also encapsulate the bottom surface of the circuit board as mentioned in the foregoing various modified embodiments.
  • other structures of the camera module can also be modified accordingly, and the present invention is not limited thereto.
  • the camera module includes at least one optical lens 4030 , at least one photosensitive chip 4010 , at least one protective frame 4060 , at least one circuit board 4070 , and at least one integrated package bracket 4050 .
  • the term "a” used in the description of the structure of the camera module and the manufacturing method of the camera module of the present invention should be understood as “at least one” or “one or more. That is, in one embodiment, the number of one element may be one, and in other embodiments, the number of the elements may be plural, and therefore, the term “a” is not to be construed as limiting the quantity.
  • any directional terminology used in the structure of the camera module of the present invention and the manufacturing method of the camera module is disclosed and illustrated, such as “longitudinal”, “lateral”, “upper”, “Orientation or positional relationship of “under”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc. It is based on the orientation or positional relationship shown in the drawings, which is merely for the convenience of the description of the invention and the simplification of the description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, is constructed and operated in a specific orientation, and thus The above terms are not to be construed as limiting the invention.
  • the camera module of the present invention may be a fixed focus camera module or a zoom camera module. In other words, whether or not the camera module of the present invention allows focusing does not limit the content and scope of the present invention.
  • the camera module of the present invention may be a single-lens camera module or a multi-lens camera module.
  • the camera module may be implemented as an array.
  • Camera module the number of the optical lenses 4030 of the camera module of the present invention does not limit the content and scope of the present invention.
  • the protective frame 4060 is convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010, and the photosensitive chip 4010 and the wiring board 4070 are In the through connection, the integrated package holder 4050 is disposed to wrap the circuit board 4070 and the non-photosensitive area of the photosensitive chip 4010, so that the integrated package holder 4050, the photosensitive chip 4010, and the circuit board 4070 are combined.
  • the optical lens 4030 is disposed on a photosensitive path of the photosensitive chip 4010. Light reflected by the object can be concentrated by the optical lens 4030 to the inside of the camera module to be further received by the sensor chip 4010 and photoelectrically converted to generate an image related to the object.
  • the photosensitive chip 4010 is mounted on the circuit board 4070, and the photosensitive chip 4010 is electrically connected to the circuit board 4070 by a wire bonding process. connection.
  • a gold wire is drawn between the non-photosensitive area of the photosensitive chip 4010 and the wiring board 4070 to electrically connect the photosensitive chip 4010 and the wiring board 4070 by a gold wire as shown in FIG.
  • the sensor chip 4010 is electrically connected to the circuit board 4070 while being mounted on the circuit board 4070, for example, the sensor chip.
  • the non-photosensitive area of 4010 is provided with a chip pad
  • the circuit board 4070 is provided with a circuit board pad.
  • the photosensitive chip 4010 is mounted on the circuit board 4070, the chip pad of the photosensitive chip 4010 is made.
  • the circuit board pads of the circuit board 4070 are electrically connected.
  • the protective frame 4060 is a hollow structure such that the protective frame 4060 can be looped on the outer peripheral side of the photosensitive region of the photosensitive chip 4010.
  • the size of the inner side of the protective frame 4060 is greater than or equal to the size of the photosensitive area of the photosensitive chip 4010, so that when the protective frame 4060 is convexly disposed on the photosensitive chip 4010, The protective frame 4060 can be held on the outer peripheral side of the photosensitive region of the photosensitive chip 4010 so that the protective frame 4060 does not block the photosensitive region of the photosensitive chip 4010.
  • the size of the outer side of the protection frame 4060 is smaller than the size of the photosensitive chip 4010, so that when the protection frame 4060 is convexly disposed on the photosensitive chip 4010, the photosensitive chip 4010
  • the outer side of the non-photosensitive area may be electrically connected to the photosensitive chip 4010 and the wiring board 4070 by a wire bonding process. Nevertheless, those skilled in the art can understand that when the photosensitive chip 4010 and the circuit board 4070 are electrically connected through the die pad and the circuit board pad, the outer side of the protection frame 4060 The size may be the same as the size of the photosensitive chip 4010.
  • the integrated package holder 4050 wraps the circuit board 4070 and the non-photosensitive area of the photosensitive chip 4010 after molding, so that the integrated package holder 4050, the circuit board 4070 and the photosensitive chip 4010 are integrated into one body. In this way, the structural stability of the camera module can be increased and the volume of the camera module can be reduced, so that the camera module can be applied to an electronic device that is thin and thin.
  • the integrated package holder 4050 is disposed to wrap the outer peripheral side of the protection frame 4060, so that the integrated package holder 4050, the circuit board 4070, the protection frame 4060, and the photosensitive chip 4010 are integrated into one body. .
  • the camera module includes at least one lens support 4040, wherein the lens support 4040 is disposed on an upper portion of the integrated package holder 4050, and the optical lens 4030 is disposed at the The lens support 4040 is configured to hold the optical lens 4030 in the photosensitive path of the photosensitive chip 4010 by the lens support 4040.
  • the lens support 4040 is disposed on an upper portion of the integrated package holder 4050 after molding.
  • the lens support 4040 can be integrally formed with the integrated package holder 4050. In this manner, the package error of the camera module can be reduced. In order to improve the imaging quality of the camera module.
  • the lens support 4040 can be implemented as a motor, that is, the optical lens 4030 is operatively disposed on the lens support 4040 to drive the optical through the lens support 4040.
  • Lens 4030 moves back and forth along the photosensitive path of the photosensitive chip 4010, thereby adjusting the focal length of the camera module by changing the position between the optical lens 4030 and the photosensitive chip 4010.
  • the lens support 4040 can be various drivers for driving the optical lens 4030 to move back and forth along the photosensitive path of the photosensitive chip 4010, for example, in this preferred embodiment of the invention.
  • the lens support 4040 can be implemented as a voice coil motor.
  • the lens support 4040 is implemented as a motor, the lens support 4040 is electrically connected to the wiring board 4070.
  • the camera module includes a filter element 4020, wherein the filter element 4020 is disposed between the optical lens 4030 and the sensor chip 4010 when reflected by an object.
  • the filter element 4020 can function as a noise reduction to improve the imaging quality of the camera module.
  • the type of the filter element 4020 may not be limited.
  • the filter element 4020 may be implemented as an infrared cut filter. a sheet for filtering an infrared portion of the light by the filter element 4020, and in another specific example of the camera module of the present invention, the filter element 4020 is implemented as a visible spectral filter .
  • the integrated package holder 4050 forms at least one mounting platform 4051 for mounting the filter element 4020.
  • the mounting platform 4051 may be a mounting groove formed on an upper portion of the integrated package holder 4050 or
  • the mounting platform 4051 may be a flat surface formed on an upper portion of the integrated package holder 4050.
  • the filter element 4020 can be directly attached to the upper portion of the integrated package holder 4050.
  • FIG. 74A to FIG. 74F are schematic diagrams showing a manufacturing process of the camera module according to the present invention, wherein in FIGS. 74A to 74F, for convenience of description, all of the camera modules are described in a sectional view.
  • the photosensitive chip 4010 is turned on the wiring board 4070. It can be understood by those skilled in the art that, in this step shown in FIG. 74A, after the photosensitive chip 4010 is mounted on the circuit board 4070, the photosensitive chip 4010 and the substrate are processed by a wire bonding process.
  • the manner in which the circuit board 4030 is conductively connected is merely exemplified.
  • the manner in which the photosensitive chip 4010 and the circuit board 4070 are electrically connected does not constitute a limitation on the content and scope of the present invention.
  • the sensor chip 4010 and the circuit board 4070 may also be directly electrically connected through the die pad and the circuit board pad.
  • the protective frame 4060 is convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010.
  • the protective frame 4060 is convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010.
  • a bonding layer 4080 is formed between the protective frame 4060 and the outer peripheral side of the photosensitive region of the photosensitive chip 4010, and the bonding layer 4080 is used for connecting the protective frame 4060 and the photosensitive chip 4010. The outer peripheral side of the area.
  • glue is disposed on the outer peripheral side of the protective frame 4060 and/or the photosensitive region of the photosensitive chip 4010 to be in the protective frame 4060 and/or
  • the glue layer 4080 is formed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010. That is, the surface of at least one of the protective frame 4060 and the outer peripheral side of the photosensitive region of the photosensitive chip 4010 forms the glue layer 4080. Subsequently, the bonding layer 4080 is used to connect the protective frame 4060 and the outer peripheral side of the photosensitive region of the photosensitive chip 4010.
  • the glue may be rapidly formed for joining the protective frame 4060 by heat curing or UV light curing.
  • the protection frame 4060 can be provided with the glue layer 4080, so that the protection frame 4060 can be directly used in the process of packaging the camera module. It is provided on the outer peripheral side of the photosensitive area of the photosensitive chip 4010.
  • the protection frame 4060 may be formed by an injection molding process or a stamping process, for example, the protection frame 4060 It may be a plastic part formed by an injection molding process.
  • the protective frame 4060 is a hollow structure, so that the protective frame 4060 can be convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010 for isolating the photosensitive chip 4020.
  • the photosensitive area and the external environment so that during the subsequent encapsulation of the camera module, the protective frame 4060 can prevent contaminants from entering the photosensitive area of the photosensitive chip 4010 to cause a bad stain point.
  • the integral package holder 4050 is formed by a molding die 40100 during the process of packaging the camera module, wherein the molding die 40100 includes a mold upper portion 40101, and the upper portion of the mold The inner surface of 40101 is pressed against the protective frame 4060 to isolate the photosensitive area and the external environment of the photosensitive chip 4010.
  • the protective frame 4060 is convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010, so that the inner surface of the upper portion 40101 of the mold is pressed against the protective frame.
  • the protective frame 4060 can prevent the inner surface of the mold upper portion 40101 from contacting the photosensitive region of the photosensitive chip 4010, so that the protective frame 4060 can prevent the inner surface of the mold upper portion 40101 from being damaged or scratched.
  • the photosensitive area of the photosensitive chip 4010 is described.
  • an inner surface of the mold upper portion 40101 corresponds to a portion of the photosensitive region of the photosensitive chip 4010, and a concave portion is formed.
  • the groove 40102 so that the groove 40102 can secure the photosensitive region of the photosensitive chip 4010 and the inner surface of the mold upper portion 40101 during molding of the integrated package holder 4050 by the molding die 40100.
  • the gap further reduces the influence of the mold upper portion 40101 on the photosensitive chip 4010 to prevent the photosensitive chip 4010 from being damaged or scratched by the inner surface of the mold upper portion 40101.
  • the protective frame 4060 has elasticity such that when the inner surface of the upper mold portion 40101 is pressed against the protective frame 4060, the protective frame 4060 can serve as a buffer to prevent the upper portion 40101 of the mold from being generated.
  • the pressure damages the photosensitive chip 4010.
  • the photosensitive chip 4010 is mounted. There may be a mounting tilt after the circuit board 4070.
  • the protective frame 4060 can be deformed to make the photosensitive
  • the photosensitive area of the chip 4010 is isolated from the external environment to prevent the forming material for forming the integral package holder 4050 from entering the photosensitive area of the photosensitive chip 4010.
  • the forming material is added to the mold upper portion 40101, and the integral package holder 4050 is formed after the forming material is cured, wherein the unitary package holder 4050 wraps the line.
  • the plate 4070 and the non-photosensitive area of the photosensitive chip 4010 are such that the integrated package holder 4050, the circuit board 4070, and the photosensitive chip 4010 are integrated.
  • the integrated package holder 4050 further wraps the outer peripheral side of the protective frame 4060 to integrate the integrated package holder 4050, the circuit board 4070, the protective frame 4060, and the photosensitive chip 4010.
  • the forming material is fluid or granular.
  • the photosensitive region and the external environment of the photosensitive chip 4010 are isolated, so that the forming material does not flow to the mold material after the molding material is added to the mold upper portion 40101.
  • the photosensitive area of the photosensitive chip 4010 so that the protective frame 4060 can prevent the forming material from damaging the photosensitive area of the photosensitive chip 4010.
  • the protective frame 4060 has elasticity such that there is no gap between the protective frame 4060 and the upper mold portion 40101 of the protective frame 4060, and therefore, the said is added to the upper portion 40101 of the mold. The phenomenon of "flashing" does not occur during the curing of the forming material to ensure the image quality of the camera module.
  • the cover film 40102 can reduce the difficulty of demolding and increase the sealing property, thereby preventing the phenomenon of "flashing" of the forming material on the inner side of the integrated package holder 4050 during curing.
  • the filter element 4020 and the optical lens 4030 are respectively disposed on the photosensitive path of the photosensitive chip 4010 to fabricate the camera module.
  • the filter element 4020 is mounted on the integrated package holder 4050, and the optical lens 4030 is held on the photosensitive chip 4010 by the lens support 4040 disposed on the integrated package holder 4050. Photosensitive path.
  • 77A to 77G are schematic views of another manufacturing process of the camera module according to the present invention.
  • the photosensitive chip 4010 is turned on the wiring board 4070.
  • the protective frame 4060 is convexly disposed on the outer peripheral side of the photosensitive region of the photosensitive chip 4010.
  • the upper portion of the protective frame 4060 is provided with a protective film 4090 to facilitate the suction of the protective frame 4060 by vacuum adsorption and the mounting of the protective frame 4060 to the periphery of the photosensitive region of the photosensitive chip 4010. side.
  • the protective film 4090 correspondingly covers the photosensitive region of the photosensitive chip 4010.
  • the photosensitive region and the external environment of the photosensitive chip 4010 are separated by the protective film 4090 and the protective frame 4060, thereby preventing the forming material from flowing to the photosensitive region of the photosensitive chip 4010.
  • the inner surface of the mold upper portion 40101 of the molding die 40100 is pressed against the protective frame 4060 to further isolate the photosensitive region and the external environment of the photosensitive chip 4010.
  • the forming material is added to the molding die 40101, and the integrally packaged holder 4060 is formed after the molding material is cured, wherein the integral package holder 4050 wraps the circuit board. 4070 and a non-photosensitive area of the photosensitive chip 4010, so that the integrated package holder 4050, the circuit board 4070, and the photosensitive chip 4010 are integrated.
  • the integrated package holder 4050 further wraps the outer peripheral side of the protective frame 4060 to integrate the integrated package holder 4050, the circuit board 4070, the protective frame 4060, and the photosensitive chip 4010.
  • an integrally-bonded integrated package holder 4050, the wiring board 4070, the protective frame 4060, and the photosensitive chip 4010 as shown in FIG. 77E can be obtained, wherein the protective film 4090 is still provided to the protection frame 4060.
  • the protective film 4090 is removed from the protective frame 4060 to obtain an integrally coupled one-piece package holder 4050, the circuit board 4070, the protection frame 4060, and the Photosensitive chip 4010.
  • the filter element 4020 and the optical lens 4030 are respectively disposed on the photosensitive path of the photosensitive chip 4010 to fabricate the camera module.
  • the camera module according to another preferred embodiment of the present invention is illustrated, wherein the camera module includes at least one optical lens 4030A, at least one photosensitive chip 4010A, and at least one a protection frame 4060A, at least one circuit board 4070A, at least one integrated package holder 4050A, and at least one filter element 4020A, wherein the photosensitive chip 4010A and the circuit board 4070A are electrically connected, and the filter elements 4020A are overlapped
  • the protective frame 4060A is disposed on the outer periphery of the filter element 4020A such that the protective frame 4060A does not block the photosensitive area of the photosensitive chip 4010A.
  • the optical lens 4030A is disposed on the photosensitive path of the photosensitive chip 4010A. Light reflected by the object is concentrated by the optical lens 4030A to the inside of the camera module to be further received by the sensor chip 4010A and photoelectrically converted to generate an image related to the object.
  • the integrated package holder 4050A wraps the outer periphery of the circuit board 4070A and the filter element 4020A during molding to make the integrated package holder 4050A, the filter element 4020A, and the photosensitive chip 4010A. It is integrally combined with the circuit board 4070A.
  • the integral package holder 4050A further wraps the outer side of the protection frame 4060A to make the integrated package holder 4050A, the filter element 4020A, the photosensitive chip 4010A, the circuit board 4070A, and The protective frame 4060A is integrally combined.
  • the protective frame 4060A is convexly disposed on the outer periphery of the filter element 4020A, so that when the inner surface of the mold upper portion 40101A of a molding die 40100A is pressed against the protective frame 4060A, the upper portion of the mold is subsequently applied.
  • the inner surface of the 40101A does not come into contact with the surface of the filter element 4020A, thereby preventing the inner surface of the mold upper portion 40101A from being damaged or scratching the filter element 4020A.
  • the protective frame 4060A that is convexly disposed on the outer periphery of the filter element 4020A forms a safe distance between the surface of the filter element 4020A and the inner surface of the upper mold portion 40101A to prevent The inner surface of the upper mold portion 40101A damages or scratches the filter element 4020A.
  • the camera module includes at least one lens support body 4040A, wherein the lens support body 4040A is disposed on an upper portion of the integrated package holder 4050A, and the optical lens 4030A is disposed on the lens support body 4040A.
  • the optical lens 4030A is held in the photosensitive path of the photosensitive chip 4010A by the lens support 4040A.
  • the lens support 4040A is disposed on an upper portion of the integrated package holder 4050A after molding.
  • the lens support 4040A can be integrally formed with the integrated package holder 4050A. In this way, the package error of the camera module can be reduced. In order to improve the imaging quality of the camera module.
  • the lens support 4040A can be implemented as a motor, that is, the optical lens 4030A is operatively disposed on the lens support 4040A to drive the optical through the lens support 4040A.
  • the lens 4030A moves back and forth along the photosensitive path of the photosensitive chip 4010A, thereby adjusting the focal length of the camera module by changing the position between the optical lens 4030A and the photosensitive chip 4010A.
  • the lens support 4040A may be a variety of drivers for driving the optical lens 4030A to move back and forth along the photosensitive path of the photosensitive chip 4010A, for example, in this preferred embodiment of the invention.
  • the lens support 4040A can be implemented as a voice coil motor.
  • the lens support 4040A is implemented as a motor, the lens support 4040A is electrically connected to the wiring board 4070A.
  • FIGS. 80A to 80G A schematic diagram of a manufacturing process of the camera module of the present invention is shown in FIGS. 80A to 80G.
  • the photosensitive chip 4010A is electrically connected to the wiring board 4070A, and the photosensitive chip 4010A and the wiring board 4070A are electrically connected, similar to the above-described preferred embodiment of the present invention.
  • the way is not limited.
  • the filter element 4020A is disposed in an overlapping manner on the photosensitive chip 4010A. It can be understood by those skilled in the art that the manner in which the filter element 4020A and the photosensor chip 4010A are overlapped can reduce the back focus of the camera module, thereby facilitating miniaturization of the camera module. In order to make the camera module suitable for electronic devices that are thin and thin.
  • the protective frame 4060A is placed on the outer periphery of the filter element 4020A, wherein the protective frame 4060A does not block the photosensitive area of the photosensitive chip 4010A.
  • the protective frame 4060A can be disposed on the outer periphery of the filter element 4020A through a glue layer 4080A. That is, the glue layer 4080A disposed between the protection frame 4060A and the filter element 4020A is used to connect the protection frame 4060A and the filter element 4020A.
  • the inner surface of the mold upper portion 40101A is pressed against the protective frame 4060A to isolate the inner and outer perimeters of the filter element 4020A, wherein the filter element 4020A
  • the size of the inner region is greater than or equal to the photosensitive region of the photosensitive chip 4010A to prevent the protective frame 4060A from blocking the photosensitive region of the photosensitive chip 4010A.
  • the protective frame 4060A is convexly disposed on the outer periphery of the filter element 4020A so that when the inner surface of the mold upper portion 40101A is pressed against the protective frame 4060A.
  • the protective frame 4060A can prevent the inner surface of the mold upper portion 40101A from contacting the photosensitive region of the filter element 4020A, so that the protective frame 4060A can prevent the inner surface of the mold upper portion 40101A from being damaged or scratched.
  • the inner region of the filter element 4020A can prevent the inner surface of the mold upper portion 40101A from being damaged or scratched.
  • the protective frame 4060A has elasticity so that when the inner surface of the upper portion 40101A of the mold is pressed against the When the protective frame 4060A is described, the protective frame 4060A can serve as a buffer to prevent the pressure generated by the upper portion 40101A of the mold from damaging the filter element 4020A.
  • the forming material is added to the mold upper portion 40101A to form the unitary package holder 4050A after the forming material is cured, wherein the unitary package holder 4050A wraps the
  • the wiring board 4070A and the outer periphery of the filter element 4020A are such that the integrated package holder 4050A, the wiring board 4070A, the photosensitive chip 4010A, and the filter element 4020A are integrated.
  • the integral package holder 4050A further wraps the outer peripheral side of the protection frame 4060A to make the integrated package holder 4050A, the circuit board 4070A, the protection frame 4060A, the photosensitive chip 4010A, and the filter.
  • the light elements 4020A are integrated into one body.
  • the forming material is fluid or granular.
  • the inner region and the outer periphery of the filter element 4020A are isolated so that the shaped material does not flow to the mold after the forming material is added to the upper portion 40101A of the mold.
  • the inner region of the filter element 4020A is such that the protective frame 4060A can prevent the forming material from damaging the inner region of the filter element 4020A.
  • the protective frame 4060A has elasticity such that there is no gap between the protective frame 4060A and the upper mold portion 40101A of the protective frame 4060A, and thus, the said is added to the upper portion 40101A of the mold. The phenomenon of "flashing" does not occur during the curing of the forming material to ensure the image quality of the camera module.
  • the filter element 4020A and the optical lens 4030A are respectively disposed on the photosensitive path of the photosensitive chip 4010A to obtain the camera module.
  • the present invention further provides a method of manufacturing a camera module, wherein the manufacturing method includes the following steps:
  • the present invention also provides a method of manufacturing a camera module, wherein the manufacturing method comprises the following steps:
  • At least one optical lens 4030 is provided, wherein the optical lens 4030 is disposed on a photosensitive path of the photosensitive chip 4010 to form the camera module.
  • the photosensitive component 5010 includes a circuit board body 5011, a photosensitive chip 5012, and a connection medium 5013.
  • the photosensitive chip 5012 is attached to the wiring board main body 5011 through the connection medium 5013.
  • the photosensitive chip 5012 has a front surface 50121 and a back surface 50122.
  • the front surface 50121 faces outward, that is, in a direction opposite to the circuit board main body 5011, and the front surface 50121 is used for light sensing.
  • the back surface 50122 is oriented toward the circuit board main body 5011, and the connection medium 5013 is disposed between the back surface 50122 of the photosensitive chip 5012 and the circuit board main body 5011, and the photosensitive chip 5012 is fixed in the The board main body 5011 is described.
  • the shape of the connecting medium 5013 matches the photosensitive chip 5012, so that the photosensitive chip 5012 is stably and evenly attached to the wiring board main body 5011.
  • the chip 501P and the circuit board 502P obtained by the conventional D/A method are The floating region 4P is generally present between the wiring board 2P and the chip 501P, so that the chip 501P is unstable in bonding, poor in flatness, and is prone to tilt.
  • connection medium 5013 is evenly distributed between the photosensitive chip 5012 and the circuit board main body 5011 such that the back surface 50122 of the photosensitive chip 5012 and the circuit board main body 5011 are disposed.
  • the area is sufficiently filled by the connection medium 5013 to increase the coverage area of the connection medium 5013, and the floating area is absent, so that the photosensitive chip 5012 is smoothly and stably connected to the wiring board main body 5011.
  • the connecting medium 5013 is one of a UV film, a thermosetting film or a UV thermosetting film.
  • the photosensitive member 5010 includes at least one connecting wire 5014, and each of the connecting wires 5014 electrically connects the photosensitive chip 5012 and the wiring board main body 5011.
  • the connecting wire 5014 can be, for example but not limited to, a gold wire, a silver wire, a copper wire, or an aluminum wire. That is, the photosensitive chip 5012 and the circuit board main body 5011 are electrically connected to each other through the connecting wires 5014.
  • the photosensitive chip 5012 is photosensitive, the optical signal is converted into an electrical signal through the connecting line 5014. The electrical signal is transmitted to the circuit board body 5011.
  • the first manufacturing process of the photosensitive member 5010 is illustrated.
  • a layer of the connecting medium 5013 is first attached to the back surface 50122 of the photosensitive chip 5012, so that the connecting medium 5013 is attached to the photosensitive chip.
  • the attachment method can be achieved by spraying, spin coating, roller brushing or printing.
  • the connecting medium 5013 may be one of a UV film, a thermosetting film or a UV thermosetting film.
  • the connecting medium 5013 is in a semi-cured state by a UV method or a thermosetting method, so that the shape of the connecting medium 5013 is not easily changed.
  • UV mode that is, ultraviolet irradiation.
  • thermosetting is the way of heat curing.
  • a wafer 50130 is usually obtained by dicing. Therefore, in order to perform the dicing process, a dicing film 50140 needs to be attached to the connecting medium 5013. Further, the wafer 50130 with the connecting medium 5013 and the dicing film 50140 is cut such that the wafer 50130 forms a plurality of the photosensitive chips 5012, that is, by cutting The wafer 50130 is cut in a cut manner such that the shape of the connection medium 5013 and the photosensitive chip 5012 are identical.
  • the dicing film 50140 is removed, and the photosensitive chip 5012 with the connecting medium 5013 is attached to the circuit board main body 5011, that is, the photosensitive chip 5012 is passed through the connecting medium 5013.
  • the wiring board main body 5011 is fixedly connected, and the connecting medium 5013 is cured by a pressing, heating or baking process, so that the photosensitive chip 5012 is stably connected with the wiring board main body 5011.
  • the step of cleaning the photo sensor chip 5012 that is, cleaning the photo sensor chip 5012, is further included. The dust contaminated on the photosensitive chip 5012 is removed.
  • the dicing film 50140 in the process of forming the photosensitive chip 5012, may be attached to the front surface of the wafer 50130, thereby facilitating the installation.
  • the wafer 50130 is cut into a plurality of the photosensitive chips 5012.
  • the dicing film 50140 is removed, thereby obtaining the photosensitive chip 5012. That is, the dicing film 50140 may be disposed on the front side and/or the back side of the wafer 50130. It should be understood by those skilled in the art that the position of the dicing film 50140 is not the present invention. limit.
  • each of the connecting wires 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011, so that The photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • a gold wire is applied to the photosensitive chip 5012 and the wiring board main body 5011 by a W/B (Wired/Bond) process.
  • connection medium 5013 is attached to the back surface 50122 of the photosensitive chip 5012, and the connection medium 5013 is evenly distributed on the back surface 50122 of the photosensitive chip 5012. It exists in the form of a continuous face, not in the form of a discrete point or a line segment, which ensures the connection flatness of the photosensitive chip 5012 and the circuit board main body 5011.
  • the photosensitive chip 5012 exists in a semi-solid form before being attached to the circuit board main body 5011, and its shape is relatively determined. Therefore, when the photosensitive chip 5012 is attached to the line through the connection medium 5013, In the case of the board main body 5011, the shape change of the connecting medium 5013 is small, and the connection flatness of the photosensitive chip 5012 and the circuit board is less affected. For example, the flatness of the photosensitive chip 5012 can reach 2 ⁇ m.
  • the coverage area of the connecting medium 5013 to the back surface 50122 of the photosensitive chip 5012 is increased to avoid the occurrence of the floating area 4P around, thereby reducing the damage of the W/B working chip. Risk, that is, it is easier to set the connecting wire 5014 to the photosensitive chip 5012 and the wiring board main body 5011.
  • the present invention provides a method of manufacturing a photosensitive member 1000 comprising the steps of:
  • At least one connecting wire 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011, so that the photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • the step 1100 can be further broken down into:
  • connection medium 5013 attaching the connection medium 5013 to the back surface 50122 of a wafer 50130;
  • the steps 1110, 1120, 1130, and 1140 are suitable for mass production of the photosensitive member 5010, and when the photosensitive chip 5012 is separately provided for manufacturing the photosensitive member 5010, it may be at the photosensitive chip 5012.
  • the connection medium 5013 is attached to the back surface 50122, and then the connection medium 5013 is semi-cured. Further, the photosensitive chip 5012 is attached to the circuit board main body 5011 via the connection medium 5013. That is, the cutting film 50140 and the cutting process are not necessarily steps that must be performed.
  • a dicing film 50140 is attached to the front surface of the wafer 50130, and then the wafer 50130 is cut.
  • a step may also be included to remove the dicing film 50140, such as by ultraviolet light.
  • the attachment means in the step 1110 may be one of spraying, spin coating, roller brushing or printing.
  • the connecting medium 5013 is one of a UV film, a thermosetting film or a UV thermosetting film.
  • the semi-curing process in the step 1130 can be achieved by ultraviolet irradiation, heating, or the like.
  • the step 1200 includes a step 1210 of cleaning the photosensitive chip 5012.
  • the curing method in the step 1300 may be pressing, heating or baking.
  • the setting manner in the step 1400 is a way of playing a gold wire.
  • the manufacturing method of the photosensitive module 5010 of the present invention is suitable for mass production, for example, the connection medium 5013 is integrally attached to the back surface 50122 of the wafer 50130, and the wafer 50130 is further A plurality of the photosensitive chips 5012 are obtained by wafer cutting, and each of the photosensitive chips 5012 is attached to each of the wiring board main bodies 5011, thereby forming a plurality of the photosensitive members 5010 at a time, thereby improving production efficiency. Different from the traditional way, it requires separate dispensing and bonding alone, which is less efficient.
  • a second method of fabricating the photosensitive member 5010 In this manufacturing method, In the manufacture of the photosensitive member 5010, a layer of the connecting medium 5013 is first attached to the dicing film 50140, and the connecting medium 5013 is semi-cured.
  • the attachment may be in the form of spraying, spin coating, roller brushing or printing, and the connecting medium 5013 is one of a UV film, a thermosetting film or a UV thermosetting film.
  • the shape of the connected medium 5013 is a predetermined shape such as a shape matching the photosensitive chip 5012.
  • the photosensitive chip 5012 is generally obtained by cutting the wafer 50130, and thus the dicing film 50140 with the connecting medium 5013 is attached to the wafer.
  • the wafer 50130 is then divided into the wafer 50130 to obtain a separate photosensitive chip 5012, and the photosensitive chip 5012 has a semi-solid connection medium 5013.
  • connection medium 5013 is attached to the back surface 50122 of the wafer 50130 by the dicing film 50140, so that the connection medium 5013 is connected to the back surface 50122 of the photosensitive chip 5012.
  • the chip can be attached to the back side 50122 of the wafer 50130 by rolling.
  • the connecting medium 5013 needs to be semi-cured, such as by semi-curing the connecting medium 5013 by UV or heat fixing.
  • the state makes the shape of the connecting medium 5013 difficult to change.
  • UV mode that is, ultraviolet irradiation.
  • thermosetting is the way of heat curing.
  • the photosensitive chip 5012 with the connection medium 5013 is attached to the circuit board main body 5011, that is, the photosensitive chip 5012 and the circuit board main body 5011 are connected by the connection medium 5013.
  • the connection is fixed, and the connection medium 5013 is cured by a pressing, heating or baking process, so that the photosensitive chip 5012 is stably connected to the wiring board main body 5011.
  • a cleaning step of the photoreceptor chip 5012 is further included to remove the contamination on the photosensor chip 5012. dust.
  • each of the connecting wires 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011 such that the photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • the present invention provides a method of manufacturing a photosensitive member 2000 comprising the steps of:
  • At least one connecting wire 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011, so that the photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • the step 2100 can be further broken down into:
  • connection medium 5013 attaching the connection medium 5013 to a wafer 50130;
  • the steps 2110, 2120, 2130, and 2140 are suitable for mass production of the photosensitive member 5010.
  • the attachment means in the step 2110 may be one of spraying, spin coating, roller brushing or printing.
  • the attachment manner in the step 2120 may be a rolling method.
  • the connecting medium 5013 is one of a UV film, a thermosetting film or a UV thermosetting film.
  • the semi-curing process in the step 2120 can be achieved by ultraviolet irradiation, heating, or the like.
  • the step 2200 includes the step of cleaning the photosensitive chip 5012.
  • the curing mode in the step 2300 may be pressing, heating or baking.
  • the setting mode in the step 2400 is a way of playing a gold wire.
  • FIG. 87A and 88 a third manufacturing process of the photosensitive member 5010 is illustrated.
  • the connecting medium 5013 is first attached to the wiring board main body 5011 so that the wiring board main body 5011 provides a connectable position.
  • the connecting medium 5013 is semi-cured, such as by UV or thermosetting, such that the connecting medium 5013 is in a semi-cured state such that the shape of the connecting medium 5013 is not easily changed.
  • UV mode that is, ultraviolet irradiation.
  • thermosetting is the way of heat curing.
  • the semi-curing process may not be performed, that is, in this method, the semi-curing is not an essential step.
  • the connecting medium 5013 may be one of a UV film, a thermosetting film or a UV thermosetting film.
  • the attachment manner of the connecting medium 5013 can be achieved by spraying, scraping, wiping or printing, etc., so that the photosensitive chip is corresponding to the printed circuit board main body 5011.
  • a film of uniform distribution and thickness is formed at a position of 5012 as an adhesive for the D/A patch, and the connecting medium 5013 is semi-cured, and then the photosensitive chip 5012 is attached to the wiring board.
  • the main body 5011 stably and reliably connects the photosensitive chip 5012 and the wiring board main body 5011 by a pressing, heating pressing or baking process.
  • the coverage area of the connecting medium 5013 is improved in the method, so that there is no floating area between the photosensitive chip 5012 and the circuit board main body 5011, and the flatness is improved.
  • the photosensitive medium 5012 is attached between the circuit board main body 5011, and the connecting medium 5013 is semi-cured, so that the shape of the connecting medium 5013 is relatively stable and is not easy to change, so that When the photosensitive chip 5012 is attached to the circuit board main body 5011 for pressing, heating pressing or baking, the shape of the connecting medium 5013 is small, thereby ensuring the photosensitive chip 5012 and the circuit board main body 5011.
  • the connection is flat.
  • each of the connecting wires 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011 such that the photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • a gold wire is applied to the photosensitive chip 5012 and the wiring board main body 5011 by a W/B (Wired/Bond Chip Bonding) process.
  • the connecting medium 5013 is first attached to the wiring board main body 5011 so that the wiring board main body 5011 provides a connectable position.
  • the connecting medium 5013 is attached to the wiring board main body 5011 by attaching.
  • a double-sided adhesive film of a predetermined shape is attached to a predetermined position on the surface of the circuit board main body 5011, and the shape of the double-sided adhesive film is matched with the photosensitive chip 5012, so that the photosensitive chip 5012 is flat and free.
  • the wiring board main body 5011 is attached to the gap.
  • the connecting medium 5013 may be pre-cured by UV irradiation, and then the photosensitive chip 5012 is attached to the connecting medium 5013, and then The connecting medium 5013 is thermoset such that the photosensitive chip 5012 and the wiring board main body 5011 are stably connected. That is to say, in this manner, the connecting medium 5013 can be selected by bonding a material having UV curing properties.
  • the connecting medium 5013 may be pre-cured without UV irradiation, but directly attached to the photosensitive chip 5012 to the connecting medium 5013, and then The connecting medium 5013 is thermoset such that the photosensitive chip 5012 and the wiring board main body 5011 are stably connected. That is to say, in this manner, the connecting medium 5013 can be bonded by using a material that does not have UV curing properties.
  • the present invention provides a method of manufacturing a photosensitive member 5010 comprising the steps of:
  • connection medium 5013 attaching a predetermined shape of the connection medium 5013 to a circuit board body 5011;
  • 3200 attaching the photosensitive chip 5012 to a circuit board main body 5011 through the connection medium 5013;
  • 3300 curing the connected medium 5013, so that the photosensitive chip 5012 and the circuit board main body 5011 are evenly and stably connected;
  • the at least one connecting wire 5014 is disposed on the photosensitive chip 5012 and the circuit board main body 5011, so that the photosensitive chip 5012 and the circuit board main body 5011 can be electrically connected.
  • the step 3100 can be further broken down into:
  • the connecting medium 5013 is semi-cured.
  • the attachment means in the step 3110 can be one of spraying, squeegeing, wiping, printing and attaching.
  • the connecting medium 5013 is one of a UV film, a thermosetting film or a UV thermosetting film.
  • the predetermined shape matches the shape of the photosensitive chip 5012 such that the photosensitive chip 5012 is flatly attached to the wiring board main body 5011, and the floating area 504P does not occur.
  • the shape of the connecting medium 5013 is relatively fixed, and it is not easy to change. It is worth mentioning that the semi-curing process is not an essential step, that is, in other embodiments, the connecting medium 5013 corresponding to the photosensitive chip 5012 may be directly coated, and then bonded. .
  • the curing method in the step 3300 may be pressing, heating or baking.
  • the setting mode in the step 3400 is a way of playing a gold wire.
  • the camera module includes a photosensitive component 5010, a bracket 5050, a filter 5020, a lens 5030, and a motor 5040.
  • the bracket 5050 is mounted on the photosensitive component 5010
  • the filter 5020 is mounted on the bracket 5050 on a photosensitive path of the photosensitive chip 5012 of the photosensitive component 5010
  • the 50 lens 5030 is Mounted in the motor 5040 to adjust the focal length of the camera module by the motor 5040, the motor 5040 is mounted on the bracket 5050 such that the lens 5030 is located in the photosensitive path of the photosensitive chip 5012. on.
  • the application of the photosensitive component 5010 in the camera module makes the photosensitive chip 5012 have better flatness, thereby making it easier to adjust the photosensitive chip 5012 and the filter 5020 and
  • the optical axis of the lens 5030 is consistent, so that the camera module has better imaging quality, and solves problems such as poor analysis, abnormal imaging curve, abnormal motor 5040CODE, and the like of the camera module during the test.
  • the moving focus camera module AFM is taken as an example for description.
  • the camera module may also be a fixed focus module FF. That is, the motor 5040 is not included, and it should be understood by those skilled in the art that the specific shape and type of the camera module are not limited by the present invention.
  • the photosensitive member 5010 includes a molded body 5015 which integrally forms the wiring board main body 5011 and the photosensitive chip 5012.
  • the floating area is usually formed due to the edge region where the chip and the circuit board are connected, so that after the D/A process, molding is performed.
  • the molded body 5015 needs to press the edge of the chip through a mold, and therefore, due to the existence of the suspended region, the photosensitive chip 5012 is easily tilted or damaged, thereby being disadvantageous to the molded body.
  • the formation of 5015 is not conducive to assembling the camera module.
  • the photosensitive chip 5012 is smoothly connected to the wiring board main body 5011 through the connection medium 5013, and the floating area is not present, so that the molded body 5015 is more easily formed. And the molded body 5015 is kept flat.
  • the camera module includes a photosensitive component 5010, a filter 5020, a lens 5030, and a motor 5040.
  • the filter 5020 is mounted on the molded body 5015 of the photosensitive member 5010 on a photosensitive path of the photosensitive chip 5012 of the photosensitive assembly 5010, and the lens 5030 is mounted on the motor 5040.
  • the motor 5040 is mounted to the molded body 5015 such that the lens 5030 is located on the photosensitive path of the photosensitive chip 5012.
  • the application of the photosensitive component 5010 in the camera module makes the photosensitive chip 5012 and the molded body 5015 have better flatness, thereby making it easier to adjust the photosensitive chip 5012. Consistency with the optical axis of the filter 5020 and the lens 5030 solves the problem of chip tilt caused when the molded body 5015 is formed, so that the camera module has better imaging quality and solves the problem.
  • the camera module has poor resolution, abnormal imaging curve, abnormal motor CODE, etc. during the test. Therefore, the photosensitive member 5010 of the present invention is particularly suitable for the camera module of the molding type.
  • the photosensitive member 5010 includes at least one circuit component 5016 protruding from the wiring board main body 5011 and covered by the molding body 5015.
  • the molded body 5015 is integrally packaged in the non-photosensitive area of the front surface 50121 of the photosensitive chip 5012, so that the photosensitive chip 5012 and the wiring board main body 5011 are more firmly connected.
  • the moving focus camera module AFM is taken as an example for description.
  • the camera module may also be a fixed focus module FFM. That is, the motor 5040 is not included, and it should be understood by those skilled in the art that the specific shape and type of the camera module are not limited by the present invention.

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Abstract

一摄像模组及其感光组件和制造方法，其中所述感光组件包括一封装部和一感光部；所感光部包括一线路板主体和一感光芯片，所述封装部一体封装成型于所述线路板主体和所述感光芯片。

Description

摄像模组及其感光组件和制造方法 技术领域
本发明涉及摄像模组领域，更进一步，涉及一摄像模组及其感光组件和制造方法。
背景技术
COB(Chip On Board，芯片封装)工艺是摄像模组组装制造过程中极为重要的一个工艺过程。传统的COB工艺制成的摄像模组由线路板、感光芯片、镜座、马达驱动以及镜头等部件组装而成。
如图1所示，是传统的COB工艺制造的一摄像模组示意图。所述摄像模组包括一线路板101P、一感光芯片102P、一支架103P、一滤光片104P、一马达105P和一镜头106P。所述感光芯片102P被安装于所述线路板101P，所述滤光片104P被安装于所述支架103P，所述镜头106P被安装于所述马达105P，所述马达105P被安装于所述支架103P，以便于所述镜头106P位于所述感光芯片102P的感光路径上。
值得一提的是，在所述线路板101P上通常被安装有一些电路器件1011P，比如电阻、电容等，这些电路器件1011P凸出于所述线路板101P表面，而所述支架103P则需要被安装于具有所述电路器件1011P的所述线路板101P上，而传统的COB工艺中所述线路板101P、所述电路器件1011P以及所述支架103P之间的组装配合关系具有一些不利因素，且在一定程度上限制了摄像模组向轻薄化的发展。
还值得一提的是，所述感光芯片102P通常是通过一些金线1021P电连接于所述线路板101P，以便于所述感光芯片102P和所述线路板101P之间的信息传输。而基于所述金线1021P的特性与结构，所述金线1021P通常呈弧形地弯曲，凸出于所述线路板101P的表面，因此，所述感光芯片102P的组装过程也是和所述电路器件1011P一样，对摄像模组存在类似的影响因素。
具体来说，首先，所述电路器件1011P以及所述金线1021P直接暴露于所述线路板101P的表面，因此在后续组装的过程中，比如粘贴所述支架103P、焊接所述马达105P等过程，不可避免的会受到影响，焊接时的阻焊剂、灰尘等容易黏着于所述电路器件1011P，而所述电路器件1011P与所述感光芯片102P位于相互连通的一个空间内，因此灰尘污染物很容易影响感光芯片102P，这样的影响可能造成组装后的摄像模组存在污黑点等不良现象，降低了产品良率。
其次，所述支架103P位于所述电路器件1011P的外侧，因此在安装所述支架103P和所述线路板101P时，需要在所述支架103P和所述电路器件1011P之间预留一定的安全距离，且在水平方向以及向上的方向都需要预留安全距离，这在一定程度上增大了摄像模组厚度的需求量，使其厚度难以降低。
第三，在COB组装的过程中，所述支架103P或所述马达105P通过胶水等粘贴物被粘贴于所述线路板101P，在粘贴时通常要进行AA(Active Arrangement自动校准)工艺，就是调整所述所述感光芯片102P和所述镜头106P的中心轴线，使其达到水平方向和竖直方向的一致，因此为了满足AA工艺，需要在所述支架103P与所述线路板101P以及所述支架103P与所述马达105P之间都需要预设较多的胶水，使得相互之间留有调整空间，而这个需求一方面在一定程度上又增加了对摄像模组的厚度需求，使其厚度难以降低，另一方面，多次粘贴组装过程很容易造成组装的倾斜不一致，且对所述镜座103P、所述线路板101P以及所述马达105P的平整性要求较高。
值得一提的是，所述支架103P通常是通过注塑成型的方式制造而成，由于选用材料以及制造工艺的限制，使得所述支架103P自身的表面平整性较差，因此一方面使得所述支架 103P与所述线路板101P之间的粘接平整性以及稳定性较差，另一方面，使得所述支架3P为其他部件，如所述马达105P和/或所述镜头106P提供的安装平面的平整性较差，这些因素都会影响摄像模组最终品质以及批量化生产时良率的高低。
此外，传统的COB工艺中，所述线路板101P提供最基本的固定、支撑载体，因此，对于所述线路板101P本身要求具备一定的结构强度，这个要求使得所述线路板101P具有较大的厚度，从而从另一方面又预加了摄像模组的厚度需求。
随着各种电子产品、智能设备的发展，摄像模组也越来越向高性能、轻薄化方向发展，而面对高像素、高成像质量等各种高性能的发展要求，电路中的电子元器件越来越多、芯片的面积越来越大、驱动电阻、电容等被动元器件相应增多，这使得电子器件的规格越来越大、组装难度不断增大、摄像模组的整体尺寸越来越大，而从上述来看，镜座、线路板以及电路元件等的传统组装方式在一定程度上也是摄像模组轻薄化发展的极大限制。且对于摄像模组需求量急剧增大的今天，批量化生产是必不可少的内容，如何让产品的性能改进，且能够提高产品的良率，使得一项技术能够真正投入生产应用，这对于摄像模组技术研究者以及生产制造商具有极其重要的意义。
传统手机摄像模组封装线路板上面通常贴有电容和塑料件，且阻容器件和塑料件都是独立存在，在空间上并不重叠，塑料件起支撑作用。此种方案主要存在如下问题：
1、塑料支架单独成型后通过胶水粘结在线路板上，容易因为塑料支架本身的不平整和贴付的组装倾斜，最终造成模组倾斜；2、阻容器件与感光芯片存在在同一空间内，阻容器件部分的灰尘不容易清洗干净，进而影响模组最终黑点污点不良；3、线路板部分结构强度不强；4、尺寸难以做到很小，尤其是横向尺寸，两个摄像模组之间的尺寸比较浪费，影响了整体的尺寸。
近年来，电子设备越来越呈现出轻薄化的发展趋势，这对于作为电子设备的标准配置之一的摄像模组，尤其是对于摄像模组的高度尺寸提出了更为苛刻的要求。另外，使用者对于摄像模组的成像品质的要求也越来越高。因此，如何减小摄像模组的尺寸和提高摄像模组的成像品质是摄像模组行业近年来致力于要解决的技术问题。
目前，应用于摄像模组行业的MOC(Molding On Chip)封装工艺得到了发展，MOC封装工艺是在摄像模组被封装的过程中将感光芯片和线路封装在一起，以最大程度地提高摄像模组的结构强度、减小摄像模组的尺寸和减少灰尘不良的情况出现。具体地说，在采用MOC封装工艺制造摄像模组的过程中，首先将感光芯片贴装于线路板上，并通过金线将所述感光芯片和所述线路板相导通，然后将所述线路板放入到成型模具中，并使所述感光芯片的感光区域朝向成型模具，通过向所述成型模具中填入成形材料的方式形成支架，其中所述支架使所述感光芯片和所述线路板一体结合。尽管这样的方式在提高所述摄像模组的结构强度和减小所述摄像模组的尺寸方面起到了积极的效果，但是，所述摄像模组的这种制造过程仍然存在诸多问题。
首先，通常情况下，所述感光芯片通过与每个像素点一一匹配的微透镜来提高所述感光芯片的感光能力，所述微透镜通常为微米级别的，这使得所述微透镜极易被损坏或者被刮伤，尤其是在高温高压状态下，所述微透镜被损坏或者被刮伤的几率更大，而一般所述感光芯片中的任何一个所述微透镜被破坏或者被刮伤，则必要导致所述摄像模组的成像品质被影响。其次，所述感光芯片和所述线路板的贴装存在公差，这导致在成型模具施压于所述感光芯片的非感光区域之后，在所述感光芯片和成型模具之间会存在缝隙，当成形材料被填入成型模具后，成形材料会流入到形成于所述感光芯片与成型模具之间的缝隙，而导致成形材料形成的所述支架存在“飞边”的情况，一方面由于成形材料的温度比较高，一旦成形材料流动到所述感光芯片的感光区域，则必会给被设于所述感光芯片的感光区域的所述微透镜造成损坏，另一方面形成于所述支架的“飞边”可能会局部遮挡所述感光芯片的感光区域而造成产品不良。
光轴的一致性是影响摄像模组成像质量的一个重要因素，而光轴的一致性主要是指感光 芯片的中心轴线与镜头的主光轴的共轴，因此D/A(Die/Attach芯片贴附)工艺是摄像模组组装、制造过程中的一个重要工序。
参照图81A和81B是传统摄像中经过D/A工艺后的芯片和线路板。传统摄像模组中，通常是将一芯片501P贴附至一线路板502P上，也就是D/A过程，即，先在所述线路板表面502P上按特定形状涂布热固性导电胶或绝缘胶，比如以点胶的方式画点或十字形或交叉形，再将所述芯片501P贴附所述线路板502P上。通过贴附过程中的按压动作使得胶水摊开，从而粘附所述芯片501P。最后通过加热烘烤进行胶水干燥固化，使得所述芯片501P固定在所述线路板502P表面。
从这里可以明显地了解到，由于在粘贴的过程中，在所述线路板502P上涂布胶体503P，通过后续按压所述芯片501P的方式使得二者结合，因此，不能在所述线路板502P上涂布太多胶体503P，以防挤压溢出线路板侧边，污染所述线路板502P或所述芯片501P，也就是说，这个过程的胶体503P的量和形状都不易被掌控。通常是按预定形状，涂布较少量的胶体503P，以保证胶体不会溢出所述芯片501P边缘。在所述线路板502P上预定且较少的胶体503P，粘接的结果是在所述芯片501P的和所述线路板502P相对的边缘区域出现一悬空区504P，且通常四周都是所述悬空区504P。悬空区域504P的存在，很容易使得所述芯片501P出现倾斜现象，比如所述芯片501P和所述线路板502P存在一个夹角θ°，如图81B中所示，另一方面，按压后的胶体503P分布不均匀，平整度较差，比如误差在20μm左右，这些情况都会影响光学系统光轴的一致性，影响摄像模组的成像质量。另外，这样粘接的芯片501P和所述线路板502P的粘接稳定性较差，也就是说，所述芯片501P很容易在外力的作用下脱离所述线路板502P，可靠性较差。
进一步，参照图81C，MOC(Molding On Chip，模塑于芯片)工艺是近期发展起来一种重要的芯片组装工艺，这种工艺的主要流程是，先将所述芯片501P贴附于所述线路板502P，而后打金线505P，继而模塑一模塑支架506P于所述线路板502P和所述芯片501P，将所述芯片501P的边缘和所述线路板502P的连接区域进行模塑封装。在这种工艺过程中，进行模塑形成所述模塑支架506P时，所述芯片501P的边缘区域会受到模具的按压作用，而通过传统的D/A工艺的所述芯片501P和所述线路板502P之间存在所述悬空区504P，这种按压很容易使得所述芯片501P出现倾斜问题，甚至由于受力的不均匀而使得所述芯片501P边缘碎裂。因此为了保证较好光轴一致性以及芯片的可靠性，一方面需要所述芯片和所述线路板粘接平整，另一方面对于模塑工艺的按压过程精度要其较高，可是这些仍旧不能完全解决传统的D/A工艺对摄像模组带来可能的光轴不一致、解析不良、曲线异常、马达CODE异常等问题。
发明内容
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件包括一封装部和一感光部，所述封装部封装成型于所述感光部。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部一体成型于所述感光部，以便于提供平整的安装平面。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光部包括一感光芯片和一线路板主体，所述感光芯片通过至少一连接线电连接于所述线路板主体，所述封装部包覆所述连接线，使其不会直接暴露于外部。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述连接线被通过模塑的制造方式一体地包覆于所述封装部内部。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件包括至少一电路元件，所述电路元件被包覆于所述封装部内，以使其不会直接暴露于外部。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述电路元件被通过模塑的制造方式一体地包覆于所述封装部内部。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光芯片具有一感光区和一非感光区，所述封装部模塑于所述感光芯片的非感光区，减小所述感光组件以及由其组装的摄像模组的长宽尺寸。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述线路板主体具有一内凹槽，所述感光芯片被设置于所述内凹槽内，从而降低对所述封装部的高度要求。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部包括一包覆段和一滤光片安装段，所述滤光片安装段一体模塑连接于所述包覆段，所述滤光片安装段适于被安装一滤光片，从而不需要提供额外的滤光片安装支架。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部包括一镜头安装段，其一体地向上延伸，适于在其内部安装一镜头。
本发明的一个目的在于提供一基于模塑工艺的感光组件和摄像模组及其制造方法，其中所述镜头安装段具有螺纹，以便于螺接一镜头。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件包括一滤光片，所述滤光片模塑地设置于所述感光芯片的上方，从而通过所述滤光片保护所述感光芯片，且能够减小由其组装的摄像模组的后焦距，使得摄像模组的高度更小。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件包括一加固层，所述加固层叠层地连接于所述线路板主体的底侧，从而增加所述线路板主体的结构强度，以便于采用厚度更小的所述线路板主体，且能够提高所述线路板主体的散热能力。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述线路主体上具有至少一加固孔，所述封装部延伸进入所述加固孔，从而增强所述封装部与所述感光组件之间的粘接力，并且增加所述线路板主体的结构强度。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部上适于被安装一马达或一镜头，可以作为传统的支架，提供所述马达或所述镜头的支撑固定位置，且借助所述封装部的模塑成型优势，具有较好的平整度，从而得到减小摄像膜组件组装倾斜误差。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述摄像模组采用模塑的方式进行组装制造，从而改变传统的摄像模组COB工艺。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其采用模塑的方式制造所述感光线路组件，从而得到模塑、一体化的所述感光组件。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件包括一马达连接结构，以便于连接马达，从而改变传统的马达焊接方式。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部至少部分地一体封装所述线路板主体和所述感光芯片，向内扩展所述封装部的可设置位置，使得所述摄像模组的尺寸可以进一步减小。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部至少部分地一体封装所述线路板主体和所述感光芯片，使得所述感光芯片更加稳定地连接于所述线路板主体。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部至少部分地一体封装所述线路板主体和所述感光芯片，增大所述封装部和所述感光部的连接面积，从而使得所述封装部连接更加稳定。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部和所述感光部的相互连接面积较大，增强所述感光部的结构强度。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述感光组件适于制造多镜片、高像素摄像模组。
本发明的一个目的在于提供一摄像模组及其感光组件和制造方法，其中所述封装部形成倾斜度可控的内侧面，有助于减少杂散光反射于所述感光芯片，从而提高成像质量。
本发明的一个目的在于提供一摄像模组及其感光组件及其制造方法，其中所述摄像模组适于应用于实际生产过程，提高产品批量生产良率，减低生产成本。
本发明的一个目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够增强模组的受力强度。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面模塑方案，能够增加线路板切割效率。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面模塑方案，使模组设计更加灵活。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板底部模塑方案，能够增强模组结构强度。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够提升模组散热效率。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够提高模组的感光芯片表面和封装部的上表面的平行度，以及封装部上表面的平整度。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够减少加工工序，提高生产效率。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够使模组整体尺寸更小。
本发明的另一目的在于提供一基于一体封装工艺的摄像模组，采用线路板侧面或底面模塑方案，能够防止模组成型后灰尘进入影响性能。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述摄像模组提供一保护框，所述保护框被设置于感光芯片的感光区域的外周侧，以在一一体封装支架成型时，所述保护框阻止用于形成所述一体封装支架的成形材料损坏所述感光芯片的感光区域。
本发明的一个目的在于提供一摄像模组及其制造方法，其中在所述一体封装支架成型时，所述保护框阻止在所述一体封装支架的内侧出现“飞边”的情况。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框被设置于滤光元件的外周侧，在所述一体封装支架成型时，所述保护框阻止在所述一体封装支架的内侧出现“飞边”的情况。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框被凸起地设置于所述感光芯片的感光区域的外周侧，用于成型所述一体封装支架的成型模具施压于所述保护框，以藉由所述保护框阻止所述成型模具直接与所述感光芯片接触，从而避免所述感光芯片的感光区域受压而被损坏或者被刮伤。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框具有弹性以提供缓冲能力，在所述保护框受压后能够与所述成型模具充分接触，以起到密封作用而隔离所述感光芯片的感光区域与外部环境，从而在所述一体封装支架成型时避免所述感光芯片的感光区域受损。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框具有弹性以提供缓冲能力，从而可以降低对所述摄像模组的平整度的要求，和降低所述摄像模组的各个机构的装配要求。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框在成型后被重叠地设置于所述感光芯片，以提高所述摄像模组的制造效率。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述成型模具的模具上部表面设有至少一覆盖膜，在所述成型模具的模具上部施压时，所述覆盖膜也可以对所述感光芯片提供进一步保护，另外，所述覆盖膜也可以增加脱模难度和增加密封性，以防止“飞边”。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述成型模具对应于所述感 光芯片的感光区域可以内凹设计，以使所述感光芯片的感光区域和所述成型模具之间具有安全距离，从而让进一步降低对所述感光芯片的影响。
本发明的一个目的在于提供一摄像模组及其制造方法，其中所述保护框被覆盖一层保护膜，以便于将所述保护框设置于所述感光芯片，另外，所述保护膜也可以隔离所述感光芯片的感光区域和外部环境。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，所述感光组件包括一感光芯片和一线路板主体，所述感光芯片通过一连接介质连接于所述线路板主体，且所述连接介质和所述感光芯片形状相匹配。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，所述感光芯片和所述线路板主体之间区域通过所述连接介质完全填充，不存在悬空区域，从而提高所述感光芯片的平整度，减少出现所述感光芯片相对所述线路板主体的倾斜现象。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，所述感光芯片具有一正面和一背面，在制造所述感光组件时，可以在所述感光芯片背面喷涂所述连接介质，且切除多余的所述连接介质，使得所述连接介质和所述感光芯片的形状相匹配。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，在制造所述感光组件时，通过滚压的方式施加所述连接介质于所述感光芯片的背面，且切除多余的所述连接介质，使得所述连接介质平整地贴附于所述感光芯片背面，保证所述感光芯片和所述线路板主体的粘接平整性。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，所述连接介质包括一线路板膜，所述线路板膜贴被附于所述线路板主体，所述线路板膜和所述感光芯片形状相匹配。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，其中在制造所述感光组件时，可以在一整版芯片背面设置所述连接介质，而后对整板芯片进行裁切形成多个单独所述感光芯片，进一步分别将多个所述感光芯片贴附于对应的所述线路板主体，适宜批量化生产，缩短所述感光组件的组装工时，提升芯片贴附生产效率。
本发明的一个目的在于提供一感光组件和摄像模组及其制造方法，其中所述感光组件包括一模塑体，一体成型于所述线路板和所述感光芯片，所述芯片平整地贴附于所述线路板主体，从而使得在形成所述模塑体时，不会使得所述感光芯片产生倾斜，以保证摄像模组光轴的一致性。
为了实现本发明的以上目的以及本发明的其他目的和优势，本发明的一方面提供一摄像模组的感光组件，其包括：一封装部和一感光部；所述感光部包括一线路板主体和一感光芯片，所述封装部封装成型于所述线路板主体和所述感光芯片。
根据本发明的一实施例，所述的感光组件中所述封装部形成一通孔，所述通孔与所述感光芯片相对，以提供所述感光芯片光线通路。
根据本发明的一实施例，所述的感光组件中所述封装部的所述通孔的底部呈由下至上逐渐增大的倾斜状。
根据本发明的一实施例，所述的感光组件中所述封装部顶端适于安装所述摄像模组的镜头、马达或滤光片。
根据本发明的一实施例，所述的感光组件中所述封装部顶端呈平面状，以用于安装所述摄像模组的镜头、马达或滤光片。
根据本发明的一实施例，所述的感光组件中所述封装部顶端具有一安装槽，所述安装槽连通于所述通孔，以用于安装所述摄像模组的滤光片、镜头或马达。
根据本发明的一实施例，所述的感光组件中所述封装部包括一包覆段、一滤光片安装段和一镜头安装段，所述滤光片安装段和所述镜头安装段依次由所述包覆段向上模塑延伸，且内部呈台阶状，以便于安装所述摄像模组的滤光片和镜头。根据本发明的一实施例，所述的感光组件中所述镜头安装段具有一镜头内壁，所述镜头内壁表面平整，以适于安装一无螺纹 镜头。
根据本发明的一实施例，所述的感光组件中所述镜头安装段具有一镜头内壁，所述镜头内壁表面具有螺纹，以适于安装一带螺纹镜头。
根据本发明的一实施例，所述的感光组件中所述感光部包括至少一连接线，所述连接线电连接所述感光芯片和所述线路板主体，所述封装部包覆所述连接线，以使得所述连接线不会直接暴露于外部。
根据本发明的一实施例，所述的感光组件中所述连接线选自组合：金线、银线、铜线或铝线中的一种。
根据本发明的一实施例，所述的感光组件中所述连接线呈弧形地连接所述线路板主体和所述感光芯片。
根据本发明的一实施例，所述的感光组件中所述感光芯片包括一感光区和一非感光区，所述非感光区围绕于所述感光区外围，所述封装部模塑延伸至所述感光芯片的所述非感光区，以扩展所述封装部向内的可模塑范围，减小所述封装部的外围尺寸。
根据本发明的一实施例，所述的感光组件中所述感光部包括至少一电路元件，所述电路元件凸出于所述线路板主体，所述封装部包覆所述电路元件，以使得所述电路元件不会直接暴露于外部。
根据本发明的一实施例，所述的感光组件中所述电路元件选择组合：电阻、电容、二极管、三级管、电位器、继电器和继电器中的其中一种或多种。
根据本发明的一实施例，所述的感光组件中所述感光部包括一滤光片，所述滤光片覆盖于所述感光芯片，所述封装部成型于所述线路板主体、所述感光芯片和所述滤光片，以便于通过所述滤光片防护所述感光芯片，且减小所述摄像模组的后焦距，使其高度减小。
根据本发明的一实施例，所述的感光组件中所述感光部包括一加固层，所述加固层叠层设置于所述线路板主体底部，以增强所述线路板主体的结构强度。
根据本发明的一实施例，所述的感光组件中所述加固层为金属板，以增强所述感光部的散热性能。
根据本发明的一实施例，所述的感光组件中所述感光部包括一屏蔽层，所述屏蔽层包裹所述线路板主体和所述封装部，以增强所述感光组件的抗电磁干扰性能。
根据本发明的一实施例，所述的感光组件中所述屏蔽层为金属板或金属网。
根据本发明的一实施例，所述的感光组件中线路板主体具有至少一加固孔，所述封装部延伸进入所述加固孔，以便于增强所述线路板主体的结构强度。
根据本发明的一实施例，所述的感光组件中所述加固孔为凹槽状。
根据本发明的一实施例，所述的感光组件中所述加固孔为通孔，以使得所述封装部的模塑材料与所述线路板主体充分接触，且易于制造。
根据本发明的一实施例，所述的感光组件中所述线路板主体的材料可以选自组合：软硬结合板、陶瓷基板、PCB硬板或FPC。
根据本发明的一实施例，所述的感光组件中所述封装部的材料选自组合：尼龙、LCP、PP或树脂中的一种或多种。
本发明的另一方面提供一摄像模组的感光组件的制造方法，其包括步骤：在一线路板主体和一感光芯片上封装成型一封装部。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在一线路板主体贴附所述感光芯片，且通过至少一连接线电连接。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：通过所述封装部包覆所述连接线。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：延伸所述封装部至所述感光芯片的一非感光区。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述封装部顶端形 成一安装槽，以便于安装一滤光片、马达或镜头。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：向上延伸所述封装部，且内部形成两阶台阶状结构，以便于安装滤光片或镜头。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述封装部内壁设置螺纹结构，以便于安装带螺纹的镜头。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述线路板主体上设置至少一凹槽状加固孔，并使所述封装部延伸进入所述加固孔。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述线路板主体上设置至少一通孔状加固孔，并使所述封装部延伸进入所述加固孔。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述线路板主体底层贴附一加固层，以增强所述线路板主体的结构强度。
根据本发明的一实施例，所述的感光组件的制造方法中包括步骤：在所述线路板主体和所述封装部包覆一屏蔽层，以增强所述感光组件的抗电磁干扰性能。
本发明的另一方面提供一摄像模组的感光组件，其包括一封装部和一感光部；所感光部包括一线路板主体、一感光芯片和一滤光片，所述封装部封装成型于所述线路板主体、所述感光芯片和所述滤光片。
本发明的另一方面提供一摄像模组的感光组件中所述封装部具有一镜头安装槽，所述镜头安装槽连通于所述通孔，以便于为所述摄像模组的镜头或马达提供安装位置
本发明的另一方面提供一摄像模组的感光组件的制造方法，其包括步骤：在一线路板主体、一感光芯片和一滤光片上封装一封装部。
根据本发明的另一实施例，所述的感光组件的制造方法中包括步骤：在一线路板主体贴附所述感光芯片，且通过至少一连接线电连接。
根据本发明的另一实施例，所述的感光组件的制造方法中包括步骤：在所述感光芯片上覆盖所述滤光片，以防护所述感光芯片。
根据本发明的另一实施例，所述的感光组件的制造方法中包括步骤：通过所述封装部包覆所述连接线和所述滤光片。
根据本发明的另一实施例，所述的感光组件的制造方法中包括步骤：延伸所述封装部至所述滤光片边缘。
根据本发明的另一方面提供一摄像模组，其包括一所述的感光组件；和一镜头；所述镜头位于所述感光组件的所述感光芯片的感光路径。
根据本发明的一实施例，所述的摄像模组包括一支架，所述支架被安装于所述感光组件，所述镜头被安装于所述支架。
根据本发明的一实施例，所述的摄像模组包括一马达，所述镜头被安装于所述马达，所述马达被安装于所述感光组件。
根据本发明的一实施例，所述的摄像模组包括一滤光片，所述滤光片被安装于所述感光组件。
根据本发明的一实施例，所述的摄像模组包括一滤光片，所述滤光片被安装于所述支架。
附图说明
图1是传统COB工艺的摄像模组剖示图。
图2是根据本发明的第一个优选实施例的感光组件的立体图。
图3是根据本发明的第一个优选实施例的感光组件的剖示图。
图4是根据本发明的第一个优选实施例的感光组件的制造过程示意图。
图5是根据本发明的第一个优选实施例的感光组件的制造方法示意图。
图6是根据本发明的第一个优选实施例的摄像模组剖示图。
图7是根据本发明的第一个优选实施例的摄像模组分解图。
图8是根据本发明的第一个优选实施例的另一摄像模组剖示图。
图9是根据本发明的第一个优选实施例的另一摄像模组的分解图。
图10A是根据本发明的第二个优选实施例的感光组件的剖示图。
图10B是根据本发明的第二个优选实施例的变形实施方式。
图11是根据本发明的第二个优选实施例的摄像模组剖示图。
图12是根据本发明的第三个优选实施例的感光组件的剖视图。
图13是根据本发明的第三个优选实施例的摄像模组剖示图。
图14是根据本发明的第三个优选实施例的另一摄像模组剖示图。
图15是根据本发明的第四个优选实施例的感光组件的剖示图。
图16是根据本发明的第四个优选实施例的感光组件制造方法示意图。
图17是根据本发明的第四个优选实施例的摄像模组剖示图。
图18是根据本发明的第四个优选实施例的另一摄像模组剖示图。
图19A是根据本发明的第五个优选实施例的感光组件剖示图。
图19B是根据本发明的第五个优选实施例的一变形实施方式。
图20A是根据本发明的第五个优选实施例的摄像模组剖示图。
图20B是根据本发明的第五个优选实施例的感光组件示意图。
图21是根据本发明的第六个优选实施例的感光组件剖示图。
图22是根据本发明的第六个优选实施例的摄像模组剖示图。
图23是根据本发明的第七个优选实施例的感光组件剖示图。
图24是根据本发明的第七个优选实施例的感光组件分解图。
图25是根据本发明的第八个优选实施例的模组感光组件剖示图。
图26是根据本发明的第九个优选实施例的摄像模组剖示图。
图27是根据本发明的第十个优选实施例的摄像模组剖视图。
图28是根据本发明的第十一个优选实施例的感光组件示意图。
图29是根据本发明的第十二个优选实施例的感光组件示意图。
图30是根据本发明的第十二优选实施例的感光组件的变形实施方式。
[根据细则91更正 20.04.2017]　
图31是根据本发明的第十三个优选实施例的感光组件示意图。
[根据细则91更正 20.04.2017]　
图32Ａ是根据本发明的第十四个优选实施例的感光组件示意图。
[根据细则91更正 20.04.2017]　
图32B是根据木发UJJ的第十四个优选实施例的变形实施方式示意图。
图33是根据本发明的上述优选实施例的组成的不同阵列摄像模组示意图。
图34是根据本发明的上述优选实施例的组成的另一阵列摄像模组示意图。
图35是根据本发明的上述优选实施例的摄像模组应用示意图。
图36A和36B是根据本发明的上述优选实施例的摄像模组的有益效果比较图。
图37是根据本发明的第十六个优选实施例的感光组件的立体图。
图38是根据本发明的第十六个优选实施例的感光组件的剖示图。
图39是根据本发明的第十六个优选实施例的感光组件的制造过程示意图。
图40是根据本发明的第十六个优选实施例的感光组件的制造方法示意图。
图41A、41B和图41C是根据本发明的第十六个优选实施例的感光组件的马达连接结构的不同实施方式示意图。
图42是根据本发明的第十六个优选实施例的摄像模组剖示图。
图43是根据本发明的第十六个优选实施例的摄像模组分解图。
图44是根据本发明的第十六个优选实施例的另一摄像模组剖示图。
图45是根据本发明的第十六个优选实施例的另一摄像模组的分解图。
图46是根据本发明的第十七个优选实施例的感光组件的剖示图。
图47是根据本发明的第十七个优选实施例的摄像模组剖示图。
图48是根据本发明的第十八个优选实施例的感光组件的剖视图。
图49是根据本发明的第十八个优选实施例的摄像模组剖示图。
图50是根据本发明的第十八个优选实施例的另一摄像模组剖示图。
图51是根据本发明的第十九个优选实施例的感光组件的剖示图。
图52是根据本发明的第十九个优选实施例的感光组件制造方法示意图。
图53是根据本发明的第十九个优选实施例的摄像模组剖示图。
图54是根据本发明的第十九个优选实施例的另一摄像模组剖示图。
图55是根据本发明的第二十个优选实施例的感光组件剖示图。
图56是根据本发明的第二十个优选实施例的感光组件分解图。
图57是根据本发明的第二十一个优选实施例的模组感光组件剖示图。
图58是根据本发明的第二十一个优选优选实施的摄像模组剖视图。
图59是根据本发明的第二十二个优选实施例的摄像模组剖视图。
图60是根据本发明的一基于一体封装工艺的摄像模组的一优选实施例的侧面剖视图。
图61是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图62A是对比技术形成的模塑形成摄像模组示意图。
图62B是对比技术中传统的模塑形成摄像模组示意图。
图62C是对比技术中传统的模塑形成摄像模组示意图。
图62D是对比技术中传统的模塑形成摄像模组示意图。
图62E是对比技术中传统的模塑形成摄像模组示意图。
图63A是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图63B是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图64是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图65是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图66A是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图66B是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图67A是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图67B是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图68A是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图68B是根据本发明的一基于一体封装工艺的摄像模组的另一实施例的侧面剖视图。
图69是根据本发明的一基于一体封装工艺的摄像模组的上述实施例的马达和线路板导通方式的侧面剖视图。
图70是根据本发明的一基于一体封装工艺的摄像模组的上述实施例的马达和线路板另一种导通方式的侧面剖视图。
图71是根据本发明的一基于一体封装工艺的摄像模组的上述实施例的马达和线路板另一种导通方式的侧面剖视图。
图72是依本发明的一优选实施例的摄像模组被沿着中间位置剖开后的内部结构示意图。
图73是依发明的上述优选实施例的摄像模组的线路板、感光芯片和保护框的结构关系立体示意图。
图74A是依本发明的上述优选实施例的摄像模组的一制造过程之步骤一的剖视示意图。
图74B是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤二的剖视示意图。
图74C是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤三的剖视示意图。
图74D是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤四的剖视示意图。
图74E是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤五的剖视示意图。
图74F是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤六的剖视示意 图。
图75A是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤三的变形实施方式的剖视示意图。
图75B是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤四的变形实施方式的剖视示意图。
图76是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤四的另一变形实施方式的剖视示意图。
图77A是依本发明的上述优选实施例的摄像模组的另一制造过程之步骤一的剖视示意图。
图77B是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤二的剖视示意图。
图77C是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤三的剖视示意图。
图77D是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤四的剖视示意图。
图77E是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤五的剖视示意图。
图77F是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤六的剖视示意图。
图77G是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤七的剖视示意图。
图78是依本发明的另一优选实施例的摄像模组被沿着中间位置剖开后的内部结构示意图。
图79是依发明的上述优选实施例的摄像模组的线路板、感光芯片、滤光元件和保护框的结构关系立体示意图。
图80A是依本发明的上述优选实施例的摄像模组的一制造过程之步骤一的剖视示意图。
图80B是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤二的剖视示意图。
图80C是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤三的剖视示意图。
图80D是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤四的剖视示意图。
图80E是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤五的剖视示意图。
图80F是依本发明的上述优选实施例的摄像模组的上述制造过程之步骤六的剖视示意图。
[根据细则91更正 20.04.2017]　
图80G是依木发明的上述优选实施例的摄像模组剖视示意图。
图81A、81B、81C是传统D/A工艺组装的芯片和线路板。
图82是根据本发明的一个优选实施例的感光组件剖视示意图。
图83是根据本发明的一个优选实施例的感光组件第一种制造过程示意图。
图84是根据本发明的一个优选实施例的感光组件第一种制造方法框图。
图85是根据本发明的一个优选实施例的感光组件第二种制造过程示意图。
图86是根据本发明的一个优选实施例的感光组件第二种制造方法框图。
图87A是根据本发明的一个优选实施例的感光组件第三种制造过程示意图。
图87B是根据本发明的一个优选实施例的感光组件的第四种制造过程示意图。
图88是根据本发明的一个优选实施例的感光组件的第三种制造方法框图。
图89是根据本发明的一个优选实施例的应用所述感光组件的摄像模组剖视示意图。
图90是根据本发明的另一个优选实施例的感光组件剖视示意图。
图91是根据本发明的另一个优选实施例的应用所述感光组件的摄像模组剖视示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
参照图2至图7，根据本发明的第一个优选实施例的感光组件和摄像模组被阐释。所述感光组件1010用于组装制造所述摄像模组。所述感光组件1010包括一封装部1011和一感光部1012，所述封装部1011一体封装地连接于所述感光部1012，如模塑地连接于所述感光部1012。
所述感光部1012包括一线路板主体10122和一感光芯片10121，所述感光芯片10121被设置于所述线路板主体10122上。根据本发明的这个实施例，所述感光芯片10121模塑地连接于所述线路板主体10122。特别地，所述封装部1011以模塑于芯片的方式(Molding on Chip，MOC)模塑于所述感光部1012。
也就是说，所述封装部1011至少部分地一体封装所述线路板主体10122和所述感光芯片10121。
根据本发明这个实施例，所述感光部1012包括一连接线路和至少一电路元件10123。所述连接线路预设于所述线路板主体10122，所述电路元件10123电连接于所述连接线路以及所述感光芯片10121，以供所述感光芯片10121的感光工作过程。所述电路元件10123被凸出地设置于所述线路板主体10122。所述电路元件10123可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011将所述电路元件10123包覆于其内部，因此使得所述电路元件10123不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121相通的环境中，从而当组装所述摄像模组时，所述电路元件10123上不会沾染灰尘等污染物，也不会影响所述感光芯片10121，不同于传统摄像模组中电路器件暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123表面，避免污染所述感光芯片10121而使得摄像模组出现污黑点等不良现象。
所述封装部1011一体成型于所述线路板主体10122和所述感光芯片10121的方式带来诸多优势，举例地但不限于，第一，所述封装部1011模塑一体成型于所述线路板主体10122和所述感光芯片10121，从而不需要像传统COB模组中的所述支架3P粘接于所述线路板1P，节省画胶空间，也不需要对所述封装部1011进行AA调整；第二，所述封装部1011模塑地一体成型于所述线路板主体10122和所述感光芯片10121，可以使得所述封装部1011的表面平整性较好，优于传统的注塑成型得到的所述支架3P的平整性；第三，所述封装部1011模塑地一体成型于线路板主体10122和所感光芯片10121，使得所述封装部1011的可成型或可设置区域向内扩展，从而使得所述摄像模组的整体尺寸向内压缩，进一步提供所述摄像模组尺寸减小的可能范围；第四，所述封装部1011模塑地一体成型于所述线路板主体10122和所述感光芯片10121，使得所述所述感光芯片10121被所述封装部1011更加稳定地固定于所述线路板主体10122，增加所述摄像模组的使用寿命；第五，所述封装部1011模塑地一体成型于所述线路板主体10122和所述感光芯片10121，增大了所述封装部1011和 所述感光部1012整体的连接面积，从而使得所述封装部1011连接更加稳定；第六，所述封装部1011模塑地一体成型于所述线路板主体10122和所述感光芯片10121，使得所述封装部1011和所述感光部1012的相互连接面积较大，从而通过所述封装部1011增强所述感光部1012的结构强度；第七，所述封装部1011模塑地一体成型于所述线路板主体10122和所述感光芯片10121的方式，使得所述感光组件1010能够被应用于制造多镜片、高像素的摄像模组，使得模塑封装工艺得以被应用于实际生产，适合现有的摄像模组各部件的发展需求；第八，所述封装部1011模塑地一体成型于所述线路板主体10122的方式可以灵活地控制所述封装部1011高度以及宽度，从而可以灵活控制所述摄像模组的后焦距大小，以及形成不同体积的模组，从而适应不同类型的摄像模组；第九，所述封装部1011模塑的一体成型于所述线路板主体10122，不需要胶水等连接介质，紧密地连接于所述线路板主体，增强所述线路板主体10122的结构强度，使得所述线路板主体10122的厚度可以进一步减小。
还值得一提的是，摄像模组作为一种较小尺寸的产品，其组成部件尺寸都较小，因此任何小的区别可能对于摄像模组都会带来较大的影响，因此这些变化，即使宏观概念上较小，但是对于摄像模组的实际生产过程却极其重要，甚至影响到是否可以将一个概念付诸于实际的生产过程。
还值得一提的是，摄像模组作为一个整体，其由众多部件组成，如感光芯片、镜头、马达等，这些部件相互适应。也就是说，各部件的发展并不是独立的，而是相关的，比如像素的提高，与感光芯片有关，也与镜头有关，而镜头需要安装条件，与支撑部件有关。在这种实际的生产发展状态中，早期的感光芯片的性能较低，镜头的镜片数量也减少，比如可能只有一片、两片，因此相应地对于支架的要求也较低，平整性、电子器件的暴露以及尺寸的大小等因素对摄像模组整体的影响并不是主要的考虑因素，更重要的在于基本硬件，如感光芯片和所述镜头的性能等的提升，而对于现阶段的摄像模组，尤其是对应智能手机快速发展阶段的摄像模组，对其像素、尺寸、精度等各方面的要求不断提升，比如镜片数量达到4片、5片、6片、7片等，这种需求也使得摄像模组的发展越来越细节化，比如本发明中的所述封装部1011一体封装所述线路板主体10122和所述感光芯片10121的方式，可能对于1片或者2片镜片的镜头构成的摄像模组来说，并不需要进行这样改进，或者这种改进并不能显现其优势，可是对于由较多镜片的镜头构成的摄像模组来说，这种改进则成为一种适合发展趋势的改进，可以使其优势得以显现，因此更适于投入实际的生产过程。且另一方面，在实际生产过程中一个重要因素是产品良率，也就是说产品在批量化生产时表现出来的整体性能的稳定性，而对于本发明实施例的摄像模组，相对传统COB的结构的摄像模组，其产品良率得到明显提升，因此即使同样大小的摄像模组，本发明的摄像模组也具有其优势，适于批量化生产，降低生产成本，适于整个摄像模组行业的发展区域。当然，所述封装部1011一体封装所述线路板主体10122和所述感光芯片10121的方式，还具有其他更多优势，在此不再一一列举。
值得一提的是，在本发明的这个实施例中，以所述电路元件10123凸出于所述线路板主体10122为例进行说明，而在本发明的其他实施例中，所述电路元件10123可以被埋设于所述线路板主体10122而不凸出于所述线路板主体10122，或者被贴装于所述线路板主体10122的背面，本领域的技术人员应当理解的是，所述电路元件10123的形状、类型以及设置位置并不是本发明的限制。
所述封装部1011形成一通孔101100，以便于为所述感光芯片10121提供感光路径。
也就是说，所述封装部1011提供一光窗，为所述感光芯片10121提供光线通路，从而使得经过位于所述封装部1011上方的所述镜头1030(后续提出)的光线能够到达所述感光芯片10121，而不被所述封装部1011阻挡。
根据本发明的这个优选实施例，所述感光部1012包括至少一连接线10124，用于电连接所述感光芯片10121和所述线路板主体10122。进一步，所述连接线10124可以被实施为，具例地但不必限于，金线、铜线、铝线、银线等。特别地，所述连接线10124呈弧形地连接 所述感光芯片10121和所述线路板主体10122。
值得一提的是，所述连接线10124被模塑于所述封装部1011内部，从而可以借助所述封装部1011将所述连接线10124进行包覆，而不会直接暴露于外部，从而在组装所述摄像模组时，使得所述连接线10124不会受到任何的碰触损伤，同时减少环境因素对所述连接线10124的影响，如温度，使得所述感光芯片10121和所述线路板主体10122之间的通讯连接稳定，这一点是完全不同于现有技术的。
优选地，所述封装部1011的所述通孔101100的底部呈由下至上逐渐增大的倾斜状，但此形状并不理解为限制本发明。
所述封装部1011具有一内侧面101200，所述内侧面101200环绕形成所述通孔101100。所述内侧面101200倾斜地设置，以使得所述通孔101100呈由下至上逐渐增大的倾斜状。具体地，所述内侧面101200具有一倾斜角α，即所述内侧面101200的倾斜方向与垂直方向的夹角。
值得一提的是，所述封装部1011通过一成型模具(后续提出)一体成型制造，在所述封装部1011成型后，所述成型模具需要脱离所述感光组件1010，即，拔模过程。由于成型模具与所述封装部1011之间的相互作用力，比如挤压力、摩擦力等，使得所述成型模具在拔出过程中，一方面所述成型模具很难拔出，另一方面，影响所述封装部1011的成型形状，出现毛刺，甚至更严重的现象，这些问题严重困扰实际生产，使得产品良率极低，而在本发明中，所述封装部1011倾斜地设置，使得所述成型模具只要与所述封装部1011产生一定位移，所述封装部1011就会与成型模具之间产生间隙，从而减小所述成型模具对所述封装部1011的影响，使得所述摄像模组得以投入实际的批量生产应用。值得注意的是，这些较小的设计点的改进，需要经过长久的实验过程才能得到，且对于一个理论上看似可行的方案到是否可以投入生产之间的一些决定因素可能就是这些不易察觉的小改进。
所述倾斜角α的大小可以根据实际需求设计。
所述封装部1011的所述内侧面101200的设置，以及所述内侧面101200的倾斜结构存在诸多优势，举例地但不限于，第一，所述内侧面101200倾斜地设置适于实际生产的拔模过程，减少所述封装部1011的毛刺并且使其得以投入实际生产应用；第二，所述内侧面101200的设置，增大了所述镜头封闭的内空间的空气直接接触面积，且由于所述封装部1011的一体成型材料特性的影响，从而使得内空间内的微尘更易于停留在所述封装部1011的所述内侧面101200，即，具有捕捉微尘的作用；第三，所述内侧面101200倾斜的设置，改变进入的光线在所述内侧面101200上的反射角度，减少杂散光反射至所述感光芯片10121的感光区，减少杂散光对成像质量的影响；第四，所述内侧面101200倾斜地设置，所述封装部1011的上端口增大，增加所述感光芯片10121的进光量。
本发明的一个目的在于提供一摄像模组及其感光组件及其制造方法，其中所述摄像模组适于应用于实际生产过程，提高产品批量生产良率，降低生产成本。
值得一提的是，所述封装部1011包覆所述电路元件10123和所述连接线10124，具有保护所述电路元件10123和所述连接线10124及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011不限于包覆所述电路元件10123或所述连接线10124。也就是说，在本发明的其他实施例中，所述封装部1011可以直接模塑于没有凸出的所述电路元件10123的所述线路板主体10122，也可以是模塑于所述电路元件10123外侧、周围等不同位置。
进一步，所述感光芯片10121具有一感光区101211和一非感光区101212，所述非感光区101212环绕于所述感光区101211外围。所述感光区101211用于进行感光作用，所述连接线10124连接于所述非感光区101212。
根据本发明的这个优选实施例，所述封装部1011延伸于所述感光芯片10121的所述非感光区101212，从而将所述感光芯片10121通过模塑的方式叠层固定于所述线路板主体10122。通过这样的方式，如模塑于芯片的方式(Molding on Chip，MOC)扩大了所述封装 部1011向内的可模塑范围，从而可以减小所述线路板主体10122以及所述封装部1011的外侧的结构性部分，进一步减小所述感光组件1010的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011凸起地围绕于所述感光芯片10121的所述感光区101211外侧，特别地，所述封装部1011一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010被用于组装所述摄像模组时，所述感光芯片10121被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010时，可以选取一传统的线路板作为所述线路板主体10122，在所述线路板主体10122上设置一所述感光芯片10121，将所述感光芯片10121通过所述连接线10124电连接，进而在初步组装后的所述线路板主体10122和感光芯片10121部件上进行模塑，比如用半导体封装中常用的模压工艺(Molding)形成所述封装部1011，或所述线路板主体10122可以选择为用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011，所述线路板主体10122可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
值得一提的是，基于本发明的所述感光组件1010的模塑成型的方式，所述感光组件1010更适合拼版作业，一次完成较多量的所述感光组件1010的制造，比如可以达到90个，而传统的注塑封装部，即镜座，需要先涂画胶水，并且一般一次只能贴装一个，在注塑过程中一般一次性生产4-8个，最多只能生产32个。
所述封装部1011包覆所述电路元件10123以及所述连接线10124的方式带来诸多优势，举例地但不限于，第一，所述封装部1011包覆所述电路元件10123以及所述连接线10124，因此不需要为所述电路元件10123以及所述连接线10124预留额外的安全空间，提供所述摄像模组尺寸减小的可能性；第二，所述封装部1011包覆所述电路元件10123以及所述连接线10124，使得所述电路元件10123和所述连接线10124被稳定地固定于内部，避免组装过程中碰触等不必要的影响，且减小在摄像模组使用过程中可能产生的晃动等因素带来的影响；第三，所述封装部1011包覆所述电路元件10123以及所述连接线10124，使得所述电路元件10123和所述连接线10124与其他部件以及相互之间隔离，减小外部以及相互之间的电磁影响，使其工作更加稳定；第四，所述封装部1011包覆所述电路元件10123以及所述连接线10124，从而使得所述电路元件10123以及所述连接线10124不会直接暴露于镜头封闭的内空间，从而避免所述电路元件10123以及所述连接线10124上的微尘等杂物金进入内空间而影响成像质量，且避免所述电路元件10123以及所述连接线10124反射杂散光到达所述感光芯片10121从而影响成像质量；第五，所述封装部1011包覆所述连接金线，使得所述封装部1011一体成型的区域向内扩展至所述感光芯片10121的非感光区。
进一步，所述封装部1011包括一包覆段10111和一滤光片安装段10112，所述滤光片安装段10112模塑地一体连接于所述包覆段10111，所述包覆段10111模塑连接于所述线路板主体10122，用于包覆所述电路元件10123和所述连接线10124。所述滤光片安装段10112用于安装一滤光片1020，也就是说，当所述感光组件1010被用于组装所述摄像模组时，所述摄像模组的所述滤光片1020被安装于所述滤光片安装段10112，使得所述滤光片1020位于所述感光芯片10121的感光路径上，且不需要提供额外的滤光片安装支架。也就是说，所述封装部1011在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段10112顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片1020 平整地被安装，这一点也是优于传统的摄像模组。特别地，所述滤光片1020为一红外截止滤光片IRCF。
更进一步，所述滤光片安装段10112具有一安装槽101121，所述安装槽101211连通于所述通孔101100，为所述滤光片1020提供充足的安装空间，使得所述滤光片1020不会凸出于所述滤光片安装段10112的顶表面101122。也就是说，所述封装部1011上端设置所述安装槽101121，从而可以将所述滤光片1020安装于其中。
值得一提的是，在本发明的这个实施例中，所述安装槽101121可以用于安装滤光片，而在本发明的其他实施中，所述安装槽101121可以用来安装所述摄像模组的马达或镜头等部件，本领域的技术人员应当理解的是，所述安装槽101121的用途并不是本发明的限制。值得一提的是，所述封装部1011的内壁可以根据所述连接线10124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线10124的同时使得所述感光芯片10121可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011的形状并不是本发明的限制。
参照图2至图7，根据本发明的第一个优选实施例的摄像模组。所述摄像模组可以是一定焦模组(Fix Focus Model，FFM)。所述摄像模组10100包括一所述感光组件1010、一所述滤光片1020和一镜头1030。
所述滤光片1020被安装于所述感光组件1010，所述镜头1030被安装于所述感光组件1010上。
更具体地，所述滤光片1020被安装于所述感光组件1010的所述封装部1011的所述滤光片安装段10112的所述安装槽101121。所述镜头1030被安装于所述感光组件1010的所述封装部1011的所述滤光片安装段10112的顶部。也就是说，所述滤光片1020被安装于所述安装槽，所述镜头1030被安装于所述封装部1011顶端。
还值得一提的是，所述镜头1030被安装于所述感光组件1010的所述封装部1011的所述滤光片安装段10112顶端，从而所述封装部1011相当于传统摄像模组中的支架的功能，为所述镜头1030提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部1011通过模塑工艺固定于所述线路板主体10122，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部1011与所述线路板主体10122之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，且在达到结构强度的条件下，本发明的模塑方案中的所述线路板主体10122的厚度可以更小，当滤光片被直接贴于模塑面时，镜头后焦可以更短，使得摄像模组的厚度得以减小；另一方面，所述封装部1011包覆所述电路元件10123和所述连接线10124，使得传统的支架功能和电路元件10123以及所述连接线10124可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部1011的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部1011代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部1011包覆所述连接线10124，且所述封装部1011延伸至所述感光芯片10121的非感光区101212，使得所述封装部1011可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
参照图2至图5以及图8和图9，是根据本发明的第一个优选实施例的另一摄像模组10100，所述摄像模组10100可以为一动焦摄像模组(Automatic Focus Model，AFM)。所述摄像模组包括一所述感光组件1010、一所述滤光片1020、一所述马达1040和一镜头1030。
所述滤光片1020被安装于所述感光组件1010，所述镜头1030被安装于所述马达1040，所述马达1040被安装于所述感光组件1010上。
进一步，所述滤光片1020被安装于所述感光组件1010的所述封装部1011的所述滤光片安装段10112的所述安装槽101121。所述马达1040被安装于所述感光组件1010的所述封装部1011的所述滤光片安装段10112顶端。也就是说，所述滤光片1020被安装于所述封 装部1011的所述安装槽，所述镜头1030被安装于所述马达1040，所述马达1040被安装于所述封装部1011的顶端。
特别地，当所述引脚通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马达1040和所述感光部1012的所述线路板主体10122，从而减少马达焊接的工艺过程。
所述马达1040被安装于所述封装部1011，也就是说，所述马达1040被支撑于所述封装部1011的顶端。由于所述封装部1011通过模具由一体成型的方式形成于所述线路板主体10122，因此可以为所述马达1040提供平整的安装平面，即，提供平整的所述顶表面101122，方便在组装所述摄像模组时，对所述马达1040进行AA调整，使得所述摄像模组易于达到光轴一致的要求。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
参照图10A和图11，根据本发明的第二个优选实施例的摄像模组感光组件1010A和摄像模组10100A。所述感光组件1010A用于组装制造所述摄像模组10100A，从而得到模塑型的摄像模组。所述感光组件1010A包括一封装部1011A和一感光部1012A，所述封装部1011A模塑地连接于所述感光部1012A。
所述感光部1012A包括一线路板主体10122A和一感光芯片10121A，所述感光芯片10121A被设置于所述线路板主体10122A上。根据本发明的这个实施例，所述感光芯片10121A模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012A包括一连接线路和至少一电路元件10123A。所述连接线路预设于所述线路板主体10122A，所述电路元件10123A电连接于所述连接线路以及所述感光芯片10121A，以供所述感光芯片10121A的感光工作过程。所述电路元件10123A凸出地设置于所述线路板主体10122A。所述电路元件10123A可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011A将所述电路元件10123A包覆于其内部，因此使得所述电路元件10123A不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121A相通的环境中，从而当组装所述摄像模组时，所述电路元件10123A上不会沾染灰尘等污染物，也不会影响所述感光芯片10121A，不同于传统摄像模组中电路元件10123A暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123A表面，避免污染所述感光芯片10121A而使得摄像模组出现污黑点等不良现象。
所述封装部1011A形成一通孔101100A，以便于为所述感光芯片10121A提供感光路径。
根据本发明的这个优选实施例，所述感光部1012A包括至少一连接线10124A，用于电连接所述感光芯片10121A和所述线路板主体10122A。进一步，所述连接线10124A可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124A呈弧形地连接所述感光芯片10121A和所述线路板主体10122A。值得一提的是，所述连接线10124A被模塑于所述封装部1011A内部，从而可以借助所述封装部1011A将所述连接线10124A进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124A不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124A的影响，如温度，使得所述感光芯片10121A和所述线路板主体10122A之间的通讯连接稳定，这一点是完全不同于现有技术的。
值得一提的是，所述封装部1011A包覆所述电路元件10123A和所述连接线10124A，具有保护所述电路元件10123A和所述连接线10124A及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011A不限于包覆所述电路元件10123A或所述连接线10124A。也就是说，在本发明的其他实施例中，所述封装部1011A可以直接模塑于没有凸出的所述电路元件10123A的所述线路板主体10122A，也可以是模塑于所述电路元件10123A外侧、周围等不同位置。
不同于上述优选实施例的是，所述线路板主体10122A具有一内凹槽101222A，所述感光芯片10121A被设置于所述内凹槽101222A内，从而使得所述感光芯片10121A和所述线路板主体10122A的相对高度降低，从而当所述封装部1011A包覆所述感光芯片10121A，减小对所述封装部1011A的高度要求，从而减小所述感光组件1010A组装的摄像模组的高度。
进一步，所述感光芯片10121A具有一感光区101211A和一非感光区101212A，所述非感光区101212A环绕于所述感光区101211A外围。所述感光区101211A用于进行感光作用，所述连接线10124A连接于所述非感光区101212A。
根据本发明的这个优选实施例，所述封装部1011A延伸于所述感光芯片10121A的所述非感光区101212A，从而将所述感光芯片10121A通过模塑的方式叠层固定于所述线路板主体10122A。通过这样的方式，如模塑于芯片的方式(Molding on chip，MOC)扩大了所述封装部1011A向内的可模塑范围，从而可以减小所述线路板主体10122A以及所述封装部1011A外侧的结构性部分，进一步减小所述感光组件1012A的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011A凸起地围绕于所述感光芯片10121A的所述感光区101211A外侧，特别地，所述封装部1011A一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010A被用于组装所述摄像模组时，所述感光芯片10121A被密封于内部，形成一封闭内空间。
进一步，所述封装部1011A包括一包覆段10111A和一滤光片安装段10112A，所述滤光片安装段10112A模塑地一体连接于所述包覆段10111A，所述包覆段10111A模塑连接于所述线路板主体10122A，用于包覆所述电路元件10123A和所述连接线10124A。所述滤光片安装段10112A用于安装一滤光片1020A，也就是说，当所述感光组件1010A被用于组装所述摄像模组时，所述摄像模组的滤光片1020A被安装于所述滤光片安装段10112A，使得所述滤光片1020A位于所述感光芯片10121A的感光路径上，且不需要提供额外的滤光片1020A安装支架。也就是说，所述封装部1011A在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段10112A顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片1020A平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段10112A具有一安装槽101121A，所述安装槽101121A连通于所述通孔101100A，为所述滤光片1020A提供充足的安装空间，使得所述滤光片1020A不会凸出于滤光片安装段10112A的顶表面101122A。也就是说，所述封装部1011A上端设置所述安装槽101121A，从而将所述滤光片1020A稳定的安装于所述封装部1011A，且不会凸出于所述封装部1011A的顶端。
值得一提的是，所述封装部1011A的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124A的同时使得所述感光芯片10121A可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011A的形状并不是本发明的限制。
参照图10B，根据本发明的第二个优选实施例的变形实施方式，所述感光组件1010A的所述线路板主体10122A具有一下沉孔101222A，所述感光芯片10121A被下沉地设置于所述下沉孔101222A，从而使得所述感光芯片10121A和所述线路板主体10122A的相对高度降低，从而当所述封装部1011A包覆所述感光芯片10121A时，减小对所述封装部1011A的高度要求，从而减小所述感光组件1010A组装的摄像模组的高度。
所述下沉孔101222A是通孔结构，连通所述线路板主体两侧的空间，从而增大所述感光芯片10121A的可下沉范围。所述感光芯片10121A与所述线路板主体10122A的高度相对位置可以根据需求选择，比如所述感光芯片10121A和所述线路板主体10122A的顶面高度一致、所述感光芯片10121A和所述线路板主体10122A的底面高度一致、所述感光芯片10121A和所述线路板主体10122A的顶面和底面高度都不一致等。
所述连接线10124A一端连接所述感光芯片10121A，另一端连接所述线路板主体10122A，即，所述下沉孔101222A的外围区域，从而使得所述下沉孔101222A更多区域用于设置所述感光芯片10121A，从而适于容纳面积更大的所述感光芯片10121A，或者减小所述下沉孔101222A的区域面积。
参照图11，根据本发明的第二个优选实施例的摄像模组10100A。所述摄像模组可以是一定焦模组。所述摄像模组包括一所述感光组件1010A、一所述滤光片1020A和一镜头1030A。
所述滤光片1020A被安装于所述感光组件1010A，所述镜头1030A被安装于所述感光组件1010A上。
更具体地，所述滤光片1020A被安装于所述感光组件1010A的所述封装部1011A的所述滤光片安装段10111A的所述安装槽1111A。所述镜头1030A被安装于所述感光组件1010A的所述封装部1011A的所述滤光片安装段10111A的顶端。换句话说，所述滤光片1020A被安装于所述封装部1011A的所述安装糟1111A，所述镜头1030A被安装于所述封装部1011A的顶端。
在本发明的其他实施例中，所述感光组件1010A还可以被组装为一动焦摄像模组。本领域的技术人员应当理解的是，所述定焦摄像模组仅作为举例来说明本发明，并不是本发明的限制。
参照图12和图13，根据本发明的第三个优选实施例的感光组件1010B和摄像模组10100B。所述感光组件1010B用于组装制造所述摄像模组，从而得到模塑型的摄像模组。所述感光组件1010B包括一封装部1011B和一感光部1012B，所述封装部1011B模塑地连接于所述感光部1012B。
所述感光部1012B包括一线路板主体10122B和一感光芯片10121B，所述感光芯片10121B被设置于所述线路板主体10122B上。根据本发明的这个实施例，所述感光芯片10121B模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012B包括一连接线路和至少一电路元件10123B。所述连接线路预设于所述线路板主体10122B，所述电路元件10123B电连接于所述连接线路以及所述感光芯片10121B，以供所述感光芯片10121B的感光工作过程。所述电路元件10123B凸出地设置于所述线路板主体10122B。所述电路元件10123B可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011B将所述电路元件10123B包覆于其内部，因此使得所述电路元件10123B不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121B相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123B上不会沾染灰尘等污染物，也不会影响所述感光芯片10121B，不同于传统摄像模组中电路元件10123B暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123B表面，避免污染所述感光芯片10121B而使得摄像模组出现污黑点等不良现象。
所述封装部1011B形成一通孔101100B，以便于为所述感光芯片10121B提供感光路径。
根据本发明的这个优选实施例，所述感光部1012B包括至少一连接线10124B，用于电连接所述感光芯片10121B和所述线路板主体10122B。进一步，所述连接线10124B可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124B呈弧形地连接所述感光芯片10121B和所述线路板主体10122B。
值得一提的是，所述连接线10124B被模塑于所述封装部1011B内部，从而可以借助所述封装部1011B将所述连接线10124B进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124B不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124B的影响，如温度，使得所述感光芯片10121B和所述线路板主体10122B之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部1011B包覆所述电路元件10123B和所述连接线10124B， 具有保护所述电路元件10123B和所述连接线10124B及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011B不限于包覆所述电路元件10123B或所述连接线10124B。也就是说，在本发明的其他实施例中，所述封装部1011B可以直接模塑于没有凸出的所述电路元件10123B的所述线路板主体10122B，也可以是模塑于所述电路元件10123B外侧、周围等不同位置。
进一步，所述感光芯片10121B具有一感光区101211B和一非感光区101212B，所述非感光区101212B环绕于所述感光区101211B外围。所述感光区101211B用于进行感光作用，所述连接线10124B连接于所述非感光区101212B。
根据本发明的这个优选实施例，所述封装部1011B延伸于所述感光芯片10121B的所述非感光区101212B，从而将所述感光芯片10121B通过模塑的方式叠层固定于所述线路板主体10122B。通过这样的方式，如模塑于芯片的方式(Molding on Chip，MOC)扩大了所述封装部1011B向内的可模塑范围，从而可以减小所述线路板主体10122B以及所述封装部1011B外侧的结构性部分，进一步减小所述模塑感光部1012B件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011B凸起地围绕于所述感光芯片10121B的所述感光区101211B外侧，特别地，所述封装部1011B一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010B被用于组装所述摄像模组时，所述感光芯片10121B被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010B时，可以选取一传统的线路板作为所述线路板主体10122B，在所述线路板主体10122B上设置一所述感光芯片10121B，将所述感光芯片10121B通过所述连接线10124B电连接，进而在初步组装后的所述线路板主体10122B和感光芯片10121B部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011B，或用半导体封装中常用的模压工艺形成所述封装部1011B。所述线路板主体10122B可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011B形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011B可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部1011B顶端表面平整，适于安装一滤光片1020B，也就是说，当所述感光组件1010B被用于组装所述摄像模组时，所述摄像模组的滤光片1020B被安装于所述封装部1011B的顶端表面，使得所述滤光片1020B位于所述感光芯片10121B的感光路径上，且不需要提供额外的滤光片1020B安装支架。也就是说，所述封装部1011B在此处具有传统支架的功能，但是基于模塑工艺的优势，所述模顶部1011B可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片1020B平整地被安装，这一点也是优于传统的摄像模组。
不同于上述优选实施例的是，在本发明的这个实施例中，所述感光组件1010B的所述感光部1012B包括一加固层10125B，所述加固层10125B叠层地连接于所述线路板主体10122B底层，以便于加强所述线路板主体10122B的结构强度。也就是说，在所述线路板主体10122B上所述封装部1011B以及所述感光芯片10121B所在的区域底层贴装所述加固层10125B，从而使得所述线路板主体10122B稳定可靠地支撑所述封装部1011B和所述感光芯片10121B。
进一步，所述加固层10125B为一金属板，所述金属板贴附于所述线路板主体10122B的底层，增加所述线路板主体10122B的结构强度，另一方面，增加所述感光组件1010B的散热性能，能有效散失所述感光芯片10121B发出的热量。
值得一提的是，所述线路板主体10122B可以采用FPC(Flex Print Circuit，挠性印制电路板)，而通过所述加固层10125B增强所述FPC的刚性，使得具有良好弯曲性能的FPC能够满足所述感光组件1010B的承载要求。也就是说，所述线路板主体10122B的可选择范围更加广泛，例如PCB(Printed Circuit Board，刚性印制电路板)，FPC，RF(Rigid Flex，软硬结合板)。通过所述加固层10125B增加所述线路板主体10122B的结构强度并且提高散热性能，从而可以减小所述线路板主体10122B的厚度，使得所述感光组件1010B的高度进一步减小，以及由其组装得到的摄像模组的高度减小。
值得一提的是，在本发明的这个实施例中，所述加固层10125呈板状重叠于所述线路板主体10122B，而在本发明的其他实施例中，所述加固层10125B可以延伸至包裹所述封装部1011B侧壁，从而在增强所述感光组件1010B的结构强度的同时，增强其抗电磁干扰能力。
值得一提的是，所述封装部的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124B的同时使得所述感光芯片10121B可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011B的形状并不是本发明的限制。
参照图12和图13，根据本发明的第三个优选实施例的摄像模组10100B。所述摄像模组10100B可以是一定焦模组(Fix Focus Model，FFM)。所述摄像模组包括一所述感光组件1010B、一所述滤光片1020B和一镜头1030B。
所述滤光片1020B被安装于所述感光组件1010B，所述镜头1030B被安装于所述感光组件1010B上。
更具体地，所述滤光片1020B被安装于所述感光组件1010B的所述封装部1011B顶端。所述镜头1030B被安装于所述感光组件1010B的所述封装部1011B的顶端。特别地，所述滤光片1020B和所述镜头1030B在所述封装部1011B的具体安装位置可以根据具体需要协调配置。
还值得一提的是，所述镜头1030B被安装于所述感光组件1010B的所述封装部1011B的顶端，从而所述封装部1011B相当于传统摄像模组中的支架的功能，为所述镜头1030B提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部1011B通过模塑工艺固定于所述线路板主体10122B，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部1011B与所述线路板主体10122B之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部1011B包覆所述电路元件10123B和所述连接线10124B，使得传统的支架功能和电路元件10123B以及所述连接线10124B可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部1011B的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部1011B代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部1011B包覆所述连接线10124B，且所述封装部1011B延伸至所述感光芯片10121B的非感光区101212B，使得所述封装部1011B可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
参照图12和图14，根据本发明的第三个优选实施例的另一摄像模组将被阐释。所述摄像模组10100B可以为一动焦摄像模组。所述摄像模组包括一所述感光组件1010B、一所述滤光片1020B、一马达1040B和一镜头1030B。
所述滤光片1020B被安装于所述感光组件1010B，所述镜头1030B被安装于所述马达1040B，所述马达1040B被安装于所述模塑感光组件1010B上。
更进一步，所述滤光片1020B被安装于所述感光组件1010B的所述封装部1011B的顶端。所述马达1040B安装于所述感光组件1010B的所述封装部1011B的顶端。特别地，所述滤光片1020B和所述马达1040B在所述封装部1011B的具体安装位置可以根据具体需要 协调配置。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
参照图15和图17，根据本发明的第四个优选实施例的感光组件1010C和摄像模组10100C将被阐释。所述感光组件1010C用于组装制造所述摄像模组，从而得到模塑型的摄像模组。所述感光组件1010C包括一封装部1011C和感光部1012C，所述封装部1011C模塑地连接于所述感光部1012C。
所述感光部1012C包括一线路板主体10122C和一感光芯片10121C，所述感光芯片10121C被设置于所述线路板主体10122C上。根据本发明的这个实施例，所述感光芯片10121C模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012C包括一连接线路和至少一电路元件10123C。所述连接线路预设于所述线路板主体10122C，所述电路元件10123C电连接于所述连接线路以及所述感光芯片10121C，以供所述感光芯片10121C的感光工作过程。所述电路元件10123C凸出地设置于所述线路板主体10122C。所述电路元件10123C可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011C将所述电路元件10123C包覆于其内部，因此使得所述电路元件10123C不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121C相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123C上不会沾染灰尘等污染物，也不会影响所述感光芯片10121C，不同于传统摄像模组中电路元件10123C暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123C表面，避免污染所述感光芯片10121C而使得摄像模组出现污黑点等不良现象。
所述封装部1011C形成一通孔101100C，以便于为所述感光芯片10121C提供感光路径。
根据本发明的这个优选实施例，所述感光部1012C包括至少一连接线10124C，用于电连接所述感光芯片10121C和所述线路板主体10122C。进一步，所述连接线10124C可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124C呈弧形地连接所述感光芯片10121C和所述线路板主体10122C。
值得一提的是，所述连接线10124C被模塑于所述封装部1011C内部，从而可以借助所述封装部1011C将所述连接线10124C进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124C不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124C的影响，如温度，使得所述感光芯片10121C和所述线路板主体10122C之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部1011C包覆所述电路元件10123C和所述连接线10124C，具有保护所述电路元件10123C和所述连接线10124C及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011C不限于包覆所述电路元件10123C或所述连接线10124C。也就是说，在本发明的其他实施例中，所述封装部1011C可以直接模塑于没有凸出的所述电路元件10123C的所述线路板主体10122C，也可以是模塑于所述电路元件10123C外侧、周围等不同位置。
进一步，所述感光芯片10121C具有一感光区101211C和一非感光区101212C，所述非感光区101212C环绕于所述感光区101211C外围。所述感光区101211C用于进行感光作用，所述连接线10124C连接于所述非感光区101212C。
根据本发明的这个优选实施例，所述封装部1011C延伸于所述感光芯片10121C的所述非感光区101212C，从而将所述感光芯片10121C通过模塑的方式叠层固定于所述线路板主体10122C。通过这样的方式，如模塑于芯片的方式(Molding on the chip)扩大了所述封装部1011C向内的可模塑范围，从而可以减小所述线路板主体10122C以及所述封装部1011C的外侧的结构性部分，进一步减小所述感光组件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011C凸起地围绕于所述感光芯片10121C的所述感光区101211C外侧，特别地，所述封装部1011C一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010C被用于组装所述摄像模组时，所述感光芯片10121C被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010C时，可以选取一传统的线路板作为所述线路板主体10122C，在所述线路板主体10122C上设置一所述感光芯片10121C，将所述感光芯片10121C通过所述连接线10124C电连接，进而在初步组装后的所述线路板主体10122C和感光芯片10121C部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011C，或用半导体封装中常用的模压工艺形成所述封装部1011C。所述线路板主体10122C可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011C形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011C可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
所述感光组件1010C进一步包括一滤光片1020C，所述滤光片1020C模塑地叠层设置于所述感光芯片10121C上。所述滤光片1020C的边缘被模塑于所述封装部1011C，从而固定所述滤光片1020C。值得一提的是，所述滤光片1020C覆盖于所述感光芯片10121C上方，将所述感光芯片10121C与外部环境隔离，保护所述感光芯片10121C受到损伤以及防止灰尘的进入。
在制造所述感光组件1010C时，先将所述感光芯片10121C贴附于所述线路板主体10122C，并将所述连接于所述感光芯片10121C和所述线路板主体10122C，进而将所述滤光片1020C贴附于所述感光芯片10121C上，进一步，将所述线路板主体10122C和所述感光芯片10121C和所述滤光片1020C进行模塑，形成所述封装部1011C。在模塑时，由于所述滤光片1020C覆盖于所述感光芯片10121C上，因此能够防止模塑的模具对于所述感光芯片10121C的伤害，且由于所述滤光片1020C与所述感光芯片10121C的距离减小，因此可以使得由其组装的摄像模组的后焦距缩小，从而减小所述摄像模组的高度，另一方面，由于不需要为所述滤光片1020C提供额外的支撑部件，因此也在一定程度上使得所述摄像模组的厚度得以进一步减小。
值得一提的是，所述封装部1010C的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124C的同时使得所述感光芯片10121C可以接收到等多光线。本领域的技术人员应当理解的是，所述封装部1011C的形状并不是本发明的限制。
参照图15至图17，根据本发明的第四个优选实施例的摄像模组10100C。所述摄像模组可以是一定焦模组。所述摄像模组包括一所述感光组件1010C和一镜头1030C。所述镜头1030C被安装于所述感光组件1010C上，组装形成所述摄像模组。
特别地，所述镜头1030C可以通过粘接的方式固定于所述感光组件1010C的所述封装部1011C的顶端，且借助模塑工艺中模具制造的特点，使得所述封装部1011C的顶端具有较好的平整性，为所述镜头1030C提供良好的安装条件，从而获得优质的摄像模组。
值得一提的是，所述镜头1030C被安装于所述感光组件1010C的所述封装部1011C的顶端，从而所述封装部1011C相当于传统摄像模组中的支架的功能，为所述镜头1030C提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部1011C通过模塑工艺固定于所述线路板主体10122C，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部1011C与所述线路板主体10122C之间不需要预留AA调 整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部1011C包覆所述电路元件10123C和所述连接线10124C，使得传统的支架功能和电路元件10123C以及所述连接线10124C可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部1011C的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部1011C代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部1011C包覆所述连接线10124C，且所述封装部1011C延伸至所述感光芯片10121C的非感光区101212C，使得所述封装部1011C可以向内收缩，从而进一步减小所述摄像模组的横向长宽尺寸。而且，所述感光组件1010C将所述滤光片1020C模塑在其内部，因此在组装所述摄像模组时，不需要再次进行滤光片的粘贴安装过程，从而减少摄像模组组装工艺过程，提高工作效率，这些都是优于现有技术的。
参照图15、图16和图18，是根据本发明的第四个优选实施例的另一摄像模组10100C将被阐释。所述摄像模组可以为一动焦摄像模组(Automatic Focus Model，AFM)。所述摄像模组包括一所述感光组件1010C、一马达1040C和一镜头1030C。
所述镜头1030C被安装于所述马达1040C，所述马达1040C被安装于所述感光组件1010C上，以便于通过所述马达1040C调节所述摄像模组焦距。所述马达1040C安装于所述感光组件1010C的所述封装部1011C的顶端。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
参照图19A和20A，根据本发明的第五个优选实施例的感光组件1010D和摄像模组10100D将被阐释。所述感光组件1010D用于组装制造所述摄像模组，从而得到模塑型的所述摄像模组。所述感光组件1010D包括一封装部1011D和一感光部1012D，所述封装部1011D模塑地连接于所述感光部1012D。
特别地，所述封装部以MOC的方式模塑于所述感光部1012D。
所述感光部1012D包括一线路板主体10122D和一感光芯片10121D，所述感光芯片10121D被设置于所述线路板主体10122D上。根据本发明的这个实施例，所述感光芯片10121D模塑地连接于所述线路板主体10122D。
根据本发明这个实施例，所述感光部1012D包括一连接线路和至少一电路元件10123D。所述连接线路预设于所述线路板主体10122D，所述电路元件10123D电连接于所述连接线路以及所述感光芯片10121D，以供所述感光芯片10121D的感光工作过程。所述电路元件10123D凸出地设置于所述线路板主体10122D。所述电路元件10123D可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。值得一提的是，所述封装部1011D将所述电路元件10123D包覆于其内部，因此使得所述电路元件10123D不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121D相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123D上不会沾染灰尘等污染物，也不会影响所述感光芯片10121D，不同于传统摄像模组中电路元件10123D暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123D表面，避免污染所述感光芯片10121D而使得摄像模组出现污黑点等不良现象。
所述封装部1011D形成一通孔101100D，以便于为所述感光芯片10121D提供感光路径。
根据本发明的这个优选实施例，所述感光部1012D包括至少一连接线10124D，用于电连接所述感光芯片10121D和所述线路板主体10122D。进一步，所述连接线10124D可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124D呈弧形地连接所述感光芯片10121D和所述线路板主体10122D。
值得一提的是，所述连接线10124D被模塑于所述封装部1011D内部，从而可以借助所述封装部1011D将所述连接线10124D进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124D不会受到任何的碰触损伤，同时减少环境因素对所述连 接线10124D的影响，如温度，使得所述感光芯片10121D和所述线路板主体10122D之间的通讯连接稳定，这一点是完全不同于现有技术的。
值得一提的是，所述封装部1011D包覆所述电路元件10123D和所述连接线10124D，具有保护所述电路元件10123D和所述连接线10124D及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011D不限于包覆所述电路元件10123D或所述连接线10124D。也就是说，在本发明的其他实施例中，所述封装部1011D可以直接模塑于没有凸出的所述电路元件10123D的所述线路板主体10122D，也可以是模塑于所述电路元件10123D外侧、周围等不同位置。
所述感光组件1010D进一步包括一滤光片1020D，所述滤光片1020D模塑地叠层设置于所述感光芯片10121D上。所述滤光片1020D的边缘被模塑于所述封装部1011D，从而固定所述滤光片1020D。值得一提的是，所述滤光片1020D覆盖于所述感光芯片10121D上方，将所述感光芯片10121D与外部环境隔离，保护所述感光芯片10121D不受到损伤以及防止灰尘的进入。
进一步，所述感光芯片10121D具有一感光区101211D和一非感光区101212D，所述非感光区101212D环绕于所述感光区101211D外围。所述感光区101211D用于进行感光作用，所述连接线10124D连接于所述非感光区101212D。
根据本发明的这个优选实施例，所述封装部1011D延伸于所述感光芯片10121D的所述非感光区101212D，从而将所述感光芯片10121D通过模塑的方式叠层固定于所述线路板主体10122D。通过这样的方式，如模塑于芯片的方式(Molding on the Chip，MOC)扩大了所述封装部1011D向内的可模塑范围，从而可以减小所述线路板主体10122D以及所述封装部1011D的外侧的结构性部分，进一步减小所述感光部1012D的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011D凸起地围绕于所述感光芯片10121D的所述感光区101211D外侧，特别地，所述封装部1011D一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010D被用于组装所述摄像模组时，所述感光芯片10121D被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010D时，可以选取一传统的线路板作为所述线路板主体10122D，在所述线路板主体10122D上设置一所述感光芯片10121D，将所述感光芯片10121D通过所述连接线10124D电连接，进而在初步组装后的所述线路板主体10122D和感光芯片10121D部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011D，或用半导体封装中常用的模压工艺形成所述封装部1011D。所述线路板主体10122D可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011D形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011D可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部1011D包括一包覆段10111D、一滤光片安装段10112D和一镜头安装段10113D，所述滤光片安装段10112D和所述镜头安装段10113D依次一体地模塑连接于所述包覆段10111D，所述包覆段10111D模塑连接于所述线路板主体10122D，用于包覆所述电路元件10123D和所述连接线10124D。所述镜头安装段10113D用于安装一镜头1030D，也就是说，当所述感光组件1010D被用于组装所述摄像模组时，所述镜头1030D被安装于所述封装部1011D的所述镜头安装段10113D内侧，以便于为所述镜头1030D提供稳定的安装位置。所述镜头安装段10113D具有一镜头安装槽101131D，所述镜头安装槽101131D连通于所述通孔101100D，为所述镜头1030D提供充足的安装空间。也就是说， 所述封装部1011D具有一所述滤光片安装槽101121D和一所述镜头安装槽101131D，所述滤光片1020D被安装于所述安装槽101121D，所述镜头1030D被安装于所述镜头安装槽101131D。图19A和图20所示，所述滤光片1020D被一体封装于所述封装部1011的所包覆段，因此不需要设置所述安装槽101121D。
所述镜头安装段10113D一体地向上延伸，且内部形成台阶状结构，为所述镜头1030D提供支撑固定位置，从而不需要提供额外的部件来安装所述镜头1030D。换句话说，所述封装部1011D一体地向上延伸，且内部形成台阶状，以分别包覆所述电路元件和所述连接线以及支撑所述镜头。
所述镜头安装段10113D具有一镜头内壁101132D，所述镜头内壁101132D呈闭合环形，适于为所述镜头1030D提供安装空间。值得一提的是，所述镜头安装段10113D的所述镜头内壁101132D表面平整，从而适于安装无螺纹的所述镜头1030D，形成定焦模组。特别地，所述镜头1030D可以通过粘接的方式固定于所述镜头安装段10113D。当然，所述镜头内壁201132还可以是开放式的环形结构，也就是说，可以是带有开口的结构，本领域的技术人员应当理解的是，所述镜头内壁101132D的结构并不是本发明的限制。
值得一提的是，所述封装部1011D的所述包覆段10111D的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124D的同时使得所述感光芯片10121D可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011D的形状并不是本发明的限制。
参照图19B，根据本发明的第五个优选实施例的变形实施方式，所述感光组件1010D中，所述封装部1011D包括一包覆段10111D、一滤光片安装段10112D和一镜头安装段10113D，所述滤光片安装段10112D和所述镜头安装段10113D依次一体地模塑连接于所述包覆段10111D，所述包覆段10111D模塑连接于所述线路板主体10122D，用于包覆所述电路元件10123D和所述连接线10124D。所述镜头安装段10113D用于安装一镜头1030D，也就是说，当所述感光组件1010D被用于组装所述摄像模组时，所述镜头1030D被安装于所述封装部1011D的所述镜头安装段10113D内侧，以便于为所述镜头1030D提供稳定的安装位置。所述镜头安装段10113D具有一镜头安装槽101131D，所述镜头安装槽101131D连通于所述通孔101100D，为所述镜头1030D提供充足的安装空间。也就是说，所述封装部1011D具有一所述安装槽101121D和一所述镜头安装槽101131D，所述滤光片1020D被安装于所述安装槽101121D，所述镜头1030D被安装于所述镜头安装槽101131D。
所述镜头安装段10113D一体地向上延伸，且内部形成台阶状结构，为所述镜头1030D提供支撑固定位置，从而不需要提供额外的部件来安装所述镜头1030D。换句话说，所述封装部1011D一体地向上延伸，且内部形成台阶状，以分别包覆所述电路元件10123D和所述连接线10124D，并且为所述滤光片1020D和所述镜头1030D提供安装位置。所述镜头安装段10113D限位所述镜头或所述马达1040，从而使得所述镜头1030D或所述马达1040D快速、准确地安装于对应的位置。
所述镜头安装段10113D的高度和结构可以根据需求设置，可以是封闭的圆筒型结构，也可以是存在间隙的、间隔的限位壁或限位柱。
参照图20A，根据本发明的第五个优选实施例的摄像模组10100D。所述摄像模组可以是一定焦模组。所述摄像模组包括一所述感光组件1010D和一所述镜头1030D。
更具体地，所述镜头1030D被安装于所述感光组件1010D的所述封装部1011D的所述镜头安装段10113D的所述镜头安装槽101131D。所述滤光片1020D被模塑于所述感光组件1011D，因此不需要提供额外的滤光片，也不需要在组装所述摄像模塑时，单独安装滤光片，因此，减少组装的过程，且模塑滤光片的方式使得所述摄像模组的后焦距可以减小。
还值得一提的是，所述镜头1030D被安装于所述感光组件1010D的所述封装部1011D的所述镜头安装段10113D，从而所述封装部1011D相当于传统摄像模组中的支架或镜筒的功能，为所述镜头1030D提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传 统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部1011D通过模塑工艺固定于所述线路板主体10122D，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部1011D与所述线路板主体10122D之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小，而且根据本发明的模塑方式的所述封装部1011D具有较好的平整度，因此在组装所述摄像模组时，可以不进行AA调整；另一方面，所述封装部1011D包覆所述电路元件10123D和所述连接线10124D，使得传统的支架功能和电路元件10123D以及所述连接线10124D可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部1011D的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部1011D代替传统的支架，且为所述镜头1030D提供安装位置，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部1011D包覆所述连接线10124D，且所述封装部1011D延伸至所述感光芯片10121D的非感光区101212D，使得所述封装部1011D可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
图20B是根据本发明的第五个优选实施例的另一变形实施方式的摄像模组10100D。所述封装部1011D包括一包覆段10111D、一滤光片安装段10112D和一凸起10113D，所述滤光片安装段10112D和所述凸起10113D依次一体地模塑连接于所述包覆段10111D，所述包覆段10111D模塑连接于所述线路板主体10122D，用于包覆所述电路元件10123D和所述连接线10124D。
所述凸起10113D自所述滤光片安装段1112D部分地向上延伸，并且于所述滤光片安装段10112D形成一外安装槽101131D，以便于安装所述镜头1030D或所述马达1040D。也就是说，所述凸起10113D将所述镜头1030D或所述马达1040D安装位置与所述感光组件1010D的内部空间隔离，以便于阻挡所述镜头1030D或所述马达1040D的粘接介质，如胶水向内部扩散，而污染所述镜头1030D中的镜片或所述摄像模组内部。也就是说，所述封装部1011D具有一所述安装槽101121D、一所述外安装槽101131D，所述安装槽101121位于内侧，用于安装所述滤光片1020D，所述外安装槽101131D位于外侧，用于安装所述镜头1030D或所述马达1040D。
参照图21和图22，根据本发明第六个优选实施例的感光组件1010E和摄像模组10100E将被阐释。所述感光组件1010E用于组装制造所述摄像模组，从而得到模塑型的所述摄像模组。所述感光组件1010E包括一封装部1011E和感光部1012E，所述封装部1011E模塑地连接于所述感光部1012E。
所述感光部1012E包括一线路板主体10122E和一感光芯片10121E，所述感光芯片10121E被设置于所述线路板主体10122E上。根据本发明的这个实施例，所述感光芯片10121E模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012E包括一连接线路和至少一电路元件10123E。所述连接线路预设于所述线路板主体10122E，所述电路元件10123E电连接于所述连接线路以及所述感光芯片10121E，以供所述感光芯片10121E的感光工作过程。所述电路元件10123E凸出地设置于所述线路板主体10122E。所述电路元件10123E可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011E将所述电路元件10123E包覆于其内部，因此使得所述电路元件10123E不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121E相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123E上不会沾染灰尘等污染物，也不会影响所述感光芯片10121E，不同于传统摄像模组中电路元件10123E暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123E表面，避免污染所述感光芯片10121E而使得摄像模组出现污黑点等不良现象。
所述封装部1011E形成一通孔101100E，以便于为所述感光芯片10121E提供感光路径。
根据本发明的这个优选实施例，所述感光部1012E包括至少一连接线10124E，用于电连接所述感光芯片10121E和所述线路板主体10122E。进一步，所述连接线10124E可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124E呈弧形地连接所述感光芯片10121E和所述线路板主体10122E。
值得一提的是，所述连接线10124E被模塑于所述封装部1011E内部，从而可以借助所述封装部1011E将所述连接线10124E进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124E不会受到任何的碰触损伤，同时减少环境因素对各所述连接线10124E的影响，如温度，使得所述感光芯片10121E和所述线路板主体10122E之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部1011E包覆所述电路元件10123E和所述连接线10124E，具有保护所述电路元件10123E和所述连接线10124E及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011E不限于包覆所述电路元件10123E或所述连接线10124E。也就是说，在本发明的其他实施例中，所述封装部1011E可以直接模塑于没有凸出的所述电路元件10123E的所述线路板主体10122E，也可以是模塑于所述电路元件10123E外侧、周围等不同位置。
所述感光组件1010E进一步包括一滤光片1020E，所述滤光片1020E模塑地叠层设置于所述感光芯片10121E上。所述滤光片1020E的边缘被模塑于所述封装部1011E，从而固定所述滤光片1020E。值得一提的是，所述滤光片1020E覆盖于所述感光芯片10121E上方，将所述感光芯片10121E与外部环境隔离，保护所述感光芯片10121E不受到损伤以及防止灰尘的进入。
进一步，所述感光芯片10121E具有一感光区101211E和一非感光区101212E，所述非感光区101212E环绕于所述感光区101211E外围。所述感光区101211E用于进行感光作用，所述连接线10124E连接于所述非感光区101212E。
根据本发明的这个优选实施例，所述封装部1011E延伸于所述感光芯片10121E的所述非感光区101212E，从而将所述感光芯片10121E通过模塑的方式叠层固定于所述线路板主体10122E。通过这样的方式，如模塑于芯片的方式(Molding on chip)扩大了所述封装部1011E向内的可模塑范围，从而可以减小所述线路板主体10122E以及所述封装部1011E的外侧的结构性部分，进一步减小所述模塑感光部1012E的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011E凸起地围绕于所述感光芯片10121E的所述感光区101211E外侧，特别地，所述封装部1011E一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010E被用于组装所述摄像模组时，所述感光芯片10121E被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010E时，可以选取一传统的线路板作为所述线路板主体10122E，在所述线路板主体10122E上设置一所述感光芯片10121E，将所述感光芯片10121E通过所述连接线10124E电连接，进而在初步组装后的所述线路板主体10122E和感光芯片10121E部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011E，或用半导体封装中常用的模压工艺形成所述封装部1011E。所述线路板主体10122E可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011E形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011E可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部1011E包括一包覆段10111E和一镜头安装段10113E，所述镜头安 装段10113E一体地模塑连接于所述包覆段10111E，所述包覆段10111E模塑连接于所述线路板主体10122E，用于包覆所述电路元件10123E和所述连接线10124E。所述镜头安装段10113E用于安装一镜头1030E，也就是说，当所述感光组件1010E被用于组装所述摄像模组时，所述镜头1030E被安装于所述封装部1011E的所述镜头安装段10113E内侧，以便于为所述镜头1030E提供稳定的安装位置。
更进一步，所述镜头安装段10113E具有一镜头安装槽101131E，所述镜头安装槽101131E连通于所述通孔101100E，为所述镜头1030E提供充足的安装空间。也就是说，所述封装部1011E具有一所述镜头安装槽101131E，所述镜头1030E被安装于所述镜头安装槽101131E。
所述镜头安装段10113E沿所述包覆部10111E一体地向上延伸，且内部形成台阶状结构，为所述镜头1030E提供支撑固定位置，从而不需要提供额外的部件来安装所述镜头1030E。换句话说，所述封装部1011E一体地向上延伸，且内部形成台阶状，以分别包覆所述电路元件和所述连接线10124E，并且支撑所述镜头1030E。
所述镜头安装段10113E具有一镜头内壁101132E，所述镜头内壁101132E呈闭合环形，适于镜头1030E提供安装空间。值得一提的是，所述镜头安装段10113E的所述镜头内壁表面101132E具有螺纹结构，从而适于安装带螺纹的所述镜头1030E，形成定焦模组。特别地，所述镜头1030E可以通过螺接的方式固定于所述镜头安装段10113E。
值得一提的是，所述封装部1011的所述包覆段10111E的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124E的同时使得所述感光芯片10121E可以接收到等多光线。本领域的技术人员应当理解的是，所述封装部1011E的形状并不是本发明的限制。
参照图22，根据本发明的第六个优选实施例的摄像模组10100E。所述摄像模组可以是一定焦模组。所述摄像模组包括一所述感光组件1010E和一所述镜头1030E。
更具体地，所述镜头1030E被安装于所述感光组件1010E的所述封装部1011E的所述镜头安装段10113E的所述镜头安装槽101131E。所述滤光片1020E被模塑于所述感光组件1011E，因此不需要提供额外的滤光片，也不需要在组装所述摄像模塑时，单独安装滤光片，因此，减少所述摄像模组的组装过程，且模塑滤光片的方式使得所述摄像模组的后焦距可以减小。
还值得一提的是，所述镜头1030E被安装于所述感光组件1010E的所述封装部1011E的所述镜头安装段10113E，从而所述封装部1011E相当于传统摄像模组中的支架或镜筒的功能，为所述镜头1030E提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部1011E通过模塑工艺固定于所述线路板主体10122E，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部1011E与所述线路板主体10122E之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部1011E包覆所述电路元件10123E和所述连接线10124E，使得传统的支架功能和电路元件10123E以及所述连接线10124E可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部1011E的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部1011E代替传统的支架，且为所述镜头1030E提供安装位置，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部1011E包覆所述连接线10124E，且所述封装部1011E延伸至所述感光芯片10121E的非感光区101212E，使得所述封装部1011E可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
参照图23和图24，根据本发明的第七个优选实施例的感光组件1010F和摄像模组10100F将被阐释。所述感光组件1010F用于组装制造所述摄像模组，从而得到模塑型的所 述摄像模组。所述感光组件1010F包括一封装部1011F和一感光部1012F，所述封装部1011F模塑地连接于所述感光部1012F。
所述感光部1012F包括一线路板主体10122F和一感光芯片10121F，所述感光芯片10121F被设置于所述线路板主体10122F上。根据本发明的这个实施例，所述感光芯片10121F模塑地连接于所述线路主体10122F。
根据本发明这个实施例，所述感光部1012F包括一连接线路和至少一电路元件10123F。所述连接线路预设于所述线路板主体10122F，所述电路元件10123F电连接于所述连接线路以及所述感光芯片10121F，以供所述感光芯片10121F的感光工作过程。所述电路元件10123F凸出地设置于所述线路板主体10122F。所述电路元件10123F可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011F将所述电路元件10123F包覆于其内部，因此使得所述电路元件10123F不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121F相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123F上不会沾染灰尘等污染物，也不会影响所述感光芯片10121F，不同于传统摄像模组中电路元件10123F暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123F表面，避免污染所述感光芯片10121F而使得摄像模组出现污黑点等不良现象。
所述封装部1011F形成一通孔101100F，以便于为所述感光芯片10121F提供感光路径。
根据本发明的这个优选实施例，所述感光部1012F包括至少一连接线10124F，用于电连接所述感光芯片10121F和所述线路板主体10122F。进一步，所述连接线10124F可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124F呈弧形地连接所述感光芯片10121F和所述线路板主体10122F。
值得一提的是，所述连接线10124F被模塑于所述封装部1011F内部，从而可以借助所述封装部1011F将所述连接线10124F进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124F不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124F的影响，如温度、湿度，使得所述感光芯片10121F和所述线路板主体10122F之间的通讯连接稳定，这一点是完全不同于现有技术的。
值得一提的是，所述封装部1011F包覆所述电路元件10123F和所述连接线10124F，具有保护所述电路元件10123F和所述连接线10124F及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011F不限于包覆所述电路元件10123F或所述连接线10124F。也就是说，在本发明的其他实施例中，所述封装部1011F可以直接模塑于没有凸出的所述电路元件10123F的所述线路板主体10122F，也可以是模塑于所述电路元件10123F外侧、周围等不同位置。
进一步，所述感光芯片10121F具有一感光区101211F和一非感光区101212F，所述非感光区101212F环绕于所述感光区101211F外围。所述感光区101211F用于进行感光作用，所述连接线10124F连接于所述非感光区101212F。
根据本发明的这个优选实施例，所述封装部1011F延伸于所述感光芯片10121F的所述非感光区101212F，从而将所述感光芯片10121F通过模塑的方式叠层固定于所述线路板主体10122F。通过这样的方式，如模塑于芯片的方式(Molding on chip)扩大了所述封装部1011F向内的可模塑范围，从而可以减小所述线路板主体10122F以及所述封装部1011F的外侧的结构性部分，进一步减小所述模塑感光部1012F件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011F凸起地围绕于所述感光芯片10121F的所述感光区101211F外侧，特别地，所述封装部1011F一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010F被用于组装所述摄像模组时，所述感光芯片10121F被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010F时，可以选取一传统的线路板作为所述线路板主 体10122F，在所述线路板主体10122F上设置一所述感光芯片10121F，将所述感光芯片10121F通过所述连接线10124F电连接，进而在初步组装后的所述线路板主体10122F和感光芯片10121F部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011F，或用半导体封装中常用的模压工艺形成所述封装部1011F。所述线路板主体10122F可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011F形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011F可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部1011F包括一包覆段10111F和一滤光片安装段10112F，所述滤光片安装段10112F模塑地一体连接于所述包覆段10111F，所述包覆段10111F模塑连接于所述线路板主体10122F，用于包覆所述电路元件10123F和所述连接线10124F。所述滤光片安装段10112F用于安装一滤光片1020F，也就是说，当所述感光组件1010F被用于组装所述摄像模组时，所述摄像模组的滤光片1020F被安装于所述滤光片安装段10112F，使得所述滤光片1020F位于所述感光芯片10121F的感光路径上，且不需要提供额外的滤光片安装支架。也就是说，所述封装部1011F在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段10112F顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片1020F平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段10112F具有一安装槽101121F，所述安装槽101121F连通于所述通孔101100F，为所述滤光片1020F提供充足的安装空间，使得所述滤光片1020F不会凸出于滤光片安装段10112F的顶表面101122F。也就是说，所述封装部1011F上端设置所述安装槽101121F，以便于将所述滤光片1020F安装于所述封装部1011F且不会凸出于所述封装部1011F的顶端。
值得一提的是，所述封装部1011F的内壁可以根据所述连接线10124F的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124F的同时使得所述感光芯片10121F可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011F的形状并不是本发明的限制。
不同于上述优选实施例的是，所述线路板主体10122F具有至少一加固孔101221F，所述封装部1011F延伸进入所述加固孔101221F内，从而增强所述线路板主体10122F的结构强度。换句话说，两种不同材料相互结合，从而形成复合材料结构，使得作为基体的所述线路板主体10122F的结构强度增强。
所述加固孔101221F的位置可以根据需要选择，以及根据所述线路板的结构强度需求来设置，比如呈对称的结构。借由所述加固孔101221F的设置使得所述线路板主体10122F的结构强度增强，从而可以减小所述线路板主体10122F的厚度，减小由其组装的摄像模组的厚度，且提高所述感光组件1010F的散热性能。
值得一提的是，在本发明的这个实施例中，所述加固孔101221F为凹槽状，从而制造所述感光组件1010F时，所述封装部1011F的模塑材料不会由所述加固孔101221F漏出。
与上述优选实施例类似，所述感光组件1010F可以被组装为定焦模组或动焦模组，本领域的技术人员应当理解的是，所述感光组件1010F的组装应用方式不是本发明的限制。
参照图25，根据本发明的第八个优选实施例的感光组件1010G将被阐释。所述感光组件1010G用于组装制造所述摄像模组，从而得到模塑型的所述摄像模组。所述感光组件1010G包括一封装部1011G和感光部1012G，所述封装部1011G模塑地连接于所述感光部1012G。
所述感光部1012G包括一线路板主体10122G和一感光芯片10121G，所述感光芯片 10121G被设置于所述线路板主体10122G上。根据本发明的这个实施例，所述感光芯片10121G模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012G包括一连接线路和至少一电路元件10123G。所述连接线路预设于所述线路板主体10122G，所述电路元件10123G电连接于所述连接线路以及所述感光芯片10121G，以供所述感光芯片10121G的感光工作过程。所述电路元件10123G凸出地设置于所述线路板主体10122G。所述电路元件10123G可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011G将所述电路元件10123G包覆于其内部，因此使得所述电路元件10123G不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121G相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123G上不会沾染灰尘等污染物，也不会影响所述感光芯片10121G，不同于传统摄像模组中电路元件10123G暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123G表面，避免污染所述感光芯片10121G而使得摄像模组出现污黑点等不良现象。
所述封装部1011G形成一通孔101100G，以便于为所述感光芯片10121G提供感光路径。
根据本发明的这个优选实施例，所述感光部1012G包括至少一连接线10124G，用于电连接所述感光芯片10121G和所述线路板主体10122G。进一步，所述连接线10124G可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124G呈弧形地连接所述感光芯片10121G和所述线路板主体10122G。
值得一提的是，所述连接线10124G被模塑于所述封装部1011G内部，从而可以借助所述封装部1011G将所述连接线10124G进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124G不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124G的影响，如温度，使得所述感光芯片10121G和所述线路板主体10122G之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部1011G包覆所述电路元件10123G和所述连接线10124G，具有保护所述电路元件10123G和所述连接线10124G及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011G不限于包覆所述电路元件10123G或所述连接线10124G。也就是说，在本发明的其他实施例中，所述封装部1011G可以直接模塑于没有凸出的所述电路元件10123G的所述线路板主体10122G，也可以是模塑于所述电路元件10123G外侧、周围等不同位置。
进一步，所述感光芯片10121G具有一感光区101211G和一非感光区101212G，所述非感光区101212G环绕于所述感光区101211G外围。所述感光区101211G用于进行感光作用，所述连接线10124G连接于所述非感光区101212G。
根据本发明的这个优选实施例，所述封装部1011G延伸于所述感光芯片10121G的所述非感光区101212G，从而将所述感光芯片10121G通过模塑的方式叠层固定于所述线路板主体10122G。通过这样的方式，如模塑于芯片的方式(Molding on chip)扩大了所述封装部1011G向内的可模塑范围，从而可以减小所述线路板主体10122G以及所述封装部1011G的外侧的结构性部分，进一步减小所述模塑感光部1012G的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011G凸起地围绕于所述感光芯片10121G的所述感光区101211G外侧，特别地，所述封装部1011G一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010G被用于组装所述摄像模组时，所述感光芯片10121G被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010G时，可以选取一传统的线路板作为所述线路板主体10122G，在所述线路板主体10122G上设置一所述感光芯片10121G，将所述感光芯片10121G通过所述连接线10124G电连接，进而在初步组装后的所述线路板主体10122G和感光芯片10121G部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT 工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011G，或用半导体封装中常用的模压工艺形成所述封装部1011G。所述线路板主体10122G可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011G形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011G可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部1011G包括一包覆段10111G和一滤光片安装段10112G，所述滤光片安装段10112G模塑地一体连接于所述包覆段10111G，所述包覆段10111G模塑连接于所述线路板主体10122G，用于包覆所述电路元件10123G和所述连接线10124G。所述滤光片安装段10112G用于安装一滤光片1020G，也就是说，当所述感光组件1010G被用于组装所述摄像模组时，所述摄像模组的滤光片1020G被安装于所述滤光片安装段10112G，使得所述滤光片1020G位于所述感光芯片10121G的感光路径上，且不需要提供额外的滤光片1020G安装支架。也就是说，所述封装部1011G在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段10112G顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片1020G平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段10112G具有一安装槽101121G，所述安装槽连通于所述通孔101100G，为所述滤光片1020G提供充足的安装空间，使得所述滤光片1020G不会凸出于滤光片安装段10112G的顶表面101122G。也就是说，所述封装部1011F上端设置所述安装槽101121F，以便于将所述滤光片1020F安装于所述封装部1011F且不会凸出于所述封装部1011F的顶端。
值得一提的是，所述封装部1011G的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124G的同时使得所述感光芯片10121G可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011G的形状并不是本发明的限制。
不同于上述优选实施例的是，所述线路板主体10122G具有至少一加固孔101221G，所述封装部1011G延伸进入所述加固孔101221G内，从而增强所述线路板主体10122G的结构强度。换句话说，两种不同材料相互结合，从而形成复合材料结构，使得作为基体的所述线路板主体10122G的结构强度增强。
所述加固孔101221G的位置可以根据需要选择，以及根据所述线路板的结构强度需求来设置，比如呈对称的结构。借由所述加固孔101221G的设置使得所述线路板主体10122G的结构强度增强，从而可以减小所述线路板主体10122G的厚度，减小由其组装的摄像模组的厚度，且提高所述感光组件1010G的散热性能。
值得一提的是，根据本发明的这个优选实施例，所述加固孔101221G为穿孔，也就是说，穿过所述线路板主体10122G，使得所述线路板主体10122G的两侧连通，从而制造所述感光组件1010G时，所述封装部1011G的模塑材料充分的与所述线路板主体10122G结合，形成更加牢固的复合材料结构，且相对所述凹槽的结构，所述穿孔更容易加工制造。
与上述优选实施例类似，所述感光组件1010G可以被组装为定焦模组或动焦模组，本领域的技术人员应当理解的是，所述感光组件1010G的组装应用方式不是本发明的限制。
参照图26，根据本发明的第九个优选实施例的摄像模组10100H将被阐释。所述摄像模组可以是一定焦模组(Fix Focus Model，FFM)。所述摄像模组10100H包括一感光组件1010H、一支架1050H、一滤光片1020H和一镜头1030H。
所述支架1050H被安装于所述感光组件1010H上，所述滤光片1020H被安装于所述支架1050H，所述镜头1030H被安装于所述支架1050H上。
所述感光组件1010H包括一封装部1011H和一感光部1012H，所述封装部1011H模塑 地连接于所述感光部1012H。
所述感光部1012H包括一线路板主体10122H和一感光芯片10121H，所述感光芯片10121H被设置于所述线路板主体10122H上。根据本发明的这个实施例，所述感光芯片10121H模塑地连接于所述线路板主体10122。
根据本发明这个实施例，所述感光部1012H包括一连接线路和至少一电路元件10123H。所述连接线路预设于所述线路板主体10122H，所述电路元件10123H电连接于所述连接线路以及所述感光芯片10121H，以供所述感光芯片10121H的感光工作过程。所述电路元件10123H凸出地设置于所述线路板主体10122H。所述电路元件10123H可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部1011H将所述电路元件10123H包覆于其内部，因此使得所述电路元件10123H不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片10121H相通的环境中，从而当组装为所述摄像模组时，所述电路元件10123H上不会沾染灰尘等污染物，也不会影响所述感光芯片10121H，不同于传统摄像模组中电路元件10123H暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件10123H表面，避免污染所述感光芯片10121H而使得摄像模组出现污黑点等不良现象。
所述封装部1011H形成一通孔101100H，以便于为所述感光芯片10121H提供感光路径。
根据本发明的这个优选实施例，所述感光部1012H包括至少一连接线10124H，用于电连接所述感光芯片10121H和所述线路板主体10122H。进一步，所述连接线10124H可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线10124H呈弧形地连接所述感光芯片10121H和所述线路板主体10122H。
值得一提的是，所述连接线10124H被模塑于所述封装部1011H内部，从而可以借助所述封装部1011H将所述连接线10124H进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线10124H不会受到任何的碰触损伤，同时减少环境因素对个所述连接线10124H的影响，如温度，使得所述感光芯片10121H和所述线路板主体10122H之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部1011H包覆所述电路元件10123H和所述连接线10124H，具有保护所述电路元件10123H和所述连接线10124H以及得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部1011H不限于包覆所述电路元件10123H或所述连接线10124H。也就是说，在本发明的其他实施例中，所述封装部1011H可以直接模塑于没有凸出的所述电路元件10123H的所述线路板主体10122H，也可以是模塑于所述电路元件10123H外侧、周围等不同位置。
进一步，所述感光芯片10121H具有一感光区101211H和一非感光区101212H，所述非感光区101212H环绕于所述感光区101211H外围。所述感光区101211H用于进行感光作用，所述连接线10124H连接于所述非感光区101212H。
根据本发明的这个优选实施例，所述封装部1011H延伸于所述感光芯片10121H的所述非感光区101212H，从而将所述感光芯片10121H通过模塑的方式叠层固定于所述线路板主体10122H。通过这样的方式，如模塑于芯片的方式(Molding on the chip，MOC)扩大了所述封装部1011H向内的可模塑范围，从而可以减小所述线路板主体10122H以及所述封装部1011H的外侧的结构性部分，进一步减小所述模塑感光部1012H件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部1011H凸起地围绕于所述感光芯片10121H的所述感光区101211H外侧，特别地，所述封装部1011H一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件1010H被用于组装所述摄像模组时，所述感光芯片10121H被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件1010H时，可以选取一传统的线路板作为所述线路板主体10122H，在所述线路板主体10122H上设置一所述感光芯片10121H，将所述感光芯片 10121H通过所述连接线10124H电连接，进而在初步组装后的所述线路板主体10122H和感光芯片10121H部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部1011H，或用半导体封装中常用的模压工艺形成所述封装部1011H。所述线路板主体10122H可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部1011H形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部1011H可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用热熔性树脂或热固性树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
所述封装部1011H在此处为所述支架1050H提供安装位置，基于模塑工艺的优势，所述封装部1011H可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述支架1050H平整地被安装。
值得一提的是，所述封装部1011H的内壁可以根据所述连接线的形状的而设置，比如设置为倾斜状，从而在包覆所述连接线10124H的同时使得所述感光芯片10121H可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部1011H的形状并不是本发明的限制。
所述感光组件在本发明的其他实施例中，还可以组装为动焦摄像模组，从而可以改变所述摄像模组的焦距，本领域的技术人员应当理解的是，所述摄像模组的类型并不是本发明的限制。
参照图27是根据本发明的第十个优选实施例的感光组件1010和摄像模组10100。不同于上述优选实施例的是，所述感光组件1010包括一屏蔽层10126I，所述屏蔽层10126I包裹所述线路板主体10122和所述封装部1011，从而在增强所述线路板主体10122的结构强度的同时，增强所述感光组件1010的抗电磁干扰能力。
更进一步，所述屏蔽层10126I为一金属层，可以为板状结构或网状结构。
参照图28，根据本发明的第十一个优选实施例的感光组件1010。所述感光组件1010包括一支架1050，所述支架1050补充设置于所述封装部1011，与所述封装部1011形成封闭的通孔101100。
进一步，所述封装部1011具有一缺口101300，所述支架1050补充设置于所述缺口101300，从而使得所述缺口101300封闭，形成所述通孔101100。也就是说，所述封装部1011并不是形成封闭的环形结构，而通过所述支架1050的补充后形成封闭结构。
所述支架1050具有一滤光片槽1051，用于安装所述滤光片1020。所述支架1050补充于所述封装部1011，以便于为所述滤光片1020提供安装位置。
所述支架1050包括一延伸腿1052，补充于所述缺口101300，延伸连接至所述线路板主体10122，以便于将所述缺口101300封闭，形成封闭的所述通孔101100。
在图中所示方式中，所述封装部1011形成平台结构，所述支架1050被支撑于所述平台结构，且所述支架1050为所述滤光片1020提供安装位置。在本发明的另一实施例中，所述封装部1011可以具有所述滤光片安装槽，用于安装所述支架1050，且所述延伸腿1052延伸连接于所述线路板主体10122。进一步，所述封装部1011的所述缺口101300以及所述支架的所述延伸腿1052的结构可以为楔形结构，以便于所述支架1050顺利、稳定地被安装于所述封装部1011。当然，在本发明的其他实施例中，所述支架1050还可以是其他形状，本领域的技术人员应当理解的是，所述支架1050的结构并不是本发明的限制。
进一步，所述支架1050向下延伸连接于所述线路板主体10122，举例地但不限于，通过胶水连接于所述线路板主体10122。
也就是说，在这种方式中，所述感光芯片10121的至少部分所述非感光区101212被所述封装部1011一体封装，且至少部分所述非感光区101212未被所述封装部1011一体封装。 未被所述封装部1011一体封装的所述非感光区101212，对应所述支架1050的延伸位置。
参照图29，根据本发明的第十二个优选实施例的感光组件1010。在这种实施方式中，所述电路元件10123被设置于所述线路板主体10122的背面。比如，多个所述电路元件10123被相互间隔地贴装于所述线路板主体10122的背面。也就是说，所述电路元件10123可以不被设置于所述线路板主体10122的正面，即，可以不被设置于所述感光芯片10121的周围，从而不需要在所述线路板正面的所述感光芯片的周围区域预留所述电路元件10123的安装位置，从而减小所述线路板主体10122的长宽尺寸，从而减少所述摄像模组的长宽尺寸，以使得所述摄像模组能够被应用于追求轻薄化的所述电子设备。
所述电路元件10123被设置于所述线路板主体10122的背面，也就是说，所述电路元件10123可以被设置于所述线路板主体10122的背面与所述感光芯片10121相对的位置，从而使得所述电路元件10123可设置区域大大增加。当所述电路元件10123被设置于所述电路板主体10122的正面时，只能被设置于所述感光芯片10121的周围，因此对线路板板主体10122的面积要求较大，且在形成所述封装部1011时，所述封装部1011需要包覆所述电路元件10123，因此必须成型的面积较大，这些在一定程度上限制了所述感光组件1010以及所述摄像模组尺寸减小的可能性。
参照图30，根据本发明的第十二个优选实施例的变形实施方式的感光组件1010，所述电路元件10123被设置于所述线路板主体10122的背面，所述封装部1011包覆所述电路元件10123。
进一步，所述封装部1011包括一下包覆部10115，所述下包覆部10115被设置于所述线路板主体10122的背面。所述包覆部10115一体成型于所述线路板主体10122的背面，从而包覆位于所述线路板主体10122背面的所述电路元件10123，从而使得所述的电路元件被稳定地设置。
值得一提的是，在制造的过程中，所述下包覆部10115可以与位于所述线路板主体10122上方的所述包覆段10111、所述滤光片安装段10112等一体成型而形成，也可以单独成型的方式设置。也就是说，可以在所述线路板主体10122上一次成型之后，再在所述线路板主体10122的背面一次成型所述下包覆部101115，本领域的技术人员应当理解的是，所述下包覆部10115成型方式以及成型区域大小，并不是本发明的限制。
参照图31，根据本发明的第十三个优选实施例的感光组件1010。所述线路板主体10122包括一第一板体101223和第二板体101224，所述第一板体101223电连接于所述第二板体101224。进一步，所述第一板体101223通过一导电介质101225电连于所述第二板体101224。所述导电介质101225举例地但不限于，各向异性导电胶。特别地，所述第一板体101223可以是一硬板，所述第二板体101224可以是一软板。
所述感光芯片10121被设置于所述第一板体101223，所述封装部1011至少部分地一体封装所述第一板体101223和所述感光芯片10121的至少部分所述非感光区。
进一步，所述感光芯片10121通过所述连接线10124电连接于所述第一板体101223。
在这个实施例附图中，所述第二板体101224搭接于所述第一板体101223的正面，并且通过所述导电介质101225电连接于所述第一板体101223。
在另一实施例中，所述第二板体101224可以拼接于所述第一板体101223，并且通过所述导电介质101225电连接于所述第一板体101223。
在另一实施例中，所述第二板体101224可以连接于所述第一板体101223的背面，并且通过所述导电介质101225电连接于所述第一板体101223。
在制造所述感光组件1010时，在一种方式中，可以先将所述封装部1011一体成型于所述第一板体101223，而后电连接所述第一板体101223和所述第二板体101224。而在另一种方式中，可以先将所述第一板体101223和所述第二板体101224先进行电连接，而后将所述封装部1011一体成型于所述第一板体101223。当然，所述封装部1011可以一体成型于所述第一板体101223和所述第二板体101224的连接位置，从而将所述第一板体101223和所述第 二板体101224稳定地固定，本领域的技术人员应当理解的是，所述第一板体101223和所述第二板体101224的连接方式以及所述封装部1011的成型位置并不是本发明的限制。
参照图32A，根据本发明的第十四个优选实施例的感光组件1010。在本发明的这个实施例中，所述感光组件1010包括一保护层10127，所述保护层10127被设置于所述线路板主体10122，以使得所述线路板主体10122表面平整，并且在制造的过程中保护所述线路板主体10122。
进一步，所述线路板主体10122包括一基板1227和至少一电路1228，所述电路1228被设置于所述基板1227。所述保护层10127覆盖于所述电路，从而保护所述电路，且填充所述电路1228在所述基板1227表面形成的凹凸不平的区域。
所述保护层10127可以延展至所述基板的边缘位置，以便于在制造所述感光组件，缓冲、支撑所述成型模具，从而保护所述线路板主体10122，防止所述成型模具在合模时的冲压力对损伤所述线路板主体。
在制造的过程中，所述保护层可以在所述线路板主体10122上贴装所述感光芯片10121后设置所述保护层10127，也可以先在所述线路板主体上设置所述保护层10127，而后贴装所述感光芯片10121。
举例地，在一些实施例中，可以将油墨等介质涂覆于所述线路板主体10122，以藉由油墨等介质在所述线路板主体10122上形成所述保护层。所述保护层10122的厚度以及所述设置区域根据需求设置。
在一些实施例中，所述保护层10127可以被设置于所述感光芯片10121的周围区域。比如，在所述线路板主体10122上贴装所述感光芯片10121，并且通过所述连接线10124将所述感光芯片10121电连接于所述线路板主体10122，而后在所述感光芯片周围的所述线路板主体区域涂覆油墨等介质，形成所述保护层。
参照图32B，在这种实施方式中，所述保护层10127可以被设置于所述所述感光芯片的至少部分所述非感光区101212，以便于保护所述感光芯片10121。也就是说，在通过所述成型模具形成所述封装部1011时，所述成型模具可以不直接与所述线路板主体10122以及所述感光芯片10121接触，而被所述保护层10127支撑，从而保护所述线路板主体10122和所述感光芯片10121。
在所述线路板主体10122和/或所述感光芯片10121上设置所述保护层10127带来诸多优势，举例地但不限于，第一，填充所述线路板主体10121的不平整区域，从而使得所述线路板主体10121表面平整，方便一体成型所述封装部1011；第二，在通过所述成型模具形成所述封装部1011时，缓冲、支撑所述成型模具，减小所述成型模具对所述线路板主体10121和/或所述感光芯片的冲压作用；第三，所述保护层具有弹性，与所述成型模具的边缘接触，防止成型材料在模塑的过程中出现溢流而产生飞边；第四，在所述感光组件1010成型后，由于所述保护层10127弹性优于所述封装部1011和所述线路板主体10122，从而柔性地缓冲所述封装部1011和所述线路板主体10122之间的相互作用力，使得所述线路板主体10122不易于由于环境温度等因素的影响而与所述封装部1011脱离，且避免影响其他部件，比如所述滤光片1020。当然，所述保护层10127的设置还具有其他众多优势，在此不再一一列举。值得一提的是，所述弹性是比较所述封装部1011和所述线路板主体10122而言，且不会影响所述摄像模组的成像质量。
参照图33，上述优选实施例的各摄像模组可以组成一阵列摄像模组。所述阵列摄像模组包括至少两所述摄像模组10100，各所述摄像模组10100相互配合实现所述阵列摄像模组的图像采集，且各所述摄像模组10100独立。
在本发明的这个实施例中，各所述摄像模组10100相互独立，通过一外框体10400组装而成。也就是说，各所述摄像模组10100的各部件不相互连接，可以自由地组合。各所述摄像模组10100可以通过胶水粘接固定的方式固定于所述外框体10400。
上述各优选实施例的摄像模组10100和各所述感光组件1010以及各实施例中特征的组 合形成摄像模组都可以用于组装所述阵列摄像模组，并不限于图中所示方式。
参照图34，上述优选实施例的各摄像模组10100可以组成另一阵列摄像模组。所述阵列摄像模组包括至少两所述摄像模组10100，各所述摄像模组10100相互配合实现所述阵列摄像模组的图像采集，且各所述摄像模组10100相互连接。
在一实施例中，各所述摄像模组10100的所述线路板主体10122相互连接，形成一一体的线路板主体，从而可以设置一共用连接器。
在一实施例中，各所述摄像模组10100的所述封装部1011一体连接，形成一连体封装部。也就是说，在成型时，在各所述线路板主体10122和各所述感光芯片10121上一次成型形成连体的两个所述封装部1011，从而使得两所述摄像模组10100的所述感光组件1010相互连接。
在一实施例中，各所述摄像模组的所述支架1050一体连接，形成一连体支架，以便于通过所述连体支架将各所述感光组件1010连接。
在本发明的上述实施中，以由两个所述摄像模组100构成的双摄阵列摄像模组为例进行说明，而在发明的其他实施例中还可以有更多所述摄像模组100，比如三个及三个以上，本领域的技术人员应当理解的是，所述摄像模组100的数量并不是本发明的限制。
参照图35，所述摄像模组10100能够被应用于一电子设备本体200，以便于配合所述电子设别本体200形成一具有图像采集功能的电子设备300。举例地但不限于所述电子设备300被具体实施为智能手机。
所述电子设备本体200尽管在附图1B中被实施为智能手机，在本发明的其他示例中，所述电子设备本体200也可以被实施为平板电脑、笔记本电脑、相机、个人数字助理、电子书、MP3/4/5等任何能够被配置所述摄像模组10100的电子设备。当然，本领域的技术人员应当理解，在冰箱、洗衣机、电视机等传统的家电上配置所述摄像模组10100也是可能的，或者在防盗门、墙壁等建筑上配置所述摄像模组10100也是可能的，因此，所述摄像模组10100的应用环境和使用方式并不应被视为对本发明的所述摄像模组10100的内容和范围的限制。
参照图36A和36B，根据本发明上述优选实施例的摄像模组和传统摄像模组的比较示意图。图36A中，左侧代表传统的摄像模组，右侧代表本发明的中的摄像模组。图36B中，左侧代表传统的线路板制造过程，右侧代表本发明的感光组件制造过程。
综合上述内容，可以很明显的看到，本发明的感光组件和摄像模组具有以下优势：
1、可以减小摄像模组的长宽尺寸，封装部分与电路元件，如阻容器件部分空间上可以重叠；传统方案支架需在电容外侧，且需要预留一定安全距离，本发明的方案可以直接利用电容空间，直接在电容周围充填塑胶。
2、降低模组倾斜，封装部分可替代现有塑料支架设计，减小累计公差；
3、模塑提升线路板结构强度，同等结构强度下，因为封装部分可以起到支撑作用，可以增加强度，线路板可以做的更薄，降低模组高度；
4、在高度空间上，传统方案电容与底座需要预留组装安全空间，模塑工艺可以不预留，降低模组高度；传统方案电容顶端距离支架需要预留安全间隙，防止干涉，新方案可以直接在电容周围充填塑胶。
5、电阻电容器件可以通过模塑包裹起来，可以避免阻容器件区域助焊剂、灰尘等所导致的模组污黑点不良，提升产品良率；
6、适合高效率大规模量产，本发明的感光组件更适于大量拼版作业。基于本发明的所述感光组件的模塑成型的方式，所述感光组件更适合拼版作业，一次完成较多量的感光组件的制造，比如可以达到80至90个，而传统的支架一次最多只能生产8个。
参照图37至图43，根据本发明的第十六个优选实施例的感光组件2010和摄像模组20100被阐释。所述感光组件2010用于组装制造所述摄像模组。所述感光组件2010包括一封装部2011和一感光部2012，所述封装部2011一体封装地连接于所述感光部2012，例如 模塑的方式形成一体结构。
所述感光部2012包括一线路板主体20122和一感光芯片20121，所述感光芯片20121被设置于所述线路板主体20122上。根据本发明的这个实施例，所述感光芯片20121模塑地连接于所述线路板主体20122。特别地，所述封装部2011以模塑于芯片的方式(Molding on Chip，MOC)模塑于所述感光部2012。
根据本发明这个实施例，所述感光部2012包括一连接线路和至少一电路元件20123。所述连接线路预设于所述线路板主体20122，所述电路元件20123电连接于所述连接线路以及所述感光芯片20121，以供所述感光芯片20121的感光工作过程。所述电路元件20123被凸出地设置于所述线路板主体20122。所述电路元件20123可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011将所述电路元件20123包覆于其内部，因此使得所述电路元件20123不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121相通的环境中，从而当组装所述摄像模组时，所述电路元件20123上不会沾染灰尘等污染物，也不会影响所述感光芯片20121，不同于传统摄像模组中电路器件暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123表面，避免污染所述感光芯片20121而使得摄像模组出现污黑点等不良现象。
值得一提的是，在本发明的这个实施例中，以所述电路元件20123凸出于所述线路板主体20122为例进行说明，而在本发明的其他实施例中，所述电路元件20123可以埋设于所述线路板主体20123而不凸出于所述线路板主体，本领域的技术人员应当理解的是，所述电路元件20123的形状、类型以及设置位置并不是本发明的限制。
所述封装部2011形成一通孔201100，以便于为所述感光芯片20121提供感光路径。
也就是说，所述封装部2011提供一光窗，为所述感光芯片20121提供光线通路，从而使得经过位于所述封装部2011上方的所述镜头2030(后续提出)的光线能够到达所述感光芯片20121，而不被所述封装部2011阻挡。
根据本发明的这个优选实施例，所述感光部2012包括至少一连接线20124，用于电连接所述感光芯片20121和所述线路板主体20122。进一步，20所述连接线20124可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124呈弧形地连接所述感光芯片20121和所述线路板主体20122。
值得一提的是，20所述连接线20124被模塑于所述封装部2011内部，从而可以借助所述封装部2011将20所述连接线20124进行包覆，而不会直接暴露于外部，从而在组装所述摄像模组时，使得所述连接线20124不会受到任何的碰触损伤，同时减少环境因素对个所述连接线20124的影响，如温度、湿度，使得所述感光芯片20121和所述线路板主体20122之间的通讯连接稳定，这一点是完全不同于现有技术的。
所述封装部2011的所述通孔201100的底部呈由下至上逐渐增大的倾斜状，可以理解的本发明中的的所述通孔201100的形状并不限于这个倾斜形状。
所述封装部2011具有一内侧面201200，所述内侧面201200环绕形成所述通孔201100。所述内侧面201200倾斜地设置，以使得所述通孔201100呈由下至上逐渐增大的倾斜状。具体地，所述内侧面201200具有一倾斜角α，即所述内侧面201200的倾斜方向与垂直方向的夹角。
值得一提的是，所述封装部2011包覆所述电路元件20123和所述连接线20124，具有保护所述电路元件20123和所述连接线20124及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011不限于包覆所述电路元件20123或所述连接线20124。也就是说，在本发明的其他实施例中，所述封装部2011可以直接模塑于没有凸出的所述电路元件20123的所述线路板主体20122，也可以是模塑于所述电路元件20123外侧、周围等不同位置。
进一步，所述感光芯片20121具有一感光区201211和一非感光区201212，所述非感光 区201212环绕于所述感光区201211外围。所述感光区201211用于进行感光作用，所述连接线20124连接于所述非感光区201212。
根据本发明的这个优选实施例，所述封装部2011延伸于所述感光芯片20121的所述非感光区201212，从而将所述感光芯片20121通过模塑的方式叠层固定于所述线路板主体20122。通过这样的方式，如模塑于芯片的方式(Molding on Chip，MOC)扩大了所述封装部2011向内的可模塑范围，从而可以减小所述线路板主体20122以及所述封装部2011的外侧的结构性部分，进一步减小所述感光组件2010的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011凸起地围绕于所述感光芯片20121的所述感光区201211外侧，特别地，所述封装部2011一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件2010被用于组装所述摄像模组时，所述感光芯片20121被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件2010时，可以选取一传统的线路板作为所述线路板主体20122，在所述线路板主体20122上设置一所述感光芯片20121，将所述感光芯片20121通过所述连接线20124电连接，进而在初步组装后的所述线路板主体20122和感光芯片20121部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部2011，或用半导体封装中常用的模压工艺形成所述封装部2011。所述线路板主体20122可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部2011形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部2011可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
值得一提的是，基于本发明的所述感光组件2010的模塑成型的方式，所述感光组件2010更适合拼版作业，一次完成较多量的所述感光组件2010的制造，比如可以达到90个，而传统的支架一次注塑封装部，即镜座，需要先涂画胶水，并且一般一次只能贴装一个，在注塑过程中一般一次性生产4-8个，最多只能生产32个。
进一步，所述封装部2011包括一包覆段20111和一滤光片安装段20112，所述滤光片安装段20112模塑地一体连接于所述包覆段20111，所述包覆段20111模塑连接于所述线路板主体20122，用于包覆所述电路元件20123和所述连接线20124。所述滤光片安装段20112用于安装一滤光片2020，也就是说，当所述感光组件2010被用于组装所述摄像模组时，所述摄像模组的所述滤光片2020被安装于所述滤光片安装段20112，使得所述滤光片2020位于所述感光芯片20121的感光路径上，且不需要提供额外的滤光片安装支架。也就是说，所述封装部2011在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段20112顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片2020平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段20112具有一安装槽201121，所述安装槽201211连通于所述通孔201100，为所述滤光片2020提供充足的安装空间，使得所述滤光片2020不会凸出于所述滤光片安装段20112的顶表面201122。也就是说，所述封装部2011上端设置所述安装槽201121，从而可以将所述滤光片2020安装于其中。特别地，所述滤光片2020为一红外截止滤光片IRCF。
值得一提的是，在本发明的这个实施例中，所述安装槽201121可以用于安装滤光片，而在本发明的其他实施中，所述安装槽201121可以用来安装所述摄像模组的马达或镜头等部件，本领域的技术人员应当理解的是，所述安装槽201121的用途并不是本发明的限制。
值得一提的是，所述封装部2011的内壁可以根据所述连接线20124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124的同时使得所述感光芯片20121可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部2011的形状并不是本发明的限制。
进一步，根据本发明的这个优选实施例，所述感光组件2010包括一马达连接结构2013，用于连接所述摄像模组的一马达2040。所述马达2040具有至少一马达引脚2041。所述马达连接结构2013包括至少一引线20131，各所述引线20131用于电连接所述马达2040和所述线路板主体20122。各所述引线20131电连接于线路板主体20122。进一步，所述引线20131电连接于所述线路板主体20122的连接电路。所述引线20131被设置于所述封装部2011，并且延伸至所述封装部2011的顶端。所述引线20131包括一马达连接端201311，显露于所述封装部2011的顶端，用于电连接所述马达2040的所述引脚2041。值得一提的是，所述引线20131可以在形成所述封装部2011时以埋设方式设置。在传统的连接方式中，诸如驱动马达等部件都是通过设置单独的导线来连接于线路板，制造工艺相对复杂，而在本发明的这种模塑时埋设所述引线20114的方式可以取代传统的马达焊接等工艺过程，并且使得电路连接更加稳定。特别地，在本发明的一实施中，所述引线20131为一导线，被埋设于所述封装部2011内部。举例地，所述马达引脚2041可以通过导电胶连接于所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
值得一提的是，所述引线20131的埋设位置以及所述引线20131的所述马达连接端201311在所述封装部2011显示的位置可以根据需要设置。比如，在本发明的一实施例中，所述引线20131的所述马达连接端201311可以被设置于所述封装部2011的外围，即所述封装部2011的顶表面，所述滤光片安装段20112的顶表面201122，而在本发明的另一实施例中，所述马达连接端201311可以被设置于所述封装部2011的内围，即所述封装部2011的所述安装槽201121底面，从而可以提供所述马达2040不同的安装位置。换句话说，当所述马达2040需要安装至所述封装部2011顶部时，所述马达连接端201311设置于所述封装部2011外围顶表面，当所述马达2040需要安装至所述安装槽201121时，所述马达连接端201311设置于所述封装部2011的内围，即所述安装槽201121底面。
也就是说，在制造所述感光组件2010时，先贴装所述感光芯片20121，而后在所述线路板主体20122以及所述感光芯片20121上，以MOC的方式模塑所述封装部2011，且在模塑时可以以埋设方式在所述封装部2011内部设置所述引线20131，并且使得所述引线20131电连接于所述线路板主体20122，且使得所述引线20131的所述马达连接端201311显示于所述封装部2011的顶端，以便于连接于所述马达2040的所述引脚2041。举例地，在所述感光组件2010被用于组装所述摄像模塑时，所述马达2040的各所述引脚2041通过焊接的方式连接于所述引线20131的所述马达连接端201311，从而使得所述马达2040电连接于所述线路板主体20122，且需要设置单独的导线将所述马达2040和所述线路板主体20122连接，且使得所述马达2040的所述引脚2042的长度可以减小。
值得一提的是，所述引线20131的埋设位置可以根据需要设置，比如，在本发明的一个实施例中，可以设置于所述封装部2011的内部，将所述引线20131隐藏，而在另一个实施例中，可以将所述引线20131埋设于所述封装部2011的表面，本领域的技术人员应当理解的是，所述引线20131的位置并不是本发明的限制。
参照图41A是根据本发明的上述优选实施例的所述马达连接结构的一等效实施例。所述马达连接结构2013包括至少一引脚槽20133，所述引脚槽20133用于容纳所述摄像模组的所述马达2040的所述引脚2041。所述引脚槽20133被设置于所述封装部2011上端。所述马达连接结构2013包括至少一引线20134，,所述引线20134用于电连接所述马达2040和所述线路板主体20122。所述引线20134被设置于所述封装部2011，并且向上延伸至所述封装部2011的所述引脚槽20133的槽底壁。所述引线20134包括一马达连接端1341，显露于所述封装部2011的所述引脚槽20133的槽底壁，用于电连接所述马达2040的所述引脚2041。特别地，在一种实施方式中，所述马达连接端1341可以被实施为一焊盘。所述引线 20134可以被实施为一导线，被埋设于所述封装部2011内部。
也就是说，在制造所述感光组件2010时，先贴装所述感光芯20121片，而后在所述线路板主体20122以及所述感光芯片20121上，以MOC的方式模塑所述封装部2011，并且预设预定长度的所述引脚槽20133，且在模塑时可以埋设方式设置所述引线20134，并且使得所述引线20134电连接于所述线路板主体20122，且使得所述引线20134的所述马达连接端1341显示于所述封装部2011的所述引脚槽20133的槽底壁，以便于连接于所述马达2040的所述引脚2041。举例地，在所述感光组件2010被用于组装所述摄像模塑时，所述马达2040的各所述引脚2041插入所述引脚槽20133，且通过焊接的方式连接于所述引线20134的所述马达连接端1341，从而使得所述马达2040电连接于所述线路板主体20122，且需要设置单独的导线将所述马达2040和所述线路板主体20122连接，且使得所述马达2040的所述引脚2042可以稳定地连接，防止外部不需要的碰触所述马达引脚2041。特别地，所述引线20134可以被实施为一导线，被埋设于所述封装部2011内部。
值得一提的是，所述引线20134的埋设位置可以根据需要设置，比如，在本发明的一个实施例中，可以设置于所述封装部2011的内部，将所述引线20134隐藏，而在另一个实施例中，可以将所述引线20134埋设于所述封装部2011的表面，本领域的技术人员应当理解的是，所述引线20134的位置并不是本发明的限制。
参照图41B，是根据本发明的上述优选实施例的马达连接结构的另一等效实施例。所述马达连接结构2013包括一引脚槽20135，所述引脚槽20135用于容纳所述摄像模组的所述马达2040的所述引脚2041。所述引脚槽20135被设置于所述封装部2011。所述马达连接结构2013包括至少一电路接点20132，所述电路接点20132预设于所述线路板主体20122，并且电连接于所述线路板主体内20122的所述连接线路。更进一步，各所述引脚槽20135由所述封装部2011的顶端延伸至所述线路板主体20122，并且使得所述电路接点20132显示。在一实施例方式中，所述马达引脚2041适于插入所述引脚槽20135，并且可以与所述电路接点20132焊接连接。
也就是说，在制造所述感光组件2010时，在所述线路板主体20122上预设各所述电路接点20132，进而贴装所述感光芯20121片，而后在所述线路板主体20122以及所述感光芯片20121上，以MOC的方式模塑所述封装部2011，并且预设预定长度的所述引脚槽20135，且使得所述电路接点20132通过所述引脚槽20135显示，以便于连接于所述马达2040的所述引脚2041。举例地，在所述感光组件2010被用于组装所述摄像模组时，所述马达2040的各所述引脚2041插入所述引脚槽20135，且通过焊接的方式连接于线路板主体20122上的所述电路接点20132，从而使得所述马达2040电连接于所述线路板主体20122，且使得所述马达2040的所述引脚2041可以稳定地连接，防止外部不需要的碰触所述马达引脚2041。
参照图41C，是根据本发明的上述优选实施里马达连接结构的另一等效实施例。所述马达连接结构2013包括至少一雕刻线路20136，所述雕刻线路20136用于电连接所述线路板主体20122上的所述连接线路、所述感光芯片20121以及马达等部件。举例地但不限于，所述雕刻线路20136可以通过激光成型(LDS)的方式在形成所述封装部2011时设置。举例地，在本发明的一实施例中，所述雕刻线路20136通过激光直接成型的方式设置于所述封装部2011的表面。在传统的连接方式中，诸如驱动马达等部件都是通过设置单独的导线来连接于线路板，制造工艺相对复杂，而在本发明的这种模塑时设置所述雕刻线路20136的方式可以取代传统的马达引脚焊接或插接等工艺过程，并且使得电路连接更加稳定。更具体地，所述雕刻线路20136的形成过程可以是，现在所述封装部2011设置雕刻槽，而后在所述雕刻槽内以电镀或化镀的方式设置电路。
参照图37至图40以及图42和图43，是根据本发明的第十六个优选实施例的一摄像模组，所述摄像模组可以为一动焦摄像模组(Automatic Focus Model，AFM)。所述摄像模组20100包括一所述感光组件2010、一所述滤光片2020、一所述马达2040和一镜头2030。
所述滤光片2020被安装于所述感光组件2010，所述镜头2030被安装于所述马达2040， 所述马达2040被安装于所述感光组件2010上。
进一步，所述滤光片2020被安装于所述感光组件2010的所述封装部2011的所述滤光片安装段20112的所述安装槽201121。所述马达2040被安装于所述感光组件2010的所述封装部2011的所述滤光片安装段20112顶端。也就是说，所述滤光片2020被安装于所述封装部2011的所述安装槽，所述镜头2030被安装于所述马达2040，所述马达2040被安装于所述封装部2011的顶端。
特别地，所述马达2040的所述马达引脚2041电连接于所述感光组件的所述电路接点20132，从而通过所述引线20131电连接于所述线路板主体20122。所述马达引脚2041可以通过导电胶连接于所述引线20131的所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
特别地，当所述引脚通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马达2040和所述感光部2012的所述线路板主体20122，从而减少马达焊接的工艺过程。
值得一提的是，在本发明的这个实施例中，以所述引线20131连接所述马达2040的方式来说明本发明电连接马达的方式，而在本发明的其他实施例所述，可以选择不同方式的所述马达连接结构2013来连接所述马达2040，例如，选取图41A、41B、41C中示例的方式，也就是说，所述图41A、41B、41C中对应的不同马达连接结构都可以与不同感光组件结合，从而提供不同马达连接方式，本领域的技术人员应当理解的是，图中所示方式，并不是本发明的限制。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
参照图37至图40以及图44和图45，根据本发明的第十六个优选实施例的另一摄像模组。所述摄像模组可以是一定焦模组(Fix Focus Model，FFM)。所述摄像模组20100包括一所述感光组件2010、一所述滤光片2020和一镜头2030。
所述滤光片2020被安装于所述感光组件2010，所述镜头2030被安装于所述感光组件2010上。
更具体地，所述滤光片2020被安装于所述感光组件2010的所述封装部2011的所述滤光片安装段20112的所述安装槽201121。所述镜头2030被按安装于所述感光组件2010的所述封装部2011的所述滤光片安装段20112的顶部。也就是说，所述滤光片被安装于所述安装槽，所述镜头2030被安装于所述封装部2011顶端。
还值得一提的是，所述镜头2030被安装于所述感光组件2010的所述封装部2011的所述滤光片安装段20112顶端，从而所述封装部2011相当于传统摄像模组中的支架的功能，为所述镜头2030提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部2011通过模塑工艺固定于所述线路板主体20122，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部2011与所述线路板主体20122之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部2011包覆所述电路元件20123和所述连接线20124，使得传统的支架功能和电路元件20123以及所述连接线20124可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部2011的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部2011代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部2011包覆所述连接线20124，且所述封装部2011延伸至所述感光芯片20121的非感光区201212，使得所述封装部2011可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
参照图46和图47，根据本发明的第十七优选实施例的摄像模组感光组件和摄像模组。 所述感光组件2010A用于组装制造所述摄像模组20100A，从而得到模塑型的摄像模组。所述感光组件2010A包括一封装部2011A和一感光部2012A，所述封装部2011A模塑地连接于所述感光部2012A。
所述感光部2012A包括一线路板主体20122A和一感光芯片20121A，所述感光芯片20121A被设置于所述线路板主体20122A上。根据本发明的这个实施例，所述感光芯片20121A模塑地连接于所述线路板主体20122A。
根据本发明这个实施例，所述感光部2012A包括一连接线路和至少一电路元件20123A。所述连接线路预设于所述线路板主体20122A，所述电路元件20123A电连接于所述连接线路以及所述感光芯片20121A，以供所述感光芯片20121A的感光工作过程。所述电路元件20123A凸出地设置于所述线路板主体20122A。所述电路元件20123A可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011A将所述电路元件20123A包覆于其内部，因此使得所述电路元件20123A不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121A相通的环境中，从而当组装为所述摄像模组时，所述电路元件20123A上不会沾染灰尘等污染物，也不会影响所述感光芯片20121A，不同于传统摄像模组中电路元件20123A暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123A表面，避免污染所述感光芯片20121A而使得摄像模组出现污黑点等不良现象。
所述封装部2011A形成一通孔201100A，以便于为所述感光芯片20121A提供感光路径。
根据本发明的这个优选实施例，所述感光部2012A包括至少一连接线20124A，用于电连接所述感光芯片20121A和所述线路板主体20122A。进一步，所述连接线20124A可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124A呈弧形地连接所述感光芯片20121A和所述线路板主体20122A。值得一提的是，所述连接线20124A被模塑于所述封装部2011A内部，从而可以借助所述封装部2011A将所述连接线20124A进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线20124A不会受到任何的碰触损伤，同时减少环境因素对个所述连接线20124A的影响，如温度，使得所述感光芯片20121A和所述线路板主体20122A之间的通讯连接稳定，这一点是完全不同于现有技术的。
值得一提的是，所述封装部2011A包覆所述电路元件20123A和所述连接线20124A，具有保护所述电路元件20123A和所述连接线20124A及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011A不限于包覆所述电路元件20123A或所述连接线20124A。也就是说，在本发明的其他实施例中，所述封装部2011A可以直接模塑于没有凸出的所述电路元件20123A的所述线路板主体20122A，也可以是模塑于所述电路元件20123A外侧、周围等不同位置。
不同于上述优选实施例的是，所述线路板主体20122A具有一内凹槽201222A，所述感光芯片20121A被设置于所述内凹槽201222A内，从而使得所述感光芯片20121A和所述线路板主体20122A的相对高度降低，从而当所述封装部2011A包覆所述感光芯片20121A，减小对所述封装部2011A的高度要求，从而减小所述感光组件2010A组装的摄像模组的高度。
进一步，所述感光芯片20121A具有一感光区201211A和一非感光区201212A，所述非感光区201212A环绕于所述感光区201211A外围。所述感光区201211A用于进行感光作用，所述连接线20124A连接于所述非感光区201212A。
根据本发明的这个优选实施例，所述封装部2011A延伸于所述感光芯片20121A的所述非感光区201212A，从而将所述感光芯片20121A通过模塑的方式叠层固定于所述线路板主体20122A。通过这样的方式，如模塑于芯片的方式(Molding on chip，MOC)扩大了所述封装部2011A向内的可模塑范围，从而可以减小所述线路板主体20122A以及所述封装部2011A的外侧的结构性部分，进一步减小所述感光组件2012A的长宽尺寸，减小由其组装 的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011A凸起地围绕于所述感光芯片20121A的所述感光区201211A外侧，特别地，所述封装部2011A一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件2010A被用于组装所述摄像模组时，所述感光芯片20121A被密封于内部，形成一封闭内空间。
进一步，所述封装部2011A包括一包覆段20111A和一滤光片安装段20112A，所述滤光片安装段20112A模塑地一体连接于所述包覆段20111A，所述包覆段20111A模塑连接于所述线路板主体20122A，用于包覆所述电路元件20123A和所述连接线20124A。所述滤光片安装段20112A用于安装一滤光片2020A，也就是说，当所述感光组件2010A被用于组装所述摄像模组时，所述摄像模组的滤光片2020A被安装于所述滤光片安装段20112A，使得所述滤光片2020A位于所述感光芯片20121A的感光路径上，且不需要提供额外的滤光片2020A安装支架。也就是说，所述封装部2011A在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段20112A顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片2020A平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段20112A具有一安装槽201121A，所述安装槽201121A连通于所述通孔201100A，为所述滤光片2020A提供充足的安装空间，使得所述滤光片2020A不会凸出于滤光片安装段20112A的顶表面201122A。也就是说，所述封装部2011A上端设置所述安装槽201121A，从而将所述滤光片2020A稳定的安装于所述封装部2011A，且不会凸出于所述封装部2011A的顶端。
值得一提的是，所述模塑的内壁可以根据所述连接线20124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124A的同时使得所述感光芯片20121A可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部2011A的形状并不是本发明的限制。
参照图46和图47，根据本发明的第十七优选实施例的摄像模组。所述摄像模组可以为一动焦摄像模组(Automatic Focus Model，AFM)。所述摄像模组包括一所述感光组件2010A、一所述滤光片2020A、一所述马达2040A和一镜头2030A。
所述滤光片2020A被安装于所述感光组件2010A，所述镜头2030A被安装于所述马达2040A，所述马达2040A被安装于所述感光组件2010A上。
进一步，所述滤光片2020A被安装于所述感光组件2010A的所述封装部2011A的所述滤光片安装段20112A的所述安装槽201121A。所述马达2040A被安装于所述感光组件2010A的所述封装部2011A的所述滤光片安装段20112A顶端。也就是说，所述滤光片2020A被安装于所述封装部2011A的所述安装槽201121A，所述镜头2030A被安装于所述马达2040A，所述马达2040A被安装于所述封装部2011A的顶端。
特别地，所述马达2040A通过所述马达连接结构2013电连接于所述感光组件2010A，所述马达4A0的所述马达引脚2041A电连接于所述感光组件2010的所述电路接点20132，从而通过所述引线20131电连接于所述线路板主体20122。所述马达引脚2041可以通过导电胶膜连接于所述引线20131的所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
特别地，当所述马达引脚2041A通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马2040A和所述感光部2012的所述线路板主体20122，从而减少马达焊接的工艺过程。
值得一提的是，在本发明的这个实施例中，以所述引线20131连接所述马达2040A的方式来说明本发明电连接马达的方式，而在本发明的其他实施例所述，可以选择不同方式的所述马达连接结构2013来连接所述马达2040A，例如，选取图41A、41B、41C中示例的方式，也就是说，所述41A、41B、41C中对应的不同马达连接结构都可以与本实施例中的所述感光组件2010A结合，从而提供不同马达连接方式，本领域的技术人员应当理解的是，图中所示方式，并不是本发明的限制。
在本发明的其他实施例中，所述感光组件2010A还可以被组装为一定焦摄像模组，本领域的技术人员应当理解的是，所述摄像模组的类型不是本发明的限制。
参照图48和图49，根据本发明的第十八优选实施例的感光组件和摄像模组。所述感光组件2010B用于组装制造所述摄像模组，从而得到模塑型的摄像模组。所述感光组件2010B包括一封装部2011B和一感光部2012B，所述封装部2011B模塑地连接于所述感光部2012B。
所述感光部2012B包括一线路板主体20122B和一感光芯片20121B，所述感光芯片20121B被设置于所述线路板主体20122B上。根据本发明的这个实施例，所述感光芯片20121B模塑地连接于所述线路板主体20122B。
根据本发明这个实施例，所述感光部2012B包括一连接线路和至少一电路元件20123B。所述连接线路预设于所述线路板主体20122B，所述电路元件20123B电连接于所述连接线路以及所述感光芯片20121B，以供所述感光芯片20121B的感光工作过程。所述电路元件20123B凸出地设置于所述线路板主体20122B。所述电路元件20123B可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011B将所述电路元件20123B包覆于其内部，因此使得所述电路元件20123B不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121B相通的环境中，从而当组装为所述摄像模组时，所述电路元件20123B上不会沾染灰尘等污染物，也不会影响所述感光芯片20121B，不同于传统摄像模组中电路元件20123B暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123B表面，避免污染所述感光芯片20121B而使得摄像模组出现污黑点等不良现象。
所述封装部2011B形成一通孔201100B，以便于为所述感光芯片20121B提供感光路径。
根据本发明的这个优选实施例，所述感光部2012B包括至少一连接线20124B，用于电连接所述感光芯片20121B和所述线路板主体20122B。进一步，所述连接线20124B可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124B呈弧形地连接所述感光芯片20121B和所述线路板主体20122B。
值得一提的是，所述连接线20124B被模塑于所述封装部2011B内部，从而可以借助所述封装部2011B将所述连接线20124B进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线20124B不会受到任何的碰触损伤，同时减少环境因素对各所述连接线20124B的影响，如温度、湿度，使得所述感光芯片20121B和所述线路板主体20122B之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部2011B包覆所述电路元件20123B和所述连接线20124B，具有保护所述电路元件20123B和所述连接线20124B及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011B不限于包覆所述电路元件20123B或所述连接线20124B。也就是说，在本发明的其他实施例中，所述封装部2011B可以直接模塑于没有凸出的所述电路元件20123B的所述线路板主体20122B，也可以是模塑于所述电路元件20123B外侧、周围等不同位置。
进一步，所述感光芯片20121B具有一感光区201211B和一非感光区201212B，所述非感光区201212B环绕于所述感光区201211B外围。所述感光区201211B用于进行感光作用，所述连接线20124B连接于所述非感光区201212B。
根据本发明的这个优选实施例，所述封装部2011B延伸于所述感光芯片20121B的所述非感光区201212B，从而将所述感光芯片20121B通过模塑的方式叠层固定于所述线路板主体20122B。通过这样的方式，如模塑于芯片的方式(Molding on Chip，MOC)扩大了所述封装部2011B向内的可模塑范围，从而可以减小所述线路板主体20122B以及所述封装部2011B的外侧的结构性部分，进一步减小所述模塑感光部件2012B的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011B凸起地围绕于所述感光芯片20121B的所述感光区201211B外侧，特别地，所述封装部2011B一体地闭合连接，使得所述封装部具 有良好的密封性，从而当所述感光组件2010B被用于组装所述摄像模组时，所述感光芯片20121B被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件2010B时，可以选取一传统的线路板作为所述线路板主体20122B，在所述线路板主体20122B上设置一所述感光芯片20121B，将所述感光芯片20121B通过所述连接线20124B电连接，进而在初步组装后的所述线路板主体20122B和感光芯片20121B部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部2011B，或用半导体封装中常用的模压工艺形成所述封装部2011B。所述线路板主体20122B可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部2011B形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部2011B可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部2011B顶端表面平整，适于安装一滤光片2020B，也就是说，当所述感光组件2010B被用于组装所述摄像模组时，所述摄像模组的滤光片2020B被安装于所述封装部2011B的顶端表面，使得所述滤光片2020B位于所述感光芯片20121B的感光路径上，且不需要提供额外的滤光片安装支架。也就是说，所述封装部2011B在此处具有传统支架的功能，但是基于模塑工艺的优势，所述模顶部2011B可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片2020B平整地被安装，这一点也是优于传统的摄像模组。
不同于上述优选实施例的是，在本发明的这个实施例中，所述感光组件2010B的所述感光部2012B包括一加固层20125B，所述加固层20125B叠层地连接于所述线路板主体20122B底层，以便于加强所述线路板主体20122B的结构强度。也就是说，在所述线路板主体20122B上所述封装部2011B以及所述感光芯片20121B所在的区域底层贴装所述加固层20125B，从而使得所述线路板主体20122B稳定可靠地支撑所述封装部2011B和所述感光芯片20121B。
进一步，所述加固层20125B为一金属板，所述金属板贴附于所述线路板主体20122B的底层，增加所述线路板主体20122B的结构强度，另一方面，增加所述感光组件2010B的散热性能，能有效散失所述感光芯片20121B发出的热量。
值得一提的是，所述线路板主体20122B可以采用FPC(Flex Print Circuit，挠性印制电路板)，而通过所述加固层20125B增强所述FPC的刚性，使得具有良好弯曲性能的FPC能够满足所述感光组件2010B的承载要求。也就是说，所述线路板主体20122B的可选择范围更加广泛，例如PCB(Printed Circuit Board，刚性印制电路板)，FPC，RF(Rigid Flex，软硬结合板)。通过所述加固层20125B增加所述线路板主体20122B的结构强度并且提高散热性能，从而可以减小所述线路板主体20122B的厚度，使得所述感光组件2010B的高度进一步减小，以及由其组装得到的摄像模组的高度减小。
值得一提的是，在本发明的这个实施例中，所述加固层20125呈板状重叠于所述线路板主体20122B，而在本发明的其他实施例中，所述加固层20125B可以延伸至包裹所述封装部2011B侧壁，从而在增强所述感光组件2010B的结构强度的同时，增强其抗电磁干扰能力。
值得一提的是，所述封装部的内壁可以根据所述连接线20124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124B的同时使得所述感光芯片20121B可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部2011B的形状并不是本发明的限制。
参照图48和图49，根据本发明的第十八优选实施例的摄像模组。所述摄像模组可以是一定焦模组(Fix Focus Model，FFM)。所述摄像模组包括一所述感光组件2010B、一所述 滤光片2020B和一镜头2030B。
所述滤光片2020B被安装于所述感光组件2010B，所述镜头2030B被安装于所述感光组件2010B上。
更具体地，所述滤光片2020B被安装于所述感光组件2010B的所述封装部2011B顶端。所述镜头2030B被按安装于所述感光组件2010B的所述封装部2011B的顶端。特别地，所述滤光片2020B和所述镜头2030B在所述封装部2011B的具体安装位置可以根据具体需要协调配置。
还值得一提的是，所述镜头2030B被安装于所述感光组件2010B的所述封装部2011B的顶端，从而所述封装部2011B相当于传统摄像模组中的支架的功能，为所述镜头2030B提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部2011B通过模塑工艺固定于所述线路板主体20122B，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部2011B与所述线路板主体20122B之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部2011B包覆所述电路元件20123B和所述连接线20124B，使得传统的支架功能和电路元件20123B以及所述连接线20124B可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部2011B的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部2011B代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部2011B包覆所述连接线20124B，且所述封装部2011B延伸至所述感光芯片20121B的非感光区201212B，使得所述封装部2011B可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。
参照图48和图50，根据本发明的第十八优选实施例的另一摄像模组将被阐释。所述摄像模组可以为一动焦摄像模组。所述摄像模组包括一所述感光组件2010B、一所述滤光片2020B、一马达2040B和一镜头2030B。
所述滤光片2020B被安装于所述感光组件2010B，所述镜头2030B被安装于所述马达2040B，所述马达2040B被安装于所述感光组件上。
更进一步，所述滤光片2020B被安装于所述感光组件2010B的所述封装部2011B的顶端。所述马达2040B安装于所述感光组件2010B的所述封装部2011B的顶端。特别地，所述滤光片2020B和所述马达2040B在所述封装部2011B的具体安装位置可以根据具体需要协调配置。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
特别地，所述马达2040B通过所述马达连接结构2013电连接于所述感光组件2010B，所述马达2040B的所述马达引脚2041B电连接于所述感光组件2010的所述电路接点20132，从而通过所述引线20131电连接于所述线路板主体20122。所述马达引脚2041B可以通过导电胶膜连接于所述引线20131的所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
特别地，当所述马达引脚2041B通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马2040B和所述感光部2012的所述线路板主体20122，从而减少马达焊接的工艺过程。
值得一提的是，在本发明的这个实施例中，以所述引线20131连接所述马达2040B的方式来说明本发明电连接马达的方式，而在本发明的其他实施例所述，可以选择不同方式的所述马达连接结构2013来连接所述马达2040B，例如，选取图41A、41B、41C中示例的方式，也就是说，所述41A、41B、41C中对应的不同马达连接结构都可以与本实施例中的所述感光组件2010B结合，从而提供不同马达连接方式，本领域的技术人员应当理解的是， 图中所示方式，并不是本发明的限制。
参照图51和图52，根据本发明的第十九个优选实施例的感光组件和摄像模组将被阐释。所述感光组件2010C用于组装制造所述摄像模组，从而得到模塑型的摄像模组。所述感光组件2010C包括一封装部2011C和感光部2012C，所述封装部2011C模塑地连接于所述感光部2012C。
所述感光部2012C包括一线路板主体20122C和一感光芯片20121C，所述感光芯片20121C被设置于所述线路板主体20122C上。根据本发明的这个实施例，所述感光芯片20121C模塑地连接于所述线路板主体。
根据本发明这个实施例，所述感光部2012C包括一连接线路和至少一电路元件20123C。所述连接线路预设于所述线路板主体20122C，所述电路元件20123C电连接于所述连接线路以及所述感光芯片20121C，以供所述感光芯片20121C的感光工作过程。所述电路元件20123C凸出地设置于所述线路板主体20122C。所述电路元件20123C可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011C将所述电路元件20123C包覆于其内部，因此使得所述电路元件20123C不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121C相通的环境中，从而当组装为所述摄像模组时，所述电路元件20123C上不会沾染灰尘等污染物，也不会影响所述感光芯片20121C，不同于传统摄像模组中电路元件20123C暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123C表面，避免污染所述感光芯片20121C而使得摄像模组出现污黑点等不良现象。
所述封装部2011C形成一通孔201100C，以便于为所述感光芯片20121C提供感光路径。根据本发明的这个优选实施例，所述感光部2012C包括至少一连接线20124C，用于电连接所述感光芯片20121C和所述线路板主体20122C。进一步，所述连接线20124C可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124C呈弧形地连接所述感光芯片20121C和所述线路板主体20122C。
值得一提的是，所述连接线20124C被模塑于所述封装部2011C内部，从而可以借助所述封装部2011C将20所述连接线20124C进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线20124C不会受到任何的碰触损伤，同时减少环境因素对各所述连接线20124C的影响，如温度、湿度，使得所述感光芯片20121C和所述线路板主体20122C之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部2011C包覆所述电路元件20123C和所述连接线20124C，具有保护所述电路元件20123C和所述连接线20124C及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011C不限于包覆所述电路元件20123C或所述连接线20124C。也就是说，在本发明的其他实施例中，所述封装部2011C可以直接模塑于没有凸出的所述电路元件20123C的所述线路板主体20122C，也可以是模塑于所述电路元件20123C外侧、周围等不同位置。
进一步，所述感光芯片20121C具有一感光区201211C和一非感光区201212C，所述非感光区201212C环绕于所述感光区201211C外围。所述感光区201211C用于进行感光作用，所述连接线20124C连接于所述非感光区201212C。
根据本发明的这个优选实施例，所述封装部2011C延伸于所述感光芯片20121C的所述非感光区201212C，从而将所述感光芯片20121C通过模塑的方式叠层固定于所述线路板主体20122C。通过这样的方式，如模塑于芯片的方式(Molding on the chip)扩大了所述封装部2011C向内的可模塑范围，从而可以减小所述线路板主体20122C以及所述封装部2011C的外侧的结构性部分，进一步减小所述感光组件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011C凸起地围绕于所述感光芯片20121C的所述感光区201211C外侧，特别地，所述封装部2011C一体地闭合连接，使得所述封装部具 有良好的密封性，从而当所述感光组件2010C被用于组装所述摄像模组时，所述感光芯片20121C被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件2010C时，可以选取一传统的线路板作为所述线路板主体20122C，在所述线路板主体20122C上设置一所述感光芯片20121C，将所述感光芯片20121C通过所述连接线20124C电连接，进而在初步组装后的所述线路板主体20122C和感光芯片20121C部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部2011C，或用半导体封装中常用的模压工艺形成所述封装部2011C。所述线路板主体20122C可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)、柔性线路板(FPC)等。所述封装部2011C形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部2011C可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
所述感光组件2010C进一步包括一滤光片2020C，所述滤光片2020C模塑地叠层设置于所述感光芯片20121C上。所述滤光片2020C的边缘被模塑于所述封装部2011C，从而固定所述滤光片2020C。值得一提的是，所述滤光片2020C覆盖于所述感光芯片20121C上方，将所述感光芯片20121C与外部环境隔离，保护所述感光芯片20121C受到损伤以及防止灰尘的进入。
在制造所述感光组件2010C时，先将所述感光芯片20121C贴附于所述线路板主体20122C，并将所述连接于所述感光芯片20121C和所述线路板主体20122C，进而将所述滤光片2020C贴附于所述感光芯片20121C上，进一步，将所述线路板主体20122C和所述感光芯片20121C和所述滤光片2020C进行模塑，形成所述封装部2011C。在模塑时，由于所述滤光片2020C覆盖于所述感光芯片20121C上，因此能够防止模塑的模具对于所述感光芯片20121C的伤害，且由于所述滤光片2020C与所述感光芯片20121C的距离减小，因此可以使得由其组装的摄像模组的后焦距缩小，从而减小所述摄像模组的高度，另一方面，由于不需要为所述滤光片2020C提供额外的支撑部件，因此也在一定程度上使得所述摄像模组的厚度得以进一步减小。
值得一提的是，所述封装部2010C的内壁可以根据所述连接线20124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124C的同时使得所述感光芯片20121C可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部2011C的形状并不是本发明的限制。
参照图51至图53，根据本发明的第十九个优选实施例的摄像模组。所述摄像模组可以是一定焦模组。所述摄像模组20100C包括一所述感光组件2010C和一镜头2030C。所述镜头2030C被安装于所述感光组件2010C上，组装形成所述摄像模组。
特别地，所述镜头2030C可以通过粘接的方式固定于所述感光组件2010C的所述封装部2011C的顶端，且借助模塑工艺中模具制造的特点，使得所述封装部2011C的顶端具有较好的平整性，为所述镜头2030C提供良好的安装条件，从而获得优质的摄像模组。
值得一提的是，所述镜头2030C被安装于所述感光组件2010C的所述封装部2011C的顶端，从而所述封装部2011C相当于传统摄像模组中的支架的功能，为所述镜头2030C提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述封装部2011C通过模塑工艺固定于所述线路板主体20122C，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，且在所述封装部2011C与所述线路板主体20122C之间不需要预留AA调整的胶水空间，因此减小了传统摄像模组AA调整的预留空间，使得摄像模组的厚度得以减小；另一方面，所述封装部2011C包覆所述电路元件20123C和所述连接线20124C，使得 传统的支架功能和电路元件20123C以及所述连接线20124C可以在空间上重叠设置，不需要像传统摄像模组，在电路器件周围预留安全距离，从而使得具有支架功能的所述封装部2011C的高度可以设置在较小的范围，从而进一步提供了摄像模组厚度可以减小的空间。此外，所述封装部2011C代替传统的支架，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。且所述封装部2011C包覆所述连接线20124C，且所述封装部2011C延伸至所述感光芯片20121C的非感光区201212C，使得所述封装部2011C可以向内收缩，从而进一步减小所述摄像模组的横向的长宽尺寸。而且，所述感光组件2010C将所述滤光片2020C模塑其内部，因此在组装所述摄像模组时，不需要再次进行滤光片的粘贴安装过程，从而减少摄像模组组装工艺过程，提高工作效率，这些都是优于现有技术的。
参照图51、图52和图54，是根据本发明的第十九个优选实施例的另一摄像模组将被阐释。所述摄像模组20100C可以为一动焦摄像模组(Automatic Focus Model，AFM)。所述摄像模组包括一所述感光组件2010C、一马达2040C和一镜头2030C。
所述镜头2030C被安装于所述马达2040C，所述马达2040C被安装于所述感光组件2010C上，以便于通过所述马达2040C调节所述摄像模组焦距。所述马达2040C安装于所述感光组件2010C的所述封装部2011C的顶端。
特别地，所述马达2040C通过所述马达连接结构2013电连接于所述感光组件2010C，所述马达2040C的所述马达引脚2041C电连接于所述感光组件2010C的所述电路接点20132，从而通过所述引线20131电连接于所述线路板主体20122。所述马达引脚2041C可以通过导电胶膜连接于所述引线20131的所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
特别地，当所述马达引脚2041C通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马2040C和所述感光部2012的所述线路板主体20122，从而减少马达焊接的工艺过程。
值得一提的是，在本发明的这个实施例中，以所述引线20131连接所述马达2040C的方式来说明本发明电连接马达的方式，而在本发明的其他实施例所述，可以选择不同方式的所述马达连接结构2013来连接所述马达2040C，例如，选取图41A、41B、41C中示例的方式，也就是说，所述41A、41B、41C中对应的不同马达连接结构都可以与本实施例中的所述感光组件2010C结合，从而提供不同马达连接方式，本领域的技术人员应当理解的是，图中所示方式，并不是本发明的限制。
本领域技术人员应当理解的是，上述摄像模组的结构和类型仅作为举例，来说明所述摄像模组可以被实施的方式，并不是本发明的限制。
参照图55和图56，根据本发明的第二十个优选实施例的感光组件和摄像模组将被阐释。所述感光组件2010F用于组装制造所述摄像模组，从而得到模塑型的所述摄像模组。所述感光组件2010F包括一封装部2011F和一感光部2012F，所述封装部2011F模塑地连接于所述感光部2012F。
所述感光部2012F包括一线路板主体20122F和一感光芯片20121F，所述感光芯片20121F被设置于所述线路板主体20122F上。根据本发明的这个实施例，所述感光芯片20121F模塑地连接于所述线路板主体20122F。
根据本发明这个实施例，所述感光部2012F包括一连接线路和至少一电路元件20123F。所述连接线路预设于所述线路板主体20122F，所述电路元件20123F电连接于所述连接线路以及所述感光芯片20121F，以供所述感光芯片20121F的感光工作过程。所述电路元件20123F凸出地设置于所述线路板主体20122F。所述电路元件20123F可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011F将所述电路元件20123F包覆于其内部，因此使得所述电路元件20123F不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121F相通的环境中，从而当组装为所述摄像模组时，所述电路元件20123F上不会沾染灰尘等污 染物，也不会影响所述感光芯片20121F，不同于传统摄像模组中电路元件20123F暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123F表面，避免污染所述感光芯片20121F而使得摄像模组出现污黑点等不良现象。
所述封装部2011F形成一通孔201100F，以便于为所述感光芯片20121F提供感光路径。
根据本发明的这个优选实施例，所述感光部2012F包括至少一连接线20124F，用于电连接所述感光芯片20121F和所述线路板主体20122F。进一步，所述连接线20124F可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124F呈弧形地连接所述感光芯片20121F和所述线路板主体20122F。
值得一提的是，所述连接线20124F被模塑于所述封装部2011F内部，从而可以借助所述封装部2011F将所述连接线20124F进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线20124F不会受到任何的碰触损伤，同时减少环境因素对各所述连接线20124F的影响，如温度，使得所述感光芯片20121F和所述线路板主体20122F之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部2011F包覆所述电路元件20123F和所述连接线20124F，具有保护所述电路元件20123F和所述连接线20124F及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011F不限于包覆所述电路元件20123F或所述连接线20124F。也就是说，在本发明的其他实施例中，所述封装部2011F可以直接模塑于没有凸出的所述电路元件20123F的所述线路板主体20122F，也可以是模塑于所述电路元件20123F外侧、周围等不同位置。
进一步，所述感光芯片20121F具有一感光区201211F和一非感光区201212F，所述非感光区201212F环绕于所述感光区201211F外围。所述感光区201211F用于进行感光作用，所述连接线20124F连接于所述非感光区201212F。
根据本发明的这个优选实施例，所述封装部2011F延伸于所述感光芯片20121F的所述非感光区201212F，从而将所述感光芯片20121F通过模塑的方式叠层固定于所述线路板主体20122F。通过这样的方式，如模塑于芯片的方式(Molding on chip)扩大了所述封装部2011F向内的可模塑范围，从而可以减小所述线路板主体20122F以及所述封装部2011F的外侧的结构性部分，进一步减小所述模塑感光部2012F件的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011F凸起地围绕于所述感光芯片20121F的所述感光区201211F外侧，特别地，所述封装部2011F一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件2010F被用于组装所述摄像模组时，所述感光芯片20121F被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件2010F时，可以选取一传统的线路板作为所述线路板主体20122F，在所述线路板主体20122F上设置一所述感光芯片20121F，将所述感光芯片20121F通过所述连接线20124F电连接，进而在初步组装后的所述线路板主体20122F和感光芯片20121F部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部2011F，或用半导体封装中常用的模压工艺形成所述封装部2011F。所述线路板主体20122F可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部2011F形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部2011F可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部2011F包括一包覆段20111F和一滤光片安装段20112F，所述滤光片安装段20112F模塑地一体连接于所述包覆段20111F，所述包覆段20111F模塑连接于所 述线路板主体20122F，用于包覆所述电路元件20123F和所述连接线20124F。所述滤光片安装段20112F用于安装一滤光片2020F，也就是说，当所述感光组件2010F被用于组装所述摄像模组时，所述摄像模组的滤光片2020F被安装于所述滤光片安装段20112F，使得所述滤光片2020F位于所述感光芯片20121F的感光路径上，且不需要提供额外的滤光片2020F安装支架。也就是说，所述封装部2011F在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段20112F顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片2020F平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段20112F具有一安装槽201121F，所述安装槽连通于所述通孔201100F，为所述滤光片2020F提供充足的安装空间，使得所述滤光片2020F不会凸出于滤光片安装段20112F的顶表面。也就是说，所述封装部2011F上端设置所述安装槽201121F，以便于将所述滤光片2020F安装于所述封装部2011F且不会凸出于所述封装部2011F的顶端。
值得一提的是，所述封装部2011F的内壁可以根据所述连接线20124F的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124F的同时使得所述感光芯片20121F可以接收到等多光线。本领域的技术人员应当理解的是，所述封装部2011F的形状并不是本发明的限制。
不同于上述优选实施例的是，所述线路板主体20122F具有至少一加固孔201221F，所述封装部2011F延伸进入所述加固孔201221F内，从而增强所述线路板主体20122F的结构强度。换句话说，两种不同材料相互结合，从而形成复合材料结构，使得作为基体的所述线路板主体20122F的结构强度增强。
所述加固孔201221F的位置可以根据需要选择，以及根据所述线路板的结构强度需求来设置，比如呈对称的结构。借由所述加固孔201221F的设置使得所述线路板主体20122F的结构强度增强，从而可以减小所述线路板主体20122F的厚度，减小由其组装的摄像模组的厚度，且提高所述感光组件2010F的散热性能。
值得一提的是，在本发明的这个实施例中，所述加固孔201221F为凹槽状，从而制造所述感光组件2010F时，所述封装部2011F的模塑材料不会由所述加固孔201221F漏出。
与上述优选实施例类似，所述感光组件2010F可以被组装为定焦模组或动焦模组，本领域的技术人员应当理解的是，所述感光组件2010F的组装应用方式不是本发明的限制。
参照图57和58，根据本发明的第二十一个优选实施例的感光组件和摄像模组将被阐释。所述感光组件2010G用于组装制造所述摄像模组，从而得到模塑型的所述摄像模组。所述感光组件2010G包括一封装部2011G和感光部2012G，所述封装部2011G模塑地连接于所述感光部2012G。
所述感光部2012G包括一线路板主体20122G和一感光芯片20121G，所述感光芯片20121G被设置于所述线路板主体20122G上。根据本发明的这个实施例，所述感光芯片20121G模塑地连接于所述线路板主体20122G。
根据本发明这个实施例，所述感光部2012G包括一连接线路和至少一电路元件20123G。所述连接线路预设于所述线路板主体20122G，所述电路元件20123G电连接于所述连接线路以及所述感光芯片20121G，以供所述感光芯片20121G的感光工作过程。所述电路元件20123G凸出地设置于所述线路板主体20122G。所述电路元件20123G可以是，举例地但不限于，电阻、电容、二极管、三极管、电位器、继电器或驱动器等。
值得一提的是，所述封装部2011G将所述电路元件20123G包覆于其内部，因此使得所述电路元件20123G不会直接暴露于空间内，更具体地说，不会暴露于与所述感光芯片20121G相通的环境中，从而当组装为所述摄像模组时，所述电路元件20123G上不会沾染灰尘等污染物，也不会影响所述感光芯片20121G，不同于传统摄像模组中电路元件20123G暴露的存在方式，如阻容器件，从而通过模塑包覆的方式防止灰尘、杂物停留于所述电路元件20123G表面，避免污染所述感光芯片20121G而使得摄像模组出现污黑点等不良现象。
所述封装部2011G形成一通孔201100G，以便于为所述感光芯片20121G提供感光路径。
根据本发明的这个优选实施例，所述感光部2012G包括至少一连接线20124G，用于电连接所述感光芯片20121G和所述线路板主体20122G。进一步，所述连接线20124G可以被实施为，举例地但不限于，金线、铜线、铝线、银线等。特别地，所述连接线20124G呈弧形地连接所述感光芯片20121G和所述线路板主体20122G。
值得一提的是，所述连接线20124G被模塑于所述封装部2011G内部，从而可以借助所述封装部2011G将所述连接线20124G进行包覆，而不会直接暴露于外部，从而组装所述摄像模组时，使得所述连接线20124G不会受到任何的碰触损伤，同时减少环境因素对个所述连接线20124G的影响，如温度、湿度，使得所述感光芯片20121G和所述线路板主体20122G之间的通讯连接稳定，这一点是完全不提供于现有技术的。
值得一提的是，所述封装部2011G包覆所述电路元件20123G和所述连接线20124G，具有保护所述电路元件20123G和所述连接线20124G及其得到更优性能的摄像模组等方面的优势，但是本领域的技术人员应当理解的是，所述封装部2011G不限于包覆所述电路元件20123G或所述连接线20124G。也就是说，在本发明的其他实施例中，所述封装部2011G可以直接模塑于没有凸出的所述电路元件20123G的所述线路板主体20122G，也可以是模塑于所述电路元件20123G外侧、周围等不同位置。
进一步，所述感光芯片20121G具有一感光区201211G和一非感光区201212G，所述非感光区201212G环绕于所述感光区201211G外围。所述感光区201211G用于进行感光作用，所述连接线20124G连接于所述非感光区201212G。
根据本发明的这个优选实施例，所述封装部2011G延伸于所述感光芯片20121G的所述非感光区201212G，从而将所述感光芯片20121G通过模塑的方式叠层固定于所述线路板主体20122G。通过这样的方式，如模塑于芯片的方式(Molding on chip)扩大了所述封装部2011G向内的可模塑范围，从而可以减小所述线路板主体20122G以及所述封装部2011G的外侧的结构性部分，进一步减小所述模塑感光部2012G的长宽尺寸，减小由其组装的所述摄像模组的长宽尺寸。
在本发明的这个实施例中，所述封装部2011G凸起地围绕于所述感光芯片20121G的所述感光区201211G外侧，特别地，所述封装部2011G一体地闭合连接，使得所述封装部具有良好的密封性，从而当所述感光组件2010G被用于组装所述摄像模组时，所述感光芯片20121G被密封于内部，形成一封闭内空间。
具体地，在制造所述感光组件2010G时，可以选取一传统的线路板作为所述线路板主体20122G，在所述线路板主体20122G上设置一所述感光芯片20121G，将所述感光芯片20121G通过所述连接线20124G电连接，进而在初步组装后的所述线路板主体20122G和感光芯片20121G部件上进行模塑，如用注塑机，通过嵌入成型(molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行模塑形成所述封装部2011G，或用半导体封装中常用的模压工艺形成所述封装部2011G。所述线路板主体20122G可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述封装部2011G形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述封装部2011G可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
进一步，所述封装部2011G包括一包覆段20111G和一滤光片安装段20112G，所述滤光片安装段20112G模塑地一体连接于所述包覆段20111G，所述包覆段20111G模塑连接于所述线路板主体20122G，用于包覆所述电路元件20123G和所述连接线20124G。所述滤光片安装段20112G用于安装一滤光片2020G，也就是说，当所述感光组件2010G被用于组装所述摄像模组时，所述摄像模组的滤光片2020G被安装于所述滤光片安装段20112G，使得 所述滤光片2020G位于所述感光芯片20121G的感光路径上，且不需要提供额外的滤光片2020G安装支架。也就是说，所述封装部2011G在此处具有传统支架的功能，但是基于模塑工艺的优势，所述滤光片安装段20112G顶部可以借助模具化的工艺方式，使其具有良好的平整性，从而使得所述滤光片2020G平整地被安装，这一点也是优于传统的摄像模组。
更进一步，所述滤光片安装段20112G具有一安装槽201121G，所述安装槽201121G连通于所述通孔201100G，为所述滤光片2020G提供充足的安装空间，使得所述滤光片2020G不会凸出于滤光片安装段20112G的顶表面。也就是说，所述封装部2011F上端设置所述安装槽201121F，以便于将所述滤光片2020F安装于所述封装部2011F且不会凸出于所述封装部2011F的顶端。
值得一提的是，所述封装部2011G的内壁可以根据所述连接线20124的形状而设置，比如设置为倾斜状，从而在包覆所述连接线20124G的同时使得所述感光芯片20121G可以接收到更多光线。本领域的技术人员应当理解的是，所述封装部2011G的形状并不是本发明的限制。
不同于上述优选实施例的是，所述线路板主体20122G具有至少一加固孔201221G，所述封装部2011G延伸进入所述加固孔201221G内，从而增强所述线路板主体20122G的结构强度。换句话说，两种不同材料相互结合，从而形成复合材料结构，使得作为基体的所述线路板主体20122G的结构强度增强。
所述加固孔201221G的位置可以根据需要选择，以及根据所述线路板的结构强度需求来设置，比如呈对称的结构。借由所述加固孔201221G的设置使得所述线路板主体20122G的结构强度增强，从而可以减小所述线路板主体20122G的厚度，减小由其组装的摄像模组的厚度，且提高所述感光组件2010G的散热性能。
值得一提的是，根据本发明的这个优选实施例，所述加固孔201221G为穿孔，也就是说，穿过所述线路板主体20122G，使得所述线路板主体20122G的两侧连通，从而制造所述感光组件2010G时，所述封装部2011G的模塑材料充分的与所述线路板主体20122G结合，形成更加牢固的复合材料结构，且相对所述凹槽的结构，所述穿孔更容易加工制造。
参照图57和58，所述摄像模组20100G包括一所述感光组件2010G、一所述滤光片2020G、一马达2040G和一镜头2030G。
所述滤光片2020G被安装于所述感光组件2010G，所述镜头2030G被安装于所述马达2040G，所述马达2040G被安装于所述感光组件2010G上。
更进一步，所述滤光片2020G被安装于所述感光组件2010G的所述封装部2011G的所述安装槽。所述马达2040G安装于所述感光组件2010G的所述封装部2011G的顶端。特别地，所述滤光片2020G和所述马达2040G在所述封装部2011G的具体安装位置可以根据具体需要协调配置。
特别地，所述马达2040G通过所述马达连接结构2013电连接于所述感光组件2010G，所述马达4G0的所述马达引脚2041G电连接于所述感光组件2010的所述电路接点20132，从而通过所述引线20131电连接于所述线路板主体20122。所述马达引脚2041G可以通过导电胶膜连接于所述引线20131的所述马达连接端201311，也可以通过焊接的方式连接于所述马达连接端201311。
特别地，当所述马达引脚2041G通过导电胶贴附方式粘接于所述电路接点时，可以不需要焊接导线来连接所述马2040G和所述感光部2012的所述线路板主体20122，从而减少马达焊接的工艺过程。
值得一提的是，在本发明的这个实施例中，以所述引线20131连接所述马达2040G的方式来说明本发明电连接马达的方式，而在本发明的其他实施例所述，可以选择不同方式的所述马达连接结构2013来连接所述马达2040G，例如，选取图41A、41B、41C中示例的方式，也就是说，所述41A、41B、41C中对应的不同马达连接结构都可以与本实施例中的所述感光组件2010G结合，从而提供不同马达连接方式，本领域的技术人员应当理解的是， 图中所示方式，并不是本发明的限制。
与上述优选实施例类似，所述感光组件2010G可以被组装为定焦模组或动焦模组，本领域的技术人员应当理解的是，所述感光组件2010G的组装应用方式不是本发明的限制。参照图59是根据本发明的第二十二个优选实施例的感光组件和摄像模组。不同于上述优选实施例的是，所述感光组件2010包括一屏蔽层20126I，所述屏蔽层20126I包裹所述线路板主体20122和所述封装部2011，从而在增强所述线路板主体20122的结构强度的同时，增强所述感光组件2010的抗电磁干扰能力。
更进一步，所述屏蔽层20126I为一金属层，可以为板状结构或网状结构。
由于本发明的所述模组是基于封装工艺一体封装形成，在本发明的各实施例中，以封装工艺中的模塑工艺为例说明。因此，为了更清楚地揭露本发明的内容，首先对模塑工艺作简要的说明。模塑工艺一般有两种实现形式，一种是MOB(Molding On Board)，也就是说将封装部仅仅形成在模组的线路板上；另一种是MOC(Molding On Chip)，也就是说将封装部形成在模组的线路板和感光芯片上。本发明将在后续揭露中分别从不同的模塑实现形式中列举实施例。
此外，模塑工艺一般从设备的不同上来说有注塑和模压。注塑还可分注塑成型模压法和压铸法。注射成型机(简称注射机或注塑机)是将热塑性材料或热固性材料利用塑料成型模具制成各种形状的塑料制品的主要成型设备，注射成型是通过注塑机和模具来实现的。模压是压缩模塑的简称，又称压塑。模压材料例如塑料或橡胶胶料在闭合模腔内借助加热、加压而成型为制品。在本发明中采用模塑工艺中的模压来说明，但是本领域的技术人员可以理解的是，本发明并不仅仅局限于模压工艺，还有其他封装工艺，本发明并不受此限制。
如图60所示为本发明的一基于一体封装工艺的摄像模组的一优选实施例，采用的为MOB工艺。所述基于一体封装工艺的摄像模组包括一封装感光组件3010、一滤光片3020、一镜头3030和一马达3040。本领域的技术人员可以理解的是，所述马达3040在其他实施例例如涉及定焦(FF)模组中可以没有，本发明并不受此限制。也就是说，本发明的这个优选实施例中是以自动对焦(AF)模组为例。在所述封装感光组件3010包括一封装部3011和一感光组件3012。所述感光组件3012进一步包括一感光芯片30121和一线路板30122、其配置有一组电子元器件30123(例如电阻、电容、驱动等，后面简称为IC)和一组引线30124。所述引线30124连接并将所述感光芯片30121和所述线路板30122导通，当然所述感光芯片30121和所述线路板30122也可以有其他导通方式。在本发明的这个优选实施例中，所述引线30124可以被实施为金线。所述封装部3011作为承载所述滤光片3020的支架，所述封装部3011可以具有电气性能，如可以雕刻线路通电连通所述马达3040和所述感光组件3012，能够取代传统的马达焊线，减少传统的工艺制程。当然，所述马达3040和所述线路板30122也可以通过传统的马焊脚焊接而导通。在封装过程中，所述封装部3011将所述线路板30122进行封装，在本发明的这个优选实施例中，所述封装部3011封装所述线路板30122上除与所述感光芯片30121以及所述引线30124接触以外的区域。所述封装部3011不仅封装所述线路板30122的顶表面301221，所述封装部3011还封装包覆所述线路板30122的至少一侧面301222。可以理解的是，在封装过程中，所述封装部3011也可以将所述电子元器件30123一体封装。
如图62A至图62E所示为对比技术中的模塑形成模组。图62A中封装部3011P左侧的部分和线路板30122P齐平，此种线路板30122P的侧面与封装部3011P侧面齐平的设计通常也为对比技术所采纳的。因此，为达到以上设计要求，如图62B所示，在模组组装前需要达到图中的结构，在模塑时所述线路板30122P做如图62B的处理，也就是将两片以上的所述线路板30122P连接在一起，进行模塑，最后在图62B中间部分用机器切割，但是就需要新增切割设备。如果不用图62B中的方式，考虑到所述线路板30122P与模具对位有一定的偏差，所述线路板30122P的边缘不可能与所述封装部3011P齐平设计，所以通常只能设计成如图62C所示，图中所述线路板30122P需要凸出一段用于模具压合，所述线路板30122P 凸出长度在数值上通常为0.1mm～10mm。如图62E所示，如果不采用切割，此段所述线路板30122P凸出部分会影响模组最终尺寸，使模组尺寸增加0.1mm～10mm，影响了产品的质量。
因此，和对比技术相比，本发明的所述基于一体封装工艺的摄像模组，对所述线路板30122进行内缩设计，使所述封装部3011的侧面包覆所述线路板30122的所述侧面301222，从而所述封装部3011的侧面与所述线路板30122仍预留一定错位空间，在模塑完之后侧面没有所述线路板30122凸出的情况，减少切割工序，提高了产品的质量。
值得一提的是，所述封装部3011可以对所述线路板30122的两个侧边都进行封装包覆。本发明的这个优选实施中，由于右侧还有其他元件如柔性线路板连接，因此，仅封装了所述线路板30122的左侧边，即所述侧面301222。但是，本领域的技术人员可以理解的是，所述封装部3011不仅可以封装所述线路板30122的所述侧面301222，在其他实施例中，还可以同时侧面封装包覆所述线路板30122的两个侧面的局部或全部区域，本发明并不受此限制。
如图61所示为本发明的所述基于一体封装工艺的摄像模组的另一种实施方式，为了保证模塑工艺之后的模组能够便于装机和定位，并提高平整度，同样是采用MOB形式，所述基于一体封装工艺的摄像模组包括一封装感光组件3010’、一滤光片3020’、一镜头3030’和一马达3040’。同样地，由于以AF模组为例，因此揭露了所述马达3040’，但是在其他FF模组中，可以不需要所述马达3040’，本发明并不受此限制。
具体地，所述封装感光组件3010’包括一封装部3011’和一感光组件3012’。所述感光组件3012’进一步包括一感光芯片30121’、和一线路板30122’，其配置有一组电子元器件30123’和一组引线30124’。所述封装部3011’作为承载所述滤光片3020’的支架，所述模组部3011’雕刻线路通电连通所述马达3040’和所述感光组件3012’。与本发明的上述优选实施例相比，在模塑过程中，除了所述封装部3011’将所述线路板30122’和所述电子元器件30123’进行封装，且封装包覆所述线路板30122’的所述顶面301221’和至少一侧面301222’以外，所述封装部3011’对所述线路板30122’的一底部301223’也进行模塑封装。从而保证了模塑完成后，所述基于一体封装工艺的摄像模组从整体上的侧面和底部的平整性，也便于安装定位在其他工装上。
值得一提的是，所述封装部3011’可以封装包覆所述线路板30122’的整个所述底部301223’，也可以在其他实施例中，根据不同的需要，封装包覆所述线路板30122’的所述底部301223’的一部分，本发明并不受此限制。
值得一提的是，本发明的这个优选实施例中，由于所述摄像模组的图中示意的右侧还可以连接其他元件或者进行其他加工工艺，因此所述线路板30122’的右侧面并没有进行封装，但是在其他实施例中，所述封装部3011’能够同时封装包覆所述线路板30122’的两个或者多个侧面，且同时封装包覆所述线路板30122’的所述底部301223’的全部或者部分区域，本发明并不受此限制。
图60和图61所示的两个实施例中采用了MOB的形式来揭露，以下变形实施例换为采用MOC的形式，并结合各种不同的模组结构来揭露对线路板的侧面或底面进行模组部封装。
如图63A所示为本发明的所述基于一体封装工艺的摄像模组的另一实施例。所述基于一体封装工艺的摄像模组包括一封装部3011A、一感光组件3012A、一滤光片3020A和一镜头3030。所述感光组件3012A进一步包括一感光芯片30121A和一线路板30122A，其配置有一组电子元器件30123A和一组引线30124A。所述封装部3011A作为承载所述滤光片3020A的支架，直接在所述线路板30122A上除了芯片感光区以外的其它区域成型。也就是说，本发明的这个实施例采用MOC形式。值得一提的是，所述感光芯片30121A包括一感光区域301211A和所述感光区域301211A以外的一非感光区域301212A，在封装时，所述封装部3011A没有封装所述感光区域301211A。而是封装所述感光芯片30121A的所述非感光区域301212A。所述非感光区域301212A还设置有引脚和所述引线30124A连接，用于导通所述感光芯片30121A。
类似地，在图63A所示的所述基于一体封装工艺的摄像模组中，所述线路板30122A进行了内缩设计，使所述封装部3011A的侧面包覆所述线路板30122A的所述侧面301222A，从而所述封装部3011A的侧面与所述线路板30122A仍预留一定错位空间，在模塑完之后侧面没有所述线路板30122A凸出的情况。此外，在基于本实施例的其他变形方式中，所述封装部3011A可以对所述线路板30122A的多个侧面都进行封装包覆。
如图63B所示为本发明的所述基于一体封装工艺的摄像模组的另一实施例。和图3063A中的实施例不同的是，除了所述封装部3011A’将所述线路板30122A’和所述电子元器件30123A’进行封装，且封装包覆所述线路板30122A’的所述顶面301221A’和至少一侧面301222A’以外，所述封装部3011A’对所述线路板30122A’的一底部301223A’也进行模塑封装。从而保证了模塑完成后，所述基于一体封装工艺的摄像模组从整体上的侧面和底部的平整性，也便于安装定位在其他工装上。
如图64所示为本发明的所述基于一体封装工艺的摄像模组的另一实施例。和图63A中的实施例不同的是，所述封装部3011B的顶部设计结构不同，图63A的实施例中，所述封装部3011A的顶部向上凸出，并和所述滤光片3020A的侧边之间具有一间隙槽301121A，用于安装不同的镜头或者马达。而图64的实施例中并没有所述间隙槽。此外，所述线路板30122B的底面紧贴有一补强板30125B。所述补强板30125B可以被实施为一金属板。其他结构和图63A中的结构相同。为所述封装部3011B将所述线路板30122B的顶面301221B、至少一侧面301221B、所述补强板30125B的侧部、所述感光芯片30121B的非感光区域301212B、所述电子元器件30123B以及所述引线30124B全部包覆封装成型。
如图65所示为本发明的所述基于一体封装工艺的摄像模组的另一实施例。和图64中的实施例不同的是，针对所述线路板30122B’和所述补强板30125B’，除了所述封装部3011B’将所述线路板30122B’的所述顶面301221B’和至少一侧面301222B’以外，所述封装部3011B’对所述补强板30125B’的底部也进行模塑封装。从而保证了模塑完成后，所述基于一体封装工艺的摄像模组从整体上的侧面和底部的平整性，也便于安装定位。
图66A所示的模组结构是对图64实施例中模组结构的一个变形，其他结构相同，不同的是，将所述滤光片3020C放在所述感光芯片30121C上一起利用所述封装部3011C进行封装。这样能减少所述感光芯片30121C在封装和使用过程中的伤害，而且能够缩小镜头的后焦距，从而使尺寸更小。
类似地，图66B所示的模组结构是对图65实施例中模组结构的一个变形，其他结构相同，不同的是，将所述滤光片3020C’放在所述感光芯片30121C’上一起利用所述封装部3011C’进行封装。这样能减少所述感光芯片30121C’在封装和使用过程中的伤害，而且能够缩小镜头的后焦距，从而使尺寸更小，这样也能减小高度，能放走所述感光芯片30121C’发出的热量，具有很高的散热能力。
图67A是基于图66A的实施例中模组结构的一个变形。主要在于所述封装部3011D的变形。所述封装部3011D的顶部分别向上延伸形成承载壁30113D，所述承载壁30111D形成一容纳槽301131D，用于容纳镜头。也就是说，所述封装部3011D能够直接承载镜头，从而实现高精度定焦(FF)模组。
图67B是基于图66B的实施例中模组结构的一个变形。主要在于所述封装部3011D’的变形。所述封装部3011D’包覆所述线路板30121D’的底面，并且其顶部分别向上延伸形成承载壁30111D’，所述承载壁30111D’形成一容纳槽1111D’，用于容纳镜头。也就是说，所述封装部3011D’能够直接承载镜头，从而实现高精度定焦(FF)模组。
图68A和68B是基于图67A的实施例中模组结构的一个变形。主要在于所述封装部3011E的变形。因此，所述线路板30121E设有一个或多个穿孔30126E，形成所述封装部3011E的成形材料进入所述穿孔30126E并且被埋入所述穿孔30126E，从而进一步地加强对所述线路板30121E的补强作用。类似地，所述封装部3011E可以不仅包覆在所述线路板30121E的顶面，还可以包覆至所述线路板30121E的侧面和底面。可以理解的是，这里的所述线路 板30121E设置所述穿孔30126E的方式也可以应用于本发明的其他实施例。
值得一提的是，基于图63A至66B所示的各实施例中，在上述实施例的MOC的技术上，当需要连接马达时，马达引脚与线路板导通的图69至71中的几种连接方式。
如图69所示是一变形实施例结构，采用的为MOC工艺。所述基于一体封装工艺的摄像模组包括一封装感光组件、一滤光片3020F、一镜头3030F和一马达3040F。也就是说，本发明的这个优选实施例中是以自动对焦(AF)模组为例。所述封装感光组件包括一封装部3011F和一感光组件3012F。所述感光组件3012F进一步包括一感光芯片30121F、一线路板30122F、一组电子元器件30123F和一组引线30124F。所述引线30124F连接并导通所述感光芯片30121F和所述线路板30122F。在本发明的这个实施例中，所述引线30124F可以被实施为金线。所述封装部3011F作为承载所述滤光片3020F的支架。在封装过程中，所述封装部3011F将所述线路板30122F进行封装，在本发明的这个实施例中，所述封装部3011F封装所述线路板30122F上除所述感光芯片30121F的感光区域以外的部分。所述封装部3011F不仅封装所述线路板30122F的顶表面301221F，所述封装部3011F还封装包覆所述线路板30122F的至少一侧面301222F。可以理解的是，在封装过程中，所述封装部3011F也将所述电子元器件30123F一体封装。
值得一提的是，所述封装部3011F的一封装部引脚301101F和所述马达3040F为电学导通，通过所述封装部3011F的一内部导线301102F，将所述马达3040F的至少一马达引脚3041F与所述线路板30122F导通，这种实施方式可以不需要采用焊接工艺。
而如图70所示的实施例中，可以采用焊接工艺，所述封装部3011G有直通上下的一凹槽通道1103G，可以用来放置所述马达引脚3041G，使所述马达引脚3041G通过所述凹槽通道1103G与所述线路板30122G的一线路板引脚1231G在一焊接点3060G进行焊接。
相应地，图71中的结构与图69，图70结构比较相似，不过由于所述封装部303011H的高度比较高，图69,图70的结构中的马达引脚可能在设计上无法达到很长，这样就只能采用图71的结构。也就是说，所述封装部303011H外壁的凹槽通道301103H并非直通到底，而是所述马达引脚3041H在所述凹槽通道301103H中与所述封装部3011H的所述封装部引脚301101H焊接，一焊接点为3060H，且直接通过所述封装部3011H的所述内部导线301102H与所述线路板30122H相连，从而实现马达与线路板之间的导通。
另外，根据另外的一种实施方式，所述封装部也可以在表面利用激光直接成型工艺形成电镀导电线路，用来连接所述马达和所述线路板。当然，所述封装部也可以不具有上述实施例中提到的电气性能，而是采用传统的方式将所述马达与所述线路板通过焊接方式焊接。
本领域的技术人员可以理解的是，图69至71示意的三个实施例中仅仅是为了说明在有马达的情况下，所述马达和所述线路板导通的不同方式。三个实施例中的所述封装部并不仅仅封装所述线路板的顶面和侧面，还可以如前述各变形实施例中提到的，封装所述线路板的底面。此外，所述摄像模组的其他结构也可以做相应的变形，本发明并不受此限制。
参考说明书附图之图72至图74F，依本发明的一优选实施例的摄像模组及所述摄像模组的制造方法被阐明。所述摄像模组包括至少一光学镜头4030、至少一感光芯片4010、至少一保护框4060、至少一线路板4070以及至少一一体封装支架4050。
值得一提的是，在本发明的关于所述摄像模组的结构和所述摄像模组的制造方法的描述中使用到的术语“一”应被理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以是一个，而在另外的实施例中，该元件的数量可以为多个，因此，术语“一”不能理解为对数量的限制。
类似地，在揭露和阐述本发明的所述摄像模组的结构和所述摄像模组的制造方法时使用到的任何方向性的术语，例如“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
更值得一提的是，本发明的所述摄像模组可以是定焦摄像模组，也可以是变焦摄像模组。换言之，本发明的所述摄像模组是否允许调焦并不限制本发明的内容和范围。
更值得一提的是，本发明的所述摄像模组可以是单镜头摄像模组，也可以是多镜头摄像模组，例如在一个具体的示例中，所述摄像模组可以被实施为阵列摄像模组。换言之，本发明的所述摄像模组的所述光学镜头4030的数量并不限制本发明的内容和范围。
具体地说，在本发明的所述摄像模组中，所述保护框4060被凸起地设置于所述感光芯片4010的感光区域的外周侧，所述感光芯片4010与所述线路板4070被导通连接，所述一体封装支架4050被设置包裹所述线路板4070和所述感光芯片4010的非感光区域，以使所述一体封装支架4050、所述感光芯片4010和所述线路板4070结合为一体，所述光学镜头4030被设置于所述感光芯片4010的感光路径。被物体反射的光线能够通过所述光学镜头4030被汇聚到所述摄像模组的内部，以进一步被所述感光芯片4010接收和进行光电转化而生成与物体相关的图像。
在本发明的所述摄像模组的一个具体的示例中，所述感光芯片4010被贴装于所述线路板4070，并且所述感光芯片4010通过打线工艺与所述线路板4070被导通连接。例如在所述感光芯片4010的非感光区域和所述线路板4070之间打金线，以藉由金线导通连接所述感光芯片4010和所述线路板4070，如图72所示。
在本发明的所述摄像模组的另一个具体的示例中，所述感光芯片4010在被贴装于所述线路板4070的同时被导通连接于所述线路板4070，例如所述感光芯片4010的非感光区域设有芯片焊盘，所述线路板4070设有线路板焊盘，在将所述感光芯片4010贴装于所述线路板4070时，使所述感光芯片4010的芯片焊盘和所述线路板4070的线路板焊盘被导通连接。
所述保护框4060是中空结构，以使所述保护框4060能够被环设于所述感光芯片4010的感光区域的外周侧。优选地，所述保护框4060的内侧边的尺寸大于或者等于所述感光芯片4010的感光区域的尺寸，从而当所述保护框4060被凸起地设置于所述感光芯片4010时，所述保护框4060能够被保持在所述感光芯片4010的感光区域的外周侧，以使所述保护框4060不会遮挡所述感光芯片4010的感光区域。
优选地，所述保护框4060的外侧边的尺寸小于所述感光芯片4010的尺寸，从而当所述保护框4060被凸起地设置于所述感光芯片4010时，在所述感光芯片4010的非感光区域的外侧可以通过打线的工艺将所述感光芯片4010和所述线路板4070导通。尽管如此，本领域的技术人员可以理解的是，当所述感光芯片4010和所述线路板4070通过芯片焊盘和线路板焊盘被导通连接时，所述保护框4060的外侧边的尺寸可以与所述感光芯片4010的尺寸一致。
所述一体封装支架4050在成型后包裹所述线路板4070和所述感光芯片4010的非感光区域，从而使所述一体封装支架4050、所述线路板4070和所述感光芯片4010结合为一体，通过这样的方式，能够增加所述摄像模组的结构稳定性和减小所述摄像模组的体积，以使所述摄像模组能够被应用于追求轻薄化的电子设备。
进一步地，所述一体封装支架4050被设置包裹所述保护框4060的外周侧，以使所述一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010结合为一体。
进一步地，如图72所示，所述摄像模组包括至少一镜头支撑体4040，其中所述镜头支撑体4040被设置于所述一体封装支架4050的上部，所述光学镜头4030被设置于所述镜头支撑体4040，以藉由所述镜头支撑体4040使所述光学镜头4030被保持在所述感光芯片4010的感光路径。
在本发明的所述摄像模组的一个具体的示例中，所述镜头支撑体4040在成型后被设置于所述一体封装支架4050的上部。在本发明的所述摄像模组的另一个具体的示例中，所述镜头支撑体4040可以与所述一体封装支架4050一体地成型，通过这样的方式，能够降低所述摄像模组的封装误差，以有利于提高所述摄像模组的成像品质。
优选地，所述镜头支撑体4040可以被实施为一马达，也就是说，所述光学镜头4030被可操作地设置于所述镜头支撑体4040，以通过所述镜头支撑体4040驱动所述光学镜头 4030沿着所述感光芯片4010的感光路径来回移动，从而通过改变所述光学镜头4030与所述感光芯片4010之间的位置来调整所述摄像模组的焦距。值得一提的是，所述镜头支撑体4040可以是各种驱动器，以供驱动所述光学镜头4030沿着所述感光芯片4010的感光路径来回移动，例如在本发明的这个优选的实施例中，所述镜头支撑体4040可以被实施为音圈马达。
本领域的技术人员可以理解的是，当所述镜头支撑体4040被实施为马达时，所述镜头支撑体4040与所述线路板4070被导通连接。
进一步地，如图72所示，所述摄像模组包括一滤光元件4020，其中所述滤光元件4020被设置于所述光学镜头4030和所述感光芯片4010之间，当被物体反射的光线自所述光学镜头4030被汇聚到所述摄像模组的内部时，光线经由所述滤光元件4020的过滤后被所述感光芯片4010接收和进行光电转化，以改善所述摄像模组的成像品质。换言之，所述滤光元件4020能够起到降噪的作用，以改善所述摄像模组的成像品质。
值得一提的是，所述滤光元件4020的类型可以不受限制，例如在本发明的所述摄像模组的一个具体的示例中，所述滤光元件4020可以被实施为红外截止滤光片，以藉由所述滤光元件4020过滤光线中的红外线部分，而在本发明的所述摄像模组的另一个具体的示例中，所述滤光元件4020被实施为可见光谱滤光片。
所述一体封装支架4050形成至少一贴装平台4051，以供被贴装所述滤光元件4020，例如所述贴装平台4051可以是形成于所述一体封装支架4050上部的安装槽或者所述贴装平台4051可以是形成于所述一体封装支架4050上部的平面。换言之，所述滤光元件4020可以被直接贴装在所述一体封装支架4050的上部。
如图74A至图74F是依本发明的所述摄像模组的一制造过程的示意图，其中在图74A至图74F中，为了方便说明，全部以剖视图的方式表示所述摄像模组的所述光学镜头4030、所述感光芯片4010、所述保护框4060、所述线路板4070以及所述一体封装支架4050等元件的结构关系。
在图74A示出的这个步骤中，将所述感光芯片4010导通所述线路板4070。本领域的技术人员可以理解的是，在图74A示出的这个步骤中，在将所述感光芯片4010贴装于所述线路板4070后，再通过打线工艺将所述感光芯片4010和所述线路板4030导通连接方式，仅仅为举例性的描述，这种将所述感光芯片4010和所述线路板4070导通连接方式并不构成对本发明的内容和范围的限制。在本发明的所述摄像模组的另一个示例中，所述感光芯片4010和所述线路板4070还可以通过芯片焊盘和线路板焊盘被直接导通连接。
在图74B示出的这个步骤中，将所述保护框4060凸起地设置于所述感光芯片4010的感光区域的外周侧。具体地说，在本发明的所述摄像模组的制造过程中，在所述保护框4060被提供后，将所述保护框4060凸起地设置于所述感光芯片4010的感光区域的外周侧。优选地，在所述保护框4060和所述感光芯片4010的感光区域的外周侧之间形成一胶合层4080，所述胶合层4080用于连接所述保护框4060和所述感光芯片4010的感光区域的外周侧。
例如在本发明的所述摄像模组的一个实例中，将胶水设置在所述保护框4060和/或所述感光芯片4010的感光区域的外周侧，以在所述保护框4060和/或所述感光芯片4010的感光区域的外周侧形成所述胶合层4080。也就是说，所述保护框4060和所述感光芯片4010的感光区域的外周侧中的至少一个的表面形成所述胶合层4080。在后续，所述胶合层4080用于将所述保护框4060和所述感光芯片4010的感光区域的外周侧连接在一起。
优选地，当胶水设置在所述保护框4060和所述感光芯片4010的感光区域的外周侧之后，可以通过热固化或者UV光照固化的方式使胶水快速地形成用于连接所述保护框4060和所述感光芯片4010的感光区域的外周侧的所述胶合层4080。而在本发明的所述摄像模组的另一个示例中，所述保护框4060可以自带所述胶合层4080，从而在封装所述摄像模组的过程中，可以直接将所述保护框4060设置在所述感光芯片4010的感光区域的外周侧。
另外，所述保护框4060可以是通过注塑工艺或者冲压工艺形成的，例如所述保护框4060 可以是通过注塑工艺形成的塑料件。
如图73所述，所述保护框4060是中空结构，从而使得所述保护框4060能够被凸起地设置于所述感光芯片4010的感光区域的外周侧，以用于隔离所述感光芯片4020的感光区域和外部环境，从而在后续封装所述摄像模组的过程中，所述保护框4060能够防止污染物进入所述感光芯片4010的感光区域而造成污坏点不良。
在图74C示出的这个步骤中，通过一成型模具40100在所述摄像模组被封装的过程中形成所述一体封装支架4050，其中所述成型模具40100包括一模具上部40101，所述模具上部40101的内表面施压于所述保护框4060，以隔离所述感光芯片4010的感光区域和外部环境。
本领域的技术人员可以理解的是，所述保护框4060被凸起地设置于所述感光芯片4010的感光区域的外周侧，从而当所述模具上部40101的内表面施压于所述保护框4060时，所述保护框4060能够阻止所述模具上部40101的内表面与所述感光芯片4010的感光区域接触，从而所述保护框4060能够阻止所述模具上部40101的内表面损坏或者刮伤所述感光芯片4010的感光区域。
进一步地，参考图76示出的所述摄像模组的制造过程的一个变形示例，其中所述模具上部40101的内表面对应于所述感光芯片4010的感光区域的部位通过内凹的方式形成一凹槽40102，从而在藉由所述成型模具40100成型所述一体封装支架4050的过程中，所述凹槽40102能够使所述感光芯片4010的感光区域与所述模具上部40101的内表面具有安全间隙，从而进一步降低所述模具上部40101对所述感光芯片4010的影响，以防止所述感光芯片4010被所述模具上部40101的内表面损坏或者刮伤。
优选地，所述保护框4060具有弹性，从而当所述模具上部40101的内表面施压于所述保护框4060时，所述保护框4060能够起到缓冲作用，以防止所述模具上部40101产生的压力损坏所述感光芯片4010。另外，受限于所述感光芯片4010的制造工艺和所述线路板4070的制造工艺以及所述感光芯片4010和所述线路板4070的贴装工艺的限制，在所述感光芯片4010被贴装于所述线路板4070之后可能会存在贴装倾斜，此时，当所述模具上部40101的内表面施压于所述保护框4060时，所述保护框4060能够产生变形，以使所述感光芯片4010的感光区域与外部环境相隔离，以防止用于形成所述一体封装支架4050的成形材料进入所述感光芯片4010的感光区域。
在图74D示出的这个步骤中，将所述成形材料加入到所述模具上部40101中，在所述成形材料固化后形成所述一体封装支架4050，其中所述一体封装支架4050包裹所述线路板4070和所述感光芯片4010的非感光区域，以使所述一体封装支架4050、所述线路板4070和所述感光芯片4010结合为一体。优选地，所述一体封装支架4050进一步包裹所述保护框4060的外周侧，以使所述一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010结合为一体。值得一提的是，所述成形材料是流质或者颗粒状。在将所述成型模具40100移离之后，可以得到如图74E示出的一体结合的所述一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010。
本领域的技术人员可以理解的是，所述感光芯片4010的感光区域和外部环境被隔离，从而当所述成形材料被加入到所述模具上部40101后，所述成形材料不会流动到所述感光芯片4010的感光区域，从而所述保护框4060能够阻止所述成形材料损坏所述感光芯片4010的感光区域。另外，所述保护框4060具有弹性，以使所述保护框4060和施压于所述保护框4060的所述模具上部40101之间没有缝隙，因此，在被加入所述模具上部40101的所述成形材料固化的过程中不会出现“飞边”的现象，以保证所述摄像模组的成像品质。
进一步地，参考图75A和图75B示出的所述摄像模组的制造过程的一个变形示例，其中所述模具上部40101的内表面被设有一覆盖膜40102，当所述模具上部40101的内表面施压于所述保护框4060时，被设于所述模具上部40101的所述覆盖膜40102与所述保护框4060直接接触，从而藉由所述覆盖膜40103对所述感光芯片4010提供进一步的保护。另外，可 以理解的是，所述覆盖膜40102可以降低脱模难度和增加密封性，从而防止所述成形材料在固化的过程中在所述一体封装支架4050的内侧出现“飞边”的现象。
在图74F示出的这个步骤中，将所述滤光元件4020和所述光学镜头4030分别设置于所述感光芯片4010的感光路径，以制得所述摄像模组。优选地，所述滤光元件4020被贴装于所述一体封装支架4050，所述光学镜头4030通过被设置于所述一体封装支架4050的所述镜头支撑体4040被保持在所述感光芯片4010的感光路径。
如图77A至图77G是依本发明的所述摄像模组的另一制造过程的示意图。在图77A示出的这个步骤中，将所述感光芯片4010导通所述线路板4070。
在图77B示出的这个步骤中，将所述保护框4060凸起地设置于所述感光芯片4010的感光区域的外周侧。优选地，所述保护框4060的上部被设有一保护膜4090，以便于通过真空吸附的方式吸取所述保护框4060和将所述保护框4060贴装于所述感光芯片4010的感光区域的外周侧。本领域的技术人员可以理解的是，当所述保护框4060被设置于所述感光芯片4010的感光区域的外周侧之后，所述保护膜4090对应地覆盖于所述感光芯片4010的感光区域的上部，以藉由所述保护膜4090和所述保护框4060隔离所述感光芯片4010的感光区域和外部环境，从而在后续防止所述成形材料流动到所述感光芯片4010的感光区域。
在图77C示出的这个步骤中，通过所述成型模具40100的所述模具上部40101的内表面施压于所述保护框4060，以进一步隔离所述感光芯片4010的感光区域和外部环境。
在图77D示出的这个步骤中，将所述成形材料加入所述成型模具40101中，在所述成形材料固化后形成所述一体封装支架4060，其中所述一体封装支架4050包裹所述线路板4070和所述感光芯片4010的非感光区域，以使所述一体封装支架4050、所述线路板4070和所述感光芯片4010结合为一体。优选地，所述一体封装支架4050进一步包裹所述保护框4060的外周侧，以使所述一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010结合为一体。在将所述成型模具40101移离之后，可以得到如图77E示出的一体结合的一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010，其中所述保护膜4090仍然被设置于所述保护框4060。
在图77F示出的这个步骤中，将所述保护膜4090从所述保护框4060上移除，以得到一体结合的一体封装支架4050、所述线路板4070、所述保护框4060和所述感光芯片4010。
在图77G中示出的这个步骤中，将所述滤光元件4020和所述光学镜头4030分别设置于所述感光芯片4010的感光路径，以制得所述摄像模组。
根据说明书附图之图78至图80G，依本发明的另一优选实施例的所述摄像模组被阐明，其中所述摄像模组包括至少一光学镜头4030A、至少一感光芯片4010A、至少一保护框4060A、至少一线路板4070A、至少一一体封装支架4050A以及至少一滤光元件4020A，其中所述感光芯片4010A和所述线路板4070A被导通连接，所述滤光元件4020A被重叠地设置于所述感光芯片4010A，所述保护框4060A被设置于所述滤光元件4020A的外周边，以使所述保护框4060A没有遮挡所述感光芯片4010A的感光区域，所述一体封装支架4050A被设置包裹所述线路板4070A和所述滤光元件4020A的外周边，以使所述一体封装支架4050A、所述滤光元件4020A、所述感光芯片4010A和所述线路板4070A一体结合，其中所述光学镜头4030A被设置于所述感光芯片4010A的感光路径。被物体反射的光线通过所述光学镜头4030A被汇聚到所述摄像模组的内部，以进一步被所述感光芯片4010A接收和进行光电转化而生成与物体相关的图像。
优选地，所述一体封装支架4050A在成型时包裹所述线路板4070A和所述滤光元件4020A的外周边，以使所述一体封装支架4050A、所述滤光元件4020A、所述感光芯片4010A和所述线路板4070A一体结合。
更优选地，所述一体封装支架4050A进一步包裹所述保护框4060A的外侧边，以使所述一体封装支架4050A、所述滤光元件4020A、所述感光芯片4010A、所述线路板4070A和所述保护框4060A一体结合。
所述保护框4060A被凸起地设置于所述滤光元件4020A的外周边，从而在后续当一成型模具40100A的模具上部40101A的内表面施压于所述保护框4060A时，所述模具上部40101A的内表面不会与所述滤光元件4020A的表面接触，从而防止所述模具上部40101A的内表面损坏或者刮伤所述滤光元件4020A。也就是说，被凸起地设置于所述滤光元件4020A的外周边的所述保护框4060A，使所述滤光元件4020A的表面与所述模具上部40101A的内表面形成安全距离，以防止所述模具上部40101A的内表面损坏或者刮伤所述滤光元件4020A。
进一步地，所述摄像模组包括至少一镜头支撑体4040A，其中所述镜头支撑体4040A被设置于所述一体封装支架4050A的上部，所述光学镜头4030A被设置于所述镜头支撑体4040A，以藉由所述镜头支撑体4040A使所述光学镜头4030A被保持在所述感光芯片4010A的感光路径。
在本发明的所述摄像模组的一个具体的示例中，所述镜头支撑体4040A在成型后被设置于所述一体封装支架4050A的上部。在本发明的所述摄像模组的另一个具体的示例中，所述镜头支撑体4040A可以与所述一体封装支架4050A一体地成型，通过这样的方式，能够降低所述摄像模组的封装误差，以有利于提高所述摄像模组的成像品质。
优选地，所述镜头支撑体4040A可以被实施为一马达，也就是说，所述光学镜头4030A被可操作地设置于所述镜头支撑体4040A，以通过所述镜头支撑体4040A驱动所述光学镜头4030A沿着所述感光芯片4010A的感光路径来回移动，从而通过改变所述光学镜头4030A与所述感光芯片4010A之间的位置来调整所述摄像模组的焦距。值得一提的是，所述镜头支撑体4040A可以是各种驱动器，以供驱动所述光学镜头4030A沿着所述感光芯片4010A的感光路径来回移动，例如在本发明的这个优选的实施例中，所述镜头支撑体4040A可以被实施为音圈马达。
本领域的技术人员可以理解的是，当所述镜头支撑体4040A被实施为马达时，所述镜头支撑体4040A与所述线路板4070A被导通连接。
如图80A至图80G所示是本发明的所述摄像模组的一制造过程的示意图。在图80A示出的这个步骤中，所述感光芯片4010A被导通连接所述线路板4070A，与本发明的上述优选实施例相似，所述感光芯片4010A和所述线路板4070A被导通连接的方式不受限制。
在图80B示出的这个步骤中，将所述滤光元件4020A重叠地设置于所述感光芯片4010A。本领域的技术人员可以理解的是，将所述滤光元件4020A和所述感光芯片4010A重叠设置的方式能够减少所述摄像模组的后焦焦距，从而有利于所述摄像模组的小型化，以便于使所述摄像模组被应用于追求轻薄化的电子设备。
在步骤80C示出的这个步骤中，将所述保护框4060A放置于所述滤光元件4020A的外周边，其中所述保护框4060A不会遮挡所述感光芯片4010A的感光区域。本领域的技术人员可以理解的是，在所述保护框4060A被提供后，可以通过一胶合层4080A将所述保护框4060A设置于所述滤光元件4020A的外周边。也就是说，被设置于所述保护框4060A和所述滤光元件4020A之间的所述胶合层4080A用于连接所述保护框4060A和所述滤光元件4020A。
在图80D示出的这个步骤中，通过所述模具上部40101A的内表面施压于所述保护框4060A，以隔离所述滤光元件4020A的内部区域和外周边，其中所述滤光元件4020A的内部区域的尺寸大于或者等于所述感光芯片4010A的感光区域，以防止所述保护框4060A遮挡所述感光芯片4010A的感光区域。本领域的技术人员可以理解的是，所述保护框4060A被凸起地设置于所述滤光元件4020A的外周边，从而当所述模具上部40101A的内表面施压于所述保护框4060A时，所述保护框4060A能够阻止所述模具上部40101A的内表面与所述滤光元件4020A的感光区域接触，从而所述保护框4060A能够阻止所述模具上部40101A的内表面损坏或者刮伤所述滤光元件4020A的内部区域。
优选地，所述保护框4060A具有弹性，从而当所述模具上部40101A的内表面施压于所 述保护框4060A时，所述保护框4060A能够起到缓冲作用，以防止所述模具上部40101A产生的压力损坏所述滤光元件4020A。
在图80E示出的这个步骤中，将所述成形材料加入到所述模具上部40101A中，在所述成形材料固化后形成所所述一体封装支架4050A，其中所述一体封装支架4050A包裹所述线路板4070A和所述滤光元件4020A的外周边，以使所述一体封装支架4050A、所述线路板4070A、所述感光芯片4010A和所述滤光元件4020A结合为一体。优选地，所述一体封装支架4050A进一步包裹所述保护框4060A的外周侧，以使所述一体封装支架4050A、所述线路板4070A、所述保护框4060A、所述感光芯片4010A和所述滤光元件4020A结合为一体。值得一提的是，所述成形材料是流质或者颗粒状。在将所述成型模具40100A移离之后，可以得到如图80F示出的一体结合的所述一体封装支架4050A、所述线路板4070A、所述保护框4060A、所述感光芯片4010A和所述滤光元件4020A。
本领域的技术人员可以理解的是，所述滤光元件4020A的内部区域和外周边被隔离，从而当所述成形材料被加入到所述模具上部40101A后，所述成形材料不会流动到所述滤光元件4020A的内部区域，从而所述保护框4060A能够阻止所述成形材料损坏所述滤光元件4020A的内部区域。另外，所述保护框4060A具有弹性，以使所述保护框4060A和施压于所述保护框4060A的所述模具上部40101A之间没有缝隙，因此，在被加入所述模具上部40101A的所述成形材料固化的过程中不会出现“飞边”的现象，以保证所述摄像模组的成像品质。
在图80G示出的这个步骤中，将所述滤光元件4020A和所述光学镜头4030A分别设置于所述感光芯片4010A的感光路径，以制得所述摄像模组。
进一步地，本发明还提供一摄像模组的制造方法，其中所述制造方法包括如下步骤：
(a)将至少一感光芯片4010和至少一线路板4070导通连接；
(b)提供至少一保护框4060，其中所述保护框4060被设置于所述感光芯片4010的感光区域的外周侧；
(c)通过一成型模具40100的模具上部40101的内表面施压于所述保护框4060，以隔离所述感光芯片4010的感光区域和非感光区域；
(d)藉由被加入所述成型模具40100的成形材料包裹所述线路板4070和所述感光芯片4010的非感光区域，以在所述成形材料固化后形成与所述感光芯片4010和所述线路板4070一体结合的一一体封装支架4050；以及
(e)提供至少一光学镜头4030，其中所述光学镜头4030被设置于所述感光芯片4010的感光路径，以制成所述摄像模组。
更进一步地，本发明还提供给一摄像模组的制造方法，其中所述制造方法包括如下步骤：
(A)将至少一感光芯片4010和至少一线路板4070导通连接；
(B)将一滤光元件4020叠合于所述感光芯片；
(C)提供至少一保护框4060，其中所述保护框4060被设置于所述滤光元件4020的外周侧；
(D)通过一成型模具40100的模具上部40101的内表面施压于所述保护框4060，以隔离所述滤光元件4020的内部区域和外周侧；
(E)藉由被加入所述成型模具40100的成形材料包裹所述线路板4070和所述滤光元件4020的外周侧，以在所述成形材料固化后形成与所述滤光元件4020、所述感光芯片4010和所述线路板4070一体结合的一一体封装支架4050；以及
(F)提供至少一光学镜头4030，其中所述光学镜头4030被设置于所述感光芯片4010的感光路径，以制成所述摄像模组。
如图81至图89所示，是根据本发明的一个优选实施例的感光组件和摄像模组。所述感光组件5010包括一线路板主体5011、一感光芯片5012和一连接介质5013。
所述感光芯片5012通过所述连接介质5013被贴附于所述线路板主体5011。
所述感光芯片5012具有一正面50121和一背面50122。所述正面50121朝向外侧，即与所述线路板主体5011相背的方向，所述正面50121用于感光。所述背面50122朝向所述线路板主体5011方向，所述连接介质5013被设置于所述感光芯片5012的所述背面50122和所述线路板主体5011之间，将所述感光芯片5012固定于所述线路板主体5011。
值得一提的是，所述连接介质5013的形状和所述感光芯片5012相匹配，从而使得所述感光芯片5012稳定地、平整地贴附于所述线路板主体5011。不同于传统的D/A贴附方式得到的所述芯片的所述线路板，由前述可知，参照图81A、81B，传统的D/A方式得到的所述芯片501P和所述线路板502P，通常在所述线路板2P和所述芯片501P之间存在所述悬空区域4P，使得所述芯片501P粘接不稳定、平整性较差，且容易出现倾斜。而根据本发明的优选实施例，所述连接介质5013均匀地分布于所述感光芯片5012和所述线路板主体5011之间，使得所述感光芯片5012背面50122和所述线路板主体5011之间的区域被所述连接介质5013充分地填充，提升了所述连接介质5013的覆盖面积，不存在所述悬空区域，从而使得所述感光芯片5012平整、稳定地连接于所述线路板主体5011。
根据本发明的这个实施例，具体地，所述连接介质5013为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
根据本发明的这个实施例，所述感光组件5010包括至少一连接线5014，各所述连接线5014电连接所述感光芯片5012和所述线路板主体5011。所述连接线5014可以为，举例地但不限于，金线、银线、铜线、铝线。也就是说，通过各所述连接线5014使得所述感光芯片5012和所述线路板主体5011电信号连通，当所述感光芯片5012进行感光时，将光信号转变为电信号，通过连接线5014所述电信号传递至所述线路板主体5011。
参照图83和图84所示，所述感光组件5010的第一种制造过程示意。在这种制造方法中，在制造所述感光组件5010时，先在所述感光芯片5012的所述背面50122附着一层所述连接介质5013，使得所述连接介质5013贴附于所述感光芯片5012的所述背面50122。其中所述附着方式可以通过喷涂、旋涂、滚刷或印刷等方式实现。所述连接介质5013可以为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
进而通过UV的方式或热固的方式使得所述连接介质5013呈半固化状态，使得所述连接介质5013的形状不易变化。UV方式，即紫外照射方式。热固的方式，即加热固化的方式。
值得一提的是，在获取所述感光芯片5012时，通常是对一晶圆片50130进行切分而得到，因此，为了进行切割工艺，需要在所述连接介质5013上贴附一切割膜50140，进一步，对带有所述连接介质5013和所述切割膜50140的所述晶圆片50130进行裁切，使得所述晶圆片50130形成多个所述感光芯片5012，也就是说，通过裁切的方式裁剪所述晶圆片50130，使得所述连接介质5013和所述感光芯片5012的形状一致。
进一步，将所述切割膜50140去除，将带有所述连接介质5013的所述感光芯片5012贴附于所述线路板主体5011，也就是说，通过所述连接介质5013将所述感光芯片5012和所述线路板主体5011相连接固定，并且通过按压、加热或烘烤工艺使得所述连接介质5013进行固化，从而使得所述感光芯片5012与所述线路板主体5011稳定连接。特别地，在本发明的一实施例中，在所述感光芯片5012贴附于所述线路板主体5011之前，还包括对所述感光芯片5012的清洗步骤，即，清洗所述感光芯片5012，除去所述感光芯片5012上沾染的灰尘。
值得一提的是，在本发明的另一种实施方式，在所述感光芯片5012形成的过程中，可以将所述切割膜50140贴附于所述晶圆片50130的正面，从而方便将所述晶圆片50130切割为多个所述感光芯片5012。在切割后，将所述切割膜50140去除，从而得到所述感光芯片5012。也就是说，所述切割膜50140可以被设置于所述晶圆片50130的正面和/或背面，本领域的技术人员应当理解的是，所述切割膜50140的设置位置，并不是本发明的限制。
进一步，设置各所述连接线5014于所述感光芯片5012和所述线路板主体5011，使得 所述感光芯片5012和所述线路板主体5011可通电连接。比如，通过W/B(Wired/Bond，芯片邦定)工艺，在所述感光芯片5012和所述线路板主体5011上打金线。
值得一提的是，传统的D/A方式中，通常在所述线路板502P表面进行点胶，而后将所述芯片501P直接放置于点胶区域，通过按压的作用，使得胶水扩展，因此胶体503P的形状存在极大的不确定性，也就是说，可能分布不均匀，且不易控制。而根据本发明的优选实施例，所述连接介质5013被贴附于所述感光芯片5012的所述背面50122，并且使得所述连接介质5013均匀分布于所述感光芯片5012的所述背面50122，以连续面的形式存在，而非离散点或线段的形式存在，保证所述感光芯片5012和所述线路板主体5011的连接平整性。进一步，所述感光芯片5012在贴附于所述线路板主体5011之前，以半固态的形式存在，自身形状相对确定，因此当所述感光芯片5012通过所述连接介质5013贴附于所述线路板主体5011时，所述连接介质5013的形状变化较小，对所述感光芯片5012和所述线路板的连接平整性影响较小，比如所述感光芯片5012的平整度可达到2μm。此外，根据本发明的优选实施例，提升了所述连接介质5013对所述感光芯片5012的背面50122的覆盖面积，避免周围出现所述悬空区4P，因此降低了W/B作业芯片受损的风险，也就是说，更易于设置所述连接线5014于所述感光芯片5012和所述线路板主体5011。
相应地，本发明提供一感光组件的制造方法1000，其包括步骤：
1100：附着一半固态的连接介质5013于一感光芯片5012的背面50122：
1200：通过所述连接介质5013贴附所述感光芯片5012于一线路板主体5011；
1300：固化所述连接介质5013，使得所述感光芯片5012和所述线路板主体5011平整、稳定连接；和
1400：设置至少一连接线5014于所述感光芯片5012和所述线路板主体5011，使得所述感光芯片5012和所述线路板主体5011可通电连接。
其中所述步骤1100进一步可以分解为：
1110：附着所述连接介质5013于一晶圆片50130的背面50122；
1120：附着一切割膜50140于所述连接介质5013的外侧；
1130：半固化所述连接介质5013；和
1140：切割所述晶圆片50130，获得带有半固态所述连接介质5013的所述感光芯片5012。
所述步骤1110、1120、1130和1140适合应用于批量化生产所述感光组件5010，当单独提供所述感光芯片5012而用于制造所述感光组件5010时，可以在所述感光芯片5012的所述背面50122附着所述连接介质5013，而后对所述连接介质5013进行半固化，进一步，将所述感光芯片5012通过所述连接介质5013贴附于所述线路板主体5011。也就是说，所述切割膜50140以及所述裁切过程并不是必须要执行的步骤。当然所述步骤1100中，还可以是，附着一切割膜50140于所述晶圆片50130的正面，而后进行切割所述晶圆片50130。还可以包括步骤，去除所述切割膜50140，比如通过紫外光照的方式的去除。
在所述步骤1110中的附着方式，可以为喷涂、旋涂、滚刷或印刷中的其中一种。所述连接介质5013为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
所述步骤1130中的半固化过程可以通过紫外照射、加热等方式实现。
所述步骤1200中包括步骤1210：清洗所述感光芯片5012。
所述步骤1300中的固化方式，可以为按压、加热或烘烤等方式。
所述步骤1400中的设置方式为打金线的方式。
值得一提的是，本发明的所述感光组件5010的制造方法适于批量化生产，比如在所述晶圆片50130的背面50122整体附着所述连接介质5013，进而将所述晶圆片50130进行晶元切割，得到多个所述感光芯片5012，进而将各所述感光芯片5012分别贴附于各所述线路板主体5011，从而一次形成多个所述感光组件5010，提高生产效率。不同于传统的方式，需要单独点胶，单独粘接，效率较低。
参照图85和图86所示，所述感光组件5010的第二种制造方法。在这种制造方法中， 在制造所述感光组件5010时，先在切割膜50140上附着一层所述连接介质5013，并且对所述连接介质5013进行半固化。所述附着的方式可以为喷涂、旋涂、滚刷或印刷等方式，所述连接介质5013为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。特别地，所连接介质5013的形状为预定形状，比如和所述感光芯片5012匹配的形状。
在通常生产的过程中，所述感光芯片5012的获得方式通常是对所述晶圆片50130切割而得到，因此将带有所述连接介质5013的所述切割膜50140贴附于所述晶圆片50130，而后对所述晶圆片50130进行切分，从而得到单独的所述感光芯片5012，且所述感光芯片5012带有半固态的所述连接介质5013。
也就是说，借助所述切割膜50140将所述连接介质5013的贴附于所述晶圆片50130的所述背面50122，使得所述连接介质5013连接于感光芯片5012的所述背面50122。特别地，可以通过滚压的方式将所述芯片贴附于所述晶圆片50130的所述背面50122。
值得一提的是，在将所述连接介质5013附着于所述切割膜50140之后，需要对所述连接介质5013进行半固化，比如通过UV或热固定的方式使得所述连接介质5013呈半固化状态使得所述连接介质5013的形状不易变化。UV方式，即紫外照射方式。热固的方式，即加热固化的方式。
进一步，将带有所述连接介质5013的所述感光芯片5012贴附于所述线路板主体5011，也就是说，通过所述连接介质5013将所述感光芯片5012和所述线路板主体5011相连接固定，并且通过按压、加热或烘烤工艺使得所述连接介质5013进行固化，从而使得所述感光芯片5012与所述线路板主体5011稳定连接。特别地，在本发明的一实施例中，在所述感光芯片5012贴附于所述线路板主体5011之前，还包括对所述感光芯片5012的清洗步骤，除去所述感光芯片5012上沾染的灰尘。
进一步，设置各所述连接线5014于所述感光芯片5012和所述线路板主体5011，使得所述感光芯片5012和所述线路板主体5011可通电连接。
相应地，本发明提供一感光组件的制造方法2000，其包括步骤：
2100：附着一半固态的连接介质5013于一感光芯片5012的背面50122：
2200：通过所述连接介质5013贴附所述感光芯片5012于一线路板主体5011；
2300：固化所连接介质5013，使得所述感光芯片5012和所述线路板主体5011平整、稳定地连接；和
2400：设置至少一连接线5014于所述感光芯片5012和所述线路板主体5011，使得所述感光芯片5012和所述线路板主体5011可通电连接。
其中所述步骤2100进一步可以分解为：
2110：附着所述连接介质5013于一切割膜50140；
2120：半固化所述连接介质5013；
2130：附着所述连接介质5013于一晶圆片50130；和
2140：切割所述晶圆芯片，获得带有所述半固态所述连接介质5013的所述感光芯片5012。
所述步骤2110、2120、2130和2140适合应用于批量化生产所述感光组件5010。
在所述步骤2110中的附着方式，可以为喷涂、旋涂、滚刷或印刷中的其中一种。所述步骤2120中的附着方式，可以为滚压的方式。
所述连接介质5013为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
所述步骤2120中的半固化过程可以通过紫外照射、加热等方式实现。
所述步骤2200中包括步骤：清洗所述感光芯片5012。
所述步骤2300中的固化方式，可以为按压、加热或烘烤等方式。
所述步骤2400中的设置方式为打金线的方式。
参照图87A和图88所示，所述感光组件5010的第三种制造过程示意。在这种制造方法中，在制造所述感光组件5010时，先在所述线路板主体5011上附着所述连接介质5013，使得所线路板主体5011提供可连接位置。
根据本发明的这个实施例，将所述连接介质5013进行半固化，比如通过UV的方式或热固的方式使得所述连接介质5013呈半固化状态，使得所述连接介质5013的形状不易变化。UV方式，即紫外照射方式。热固的方式，即加热固化的方式。
而在本发明的另一实施例中，可以不进行半固化过程，也就是说，在这种方法中，所述半固化并不是必须的步骤。
进而将所述感光芯片5012贴附于所述线路板主体5011，最后对所述连接介质5013进行固化，形成稳定、平整的所述感光组件5010。所述连接介质5013可以UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
值得一提的是，在这种制造过程中，所述连接介质5013的附着方式可以通过喷涂、刮胶、刮刷或印刷等方式实现，从而在所述线路板主体5011上对应所述感光芯片5012的位置形成一层均匀分布、具有一定厚度的薄膜，作为D/A贴片的粘接剂，并且对所述连接介质5013半固化，而后将所述感光芯片5012贴附于所述线路板主体5011，通过按压、加热按压或烘烤工艺将所述感光芯片5012和线路板主体5011稳定、可靠连接。不同于传统的点胶粘接方式，本方法中提高了所述连接介质5013的覆盖面积，使得所述感光芯片5012和所述线路板主体5011之间不会存在悬空区域，提高平整性。且在所述感光芯片5012贴附于所述线路板主体5011之间，对所述连接介质5013进行半固化，使得所述连接介质5013的形状相对稳定，而不易改变，从而在后续将所述感光芯片5012贴附于所述线路板主体5011进行按压、加热按压或烘烤等工艺过程时，所述连接介质5013的形变量较小，从而保证所述感光芯片5012和所述线路板主体5011的连接平整性。
进一步，设置各所述连接线5014于所述感光芯片5012和所述线路板主体5011，使得所述感光芯片5012和所述线路板主体5011可通电连接。比如，通过W/B(Wired/Bond芯片绑定)工艺，在所述感光芯片5012和所述线路板主体5011上打金线。
参照图87B，是根据本发明的优选实施例的感光组件的第四种制造过程。在这种制造方法中，在制造所述感光组件5010时，先在所述线路板主体5011上附着所述连接介质5013，使得所线路板主体5011提供可连接位置。而不同上述第三种制造过程的是，在这种制造过程中，所述连接介质5013是通过贴附的方式附着于所述线路板主体5011。比如，在所述线路板主体5011表面预定位置贴附预定形状的双面胶膜，所述双面胶膜的形状与所述感光芯片5012相匹配，从而使得所述感光芯片5012平整的、无间隙地贴附于所述线路板主体5011。
进一步，在一种实施方式中，在贴附所述连接介质5013后，可以通过UV照射预固化所述连接介质5013，而后贴附所述感光芯片5012至所述连接介质5013上，继而对所述连接介质5013进行热固，使得所述感光芯片5012和所述线路板主体5011稳定连接。也就是说，在这种方式中，所述连接介质5013可以选择具有UV固化性能的材料进行粘接。
在另一种实施方式中，贴附所述连接介质5013后，可以不进行UV照射预固化所述连接介质5013，而是直接贴附所述感光芯片5012至所述连接介质5013上，而后对所述连接介质5013进行热固，使得所述感光芯片5012和所述线路板主体5011稳定连接。也就是说，在这种方式中，所述连接介质5013可以选取不具有UV固化性能的材料进行粘接。
相应地，根据本发明的上述两种制造过程，本发明提供一感光组件5010的制造方法3000，其包括步骤：
3100：附着一预定形状的连接介质5013于一线路板主体5011；
3200：通过所述连接介质5013贴附所述感光芯片5012于一线路板主体5011；
3300：固化所连接介质5013，使得所述感光芯片5012和所述线路板主体5011平整、稳定连接；和
3400：设置至少一连接线5014于所述感光芯片5012和所述线路板主体5011，使得所述感光芯片5012和所述线路板主体5011可通电连接。
其中所述步骤3100进一步可以分解为：
3110：附着所述连接介质5013于所述线路板主体5011；和
3120：半固化所述连接介质5013。
在所述步骤3110中的附着方式，可以喷涂、刮胶、刮刷、印刷和贴附中的其中一种。所述连接介质5013为UV胶膜、热固胶膜或UV热固胶膜中的其中一种。且所述预定形状与所述感光芯片5012的形状相匹配，从而使得所述感光芯片5012平整地贴附于所述线路板主体5011，不会出现所述悬空区504P。且通过半固化过程，使得连接介质5013的形状相对固定，不易产生变化。值得一提的是，所述半固化过程并不是必须的步骤，也就是说，在其他实施例中，可以直接涂布与所述感光芯片5012相对应的所述连接介质5013，而后进行粘接。
所述步骤3300中的固化方式，可以为按压、加热或烘烤等方式。
所述步骤3400中的设置方式为打金线的方式。
参照图89是根据本发明的一个优选实施例的摄像模组。所述摄像模组包括一所述感光组件5010、一支架5050、一滤光片5020、一镜头5030和一马达5040。所述支架5050被安装于所述感光组件5010，所述滤光片5020被安装于所述支架5050，位于所述感光组件5010的所述感光芯片5012的感光路径上，所述50镜头5030被安装于所述马达5040，以便于通过所述马达5040调整所述摄像模组的焦距，所述马达5040被安装于所述支架5050，以使得所述镜头5030位于所述感光芯片5012的感光路径上。
值得一提的是，所述感光组件5010在所述摄像模组的应用，使得所述感光芯片5012具有较好的平整度，从而更容易调整所述感光芯片5012和所述滤光片5020以及所述镜头5030光轴的一致性，从而使得所述摄像模组具有更好的成像质量，解决所述摄像模组在测试过程中出现的解析不良，成像曲线异常、马达5040CODE异常等问题。
值得一提的是，在本发明的这个实施例中，以动焦摄像模组AFM为例进行说明，而在本发明的其他实施例中，所述摄像模组还可以是定焦模组FF，也就是说，不包括所述马达5040，本领域的技术人员应当理解的是，所述摄像模组的具体形状和类型并不是本发明的限制。
如图90和图91所示，是根据本发明的另一个优选实施例的感光组件5010和摄像模组。不同于上述优选实施例的是，所述感光组件5010包括一模塑体5015，所述模塑体5015一体成型地所述线路板主体5011和所述感光芯片5012。
值得一提的是，在传统的D/A方式中，由于所述芯片和所述线路板连接的边缘区域，通常会出现所述悬空区域，从而在进行D/A工艺之后，进行模塑形成所述模塑体5015，需要通过模具对所述芯片的边缘进行按压，因此，由于所述悬空区域的存在，很容易使得所述感光芯片5012出现倾斜或损伤，从而不利于所述模塑体5015的形成，且不利于组装所述摄像模组。而根据本发发明的这个实施例，所述感光芯片5012通过所述连接介质5013平整地连接于所述线路板主体5011，且不存在所述悬空区域，因此更易于形成所述模塑体5015，且使得所述模塑体5015保持平整。
参照图91，是应用本发明的这个实施例的所述感光组件的摄像模组，所述摄像模组包括一感光组件5010、一滤光片5020、一镜头5030和一马达5040。
所述滤光片5020被安装于所述感光组件5010的所述模塑体5015，位于所述感光组件5010的所述感光芯片5012的感光路径上，所述镜头5030被安装于所述马达5040，以便于通过所述马达5040调整所述摄像模组的焦距，所述马达5040被安装于所述模塑体5015，以使得所述镜头5030位于所述感光芯片5012的感光路径上。
值得一提的是，所述感光组件5010在所述摄像模组的应用，使得所述感光芯片5012和所述模塑体5015都具有较好的平整度，从而更容易调整所述感光芯片5012和所述滤光片5020以及所述镜头5030光轴的一致性，解决形成所述模塑体5015时带来的芯片倾斜问题，从而使得所述摄像模组具有更好的成像质量，解决所述摄像模组在测试过程中出现的解析不良，成像曲线异常、马达CODE异常等问题。因此本发明的所述感光组件5010尤其适用于模塑型的所述摄像模组。
所述感光组件5010包括至少一电路元件5016，凸出于所述线路板主体5011，且被所述模塑体5015包覆。
所述模塑体5015一体封装于所述感光芯片5012的所述正面50121的非感光区，从而使得所述感光芯片5012和所述线路板主体5011连接更加牢固。
值得一提的是，在本发明的这个实施例中，以动焦摄像模组AFM为例进行说明，而在本发明的其他实施例中，所述摄像模组还可以是定焦模组FFM，也就是说，不包括所述马达5040，本领域的技术人员应当理解的是，所述摄像模组的具体形状和类型并不是本发明的限制。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (128)

  1. 一摄像模组的感光组件，其特征在于，包括：
    一封装部；和
    一感光部；所述感光部包括一线路板主体和一感光芯片，所述封装部封装成型于所述线路板主体和所述感光芯片。
  2. 根据权利要求1所述的感光组件，其中所述封装部形成一通孔，所述通孔与所述感光芯片相对，以提供所述感光芯片光线通路。
  3. 根据权利要求2所述的感光组件，其中所述封装部的所述通孔的底部呈由下至上逐渐增大的倾斜状。
  4. 根据权利要求2所述的感光组件，其中所述封装部顶端适于安装所述摄像模组的镜头、马达或滤光片。
  5. 根据权利要求2所述的感光组件，其中所述封装部顶端呈平面状，以用于安装所述摄像模组的镜头、马达或滤光片。
  6. 根据权利要求2所述的感光组件，其中所述封装部顶端具有一安装槽，所述安装槽连通于所述通孔，以用于安装所述摄像模组的滤光片、镜头或马达。
  7. 根据权利要求6所述的感光组件，其中所述滤光片安装段具有一安装槽，连通于所述通孔，形成所述台阶状的第一阶，以便于安装所述滤光片，所述镜头安装段具有一镜头安装槽，形成所述台阶状的第二阶，以便于安装所述摄像模组的镜头。
  8. 根据权利要求1至7任一所述的感光组件，其中所述感光部包括至少一连接线，各所述连接线电连接所述感光芯片和所述线路板主体，所述封装部包覆所述连接线。
  9. 根据权利要求8所述的感光组件，其中所述连接线选自组合：金线、银线、铜线或铝线中的一种。
  10. 根据权利要求8所述的感光组件，其中所述连接线呈弧形地连接所述线路板主体和所述感光芯片。
  11. 根据权利要求8所述的感光组件，其中所述感光芯片包括一感光区和一非感光区，所述非感光区围绕于所述感光区外围，所述封装部模塑延伸至所述感光芯片的所述非感光区。
  12. 根据权利要求8所述的感光组件，其中所述感光部包括至少一电路元件，所述电路元件凸出于所述线路板主体，所述封装部包覆至少一所述电路元件。
  13. 根据权利要求12所述的感光组件，其中所述电路元件选择组合：电阻、电容、二极管、三级管、电位器、继电器和继电器中的其中一种或多种。
  14. 根据权利要求8所述的感光组件，其中所述感光部包括一滤光片，所述滤光片覆盖于所述感光芯片，所述封装部成型于所述线路板主体、所述感光芯片和所述滤光片。
  15. 根据权利要求8所述的感光组件，其中所述感光部包括一加固层，所述加固层叠层设置于所述线路板主体底部，以增强所述线路板主体的结构强度。
  16. 根据权利要求15所述的感光组件，其中所述加固层为金属板，以增强所述感光部的散热性能。
  17. 根据权利要求8所述的感光组件，其中所述感光部包括一屏蔽层，所述屏蔽层包裹所述线路板主体和所述封装部至少一侧，以增强所述感光组件的抗电磁干扰性能。
  18. 根据权利要求17所述的感光组件，其中所述屏蔽层为金属板或金属网。
  19. 根据权利要求8所述的感光组件，其中线路板主体具有至少一加固孔，所述封装部延伸进入所述加固孔，以便于增强所述线路板主体的结构强度。
  20. 根据权利要求19所述的感光组件，其中所述加固孔为凹槽状。
  21. 根据权利要求19所述的感光组件，其中所述加固孔为通孔，以使得所述封装部的模塑材料与所述线路板主体充分接触，且易于制造。
  22. 根据权利要求8所述的感光组件，其中所述线路板主体的材料可以选自组合：软硬结合板、陶瓷基板、PCB硬板或FPC。
  23. 根据权利要求8所述的感光组件，其中所述封装部的材料选自组合：环氧树脂、尼龙、LCP、或PP中的一种或多种。
  24. 根据权利要求8所述的感光组件，其中所述感光组件包括一马达连接结构，其包括至少一引线，所述引线设置于所述封装部，且电连接于所述线路板主体，所述引线包括一马达连接端，显露于所述封装部，以便于连接一马达引脚。
  25. 根据权利要求8所述的感光组件，其中所述引线被设置于所述封装部表面。
  26. 根据权利要求8所述的感光组件，其中引线被设置于所述封装部内部。
  27. 根据权利要求8所述感光组件，其中所述感光组件包括一马达连接结构，其包括至少一引线和至少一引脚槽，所述引线被设置于所述封装部，且电连接于所述线路板主体，所述引脚槽被设置于所述封装部上端部，所述引线包括一马达连接端，所述马达连接端显露于所述槽底壁，以便于一马达引脚插接于所述引脚槽时电连接于所述马达连接端。
  28. 根据权利要求8所述的感光组件，其中所述感光组件包括一马达连接结构，其包括至少一引脚槽和至少一电路接点，所述电路接点电连接于所述线路板主体，所述引脚槽被设置于所述封装部，由所述线路板主体延伸至所述封装部的顶端，且所述电路接点显露于所述引脚槽，以便于一马达引脚插接于所述引脚槽时电连接于所述电路接点。
  29. 根据权利要求8所述的感光组件，其中所述感光组件包括一马达连接结构，其包括至少一雕刻线路，所述雕刻线路设置于所述封装部，电连接于所述线路板主体，以便于电连接一马达引脚。
  30. 根据权利要求29所述的感光组件，其中所述雕刻线路以激光成型的方式设置于所述封装部。
  31. 根据权利要求29所述的感光组件，其中所述雕刻线路被设置所述封装部的表面。
  32. 一摄像模组的感光组件的制造方法，其特征在于，包括步骤：在一线路板主体和一感光芯片上封装成型一封装部。
  33. 根据权利要求32所述的感光组件的制造方法，其中包括步骤：在一线路板主体贴附所述感光芯片，且通过至少一连接线电连接。
  34. 根据权利要求33所述的感光组件的制造方法，其中包括步骤：通过所述封装部包覆所述连接线。
  35. 根据权利要求34所述的感光组件的制造方法，其中包括步骤：延伸所述封装部至所述感光芯片的一非感光区。
  36. 根据权利要求32所述的感光组件的制造方法，其中包括步骤：在所述封装部顶端形成一安装槽，以便于安装一滤光片、马达或镜头。
  37. 根据权利要求32至36任一所述的感光组件的制造方法，其中包括步骤：在所述线路板主体上设置至少一凹槽状加固孔，并使所述封装部延伸进入所述加固孔。
  38. 根据权利要求32至36任一所述的感光组件的制造方法，其中包括步骤：在所述线路板主体上设置至少一通孔状加固孔，并使所述封装部延伸进入所述加固孔。
  39. 根据权利要求32至36任一所述的感光组件的制造方法，其中包括步骤：在所述线路板主体底层贴附一加固层，以增强所述线路板主体的结构强度。
  40. 根据权利要求32至36任一所述的感光组件的制造方法，其中包括步骤：在所述线路板主体和所述封装部至少一侧包覆一屏蔽层，以增强所述感光组件的抗电磁干扰性能。
  41. 根据权利要求32至36任一所述的感光组件的制造方法，还包括步骤：在所述线路板主体、所述感光芯片和一滤光片上封装一封装部。
  42. 一摄像模组，其特征在于，包括：
    一根据权利要求1至31任一所述的感光组件；和
    一镜头；所述镜头位于所述感光组件的所述感光芯片的感光路径。
  43. 根据权利要求42所述的摄像模组，其中所述摄像模组包括一支架，所述支架被安装于所述感光组件，所述镜头被安装于所述支架。
  44. 根据权利要求42所述的摄像模组，其中所述摄像模组包括一马达，所述镜头被安装于所述马达，所述马达被安装于所述感光组件件。
  45. 根据权利要求42所述的摄像模组，其中所述摄像模组包括一滤光片，所述滤光片被安装于所述感光组件。
  46. 根据权利要其43所述的摄像模组，其中所述摄像模组包括一滤光片，所述滤光片被安装于所述支架。
  47. 一基于一体封装工艺的摄像模组，其特征在于，包括至少一封装感光组件、和至少一镜头，所述封装感光组件包括至少一封装部和至少一感光组件，所述感光组件进一步包括至少一感光芯片，和至少一线路板，所述感光芯片和所述线路板可导通地连接，所述镜头位于所述感光芯片的感光路径，所述封装部一体地封装于所述线路板的一顶表面和所述线路板的至少一侧面。
  48. 根据权利要求47所述的基于一体封装工艺的摄像模组，其中所述封装部还封装所述线路板的一底面。
  49. 根据权利要求47所述的基于一体封装工艺的摄像模组，其中所述线路板的底面紧贴设置有一补强板。
  50. 根据权利要求49所述的基于一体封装工艺的摄像模组，其中所述封装部封装所述补强板的至少一侧部。
  51. 根据权利要求49所述的基于一体封装工艺的摄像模组，其中所述封装部封装所述补强板的一底部。
  52. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述封装部还封装于所述感光芯片的非感光区域。
  53. 根据权利要求52所述的基于一体封装工艺的摄像模组，其中所述感光芯片和所述线路板通过一组引线连接，其中所述封装部包覆所述引线。
  54. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，还包括至少一滤光片，其中所述封装部作为承载所述滤光片的支架。
  55. 根据权利要求54所述的基于一体封装工艺的摄像模组，其中所述封装部还封装于所述感光芯片的非感光区域。
  56. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述滤光片叠合于所述感光芯片，所述封装部还封装于所述滤光片。
  57. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述封装部的顶部分别向上延伸形成至少一容纳槽，以用于容纳所述镜头。
  58. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述基于一体封装工艺的摄像模组还包括一马达，所述马达安装于所述封装部，并与所述线路板导通连接。
  59. 根据权利要求58所述的基于一体封装工艺的摄像模组，其中所述封装部具有电气性能，以将所述马达和所述线路板导通连接。
  60. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述线路板还设置有至少一穿孔，所述封装部延伸埋入所述穿孔。
  61. 根据权利要求52所述的基于一体封装工艺的摄像模组，其中所述线路板还设置有至少一穿孔，所述封装部延伸埋入所述穿孔。
  62. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组，其中所述的封装工艺为模塑工艺。
  63. 根据权利要求62所述的基于一体封装工艺的摄像模组，其中所述模塑工艺为注塑或模压工艺。
  64. 根据权利要求47至51中任一所述的基于一体封装工艺的摄像模组， 其中所述摄像模组是定焦摄像模组或自动对焦摄像模组。
  65. 一摄像模组，其特征在于，包括：
    至少一线路板；
    至少一光学镜头；
    至少一保护框；
    至少一感光芯片，其中所述保护框被凸起地设置于所述感光芯片的感光区域的外周侧；以及
    至少一一体封装支架，其中所述一体封装支架被设置包裹所述线路板和所述感光芯片的非感光区域，以使所述一体封装支架、所述线路板和所述感光芯片结合为一体，其中所述光学镜头被设置于所述感光芯片的感光路径，其中所述感光芯片与所述线路板被导通连接。
  66. 根据权利要求65所述的摄像模组，其中所述保护框的内侧边的尺寸大于或者等于所述感光芯片的感光区域的尺寸。
  67. 根据权利要求66所述的摄像模组，其中所述保护框的外侧边的尺寸小于或者等于所述感光芯片的尺寸。
  68. 根据权利要求65所述的摄像模组，其中所述保护框具有弹性。
  69. 根据权利要求65所述的摄像模组，进一步包括一胶合层，其中所述胶合层被设置于所述保护框和所述感光芯片的感光区域的外周侧之间，以藉由所述胶合层连接所述保护框和所述感光芯片的感光区域的外周侧。
  70. 根据权利要求65所述的摄像模组，其中所述一体封装支架进一步被设置包裹所述保护框的外侧面。
  71. 根据权利要求65-70中任一所述的摄像模组，进一步包括一镜头支撑体，其中所述镜头支撑体被设置于所述一体封装支架，所述光学镜头被设置于所述镜头支撑体。
  72. 根据权利要求71所述的摄像模组，其中所述镜头支撑体与所述一体封装支架一体地形成。
  73. 根据权利要求71所述的摄像模组，其中所述镜头支撑体是一马达，并且所述马达与所述线路板被导通连接。
  74. 根据权利要求65-70中任一所述的摄像模组，进一步包括一滤光元件，其中所述滤光元件被设置于所述一体封装支架的顶部，以使所述滤光元件位于所 述感光芯片和所述光学镜头之间。
  75. 根据权利要求71所述的摄像模组，进一步包括一滤光元件，其中所述滤光元件被设置于所述一体封装支架的顶部，以使所述滤光元件位于所述感光芯片和所述光学镜头之间。
  76. 一摄像模组，其特征在于，包括：至少一线路板；
    至少一光学镜头；
    至少一保护框；
    至少一感光芯片；
    至少一滤光元件，其中所述滤光元件被重叠地设置于所述感光芯片，所述保护框被设置于所述滤光元件的外周侧；以及
    至少一一体封装支架，其中所述一体封装支架被设置包覆所述滤光元件的外周侧和所述线路板，以使所述一体封装支架，所述滤光元件、所述感光芯片和所述线路板结合为一体，其中所述光学镜头被设置于所述感光芯片的感光路径，所述感光芯片与所述线路板导通连接。
  77. 根据权利要求76所述的摄像模组，其中所述保护框的内侧边的尺寸大于或者等于所述感光芯片的感光区域的尺寸，以使所述保护框不会遮挡所述感光芯片的感光区域。
  78. 根据权利要求77所述的摄像模组，其中所述保护框具有弹性。
  79. 根据权利要求78所述的摄像模组，进一步包括一胶合层，其中所述胶合层被设置于所述保护框和所述滤光元件之间，以藉由所述胶合层连接所述保护框和所述滤光元件的外周侧。
  80. 根据权利要求76-79中任一所述的摄像模组，其中所述一体封装支架进一步被设置包裹所述保护框的外侧面。
  81. 根据权利要求76-79中任一所述的摄像模组，进一步包括一镜头支撑体，其中所述镜头支撑体被设置于所述一体封装支架，所述光学镜头被设置于所述镜头支撑体。
  82. 根据权利要求80所述的摄像模组，进一步包括一镜头支撑体，其中所述镜头支撑体被设置于所述一体封装支架，所述光学镜头被设置于所述镜头支撑体。
  83. 根据权利要求82所述的摄像模组，其中所述镜头支撑体与所述一体封 装支架一体地形成。
  84. 一摄像模组的制造方法，其特征在于，所述制造方法包括如下步骤：
    (a)将至少一感光芯片和至少一线路板导通连接；
    (b)提供至少一保护框，其中所述保护框被设置于所述感光芯片的感光区域的外周侧；
    (c)通过一成型模具的模具上部的内表面施压于所述保护框，以隔离所述感光芯片的感光区域和非感光区域；
    (d)藉由被加入所述成型模具的成形材料包裹所述线路板和所述感光芯片的非感光区域，以在所述成形材料固化后形成与所述感光芯片和所述线路板一体结合的一一体封装支架；以及
    (e)提供至少一光学镜头，其中所述光学镜头被设置于所述感光芯片的感光路径，以制成所述摄像模组。
  85. 根据权利要求84所述的制造方法，其中在所述步骤(b)中，在所述保护框的上部设置一保护膜，以使所述保护膜对应于所述感光芯片的感光区域，并且在所述步骤(d)之后，将所述保护膜从所述保护框上去除。
  86. 根据权利要求84所述的制造方法，其中在上述方法中，在所述成型模具的所述模具上部对应所述感光区域的部位设置一凹槽，以在所述步骤(c)中，使所述模具上部的内表面与所述感光芯片的感光区域保持安全距离。
  87. 根据权利要求85所述的制造方法，其中在上述方法中，在所述成型模具的所述模具上部对应所述感光区域的部位设置一凹槽，以在所述步骤(c)中，使所述模具上部的内表面与所述感光芯片的感光区域保持安全距离。
  88. 根据权利要求86所述的制造方法，其中在所述成型模具的所述模具上部的内表面设置一覆盖膜。
  89. 根据权利要求87所述的制造方法，其中在所述成型模具的所述模具上部的内表面设置一覆盖膜。
  90. 根据权利要求84-89中任一所述的制造方法，其中在所述步骤(d)中，所述成形材料进一步包裹所述保护框的外侧面，以在所述成形材料固化后形成与所述感光芯片、所述线路板和所述保护框一体结合的所述一体封装支架。
  91. 根据权利要求84-89中任一所述的制造方法，其中在所述步骤(e)之前，进一步包括步骤：
    将至少一滤光元件贴装于所述一体封装支架的顶部，并使所述滤光元件被保持在所述感光芯片和所述光学镜头之间。
  92. 根据权利要求90所述的制造方法，其中在所述步骤(e)之前，进一步包括步骤：
    将至少一滤光元件贴装于所述一体封装支架的顶部，并使所述滤光元件被保持在所述感光芯片和所述光学镜头之间。
  93. 根据权利要求84-89中任一所述的制造方法，其中在所述步骤(b)中，在所述感光芯片的感光区域的外周侧和所述保护框之间形成一胶合层，以藉由所述胶合层连接所述保护框和所述感光芯片的外周侧。
  94. 根据权利要求92所述的制造方法，其中在所述步骤(b)中，在所述感光芯片的感光区域的外周侧和所述保护框之间形成一胶合层，以藉由所述胶合层连接所述保护框和所述感光芯片的外周侧。
  95. 根据权利要求94所述的制造方法，其中在上述方法中，在所述保护框和/或所述感光芯片的感光区域的外周侧施涂胶水，以在所述胶水固化后形成所述胶合层。
  96. 根据权利要求95所述的制造方法，其中在上述方法中，所述胶水通过热固化或者UV光照固化。
  97. 一摄像模组的制造方法，其特征在于，所述制造方法包括如下步骤：
    (A)将至少一感光芯片和至少一线路板导通连接；
    (B)将一滤光元件叠合于所述感光芯片；
    (C)提供至少一保护框，其中所述保护框被设置于所述滤光元件的外周侧；
    (D)通过一成型模具的模具上部的内表面施压于所述保护框，以隔离所述滤光元件的内部区域和外周侧；
    (E)藉由被加入所述成型模具的成形材料包裹所述线路板和所述滤光元件的外周侧，以在所述成形材料固化后形成与所述滤光元件、所述感光芯片和所述线路板一体结合的一一体封装支架；以及
    (F)提供至少一光学镜头，其中所述光学镜头被设置于所述感光芯片的感光路径，以制成所述摄像模组。
  98. 根据权利要求97所述的制造方法，其中在所述步骤(E)中，所述成形材料进一步包括所述保护框的外侧面，以在所述成形材料固化后形成与所述感 光芯片、所述线路板、所述滤光元件和所述保护框一体结合的所述一体封装支架。
  99. 根据权利要求97或98中任一所述的制造方法，其中在上述方法中，所述成形材料是流质材料或者颗粒状材料。
  100. 一感光组件，其特征在于，包括：
    一线路板主体；
    一感光芯片；和
    一连接介质；其中所述感光芯片通过所述连接介质贴附于所述线路板主体，且所述连接介质和所述感光芯片的形状相匹配，以使得所述感光芯片平整地连接于所述线路板主体。
  101. 根据权利要求100所述的感光组件，其中所述感光组件包括至少一连接线，可通电连接所述感光芯片和所述线路板主体。
  102. 根据权利要求101所述的感光组件，其中所述连接线为组合：金线、银线、铜线和铝线中的其中至少一种。
  103. 根据权利要求100所述的感光组件，其中所述感光组件包括一模塑体，所述模塑体一体成型于所述感光芯片和所述线路板主体。
  104. 根据权利要求103所述的感光组件，其中所述感光组件包括至少一电路元件，凸出于所述线路板主体，且被所述模塑体包覆。
  105. 根据权利要求100至104任一所述的感光组件，其中所述连接介质通过组合：喷涂、旋涂、滚刷、印刷和贴附中的一种方式施加于所述感光芯片的一背面。
  106. 根据权利要求100至104任一所述的感光组件，其中所述连接介质通过组合：喷涂、刮胶、刮刷和印刷中的一种方式施加于所述线路板主体。
  107. 根据权利要求100至104任一所述的感光组件，其中所述连接介质为组合：UV胶膜、热固胶膜和UV热固胶膜中的其中一种。
  108. 一摄像模组，其特征在于，包括：
    如权利要求100至107任一所述的感光组件；和
    一镜头；其中所述镜头位于所述感光组件的感光路径上。
  109. 根据权利要求108所述的摄像模组，其中所述摄像模组包括一马达，所述镜头被安装于所述马达。
  110. 根据权利要求108所述的摄像模组，其中所述摄像模组包括一滤光片， 所述滤光片位于所述感光组件的感光路径。
  111. 根据权利要求108所述的摄像模组，其中所述摄像模组包括一支架，所述支架被安装于所述感光组件。
  112. 一感光组件制造方法，其特征在于，包括步骤：
    (A)附着一半固态的连接介质于一感光芯片的背面；
    (B)通过所述连接介质贴附所述感光芯片于一线路板主体；
    (C)固化所述连接介质，使得所述感光芯片和所述线路板主体平整、稳定连接；和
    (D)设置至少一连接线于所述感光芯片和所述线路板主体，使得所述感光芯片和所述线路板主体可通电连接。
  113. 根据权利要求112所述的感光组件的制造方法，其中所述步骤(A)包括步骤：
    附着所述连接介质于一晶圆片的背面；
    附着一切割膜于所述连接介质的外侧；
    半固化所述连接介质；和
    切割所述晶圆片，获得带有半固态所述连接介质的所述感光芯片。
  114. 根据权利要求112所述的感光组件的制造方法，其中所述步骤(A)包括步骤：
    附着所述连接介质于一晶圆片的背面；
    附着一切割膜于所述晶圆片的正面；
    半固化所述连接介质；和
    切割所述晶圆片，获得带有半固态所述连接介质的所述感光芯片。
  115. 根据权利要求112所述的感光组件的制造方法，其中所述步骤(A)包括步骤：
    附着所述连接介质于一切割膜；
    半固化所述连接介质；
    附着所述连接介质于一晶圆片；和
    切割所述晶圆芯片，获得带有所述半固态所述连接介质的所述感光芯片。
  116. 根据权利要求112所述的感光组件的制造方法，其中所述步骤(B)包括步骤：清洗所述感光芯片。
  117. 根据权利要求112至116任一所述的感光组件的制造方法，其中所述附着方式为组合：喷涂、旋涂、滚刷、印刷和贴附中的其中一种方式。
  118. 根据权利要求114至116所述的感光组件的制造方法，其中所述半固化过程可以通过紫外照射或加热方式实现。
  119. 根据权利要求112至116任一所述的感光组件的制造方法，其中所述步骤(C)中的固化方式可以为组合：按压、加热和烘烤中的其中一种或多种。
  120. 根据权利要求112至116任一所述的感光组件的制造方法，其中所述步骤(D)中的设置方式为打金线的方式。
  121. 根据权利要求112至116任一所述的感光组件的制造方法，其中所述连接介质为组合：UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
  122. 一感光组件的制造方法，其特征在于，包括步骤：
    (a)附着一预定形状的连接介质于一线路板主体；
    (b)通过所述连接介质贴附所述感光芯片于一线路板主体；
    (c)固化所连接介质，使得所述感光芯片和所述线路板主体平整、稳定连接；和
    (d)设置至少一连接线于所述感光芯片和所述线路板主体，使得所述感光芯片和所述线路板主体可通电连接。
  123. 根据权利要求122所述的感光组件的制造方法，其中所述步骤(a)包括步骤：
    附着所述连接介质于所述线路板主体；和
    半固化所述连接介质。
  124. 根据权利要求122所述的感光组件的制造方法，其中所述半固化过程可以通过紫外照射或加热方式实现。
  125. 根据权利要求122至124任一所述的感光组件的制造方法，其中所述附着的方式为组合：喷涂、刮胶、刮刷、印刷和贴附中的其中一种。
  126. 根据权利要求122至124任一所述的感光组件的制造方法，其中所述步骤(c)中的固化方式可以为组合：按压、加热和烘烤中的其中一种或多种。
  127. 根据权利要求122至124任一所述的感光组件的制造方法，其中所述步骤(d)中的设置方式为打金线的方式。
  128. 根据权利要求122至124任一所述的感光组件的制造方法，其中所述 连接介质为组合：UV胶膜、热固胶膜或UV热固胶膜中的其中一种。
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