JP6832271B2 - 樹脂組成物及び多層基板 - Google Patents
樹脂組成物及び多層基板 Download PDFInfo
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- JP6832271B2 JP6832271B2 JP2017246584A JP2017246584A JP6832271B2 JP 6832271 B2 JP6832271 B2 JP 6832271B2 JP 2017246584 A JP2017246584 A JP 2017246584A JP 2017246584 A JP2017246584 A JP 2017246584A JP 6832271 B2 JP6832271 B2 JP 6832271B2
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical group N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
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- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
上記樹脂組成物に含まれているエポキシ化合物は特に限定されない。該エポキシ化合物として、従来公知のエポキシ化合物を使用可能である。該エポキシ化合物は、少なくとも1個のエポキシ基を有する有機化合物をいう。上記エポキシ化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物に含まれている硬化剤は特に限定されない。該硬化剤として、従来公知の硬化剤を使用可能である。上記硬化剤は1種のみが用いられてもよく、2種以上が併用されてもよい。
上記熱可塑性樹脂としては、ポリビニルアセタール樹脂及びフェノキシ樹脂等が挙げられる。上記熱可塑性樹脂は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物は、無機充填材を含む。無機充填材の使用により、硬化物の熱による寸法変化がより一層小さくなる。また、硬化物の誘電正接がより一層小さくなる。
上記樹脂組成物は、硬化促進剤を含むことが好ましい。上記硬化促進剤の使用により、硬化速度がより一層速くなる。樹脂フィルムを速やかに硬化させることで、未反応の官能基数が減り、結果的に架橋密度が高くなる。上記硬化促進剤は特に限定されず、従来公知の硬化促進剤を使用可能である。上記硬化促進剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記樹脂組成物は、溶剤を含まないか又は含む。上記溶剤の使用により、樹脂組成物の粘度を好適な範囲に制御でき、樹脂組成物の塗工性を高めることができる。また、上記溶剤は、上記無機充填材を含むスラリーを得るために用いられてもよい。上記溶剤は1種のみが用いられてもよく、2種以上が併用されてもよい。
耐衝撃性、耐熱性、樹脂の相溶性及び作業性等の改善を目的として、上記樹脂組成物には、レベリング剤、難燃剤、カップリング剤、着色剤、酸化防止剤、紫外線劣化防止剤、消泡剤、増粘剤、揺変性付与剤及びエポキシ化合物以外の他の熱硬化性樹脂等を添加してもよい。
上述した樹脂組成物をフィルム状に成形することにより樹脂フィルム(Bステージフィルム)が得られる。樹脂フィルムは、Bステージフィルムであることが好ましい。
上記樹脂組成物及び上記樹脂フィルムは、プリント配線板において絶縁層を形成するために好適に用いられる。
上記樹脂組成物及び上記樹脂フィルムは、銅張り積層板を得るために好適に用いられる。上記銅張り積層板の一例として、銅箔と、該銅箔の一方の表面に積層された樹脂フィルムとを備える銅張り積層板が挙げられる。この銅張り積層板の樹脂フィルムが、上記樹脂組成物により形成される。
ビフェニル型エポキシ樹脂(日本化薬社製「NC3000」、25℃で固形)
ジシクロペンタジエン型エポキシ樹脂(日本化薬社製「XD1000」、25℃で固形)
ジシクロペンタジエンジメタノールジグリシジルエーテル(ジシクロペンタジエン型エポキシ樹脂、ADEKA社製「EP−4088S」、25℃での粘度230mPa・s)
ジグリシジルアニリン(グリシジルアミン型エポキシ樹脂、日本化薬社製「GAN」、25℃での粘度130mPa・s)
ジグリシジルアニリン(グリシジルアミン型エポキシ樹脂、ADEKA社製「EP−3980S」、25℃での粘度30mPa・s)
シクロヘキサンジメタノールジグリシジルエーテル(ナガセケムテックス社製「EX−216L」、25℃での粘度55mPa・s)
レゾルシノールジグリシジルエーテル(ナガセケムテックス社製「EX−201−IM」、25℃での粘度400mPa・s)
ビスフェノールA型エポキシ樹脂(DIC社製「840−S」、25℃での粘度10000mPa・s)
ビスフェノールF型エポキシ樹脂(DIC社製「830−S」、25℃での粘度4000mPa・s)
活性エステル樹脂含有液(DIC社製「EXB−9416−70BK」、固形分70重量%)
イミダゾール化合物(四国化成工業社製「2P4MZ」)
フェノキシ樹脂含有液(三菱化学社製「YX6954BH30」、固形分30重量%)
アドマテックス社製「C4 シリカ」、固形分75重量%
下記の表1,2に示す成分を下記の表1,2に示す配合量で配合し、撹拌機を用いて1200rpmで1時間撹拌し、樹脂組成物を得た。
(1)カッター試験
縦10cm×横5cmの長方形に切り抜いた積層フィルムを用意した。この積層フィルムのBステージフィルム側に、カッターで縦方向に8cmの切込みを4本入れた。切断面を目視で観察し、チッピングの有無を確認した。
○:チッピングなし
×:チッピングあり
縦10cm×横5cmの長方形に切り抜いたBステージフィルムを用意した。このBステージフィルムを90度又は180度折り曲げた後に平面状に戻し、樹脂の状況を確認した。なお、180度に折り曲げた場合に、90度に折り曲げた場合よりも割れやすい。
○○:90度及び180度のいずれに曲げても割れなし
○:180度折り曲げると割れあり、かつ、90度折り曲げると割れなし
×:90度及び180度のいずれに曲げても割れあり
樹脂フィルムを幅2mm、長さ80mmの大きさに裁断して5枚を重ね合わせて、厚み200μmの積層体を得た。得られた積層体について、関東電子応用開発社製「空洞共振摂動法誘電率測定装置CP521」及びキーサイトテクノロジー社製「ネットワークアナライザーN5224A PNA」を用いて、空洞共振法で常温(23℃)にて、周波数1.0GHzにて誘電正接を測定した。
○○:誘電正接が0.0045以下
○:誘電正接が0.0045を超え、0.005以下
×:誘電正接が0.005を超える
上記硬化物(厚さ40μmの樹脂フィルムを使用)を3mm×25mmの大きさに裁断した。熱機械的分析装置(エスアイアイ・ナノテクノロジー社製「EXSTAR TMA/SS6100」)を用いて、引っ張り荷重33mN及び昇温速度5℃/分の条件で、裁断された硬化物の25℃〜150℃までの平均線膨張係数(ppm/℃)を算出した。
○○:平均線膨張係数が25ppm/℃以下
○:平均線膨張係数が25ppm/℃を超え、30ppm/℃以下
×:平均線膨張係数が30ppm/℃を超える
12…回路基板
12a…上面
13〜16…絶縁層
17…金属層
Claims (8)
- エポキシ化合物と、硬化剤と、無機充填材とを含み、
前記エポキシ化合物が、25℃で固体のエポキシ化合物を含み、
前記エポキシ化合物が、前記エポキシ化合物の全体100重量%中、25℃での粘度が500mPa・s以下である液状エポキシ化合物を1重量%以上、10重量%以下で含み、
樹脂組成物中の溶剤を除く成分100重量%中、前記無機充填材の含有量が60重量%以上である、樹脂組成物。 - 前記無機充填材がシリカを含む、請求項1に記載の樹脂組成物。
- 前記硬化剤が、活性エステル化合物を含む、請求項1又は2に記載の樹脂組成物。
- 前記液状エポキシ化合物の25℃での粘度が10mPa・s以上である、請求項1〜3のいずれか1項に記載の樹脂組成物。
- 前記液状エポキシ化合物が、脂環式構造、芳香族環構造を有するグリシジルアミン構造又はレゾルシノール構造を有する、請求項1〜4のいずれか1項に記載の樹脂組成物。
- 前記液状エポキシ化合物が、ケイ素原子を含まない液体エポキシ化合物である、請求項1〜5のいずれか1項に記載の樹脂組成物。
- 熱可塑性樹脂を含む、請求項1〜6のいずれか1項に記載の樹脂組成物。
- 回路基板と、
前記回路基板上に配置された絶縁層とを備え、
前記絶縁層が、請求項1〜7のいずれか1項に記載の樹脂組成物の硬化物である、多層基板。
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JP2015195421 | 2015-09-30 |
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JP2018002943A (ja) * | 2016-07-06 | 2018-01-11 | 日立化成株式会社 | エポキシ樹脂組成物及び電気電子部品の製造法 |
JP7024174B2 (ja) * | 2016-08-26 | 2022-02-24 | 味の素株式会社 | 樹脂組成物 |
JP7212830B2 (ja) * | 2017-03-31 | 2023-01-26 | 株式会社レゾナック | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP6825517B2 (ja) * | 2017-08-21 | 2021-02-03 | 味の素株式会社 | 樹脂組成物 |
WO2019189466A1 (ja) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
KR20210019009A (ko) * | 2018-06-12 | 2021-02-19 | 세키스이가가쿠 고교가부시키가이샤 | 수지 재료 및 다층 프린트 배선판 |
JP2020029494A (ja) * | 2018-08-21 | 2020-02-27 | 日立化成株式会社 | 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置 |
CN113039263B (zh) | 2018-11-15 | 2024-05-24 | 深圳华大智造科技股份有限公司 | 用于集成的传感器盒的系统与方法 |
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JP4147454B2 (ja) * | 2002-02-28 | 2008-09-10 | Dic株式会社 | エポキシ樹脂組成物の予備硬化物、硬化物及びその製造方法 |
US20040202782A1 (en) * | 2003-04-14 | 2004-10-14 | General Electric Company | Methods for repairing insulating material |
JP4486841B2 (ja) * | 2004-03-29 | 2010-06-23 | 日東紡績株式会社 | ガラス繊維強化樹脂線状物及びその製造方法 |
WO2008010555A1 (fr) * | 2006-07-20 | 2008-01-24 | Sekisui Chemical Co., Ltd. | Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur |
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JP2010202727A (ja) * | 2009-03-02 | 2010-09-16 | Mitsubishi Rayon Co Ltd | 繊維強化複合材料用エポキシ樹脂組成物およびそれを用いた繊維強化複合材料 |
JP2014013825A (ja) * | 2012-07-04 | 2014-01-23 | Namics Corp | カメラモジュール用アンダーフィル剤 |
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JP6163803B2 (ja) * | 2013-03-14 | 2017-07-19 | 味の素株式会社 | 樹脂組成物 |
EP3049478B8 (en) * | 2013-09-26 | 2018-09-19 | Blue Cube IP LLC | A curable epoxy resin composition |
JP2015143302A (ja) | 2014-01-31 | 2015-08-06 | 日本ゼオン株式会社 | 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体 |
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JP6461194B2 (ja) | 2019-01-30 |
CN107849336B (zh) | 2023-11-10 |
JPWO2017057561A1 (ja) | 2017-10-05 |
TW201726802A (zh) | 2017-08-01 |
TWI774644B (zh) | 2022-08-21 |
JP2018087336A (ja) | 2018-06-07 |
WO2017057561A1 (ja) | 2017-04-06 |
KR102637946B1 (ko) | 2024-02-20 |
CN107849336A (zh) | 2018-03-27 |
US20180213635A1 (en) | 2018-07-26 |
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