WO2017057561A1 - 樹脂組成物及び多層基板 - Google Patents
樹脂組成物及び多層基板 Download PDFInfo
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- WO2017057561A1 WO2017057561A1 PCT/JP2016/078800 JP2016078800W WO2017057561A1 WO 2017057561 A1 WO2017057561 A1 WO 2017057561A1 JP 2016078800 W JP2016078800 W JP 2016078800W WO 2017057561 A1 WO2017057561 A1 WO 2017057561A1
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- JAWGVVJVYSANRY-UHFFFAOYSA-N cobalt(3+) Chemical compound [Co+3] JAWGVVJVYSANRY-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical group N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Definitions
- the present invention relates to a resin composition containing an epoxy compound, a curing agent, and an inorganic filler.
- the present invention also relates to a multilayer substrate using the above resin composition.
- a resin composition is used in order to form an insulating layer for insulating inner layers or to form an insulating layer located in a surface layer portion.
- a wiring generally made of metal is laminated on the surface of the insulating layer.
- the B stage film which made the said resin composition into a film may be used.
- the resin composition and the B stage film are used as insulating materials for printed wiring boards including build-up films.
- Patent Document 1 discloses a curable epoxy composition containing an epoxy compound, an active ester compound, and a filler.
- the content of the epoxy compound having a softening point of 100 ° C. or less is 80% by weight or more in 100% by weight of the total epoxy compound.
- the insulating layer is required to have a low dielectric loss tangent in order to reduce transmission loss.
- the insulating layer is required to have high thermal dimensional stability and hardly undergo dimensional changes due to heat in order to reduce the occurrence of peeling and warping.
- An object of the present invention is to provide a resin composition that can enhance the bending characteristics and cutting processability of a B-stage film, lower the dielectric loss tangent of the cured product, and increase the thermal dimensional stability of the cured product. That is.
- the epoxy compound includes an epoxy compound, a curing agent, and an inorganic filler, and the epoxy compound has a viscosity at 25 ° C. of 500 mPa ⁇ s or less in a total of 100% by weight of the epoxy compound.
- a resin composition containing a liquid epoxy compound in an amount of 1 wt% to 10 wt%.
- the content of the inorganic filler is 60% by weight or more in 100% by weight of the component excluding the solvent in the resin composition.
- the inorganic filler contains silica.
- the curing agent includes an active ester compound.
- the liquid epoxy compound has a viscosity at 25 ° C. of 10 mPa ⁇ s or more.
- the liquid epoxy compound has a glycidylamine structure or a resorcinol structure having an alicyclic structure or an aromatic ring structure.
- the liquid epoxy compound is a liquid epoxy compound containing no silicon atom.
- the resin composition includes a thermoplastic resin.
- a multilayer substrate comprising a circuit board and an insulating layer disposed on the circuit board, wherein the insulating layer is a cured product of the resin composition described above.
- the resin composition according to the present invention includes an epoxy compound, a curing agent, and an inorganic filler, and the epoxy compound has a viscosity of 500 mPa ⁇ s or less at 25 ° C. in 100% by weight of the total epoxy compound. Since a liquid epoxy compound is contained in an amount of 1% by weight or more and 10% by weight or less, the bending characteristics and cutting processability of the B-stage film can be improved, the dielectric loss tangent of the cured product is lowered, and the thermal dimensional stability of the cured product Can increase the sex.
- FIG. 1 is a cross-sectional view schematically showing a multilayer substrate using a resin composition according to an embodiment of the present invention.
- the resin composition according to the present invention includes an epoxy compound, a curing agent, and an inorganic filler.
- the epoxy compound includes a liquid epoxy compound having a viscosity at 25 ° C. of 500 mPa ⁇ s or less.
- the content of the liquid epoxy compound whose viscosity at 25 ° C. is 500 mPa ⁇ s or less is 1% by weight or more and 10% by weight or less in the total 100% by weight of the epoxy compound. .
- the bending characteristics and cutting processability of the B-stage film can be improved, the dielectric loss tangent of the cured product is lowered, and the thermal dimensional stability of the cured product is enhanced. Can do.
- the B-stage film is bent, it can be made difficult to cause cracks.
- the B stage film is cut into a predetermined size, generation of chips (chipping) can be suppressed.
- the content of the liquid epoxy compound having a viscosity at 25 ° C. of 500 mPa ⁇ s or less in the total of 100% by weight of the epoxy compound is 1% by weight or more and 10% by weight or less.
- the content of the inorganic filler can be increased, and a low dielectric loss tangent and high dimensional stability can be achieved at an even higher level.
- the average linear expansion coefficient of the cured product at 25 ° C. or more and 150 ° C. or less is preferably 30 ppm / ° C. or less, more preferably 25 ppm / ° C. or less.
- the dielectric loss tangent of the cured product at a frequency of 1.0 GHz is preferably 0.005 or less, more preferably 0.0045 or less. When the dielectric loss tangent is less than or equal to the upper limit, transmission loss is further suppressed.
- the multilayer substrate according to the present invention includes a circuit board and an insulating layer disposed on the circuit board.
- the insulating layer is a cured product of the resin composition described above.
- Epoxy compound The epoxy compound contained in the resin composition is not particularly limited. A conventionally well-known epoxy compound can be used as this epoxy compound.
- the epoxy compound refers to an organic compound having at least one epoxy group. As for the said epoxy compound, only 1 type may be used and 2 or more types may be used together.
- Examples of the epoxy compound include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, biphenyl novolac type epoxy resin, biphenol type epoxy resin, and naphthalene type epoxy resin.
- Examples thereof include an epoxy resin having a skeleton.
- the epoxy compound contains 1 wt% or more and 10 wt% or less of a liquid epoxy compound having a viscosity at 25 ° C. of 500 mPa ⁇ s or less in 100 wt% of the total epoxy compound.
- the liquid epoxy compound examples include monomer type epoxy compounds.
- the liquid epoxy compound is preferably a dicyclopentadiene type epoxy compound or an epoxy compound having a benzene ring, and the dicyclopentadiene type.
- An epoxy monomer or an epoxy monomer having a benzene ring is more preferable.
- the liquid epoxy compound is more preferably a liquid epoxy compound having two or more epoxy groups.
- the liquid epoxy compound is preferably a liquid epoxy compound containing no silicon atom. By using this liquid epoxy compound, the bending characteristics and the cutting workability can be further improved.
- liquid epoxy compound examples include 2-ethylhexyl glycidyl ether, hexanediol diglycidyl ether, butanediol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, dicyclopentadiene dimethanol diglycidyl ether, resorcinol diglycidyl ether, A glycidyl aniline etc. are mentioned.
- the liquid epoxy compound preferably has a cyclic structure.
- the cyclic structure include an alicyclic structure and an aromatic ring structure.
- the alicyclic structure is preferably a cyclohexane structure or a dicyclopentadiene structure.
- the aromatic ring structure include a benzene ring structure and a naphthalene ring structure.
- the structure having a benzene ring structure include a glycidylamine structure having an aromatic ring structure and a resorcinol structure.
- the liquid epoxy compound preferably has a glycidylamine structure or resorcinol structure having an alicyclic structure or an aromatic ring structure, and has a resorcinol structure, since the effects of the present invention are more effectively exhibited. Is more preferable.
- the epoxy compound preferably contains a solid epoxy compound at 25 ° C. together with the liquid epoxy resin.
- the viscosity of the liquid epoxy compound at 25 ° C. is preferably 400 mPa ⁇ s or less.
- the viscosity of the liquid epoxy compound at 25 ° C. is preferably 10 mPa ⁇ s or more, more preferably 30 mPa ⁇ s or more.
- the liquid epoxy compound has a viscosity at 25 ° C. as the liquid epoxy compound having a viscosity at 25 ° C. of 500 mPa ⁇ s or less.
- the liquid epoxy compound which is 400 mPa * s or less is included.
- the liquid epoxy compound is a liquid having a viscosity at 25 ° C. of 10 mPa ⁇ s or more as the liquid epoxy compound having a viscosity of 500 mPa ⁇ s or less at 25 ° C.
- the content of the liquid epoxy compound having a viscosity at 25 ° C. of 500 mPa ⁇ s or less in the total 100% by weight of the epoxy compound is preferably 9% by weight or less.
- the content of the liquid epoxy compound having a viscosity at 25 ° C. of 400 mPa ⁇ s or less in 100% by weight of the total epoxy compound Preferably it is 9 weight% or less.
- a liquid epoxy having a viscosity at 25 ° C. of 10 mPa ⁇ s to 500 mPa ⁇ s in 100% by weight of the total epoxy compound is preferably 1% by weight or more, preferably 10% by weight or less, more preferably 9% by weight or less.
- the content of the compound is preferably 1% by weight or more, preferably 10% by weight or less, more preferably 9% by weight or less.
- the content of the compound is preferably 1% by weight or more, preferably 10% by weight or less, more preferably 9% by weight or less.
- the content of the compound is preferably 1% by weight or more, preferably 10% by weight or less, more preferably 9% by weight or less.
- the curing agent contained in the resin composition is not particularly limited.
- a conventionally known curing agent can be used as the curing agent.
- curing agent only 1 type may be used and 2 or more types may be used together.
- cyanate ester compound cyanate ester curing agent
- phenol compound phenol curing agent
- amine compound amine curing agent
- thiol compound thiol curing agent
- imidazole compound phosphine compound, acid anhydride
- Examples include active ester compounds and dicyandiamide.
- the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.
- cyanate ester compounds include novolak type cyanate ester resins, bisphenol type cyanate ester resins, and prepolymers in which these are partly trimerized.
- novolak-type cyanate ester resin a phenol novolak-type cyanate ester resin, an alkylphenol-type cyanate ester resin, etc. are mentioned.
- the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.
- cyanate ester compounds Commercially available products of the above-mentioned cyanate ester compounds include phenol novolac type cyanate ester resins (Lonza Japan “PT-30” and “PT-60”), and prepolymers (Lonza Japan) in which bisphenol type cyanate ester resins are trimmed. "BA-230S”, “BA-3000S”, “BTP-1000S” and “BTP-6020S”) manufactured by the company.
- phenol compound examples include novolak type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol, and dicyclopentadiene type phenol.
- phenol compounds examples include novolak-type phenols (“TD-2091” manufactured by DIC), biphenyl novolac-type phenols (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), and aralkyl-type phenol compounds (“MEH manufactured by Meiwa Kasei Co., Ltd.). -7800 "), and phenols having an aminotriazine skeleton (" LA1356 “and” LA3018-50P "manufactured by DIC).
- the curing agent preferably contains an active ester compound.
- the active ester compound refers to a compound containing at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond.
- the active ester compound is obtained, for example, by a condensation reaction between a carboxylic acid compound or thiocarboxylic acid compound and a hydroxy compound or thiol compound.
- Examples of the active ester compound include a compound represented by the following formula (1).
- X1 and X2 each represent a group containing an aromatic ring.
- the group containing an aromatic ring include a benzene ring which may have a substituent and a naphthalene ring which may have a substituent.
- a hydrocarbon group is mentioned as said substituent.
- the carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.
- a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, a benzene ring which may have a substituent and a substitution
- the combination with the naphthalene ring which may have a group, and the combination of the naphthalene ring which may have a substituent and the naphthalene ring which may have a substituent are mentioned.
- the active ester compound is not particularly limited. From the viewpoint of reducing the dielectric loss tangent of the cured product and increasing the thermal dimensional stability of the cured product, it is more preferable to have a naphthalene ring in the main chain skeleton of the active ester. Examples of commercially available active ester compounds include “HPC-8000-65T”, “EXB9416-70BK”, and “EXB8100-65T” manufactured by DIC.
- the content of the curing agent with respect to 100 parts by weight of the epoxy compound is preferably 25 parts by weight or more, more preferably 50 parts by weight or more, preferably 200 parts by weight or less, more preferably 150 parts by weight or less.
- the content of the curing agent is not less than the above lower limit and not more than the above upper limit, the curability is further improved, and the dimensional change of the cured product due to heat and the volatilization of the remaining unreacted components can be further suppressed.
- the total content of the epoxy compound and the curing agent is preferably 75% by weight or more, more preferably 80% by weight or more, preferably Is 99% by weight or less, more preferably 97% by weight or less.
- the total content of the epoxy compound and the curing agent is not less than the above lower limit and not more than the above upper limit, a more favorable cured product can be obtained, and the dimensional change due to heat of the cured product can be further suppressed.
- thermoplastic resin examples include polyvinyl acetal resin and phenoxy resin. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be used together.
- the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring.
- the phenoxy resin By using the phenoxy resin, deterioration of the embedding property of the resin film with respect to the holes or irregularities of the circuit board and non-uniformity of the inorganic filler can be suppressed.
- the melt viscosity can be adjusted by using a phenoxy resin, the dispersibility of the inorganic filler is improved, and the resin composition or the B-stage film is difficult to wet and spread in an unintended region during the curing process.
- the phenoxy resin contained in the resin composition is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin. As for the said phenoxy resin, only 1 type may be used and 2 or more types may be used together.
- phenoxy resins examples include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and an imide skeleton.
- phenoxy resins examples include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40” manufactured by Mitsubishi Chemical Corporation, “ 4275 “,” YX6954BH30 “,” YX8100BH30 “, and the like.
- the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10,000 or more, preferably 100,000 or less, more preferably 50000 or less.
- the weight average molecular weight of the thermoplastic resin indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
- the content of the thermoplastic resin is not particularly limited.
- the content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 2% in 100% by weight of the component excluding the inorganic filler and solvent in the resin composition. % Or more, more preferably 4% by weight or more, preferably 15% by weight or less, more preferably 10% by weight or less.
- the content of the thermoplastic resin is not less than the above lower limit and not more than the above upper limit, the embedding property of the resin composition or the B stage film with respect to the holes or irregularities of the circuit board becomes good.
- the content of the thermoplastic resin is equal to or more than the lower limit, the resin composition can be more easily formed into a film, and a better insulating layer can be obtained.
- the content of the thermoplastic resin is not more than the above upper limit, the thermal expansion coefficient of the cured product is further reduced. The surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.
- the resin composition includes an inorganic filler. Use of the inorganic filler further reduces the dimensional change due to heat of the cured product. Further, the dielectric loss tangent of the cured product is further reduced.
- examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
- the inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica.
- silica the coefficient of thermal expansion of the cured product is further reduced, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased.
- the shape of silica is preferably spherical.
- the average particle size of the inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, further preferably 150 nm or more, preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, still more preferably 5 ⁇ m or less, and particularly preferably 1 ⁇ m or less. is there.
- the average particle size of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the size of the holes formed by the roughening treatment or the like becomes fine, and the number of holes increases. As a result, the adhesive strength between the cured product and the metal layer is further increased.
- the median diameter (d50) value of 50% is adopted as the average particle diameter of the inorganic filler.
- the average particle size can be measured using a laser diffraction / scattering particle size distribution measuring apparatus.
- Each of the inorganic fillers is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the insulating layer and the metal layer is effectively increased.
- the aspect ratio of each of the inorganic fillers is preferably 2 or less, more preferably 1.5 or less.
- the inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent.
- the surface roughness of the surface of the roughened cured product is further reduced, the adhesive strength between the cured product and the metal layer is further increased, and finer wiring is formed on the surface of the cured product, and more Better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the cured product.
- Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
- Examples of the silane coupling agent include methacryl silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.
- the content of the inorganic filler is preferably 25% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, particularly preferably 50% by weight. % Or more, most preferably 60% by weight or more, preferably 99% by weight or less, more preferably 85% by weight or less, still more preferably 80% by weight or less, and particularly preferably 75% by weight or less.
- the adhesive strength between the cured product and the metal layer is further increased, and finer wiring is formed on the surface of the cured product. At the same time, with this amount of inorganic filler, the dimensional change due to heat of the cured product can be reduced.
- the resin composition preferably contains a curing accelerator.
- the curing accelerator By using the curing accelerator, the curing rate is further increased.
- the number of unreacted functional groups is reduced, and as a result, the crosslinking density is increased.
- the said hardening accelerator is not specifically limited, A conventionally well-known hardening accelerator can be used.
- As for the said hardening accelerator only 1 type may be used and 2 or more types may be used together.
- curing accelerator examples include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.
- imidazole compound examples include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ' -Mechi Imidazolyl- (1 ′)]-
- Examples of the phosphorus compound include triphenylphosphine.
- Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.
- organometallic compound examples include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).
- the content of the curing accelerator is not particularly limited. In 100% by weight of the component excluding the inorganic filler and solvent in the resin composition, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.9% by weight or more, preferably 5. It is 0 weight% or less, More preferably, it is 3.0 weight% or less.
- the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the resin film is efficiently cured. If content of the said hardening accelerator is a more preferable range, the storage stability of a resin composition will become still higher and a much better hardened
- the resin composition does not contain or contains a solvent.
- the solvent By using the solvent, the viscosity of the resin composition can be controlled within a suitable range, and the coatability of the resin composition can be improved.
- the said solvent may be used in order to obtain the slurry containing the said inorganic filler. As for the said solvent, only 1 type may be used and 2 or more types may be used together.
- Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples thereof include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha which is a mixture.
- the boiling point of the solvent is preferably 200 ° C. or lower, more preferably 180 ° C. or lower.
- the content of the solvent in the resin composition is not particularly limited. The content of the solvent can be appropriately changed in consideration of the coating property of the resin composition.
- the resin composition includes a leveling agent, a flame retardant, a coupling agent, a colorant, an antioxidant, an ultraviolet degradation inhibitor, You may add other thermosetting resins other than an antifoamer, a thickener, a thixotropic agent, and an epoxy compound.
- Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
- Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.
- thermosetting resins examples include polyphenylene ether resins, divinyl benzyl ether resins, polyarylate resins, diallyl phthalate resins, polyimide resins, benzoxazine resins, benzoxazole resins, bismaleimide resins, and acrylate resins.
- a resin film (B stage film) and laminated film) can be obtained by molding the resin composition described above into a film.
- the resin film is preferably a B stage film.
- the thickness of the resin film is preferably 5 ⁇ m or more, and preferably 200 ⁇ m or less.
- an extrusion molding method is used in which the resin composition is melt-kneaded using an extruder, extruded, and then formed into a film using a T-die or a circular die.
- a casting molding method in which a resin composition containing a solvent is cast to form a film, and other conventionally known film molding methods.
- the extrusion molding method or the casting molding method is preferable because it can cope with the reduction in thickness.
- the film includes a sheet.
- a resin film which is a B stage film can be obtained by forming the resin composition into a film and drying it by heating, for example, at 50 to 150 ° C. for 1 to 10 minutes so that curing by heat does not proceed excessively. .
- the film-like resin composition that can be obtained by the drying process as described above is referred to as a B-stage film.
- the B-stage film is a film-shaped resin composition in a semi-cured state.
- the semi-cured product is not completely cured and curing can proceed further.
- the resin film may not be a prepreg.
- the resin film is not a prepreg, migration does not occur along a glass cloth or the like. Further, when laminating or precuring the resin film, the surface is not uneven due to the glass cloth.
- the said resin composition can be used suitably in order to form a laminated film provided with metal foil or a base material, and the resin film laminated
- the resin film in the laminated film is formed from the resin composition.
- the metal foil is preferably a copper foil.
- Examples of the substrate of the laminated film include polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide resin film.
- the surface of the base material may be subjected to a release treatment as necessary.
- the thickness of the insulating layer formed of the resin composition or the resin film is equal to or greater than the thickness of the conductor layer (metal layer) forming the circuit. It is preferable that The thickness of the insulating layer is preferably 5 ⁇ m or more, and preferably 200 ⁇ m or less.
- the resin composition and the resin film are suitably used for forming an insulating layer in a printed wiring board.
- the printed wiring board can be obtained, for example, by heat-pressing the resin film.
- a metal foil can be laminated on one side or both sides of the resin film.
- the method for laminating the resin film and the metal foil is not particularly limited, and a known method can be used.
- the resin film can be laminated on the metal foil using an apparatus such as a parallel plate press or a roll laminator while applying pressure while heating or without heating.
- the resin composition and the resin film are preferably used for obtaining a copper-clad laminate.
- An example of the copper-clad laminate includes a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil. The resin film of this copper-clad laminate is formed from the resin composition.
- the thickness of the copper foil of the copper-clad laminate is not particularly limited.
- the thickness of the copper foil is preferably in the range of 1 to 50 ⁇ m.
- the said copper foil has a fine unevenness
- the method for forming the unevenness is not particularly limited. Examples of the method for forming the unevenness include a formation method by treatment using a known chemical solution.
- the resin composition and the resin film are preferably used for obtaining a multilayer substrate.
- a multilayer substrate including a circuit substrate and an insulating layer stacked on the surface of the circuit substrate can be given.
- the insulating layer of this multilayer substrate is formed of the resin film using a resin film obtained by forming the resin composition into a film.
- the insulating layer of the multilayer substrate may be formed of the resin film of the laminated film using a laminated film.
- the insulating layer is preferably laminated on the surface of the circuit board on which the circuit is provided. Part of the insulating layer is preferably embedded between the circuits.
- the surface of the insulating layer opposite to the surface on which the circuit substrate is laminated is roughened.
- An appropriate roughening treatment method can be used as the roughening treatment method.
- the surface of the insulating layer may be subjected to a swelling treatment before the roughening treatment.
- the multilayer board preferably further includes a copper plating layer laminated on the roughened surface of the insulating layer.
- the circuit board, the insulating layer laminated on the surface of the circuit board, and the surface of the insulating layer opposite to the surface on which the circuit board is laminated are laminated.
- a multilayer substrate provided with copper foil The insulating layer and the copper foil are formed by curing the resin film using a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil.
- the copper foil is etched and is a copper circuit.
- the multilayer substrate is a multilayer substrate including a circuit board and a plurality of insulating layers stacked on the surface of the circuit board. At least one of the plurality of insulating layers arranged on the circuit board is formed using a resin film obtained by forming the resin composition into a film. It is preferable that the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.
- FIG. 1 is a cross-sectional view schematically showing a multilayer substrate using a resin composition according to an embodiment of the present invention.
- a plurality of insulating layers 13 to 16 are laminated on the upper surface 12 a of the circuit substrate 12.
- the insulating layers 13 to 16 are cured product layers.
- a metal layer 17 is formed in a partial region of the upper surface 12 a of the circuit board 12.
- the metal layer 17 is formed in a part of the upper surface of the insulating layers 13 to 15 other than the insulating layer 16 located on the outer surface opposite to the circuit board 12 side.
- the metal layer 17 is a circuit.
- Metal layers 17 are respectively arranged between the circuit board 12 and the insulating layer 13 and between the stacked insulating layers 13 to 16.
- the lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via hole connection and through hole connection (not shown).
- insulating layers 13 to 16 are formed of the resin composition.
- fine holes (not shown) are formed on the surfaces of the insulating layers 13 to 16.
- the metal layer 17 reaches the inside of the fine hole.
- the width direction dimension (L) of the metal layer 17 and the width direction dimension (S) of the part in which the metal layer 17 is not formed can be made small.
- good insulation reliability is imparted between an upper metal layer and a lower metal layer that are not connected by via-hole connection and through-hole connection (not shown).
- a roughening process may be performed, a swelling process may be performed, or a desmear process may be performed. It is preferable that the said resin composition is used in order to obtain the hardened
- the viscosity of the epoxy compound was determined using a viscometer (“TVE-33H” manufactured by Toki Sangyo Co., Ltd.) at 25 ° C. and 5 ° using 1 ° 34 ′ ⁇ R24 as a cone rotor. It was measured.
- Phenoxy resin-containing liquid (Mitsubishi Chemical "YX6954BH30", solid content 30 wt%)
- Examples 1 to 7 and Comparative Examples 1 to 6 The components shown in the following Tables 1 and 2 were blended in the blending amounts shown in the following Tables 1 and 2, and stirred at 1200 rpm for 1 hour using a stirrer to obtain a resin composition.
- the laminated film was heated at 190 ° C. for 90 minutes to produce a cured product in which the resin film was cured.
- Dielectric loss tangent is 0.0045 or less ⁇ : Dielectric loss tangent exceeds 0.0045, 0.005 or less ⁇ : Dielectric loss tangent exceeds 0.005
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Abstract
Description
上記樹脂組成物に含まれているエポキシ化合物は特に限定されない。該エポキシ化合物として、従来公知のエポキシ化合物を使用可能である。該エポキシ化合物は、少なくとも1個のエポキシ基を有する有機化合物をいう。上記エポキシ化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物に含まれている硬化剤は特に限定されない。該硬化剤として、従来公知の硬化剤を使用可能である。上記硬化剤は1種のみが用いられてもよく、2種以上が併用されてもよい。
上記熱可塑性樹脂としては、ポリビニルアセタール樹脂及びフェノキシ樹脂等が挙げられる。上記熱可塑性樹脂は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物は、無機充填材を含む。無機充填材の使用により、硬化物の熱による寸法変化がより一層小さくなる。また、硬化物の誘電正接がより一層小さくなる。
上記樹脂組成物は、硬化促進剤を含むことが好ましい。上記硬化促進剤の使用により、硬化速度がより一層速くなる。樹脂フィルムを速やかに硬化させることで、未反応の官能基数が減り、結果的に架橋密度が高くなる。上記硬化促進剤は特に限定されず、従来公知の硬化促進剤を使用可能である。上記硬化促進剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物は、溶剤を含まないか又は含む。上記溶剤の使用により、樹脂組成物の粘度を好適な範囲に制御でき、樹脂組成物の塗工性を高めることができる。また、上記溶剤は、上記無機充填材を含むスラリーを得るために用いられてもよい。上記溶剤は1種のみが用いられてもよく、2種以上が併用されてもよい。
耐衝撃性、耐熱性、樹脂の相溶性及び作業性等の改善を目的として、上記樹脂組成物には、レベリング剤、難燃剤、カップリング剤、着色剤、酸化防止剤、紫外線劣化防止剤、消泡剤、増粘剤、揺変性付与剤及びエポキシ化合物以外の他の熱硬化性樹脂等を添加してもよい。
上述した樹脂組成物をフィルム状に成形することにより樹脂フィルム(Bステージフィルム)が得られる。樹脂フィルムは、Bステージフィルムであることが好ましい。
上記樹脂組成物及び上記樹脂フィルムは、プリント配線板において絶縁層を形成するために好適に用いられる。
上記樹脂組成物及び上記樹脂フィルムは、銅張り積層板を得るために好適に用いられる。上記銅張り積層板の一例として、銅箔と、該銅箔の一方の表面に積層された樹脂フィルムとを備える銅張り積層板が挙げられる。この銅張り積層板の樹脂フィルムが、上記樹脂組成物により形成される。
ビフェニル型エポキシ樹脂(日本化薬社製「NC3000」、25℃で固形)
ジシクロペンタジエン型エポキシ樹脂(日本化薬社製「XD1000」、25℃で固形)
ジシクロペンタジエンジメタノールジグリシジルエーテル(ジシクロペンタジエン型エポキシ樹脂、ADEKA社製「EP-4088S」、25℃での粘度230mPa・s)
ジグリシジルアニリン(グリシジルアミン型エポキシ樹脂、日本化薬社製「GAN」、25℃での粘度130mPa・s)
ジグリシジルアニリン(グリシジルアミン型エポキシ樹脂、ADEKA社製「EP-3980S」、25℃での粘度30mPa・s)
シクロヘキサンジメタノールジグリシジルエーテル(ナガセケムテックス社製「EX-216L」、25℃での粘度55mPa・s)
レゾルシノールジグリシジルエーテル(ナガセケムテックス社製「EX-201-IM」、25℃での粘度400mPa・s)
ビスフェノールA型エポキシ樹脂(DIC社製「840-S」、25℃での粘度10000mPa・s)
ビスフェノールF型エポキシ樹脂(DIC社製「830-S」、25℃での粘度4000mPa・s)
活性エステル樹脂含有液(DIC社製「EXB-9416-70BK」、固形分70重量%)
イミダゾール化合物(四国化成工業社製「2P4MZ」)
フェノキシ樹脂含有液(三菱化学社製「YX6954BH30」、固形分30重量%)
アドマテックス社製「C4 シリカ」、固形分75重量%
下記の表1,2に示す成分を下記の表1,2に示す配合量で配合し、撹拌機を用いて1200rpmで1時間撹拌し、樹脂組成物を得た。
(1)カッター試験
縦10cm×横5cmの長方形に切り抜いた積層フィルムを用意した。この積層フィルムのBステージフィルム側に、カッターで縦方向に8cmの切込みを4本入れた。切断面を目視で観察し、チッピングの有無を確認した。
○:チッピングなし
×:チッピングあり
縦10cm×横5cmの長方形に切り抜いたBステージフィルムを用意した。このBステージフィルムを90度又は180度折り曲げた後に平面状に戻し、樹脂の状況を確認した。なお、180度に折り曲げた場合に、90度に折り曲げた場合よりも割れやすい。
○○:90度及び180度のいずれに曲げても割れなし
○:180度折り曲げると割れあり、かつ、90度折り曲げると割れなし
×:90度及び180度のいずれに曲げても割れあり
樹脂フィルムを幅2mm、長さ80mmの大きさに裁断して5枚を重ね合わせて、厚み200μmの積層体を得た。得られた積層体について、関東電子応用開発社製「空洞共振摂動法誘電率測定装置CP521」及びキーサイトテクノロジー社製「ネットワークアナライザーN5224A PNA」を用いて、空洞共振法で常温(23℃)にて、周波数1.0GHzにて誘電正接を測定した。
○○:誘電正接が0.0045以下
○:誘電正接が0.0045を超え、0.005以下
×:誘電正接が0.005を超える
上記硬化物(厚さ40μmの樹脂フィルムを使用)を3mm×25mmの大きさに裁断した。熱機械的分析装置(エスアイアイ・ナノテクノロジー社製「EXSTAR TMA/SS6100」)を用いて、引っ張り荷重33mN及び昇温速度5℃/分の条件で、裁断された硬化物の25℃~150℃までの平均線膨張係数(ppm/℃)を算出した。
○○:平均線膨張係数が25ppm/℃以下
○:平均線膨張係数が25ppm/℃を超え、30ppm/℃以下
×:平均線膨張係数が30ppm/℃を超える
12…回路基板
12a…上面
13~16…絶縁層
17…金属層
Claims (9)
- エポキシ化合物と、硬化剤と、無機充填材とを含み、
前記エポキシ化合物が、前記エポキシ化合物の全体100重量%中、25℃での粘度が500mPa・s以下である液状エポキシ化合物を1重量%以上、10重量%以下で含む、樹脂組成物。 - 樹脂組成物中の溶剤を除く成分100重量%中、前記無機充填材の含有量が60重量%以上である、請求項1に記載の樹脂組成物。
- 前記無機充填材がシリカを含む、請求項1又は2に記載の樹脂組成物。
- 前記硬化剤が、活性エステル化合物を含む、請求項1~3のいずれか1項に記載の樹脂組成物。
- 前記液状エポキシ化合物の25℃での粘度が10mPa・s以上である、請求項1~4のいずれか1項に記載の樹脂組成物。
- 前記液状エポキシ化合物が、脂環式構造、芳香族環構造を有するグリシジルアミン構造又はレゾルシノール構造を有する、請求項1~5のいずれか1項に記載の樹脂組成物。
- 前記液状エポキシ化合物が、ケイ素原子を含まない液体エポキシ化合物である、請求項1~6のいずれか1項に記載の樹脂組成物。
- 熱可塑性樹脂を含む、請求項1~7のいずれか1項に記載の樹脂組成物。
- 回路基板と、
前記回路基板上に配置された絶縁層とを備え、
前記絶縁層が、請求項1~8のいずれか1項に記載の樹脂組成物の硬化物である、多層基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020187001631A KR102637946B1 (ko) | 2015-09-30 | 2016-09-29 | 수지 조성물 및 다층 기판 |
CN201680044674.9A CN107849336B (zh) | 2015-09-30 | 2016-09-29 | 树脂组合物及多层基板 |
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JP2018002943A (ja) * | 2016-07-06 | 2018-01-11 | 日立化成株式会社 | エポキシ樹脂組成物及び電気電子部品の製造法 |
JP2018030981A (ja) * | 2016-08-26 | 2018-03-01 | 味の素株式会社 | 樹脂組成物 |
WO2018181813A1 (ja) * | 2017-03-31 | 2018-10-04 | 日立化成株式会社 | エポキシ樹脂組成物及び電子部品装置 |
KR20190020621A (ko) * | 2017-08-21 | 2019-03-04 | 아지노모토 가부시키가이샤 | 수지 조성물 |
JP2020029494A (ja) * | 2018-08-21 | 2020-02-27 | 日立化成株式会社 | 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置 |
JP7398028B1 (ja) * | 2022-06-08 | 2023-12-13 | 三菱瓦斯化学株式会社 | エポキシ樹脂組成物 |
WO2023238615A1 (ja) * | 2022-06-08 | 2023-12-14 | 三菱瓦斯化学株式会社 | エポキシ樹脂組成物 |
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WO2019189466A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
JPWO2019240083A1 (ja) * | 2018-06-12 | 2021-05-06 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
TW202043450A (zh) | 2018-11-15 | 2020-12-01 | 中國商深圳華大智造科技有限公司 | 用於集成傳感器盒的系統與方法 |
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JP2018030981A (ja) * | 2016-08-26 | 2018-03-01 | 味の素株式会社 | 樹脂組成物 |
JP7435665B2 (ja) | 2016-08-26 | 2024-02-21 | 味の素株式会社 | 樹脂組成物 |
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JP2020029494A (ja) * | 2018-08-21 | 2020-02-27 | 日立化成株式会社 | 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置 |
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WO2023238615A1 (ja) * | 2022-06-08 | 2023-12-14 | 三菱瓦斯化学株式会社 | エポキシ樹脂組成物 |
Also Published As
Publication number | Publication date |
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JPWO2017057561A1 (ja) | 2017-10-05 |
JP6832271B2 (ja) | 2021-02-24 |
KR20180063034A (ko) | 2018-06-11 |
KR102637946B1 (ko) | 2024-02-20 |
JP2018087336A (ja) | 2018-06-07 |
CN107849336B (zh) | 2023-11-10 |
TW201726802A (zh) | 2017-08-01 |
US20180213635A1 (en) | 2018-07-26 |
JP6461194B2 (ja) | 2019-01-30 |
TWI774644B (zh) | 2022-08-21 |
CN107849336A (zh) | 2018-03-27 |
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