WO2016136964A1 - 配線体、配線基板、配線構造体、及びタッチセンサ - Google Patents
配線体、配線基板、配線構造体、及びタッチセンサ Download PDFInfo
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- WO2016136964A1 WO2016136964A1 PCT/JP2016/055893 JP2016055893W WO2016136964A1 WO 2016136964 A1 WO2016136964 A1 WO 2016136964A1 JP 2016055893 W JP2016055893 W JP 2016055893W WO 2016136964 A1 WO2016136964 A1 WO 2016136964A1
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- wiring
- terminal portion
- resin layer
- terminal
- connection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Definitions
- the present invention relates to a wiring body, a wiring board, a wiring structure, and a touch sensor.
- a wiring body a wiring board
- a wiring structure a wiring structure
- a touch sensor a touch sensor
- a transparent touch panel formed by laminating a glass substrate and a transparent film each having a transparent electrode formed thereon is known (see, for example, Patent Document 1).
- the transparent film in order to take out the circuit of the transparent electrode on the glass substrate side, the transparent film is cut, and the glass substrate side transparent electrode extraction circuit provided on the transparent film is connected to the transparent electrode on the glass substrate side. And it takes out from a transparent film by thermocompression-bonding between the connection part formed in the said taking-out circuit and the transparent electrode by the side of a glass substrate with an anisotropic conductive adhesive.
- the transparent electrode on the glass substrate side must be once connected to the transparent film via the anisotropic conductive adhesive, it is inferior in durability and take-out property.
- the problem to be solved by the present invention is to provide a wiring body, a wiring board, a wiring structure, and a touch sensor that are excellent in the ability to take out wiring.
- a wiring body includes a first resin layer, a first terminal portion, a first conductor layer provided on the first resin layer, and at least the first conductor layer.
- the first conductor layer further includes a mesh-shaped first electrode portion
- the second conductor layer further includes a mesh-shaped second electrode portion
- the first electrode part and the first terminal part may be integrally formed
- the second electrode part and the second terminal part may be integrally formed.
- the maximum thickness of the second resin layer may be larger than the maximum thickness of the first conductor layer.
- the maximum thickness of the second resin layer may be larger than the maximum thickness of the first resin layer.
- the second resin layer corresponding to the second terminal portion may have a thin portion that gradually becomes thinner toward the first terminal portion side.
- the thickness of the second resin layer corresponding to the second terminal portion is relatively small on the second terminal portion side in the extending direction of the second conductor layer. It may be.
- the surface roughness of the first adhesive surface that adheres to the first resin layer is greater than the surface roughness of the surface opposite to the first adhesive surface.
- the surface roughness of the second adhesive surface that adheres to the second resin layer in the second terminal portion may be rougher than the surface roughness of the surface opposite to the second adhesive surface. Good.
- the first terminal portion has a tapered shape that becomes narrower toward the side away from the first resin layer, and the second terminal portion is formed of the second resin. You may have the taper shape which becomes narrow as it goes to the side away from a layer.
- the first resin layer has a first convex portion protruding toward the first terminal portion, and the first terminal portion is on the first convex portion.
- the second resin layer has a second convex portion that protrudes toward the second terminal portion, and the second terminal portion is on the second convex portion. It may be provided.
- the first resin layer may have a slit for dividing between the first terminal portion and the second terminal portion.
- a wiring structure according to the present invention includes the wiring body and a connection wiring board electrically connected to the wiring body, and the connection wiring board includes the connection board and the first terminal.
- the first resin layer corresponding to the first terminal portion is closer to the connection substrate side than the first resin layer corresponding to the second terminal portion. May be.
- a wiring structure according to the present invention includes the wiring body and a connection wiring board electrically connected to the wiring body, and the connection wiring board includes a connection board and the first terminal.
- the connection board has a slit that divides between the first connection terminal and the second connection terminal.
- the first connection terminal may be closer to the first resin layer side than the second connection terminal.
- a wiring board according to the present invention includes the wiring body or the wiring structure, and a support body that supports the wiring body or the wiring structure.
- a touch sensor according to the present invention includes the wiring board of the present invention.
- the wiring body is formed on the first resin layer, the first conductor layer provided on the first resin layer, the second resin layer, and the second resin layer.
- FIG. 1 is a perspective view showing a touch sensor according to a first embodiment of the present invention.
- FIG. 2 is a plan view showing the first conductor layer in the first embodiment of the present invention.
- FIG. 3 is a plan view showing a second conductor layer in the first embodiment of the present invention.
- 4 is a cross-sectional view taken along line IV-IV in FIG.
- FIG. 5 is a sectional view taken along line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.
- FIG. 7 is a cross-sectional view in the width direction for explaining the structure of the first conductor wire in the first embodiment of the present invention.
- FIG. 8 is a sectional view taken along line VIII-VIII in FIG.
- FIG. 9 is a sectional view taken along line IX-IX in FIG.
- FIG. 10 is a cross-sectional view showing a first modification of the second resin layer in the first embodiment of the present invention.
- FIG. 11 is a cross-sectional view showing a second modification of the second conductor layer in the first embodiment of the present invention.
- FIGS. 12A to 12I are cross-sectional views for explaining a method of manufacturing a wiring board in the first embodiment of the present invention.
- FIGS. 13A to 13I are cross-sectional views for explaining a modification of the method for manufacturing the wiring board in the first embodiment of the present invention.
- FIG. 14 is a perspective view showing a touch sensor according to the second embodiment of the present invention.
- FIG. 15 is a perspective view showing a wiring board according to the second embodiment of the present invention.
- 16 is a cross-sectional view taken along line XVI-XVI in FIG.
- FIG. 17 is a cross-sectional view showing a first modification of the second resin layer in the second embodiment of the present invention.
- 18 is a cross-sectional view taken along line XVIII-XVIII in FIG.
- FIG. 19A to FIG. 19L are cross-sectional views for explaining a method for manufacturing a wiring structure according to the second embodiment of the present invention.
- 20A and 20B are cross-sectional views for explaining a manufacturing method in a modification of the wiring structure according to the second embodiment of the present invention.
- FIG. 21 is a plan view showing a modification of the first and second conductor layers in the embodiment of the present invention.
- FIG. 1 is a perspective view showing a touch sensor in the first embodiment of the present invention
- FIG. 2 is a plan view showing a first conductor layer in the first embodiment of the present invention
- FIG. 4 is a plan view showing a second conductor layer in one embodiment
- FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3
- FIG. 5 is a cross-sectional view taken along line VV in FIG.
- FIG. 6 is a sectional view taken along line VI-VI in FIG. 7 is a cross-sectional view in the width direction for explaining the structure of the first conductor wire in the first embodiment of the present invention.
- FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG.
- FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 1
- FIG. 10 is a cross-sectional view showing a first modification of the second resin layer in the first embodiment of the present invention
- FIG. FIG. 6 is a cross-sectional view (a cross-sectional view corresponding to the line PP in FIG. 3) showing a second modification of the second conductor layer in the first embodiment.
- the touch sensor 10 is a touch input device used for, for example, a capacitive touch panel and a touch pad. As illustrated in FIG. 1, the substrate 2 and wiring arranged on the substrate 2 are used. And a body 3.
- the wiring body 3 includes an adhesive layer 31, a first conductor layer 32, a resin layer 33, and a second conductor layer 34 (see FIGS. 4 to 6).
- the substrate 2 has a rectangular shape and is made of a film made of polyethylene terephthalate (PET).
- substrate 2 is not specifically limited to this.
- PEN polyethylene naphthalate
- PI polyimide resin
- PEI polyetherimide resin
- PC polycarbonate
- PEEK polyetheretherketone
- LCP liquid crystal polymer
- COP cycloolefin polymer
- silicone examples include resin (SI), acrylic resin, phenol resin, epoxy resin, green sheet, and glass.
- These substrates may be provided with an easy-adhesion layer or an optical adjustment layer.
- a display may be used as the substrate 2.
- the shape of the substrate 2 is not particularly limited.
- the substrate 2 in the present embodiment corresponds to an example of the support body of the present invention.
- the adhesive layer 31 as a resin layer is a layer for adhering and fixing the substrate 2 and the first conductor layer 32 to each other.
- the adhesive material constituting the adhesive layer 31 include epoxy resins, acrylic resins, polyester resins, urethane resins, vinyl resins, silicone resins, phenol resins, polyimide resins, and other UV curable resins, thermosetting resins or thermoplastic resins. Examples include ceramics.
- the adhesive layer 31 is provided between a support portion 311 that supports a first conductor wire 322 (described later), and between the support portion 311 and the main surface 21 of the substrate 2.
- a flat portion 312 covering the surface 21, and the support portion 311 and the flat portion 312 are integrally formed.
- the support portion 311 in the present embodiment corresponds to an example of the first convex portion of the present invention.
- the cross-sectional shape of the support portion 311 in this embodiment (the cross-sectional shape with respect to the extending direction of the first conductor wire 322 (described later)) is the direction away from the substrate 2 (the + Z-axis direction in FIG. 2), as shown in FIG. ) Becomes a narrow shape toward. Further, the boundary between the support portion 311 and the first conductor line 322 has an uneven shape corresponding to the uneven shape of the lower surface 326 of the first conductor line 322. Such an uneven shape is formed based on the surface roughness of the lower surface 326 of the first conductor wire 322. As shown in FIG.
- the boundary between the support portion 311 and the first conductor wire 322 in the cross section along the extending direction of the first conductor wire 322 is also uneven on the lower surface 326 of the first conductor wire 322. It has an uneven shape corresponding to the shape. The surface roughness of the lower surface 326 will be described in detail later.
- the uneven shape at the boundary between the support portion 311 and the first conductor wire 322 is exaggerated.
- the flat portion 312 is provided on the entire main surface 21 of the substrate 2 with a substantially uniform height (thickness). Although not particularly limited, the thickness of the flat portion 312 can be set within a range of 5 ⁇ m to 100 ⁇ m. By providing the support portion 311 on the flat portion 312, the adhesive layer 31 protrudes in the support portion 311, and the rigidity of the first conductor wire 322 is improved in the support portion 311.
- the flat portion 312 may be omitted from the adhesive layer 31 and the adhesive layer 31 may be configured by only the support portion 311. In this case, since the light transmittance of the entire wiring board 1 is improved, the visibility of the touch sensor 10 can be improved.
- the adhesive layer 31 in the present embodiment corresponds to an example of the first resin layer of the present invention.
- the first conductor layer 32 is, for example, a layer that functions as an electrode or a lead wire, and is made of a metal material such as silver, copper, nickel, tin, bismuth, zinc, indium, palladium, graphite, carbon black (furnace black, (Acetylene black, ketjen black), carbon nanotubes, carbon nanofibers and other conductive materials (conductive powders and particles), acrylic resins, polyester resins, epoxy resins, vinyl resins, urethane resins And a binder resin containing a phenol resin, a polyimide resin, a silicone resin, a fluorine resin, and the like.
- a metal material such as silver, copper, nickel, tin, bismuth, zinc, indium, palladium, graphite, carbon black (furnace black, (Acetylene black, ketjen black), carbon nanotubes, carbon nanofibers and other conductive materials (conductive powders and particles), acrylic resins, polyester resins, epoxy resins, vinyl resin
- the first conductor line 322 will be described as an example.
- the width of the first conductor line 322 for example, 0.5 ⁇ m to 2 ⁇ m.
- a conductive material having a diameter ⁇ (0.5 ⁇ ⁇ ⁇ 2) can be used.
- the conductive material it is preferable to use particles having a specific surface area measured by the BET method of 20 m 2 / g or more.
- the first conductor layer 32 When a relatively small electrical resistance value of a certain value or less is required as the first conductor layer 32, it is preferable to use a metal material as the conductive material, but the first conductor layer 32 is relatively large as a certain value or more. When the electrical resistance value is allowed, a carbon-based material can be used as the conductive material. In addition, it is preferable to use a carbon-based material as the conductive material from the viewpoint of improving the haze and total light reflectance of the mesh film.
- the first conductor layer 32 is formed by applying and hardening a conductive paste.
- a conductive paste composed of a conductive material mixed with a binder resin, water or a solvent, and various additives can be exemplified.
- the solvent contained in the conductive paste include ⁇ -terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, and tetradecane.
- a metal salt may be used as the above-described conductive material. Examples of the metal salt include the above-described metal salts.
- the binder resin may be omitted from the material constituting the first conductor layer 32.
- the first conductor layer 32 in the present embodiment is connected to the first electrode pattern 320 extending along the Y-axis direction in FIG. 2 and the first electrode pattern 320. And lead-out wiring 324.
- three first electrode patterns 320 are arranged at substantially equal intervals along the X-axis direction in FIG.
- the number and arrangement of the first electrode patterns 320 included in the first conductor layer 32 are not particularly limited to the above.
- the first electrode pattern 320 has a plurality of first conductor lines 321 and 322. As shown in FIG. 2, the first conductor wire 321 extends linearly, and the first conductor wire 322 also extends linearly. In addition, the plurality of first conductor lines 321 are arranged in parallel at substantially intervals, respectively, and the plurality of first conductor lines 322 are also arranged in parallel at substantially equal intervals. In the present embodiment, the first conductor line 321 and the first conductor line 322 are orthogonal to each other, whereby the first electrode pattern 320 has a mesh shape having a rectangular lattice shape.
- the first conductor lines 321 and 322 are arranged with an inclination of 45 degrees with respect to the extending direction of the first electrode pattern 320 (the Y-axis direction in FIG. 2). You may incline and arrange
- the first conductor wires 321 and 322 may extend in a curved shape, a horseshoe shape, a zigzag line shape, etc., and a straight portion and a curved shape, a horseshoe shape, a zigzag line shape, etc. are mixed. You may do it.
- the first conductor lines 321 and 322 have substantially the same line width, but the first conductor lines 321 and 322 may have different line widths.
- the width of the first conductor lines 321 and 322 is preferably 50 nm to 1000 ⁇ m, more preferably 500 nm to 150 ⁇ m, still more preferably 1 ⁇ m to 10 ⁇ m, and further preferably 1 ⁇ m to 5 ⁇ m. More preferred.
- the height of the first conductor lines 321 and 322 is preferably 50 nm to 3000 ⁇ m, more preferably 500 nm to 450 ⁇ m, and further preferably 500 nm to 10 ⁇ m.
- each mesh of the mesh constituted by the first conductor wires 321 and 322 is not particularly limited.
- the shape of each mesh may be the following geometric pattern. That is, the mesh shape of the mesh formed by the first conductor lines 321 and 322 may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a quadrangle such as a parallelogram or a trapezoid. Further, the mesh shape may be an n-gon such as a hexagon, an octagon, a dodecagon, or an icosahedron, a circle, an ellipse, or a star.
- the side part 320 a connected to the lead-out wiring 324 in the first electrode pattern 320 is wider than the first conductor lines 321 and 322.
- the first electrode pattern 320 may have a frame portion surrounding at least a part of the mesh shape formed by the first conductor wires 321 and 322.
- the first conductor lines 321 and 322, the side portion 320a, and the lead-out wiring 324 are integrally formed.
- the side portion 323 of the first conductor wire 322 and the side portion of the support portion 311 in the adhesive layer 31 form a single flat surface by being smoothly continuous.
- the first conductor wire 322 has a taper shape that becomes narrower toward the second conductor layer 34, and thereby the cross-sectional shape of the first conductor wire 322 (the extension of the first conductor wire 322).
- the cross-sectional shape with respect to the existing direction is substantially trapezoidal.
- the cross-sectional shape of the first conductor wire 322 is not particularly limited to this.
- the first conductor wire 322 may have a cross-sectional shape that is square, rectangular, triangular, or the like.
- the first conductor wire 321 also has the same cross-sectional shape as the first conductor wire 322.
- the lower surface 326 in FIG. 4 of the first conductor wire 322 of this embodiment is an adhesive surface that adheres to the support portion 311.
- the upper surface 325 is located on the opposite side of the lower surface 326 in the first conductor wire 322.
- the upper surface 325 is substantially parallel to the main surface 21 of the substrate 2 (the upper surface of the flat portion 312 of the adhesive layer 31).
- the upper surface 325 includes a flat portion 3251 in the cross section in the width direction of the first conductor wire 322.
- the flat portion 3251 is a linear portion (that is, a portion having a very large radius of curvature) existing on the upper surface 325 in the cross section in the width direction of the first conductor wire 322, and the flatness is 0.5 ⁇ m or less. ing.
- the flatness can be defined by the JIS method (JIS B0621 (1984)).
- the flatness of the flat portion 3251 is obtained using a non-contact measurement method using laser light.
- the measurement target specifically, the upper surface 325) is irradiated with a strip-shaped laser beam, and the reflected light is imaged on an image sensor (for example, a two-dimensional CMOS) to measure the flatness.
- an image sensor for example, a two-dimensional CMOS
- a method for calculating the flatness a method (maximum deflection flatness) in which planes passing through three points as far apart as possible in the target plane are set and the maximum value of the deviations is calculated as flatness is used.
- the flatness measurement method and calculation method are not particularly limited to those described above.
- the flatness measurement method may be a contact-type measurement method using a dial gauge or the like.
- the flatness calculation method may be a method (maximum inclination flatness) in which a value of a gap formed when a target plane is sandwiched between parallel planes is calculated as flatness.
- the flat portion 3251 of this embodiment is formed on substantially the entire upper surface 325.
- the flat portion 3251 is not particularly limited to the above, and may be formed on a part of the upper surface 325. In this case, for example, the flat portion may be formed in a region not including both ends of the upper surface.
- the width of the flat portion is at least 1/2 or more than the width of the upper surface.
- the side portion 323 is located between the upper surface 325 and the lower surface 326.
- the side portion 323 is connected to the upper surface 325 at the first portion 3231 and is connected to the lower surface 326 at the second portion 3232. Since the first conductor wire 322 of the present embodiment has a tapered shape that becomes narrower toward the second conductor layer 34, the second portion 3232 is more than the first portion 3231. Located on the outside.
- the side portion 323 of the present embodiment has a linear surface extending on a virtual straight line (not shown) passing through the first and second portions 3231 and 3232 in the cross section in the width direction of the first conductor wire 322. It has become.
- the shape of the side portion 323 is not particularly limited to the above.
- the side portion 323 may protrude outward from an imaginary straight line passing through the first and second portions 3231 and 3232 in the cross section in the width direction of the first conductor wire 322.
- the side portion 323 has a shape that is not recessed inward from a virtual straight line passing through the first and second portions in the cross section in the width direction of the first conductor wire 322 (the bottom of the first conductor wire 322). Is a shape that does not spread).
- the side portion 323 of the present embodiment includes a flat portion 3233 in the cross section in the width direction of the first conductor wire 322.
- the flat portion 3233 is a linear portion (that is, a portion having a very large radius of curvature) existing in the side portion 323 in the cross section in the width direction of the first conductor wire 322, and the flatness is 0.5 ⁇ m or less. ing.
- the flatness of the flat portion 3233 can be measured using a method similar to the method for measuring the flatness of the flat portion 3251.
- a flat portion 3233 is formed on substantially the entire side portion 323. Note that the shape of the flat portion 3233 is not particularly limited to the above, and may be formed in a part of the side portion 323.
- the angle ⁇ 1 between the side portion 323 and the upper surface 325 is preferably 90 ° to 170 ° (90 ° ⁇ ⁇ 1 ⁇ 170 °), and 90 It is more preferable that the angle is from 120 ° to 90 ° (90 ° ⁇ ⁇ 1 ⁇ 120 °).
- the angle between one side 323 and the upper surface 325 and the angle between the other side 323 and the upper surface 325 are substantially the same. It has become.
- the angle between one side 323 and the upper surface 325 and the angle between the other side 323 and the upper surface 325 may be different angles. .
- the surface roughness of the lower surface 326 in FIG. 4 in the first conductor wire 322 in the present embodiment increases the contact area between the first conductor wire 322 and the adhesive layer 31, and the first conductor wire 322 and the adhesive layer. From the viewpoint of firmly fixing 31, it is preferable that the first conductor wire 322 is rougher than the surface roughness of the upper surface 325 in FIG. 4. In the present embodiment, since the upper surface 325 includes the flat portion 3251, the relative relationship of the surface roughness in the first conductor wire 322 (the surface roughness of the lower surface 326 is relative to the surface roughness of the upper surface 325). A relatively rough relationship is established.
- the surface roughness Ra of the lower surface 326 of the first conductor wire 322 is about 0.1 ⁇ m to 3 ⁇ m, whereas the surface roughness Ra of the upper surface 325 is about 0.001 ⁇ m to 1.0 ⁇ m. It is preferable. Note that the surface roughness Ra of the lower surface 326 of the first conductor wire 322 is more preferably 0.1 ⁇ m to 0.5 ⁇ m, and the surface roughness Ra of the upper surface 325 is 0.001 to 0.3 ⁇ m. Even more preferred.
- the ratio of the surface roughness of the lower surface 326 to the surface roughness of the upper surface 325 is preferably 0.01 to less than 0.1, More preferably, it is less than 1.
- the surface roughness of the upper surface 325 is preferably not more than one fifth of the width (maximum width) of the first conductor wire 322. Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)).
- the surface roughness of the lower surface 326 and the surface roughness of the upper surface 325 may be measured along the width direction of the first conductor wire 322 (see FIG. 4) or the extending direction of the first conductor wire 322. (See FIG. 6).
- surface roughness Ra here means “arithmetic average roughness Ra”.
- the “arithmetic average roughness Ra” refers to a roughness parameter obtained by blocking a long wavelength component (swell component) from a cross-sectional curve. Separation of the waviness component from the cross-sectional curve is performed based on measurement conditions (for example, dimensions of the object) necessary for obtaining the shape.
- the side portion 323 also includes a flat portion 3233.
- the surface roughness of the lower surface 326 is rougher than the surface roughness of the side portion 323 including the flat portion 3233.
- the surface roughness Ra of the side portion 323 is preferably about 0.001 ⁇ m to 1.0 ⁇ m with respect to the surface roughness Ra of the lower surface 326 described above.
- the surface roughness Ra of the side portion 323 is more preferably 0.001 ⁇ m to 0.3 ⁇ m.
- the measurement of the surface roughness of the side portion 323 may be performed along the width direction of the first conductor wire 322 or may be performed along the extending direction of the first conductor wire 322.
- the upper surface 325 includes a flat portion 3251 and the side portion 323 includes a flat portion 3233.
- the irregular reflectance of the wiring body 3 on the other surface side excluding the lower surface 326 is relatively relative to the irregular reflectance of the wiring body 3 on the lower surface 326 side. It is preferable that it is small.
- the diffuse reflectance of the wiring body 3 on the other surface side is preferably 0.1 to less than 1, and more preferably 0.3 to less than 1.
- the first conductor wire 322B shown in FIG. 7 includes the conductive material M and the binder resin B. And in the cross section of the 1st conductor wire 322B in the width direction, in the lower surface 326B, a part of conductive material M protrudes from the binder resin B, and, thereby, the said lower surface 326B becomes uneven
- the binder resin B enters between the conductive materials M on the upper surface 325B and the side portion 323B, and the binder resin B covers the conductive material M.
- a flat portion 3251B is formed on the upper surface 325B.
- a flat portion 3233B is formed on the side portion 323B.
- the conductive material M is covered with the binder resin B on the upper surface 325B and the side portion 323B, the electrical insulation between the adjacent first conductor wires 322 is improved, and the occurrence of migration is suppressed. Is done.
- the conductive material M is covered with the binder resin B, so that the surface roughness of the side portion 323B is relatively small.
- the surface roughness of the lower surface 326B is rougher than the surface roughness of the side part 323B.
- the shape of a lower surface, an upper surface, and a side part is not limited to the form shown in FIG.
- the cross-sectional shape of the lead-out wiring 324 and the adhesive layer 31 in the portion corresponding to the lead-out wiring 324 is the first conductor line 322 and the adhesive layer 31 that adheres to the first conductor line 322.
- Each has the same cross-sectional shape.
- the adhesive layer 31 has a support portion 311 and a flat portion 312, and the lead-out wiring 324 is provided on the support portion 311.
- the side portion 327 of the lead-out wiring 324 and the side portion of the support portion 311 in the adhesive layer 31 form one plane by smoothly continuing.
- the lead-out wiring 324 has a taper shape that becomes narrower toward the second conductor layer 34 side (the + Z-axis direction side in FIG. 8), and thus the cross-sectional shape of the lead-out wiring 324 (the extension of the lead-out wiring 324).
- the cross-sectional shape with respect to the existing direction is substantially trapezoidal. Note that the cross-sectional shape of the lead-out wiring 324 is not particularly limited to this.
- the cross-sectional shape of the lead wiring 324 may be a square shape, a rectangular shape, a triangular shape, or the like.
- the lead-out wiring 324 in the present embodiment is made of substantially the same material as the material constituting the first electrode pattern 320, and the first electrode pattern 320 and the lead-out wiring 324 are integrally formed. ing.
- the leading end portion of the lead wiring 324 is a first terminal portion 324T (see FIG. 1) connected to an external terminal (not shown).
- the lower surface 328 in FIG. 8 of the lead-out wiring 324 of this embodiment is an adhesive surface that adheres to the support portion 311.
- the upper surface 329 is located on the opposite side of the lower surface 328 in the lead wiring 324.
- the upper surface 329 is substantially parallel to the main surface 21 of the substrate 2 (the upper surface of the flat portion 312 of the adhesive layer 31).
- the upper surface 329 includes a flat portion 3291 in the cross section in the width direction of the lead-out wiring 324.
- the flat portion 3291 is a linear portion (that is, a portion having a very large radius of curvature) existing on the upper surface 329 in the cross section in the width direction of the lead-out wiring 324, and has a flatness of 0.5 ⁇ m or less.
- the flatness can be defined by the JIS method (JIS B0621 (1984)).
- the flatness of the flat portion 3291 can be measured using a method similar to the method for measuring the flatness of the flat portion 3251.
- the flat portion 3291 of the present embodiment is formed on substantially the entire upper surface 329.
- the flat portion 3291 may be formed over part of the upper surface 329 without being particularly limited to the above.
- the flat portion may be formed in a region not including both ends of the upper surface.
- the width of the flat portion is at least 1/2 or more than the width of the upper surface.
- the side portion 327 is located between the upper surface 329 and the lower surface 328.
- the side portion 327 is connected to the upper surface 329 at the first portion 3271 and is connected to the lower surface 328 at the second portion 3272. Since the lead-out wiring 324 according to the present embodiment has a tapered shape that becomes narrower toward the second conductor layer 34, the second portion 3272 is positioned outside the first portion 3271. is doing.
- the side portion 327 of the present embodiment is a straight surface extending on a virtual straight line (not shown) passing through the first and second portions 3271 and 3272 in the cross section in the width direction of the lead-out wiring 324. .
- the shape of the side portion 327 is not particularly limited to the above.
- the side portion 327 may protrude outward from a virtual straight line passing through the first and second portions 3271 and 3272 in the cross section in the width direction of the lead-out wiring 324.
- the side portion 327 has a shape that is not recessed inward from a virtual straight line passing through the first and second portions in the cross-section in the width direction of the lead-out wiring 324 (a shape in which the bottom of the lead-out wiring does not widen). It is preferable.
- the side portion 327 of the present embodiment includes a flat portion 3273 in the cross section in the width direction of the lead-out wiring 324.
- the flat portion 3273 is a linear portion (that is, a portion having a very large radius of curvature) existing in the side portion 327 in the cross section in the width direction of the lead-out wiring 324, and has a flatness of 0.5 ⁇ m or less.
- the flatness of the flat portion 3273 can be measured by the same method as the method for measuring the flatness of the flat portion 3251 described above.
- a flat portion 3273 is formed on substantially the entire side portion 327. Note that the shape of the flat portion 3237 is not particularly limited to the above, and may be formed in a part of the side portion 327.
- the angle ⁇ 2 between the side portion 327 and the upper surface 329 is preferably 90 ° to 170 ° (90 ° ⁇ ⁇ 2 ⁇ 170 °), and 90 ° to 120 ° (90 ° ⁇ ⁇ 2 ⁇ 120 °). ) Is more preferable.
- the angle between one side portion 327 and the upper surface 329 and the angle between the other side portion 327 and the upper surface 329 are substantially the same. Yes. Note that in one lead-out wiring 324, the angle between one side portion 327 and the upper surface 329 and the angle between the other side portion 327 and the upper surface 329 may be different angles.
- the surface roughness of the lower surface (first adhesive surface) 328 in FIG. 8 of the lead-out wiring 324 in the present embodiment is the same as that of the lead-out wiring 324 in FIG. 8 from the viewpoint of firmly fixing the lead-out wiring 324 to the adhesive layer 31. It is preferable that the surface roughness of the upper surface 329 is rougher. In the present embodiment, since the upper surface 329 includes the flat portion 3291, the relative relationship of the surface roughness in the lead-out wiring 324 (the surface roughness of the lower surface 328 is relative to the surface roughness of the upper surface 329). Coarse relationship) holds.
- the surface roughness Ra of the lower surface 328 of the lead-out wiring 324 is about 0.1 ⁇ m to 3 ⁇ m, whereas the surface roughness Ra of the upper surface 329 is about 0.001 ⁇ m to 1.0 ⁇ m. Is preferred.
- the surface roughness Ra of the lower surface 328 of the lead-out wiring 324 is more preferably 0.1 ⁇ m to 0.5 ⁇ m, and the surface roughness Ra of the upper surface 329 is more preferably 0.001 to 0.3 ⁇ m. .
- the ratio of the surface roughness of the lower surface 328 to the surface roughness of the upper surface 329 is preferably 0.01 to less than 0.1, More preferably, it is less than 1. Further, the surface roughness of the upper surface 329 is preferably less than or equal to one fifth of the width (maximum width) of the lead wiring 324. Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)). The measurement of the surface roughness of the lower surface 328 and the surface roughness of the upper surface 329 may be performed along the width direction of the extraction wiring 324 or may be performed along the extending direction of the extraction wiring 324.
- the side portion 327 also includes a flat portion 3273. Similar to the upper surface 329, the surface roughness of the lower surface 328 is rougher than the surface roughness of the side portion 327 including the flat portion 3273. Specifically, the surface roughness Ra of the side portion 327 is preferably about 0.001 ⁇ m to 1.0 ⁇ m with respect to the surface roughness Ra of the lower surface 328 described above. The surface roughness Ra of the side portion 327 is more preferably 0.001 ⁇ m to 0.3 ⁇ m. The measurement of the surface roughness of the side portion 327 may be performed along the width direction of the lead wiring 324 or may be performed along the extending direction of the lead wiring 324.
- the first terminal portion 324T which is a part of the lead-out wiring 324 has a shape similar to the shape of the lead-out wiring 324 described above. . Therefore, detailed description of the shape of the first terminal portion 324T is omitted.
- the resin layer 33 in the present embodiment is composed of an epoxy resin, an acrylic resin, a polyester resin, a urethane resin, a vinyl resin, a silicone resin, a phenol resin, a polyimide resin, and other UV curable resins, thermosetting resins, thermoplastic resins, ceramics, and the like. It is composed of The resin layer 33 in the present embodiment corresponds to an example of the second resin layer of the present invention.
- the resin layer 33 has a substantially flat upper surface and a main portion 331 provided on the main surface 21 of the substrate 2 and a convex portion 332 provided on the main portion 331. And have. As shown in FIG. 4 or 5, the main portion 331 covers the first conductor layer 32 and the adhesive layer 31 excluding the adhesive surface between the first electrode pattern 320. Further, as shown in FIG. 1, in a terminal region 333 for connecting an external terminal (not shown), a first terminal portion 324T and a second terminal portion 344T (described later) are exposed to the outside of the wiring board 1. Yes.
- the convex portion 332 protrudes toward the second conductor layer 34 side (+ Z-axis direction side), and is formed corresponding to the second electrode pattern 340 of the second conductor layer 34.
- the main portion 331 and the convex portion 332 of the resin layer 33 in the present embodiment are integrally formed.
- the convex portion 332 in the present embodiment corresponds to an example of the second convex portion of the present invention.
- the cross-sectional shape of the convex portion 332 in this embodiment is a direction away from the substrate 2 (upward direction in FIG. 6), as shown in FIG. It becomes the shape which becomes narrow toward it. Further, the boundary between the convex portion 332 and the second conductor line 342 has an uneven shape corresponding to the uneven shape of the lower surface 346 of the second conductor line 342. Since the convex portion 332 is provided on the main portion 331, the rigidity of the second conductor wire 342 is improved in the convex portion 332.
- the uneven shape of the lower surface 346 is formed based on the surface roughness of the lower surface 346 of the second conductor wire 342.
- the boundary between the convex portion 332 and the second conductor wire 342 in the cross section along the extending direction of the second conductor wire 342 is also the unevenness of the lower surface 346 of the second conductor wire 342. It has an uneven shape corresponding to the shape. The surface roughness of the lower surface 346 will be described in detail later.
- FIGS. 4 and 6 in order to explain the wiring body 3 in the present embodiment in an easy-to-understand manner, the uneven shape at the boundary between the convex portion 332 and the second conductor wire 342 is exaggerated.
- the thickness (maximum thickness) W 1 of the resin layer 33 is larger than the thickness (maximum thickness) W 2 of the first conductor layer 32. . Thereby, it is possible to ensure insulation between the first conductor layer 32 and the second conductor layer 34.
- the thickness (maximum thickness) W 1 of the resin layer 33 is larger than the thickness (maximum thickness) W 3 of the adhesive layer 31.
- the thickness (maximum thickness) in the above is an average maximum thickness.
- the average maximum thickness means that a plurality of cross-sections along the width direction of each conductor wire are sampled over the entire extending direction of the conductor wire, and the maximum thickness obtained for each cross-section is obtained. It is average.
- the first conductor lines 321 and 322 and the lead-out wiring 324 (first terminal portion 324T) constituting the first conductor layer 32 and the second conductor layer 34 are formed on the conductor lines.
- Second conductor lines 341 and 342 and lead wiring 344 (second terminal portion 344T) are included. The conductor wire is appropriately selected according to the required parameter.
- the second terminal portion in the resin layer 33 corresponding to the second terminal portion 344T This is the distance along the Z-axis direction between the contact portion (adhesion surface) of the 344T with the lower surface 348 and the lower surface of the resin layer 33.
- the lower surface of the resin layer 33 is a contact portion with the upper surface of the adhesive layer 31, but when the adhesive layer 31 is not present, it is a contact surface with the main surface 21 of the substrate 2.
- the maximum value of the thickness of the first conductor layer 32 is the first terminal portion 324T (lead wiring 324). Is the distance along the Z-axis direction between the lower surface 328 and the upper surface 329.
- the second conductor layer 34 is, for example, a layer that functions as an electrode or a lead line, and is made of the same conductive material as that of the first conductor layer 32.
- the second conductor layer 34 in the present embodiment is provided directly on the resin layer 33, and has a second electrode pattern 340 extending along the X-axis direction in FIG. 3. And a lead wiring 344 connected to the second electrode pattern 340.
- four second electrode patterns 340 are arranged at substantially equal intervals along the Y-axis direction in FIG.
- the two second electrode patterns 340 arranged on the + Y axis direction side in FIG. 3 are connected to the lead-out wiring 344 on the ⁇ X axis direction side in FIG.
- the two second electrode patterns 340 arranged on the ⁇ Y axis direction side are connected to the lead wiring 344 on the + X axis direction side in FIG.
- the number and arrangement of the second electrode patterns included in the second conductor layer 34 are not particularly limited to the above.
- the second electrode pattern 340 has a plurality of second conductor lines 341 and 342. As shown in FIG. 3, the second conductor line 341 extends linearly, and the second conductor line 342 also extends linearly. Further, the plurality of second conductor lines 341 are arranged in parallel at substantially intervals, and the plurality of second conductor lines 342 are also arranged in parallel at substantially equal intervals. In the present embodiment, the second conductor line 341 and the second conductor line 342 are orthogonal to each other, whereby the second electrode pattern 340 has a mesh shape having a rectangular lattice shape. In the present embodiment, the unit cell constituting the mesh shape of the first electrode pattern 320 and the unit cell constituting the mesh shape of the second electrode pattern 340 have substantially the same shape. It is not particularly limited to this.
- the second conductor lines 341 and 342 are respectively inclined by 45 degrees with respect to the extending direction of the second electrode pattern 340 (X-axis direction in FIG. 3). You may incline and arrange
- the second conductor wires 341 and 342 may extend in a curved shape, a horseshoe shape, a zigzag line shape, etc., and a straight portion and a curved shape, a horseshoe shape, a zigzag line shape, etc. are mixed. You may do it.
- the angle at which the second conductor line 341 and the second conductor line 342 intersect is not particularly limited to a right angle.
- the second conductor lines 341 and 342 have substantially the same line width, but the second conductor lines 341 and 342 may have different line widths.
- the widths of the second conductor lines 341 and 342 can be set in the same range as the ranges cited as the widths of the first conductor lines 321 and 322 described above.
- each mesh of the mesh constituted by the second conductor lines 341 and 342 is not particularly limited.
- the shape of each mesh may be the following geometric pattern. That is, the mesh shape of the mesh formed by the second conductor lines 341 and 342 may be a triangle such as a regular triangle, an isosceles triangle, a right triangle, or a quadrangle such as a parallelogram or a trapezoid.
- the mesh shape may be an n-gon such as a hexagon, an octagon, a dodecagon, or an icosahedron, a circle, an ellipse, or a star.
- the side portion 340a connected to the lead-out wiring 344 in the second electrode pattern 340 is wider than the second conductor lines 341 and 342.
- the second electrode pattern 340 may have a frame portion surrounding at least a part of the mesh shape formed by the second conductor lines 341 and 342.
- the second conductor lines 341 and 342, the side portion 340a, and the lead-out wiring 344 are integrally formed.
- the leading end of the lead wiring 344 is a second terminal portion 344T (see FIG. 1) connected to an external terminal (not shown).
- the second conductor line 342 has a tapered shape that becomes narrower toward the side away from the first conductor layer 32 (upward side in FIG. 6).
- the cross-sectional shape (the cross-sectional shape with respect to the extending direction of the second conductor wire 342) is a substantially trapezoidal shape.
- the cross-sectional shape of the second conductor wire 342 is not particularly limited to this.
- the cross-sectional shape of the second conductor wire 342 may be a square shape, a rectangular shape, a triangular shape, or the like.
- the second conductor wire 341 also has the same cross-sectional shape as the second conductor wire 342.
- the lower surface 346 in FIG. 6 of the second conductor wire 342 of this embodiment is an adhesive surface that adheres to the support portion 332.
- the upper surface 345 is located on the opposite side of the lower surface 346 in the second conductor wire 342.
- the upper surface 345 is substantially parallel to the main surface 21 of the substrate 2 (the upper surface of the main portion 331 of the resin layer 33).
- the upper surface 345 includes a flat portion 3451 in the cross section in the width direction of the second conductor wire 342.
- the flat portion 3451 is a linear portion (that is, a portion having a very large radius of curvature) existing on the upper surface 345 in the cross section in the width direction of the second conductor wire 342, and the flatness is 0.5 ⁇ m or less. ing.
- the flatness can be defined by the JIS method (JIS B0621 (1984)).
- the flatness of the flat portion 3451 can be measured using a method similar to the method for measuring the flatness of the flat portion 3251.
- the flat portion 3451 of the present embodiment is formed on substantially the entire upper surface 345.
- the flat portion 3451 is not particularly limited to the above, and may be formed on a part of the upper surface 345. In this case, for example, the flat portion may be formed in a region not including both ends of the upper surface.
- the width of the flat portion is at least 1/2 or more than the width of the upper surface.
- the side part 343 is located between the upper surface 345 and the lower surface 346.
- the side portion 343 is connected to the upper surface 345 at the first portion 3431 and is connected to the lower surface 346 at the second portion 3432. Since the second conductor wire 352 of the present embodiment has a tapered shape that becomes narrower toward the side away from the first conductor layer 32, the second portion 3432 is the first portion 3431. It is located outside.
- the side portion 343 of the present embodiment includes a linear surface extending on a virtual straight line (not shown) passing through the first and second portions 3431 and 3432 in the cross section in the width direction of the second conductor wire 342. It has become.
- the shape of the side portion 343 is not particularly limited to the above.
- the side portion 343 may protrude outward from an imaginary straight line passing through the first and second portions 3431 and 3432 in the cross section in the width direction of the second conductor wire 342.
- the side portion 343 has a shape that is not recessed inward from a virtual straight line passing through the first and second portions in the cross-section in the width direction of the second conductor wire 342 (the bottom of the second conductor wire 342). Is a shape that does not spread).
- the side portion 343 of the present embodiment includes a flat portion 3433 in the cross section in the width direction of the second conductor wire 342.
- the flat portion 3433 is a linear portion (that is, a portion having a very large radius of curvature) existing in the side portion 343 in the cross section in the width direction of the second conductor wire 342, and the flatness is 0.5 ⁇ m or less. ing.
- the flatness of the flat portion 3433 can be measured by a method similar to the method for measuring the flatness of the flat portion 3251 described above.
- a flat portion 3433 is formed on substantially the entire side portion 343. Note that the shape of the flat portion 3433 is not particularly limited to the above, and may be formed in part of the side portion 343.
- the angle between the one side portion 343 and the upper surface 345 and the angle between the other side portion 343 and the upper surface 345 may be different angles. .
- the angle ⁇ 3 between the side portion 343 and the upper surface 345 is preferably 90 ° to 170 ° (90 ° ⁇ ⁇ 3 ⁇ 170 °), and 90 It is more preferable that the angle is from 120 ° to 90 ° (90 ° ⁇ ⁇ 3 ⁇ 120 °).
- the angle between one side 343 and the upper surface 345 and the angle between the other side 343 and the upper surface 345 are substantially the same. It has become.
- the surface roughness of the lower surface 346 in FIG. 6 of the second conductor wire 342 in the present embodiment increases the contact area between the second conductor wire 342 and the resin layer 33, and the second conductor wire 342 and the resin layer. From the viewpoint of firmly fixing 33, it is preferable that the second conductor wire 342 is rougher than the surface roughness of the upper surface 345 in FIG. In the present embodiment, since the upper surface 345 includes the flat portion 3451, the relative relationship of the surface roughness in the second conductor wire 342 (the surface roughness of the lower surface 346 is relative to the surface roughness of the upper surface 345). A relatively rough relationship is established.
- the surface roughness Ra of the lower surface 346 of the second conductor wire 342 is about 0.1 ⁇ m to 3 ⁇ m, whereas the surface roughness Ra of the upper surface 345 is about 0.001 ⁇ m to 1.0 ⁇ m. It is preferable.
- the surface roughness Ra of the lower surface 346 of the second conductor wire 342 is more preferably 0.1 ⁇ m to 0.5 ⁇ m, and the surface roughness Ra of the upper surface 345 is 0.001 to 0.3 ⁇ m. Even more preferred.
- the ratio of the surface roughness of the lower surface 346 to the surface roughness of the upper surface 345 is preferably 0.01 to less than 0.1, More preferably, it is less than 1.
- the surface roughness of the upper surface 345 is preferably not more than one fifth of the width (maximum width) of the second conductor wire 342. Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)).
- the measurement of the surface roughness of the lower surface 346 and the surface roughness of the upper surface 345 may be performed along the width direction of the second conductor wire 342 or may be performed along the extending direction of the second conductor wire 342. Also good.
- the side portion 343 also includes a flat portion 3433. Similar to the upper surface 345, the surface roughness of the lower surface 346 is rougher than the surface roughness of the side portion 343 including the flat portion 3433. Specifically, the surface roughness Ra of the side portion 343 is preferably about 0.001 ⁇ m to 1.0 ⁇ m with respect to the surface roughness Ra of the lower surface 346 described above. The surface roughness Ra of the side portion 343 is more preferably 0.001 ⁇ m to 0.3 ⁇ m. The measurement of the surface roughness of the side part 343 may be performed along the width direction of the second conductor line 342 or may be performed along the extending direction of the second conductor line 342.
- the upper surface 345 includes a flat portion 3451 and the side portion 343 includes a flat portion 3433.
- the irregular reflectance of the wiring body 3 on the other surface side excluding the lower surface 346 is relatively relative to the irregular reflectance of the wiring body 3 on the lower surface 346 side. It is preferable that it is small.
- the diffuse reflectance of the wiring body 3 on the other surface side is preferably 0.1 to less than 1, and more preferably 0.3 to less than 1.
- the cross-sectional shape of the lead wiring 344 and the resin layer 33 in the portion corresponding to the lead wiring 344 is the second conductor wire 342 and the resin layer 33 that adheres to the second conductor wire 342. Has the same cross-sectional shape.
- the resin layer 33 has a main part 331 and a convex part 332, and the lead-out wiring 344 is provided on the convex part 332.
- the side portion 347 of the lead-out wiring 344 and the side portion of the convex portion 332 in the resin layer 33 form a single plane by being smoothly continuous.
- the lead-out wiring 344 has a taper shape that becomes narrower toward the side away from the resin layer 33 (the + Z-axis direction side in FIG. 8), and thereby the cross-sectional shape of the lead-out wiring 344 (extension of the lead-out wiring 344).
- the cross-sectional shape with respect to the direction is substantially trapezoidal. Note that the cross-sectional shape of the lead-out wiring 344 is not particularly limited to this.
- the cross-sectional shape of the lead wiring 344 may be a square shape, a rectangular shape, a triangular shape, or the like.
- the lead-out wiring 344 in the present embodiment is made of substantially the same material as that constituting the second electrode pattern 340, and the second electrode pattern 340 and the lead-out wiring 344 are integrally formed. ing.
- the lower surface 348 in FIG. 8 of the lead-out wiring 344 of the present embodiment is an adhesive surface that adheres to the support portion 332.
- the upper surface 349 is located on the opposite side of the lower surface 348 in the lead wiring 344.
- the upper surface 349 is substantially parallel to the main surface 21 of the substrate 2 (the upper surface of the main portion 331 of the resin layer 33).
- the upper surface 349 includes a flat portion 3491 in the cross section in the width direction of the lead-out wiring 344.
- the flat portion 3491 is a linear portion (that is, a portion having a very large curvature radius) existing on the upper surface 349 in the cross section in the width direction of the lead-out wiring 344, and has a flatness of 0.5 ⁇ m or less.
- the flatness can be defined by the JIS method (JIS B0621 (1984)).
- the flatness of the flat portion 3491 can be measured using a method similar to the method for measuring the flatness of the flat portion 3251.
- the flat portion 3491 of the present embodiment is formed on substantially the entire upper surface 349.
- the flat portion 3491 is not particularly limited to the above, and may be formed in part of the upper surface 349. In this case, for example, the flat portion may be formed in a region not including both ends of the upper surface.
- the width of the flat portion is at least 1/2 or more than the width of the upper surface.
- the side portion 347 is located between the upper surface 349 and the lower surface 348.
- the side portion 347 is connected to the upper surface 349 at the first portion 3471 and is connected to the lower surface 348 at the second portion 3472. Since the lead-out wiring 344 of the present embodiment has a tapered shape that becomes narrower toward the side away from the first conductor layer 32, the second portion 3472 is outside the first portion 3471. Is located.
- the side portion 347 of the present embodiment is a straight surface extending on an imaginary straight line (not shown) passing through the first and second portions 3471 and 3472 in the cross section in the width direction of the lead-out wiring 344. .
- the shape of the side portion 347 is not particularly limited to the above.
- the side portion 347 may protrude outward from a virtual straight line passing through the first and second portions 3471 and 3472 in the cross section in the width direction of the lead-out wiring 344.
- the side portion 347 has a shape that is not recessed inward from a virtual straight line passing through the first and second portions in the cross-section in the width direction of the lead-out wiring 344 (a shape in which the bottom of the lead-out wiring 344 does not widen). Preferably there is.
- the side portion 347 of the present embodiment includes a flat portion 3473 in the cross section in the width direction of the lead-out wiring 344.
- the flat portion 3473 is a straight portion (that is, a portion having a very large curvature radius) existing in the side portion 347 in the cross section in the width direction of the lead-out wiring 344, and has a flatness of 0.5 ⁇ m or less.
- the flatness of the flat portion 3473 can be measured by a method similar to the method for measuring the flatness of the flat portion 3251 described above.
- a flat portion 3473 is formed on substantially the entire side portion 347. Note that the shape of the flat portion 3437 is not particularly limited to the above, and may be formed in a part of the side portion 347.
- the angle ⁇ 4 between the side portion 347 and the upper surface 349 is preferably 90 ° to 170 ° (90 ° ⁇ ⁇ 4 ⁇ 170 °), and 90 ° to 120 ° (90 ° ⁇ ⁇ 4 ⁇ 120 °). ) Is more preferable.
- the angle between one side 347 and the upper surface 349 and the angle between the other side 347 and the upper surface 349 are substantially the same. Yes.
- the angle between one side 347 and the upper surface 349 and the angle between the other side 347 and the upper surface 349 may be different.
- the surface roughness of the lower surface (second adhesive surface) 348 in FIG. 8 of the lead wiring 344 in the present embodiment is from the viewpoint of firmly fixing the lead wiring 344 to the resin layer 33 in FIG.
- the surface roughness of the upper surface 349 is preferably rougher.
- the relative relationship of the surface roughness in the lead-out wiring 344 (the surface roughness of the lower surface 348 is relative to the surface roughness of the upper surface 349). Coarse relationship) holds.
- the surface roughness Ra of the lower surface 348 of the lead-out wiring 344 is about 0.1 ⁇ m to 3 ⁇ m, whereas the surface roughness Ra of the upper surface 349 is about 0.001 ⁇ m to 1.0 ⁇ m. Is preferred.
- the surface roughness Ra of the lower surface 348 of the lead-out wiring 344 is more preferably 0.1 ⁇ m to 0.5 ⁇ m, and the surface roughness Ra of the upper surface 349 is more preferably 0.001 ⁇ m to 0.3 ⁇ m. .
- the ratio of the surface roughness of the lower surface 348 to the surface roughness of the upper surface 349 is preferably 0.01 to less than 0.1, More preferably, it is less than 1. Further, the surface roughness of the upper surface 349 is preferably less than or equal to one fifth of the width (maximum width) of the lead wiring 344.
- Such surface roughness can be measured by the JIS method (JIS B0601 (revised on March 21, 2013)).
- the measurement of the surface roughness of the lower surface 348 and the surface roughness of the upper surface 349 may be performed along the width direction of the extraction wiring 344 or may be performed along the extending direction of the extraction wiring 344.
- the side portion 347 also includes a flat portion 3473.
- the surface roughness of the lower surface 348 is rougher than the surface roughness of the side portion 347 including the flat portion 3473.
- the surface roughness Ra of the side portion 347 is preferably about 0.001 ⁇ m to 1.0 ⁇ m with respect to the surface roughness Ra of the lower surface 348 described above.
- the surface roughness Ra of the side portion 347 is more preferably 0.001 ⁇ m to 0.3 ⁇ m.
- the measurement of the surface roughness of the side portion 347 may be performed along the width direction of the extraction wiring 344 or may be performed along the extending direction of the extraction wiring 344.
- the second terminal portion 344T that is a part of the lead-out wiring 344 also has the same shape as the shape of the lead-out wiring 344 described above. . Therefore, detailed description of the shape of the second terminal portion 344T is omitted.
- the first terminal portion 324T and the second terminal portion 344T are exposed to the outside of the wiring board 1. Further, in the terminal region 333, the resin layer 33 is provided only in a portion corresponding to the lead wiring 344. For this reason, the first terminal portion 324T and the second terminal portion 344T are displaced from each other by a distance R along the thickness direction of the adhesive layer 31 (Z-axis direction in FIG. 9). That is, the average position along the thickness direction of the adhesive layer 31 (Z-axis direction in FIG. 9) in the first terminal portion 324T and the thickness direction of the adhesive layer 31 in the second terminal portion 344T (in FIG. 9).
- the distance between the average position along the Z-axis direction) is R.
- the space between the adjacent second terminal portions 344T is covered with the resin layer 33, but a portion where the resin layer 33 is not formed is provided between the adjacent second terminal portions 344T. It may be done.
- the first terminal portion 324T protrudes toward the side away from the adhesive layer 31 in the Z-axis direction.
- the entire first terminal portion 324T is in the Z-axis direction.
- the lower surface of the resin layer 33 (the surface opposite to the surface on which the second conductor layer is provided) is located on the side farther from the adhesive layer 31.
- the first terminal portion 324T is exposed without being covered with the resin layer 33.
- the first terminal portion 324T is projected in the X-axis direction, the first terminal portion 324T is projected. The entire portion overlaps with the resin layer 33.
- the positional relationship between the first terminal portion 324T and the resin layer 33 is not particularly limited to the above, and when the first terminal portion 324T is projected in the X-axis direction, a part of the first terminal portion 324T is formed. However, it may overlap with the resin layer 33.
- the side surface on the first terminal portion 324T side of the resin layer 33 provided only in the portion corresponding to the lead-out wiring 344 is a substantially vertical surface, but is not particularly limited thereto.
- a thin portion 334 may be formed in which the side surface of the resin layer 33 on the first terminal portion 324T side gradually becomes thinner toward the first terminal portion 324T side.
- the presence of the thin portion 334 reduces the step between the first terminal portion 324T and the second terminal portion 344T, so that the connection with the connector is facilitated and the durability of the connection portion is increased. Can be improved.
- the resin layer 33 provided only in the portion corresponding to the lead-out wiring 344 has a substantially constant thickness, but is not particularly limited thereto.
- the thickness of the resin layer 33 provided only in the portion corresponding to the lead-out wiring 344 is such that the leading end in the extending direction of the lead-out wiring 344 (the ⁇ Y axis direction in FIG. 11). (Terminal portion 344T) may be relatively small.
- the above-described wiring board 1 is connected to the drive circuit C via the lead wires 324 and 344.
- the drive circuit C periodically applies a predetermined voltage between the first electrode pattern 320 and the second electrode pattern 340, so that each intersection of the first and second electrode patterns 320 and 340 is applied.
- the contact position of the operator's finger on the touch sensor 10 is determined based on the change in capacitance.
- FIGS. 13 (A) to 13 (I) are diagrams in the present embodiment.
- FIG. 10 is a cross-sectional view for explaining a modification of the method for manufacturing the wiring board 1.
- two first terminal portions 324T and one second terminal portion 344T are provided outside the first terminal portions 324T one by one. Is illustrated.
- a first intaglio plate 4 in which a concave portion 41 having a shape corresponding to the shape of the first electrode pattern 320 and the lead wiring 324 in the first conductor layer 32 is prepared.
- the material constituting the first intaglio 4 include glasses such as nickel, silicon and silicon dioxide, organic silicas, glassy carbon, thermoplastic resins, and photocurable resins.
- the width of the recess 41 is preferably 50 nm to 1000 ⁇ m, more preferably 500 nm to 150 ⁇ m, still more preferably 1 ⁇ m to 10 ⁇ m, and even more preferably 1 ⁇ m to 5 ⁇ m.
- the depth of the concave portion 41 is preferably 50 nm to 3000 ⁇ m, more preferably 500 nm to 450 ⁇ m, and further preferably 500 nm to 10 ⁇ m.
- the cross-sectional shape of the recess 41 is formed with a tapered shape that becomes narrower toward the bottom.
- a release layer 411 made of graphite material, silicone material, fluorine material, ceramic material, aluminum material or the like is preferably formed on the surface of the recess 41 in order to improve the release property.
- the conductive material 5 is filled into the recess 41 of the first intaglio 4.
- the conductive paste as described above is used.
- the method for filling the conductive material 5 in the concave portion 41 of the first intaglio 4 include a dispensing method, an ink jet method, and a screen printing method.
- the conductive material coated other than the recesses is wiped or scraped, blotted, and pasted. , Wash away, and blow away. It can be properly used depending on the composition of the conductive material, the shape of the intaglio, and the like.
- the conductive material 5 filled in the recess 41 of the first intaglio 4 is heated to form a conductor pattern constituting the first conductor layer 32.
- the heating conditions for the conductive material 5 can be appropriately set according to the composition of the conductive material and the like. By this heat treatment, the conductive material 5 shrinks in volume. At this time, the outer surface excluding the upper surface of the conductive material 5 is formed in a shape along the recess 41. On the other hand, since the upper surface of the conductor pattern is heated in contact with the external atmosphere, an uneven shape 51 based on the shape of the conductive material included in the conductive material 5 is formed (see the drawing in FIG. 12B). ).
- the processing method of the conductive material 5 is not limited to heating. Energy rays such as infrared rays, ultraviolet rays, and laser beams may be irradiated, or only drying may be performed. Moreover, you may combine these 2 or more types of processing methods. Due to the presence of the concavo-convex shape 51, the contact area between the first conductor layer 32 and the adhesive layer 31 is increased, and the first conductor layer 32 can be more firmly fixed to the adhesive layer 31.
- an adhesive material 6 for forming the adhesive layer 31 is applied on the substrate 2 substantially uniformly.
- an adhesive material 6 the material which comprises the contact bonding layer 31 mentioned above is used.
- the method for applying the adhesive material 6 on the substrate 2 include a screen printing method, a spray coating method, a bar coating method, a dip method, and an ink jet method.
- the substrate 2 and the adhesive material 6 are arranged on the first intaglio plate 4 so that the adhesive material 6 enters the recess 41 of the first intaglio plate 4, and the substrate 2 is placed in the first intaglio plate 4. Is pressed against the intaglio plate 4 to cure the adhesive material 6.
- the method for curing the adhesive material 6 include irradiation with energy rays such as ultraviolet rays and infrared laser beams, heating, heating and cooling, and drying.
- the substrate 2, the adhesive layer 31 and the first conductor layer 32 are released from the first intaglio 4 to obtain the intermediate body 7.
- a second intaglio plate 45 is prepared in which a concave portion 46 having a shape corresponding to the shape of the second electrode pattern 340 and the lead-out wiring 344 in the second conductor layer 34 is formed.
- Examples of the material constituting the second intaglio 45 include the same materials as those of the first intaglio 4 described above.
- the cross-sectional shape of the recess 46 is formed in a tapered shape that becomes narrower toward the bottom.
- a release layer 461 similar to the release layer 411 of the recess 41 is preferably formed on the surface of the recess 46.
- the conductive material is filled into the concave portion 46 of the second intaglio 45.
- Examples of the conductive material that fills the recess 46 include the same materials as the conductive material 5 described above.
- Examples of the method of filling the conductive material into the concave portion 46 of the second intaglio 45 include a dispensing method, an inkjet method, and a screen printing method.
- the conductive material coated other than the recesses is wiped or scraped, blotted, and pasted. , Wash away, and blow away. It can be properly used depending on the composition of the conductive material, the shape of the intaglio, and the like.
- a conductive pattern constituting the second conductive layer 34 is formed by heating the conductive material filled in the concave portions 46 of the second intaglio 45.
- the heating conditions for the conductive material can be appropriately set according to the composition of the conductive material and the like.
- the conductive material filled in the recesses 46 shrinks in volume, and the outer surface excluding the upper surface of the conductive material is formed in a shape along the recesses 46.
- an uneven shape similar to the uneven shape 51 is formed on the upper surface of the conductor pattern.
- the treatment method of the conductive material is not limited to heating.
- Energy rays such as infrared rays, ultraviolet rays, and laser beams may be irradiated, or only drying may be performed. Moreover, you may combine these 2 or more types of processing methods.
- the contact area between the second conductor layer 34 and the resin layer 33 is increased, and the second conductor layer 34 is more firmly formed into the resin layer 33. Can be fixed.
- a resin material 71 constituting the resin layer 33 is applied onto the second intaglio 45.
- a resin material 71 the material which comprises the resin layer 33 mentioned above is used.
- the viscosity of the material constituting the resin layer 33 is preferably 1 mPa ⁇ s to 10,000 mPa ⁇ s from the viewpoint of ensuring sufficient fluidity during application.
- the storage elastic modulus of the cured resin is preferably 10 6 Pa or less, and preferably 10 9 Pa or less, from the viewpoint of durability of the first conductor layer 32 and the second conductor layer 34. More preferred.
- Examples of a method for applying the resin material 71 onto the second intaglio 45 include a screen printing method, a spray coating method, a bar coating method, a dip method, and an ink jet method.
- the intermediate body 7 and the resin material 71 are arranged on the second intaglio plate 45 so that the resin material 71 enters the recess 46 of the second intaglio plate 45, and the intermediate body 7 is pressed against the second intaglio plate 45. Is cured (see FIGS. 12G and 12H).
- Examples of the method for curing the resin material 71 include irradiation with energy rays such as ultraviolet rays and infrared laser light, heating, heating and cooling, and drying.
- the pressure applied when the intermediate body 7 is pressed against the second intaglio 45 is preferably 0.001 MPa to 100 MPa, and more preferably 0.01 MPa to 10 MPa.
- the said pressurization can be performed using a pressure roller etc. Thereby, the resin layer 33 is formed, and the intermediate body 7 and the second conductor layer 34 are bonded and fixed to each other via the resin layer 33.
- the wiring substrate 1 may be manufactured by the method described below. That is, as shown in FIGS. 13A to 13I, after the first intaglio 4 is filled with the conductive material 5 (FIG. 13A) and heated (FIG. 13B), A resin material is applied on the first intaglio 4 (FIG. 13C), and the resin material is hardened (FIG. 13D). Then, the wiring body or the wiring board may be formed by using the hardened resin material as a base material (FIGS. 13E to 13I).
- the first conductor layer 32 is formed on the adhesive layer 31 and the second conductor layer 34 is formed on the resin layer 33.
- the first terminal portion 324T included in the first conductor layer 32 and the second terminal portion 344T included in the second conductor layer are arranged in the thickness direction of the adhesive layer 31 (Z-axis direction in FIG. 8). Are displaced from each other. As a result, the terminal portions 324T and 344T exposed in the same direction can be provided without using an anisotropic conductive adhesive or the like, so that the drawability of the wiring can be improved.
- the first terminal portion 324T protrudes toward the side away from the adhesive layer 31 in the Z-axis direction, and when the first terminal portion 324T is projected in the X-axis direction, The projected portion of one terminal portion 324T overlaps the resin layer 33. For this reason, since the space between the first and second terminal portions 324T and 344T can be reduced, the first and second terminal portions 324T and 344T can be easily taken out.
- the positional relationship between the first terminal portion 324T and the resin layer 33 is the above-described positional relationship (when the first terminal portion 324T is projected in the X-axis direction, the first terminal portion 324T Therefore, the first and second terminal portions 324T and 344T can be disposed in a state where they are close to each other. For this reason, durability of the connection part of the 1st and 2nd terminal parts 324T and 344T and an external connector (not shown) can be improved.
- an optical transparent adhesive material or the like is not interposed between the resin layer 33, the first conductor layer 32, and the adhesive layer 31. For this reason, the whole thickness of the wiring body 3, the wiring board 1, and the touch sensor 10 provided with them can be reduced.
- the thickness of the resin layer 33 (maximum thickness) W 1 the thickness of the first conductor layer 32 (maximum thickness) than W 2 Is also getting bigger. Thereby, it is possible to ensure insulation between the first conductor layer 32 and the second conductor layer 34. For this reason, since both the first electrode pattern 320 and the second electrode pattern 340 can be provided on one main surface of the substrate 2, the wiring body 3, the wiring substrate 1, and the touch sensor 10 including them are thin. Can be achieved.
- the first electrode pattern 320 and the lead wiring 324 are integrally formed, and the second electrode pattern 340 and the lead wiring 344 are integrally formed. Therefore, the connection reliability between the first electrode pattern 320 and the lead wiring 324 and the connection reliability between the second electrode pattern 340 and the lead wiring 344 can be improved.
- the thickness of the resin layer 33 provided only in the portion corresponding to the lead-out wiring 344 depends on the extending direction of the lead-out wiring 344 ( ⁇ in FIG. 11). Since the heights of the first terminal portion 324T and the second terminal portion 344T can be made closer to each other when the tip portion in the Y-axis direction is relatively small, the first and second Connection reliability with terminals (not shown) connected to the terminal portions 324T and 344T can be improved.
- the lead-out wiring 324 of the present embodiment has a tapered shape that becomes narrower toward the second conductor layer 34 side.
- the lead wire 324 has a pressing force when the intermediate body 7 is pressed against the second intaglio 45. Mechanical strength can be improved. For this reason, disconnection of the lead-out wiring 324 during manufacturing or the like can be suppressed, and the durability of the wiring board 1 can be improved.
- the lead-out wiring 344 also has a similar taper shape (taper shape that becomes narrower toward the side away from the first conductor layer 32). Thereby, since the mechanical strength of the second conductor wire 342 can be improved and disconnection can be suppressed, the durability of the wiring body 3, the wiring board 1, and the touch sensor 10 including them can be further improved. .
- the lower surface 328 of the extraction wiring 324 (first terminal portion 324T) and other surfaces (the upper surface 329 and the side portion) other than the lower surface 328 in the cross section in the width direction of the extraction wiring 324 Note also the relative relationship between the surface roughness (that is, the roughness parameter in which the swell component is blocked) and the drawing of the lead-out wiring 324 (first terminal portion 324T) in this embodiment.
- the surface roughness of the lower surface (first adhesive surface) 328 in FIG. 8 is rougher than the surface roughness of the upper surface 329 in FIG. 8 in the lead wiring 324 (first terminal portion 324T).
- the contact area between the lead wiring 324 (first terminal portion 324T) and the adhesive layer 31 is increased, so that the lead wiring 324 (first terminal portion 324T) can be firmly fixed to the adhesive layer 31. .
- durability of the wiring body 3, the wiring board 1, and the touch sensor 10 provided with them can be further improved.
- irregular reflection of light incident from the outside can be suppressed.
- the width of the lead-out wiring 324 (the first terminal portion 324T) is 1 ⁇ m to 5 ⁇ m
- the relative relationship of the surface roughness between the lower surface 328 and the upper surface 329 satisfies the above relationship, so that the adhesive layer 31
- the effect of suppressing irregular reflection of light incident from the outside can be remarkably exhibited while firmly bonding the lead wiring 324 (first terminal portion 324T).
- the surface roughness of the lower surface 348 in FIG. 8 in the lead wiring 344 (second terminal portion 344T) is similarly the upper surface in FIG. 8 in the lead wiring 344 (second terminal portion 344T). Since it is rougher than the surface roughness of 349, the durability of the wiring body 3, the wiring board 1, and the touch sensor 10 including them can be further improved. In addition, irregular reflection of light incident from the outside can be suppressed.
- the width of the lead-out wiring 344 (second terminal portion 344T) is 1 ⁇ m to 5 ⁇ m, the relative relationship of the surface roughness between the lower surface 348 and the upper surface 349 satisfies the above relationship, so that the resin layer 33 The effect of suppressing irregular reflection of light incident from the outside can be remarkably exhibited while firmly bonding the lead wiring 344 (second terminal portion 344T).
- the side portion 327 extends so as to substantially coincide with an imaginary straight line passing through the first and second portions 3271 and 3272.
- the side portion 327 in the cross-section in the width direction of the lead-out wiring 324 (first terminal portion 324T), the side portion 327 has a shape that is recessed inward from the virtual straight line that passes through the first and second portions 3271 and 3272 (the conductor pattern Therefore, irregular reflection of light incident from the outside of the wiring body 3 can be suppressed. Thereby, the visibility of the wiring body 3 can be further improved.
- the side portion 347 extends so as to substantially coincide with an imaginary straight line passing through the first and second portions 3471 and 3472.
- the side portion 347 in the cross-section in the width direction of the lead-out wiring 344 (second terminal portion 344T), the side portion 347 has a shape recessed toward the inner side of the virtual straight line passing through the first and second portions 3471 and 3472 (the conductor pattern Therefore, irregular reflection of light incident from the outside of the wiring body 3 can be suppressed. Thereby, the visibility of the wiring body 3 can be further improved.
- the surface roughness Ra of the lower surface 328 is made relatively rough with respect to the surface roughness Ra of the other surface (the surface including the upper surface 329 and the side portion 323) other than the lower surface 328.
- the irregular reflectance of the wiring body 3 on the other surface side is relatively small with respect to the irregular reflectance of the wiring body 3 on the lower surface 328 side.
- the diffuse reflectance of the wiring body 3 is small, it is possible to suppress the extraction wiring 324 from appearing white and to suppress a decrease in contrast in an area where the extraction wiring 324 can be visually recognized.
- the visibility of the wiring body 3 of this embodiment can be further improved.
- the surface roughness Ra of the lower surface 348 is made relatively rough with respect to the surface roughness Ra of the other surface (the surface including the upper surface 349 and the side portion 343) other than the lower surface 348.
- the irregular reflectance of the wiring body 3 on the other surface side is relatively smaller than the irregular reflectance of the wiring body 3 on the lower surface 348 side.
- the diffuse reflectance of the wiring body 3 is small, it is possible to suppress the lead-out wiring 344 from appearing white, and to suppress a decrease in contrast in an area where the lead-out wiring 344 can be visually recognized.
- the visibility of the wiring body 3 of this embodiment can be further improved.
- the first conductor lines 321 and 322 and the second conductor lines 341 and 342 also have the same shape as the lead-out wirings 324 and 344, and therefore the first and second conductors.
- the lines 321, 322, 341, and 342 can also exhibit the same functions and effects as those of the above-described lead wires 324 and 344. For this reason, the durability of the wiring body 3, the wiring board 1, and the touch sensor 10 including them can be improved and the visibility can be further improved.
- the lead-out wiring 344 is arranged on both sides of the lead-out wiring 324 with a predetermined interval in plan view, but the present invention is not particularly limited to this.
- the lead-out wiring 324 may be arranged on both sides of the lead-out wiring 344 with a predetermined interval in plan view.
- FIG. 14 is a perspective view showing a touch sensor according to the second embodiment of the present invention
- FIG. 15 is a perspective view showing a wiring board according to the second embodiment of the present invention
- FIG. 16 is a cross section taken along line XVI-XVI in FIG. 17 is a sectional view showing a first modification of the second resin layer in the second embodiment of the present invention.
- FIG. 18 is a sectional view taken along the line XVIII-XVIII in FIG.
- the basic configuration of the wiring board 1 (wiring body 3) included in the wiring structure 11 of the present embodiment is the same as that of the first embodiment.
- the configuration of the wiring structure 11 will be described as the second embodiment.
- the wiring board 1 (wiring body 3) will be described only with respect to differences from the first embodiment, and is the same as the first embodiment.
- symbol is attached
- the wiring structure 11 of the present embodiment is used for the touch sensor 10 as in the first embodiment.
- the wiring structure 11 is electrically connected to the wiring board 1 and the wiring body 3 included in the wiring board 1. And a connection wiring board 8 connected to each other.
- the substrate 2 and the adhesive layer 31 are provided with slits 30.
- the slit 30 divides between the first terminal portion 324T and the second terminal portion 344T in a region (resin layer non-forming portion 335) on the adhesive layer 31 where the resin layer 33 is not formed.
- the terminal region 333 is formed to the vicinity of the end portion.
- the slit 30 in the present embodiment is formed in a straight line along the Y-axis direction in FIG. 15, but is not particularly limited thereto, and may be formed in a curved line.
- the thin part 334 which becomes thin gradually toward the 1st terminal part 324T side may be formed in the side surface of the resin layer 33 which faces the resin layer non-formation part 335.
- the presence of the thin portion 334 reduces the step between the first terminal portion 324T and the second terminal portion 344T, so that the connection with the connection wiring board 8 is facilitated, and the connection portion Durability can be improved.
- the slit 30 has the thin portion 334 and the first terminal closest to the thin portion 334 in a cross section perpendicular to the Y-axis direction (the extending direction of the first terminal portion 324T). It is formed between the portion 324T.
- connection wiring substrate 8 is attached to the terminal region 333.
- connection wiring board 8 has a function of connecting the drive circuit C (see FIG. 14) and the wiring board 1, and the connection board 81 and the first connection terminals 82 provided on the connection board 81, respectively. And a second connection terminal 83.
- connection substrate 81 is made of, for example, a film made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide resin (PI), polyetherimide resin (PEI), or the like.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PI polyimide resin
- PEI polyetherimide resin
- connection wiring board 8 faces the wiring board 1 via an anisotropic conductive adhesive 84, and the connection wiring board 8 and the wiring board 1 are fixed to each other.
- anisotropic conductive adhesive 84 include ACF (Anisotropic Conductive Film) manufactured by Dexerials Corporation.
- the portion 2A where the first terminal portion 324T is provided in the wiring board 1 is relatively relative to the portion 2B where the second terminal portion 344T is provided. It is shifted to the connection wiring board 8 side (+ Z axis direction side in FIG. 18). That is, the first and second terminal portions 324T and 344T are displaced from each other along the thickness direction of the adhesive layer 31. Accordingly, the adhesive layer 31 corresponding to the first terminal portion 324T is closer to the connection substrate 81 side than the adhesive layer 31 corresponding to the second terminal portion 344T.
- the distance H 1 between the first terminal portion 324T and the first connection terminal 82 and the distance H 2 between the second terminal portion 344T and the second connection terminal 83 are approximately the same. Preferably they are equal (H 1 ⁇ H 2 ).
- 19A to 19L are cross-sectional views for explaining a method for manufacturing a wiring structure according to the second embodiment of the present invention.
- two first terminal portions 324T and one second terminal portion 344T are provided outside the first terminal portion 324T. Is illustrated.
- the wiring substrate 1 is obtained using a method similar to the method described in the first embodiment (see FIGS. 19A to 19I).
- a slit 30 for dividing the first terminal portion 324T and the second terminal portion 344T is provided by a laser cutter or the like.
- the connection wiring board 8 provided with the first and second connection terminals 82 and 83 is prepared on the connection board 81, and thermocompression bonding is performed so as to face the wiring board 1 through the anisotropic conductive adhesive 84.
- the first terminal portion 324T faces the first connection terminal 82
- the second terminal portion 344T faces the second connection terminal 83.
- thermocompression bonding is performed by applying pressure to the wiring board 1 and the connection wiring board 8 while applying heat to the anisotropic conductive adhesive 84 using a thermocompression bonding apparatus.
- the portion 2A where the first terminal portion 324T is provided in the wiring board 1 is stronger than the portion 2B where the second terminal portion 344T is provided.
- Pressure is applied to bring the adhesive layer 31 corresponding to the first terminal portion 324T closer to the connection substrate 81 side than the adhesive layer 31 corresponding to the second terminal portion 344T.
- the wiring board 1 and the connection wiring board 8 are fixed to each other, and the first and second terminal portions 324T and 344T are electrically connected to the first and second connection terminals 82 and 83, respectively. Connected to obtain the wiring structure 11.
- the wiring structure 11 of the present embodiment includes the wiring body 3, it is possible to obtain the same functions and effects as the functions and effects of the wiring body 3 described in the first embodiment.
- a conductive structure comprising two conductive layers is formed by providing a transparent polymer layer after forming the first conductive layer on a transparent film and forming a second conductive layer on the transparent polymer layer.
- a conductive structure if a wiring for connecting an external wiring board or the like to a conductive layer is provided, the conductive layer may be inferior in the ability to take out the wiring due to the two layers. was there.
- the first conductor layer 32 is formed on the adhesive layer 31, and the second conductor layer 34 is formed on the resin layer 33.
- the first terminal portion 324T included in the first conductor layer 32 and the second terminal portion 344T included in the second conductor layer 34 are displaced from each other along the thickness direction of the adhesive layer 31.
- the adhesive layer 31 and the substrate 2 have a slit 30 that divides between the first terminal portion 324T and the second terminal portion 344T.
- the heights of the first terminal portion 324T and the second terminal portion 344T can be made close to each other (see FIG. 18).
- the heights of the second terminal portions 324T and 344T can be easily aligned, and the wiring take-out property can be improved.
- the connection characteristics between the wiring body 3 and the connection wiring board 8 can also be improved.
- the connection characteristics between the wiring body 3 and the connection wiring board 8 can be further improved.
- the slit is provided on the wiring board 1 side, but the present invention is not limited to this.
- the slit 30 may be omitted from the wiring board 1 and the slit 301 may be provided in the connection wiring board 8.
- the slit 301 is provided so as to divide the first connection terminal 82 and the second connection terminal 83.
- the portion 8A where the first connection terminal 82 is received in the connection wiring board 8 is relatively strongly pressed against the portion 8B where the second connection terminal 83 is provided, so that the first connection The terminal 82 is brought closer to the adhesive layer 31 side than the second connection terminal 83.
- the same effects as those of the above-described embodiment can be obtained.
- the distance H 1 between the first terminal portion 324T and the first connection terminal 82 and the distance H 2 between the second terminal portion 344T and the second connection terminal 83 are approximately the same. It is preferable that they are equal (H 1 ⁇ H 2 ). In this case, the connection characteristics between the wiring body 3 and the connection wiring substrate 8 can be further improved.
- a metal material or a carbon-based material is used as the conductive material constituting the first and second conductor layers.
- the present invention is not particularly limited thereto, and the metal material and the carbon-based material are used.
- a mixture may be used.
- a carbon-based material may be disposed on the upper surface 325 side of the first conductor wire 322 and a metal material may be disposed on the lower surface 326 side.
- a metal material may be disposed on the upper surface 325 side of the first conductor wire 322 and a carbon-based material may be disposed on the lower surface 326 side.
- the substrate 2 may be omitted from the wiring substrate 1 in the above-described embodiment.
- a release sheet is provided on the lower surface of the adhesive layer 31, and the release sheet is peeled off at the time of mounting and adhered to a mounting target (film, surface glass, polarizing plate, display, etc.) and mounted as a wiring body or A wiring board may be configured.
- the mounting target corresponds to an example of the support body of the present invention.
- a wiring body or a wiring board may be configured as a form in which a resin portion covering the second conductor layer 34 is provided and the above-described mounting target is adhered and mounted via the resin portion.
- first electrode pattern in the first conductor layer 32 and the second electrode pattern in the second conductor layer 34 may be configured as shown in FIG.
- the first electrode pattern 320B includes a plurality of rectangular portions 91 and a connecting portion 92 that connects the rectangular portions 91 to each other.
- the rectangular portions 91 are arranged such that diagonal lines are arranged in the Y-axis direction at substantially equal intervals along the Y-axis direction in FIG. 21, and the connecting portion 92 connects the corner portions of the adjacent rectangular portions 91. ing.
- the rectangular portion 91 and the connecting portion 92 have a mesh shape composed of a plurality of conductor wires.
- the second electrode pattern 340B also includes a plurality of rectangular portions 93 and a connecting portion 94 that connects the rectangular portions 93 to each other.
- the rectangular portions 93 are arranged such that diagonal lines are arranged in the X-axis direction at substantially equal intervals along the X-axis direction in FIG. 21, and the connecting portion 94 connects the corner portions of the adjacent rectangular portions 93. ing.
- the rectangular portion 93 and the connecting portion 94 also have a mesh shape composed of a plurality of conductor wires.
- the first electrode patterns 320B are arranged at substantially equal intervals along the X-axis direction in FIG. 21, and the second electrode patterns 340B are arranged at substantially equal intervals along the Y-axis direction in FIG. Is arranged in.
- the first electrode pattern 320B and the second electrode pattern 340B intersect with each other at the connecting portions 92 and 94.
- the wiring body is described as being used for a touch sensor, but the use of the wiring body is not particularly limited thereto.
- the wiring body may be used as a heater by energizing the wiring body and generating heat by resistance heating or the like.
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Abstract
Description
文献の参照による組み込みが認められる指定国については、2015年2月27日に日本国に出願された特願2015-038626号、及び、2015年2月27日に日本国に出願された特願2015-038629号に記載された内容を参照により本明細書に組み込み、本明細書の記載の一部とする。
図1は本発明の第1実施形態におけるタッチセンサを示す斜視図であり、図2は本発明の第1実施形態における第1の導体層を示す平面図であり、図3は本発明の第1実施形態における第2の導体層を示す平面図であり、図4は図3のIV-IV線に沿った断面図であり、図5は図3のV-V線に沿った断面図であり、図6は図3のVI-VI線に沿った断面図である。また、図7は本発明の第1実施形態における第1の導体線の構造を説明するための幅方向の断面図、図8は図1のVIII-VIII線に沿った断面図であり、図9は図1のIX-IX線に沿った断面図であり、図10は本発明の第1実施形態における第2の樹脂層の第1変形例を示す断面図であり、図11は本発明の第1実施形態における第2の導体層の第2変形例を示す断面図(図3のP-P線に相当する断面図)である。
図14は本発明の第2実施形態におけるタッチセンサを示す斜視図、図15は本発明の第2実施形態における配線基板を示す斜視図、図16は図15のXVI-XVI線に沿った断面図、図17は本発明の第2実施形態における第2の樹脂層の第1変形例を示す断面図、図18は図14のXVIII-XVIII線に沿った断面図である。
2・・・基板
21・・・主面
11,11B・・・配線構造体
3・・・配線体
30・・・スリット
31・・・接着層(第1の樹脂層)
311・・・支持部(第1の凸部)
312・・・平状部
32・・・第1の導体層
320、320B・・・第1の電極パターン(第1の電極部)
321、322・・・第1の導体線
323・・・側部
3231・・・第1の部分
3232・・・第2の部分
3233・・・平坦部
324・・・引き出し配線
324T・・・第1の端子部
327・・・側部
3271・・・第1の部分
3272・・・第2の部分
3273・・・平坦部
328・・・下面
329・・・上面
3291・・・平坦部
325・・・上面
3251・・・平坦部
326・・・下面
M・・・導電性材料
B・・・バインダ樹脂
33・・・樹脂層(第2の樹脂層)
331・・・主部
332・・・凸部(第2の凸部)
334・・・肉薄部
335・・・樹脂層非形成部
34・・・第2の導体層
340、340B・・・第2の電極パターン(第2の電極部)
341、342・・・第2の導体線
343・・・側部
3431・・・第1の部分
3432・・・第2の部分
3433・・・平坦部
344・・・引き出し配線
344T・・・第2の端子部
347・・・側部
3471・・・第1の部分
3472・・・第2の部分
3473・・・平坦部
348・・・下面
349・・・上面
3491・・・平坦部
345・・・上面
3451・・・平坦部
346・・・下面
8・・・接続配線基板
301・・・スリット
81・・・接続基板
82・・・第1の接続端子
83・・・第2の接続端子
84・・・異方導電性接着剤
4・・・第1の凹版
41・・・凹部
411・・・離型層
45・・・第2の凹版
46・・・凹部
461・・・離型層
5・・・導電性材料
51・・・凹凸形状
55・・・導電性材料
6・・・接着材料
7・・・中間体
71・・・樹脂材料
Claims (15)
- 第1の樹脂層と、
第1の端子部を有し、前記第1の樹脂層上に設けられた第1の導体層と、
少なくとも前記第1の端子部を除いて前記第1の導体層を覆う第2の樹脂層と、
第2の端子部を有し、前記第2の樹脂層上に直接設けられた第2の導体層と、を備え、
前記第1の端子部及び前記第2の端子部は、前記第1の樹脂層の厚さ方向に沿って相互にずれており、
前記第1の端子部は、前記厚さ方向において、前記第1の樹脂層から離れる側に向かって突出しており、
前記第1の端子部を前記厚さ方向に対して直交する方向に投影した場合、前記第1の端子部の投影部分の少なくとも一部は、前記第2の樹脂層と重なっている配線体。 - 請求項1に記載の配線体であって、
前記第1の導体層は、メッシュ状の第1の電極部をさらに有し、
前記第2の導体層は、メッシュ状の第2の電極部をさらに有し、
前記第1の電極部及び前記第1の端子部は、一体的に形成されており、
前記第2の電極部及び前記第2の端子部は、一体的に形成されている配線体。 - 請求項1又は2に記載の配線体であって、
前記第2の樹脂層の最大厚さは、前記第1の樹脂層の最大厚さよりも大きい配線体。 - 請求項1~3の何れか1項に記載の配線体であって、
前記第2の端子部に対応する前記第2の樹脂層は、前記第1の端子部側に向かって徐々に肉薄となる肉薄部を有する配線体。 - 請求項1~4の何れか1項に記載の配線体であって、
前記第2の端子部に対応する前記第2の樹脂層の厚さは、前記第2の導体層の延在方向における前記第2の端子部側が相対的に小さくなっている配線体。 - 請求項1~5の何れか1項に記載の配線体であって、
前記第1の端子部において、前記第1の樹脂層に接着する第1の接着面の面粗さは、前記第1の接着面と反対側の面の面粗さよりも粗く、
前記第2の端子部において、前記第2の樹脂層に接着する第2の接着面の面粗さは、前記第2の接着面と反対側の面の面粗さよりも粗い配線体。 - 請求項1~6の何れか1項に記載の配線体であって、
前記第1の端子部は、前記第1の樹脂層から離れる側に向かうに従って幅狭となるテーパー形状を有し、
前記第2の端子部は、前記第2の樹脂層から離れる側に向かうに従って幅狭となるテーパー形状を有する配線体。 - 請求項1~7の何れか1項に記載の配線体であって、
前記第1の樹脂層は、前記第1の端子部に向かって突出する第1の凸部を有し、
前記第1の端子部は、前記第1の凸部上に設けられており、
前記第2の樹脂層は、前記第2の端子部に向かって突出する第2の凸部を有し、
前記第2の端子部は、前記第2の凸部上に設けられている配線体。 - 請求項1~8の何れか1項に記載の配線体であって、
前記第1の樹脂層は、前記第1の端子部と前記第2の端子部との間を分断するスリットを有する配線体。 - 請求項9に記載の配線体と、
前記配線体に電気的に接続される接続配線基板と、を含み、
前記接続配線基板は、
接続基板と、
前記第1の端子部に対向するように前記接続基板上に設けられた第1の接続端子と、
前記第2の端子部に対向するように前記接続基板上に設けられた第2の接続端子と、を備えた配線構造体。 - 請求項10に記載の配線構造体であって、
前記第1の端子部に対応する前記第1の樹脂層は、前記第2の端子部に対応する前記第1の樹脂層に比べ、前記接続基板側に接近している配線構造体。 - 請求項1~8の何れか1項に記載の配線体と、前記配線体に電気的に接続される接続配線基板と、を含む配線構造体であって、
前記接続配線基板は、
接続基板と、
前記第1の端子部に対向するように前記接続基板上に設けられた第1の接続端子と、
前記第2の端子部に対向するように前記接続基板上に設けられた第2の接続端子と、を備え、
前記接続基板は、前記第1の接続端子と前記第2の接続端子との間を分断するスリットを有する配線構造体。 - 請求項12に記載の配線構造体であって、
前記第1の接続端子は、前記第2の接続端子に比べ、前記第1の樹脂層側に接近している配線構造体。 - 請求項1~9の何れか1項に記載の配線体、又は、請求項10~13の何れか1項に記載の配線構造体と、
前記配線体又は前記配線構造体を支持する支持体と、を備えた配線基板。 - 請求項14に記載の配線基板を備えたタッチセンサ。
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US10394398B2 (en) | 2019-08-27 |
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