WO2017045332A1 - 双面胶贴附装置及双面胶的贴附方法 - Google Patents

双面胶贴附装置及双面胶的贴附方法 Download PDF

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Publication number
WO2017045332A1
WO2017045332A1 PCT/CN2016/072417 CN2016072417W WO2017045332A1 WO 2017045332 A1 WO2017045332 A1 WO 2017045332A1 CN 2016072417 W CN2016072417 W CN 2016072417W WO 2017045332 A1 WO2017045332 A1 WO 2017045332A1
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WO
WIPO (PCT)
Prior art keywords
double
station
sided tape
robot
protective film
Prior art date
Application number
PCT/CN2016/072417
Other languages
English (en)
French (fr)
Inventor
章善财
侯程成
张月圆
李恒滨
胡明
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP16794916.3A priority Critical patent/EP3351496B1/en
Priority to US15/312,279 priority patent/US10399319B2/en
Publication of WO2017045332A1 publication Critical patent/WO2017045332A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G29/00—Rotary conveyors, e.g. rotating discs, arms, star-wheels or cones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

  • Embodiments of the present disclosure relate to a double-sided tape attaching device and a method of attaching a double-sided tape.
  • PCBA International: Printed Circuit Board Assembly, Chinese: printed circuit board
  • Embodiments of the present disclosure provide a double-sided tape attaching device and a method of attaching a double-sided tape.
  • a double-sided tape attaching device for attaching a double-sided tape to a back surface of a printed circuit board, the double-sided tape comprising a glue layer and a first layer on both sides of the glue layer a protective film and a second protective film
  • the double-sided tape attaching device comprising a driver, a table, and a robot disposed above the table; the robot connecting the driver to allow driving under the driver Laying the double-sided tape on a preset station of the workbench, tearing off the first protective film of the double-sided tape on the preset station, and printing the printing at the preset station
  • the circuit board is pressed against the double-sided tape on which the first protective film is torn off, and the printed circuit board to which the double-sided tape is attached is removed from the preset station;
  • the preset station is provided with a positioning mechanism to allow the adhesive layer and the second protective film to be fixed when the first protective film is torn off by the robot, and attached to the printed circuit board on the
  • the workbench is coupled to the driver to allow rotation under the drive of the driver;
  • the robot includes a double-sided adhesive robot and a circuit board robot;
  • the preset station includes a first station And a second station;
  • the double-sided adhesive robot is located at the first station to allow a double-sided adhesive to be placed when the table rotates a positioning mechanism to the first station On the positioning mechanism, tearing off the first protective film of the double-sided tape to expose the first adhesive surface;
  • the circuit board robot is located at the second station, allowing when the workbench is to be located When the double-sided tape of the first station is rotated to the second station, the printed circuit board is pressed against the first adhesive surface of the double-sided tape at the second station, and the double is attached The surface printed circuit board is removed from the second station.
  • the workbench is coupled to the driver for rotation under the driving of the driver;
  • the robot includes a first double-sided adhesive robot, a second double-sided adhesive robot, a first circuit board robot, a second circuit board robot;
  • the preset station includes a first station, a second station, a third station, and a fourth station;
  • the first double-sided adhesive robot is located at the first station, allowing When the worktable rotates a positioning mechanism to the first station, a double-sided adhesive is placed on the positioning mechanism;
  • the second double-sided adhesive robot is located at the second station, allowing When the working table rotates the double-sided tape located at the first station to the second station, the first protective film of the double-sided tape located at the second station is torn off to expose the first adhesive a rubber surface;
  • the first circuit board robot is located at the third station, allowing the printed circuit board to be printed when the work surface rotates the double-sided tape at the second station to the third station Pressing on the first adhesive surface of the double-sided tape at
  • the positioning mechanism includes a limiting slot disposed on the table, the limiting slot having a depth greater than a thickness of the double-sided tape.
  • the positioning mechanism further includes two positioning posts fixed to the bottom surface of the limiting slot, and configured to pass through the positioning holes at both ends of the double-sided tape.
  • the positioning mechanism further includes at least one lifting device located inside the workbench corresponding to the position of the limiting slot;
  • the lifting device includes a pneumatic rod and a pneumatic cylinder, and one end of the pneumatic rod is installed a piston, the piston is located in the pneumatic cylinder, and the other end of the gas pressure rod is provided with a suction cup;
  • a bottom surface of the limiting groove is provided with a through hole corresponding to the position of the gas pressure rod, allowing the gas pressure rod to be When passing through the through hole, the suction cup is brought into contact with the double-sided tape located in the limiting groove.
  • the positioning mechanism further includes a gas pressure source;
  • the gas pressure rod is provided with a gas passage, one end of the gas passage is in communication with a bottom of the suction cup, and the other end of the gas passage is opposite to the air pressure a source phase connected to allow reception of gas provided by the gas pressure source, or a gas in the gas passage is discharged to the air pressure source;
  • a gas inlet and outlet is disposed on a sidewall of the pneumatic cylinder, and the gas inlet and outlet are connected to the air pressure source to allow receiving the gas supplied by the air pressure source, Or discharging the gas in the pneumatic cylinder to the air pressure source.
  • a method for performing double-sided tape attachment by using any one of the above-mentioned double-sided tape attaching devices comprising: placing a double-sided tape on a preset station of a workbench by using a robot; Positioning mechanism fixes the rubber layer of the double-sided tape and the second protective film; the robot tears off the first protective film of the double-sided tape on the preset station; the robot is at the preset a station for pressing the printed circuit board on the double-sided tape that tears off the first protective film; the positioning mechanism releases the fixing of the adhesive layer and the second protective film; and the robot is attached A printed circuit board having the double-sided tape is removed from the preset station.
  • the method further includes: rotating the work table, a positioning mechanism is rotated to the first station; the double-sided adhesive robot at the first station places a double-sided tape on the positioning mechanism; the positioning mechanism is opposite to the double-sided tape
  • the rubber layer and the second protective film are fixed; the double-sided adhesive robot at the first station tears off the first protective film of the double-sided tape to expose the first adhesive surface; a table, rotating the double-sided tape at the first station to the second station; the circuit board robot at the second station pressing the printed circuit board to the second station a first adhesive surface of the double-sided tape; the positioning mechanism releases the fixing of the adhesive layer and the second protective film; and the circuit board robot at the second station is attached with a double The surface printed circuit board is removed from the second station.
  • the robot when the robot includes a first double-sided adhesive robot, a second double-sided adhesive robot, a first circuit board robot, and a second circuit board robot; the preset station includes a first station and a second The method, the third station and the fourth station, the method further includes: rotating the workbench to rotate a positioning mechanism to the first station; the first double-sided adhesive robot a double-sided tape is placed on the positioning mechanism; rotating the table to rotate the double-sided tape at the first station to the second station; the positioning mechanism is opposite to the double-sided tape The rubber layer and the second protective film are fixed; the second double-sided adhesive robot tears off the first protective film of the double-sided tape located at the second station to expose the first adhesive surface;
  • the first circuit board robot presses the printed circuit board to both sides of the third station The first adhesive surface of the glue;
  • the fixing of the rubber layer and the second protective film by the positioning mechanism includes: the air pressure source acts on the pneumatic cylinder through the gas inlet and outlet, so that The air pressure rod moves in a direction close to the second protective film of the double-sided tape, and the suction cup is in contact with the second protective film of the double-sided tape; the air source passes through the gas passage to discharge the gas between the suction cup and the second protective film So that the suction cup is adsorbed on the second protective film.
  • the positioning mechanism when the positioning mechanism includes a lifting device and a gas pressure source, the positioning mechanism releases the fixing of the rubber layer and the second protective film, including: the air pressure source passes through the gas passage, and the suction cup and the second protective film The air is inflated so that the suction cup is separated from the second protective film of the double-sided tape; the air pressure source acts on the air cylinder through the gas inlet and outlet, so that the air pressure rod moves in a direction away from the second protective film.
  • Embodiments of the present disclosure provide a double-sided tape attaching device and a double-sided tape attaching device configured to attach a double-sided tape on a back surface of a printed circuit board, the double-sided tape comprising a glue layer and The first protective film and the second protective film are respectively located on both sides of the adhesive layer.
  • the double-sided tape attaching device includes a driver, a table, and a robot disposed above the table. The robot is connected to the driver to allow the double-sided tape to be placed on the preset station of the workbench under the driving of the driver, and the first protective film of the double-sided tape on the preset station is torn off at the preset station.
  • the printed circuit board is pressed against the double-sided tape on which the first protective film is torn off, and the printed circuit board to which the double-sided tape is attached is removed from the preset station.
  • the preset station is provided with a positioning mechanism configured to fix the adhesive layer and the second protective film when the mechanical tearing off the first protective film, and release the adhesive when the double-sided adhesive is attached to the printed circuit board. The fixing of the layer and the second protective film.
  • FIG. 1 is a schematic structural view of a double-sided adhesive attaching device according to an embodiment of the present disclosure
  • FIG. 2a is a schematic structural view of the double-sided tape in the positioning mechanism of FIG. 1;
  • Figure 2b is a plan view of the double-sided tape of Figure 2a;
  • Figure 3a is a schematic structural view of the workbench of Figure 1 with four positioning mechanisms;
  • Figure 3b is a schematic structural view of the positioning mechanism on the workbench of Figure 1;
  • Figure 4a is a cross-sectional view taken along line O-O' of Figure 3b;
  • Figure 4b is a schematic structural view of the lifting device of Figure 4a;
  • FIG. 5 is a flowchart of a method for attaching a double-sided tape according to an embodiment of the present disclosure
  • Figure 6 is a flow chart of a double-sided tape attaching method using the double-sided tape sticking device shown in Figure 1;
  • Fig. 7 is a flow chart showing a method of attaching a double-sided tape using the double-sided tape attaching device shown in Fig. 3a.
  • Embodiments of the present disclosure provide a double-sided tape attaching device for attaching a double-sided tape to a back surface of a PCBA.
  • the double-sided tape 40 includes a glue layer 404 having two oppositely disposed adhesive faces, a first adhesive face A and a second adhesive face B, for the adhesive component.
  • a first protective film 401 and a second protective film 402 are respectively disposed on the first adhesive surface A and the second adhesive surface B for protecting the adhesive surface from contamination after the double-sided adhesive 40 is pasted with the component. Paste ability.
  • the double-sided tape attaching device may include a driver, a table, and a robot disposed above the table.
  • the robot is connected to the driver for placing the double-sided tape on the preset working position of the worktable under the driving of the driver, and tearing off the first protective film 401 of the double-sided tape on the preset station, at the preset station.
  • the PCBA is pressed against the double-sided tape 40 from which the first protective film 401 is torn off, and the PCBA to which the double-sided tape 40 is attached is removed from the preset station.
  • the positioning station is provided with a positioning mechanism for fixing the adhesive layer 404 and the second protective film 402 when the first protective film 401 is torn off by the robot, and when the double-sided adhesive 40 is attached to the PCBA, The fixing of the adhesive layer 404 and the second protective film 402 is released.
  • the lifting part of the robot in the embodiment of the present disclosure may be a vacuum suction cup.
  • the vacuum suction cup When the robot needs to extract the object, the vacuum suction cup may be vacuumed so that the suction cup is adsorbed on the surface of the object, and when the robot needs to be laid down
  • the vacuum chuck can be filled with gas to break the vacuum environment, so that the vacuum chuck can be separated from the surface of the object.
  • the vacuum chuck can be adsorbed on one end of the first protective film 401, that is, as shown in FIG. 2a, and adsorbed on the lower surface of the first protective film 401 without the adhesive layer 404.
  • the lifting parts of the above-mentioned manipulator can also be mechanical clips with higher precision and smaller size.
  • the specific structure of the manipulator is not limited in the present invention, as long as the double-sided tape 40 and the PCBA can be lifted and the protective film of the double-sided tape 40 can be removed.
  • the vacuum chuck is simple in operation and low in cost with respect to the mechanical chuck, and therefore, for example, a vacuum chuck is preferable as a lifting member of the robot.
  • An embodiment of the present disclosure provides a double-sided tape attaching device for attaching a double-sided tape to a back surface of a printed circuit board, the double-sided tape comprising a glue layer and a first protective film and a second layer respectively located on two sides of the glue layer Protective film.
  • the double-sided tape attaching device includes a driver, a table, and a robot disposed above the table.
  • the robot is connected to the driver for placing the double-sided tape on the preset working position of the worktable under the driving of the driver, and tearing off the first protective film of the double-sided tape on the preset station, at the preset station
  • the printed circuit board is pressed against the double-sided tape on which the first protective film is torn off, and the printed circuit board to which the double-sided tape is attached is removed from the preset station.
  • the preset station is provided with a positioning mechanism for fixing the adhesive layer and the second protective film when the first protective film is torn off by the robot, and releasing the adhesive when the double-sided adhesive is attached to the printed circuit board. The fixing of the layer and the second protective film.
  • the double-sided tape and the printed circuit board are lifted by the robot, and the first protective film for peeling off the double-sided tape is realized during the lifting process. And pressing the printed circuit board on the double-sided tape that tears off the first protective film. And the positioning mechanism can fix the second protective film and the rubber layer of the double-sided tape in the process of tearing off the first protective film by the robot, thereby preventing the manipulator from directly removing the double-sided tape from the preset during the process of tearing the protective film. Station. And when the robot needs to remove the printed circuit board with the double-sided tape attached from the workbench, the glue layer can be released. And fixing of the second protective film. Therefore, the above attachment process does not require manual operation, and thus the attachment efficiency can be improved. On the other hand, under the control of the driver, the alignment accuracy of the robot when attaching the double-sided tape is higher than that of the manual.
  • the attaching process of the robot to attach the double-sided tape 40 to the PCBA may include:
  • the double-sided tape 40 is grasped by a robot and placed on a preset station on the workbench.
  • the first protective film 401 on the double-sided tape 40 on the double-sided tape 40 close to the surface of the robot is removed by a robot.
  • the robot grabs the PCBA and presses the PCBA on the double-sided tape 40 that tears off the first protective film 401 at a preset station.
  • the robot removes the PCBA to which the double-sided tape 40 is attached from the table 20.
  • the present disclosure does not limit the number of robots. All of the above processes can be performed by one robot, and the above processes can be divided by a plurality of robots.
  • the above-described attaching process is described in detail by the above-described plurality of robots by way of an exemplary embodiment.
  • the robot in this embodiment includes a double-sided adhesive robot 301 and a circuit board robot 302.
  • the preset station includes a first station 1 and a second station 2.
  • the table 20 is coupled to the drive 10 for rotation under the drive of the drive 10. It is possible to rotate clockwise or counterclockwise, but the present disclosure is not limited thereto.
  • the double-sided adhesive robot 301 is located at the first station 1 for placing a double-sided tape 40 on the positioning mechanism 201 when the table 20 rotates a positioning mechanism 201 to the first station 1.
  • the first protective film 401 of the double-sided tape is peeled off to expose the first adhesive face A.
  • the circuit board robot 302 is located at the second station 2 for pressing the PCBA to the second station 2 when the table 40 rotates the double-sided tape 40 located at the first station 1 to the second station 2.
  • the first adhesive surface A of the glue 40 is attached, and the PCBA to which the double-sided tape 40 is attached is removed from the second station 2.
  • the double-sided adhesive robot 301 in this embodiment operates only on the double-sided tape 40, and the circuit board robot 302 operates only on the PCBA. This simplifies the manufacturing process by changing the inconvenience caused by the robot operating procedure when lifting objects of different weights.
  • two positioning mechanisms 201 can be disposed on the worktable 20, and each positioning mechanism 201 corresponds to one station. In this case, both robots can be in an operating state, thereby improving production efficiency.
  • the above-mentioned manipulator may include a first double-sided tape robot 303, a second double-sided tape robot 304, a first circuit board robot 305, and a second circuit board robot 306.
  • the preset station includes a first station 1, a second station 2, a third station 3, and a fourth station 4.
  • the table 20 is coupled to the drive 10 for rotation under the drive of the drive 10.
  • the first double-sided adhesive robot 303 is located at the first station 1 for placing a double-sided tape 40 on the positioning mechanism 201 when the table 20 rotates a positioning mechanism 201 to the first station 1.
  • the second double-sided adhesive robot 304 is located at the second station 2 for being used on the double side of the second station 2 when the table 20 rotates the double-sided tape located at the first station 1 to the second station 2
  • the first protective film 401 of the glue 40 is peeled off to expose the first adhesive face A.
  • the first circuit board robot 305 is located at the third station 3 for pressing the PCBA to the third station when the table 20 rotates the double-sided tape 40 located at the second station 2 to the third station 3. 3 on the first adhesive surface A of the double-sided tape 40.
  • the second circuit board robot 306 is located at the fourth station 4 for rotating the double-sided tape 40 located at the third station 3 to the fourth station 4 when the table 40 is used, and the PCBA to which the double-sided tape 40 is attached is The fourth station 4 is removed.
  • each robot is more versatile than that of the first embodiment, so that the manipulation is easier.
  • four positioning mechanisms 201 are disposed on the worktable 20, and each positioning mechanism 201 corresponds to one station. In this case, the four robots can all be in the working state, and the above four processes are respectively performed, thereby further Increased production efficiency.
  • the positioning mechanism 201 can include a limiting slot 211 disposed on the table 20 as shown in FIG. 3b. Therefore, the position of the double-sided tape 40 can be restricted in the limiting groove 211.
  • the present disclosure does not limit the manner in which the limiting slot 211 is disposed, and may be disposed laterally or vertically on the working platform.
  • the preferred limiting groove 211 can be disposed along the radial direction of the table 20, and the four double-sided tapes 40 are respectively located in the four limiting slots 211 as shown in FIG. 3a.
  • the limit slots 211 correspond to station 1, station 2, station 3 and station 4. In this way, for a table provided with a plurality of, for example, four limiting slots 211, the upper surface of the table 201 is more effectively utilized to avoid dimensional interference between adjacent limiting slots 211.
  • the width and length of the limiting groove 211 are generally set to be slightly larger than the width and length of the double-sided tape 40.
  • a positioning hole 403 may be provided at each end of the double-sided tape 40.
  • the positioning mechanism 201 may further include two positioning posts 212 fixed to the bottom surface of the limiting slot 211.
  • the positions of the two positioning posts 212 correspond to the positions of the double-sided tape 40, so that the positioning post 212 can pass through the positioning holes 403 at both ends of the double-sided tape 40.
  • the size of the PCBA is large relative to the double-sided tape 40. Therefore, when the robot 30 presses the PCBA against the double-sided tape 40, the remaining portion of the PCBA to which the double-sided tape 40 is not attached is brought into contact with the upper surface D of the table 20 as shown in FIG. Therefore, if the upper surface of the double-sided tape 40 (i.e., the surface of the first protective film 401) protrudes from the upper surface D of the table 20, since the thickness of the first protective film 401 is small, when the first protective film 401 is torn off Thereafter, the first adhesive face A is also higher than the upper surface D of the table 20.
  • the upper surface of the double-sided tape 40 i.e., the surface of the first protective film 401
  • the protruding double-sided tape may make the lower surface of the PCBA not be able to be leveled with the upper surface D of the table 20, thereby causing uneven stress on the PCBA. Prone to damage.
  • the depth of the limiting groove 211 may be greater than the thickness of the double-sided tape 40, so that when the suction cup 504 is adsorbed on the lower surface of the double-sided tape 40 (ie, the surface of the second protective film 402), the double-sided tape
  • the upper surface i.e., the surface of the first protective film 401 is lower than the upper surface D of the table (as shown in Fig. 1).
  • the positioning mechanism 201 is shown in Fig. 4a (a cross-sectional view taken along line O-O in Fig. 3b), and further includes at least one lifting device 50 located inside the table 20 corresponding to the position of the limiting groove 211.
  • the lifting device 50 can include a pneumatic rod 501 and a pneumatic cylinder 502.
  • a piston 503 is attached to one end of the pneumatic rod 501, a piston 503 is located in the pneumatic cylinder 502, and a suction cup 504 is attached to the other end of the pneumatic rod 501.
  • the bottom surface of the limiting slot 211 is provided with a through hole (not shown) corresponding to the position of the air pressure lever 501, and the suction cup 504 can be located in the limiting slot of the 211 when the air pressure rod 501 passes through the through hole. Double-sided tape contact.
  • the positioning mechanism can act on the piston 503 through the air pressure in the pneumatic cylinder 502 during the process of tearing off the first protective film by the robot, so that the piston 503 pushes the pneumatic rod 501 upward, and the suction cup 504 can pass through the through hole.
  • the second protective film 402 on the second adhesive surface B of the double-sided adhesive 40, so that the double-sided adhesive 40 is adsorbed on the suction cup 504, so that the second protective film 402 and the adhesive of the double-sided adhesive 40
  • the layer 404 is fixed to prevent the robot from directly taking the double-sided tape 40 away from the preset station during the process of tearing off the protective film.
  • the robot grabs the PCBA and presses the PCBA against the double-sided tape 40 of the first protective film 401 according to the set pasting position
  • the air pressure in the pneumatic cylinder 502 can be applied.
  • the piston 503 when the piston 503 pushes the air pressure lever 501 to move upward, the double-sided adhesive 40 can move upward, and at this time, the robot presses the PCBA to move downward, so that the upper and lower surfaces of the double-sided adhesive 40 are stressed, which is favorable for providing Its adhesion to PCBA.
  • the air pressure bar 501 is moved downward by the air pressure in the air cylinder 502, so that the suction cup 504 is no longer adsorbed on the double-sided tape 40, so that it is convenient in the next fourth process.
  • the robot 30 removes the PCBA to which the double-sided tape 40 is attached from the table 20. Thereby, the fixing of the adhesive layer 404 and the second protective film 402 is released.
  • the double-sided tape attaching device may further include a gas pressure source (not shown).
  • the air pressure source can be an air compressor.
  • a gas inlet and outlet 505 may be provided.
  • the gas inlet and outlet 505 is connected to the above-mentioned air pressure source for receiving the gas supplied from the air pressure source or discharging the gas in the air cylinder 502 to the air pressure source.
  • the gas in and out of the gas pressure bar 201 is different in the direction in which it enters and exits.
  • the position of the gas inlet and outlet 505 is above the piston 503 (C position as shown in FIG. 4b)
  • the piston 503 when the piston 503 is required to move upward to push the gas pressure rod 501 upward, the suction cup 504 is attracted to the double-sided tape.
  • the above air pressure source needs to extract the gas in the pneumatic cylinder 502 so that the gas is discharged to the air pressure source through the gas inlet and outlet 502.
  • the piston 503 is required to move downward to push the pneumatic rod 501 downward so that the suction cup 504 is disengaged from the double-sided tape 40
  • the above-mentioned air pressure source needs to supply gas into the pneumatic cylinder 502.
  • the above air pressure source needs to supply gas into the pneumatic cylinder 502.
  • the piston 503 is required to move downward to push the pneumatic rod 501 downward so that the suction cup 504 is disengaged from the double-sided tape 40
  • the above-mentioned air pressure source needs to withdraw the gas in the pneumatic cylinder 502, so that the gas passes through the gas inlet and outlet 502 to the air pressure source.
  • the air pressure source can supply gas to one gas inlet and outlet 505, and pass through another place.
  • the gas inlet and outlet 505 discharges the gas in the pneumatic cylinder 502.
  • the direction of the gas in and out is the same as the direction of movement of the gas pressure rod 501, and will not be described herein.
  • a gas passage 506 may be disposed on the gas pressure lever 501 as shown in FIG. 4b.
  • One end of the gas passage 506 is in communication with the bottom of the suction cup 504, and the other end of the gas passage 506 is
  • the gas pressure source is connected to receive gas supplied from a gas pressure source or to discharge gas in the gas passage 506 to the gas pressure source.
  • the air source discharges the air between the suction cup 504 and the second protective film 402 of the double-sided tape 40 to the air pressure source through the gas passage 506.
  • gas may be supplied into the gas passage 506 through the air pressure source so that the gas is filled between the suction cup 504 and the second protective film 402 of the double-sided tape 40.
  • Embodiments of the present disclosure provide a method for performing double-sided tape attachment using any of the double-sided tape attachment devices described above, as shown in FIG. 5, including:
  • the robot places the double-sided tape 40 on a preset station of the worktable 20.
  • the positioning mechanism 201 fixes the glue layer 404 and the second protection film 402 of the double-sided tape 40.
  • the robot removes the first protective film 401 of the double-sided tape 40 on the preset station.
  • the robot presses the PCBA on the double-sided tape 40 that tears off the first protective film 401 at a preset station.
  • the positioning mechanism 201 releases the fixing of the adhesive layer 404 and the second protective film 402.
  • the robot removes the PCBA to which the double-sided tape 40 is attached from the preset station.
  • the double-sided tape and the printed circuit board are lifted by the robot, and the first protective film for peeling off the double-sided tape is realized during the lifting process. And pressing the printed circuit board on the double-sided tape that tears off the first protective film. And the positioning mechanism can fix the second protective film and the rubber layer of the double-sided tape in the process of tearing off the first protective film by the robot, thereby preventing the manipulator from directly removing the double-sided tape from the preset during the process of tearing the protective film. Station.
  • the robot needs to remove the printed circuit board to which the double-sided tape is attached from the workbench, the fixing of the adhesive layer and the second protective film can be released. Therefore, the above attachment process does not require manual operation, and thus the attachment efficiency can be improved.
  • the alignment accuracy of the robot when attaching the double-sided tape is higher than that of the manual.
  • the robot in this embodiment includes a double-sided adhesive robot 301 and a circuit board robot 302.
  • the preset station includes a first station 1 and a second station 2.
  • the method includes:
  • the table 20 rotates to rotate a positioning mechanism 201 to the first station 1.
  • the double-sided adhesive robot 301 located at the first station 1 places a double-sided tape 40 on the positioning mechanism 201.
  • the positioning mechanism 201 fixes the adhesive layer 404 and the second protective film 402 of the double-sided tape 40.
  • the table 20 rotates to rotate the double-sided tape 40 located at the first station 1 to the second station 2.
  • the circuit board robot 302 at the second station 2 presses the PCBA to the second station. 2 on the first adhesive surface A of the double-sided tape 40.
  • the positioning mechanism 201 releases the fixing of the adhesive layer 404 and the second protective film 402.
  • the circuit board robot 302 at the second station 2 removes the PCBA to which the double-sided tape 40 is attached from the second station 2.
  • the double-sided tape 40 or PCBA will not be damaged.
  • the robot will not be able to lift the PCBA by the force of the double-sided tape 40, and the manipulator will easily damage the double-sided tape 40 when the double-sided tape 40 is lifted by the force of the PCBA. Therefore, the double-sided adhesive robot 301 in this embodiment operates only on the double-sided tape 40, and the circuit board robot 302 operates only on the PCBA. This simplifies the manufacturing process by changing the inconvenience caused by the robot operating procedure when lifting objects of different weights.
  • two positioning mechanisms 201 can be disposed on the worktable 20, and each positioning mechanism 201 corresponds to one station. In this case, both robots can be in an operating state, thereby improving production efficiency.
  • the above-mentioned manipulator may include a first double-sided tape robot 303, a second double-sided tape robot 304, a first circuit board robot 305, and a second circuit board robot 306.
  • the preset station includes a first station 1, a second station 2, a third station 3, and a fourth station 4.
  • the method includes:
  • the table 20 rotates to rotate a positioning mechanism 201 to the first station 1.
  • the first double-sided tape robot 303 places a double-sided tape 40 on the positioning mechanism 201.
  • the table 20 rotates to rotate the double-sided tape 40 located at the first station 1 to the second station 2.
  • the positioning mechanism 201 fixes the glue layer 404 and the second protection film 402 of the double-sided tape 40.
  • the second double-sided adhesive robot 304 tears off the first protective film 404 of the double-sided tape 40 located at the second station 2 to expose the first adhesive surface A.
  • the first circuit board robot 305 presses the PCBA to the double-sided adhesive 40 at the third station 3 A on the first adhesive surface.
  • the positioning mechanism 201 releases the fixing of the adhesive layer 404 and the second protective film 402.
  • the second circuit board robot 306 removes the PCBA to which the double-sided tape 40 is attached from the fourth station 4.
  • each robot is more versatile than that of the third embodiment, so that the manipulation is easier.
  • four positioning mechanisms 201 are disposed on the worktable 20, and each positioning mechanism 201 corresponds to one station. In this case, the four robots can all be in the working state, and the above four processes are respectively performed, thereby further Increased production efficiency.
  • the fixing of the adhesive layer 404 and the second protective film 402 by the positioning mechanism 201 includes:
  • the air pressure source acts on the air cylinder 502 through the gas inlet and outlet, so that the air pressure rod 501 moves toward the second protective film 402 of the double-sided tape 40, and the suction cup 504 is in contact with the second protective film 402 of the double-sided tape 40.
  • the air pressure source can supply gas to one gas inlet and outlet 505, and pass through another place.
  • the gas inlet and outlet 505 discharges the gas in the pneumatic cylinder 502.
  • the direction of the gas in and out is the same as the direction of movement of the gas pressure rod 501, and will not be described herein.
  • the air pressure source discharges the gas between the suction cup 504 and the second protective film 402 through the gas passage 506 as shown in FIG. 4b, so that the suction cup 504 is adsorbed on the second protective film 402.
  • the fixing mechanism 201 releases the fixing of the adhesive layer 404 and the second protective film 402 to include:
  • the air pressure source is inflated between the suction cup 504 and the second protective film 402 of the double-sided tape 40 through the gas passage, so that the suction cup 504 is separated from the second protective film 402 of the double-sided tape 40.
  • the air pressure source acts on the pneumatic cylinder 502 through the gas inlet and outlet, so that the gas pressure lever 501 moves in a direction away from the second protective film 402.
  • the gas in and out of the gas pressure bar 201 is different in the direction in which it enters and exits.
  • the position of the gas inlet and outlet 505 is above the piston 503 (C position as shown in FIG. 4b)
  • the piston 503 is required to move downward (ie, the gas pressure lever 501 is moved away from the second protective film 402).
  • the above air pressure source needs to supply gas to the pneumatic cylinder 502.
  • the air pressure source can supply gas to one gas inlet and outlet 505, and pass through another place.
  • the gas inlet and outlet 505 discharges the gas in the pneumatic cylinder 502.
  • the direction of the gas in and out is the same as the direction of movement of the gas pressure rod 501, and will not be described herein.
  • the double-sided tape and the printed circuit board are lifted by the robot, and the first protective film for peeling off the double-sided tape is removed during the lifting process, and the printed circuit board is pressed.
  • On the double-sided tape of the first protective film is peeled off.
  • the positioning mechanism can fix the second protective film and the rubber layer of the double-sided tape in the process of tearing off the first protective film by the robot, thereby preventing the robot from directly taking the double-sided tape away from the preset work in the process of tearing the protective film. Bit.
  • the fixing of the adhesive layer and the second protective film can be released.
  • the above attachment process does not require manual operation, and thus the attachment efficiency can be improved.
  • the alignment accuracy of the robot when attaching the double-sided tape is higher than that of the manual.

Abstract

一种双面胶贴附装置，包括驱动器（10）、工作台（20）以及设置于所述工作台（20）上方的机械手（301，302）。机械手（301，302）连接驱动器（10），以允许将双面胶（40）放置于工作台（20）的预设工位上，将预设工位上的双面胶（40）的第一保护膜（401）撕掉，在预设工位将印刷电路板按压于撕掉第一保护膜（401）的双面胶（40）上，将贴附有双面胶（40）的印刷电路板从预设工位上取下。预设工位上设置有定位机构（201），用于在机械手（301，302）撕掉第一保护膜（401）时，对胶层和第二保护膜（402）进行固定，并在双面胶（40）贴附于印刷电路板上时，解除对胶层和第二保护膜（402）的固定。该贴附装置能够提高贴附效率和精度。还公开了一种双面胶的贴附方法。

Description

双面胶贴附装置及双面胶的贴附方法 技术领域
本公开的实施例涉及一种双面胶贴附装置及双面胶的贴附方法。
背景技术
在电子产品的制备过程中，PCBA(英文：Printed Circuit Board Assembly，中文：印刷电路板)作为电子元件的支撑体，其应用十分广泛。为了使得PCBA能够与电子产品的整机系统进行固定和共地。需要在PCBA的背面贴附双面胶或者双面导电胶。
现有技术中，一般通过人工在PCBA的背面贴附双面胶。但是人工贴附存在精度和效率较低的问题。
发明内容
本公开的实施例提供一种双面胶贴附装置及双面胶的贴附方法。
本公开的实施例采用如下技术方案：
根据本公开的实施例，提供一种双面胶贴附装置，用于在印刷电路板的背面贴附双面胶，所述双面胶包括胶层以及分别位于所述胶层两侧的第一保护膜和第二保护膜，所述双面胶贴附装置包括驱动器、工作台以及设置于所述工作台上方的机械手；所述机械手连接所述驱动器，以允许在所述驱动器的驱动下将所述双面胶放置于所述工作台的预设工位上、将所述预设工位上的双面胶的第一保护膜撕掉、在所述预设工位将所述印刷电路板按压于撕掉第一保护膜的双面胶上，以及将贴附有所述双面胶的印刷电路板从所述预设工位上取下；所述预设工位上设置有定位机构，以允许在所述机械手撕掉所述第一保护膜时，对所述胶层和所述第二保护膜进行固定，并在所述双面胶贴附于所述印刷电路板上时，解除对所述胶层和所述第二保护膜的固定。
在一示例中，所述工作台连接所述驱动器，以允许在所述驱动器的驱动下进行旋转；所述机械手包括双面胶机械手和电路板机械手；所述预设工位包括第一工位和第二工位；所述双面胶机械手位于所述第一工位，以允许当所述工作台将一定位机构旋转至所述第一工位时，将一双面胶放置 于所述定位机构上，并将所述双面胶的第一保护膜撕掉，露出第一粘胶面；所述电路板机械手位于所述第二工位，允许当所述工作台将位于所述第一工位的双面胶旋转至所述第二工位时，将印刷电路板按压于所述第二工位处双面胶的第一粘胶面上，并将贴附有双面胶的印刷电路板从所述第二工位处取下。
在一示例中，所述工作台连接所述驱动器，用于在所述驱动器的驱动下进行旋转；所述机械手包括第一双面胶机械手、第二双面胶机械手、第一电路板机械手、第二电路板机械手；所述预设工位包括第一工位、第二工位、第三工位以及第四工位；所述第一双面胶机械手位于所述第一工位，允许当所述工作台将一定位机构旋转至所述第一工位时，将一双面胶放置于所述定位机构上；所述第二双面胶机械手位于所述第二工位，允许当所述工作台将位于所述第一工位的双面胶旋转至所述第二工位时，将位于所述第二工位的双面胶的第一保护膜撕掉，露出第一粘胶面；所述第一电路板机械手位于所述第三工位，允许当所述工作台将位于所述第二工位的双面胶旋转至所述第三工位时，将印刷电路板按压于所述第三工位处双面胶的第一粘胶面上；所述第二电路板机械手位于所述第四工位，允许当所述工作台将位于所述第三工位的双面胶旋转至第四工位，将贴附有双面胶的印刷电路板从所述第四工位处取下。
在一示例中，所述定位机构包括设置于所述工作台上的限位槽，所述限位槽的深度大于所述双面胶的厚度。
在一示例中，所述定位机构还包括固定于所述限位槽底面的两个定位柱，配置来穿过所述双面胶两端的定位孔。
在一示例中，所述定位机构还包括位于所述工作台内部，对应所述限位槽位置的至少一个升降装置；所述升降装置包括气压杆以及气压缸，所述气压杆的一端安装有活塞，所述活塞位于所述气压缸内，所述气压杆的另一端安装有吸盘；所述限位槽的底面设置有与所述气压杆位置相对应的过孔，允许在所述气压杆穿过所述过孔时，使得吸盘与位于所述限位槽中的双面胶接触。
在一示例中，所述定位机构还包括气压源；所述气压杆上设置有气体通道，所述气体通道的一端与所述吸盘的底部相连通，所述气体通道的另一端与所述气压源相连接，以允许接收所述气压源提供的气体，或将所述 气体通道中的气体排向所述气压源；所述气压缸的侧壁上设置有气体进出口，所述气体进出口与所述气压源相连接，以允许接收所述气压源提供的气体，或将所述气压缸中的气体排向所述气压源。
根据本公开的实施例，提供一种利用上述任意一种双面胶贴附装置进行双面胶贴附的方法，包括：利用机械手将双面胶放置于工作台的预设工位上；利用定位机构对所述双面胶的胶层和第二保护膜进行固定；所述机械手将所述预设工位上的双面胶的第一保护膜撕掉；所述机械手在所述预设工位，将所述印刷电路板按压于撕掉第一保护膜的双面胶上；所述定位机构解除对所述胶层和所述第二保护膜的固定；以及所述机械手将贴附有所述双面胶的印刷电路板从所述预设工位上取下。
在一示例中，当所述机械手包括双面胶机械手和电路板机械手，所述预设工位包括第一工位和第二工位时，所述方法还包括：旋转所述工作台，将一定位机构旋转至所述第一工位；位于所述第一工位的所述双面胶机械手将一双面胶放置于所述定位机构上；所述定位机构对所述双面胶的胶层和所述第二保护膜进行固定；位于所述第一工位的所述双面胶机械手将所述双面胶的第一保护膜撕掉，露出第一粘胶面；旋转所述工作台，将位于所述第一工位的双面胶旋转至所述第二工位；位于所述第二工位的所述电路板机械手将印刷电路板按压于所述第二工位处双面胶的第一粘胶面上；所述定位机构解除对所述胶层和所述第二保护膜的固定；以及位于所述第二工位的所述电路板机械手将贴附有双面胶的印刷电路板从所述第二工位处取下。
在一示例中，当所述机械手包括第一双面胶机械手、第二双面胶机械手、第一电路板机械手、第二电路板机械手；所述预设工位包括第一工位、第二工位、第三工位以及第四工位时，所述方法还包括：旋转所述工作台，将一所述定位机构旋转至所述第一工位；所述第一双面胶机械手将一双面胶放置于所述定位机构上；旋转所述工作台，将位于所述第一工位的双面胶旋转至所述第二工位；所述定位机构对所述双面胶的胶层和所述第二保护膜进行固定；所述第二双面胶机械手将位于所述第二工位的双面胶的第一保护膜撕掉，露出第一粘胶面；
旋转所述工作台，将位于所述第二工位的双面胶旋转至所述第三工位；
所述第一电路板机械手将所述印刷电路板按压于所述第三工位处双面 胶的第一粘胶面上；
旋转所述工作台，将位于所述第三工位的双面胶旋转至第四工位；所述定位机构解除对所述胶层和所述第二保护膜的固定；以及所述第二电路板机械手将贴附有双面胶的印刷电路板从所述第四工位处取下。
在一示例中，在所述定位机构包括升降装置和气压源时，所述定位机构对所述胶层和第二保护膜的固定包括：所述气压源通过气体进出口作用于气压缸，使得气压杆向靠近所述双面胶第二保护膜的方向运动，吸盘与所述双面胶的第二保护膜相接触；气压源通过气体通道，将吸盘与第二保护膜之间的气体排出，使得吸盘吸附于所述第二保护膜上。
在一示例中，在所述定位机构包括升降装置和气压源时，所述定位机构解除对所述胶层和第二保护膜的固定包括：气压源通过气体通道，向吸盘与第二保护膜之间充气，使得吸盘脱离所述双面胶的第二保护膜；所述气压源通过气体进出口作用于气压缸，使得气压杆向远离所述第二保护膜的方向运动。
本公开实施例提供一种双面胶贴附装置及双面胶的贴附方法，双面胶贴附装置配置来在印刷电路板的背面贴附双面胶，该双面胶包括胶层以及分别位于胶层两侧的第一保护膜和第二保护膜。该双面胶贴附装置包括驱动器、工作台以及设置于所述工作台上方的机械手。机械手连接驱动器，以允许在驱动器的驱动下将双面胶放置于工作台的预设工位上、将预设工位上的双面胶的第一保护膜撕掉、在预设工位将印刷电路板按压于撕掉第一保护膜的双面胶上，以及将贴附有双面胶的印刷电路板从预设工位上取下。预设工位上设置有定位机构，配置来在机械手撕掉第一保护膜时，对胶层和第二保护膜进行固定，并在双面胶贴附于印刷电路板上时，解除对胶层和第二保护膜的固定。
附图说明
以下将结合附图对本公开的实施例进行更详细的说明，以使本领域普通技术人员更加清楚地理解本公开的实施例，其中：
图1为本公开实施例提供的一种双面胶贴附装置的结构示意图；
图2a为图1中位于定位机构中双面胶的结构示意图；
图2b为图2a中双面胶的俯视图；
图3a为图1中工作台上设置有四个定位机构的结构示意图；
图3b为图1中工作台上定位机构的结构示意图；
图4a为图3b中沿O-O’进行剖切得到的剖视图；
图4b为图4a中升降装置的结构示意图；
图5为本公开实施例提供的一种双面胶贴附方法的流程图；
图6为利用图1所示的双面胶贴附装置进行双面胶贴附方法的流程图；
图7为利用图3a所示的双面胶贴附装置进行双面胶贴附方法的流程图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在无需做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
除非另作定义，本文使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其它元件或者物件。“上”、“下”、等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开实施例提供一种双面胶贴附装置，用于在PCBA的背面贴附双面胶。该双面胶40如图2a所示，包括胶层404，该胶层404具有两个相对设置的粘胶面，第一粘胶面A和第二粘胶面B，用于粘贴部件。在第一粘胶面A和第二粘胶面B上分别设置有第一保护膜401和第二保护膜402，用于在双面胶40粘贴部件前保护上述粘胶面不受到污染而降低粘贴能力。
该双面胶贴附装置可以包括驱动器、工作台以及设置于工作台上方的机械手。
机械手连接驱动器，用于在驱动器的驱动下将双面胶放置于工作台的预设工位上、将预设工位上的双面胶的第一保护膜401撕掉、在预设工位， 将PCBA按压于撕掉第一保护膜401的双面胶40上，以及将贴附有双面胶40的PCBA从预设工位上取下。
上述预设工位上设置有定位机构，用于在机械手撕掉第一保护膜401时，对胶层404和第二保护膜402进行固定，并在双面胶40贴附于PCBA上时，解除对胶层404和第二保护膜402的固定。
需要说明的是，本公开实施例中的机械手的提放部件可以是真空吸盘，当机械手需要提取物件时，可以对真空吸盘进行抽真空处理，使得吸盘吸附于物件的表面，而当机械手需要放下物件时，可以向真空吸盘中充入气体，破坏真空环境，从而使得真空吸盘能够脱离物件表面。此外，机械手在撕去第一保护膜401时，可以将上述真空吸盘吸附在第一保护膜401的一端，即如图2a所示，吸附于第一保护膜401下方没有设置胶层404的位置，从而当机械手向上运动时，可以使得第一保护膜401脱离于第一粘胶面A。此外上述机械手的提放部件还可以为精度较高，尺寸较小的机械夹。本发明对机械手的具体结构不做限定，只要能够实现对双面胶40和PCBA进行提放，以及将双面胶40的保护膜撕去即可。但真空吸盘相对于机械夹而言操作简单成本低，因此，例如，优选真空吸盘作为机械手的提放部件。
本公开实施例提供一种双面胶贴附装置，用于在印刷电路板的背面贴附双面胶，该双面胶包括胶层以及分别位于胶层两侧的第一保护膜和第二保护膜。该双面胶贴附装置包括驱动器、工作台以及设置于所述工作台上方的机械手。机械手连接驱动器，用于在驱动器的驱动下将双面胶放置于工作台的预设工位上、将预设工位上的双面胶的第一保护膜撕掉、在预设工位将印刷电路板按压于撕掉第一保护膜的双面胶上，以及将贴附有双面胶的印刷电路板从预设工位上取下。预设工位上设置有定位机构，用于在机械手撕掉第一保护膜时，对胶层和第二保护膜进行固定，并在双面胶贴附于印刷电路板上时，解除对胶层和第二保护膜的固定。
这样一来，一方面，在整个双面胶的贴附过程中，由机械手对双面胶和印刷电路板进行提放，并在提放的过程中实现撕去双面胶的第一保护膜，并将印刷电路板按压于撕掉第一保护膜的双面胶上。并且定位机构可以在机械手撕掉第一保护膜的过程中，对双面胶的第二保护膜和胶层进行固定，防止机械手在撕保护膜的过程中将双面胶直接拿离于预设工位。并在机械手需要将贴附有双面胶的印刷电路板从工作台上取下时，能够解除对胶层 和第二保护膜的固定。因此上述贴附过程无需人工操作，因此能够提高贴附效率。另一方面，在驱动器的控制下，机械手贴附双面胶时的对位精度相对于人工而言较高。
需要说明的是，机械手将双面胶40贴附于PCBA上的贴附工序可以包括：
第一工序，通过机械手抓取双面胶40，并将其放置于工作台上的预设工位上。
第二工序，通过机械手将双面胶40上靠近机械手的一粘胶面(以下实施例均是以第一粘胶面A靠近机械手为例)上的第一保护膜401撕去。
第三工序，机械手抓取PCBA，并在预设工位将PCBA按压于撕掉第一保护膜401的双面胶40上。
第四工序，机械手将贴附好双面胶40的PCBA从工作台20上取下。
在此基础上，本公开对机械手的数量不做限定。可以采用一个机械手完成上述所有工序，还可以通过多个机械手对上述工序进行分工。以下通过示例的实施例对上述多个机械手实现上述贴附工序进行详细的举例说明。
实施例一
本实施例中机械手如图1所示，包括双面胶机械手301和电路板机械手302，上述预设工位包括第一工位①和第二工位②。
在此情况下，工作台20连接驱动器10，用于在驱动器10的驱动下进行旋转。可以顺时针旋转还可以逆时针旋转，但是本公开并不限于此。
基于此，双面胶机械手301位于第一工位①，用于当工作台20将一定位机构201旋转至第一工位①时，将一双面胶40放置于定位机构201上，并将双面胶的第一保护膜401撕掉，露出第一粘胶面A。
电路板机械手302位于第二工位②，用于当工作台40将位于第一工位①的双面胶40旋转至第二工位②时，将PCBA按压于第二工位②处双面胶40的第一粘胶面A上，并将贴附有双面胶40的PCBA从所述第二工位②处取下。
由于双面胶40和PCBA的重量相差较大，因此采用一个机械手对双面胶40和PCBA进行提放时，需要设置不同的程序，以控制机械手能够具有 适当的力度，在实现提放双面胶40或PCBA的前提下，不会破坏双面胶40或PCBA。例如如果不更改程序，那么机械手采用提放双面胶40的力度将无法提放PCBA，而机械手采用提放PCBA的力度提放双面胶40时将容易损坏双面胶40。因此，本实施例中的双面胶机械手301只对双面胶40进行操作，而电路板机械手302只对PCBA进行操作。从而避免了在提放不同重量的物件时，更改机械手操作程序带来的不便，简化了制作工艺。
此外，本实施例中在工作台20上可以设置两个定位机构201，且每个定位机构201对应一个工位，在此情况下，两个机械手可以均处于工作状态，从而提高了生产效率。
实施例二
本实施例中上述机械手如图3a所示，可以包括第一双面胶机械手303、第二双面胶机械手304、第一电路板机械手305、第二电路板机械手306。所述预设工位包括第一工位①、第二工位②、第三工位③以及第四工位④。
在此情况下，工作台20连接驱动器10，用于在驱动器10的驱动下进行旋转。
基于此，第一双面胶机械手303位于第一工位①，用于当工作台20将一定位机构201旋转至第一工位①时，将一双面胶40放置于定位机构201。
第二双面胶机械手304位于第二工位②，用于当工作台20将位于第一工位①的双面胶旋转至第二工位②时，将位于第二工位②的双面胶40的第一保护膜401撕掉，露出第一粘胶面A。
第一电路板机械手305位于第三工位③，用于当工作台20将位于第二工位②的双面胶40旋转至第三工位③时，将PCBA按压于所述第三工位③处双面胶40的第一粘胶面A上。
第二电路板机械手306位于第四工位④，用于当工作台40将位于第三工位③的双面胶40旋转至第四工位④，将贴附有双面胶40的PCBA从所述第四工位④处取下。
这样一来，每个机械手的执行的动作相对于实施例一而言，功能更加单一，因此操控更容易。此外，在工作台20上设置有四个定位机构201，且每个定位机构201对应一个工位，在此情况下，四个机械手可以均处于工作状态，同时分别执行上述四个工序，从而进一步提高了生产效率。
无论对于上述实施例一或上述实施例二而言，上述定位机构201如图3b所示，可以包括设置于工作台20上的限位槽211。从而可以将双面胶40的位置限制于限位槽211内。
需要说明的是，本公开对限位槽211的设置方式不做限制，可以在工作台上横向或纵向设置。对于长度较长的双面胶40而言，优选的限位槽211可以沿工作台20的半径方向设置，如图3a所示四个双面胶40分别位于四个限位槽211中，四个限位槽211分别对应工位①，工位②，工位③以及工位④。这样一来，对于设置有多个，例如四个限位槽211的工作台而言，更有效的利用工作台201的上表面，避免相邻限位槽211之间发生尺寸干涉。
此外，为了便于机械手30易于将双面胶40放置于上述限位槽211内，通常设置限位槽211的宽度和长度略大于双面胶40的宽度和长度。然而这样一来，表面PCBA按压于双面胶第一粘胶面A上时，会造成双面胶40在限位槽211内发生移动，从而降低了贴附对位精度。因此，为了更好的对双面胶40的位置进行限定，如图2b(图2a的俯视图)所示，可以在双面胶40的两端各设置一个定位孔403。
在此情况下，如图3b所示，上述定位机构201还可以包括固定于限位槽211底面的两个定位柱212。上述两个定位柱212的位置与双面胶40的位置相对应，从而使得定位柱212能够穿过该双面胶40两端的定位孔403。
例如，由于PCBA的尺寸相对于双面胶40而言很大。因此机械手30将PCBA按压于双面胶40上时，未贴附双面胶40的PCBA其余部分会与如图1所示的工作台20的上表面D相接触。因此，如果双面胶40的上表面(即第一保护膜401的表面)凸出于工作台20的上表面D，由于第一保护膜401的厚度较小，当第一保护膜401撕掉后，第一粘胶面A也会高于工作台20的上表面D。这样一来，机械手30将PCBA按压于双面胶40上时，凸出的双面胶会使得PCBA的下表面不能够与工作台20上表面D平整的基础，从而造成PCBA受力不均匀，易发生损坏。
为了解决上述问题，上述限位槽211的深度可以大于双面胶40的厚度，使得吸盘504吸附在双面胶40的下表面(即第二保护膜402的表面)时，所述双面胶的上表面(即第一保护膜401的表面)低于工作台的上表面D(如图1所示)。
在此基础上，定位机构201如图4a所示(图3b中沿O-O’剖切得到的剖视图)，还包括位于工作台20内部，对应限位槽211位置的至少一个升降装置50。
例如，如图4b所示，升降装置50可以包括气压杆501以及气压缸502。气压杆501的一端安装有活塞503，活塞503位于气压缸502内，气压杆501的另一端安装有吸盘504。
限位槽211的底面设置有与气压杆501位置相对应的过孔(图中未示出)，用于在气压杆501穿过上述过孔时，吸盘504能够与位于211限位槽内的双面胶接触。
这样一来，定位机构可以在机械手撕掉第一保护膜的过程中，可以通过气压缸502中的气压作用于活塞503，使得活塞503推动气压杆501向上运动，吸盘504能够穿过上述过孔，并与位于双面胶40的第二粘胶面B上的第二保护膜402相接触，使得双面胶40吸附于吸盘504上，从而对双面胶40的第二保护膜402和胶层404进行固定，防止机械手在撕保护膜的过程中将双面胶40直接拿离于预设工位。
接下来，在上述第三工序，即机械手抓取PCBA，并根据设定的粘贴位置，将PCBA按压于撕掉第一保护膜401的双面胶40上时，气压缸502中的气压可以作用于活塞503，使得活塞503推动气压杆501向上进一步运动时，双面胶40能够向上运动，而此时机械手按压PCBA向下运动，从而使得双面胶40上下两个表面均受力，利于提供其与PCBA的粘合力。
此外，当上述第三工序结束后，气压缸502中气压的作用下，气压杆501向下运动，使得吸盘504不再吸附于双面胶40上，从而在接下来的第四工序中，便于机械手30将贴附有双面胶40的PCBA从工作台20上取下。从而解除对胶层404和第二保护膜402的固定。
在此基础上，为了方便对气压缸502中的气压的方向进行控制，上述双面胶贴附装置还可以包括一气压源(图中未示出)。该气压源可以为空气压缩机。
基于此，气压缸502的侧壁上如图4b所示，可以设置有气体进出口505。该气体进出口505与上述气压源相连接，用于接收气压源提供的气体，或将气压缸502中的气体排向该气压源。
需要说明的是，当气压缸502的侧壁上只设置有一个气体进出口505 时，上述气体进出口505的位置不同时，作用气压杆201的气体的进出方向不同。例如，在气体进出口505的位置位于活塞503的上方(如图4b所示的C位置)的情况下，当需要活塞503向上运动，以推动气压杆501向上，使得吸盘504吸附于双面胶40上时，上述气压源需要将气压缸502中的气体抽出，使得气体通过气体进出口502排向该气压源。当需要活塞503向下运动，以推动气压杆501向下，使得吸盘504脱离双面胶40时，上述气压源需要向气压缸502中提供气体。
或者，在气体进出口505的位置位于活塞503的下方(如图4b所示的C’位置)的情况下，当需要活塞503向上运动，以推动气压杆501向上，使得吸盘504吸附于双面胶40上时，上述气压源需要向气压缸502中提供气体。当需要活塞503向下运动，以推动气压杆501向下，使得吸盘504脱离双面胶40时，上述气压源需要将气压缸502中的气体抽出，使得气体通过气体进出口502向该气压源。
此外，当气压缸502的侧壁上分别在图4b的C处和C’处均设置有一个气体进出口505时，气压源可以向一处的气体进出口505提供气体，而通过另一处气体进出口505将气压缸502中的气体排出。气体的进出方向与气压杆501的运动方向同上所述，此处不再赘述。
例如，为了便于对吸盘504进行控制，气压杆501上，如图4b所示，可以设置有气体通道506，所述气体通道506的一端与吸盘504的底部相连通，气体通道506的另一端与上述气压源相连接，用于接收气压源提供的气体，或将气体通道506中的气体排向所述气压源。例如，当需要将吸盘504吸附于双面胶40上时，气压源将吸盘504与双面胶40的第二保护膜402之间的空气，通过气体通道506排向所述气压源。此外，当需要将吸盘504从双面胶40上脱离时，可以通过气压源向气体通道506内提供气体，使得上述气体充入吸盘504与双面胶40的第二保护膜402之间。从而能够实现吸盘504的自动吸附和脱开。
本公开实施例提供一种利用如上所述的任意一种双面胶贴附装置进行双面胶贴附的方法，如图5所示，包括：
S101、机械手将双面胶40放置于工作台20的预设工位上。
S102、定位机构201对双面胶40的胶层404和第二保护膜402进行固定。
S103、机械手将预设工位上的双面胶40的第一保护膜401撕掉。
S104、机械手在预设工位，将PCBA按压于撕掉第一保护膜401的双面胶40上。
S105、定位机构201解除对胶层404和第二保护膜402的固定。
S106、机械手将贴附有双面胶40的PCBA从预设工位上取下。
这样一来，一方面，在整个双面胶的贴附过程中，由机械手对双面胶和印刷电路板进行提放，并在提放的过程中实现撕去双面胶的第一保护膜，并将印刷电路板按压于撕掉第一保护膜的双面胶上。并且定位机构可以在机械手撕掉第一保护膜的过程中，对双面胶的第二保护膜和胶层进行固定，防止机械手在撕保护膜的过程中将双面胶直接拿离于预设工位。并在机械手需要将贴附有双面胶的印刷电路板从工作台上取下时，能够解除对胶层和第二保护膜的固定。因此上述贴附过程无需人工操作，因此能够提高贴附效率。另一方面，在驱动器的控制下，机械手贴附双面胶时的对位精度相对于人工而言较高。
在此基础上，上述机械手的数量不同时，双面胶的贴附方法也不尽相同。以下对多个机械手实现上述贴附双面胶的方法进行详细的举例说明。
实施例三
本实施例中机械手如图1所示，包括双面胶机械手301和电路板机械手302，上述预设工位包括第一工位①和第二工位②。
在此情况下，所述方法，如图6所示，包括：
S201、工作台20进行旋转，将一定位机构201旋转至第一工位①。
S202、位于第一工位①的双面胶机械手301将一双面胶40放置于定位机构201上。
S203、定位机构201对双面胶40的胶层404和第二保护膜402进行固定。
S204、位于第一工位①的所述双面胶机械手301将双面胶40的第一保护膜401撕掉，露出第一粘胶面A。
S205、工作台20进行旋转，将位于第一工位①的双面胶40旋转至第二工位②。
S206、位于第二工位②的电路板机械手302将PCBA按压于第二工位 ②处双面胶40的第一粘胶面A上。
S207、定位机构201解除对胶层404和第二保护膜402的固定。
S208、位于第二工位②的电路板机械手302将贴附有双面胶40的PCBA从第二工位②处取下。
由于双面胶40和PCBA的重量相差较大，因此采用一个机械手对双面胶40和PCBA进行提放时，需要设置不同的程序，以控制机械手能够具有适当的力度再实现提放双面胶40或PCBA的前提下，不会破坏双面胶40或PCBA。例如如果不更改程序，那么机械手采用提放双面胶40的力度将无法提放PCBA，而机械手采用提放PCBA的力度提放双面胶40时将容易损坏双面胶40。因此，本实施例中的双面胶机械手301只对双面胶40进行操作，而电路板机械手302只对PCBA进行操作。从而避免了在提放不同重量的物件时，更改机械手操作程序带来的不便，简化了制作工艺。
此外，本实施例中在工作台20上可以设置两个定位机构201，且每个定位机构201对应一个工位，在此情况下，两个机械手可以均处于工作状态，从而提高了生产效率。
实施例四
本实施例中上述机械手如图3a所示，可以包括第一双面胶机械手303、第二双面胶机械手304、第一电路板机械手305、第二电路板机械手306。所述预设工位包括第一工位①、第二工位②、第三工位③以及第四工位④。
在此情况下，所述方法，如图7所示，包括：
S301、工作台20旋转，将一定位机构201旋转至第一工位①。
S302、第一双面胶机械手303将一双面胶40放置于定位机构201上。
S303、工作台20旋转，将位于第一工位①的双面胶40旋转至第二工位②。
S304、定位机构201对双面胶40的胶层404和第二保护膜402进行固定。
S305、第二双面胶机械手304将位于第二工位②的双面胶40的第一保护膜404撕掉，露出第一粘胶面A。
S306、工作台旋转，将位于第二工位②的双面胶40旋转至第三工位③。
S307、第一电路板机械手305将PCBA按压于第三工位③处双面胶40 的第一粘胶面上A。
S308、工作台20旋转，将位于第三工位③的双面胶40旋转至第四工位④。
S309、定位机构201解除对胶层404和第二保护膜402的固定。
S310、第二电路板机械手306将贴附有双面胶40的PCBA从所述第四工位④处取下。
这样一来，每个机械手的执行的动作相对于实施例三而言，功能更加单一，因此操控更容易。此外，在工作台20上设置有四个定位机构201，且每个定位机构201对应一个工位，在此情况下，四个机械手可以均处于工作状态，同时分别执行上述四个工序，从而进一步提高了生产效率。
无论对于上述实施例三或上述实施例四而言，定位机构201包括升降装置50和气压源时，该定位机构201对胶层404和第二保护膜402的固定包括：
首选，上述气压源通过气体进出口作用于气压缸502，使得气压杆501向靠近双面胶40第二保护膜402的方向运动，吸盘504与双面胶40的第二保护膜402相接触。
需要说明的是，当气压缸502的侧壁上只设置有一个气体进出口505时，上述气体进出口505的位置不同时，作用气压杆201的气体的进出方向不同。例如，在气体进出口505的位置位于活塞503的上方(如图4b所示的C位置)的情况下，当需要活塞503向上运动(即使得气压杆501向靠近双面胶40第二保护膜402的方向运动)，以推动气压杆501向上，使得吸盘504与双面胶40的第二保护膜402相接触时，上述气压源需要将气压缸502中的气体抽出，使得气体通过气体进出口502向该气压源。
或者，在气体进出口505的位置位于活塞503的下方(如图4b所示的C’位置)的情况下，当需要活塞503向上运动，以推动气压杆501向上，使得吸盘504与双面胶40的第二保护膜402相接触时时，上述气压源需要向气压缸502中提供气体。
此外，当气压缸502的侧壁上分别在图4b的C处和C’处均设置有一个气体进出口505时，气压源可以向一处的气体进出口505提供气体，而通过另一处气体进出口505将气压缸502中的气体排出。气体的进出方向与气压杆501的运动方向同上所述，此处不再赘述。
在此基础上，接下来，气压源通过如图4b所示的气体通道506，将吸盘504与第二保护膜402之间的气体排出，使得吸盘504吸附于第二保护膜402上。
此外，在定位机构201包括升降装置50和气压源时，该定位机构201解除对胶层404和第二保护膜402的固定包括：
首选，气压源通过气体通道，向吸盘504与双面胶40的第二保护膜402之间充气，使得吸盘504脱离该双面胶40的第二保护膜402。
在此基础上，接下来，气压源通过气体进出口作用于气压缸502，使得气压杆501向远离第二保护膜402的方向运动。
例如，当气压缸502的侧壁上只设置有一个气体进出口505时，上述气体进出口505的位置不同时，作用气压杆201的气体的进出方向不同。例如，在气体进出口505的位置位于活塞503的上方(如图4b所示的C位置)的情况下，当需要活塞503向下运动(即使得气压杆501向远离第二保护膜402的方向运动)，上述气压源需要向气压缸502提供气体。
或者，在气体进出口505的位置位于活塞503的下方(如图4b所示的C’位置)的情况下，当需要活塞503向下运动上述气压源需要将气压缸502中的气体排出。
此外，当气压缸502的侧壁上分别在图4b的C处和C’处均设置有一个气体进出口505时，气压源可以向一处的气体进出口505提供气体，而通过另一处气体进出口505将气压缸502中的气体排出。气体的进出方向与气压杆501的运动方向同上所述，此处不再赘述。
在整个双面胶的贴附过程中，由机械手对双面胶和印刷电路板进行提放，并在提放的过程中实现撕去双面胶的第一保护膜，并将印刷电路板按压于撕掉第一保护膜的双面胶上。定位机构可以在机械手撕掉第一保护膜的过程中，对双面胶的第二保护膜和胶层进行固定，防止机械手在撕保护膜的过程中将双面胶直接拿离于预设工位。而且，在机械手需要将贴附有双面胶的印刷电路板从工作台上取下时，能够解除对胶层和第二保护膜的固定。上述贴附过程无需人工操作，因此能够提高贴附效率。此外，在驱动器的控制下，机械手贴附双面胶时的对位精度相对于人工而言较高。
以上所述，仅为本公开的示例性的实施例和实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的普通技术人员在本公开揭露 的技术范围内，可轻易想到的变化或替换都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。
本申请要求于2015年09月16日提交的名称为“一种双面胶贴附装置及双面胶的贴附方法”的中国专利申请No.201510591922.9的优先权，其全文通过引用合并于本文。

Claims (12)

  1. 一种双面胶贴附装置，用于在印刷电路板的上贴附双面胶，其中，所述双面胶包括胶层以及分别位于所述胶层两侧的第一保护膜和第二保护膜；所述双面胶贴附装置包括驱动器、工作台以及设置于所述工作台上方的机械手；
    所述机械手连接所述驱动器，以允许在所述驱动器的驱动下将所述双面胶放置于所述工作台的预设工位上、将所述预设工位上的双面胶的第一保护膜撕掉、在所述预设工位将所述印刷电路板按压于撕掉第一保护膜的双面胶上，以及将贴附有所述双面胶的印刷电路板从所述预设工位上取下；以及
    所述预设工位上设置有定位机构，配置来在所述机械手撕掉所述第一保护膜时，对所述胶层和所述第二保护膜进行固定，并在所述双面胶贴附于所述印刷电路板上时，解除对所述胶层和所述第二保护膜的固定。
  2. 根据权利要求1所述的双面胶贴附装置，其中，所述工作台连接所述驱动器，以允许在所述驱动器的驱动下进行旋转；
    所述机械手包括双面胶机械手和电路板机械手；所述预设工位包括第一工位和第二工位；
    所述双面胶机械手位于所述第一工位，以允许当所述工作台将一定位机构旋转至所述第一工位时，将一双面胶放置于所述定位机构上，并将所述双面胶的第一保护膜撕掉，露出第一粘胶面；以及
    所述电路板机械手位于所述第二工位，以允许当所述工作台将位于所述第一工位的双面胶旋转至所述第二工位时，将印刷电路板按压于所述第二工位处双面胶的第一粘胶面上，并将贴附有双面胶的印刷电路板从所述第二工位处取下。
  3. 根据权利要求1所述的双面胶贴附装置，其中，所述工作台连接所述驱动器，以允许在所述驱动器的驱动下进行旋转；
    所述机械手包括第一双面胶机械手、第二双面胶机械手、第一电路板机械手、第二电路板机械手；所述预设工位包括第一工位、第二工位、第三工位以及第四工位；
    所述第一双面胶机械手位于所述第一工位，以允许当所述工作台将一 定位机构旋转至所述第一工位时，将一双面胶放置于所述定位机构上；
    所述第二双面胶机械手位于所述第二工位，以允许当所述工作台将位于所述第一工位的双面胶旋转至所述第二工位时，将位于所述第二工位的双面胶的第一保护膜撕掉，露出第一粘胶面；
    所述第一电路板机械手位于所述第三工位，以允许当所述工作台将位于所述第二工位的双面胶旋转至所述第三工位时，将印刷电路板按压于所述第三工位处双面胶的第一粘胶面上；以及
    所述第二电路板机械手位于所述第四工位，以允许当所述工作台将位于所述第三工位的双面胶旋转至第四工位，将贴附有双面胶的印刷电路板从所述第四工位处取下。
  4. 根据权利要求1-3任一项所述的双面胶贴附装置，其中，所述定位机构包括设置于所述工作台上的限位槽，所述限位槽的深度大于所述双面胶的厚度。
  5. 根据权利要求4所述的双面胶贴附装置，其中，所述定位机构还包括固定于所述限位槽底面的两个定位柱，配置来穿过所述双面胶两端的定位孔。
  6. 根据权利要求4或5所述的双面胶贴附装置，其中，所述定位机构还包括位于所述工作台内部，对应所述限位槽位置的至少一个升降装置；
    所述升降装置包括气压杆以及气压缸，所述气压杆的一端安装有活塞，所述活塞位于所述气压缸内，所述气压杆的另一端安装有吸盘；以及
    所述限位槽的底面设置有与所述气压杆位置相对应的过孔，配置来在所述气压杆穿过所述过孔时，使得吸盘与位于所述限位槽中的双面胶接触。
  7. 根据权利要求6所述的双面胶贴附装置，其中，所述定位机构还包括气压源；
    所述气压杆上设置有气体通道，所述气体通道的一端与所述吸盘的底部相连通，所述气体通道的另一端与所述气压源相连接，以允许接收所述气压源提供的气体，或将所述气体通道中的气体排向所述气压源；以及
    所述气压缸的侧壁上设置有气体进出口，所述气体进出口与所述气压源相连接，以允许接收所述气压源提供的气体，或将所述气压缸中的气体排向所述气压源。
  8. 一种利用如权利要求1-7任一项所述的双面胶贴附装置进行双面胶 贴附的方法，包括：
    利用机械手将双面胶放置于工作台的预设工位上；
    利用定位机构对所述双面胶的胶层和第二保护膜进行固定；
    利用所述机械手将所述预设工位上的双面胶的第一保护膜撕掉；
    利用所述机械手，在所述预设工位，将所述印刷电路板按压于撕掉第一保护膜的双面胶上；
    利用所述定位机构解除对所述胶层和所述第二保护膜的固定；以及
    利用所述机械手将贴附有所述双面胶的印刷电路板从所述预设工位上取下。
  9. 根据权利要求8所述的双面胶贴附的方法，还包括，当所述机械手包括双面胶机械手和电路板机械手，所述预设工位包括第一工位和第二工位时，旋转所述工作台，将一定位机构旋转至所述第一工位；
    利用位于所述第一工位的所述双面胶机械手将一双面胶放置于所述定位机构上；
    利用所述定位机构将所述双面胶的胶层和所述第二保护膜进行固定；
    利用位于所述第一工位的所述双面胶机械手将所述双面胶的第一保护膜撕掉，露出第一粘胶面；
    旋转所述工作台，将位于所述第一工位的双面胶旋转至所述第二工位；
    利用位于所述第二工位的所述电路板机械手将印刷电路板按压于所述第二工位处、双面胶的第一粘胶面上；
    利用所述定位机构解除对所述胶层和所述第二保护膜的固定；以及
    利用位于所述第二工位的所述电路板机械手将贴附有双面胶的印刷电路板从所述第二工位处取下。
  10. 根据权利要求8所述的双面胶贴附的方法，还包括：当所述机械手包括第一双面胶机械手、第二双面胶机械手、第一电路板机械手、第二电路板机械手；所述预设工位包括第一工位、第二工位、第三工位以及第四工位时，旋转所述工作台，将一所述定位机构旋转至所述第一工位；
    利用所述第一双面胶机械手将一双面胶放置于所述定位机构上；
    旋转所述工作台，将位于所述第一工位的双面胶旋转至所述第二工位；
    利用所述定位机构对所述双面胶的胶层和所述第二保护膜进行固定；
    利用所述第二双面胶机械手将位于所述第二工位的双面胶的第一保护 膜撕掉，露出第一粘胶面；
    旋转所述工作台，将位于所述第二工位的双面胶旋转至所述第三工位；
    利用所述第一电路板机械手将所述印刷电路板按压于所述第三工位处双面胶的第一粘胶面上；
    旋转所述工作台，将位于所述第三工位的双面胶旋转至第四工位；
    利用所述定位机构解除对所述胶层和所述第二保护膜的固定；以及
    利用所述第二电路板机械手将贴附有双面胶的印刷电路板从所述第四工位处取下。
  11. 根据权利要求8-10任一项所述的双面胶贴附的方法，其中在所述定位机构包括升降装置和气压源时，所述定位机构对所述胶层和第二保护膜的固定，包括：
    所述气压源通过气体进出口作用于气压缸，使得气压杆向靠近所述双面胶第二保护膜的方向运动，吸盘与所述双面胶的第二保护膜相接触；
    气压源通过气体通道，将吸盘与第二保护膜之间的气体排出，使得吸盘吸附于所述第二保护膜上。
  12. 根据权利要求8-10任一项所述的双面胶贴附的方法，其中，在所述定位机构包括升降装置和气压源时，所述定位机构解除对所述胶层和第二保护膜的固定包括：
    气压源通过气体通道，向吸盘与第二保护膜之间充气，使得吸盘脱离所述双面胶的第二保护膜；以及
    所述气压源通过气体进出口作用于气压缸，使得气压杆向远离所述第二保护膜的方向运动。
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