WO2016104576A1 - 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ - Google Patents
気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ Download PDFInfo
- Publication number
- WO2016104576A1 WO2016104576A1 PCT/JP2015/085964 JP2015085964W WO2016104576A1 WO 2016104576 A1 WO2016104576 A1 WO 2016104576A1 JP 2015085964 W JP2015085964 W JP 2015085964W WO 2016104576 A1 WO2016104576 A1 WO 2016104576A1
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- WIPO (PCT)
- Prior art keywords
- layer
- clad material
- silver brazing
- electronic component
- alloy
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 389
- 238000007789 sealing Methods 0.000 title claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 229910052709 silver Inorganic materials 0.000 claims abstract description 240
- 238000005219 brazing Methods 0.000 claims abstract description 237
- 239000004332 silver Substances 0.000 claims abstract description 191
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 190
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 238000005253 cladding Methods 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims description 80
- 238000009792 diffusion process Methods 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 25
- 229910052742 iron Inorganic materials 0.000 claims description 23
- 229910052804 chromium Inorganic materials 0.000 claims description 21
- 238000005304 joining Methods 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 85
- 230000000052 comparative effect Effects 0.000 description 44
- 229910052751 metal Inorganic materials 0.000 description 38
- 239000002184 metal Substances 0.000 description 38
- 229910000881 Cu alloy Inorganic materials 0.000 description 22
- 239000011800 void material Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 12
- 230000008961 swelling Effects 0.000 description 11
- 239000006104 solid solution Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000012535 impurity Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 230000008646 thermal stress Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910000833 kovar Inorganic materials 0.000 description 6
- 229910018054 Ni-Cu Inorganic materials 0.000 description 5
- 229910018481 Ni—Cu Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000007545 Vickers hardness test Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Further insulation means against electrical, physical or chemical damage, e.g. protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
Definitions
- the present invention relates to a hermetic sealing lid, a method for manufacturing a hermetic sealing lid, and an electronic component storage package.
- an electronic component storage package having a hermetic sealing lid material including a brazing material layer is known.
- Such electronic component storage packages are disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2003-158221 and 2001-156193.
- Japanese Patent Application Laid-Open No. 2003-158221 discloses a metal lid made of a clad material joined in a state in which an Ag brazing layer, a Cu layer, a Kovar (registered trademark) metal base material and a Ni layer are laminated, and a quartz crystal
- An electronic component package including a ceramic package in which a diaphragm is accommodated is disclosed.
- the Cu layer is provided to reduce thermal stress after welding and thermal strain during welding.
- the metal lid (cladding material) is formed in a flat plate shape, while the ceramic package is formed in a box shape including a concave portion for accommodating the crystal diaphragm.
- Japanese Patent Laid-Open No. 2001-156193 discloses a metal plate made of Kovar, a brazing material layer made of a low melting point brazing material joined to the lower surface of the metal plate, and an upper side of the metal plate.
- a metal lid formed in a box shape having a concave portion, and a ceramic substrate (electronic component arranging member) in which a crystal resonator is housed. ) Is disclosed.
- Japanese Patent Laid-Open No. 2001-156193 discloses Au alloy, Sn, solder and aluminum alloy as the low melting point brazing material.
- a flat metal lid provided with an Ag brazing layer described in JP-A No. 2003-158221 is used as a metal lid provided with a brazing filler metal layer made of a low melting point brazing material described in JP-A No. 2001-156193.
- a box shape that includes a recess like a lid it is possible to improve the productivity of the ceramic package by suppressing the complexity of the ceramic package made of ceramic that is difficult to process compared to metal materials.
- the inventor of the present application uses a flat clad material having an Ag brazing layer described in JP-A No. 2003-158221 as a metal plate having a brazing filler metal layer made of a low melting point brazing material in JP-A No. 2001-156193.
- a metal lid is formed by bending into a box shape that includes a recess like a lid material, the metal base material made of Kovar is hard, so that cracks are likely to occur in the folded part. discovered.
- heat treatment for softening softening heat treatment
- the clad material is not melted without melting the Ag brazing layer.
- voids are generated at the interface between the Ag brazing layer and the Cu layer. “Void” means a gap generated by separation of two layers at the interface with each other.
- the silver brazing material is scattered together with the released gas, and there is a possibility that the brazing joining becomes insufficient or the silver brazing material adheres to the crystal diaphragm.
- the gas that has flowed into the void is released into the sealed space where the electronic component package is sealed, which may cause problems in the electronic component of the electronic component package.
- the present invention has been made in order to solve the above-described problems, and one object of the present invention is to provide cracks and cracks even when a clad material having a silver brazing layer is formed in a box shape including a recess.
- An object of the present invention is to provide a hermetic sealing lid member in which generation of voids is suppressed, a method for manufacturing the hermetic sealing lid member, and an electronic component storage package including the hermetic sealing lid member.
- the lid for hermetic sealing according to the first aspect of the present invention is a lid for hermetic sealing used for an electronic component storage package including an electronic component placement member on which electronic components are placed, and Ag and Cu And a first brazing layer formed by using Fe or an Fe alloy, and a concave portion formed by bending the clad material. It is formed in the box shape shape containing.
- the lid for hermetic sealing according to the first aspect of the present invention is, as described above, a clad material provided with a first Fe layer joined to a clad material on a silver brazing layer and configured using Fe or an Fe alloy. It consists of.
- a clad material provided with a first Fe layer joined to a clad material on a silver brazing layer and configured using Fe or an Fe alloy. It consists of.
- Ag and Cu contained in the silver brazing layer hardly dissolve in the first Fe layer formed using Fe or Fe alloy, so that almost no solid solution diffusion occurs. .
- it can suppress that Ag and Cu which are contained in a silver brazing layer diffuse into a 1st Fe layer.
- the first Fe layer is disposed between the silver brazing layer and another metal layer formed using Ni or the like, Ag or Cu contained in the silver brazing layer is reduced by the first Fe layer.
- Diffusion to other metal layers can be suppressed.
- the silver brazing component located near the interface between the silver brazing layer and the first Fe layer or other metal layer directly bonded to the silver brazing layer is caused by diffusion. Since it can suppress that it reduces, it can suppress that a void generate
- the first Fe layer is formed using an Fe alloy containing at least one of Co and Cr, and Fe, Co, and Cr total 50 mass%. Included. According to this structure, even when the softening heat treatment is performed, the first Fe layer formed using an Fe alloy in which Ag or Cu contained in the silver brazing layer contains at least one of Co and Cr is almost solid. By not dissolving, it is possible to suppress the diffusion of Ag or Cu contained in the silver brazing layer into the first Fe layer. Moreover, by containing 50 mass% or more of Fe, Co, and Cr in the first Fe layer in total, it is possible to sufficiently suppress the diffusion of Ag and Cu contained in the silver brazing layer into the first Fe layer. . This has been confirmed in an experiment described later.
- the cladding material is bonded onto the first Fe layer, and is bonded to the intermediate layer including at least one of Cu and Ni, and bonded to the intermediate layer, and Fe or And a second Fe layer configured using an Fe alloy.
- the intermediate layer is composed of a layer containing one of Cu and Ni in which Ag and Cu are dissolved, and as a result, when the silver brazing layer and the intermediate layer are in direct contact, the silver brazing layer Ag and Cu easily diffuse into the intermediate layer. Therefore, as described above, by disposing the first Fe layer between the intermediate layer and the silver brazing layer, Ag and Cu contained in the silver brazing layer diffuse into the intermediate layer even when the softening heat treatment is performed.
- the intermediate layer can be made of Cu, so that thermal strain during brazing and joining the second Fe layer and the electronic component arranging member, brazing, The thermal stress due to the thermal expansion difference after the soldering can be relaxed in the intermediate layer. Further, the mechanical strength of the hermetic sealing lid can be easily adjusted by adjusting the composition and thickness of the second Fe layer formed using Fe or an Fe alloy.
- the first Fe layer has a thickness of 1 ⁇ m or more and not more than the thickness of the intermediate layer. If the thickness of the first Fe layer is 1 ⁇ m or more, the thickness of the first Fe layer can be sufficiently secured. Therefore, the first Fe layer diffuses Ag and Cu contained in the silver brazing layer into the intermediate layer. It can be sufficiently suppressed. Further, since the first Fe layer has a thickness equal to or less than the thickness of the intermediate layer, it is possible to suppress the thickness of the first Fe layer from becoming too large. It is possible to suppress thermal stress caused by brazing and thermal stress caused by a difference in thermal expansion after brazing cannot be sufficiently relaxed in the intermediate layer formed using Cu.
- the second Fe layer of the clad material preferably has a Vickers hardness of 110 HV or more and 200 HV or less. If the Vickers hardness of the second Fe layer is 200 HV or less, since the second Fe layer is sufficiently softened, the cladding material having the second Fe layer can be easily bent. Thereby, a clad material can be easily bent into a box shape including a recess. In addition, if the Vickers hardness of the second Fe layer is 110 HV or more, the hardness of the second Fe layer is not excessively small, so that the lid for airtight sealing is prevented from being easily deformed by an external force or the like. Can do.
- the second Fe layer of the clad material preferably has a thickness of 50% or more of the thickness of the clad material. If the thickness of the second Fe layer is 50% or more of the thickness of the cladding material, parameters such as the mechanical strength and thermal expansion coefficient of the cladding material can be mainly determined by the second Fe layer. By appropriately selecting the material (various elements added in addition to Fe), an airtight sealing lid material excellent in airtightness and the like can be produced.
- the first Fe layer is made of an Fe alloy containing Ni that is greater than 0% by mass and equal to or less than 50% by mass. If the first Fe layer is made of an Fe alloy containing Ni, the thermal expansion coefficient of the first Fe layer can be reduced. As a result, the thermal expansion coefficient of the clad material can be reduced, so that it is possible to suppress the occurrence of a large difference in thermal expansion between the electronic component arranging member made of ceramic having a small thermal expansion coefficient and the hermetic sealing lid material. be able to. Further, if the first Fe layer is made of an Fe alloy containing Ni of 50% by mass or less, it is possible to prevent Ag and Cu contained in the silver brazing layer from being easily diffused into the first Fe layer.
- the clad material has an elongation of 10% or more. If the elongation percentage of the clad material is 10% or more, the clad material is sufficiently softened, so that the clad material can be bent easily. Thereby, a clad material can be easily bent into a box shape including a recess.
- the clad material forms an outermost layer on the side opposite to the silver brazing layer, and further includes a Ni layer containing Ni. If the Ni layer is provided on the outermost layer exposed to the outside of the clad material, the Ni layer can improve the corrosion resistance on the surface where the clad material is exposed. Thereby, it can suppress effectively that the airtightness of the electronic component storage package using the airtight sealing cover material falls due to corrosion of the airtight sealing cover material.
- a method for manufacturing a hermetic sealing lid member according to a second aspect of the present invention is a method for manufacturing a hermetic sealing lid member used in an electronic component storage package including an electronic component placement member on which electronic components are placed.
- a silver brazing plate containing Ag and Cu and a first Fe plate composed of Fe or Fe alloy By rolling and joining a silver brazing plate containing Ag and Cu and a first Fe plate composed of Fe or Fe alloy, and performing a first heat treatment for diffusion annealing, Ag and Cu are obtained.
- the material is provided with a step of softening the clad material by performing a second heat treatment.
- the above-described softened clad material having the first Fe layer has no solid solution diffusion of Ag or Cu from the silver brazing layer, suppresses the generation of voids, and is formed into a box shape including a recess. Even if it does, generation
- the step of softening the cladding material includes performing a second heat treatment at a temperature of 700 ° C. or higher and lower than the melting point of the silver brazing layer, or And a step of performing the second heat treatment at a temperature of 650 ° C. or higher and lower than 700 ° C. for a time longer than the time of the first heat treatment.
- the reason why the temperature is specified to be 700 ° C. or higher and lower than the melting point of the silver brazing layer is that it is preferable to set the temperature so as not to melt even the brazing filler metal having a high melting point.
- the clad material can be sufficiently softened.
- the second heat treatment is performed for a longer time than the first heat treatment time in the step of creating the clad material, whereby the clad material is a box shape including a recess. It can be softened to such an extent that it can be formed into a shape. As a result, the generation of cracks in the clad material during bending can be effectively suppressed.
- a silver brazing plate, a first Fe plate, an intermediate layer plate containing at least one of Cu and Ni, and an Fe or Fe alloy are used.
- the intermediate layer containing at least one of Cu and Ni is disposed on the silver brazing layer, the first Fe layer, and the first Fe layer by rolling and joining the second Fe plate configured as described above and performing the first heat treatment.
- the step of softening the cladding material includes performing a second heat treatment to reduce the Vickers hardness in the second Fe layer of the cladding material, Including a step of 110 HV to 200 HV.
- the clad material can be easily bent into a box shape including a recess. If the Vickers hardness of the second Fe layer is 110 HV or more, it is possible to prevent the hermetic sealing lid material from being easily deformed by an external force or the like.
- the step of softening the clad material is such that the clad material has an elongation of 10% or more by performing the second heat treatment. Includes a step of softening the clad material. If the elongation percentage of the clad material is 10% or more, the clad material is sufficiently softened, so that the clad material can be bent easily. Thereby, a clad material can be easily bent into a box shape including a recess.
- the step of forming the cladding material includes rolling joining the silver brazing plate, the first Fe plate, and the Ni plate containing Ni.
- a clad material is formed in which the silver brazing layer, the first Fe layer, and the Ni layer containing Ni are joined so as to constitute the outermost layer on the side opposite to the silver brazing layer The process of carrying out is included. If the Ni layer is provided on the exposed outermost layer, it is possible to effectively suppress the deterioration of the airtightness of the electronic component storage package using the airtight sealing lid.
- the silver brazing plate and the first Fe plate are rolled and joined, the Ni plate can also be joined at the same time, so that the manufacturing process is simplified as compared with the case where the Ni layer is separately formed by plating or the like. Can do.
- An electronic component storage package includes a flat plate-shaped electronic component arranging member on which electronic components are arranged, a silver brazing layer containing Ag and Cu, and joined on the silver brazing layer. Or a first Fe layer composed of an Fe alloy, and a clad material, and the clad material is bent to form a hermetic sealing lid material formed into a box shape including a recess.
- the lid member for hermetic sealing is brazed and joined to the electronic component arranging member by the silver brazing layer in a state where the electronic component arranged in the electronic component arranging member is housed in the recess.
- the lid for airtight sealing according to the first aspect which is formed in a box shape including a recess, and both generation of cracks and voids is suppressed.
- the lid for airtight sealing according to the first aspect which is formed in a box shape including a recess, and both generation of cracks and voids is suppressed.
- the first Fe layer is configured using an Fe alloy including at least one of Co and Cr, and includes 50 mass% or more in total of Fe, Co, and Cr. It is. If comprised in this way, even if softening heat processing is performed, it can suppress that Ag and Cu which are contained in a silver soldering layer diffuse into a 1st Fe layer. Moreover, by containing 50 mass% or more of Fe, Co, and Cr in the first Fe layer in total, it is possible to sufficiently suppress the diffusion of Ag and Cu contained in the silver brazing layer into the first Fe layer. .
- the clad material is bonded onto the first Fe layer, and is bonded to the intermediate layer including at least one of Cu and Ni, and is bonded to the intermediate layer, and Fe or Fe alloy. And a second Fe layer constituted by using. If the first Fe layer is disposed between the intermediate layer and the silver brazing layer, Ag and Cu contained in the silver brazing layer are diffused into the intermediate layer by the first Fe layer even if the softening heat treatment is performed. Can be suppressed. Further, the mechanical strength of the hermetic sealing lid can be easily adjusted by adjusting the composition and thickness of the second Fe layer formed using Fe or an Fe alloy.
- the first Fe layer has a thickness of 1 ⁇ m or more and not more than the thickness of the intermediate layer. If the thickness of the first Fe layer is 1 ⁇ m or more, the first Fe layer can sufficiently suppress the diffusion of Ag and Cu contained in the silver brazing layer into the intermediate layer. In addition, since the first Fe layer has a thickness equal to or less than the thickness of the intermediate layer, it is possible to prevent thermal distortion when brazing and joining the lid for airtight sealing and the electronic component arranging member, and thermal expansion difference after brazing and joining. It is possible to suppress the resulting thermal stress from being sufficiently relaxed in the intermediate layer configured using Cu.
- the second Fe layer of the clad material preferably has a Vickers hardness of 110 HV or more and 200 HV or less. If the Vickers hardness of the second Fe layer is 110 HV or more, it is possible to prevent the hermetic sealing lid material from being easily deformed by an external force or the like. Further, if the Vickers hardness of the second Fe layer is 200 HV or less, the clad material can be easily bent so as to have a box shape including a recess capable of accommodating an electronic component.
- the hermetic sealing lid material in which generation of cracks and voids is suppressed, It is possible to provide a method for manufacturing a hermetically sealing lid member and an electronic component storage package including the hermetic sealing lid member.
- FIG. 3 is a cross-sectional view showing a lid member taken along line 300-300 in FIG. It is the expanded sectional view which showed the layer structure of the cover material by 1st Embodiment of this invention. It is sectional drawing which showed the electronic component storage package using the cover material by 1st and 2nd embodiment of this invention. It is a figure for demonstrating the softening heat processing of the clad material by 1st Embodiment of this invention. It is the expanded sectional view which showed the layer structure of the cover material by 2nd Embodiment of this invention.
- 10 is a cross-sectional photograph of a clad material of Comparative Example 11.
- 10 is a cross-sectional photograph of a clad material of Comparative Example 12.
- 14 is a cross-sectional photograph of a clad material of Comparative Example 13.
- It is a surface photograph of the clad material of Example 11 of the present invention.
- 10 is a surface photograph of a clad material of Comparative Example 11.
- 10 is a surface photograph of a clad material of Comparative Example 12.
- 10 is a cross-sectional photograph of the clad material of Example 21 of the present invention.
- 10 is a cross-sectional photograph of a clad material of Comparative Example 21.
- the lid member 10 is an example of the “hermetic lid member” in the present invention.
- the lid member 10 is formed in a rectangular shape as seen in plan view from above (Z1 side, see FIG. 2), as shown in FIG. Further, as shown in FIG. 2, the lid member 10 includes a flat upper portion 11 formed so as to extend on an XY plane orthogonal to the vertical direction (Z direction), and a lower portion from the entire peripheral portion of the upper portion 11 ( And a wall portion 12 formed so as to extend toward the Z2 side). As a result, the lid 10 is formed with a recess 13 surrounded by the upper portion 11 and the wall portion 12. The recess 13 has an opening 13a below. That is, the lid member 10 is formed in a box shape including the recess 13.
- the lid member 10 is formed with a flange portion 14 extending on the XY plane in a direction away from the upper portion 11 from the side (Z2 side) opposite to the upper portion 11 of the wall portion 12.
- the flange portion 14 is formed over the entire circumference of the wall portion 12.
- the lid member 10 is formed in a box shape including the recess 13 by bending (bending) the clad member 20.
- the clad material 20 has a thickness t1 in the vertical direction.
- the clad material 20 has a silver brazing layer 21, an Fe layer 22, an intermediate layer 23, a base material layer 24, and a Ni layer 25 laminated in order from the lower side to the upper side. It is composed of an overlay type clad material having a five-layer structure joined.
- it is comprised so that the base 30 (refer FIG. 4) comprised using the ceramic mentioned later under the cover material 10 may be arrange
- the silver brazing layer 21 is illustrated, while the other Fe layer 22, intermediate layer 23, base material layer 24, and Ni layer 25 are integrally illustrated.
- the Fe layer 22 is an example of the “first Fe layer” in the present invention.
- the base material layer 24 is an example of the “second Fe layer” in the present invention.
- the silver brazing layer 21 constituting the outermost layer on the Z2 side (base 30 side) of the clad material 20 is configured using a silver brazing material containing Ag and Cu.
- the silver brazing layer 21 is, for example, a 72Ag—Cu alloy composed of about 72% by mass of Ag, unavoidable impurities and the balance Cu, or a 85Ag—Cu alloy composed of about 85% by mass of Ag, unavoidable impurities and the balance Cu.
- An alloy is used.
- the melting point of the silver brazing material is about 780 ° C. or higher, which is higher than that of the aluminum alloy (about 600 ° C.), which is the hottest low melting point brazing material described in Japanese Patent Application Laid-Open No. 2001-156193, and Lower than the melting point of pure Ag (about 960 ° C.).
- the silver brazing layer 21 has a thickness t2 in the vertical direction.
- the silver brazing layer 21 is formed so as to be exposed on the entire surface on the Z2 side of the lid member 10 including the flange portion 14 by constituting the outermost layer on the base 30 side of the clad material 20.
- the Fe layer 22 joined to the silver brazing layer 21 and the intermediate layer 23 (on the silver brazing layer 21) is pure Fe or Fe alloy containing Fe, such as SPCC (cold rolled steel sheet defined in JIS G 3141). It is comprised using.
- the Fe layer 22 is formed using an Fe alloy, an Fe alloy containing at least one of Co and Cr and containing approximately 50% by mass or more of Fe, Co, and Cr is used. Is preferred.
- Fe, Co, and Cr have a property of not forming a solid solution with Ag and Cu in a temperature environment of about 650 ° C. or higher and a melting point of pure Ag (about 960 ° C.) or lower. That is, Ag and Cu are diffused in the Fe layer 22 configured using pure Fe and the Fe layer 22 configured using an Fe alloy containing Fe and at least one of Co and Cr. It is suppressed.
- the Fe layer 22 has a thickness t3 in the vertical direction. The thickness t3 is preferably 1 ⁇ m or more.
- the intermediate layer 23 bonded to the Fe layer 22, the base material layer 24 (on the Fe layer 22) is configured using so-called pure Cu such as oxygen-free copper. Thereby, the intermediate layer 23 can be configured using a metal that is more flexible than the base material layer 24 configured using Fe or an Fe alloy.
- the intermediate layer 23 has a thickness t4 in the vertical direction.
- the thickness t4 is preferably equal to or greater than the thickness t3 of the Fe layer 22. That is, the thickness t3 of the Fe layer 22 is preferably 1 ⁇ m or more and not more than the thickness t4.
- the intermediate layer 23 is made of Cu
- the Ag and the solid solution contained in the silver brazing layer 21 are easily formed under a temperature condition of about 650 ° C. or higher.
- diffusion of Ag or Cu contained in the silver brazing layer 21 into the intermediate layer 23 is suppressed by the Fe layer 22 joined to the silver brazing layer 21 and the intermediate layer 23.
- the formation of voids is suppressed at the interface Ia between the silver brazing layer 21 and the Fe layer 22 directly joined to the silver brazing layer 21.
- the base material layer 24 bonded to the intermediate layer 23 and the Ni layer 25 (on the intermediate layer 23) is a layer that mainly determines parameters such as mechanical strength and thermal expansion coefficient of the clad material 20.
- the base material layer 24 is configured using pure Fe or an Fe alloy containing Fe.
- the Fe alloy constituting the base material layer 24 for example, a 29Ni-17Co—Fe alloy (so-called “Ni” of about 29% by mass, Co of about 17% by mass, inevitable impurities, and the balance Fe) , Kovar (registered trademark), and a Fe alloy having a small thermal expansion coefficient, such as 42Ni-6Cr-Fe alloy composed of about 42% by mass of Ni, about 6% by mass of Cr, inevitable impurities, and the balance Fe.
- the lid member 10 is brazed and joined to the base 30, the difference in thermal expansion between the base 30 made of ceramic having a small thermal expansion coefficient and the base material layer 24 of the lid member 10 is obtained. It can be made smaller. As a result, it is possible to suppress the brazing joint from being peeled off due to the difference in thermal expansion between the base 30 and the base material layer 24 (the lid member 10).
- Fe alloy with a small thermal expansion coefficient Fe alloy containing about 29 mass% or more of Ni is mentioned, for example.
- the Fe layer 22 and the base material layer 24 are made of materials having the same composition of Fe or Fe alloy. Therefore, since the mechanical characteristics of the Fe layer 22 and the base material layer 24 can be matched, the mechanical characteristics of the clad material 20 can be easily adjusted.
- the base material layer 24 has a thickness t5 in the vertical direction.
- the thickness t5 is preferably larger than the thickness t3 of the Fe layer 22, and more preferably larger than the thicknesses of the silver brazing layer 21, the Fe layer 22, the intermediate layer 23, and the Ni layer 25.
- the thickness t5 is more preferably about 50% or more of the thickness t1 of the clad material 20.
- the base material layer 24 has a Vickers hardness of about 110 HV or more and about 200 HV or less.
- the base material layer 24 preferably has a Vickers hardness of about 150 HV or more and about 170 HV or less.
- the Ni layer 25 constituting the outermost layer on the Z1 side (opposite side of the base 30) of the clad material 20 is made of pure Ni that is less likely to corrode in terms of potential.
- the Ni layer 25 has a thickness t6 in the vertical direction.
- the thickness t6 is preferably sufficiently small, for example, about 2 ⁇ m.
- the clad material 20 has an elongation (ratio of elongation at break) of about 10% or more in a tensile test specified in JIS standards.
- the elongation (%) is obtained by ((length of test material at break-length of test material before test (before tension)) / length of test material before test) ⁇ 100.
- the package 100 is an example of the “electronic component storage package” in the present invention.
- the package 100 according to the first embodiment of the present invention includes a lid member 10 and a flat base 30 to which the lid member 10 is brazed and joined below the lid member 10 (Z2 side). 4 shows the silver brazing layer 21 of the lid member 10, while the other Fe layer 22, intermediate layer 23, base material layer 24 and Ni layer 25 (see FIG. 3) are not individually shown. They are shown as a single unit.
- the base 30 is formed using a ceramic such as alumina and is formed in a flat plate shape on the XY plane.
- An electronic component 40 such as a crystal resonator is attached to the upper surface 30 a of the base 30 via bumps 50.
- the lid member 10 is disposed on the upper surface 30 a of the base 30 so that the electronic component 40 is accommodated in the recess 13.
- the cover material 10 is arrange
- the base 30 is an example of the “electronic component arranging member” in the present invention.
- the silver brazing layer 21 provided on the flange portion 14 of the lid member 10 is melted on substantially the entire surface, so that the lid member 10 and the base 30 are brazed and joined.
- the sealing space S is sealed in an airtight state in a state where the electronic component 40 is housed in the sealing space S formed by the concave portion 13 of the lid member 10 and the base 30.
- a metallized layer in which a W layer, a Ni layer, and an Au layer are laminated in this order may be provided in a frame-like region in which the flange portion 14 is arranged in the upper surface 30a of the base 30. With this metallized layer, it is possible to improve the adhesion between the molten silver brazing layer 21 and the base 30.
- a silver brazing material plate (silver brazing plate) containing Ag and Cu, a plate material (first Fe plate) composed of pure Fe or Fe alloy containing Fe, a pure Cu plate material (intermediate layer plate) ), A plate composed of pure Fe or an Fe alloy containing Fe (second Fe plate), and a plate material of pure Ni (Ni plate) are prepared and laminated in this order.
- the thickness ratio of each plate material corresponds to the thickness ratio of each layer (silver brazing layer 21, Fe layer 22, intermediate layer 23, base material layer 24 and Ni layer 25) in the clad material 20.
- the heat treatment during rolling is a heat treatment performed for relaxing the hardening of the metal layer by rolling and for clad joining between the metal layers. Specifically, the heat treatment during rolling is performed for several tens of seconds to about 10 minutes in a temperature environment of about 600 ° C. to about 700 ° C.
- the rolling heat treatment is an example of the “first heat treatment” in the present invention. Further, rolling for rolling joining is performed at a predetermined rolling reduction.
- the continuous clad material 20 is punched into a rectangular shape having a predetermined size by press working, thereby forming a flat clad material 20.
- a heat treatment (softening heat treatment) is performed to soften the flat clad material 20 to such an extent that it can be easily processed into a box shape.
- This softening heat treatment is performed in a temperature environment that is equal to or higher than the temperature at which the base material layer 24 can be softened and lower than the melting point of the silver brazing material constituting the silver brazing layer 21.
- the softening heat treatment is performed for about 3 minutes in a temperature environment of about 700 ° C. or higher and lower than the melting point of the silver brazing material.
- the time for the heat treatment performed in a temperature environment of about 700 ° C. or higher and lower than the melting point of the silver brazing material may be appropriately adjusted depending on the material configuration of the clad material 20 and the like.
- the softening heat treatment is an example of the “second heat treatment” in the present invention.
- the softening heat treatment is longer than the treatment time (about 10 minutes or less) in the heat treatment during rolling even in a temperature environment of about 650 ° C. or more and less than about 700 ° C. under a temperature environment of less than about 700 ° C.
- the substrate layer 24 can be softened.
- the softening heat treatment may be performed for about 30 minutes or more in a temperature environment of about 650 ° C. or more and less than about 700 ° C.
- the time for the heat treatment performed in a temperature environment of about 650 ° C. or more and less than about 700 ° C. may be appropriately adjusted depending on the material configuration of the clad material 20 as long as it is longer than about 10 minutes.
- the heating furnace 101 is filled with a hydrogen (H 2 ) atmosphere or nitrogen (N 2 ) in a state where a flat clad material 20 is disposed in a predetermined heating furnace 101.
- a hydrogen (H 2 ) atmosphere or nitrogen (N 2 ) used in a state where a flat clad material 20 is disposed in a predetermined heating furnace 101.
- Use an inert gas atmosphere such as an atmosphere.
- the inside of the heating furnace 101 is heated using a heat source 102 such as a resistance heating element.
- 5 illustrates the silver brazing layer 21 of the clad material 20, while the other Fe layer 22, intermediate layer 23, base material layer 24 and Ni layer 25 (see FIG. 3) are not individually illustrated. They are shown as a single unit.
- the clad material 20 is easily modified by plasticizing heat treatment. Specifically, by the softening heat treatment, the Vickers hardness of the base material layer 24 is reduced to about 110 HV or more and about 200 HV or less, and the elongation rate of the clad material 20 is modified to about 10% or more.
- the flat clad material 20 is bent using a press machine (not shown). At this time, since the softening heat treatment is performed, the clad material 20 is easily modified by plastic deformation, so that generation of cracks in a bent portion or the like is suppressed. Thereby, the cover material 10 which has the box shape containing the recessed part 13 shown in FIG. 2 is created.
- a flat base 30 is prepared in which the electronic component 40 is bonded onto the upper surface 30a via the bumps 50. Then, the silver brazing material of the silver brazing layer 21 is melted at a temperature of about 780 ° C. or higher in a state where the flange portion 14 of the lid member 10 is disposed on the upper surface 30 a of the base 30 so as to surround the electronic component 40. At this time, the silver brazing material is melted by seam welding or laser welding. Thereby, the box-shaped lid member 10 and the flat base 30 are brazed and joined, and the package 100 is manufactured.
- the lid member 10 and the base 30 are welded in a state where a roller electrode (not shown) is in contact with the Ni layer 25 (see FIG. 2). At this time, the Ni layer 25 having a low electric resistance can suppress the occurrence of a spark between the roller electrode and the lid member 10 during seam welding.
- the generation of voids in the lid member 10 is suppressed, there are almost no problems caused by the gas flowing into the voids.
- the silver brazing material of the silver brazing layer 21 is suppressed from being scattered, and after brazing and joining, the gas taken into the bulge is released into the sealed space S where the package 100 is sealed. Is suppressed.
- the electronic component 40 in the sealing space S is a crystal resonator, the frequency characteristics of the crystal resonator are prevented from changing (deteriorating).
- the softening heat treatment is performed by providing the clad material 20 with the Fe layer 22 bonded to the silver brazing layer 21 and configured using Fe or an Fe alloy.
- Ag and Cu contained in the silver brazing layer 21 can be prevented from diffusing into the Fe layer 22 and the intermediate layer 23.
- the silver brazing located in the vicinity of the interface Ia between the silver brazing layer 21 and the Fe layer 22 directly bonded to the silver brazing layer 21 is reduced due to diffusion. Therefore, the generation of voids at the interface Ia can be suppressed.
- the clad material 20 including the silver brazing layer 21 is formed in a box shape including the recess 13, the occurrence of cracks can be suppressed.
- the package 100 As a result, it is possible to prevent the package 100 from being sufficiently hermetically sealed due to cracks. Further, since the generation of voids is suppressed, the atmospheric gas or residual gas that has flowed into the voids of the lid member 10 is released during or after the brazing joint between the lid member 10 and the base 30. It is possible to suppress problems caused by the problem. Thereby, it can suppress that the silver brazing material of the silver brazing layer 21 scatters at the time of brazing joining. As a result, it is possible to prevent the brazed joint from becoming insufficient or adhering to the electronic component 40.
- the Fe layer 22 is configured using an Fe alloy containing at least one of Co and Cr and containing approximately 50 mass% or more of Fe, Co, and Cr in total. If comprised in this way, even if softening heat processing is performed, it is almost in the Fe layer 22 comprised using the Fe alloy in which Ag and Cu contained in the silver brazing layer 21 contain at least one of Co and Cr. By not dissolving, it is possible to suppress the diffusion of Ag or Cu contained in the silver brazing layer 21 into the Fe layer 22 or the intermediate layer 23. Further, since the total amount of Fe, Co, and Cr in the Fe layer 22 is about 50% by mass or more, it is sufficient that Ag and Cu contained in the silver brazing layer 21 diffuse into the Fe layer 22 and the intermediate layer 23. Can be suppressed.
- the clad material 20 is bonded to the Fe layer 22 and is formed using pure Cu.
- the intermediate layer 23 is bonded to the intermediate layer 23 and is formed using Fe or an Fe alloy.
- the base material layer 24 to be formed is further formed.
- the intermediate layer 23 is made of pure Cu, the intermediate layer 23 can be made flexible to some extent, so that the thermal strain or the brazing when the base material layer 24 and the base 30 are brazed and joined, Thermal stress due to the difference in thermal expansion after the soldering can be relaxed in the intermediate layer 23. Further, the mechanical strength of the lid member 10 can be easily adjusted by adjusting the composition and thickness of the base material layer 24 configured using Fe or an Fe alloy.
- the thickness t3 of the Fe layer 22 can be sufficiently secured by setting the thickness t3 of the Fe layer 22 to about 1 ⁇ m or more. It is possible to sufficiently suppress the diffusion of Ag and Cu contained in the layer 21. Moreover, since the thickness t3 of the Fe layer 22 can be prevented from becoming too large by making the thickness t3 of the Fe layer 22 equal to or less than the thickness t4 of the intermediate layer 23, the lid 10 and the base 30 are connected. It is possible to prevent thermal stress caused by brazing and thermal stress caused by a difference in thermal expansion after brazing from being sufficiently relaxed in the intermediate layer 23 formed using pure Cu.
- the base material layer 24 of the clad material 20 has a Vickers hardness of about 200 HV or less, the base material layer 24 is sufficiently softened.
- the clad material 20 having the base material layer 24 can be easily bent so as to have a box shape including 13.
- the base material layer 24 has a Vickers hardness of 110 HV or higher, the base material layer 24 is not excessively small in hardness, so that the lid member 10 is prevented from being easily deformed by an external force or the like. Can do.
- the thickness t5 of the base material layer 24 of the clad material 20 is set to about 50% or more of the thickness t1 of the clad material 20.
- the thermal expansion coefficient of the Fe layer 22 can be reduced by configuring the Fe layer 22 from an Fe alloy containing Ni.
- the thermal expansion coefficient of the clad material 20 can be made small, it can suppress that a big thermal expansion difference arises in the base 30 comprised from the ceramic with a small thermal expansion coefficient, and the cover material 10.
- FIG. Moreover, it can suppress that Ag and Cu contained in the silver brazing layer 21 are easily diffused into the Fe layer 22 by configuring the Fe layer 22 from an Fe alloy containing Ni of about 50 mass% or less. .
- the clad material 20 is sufficiently softened because the clad material 20 has an elongation of about 10% or more, the clad material 20 can be easily bent. it can. Thereby, the clad material 20 can be easily bent into a box shape including the recess 13.
- the Ni layer 25 in the outermost layer where the cladding material 20 is exposed, the Ni layer 25 can improve the corrosion resistance on the surface where the cladding material 20 is exposed. Thereby, it can suppress effectively that the airtightness of the package 100 using the cover material 10 falls due to corrosion of the cover material 10.
- the softening heat treatment is performed at a temperature of about 700 ° C. or higher and lower than the melting point of the silver brazing layer 21 as the softening heat treatment for softening the clad material 20.
- the softening heat treatment can be performed at a sufficiently high temperature that the silver brazing layer 21 does not melt, so that the clad material 20 can be sufficiently softened.
- the softening heat treatment is performed for a time longer than the time of the heat treatment during rolling even at a temperature of about 650 ° C. or more and less than about 700 ° C.
- the Ni plate can be joined at the same time.
- the manufacturing process can be simplified as compared with the case of forming by plating.
- the lid 110 according to the second embodiment of the present invention has the same external shape as the lid 10 of the first embodiment as shown in FIGS.
- the lid member 110 is formed in a box shape including the recess 13 by bending (bending) the clad member 120 as shown in FIG.
- the clad material 120 has a thickness t11 in the vertical direction.
- the clad material 120 has a silver brazing layer 121, an Fe layer 122, and a Ni layer 125 laminated in order from the lower side (the base 30 (see FIG. 4) side) to the upper side. It is comprised by the overlay type
- the Fe layer 122 is an example of the “first Fe layer” in the present invention.
- the silver brazing layer 121 constituting the outermost layer on the base 30 side (Z2 side) of the clad material 120 has the same composition and configuration as the silver brazing layer 21 of the first embodiment.
- the silver brazing layer 121 has a thickness t12 in the vertical direction.
- the Fe layer 122 joined to the silver brazing layer 121 and the Ni layer 125 (on the silver brazing layer 121) is made of pure Fe or an Fe alloy, similarly to the Fe layer 22 and the base material layer 24 of the first embodiment. Configured.
- the Fe layer 122 has a thickness t13 in the vertical direction.
- the thickness t13 is preferably larger than the thickness t12 of the silver brazing layer 21.
- the thickness t13 is more preferably about 50% or more of the thickness t11 of the clad material 120, and more preferably about 80% or more of the thickness t11.
- the Fe layer 122 is preferably composed of an Fe alloy containing Ni and having a small thermal expansion coefficient. Thereby, the difference in thermal expansion between the base 30 (see FIG.
- the Ni layer 125 constituting the outermost layer on the side opposite to the base 30 side (Z1 side) of the clad material 120 has the same composition and configuration as the Ni layer 25 of the first embodiment.
- the Ni layer 125 has a thickness t16 in the vertical direction.
- the clad material 120 has an elongation (ratio of elongation at break) of about 10% or more in a tensile test specified in JIS standards.
- the structure of the package 100 using the lid member 110 is substantially the same as that of the first embodiment as shown in FIG.
- the manufacturing process of the lid member 110 includes a silver brazing material plate containing Ag and Cu, a plate material formed using pure Fe or an Fe alloy containing Fe, and a pure Ni plate material.
- the first embodiment is substantially the same as the first embodiment except that the layers are laminated in this order and rolled and joined.
- the clad material 120 is provided with the Fe layer 122 bonded to the silver brazing layer 121 and configured by using Fe or an Fe alloy, as in the first embodiment.
- the lid 110 is constituted by the clad material 120 having a three-layer structure joined in a state where the silver brazing layer 121, the Fe layer 122, and the Ni layer 125 are laminated. Since the clad material 120 has a simplified layer structure compared to the five-layer clad material 20 having the intermediate layer 23 and the base material layer 24, the type of the metal plate is selected when the clad material 120 is formed. The cost can be reduced by reducing the number of layers, and the clad material 120 can be easily formed because of the small layer structure. Other effects of the second embodiment are the same as those of the first embodiment except for the effects caused by the intermediate layer 23 and the base material layer 24.
- Example 1 corresponding to the first embodiment, adjacent layers in a state where the silver brazing layer 21, the Fe layer 22, the intermediate layer 23, the base material layer 24, and the Ni layer 25 shown in FIG. 3 are laminated.
- a clad material 20 having a flat plate-like five-layer structure in which the clads were joined to each other was produced.
- the silver brazing layer 21 was formed using a 72Ag—Cu alloy.
- Both the Fe layer 22 and the base material layer 24 were formed using a 29Ni-17Co—Fe alloy.
- the intermediate layer 23 was configured using pure Cu.
- the Ni layer 25 was configured using pure Ni.
- the thickness t1 of the clad material 20 was 90 ⁇ m.
- the thickness t2 of the silver brazing layer 21 was set to 13 ⁇ m.
- the thickness t3 of the Fe layer 22 was 4 ⁇ m.
- the thickness t4 of the intermediate layer 23 was 24 ⁇ m.
- the thickness t5 of the base material layer 24 was set to 45 ⁇ m.
- the thickness t6 of the Ni layer 25 was 4 ⁇ m.
- the clad material 20 of Example 1 was subjected to heat treatment (softening heat treatment) in order to soften. Specifically, softening heat treatment was performed for 3 minutes in a nitrogen atmosphere and at a temperature environment of 700 ° C.
- Example 2 a plate shape in which adjacent layers are clad-bonded in a state where the silver brazing layer 121, the Fe layer 122, and the Ni layer 125 shown in FIG. 6 are laminated.
- a clad material 120 having a three-layer structure was prepared.
- the silver brazing layer 121 was formed using a 72Ag—Cu alloy.
- the Fe layer 122 was formed using a 29Ni-17Co—Fe alloy.
- the Ni layer 125 was configured using pure Ni.
- Example 2 the thickness t11 of the clad material 120 was 84 ⁇ m.
- the thickness t12 of the silver brazing layer 121 was set to 10 ⁇ m.
- the thickness t13 of the Fe layer 122 was set to 70 ⁇ m.
- the thickness t16 of the Ni layer 125 was 4 ⁇ m.
- the softening heat processing was performed with respect to the clad material 120 of Example 2 on the conditions similar to the said Example 1.
- a clad material was prepared in which no Fe layer was provided between the silver brazing layer and the intermediate layer.
- Comparative Example 1 a clad material having a flat plate-like four-layer structure in which a silver brazing layer, an intermediate layer, a base material layer, and a Ni layer were laminated in this order was prepared.
- the clad material of Comparative Example 1 is the same as the clad material 20 of Example 1 except that the Fe layer is not provided.
- Comparative Example 2 instead of the intermediate layer constituted by using pure Cu of Comparative Example 1, a flat plate-like clad material having a four-layer structure in which the intermediate layer was constituted by using pure Ni was prepared.
- the clad material of Comparative Example 2 is the same as the clad material 20 of Example 1 except that the Fe layer is not provided and the intermediate layer is made of pure Ni.
- Comparative Examples 1 and 2 the thickness of the clad material was 86 ⁇ m, and the thickness of the other metal layers was the same as that of Example 1 because the Fe layer was not provided. Then, the softening heat treatment was performed on the clad materials of Comparative Examples 1 and 2 under the same conditions as in Example 1 above.
- Comparative Examples 1 and 2 The voids and blisters formed in Comparative Examples 1 and 2 are considered to be explained by the mechanism shown in FIG. That is, in Comparative Example 1, in the softening heat treatment, the diffusion rate of Ag in the silver brazing layer into the intermediate layer (Cu) is larger than the diffusion rate of Cu in the intermediate layer into the silver brazing layer. A large amount of Ag in the brazing layer diffuses (solid solution diffusion) to the intermediate layer side. As a result, it is considered that the components at the interface of the silver brazing layer are reduced and voids (kirkendall voids) are formed on the silver brazing layer side of the interface.
- a 90-degree bending test was performed on the clad materials of Examples 1 and 2.
- the clad materials of Examples 1 and 2 were bent so that the silver brazing layer 21 (121) side was convex (Ni layer 25 (125) side was concave), and the clad materials of Examples 1 and 2 were Ni
- the cross section of the clad material was observed using a scanning electron microscope.
- the elongations of the clad materials of Examples 1 and 2 were both increased to 10% or more, and the base material layer 24 and the Fe layer 122 made of 29Ni-17Co—Fe alloy were used. Vickers hardness also decreased to 200 HV or less. The elongation of the clad material before the softening heat treatment is about 5%, and the Vickers hardness of the 29Ni-17Co—Fe alloy is about 220 HV. Accordingly, it was confirmed that the clad materials of Examples 1 and 2 were sufficiently softened to have at least the elongation corresponding to the semi-hard material and the Vickers hardness from the hard material.
- the elongation was increased to 20% or more, and the Vickers hardness of the 29Ni-17Co—Fe alloy was decreased to 160 HV or less, so that the softened material was softer than the semi-hard material.
- the cladding materials of Examples 1 and 2 can be easily bent while suppressing the occurrence of cracks.
- a clad material having a two-layer structure including an Fe layer having a different composition and a silver brazing layer composed of 72Ag—Cu alloy or 85Ag—Cu alloy was prepared as an example.
- a clad having a two-layer structure including a metal layer that does not contain Fe and contains at least one of Cu and Ni, and a silver brazing layer composed of 72Ag—Cu alloy or 85Ag—Cu alloy Made the material.
- the thickness of the silver brazing layer was 10 ⁇ m, and the thickness of the Fe layer (metal layer) was 75 ⁇ m.
- Example 11 a clad material of 72Ag—Cu alloy (silver brazing layer) and pure Fe (Fe layer) composed of SPCC was prepared.
- Example 12 a clad material of 72Ag—Cu alloy and 29Ni-17Co—Fe alloy was prepared.
- Example 13 a clad material of 72Ag—Cu alloy and 36Ni—Fe alloy (so-called Invar (registered trademark)) composed of 36% by mass of Ni, the balance Fe and inevitable impurities was prepared.
- Example 14 a clad material of a 72Ag—Cu alloy and a 50Ni—Fe alloy composed of 50% by mass of Ni, the balance Fe, and inevitable impurities was prepared.
- Example 15 a clad material of 72Ag—Cu alloy and 42Ni-6Cr—Fe alloy composed of 42% by mass of Ni, 6% by mass of Cr, the balance Fe and unavoidable impurities was prepared.
- Example 16 a clad material of 72Ag—Cu alloy and 18Cr—Fe alloy composed of 18% by mass of Cr, the balance Fe and inevitable impurities was prepared.
- Example 21 a clad material of 85 g-Cu alloy and 29Ni-17Co-Fe alloy was prepared.
- Comparative Example 11 a clad material of 72Ag—Cu alloy and pure Cu was prepared.
- Comparative Example 12 a clad material of 72Ag—Cu alloy and pure Ni was prepared.
- Comparative Example 13 a clad material of 72Ag—Cu alloy and 30Ni—Cu alloy was prepared.
- Comparative Example 21 a clad material of 85 g-Cu alloy and pure Cu was prepared.
- softening heat treatment was performed on the clad materials of Examples and Comparative Examples. Specifically, heat treatment was performed for 3 minutes in a nitrogen atmosphere and at a temperature environment of 700 ° C. Then, the presence or absence of a void was investigated by observing the cross section of the clad material of an Example and a comparative example using a scanning electron microscope. Further, the surface of the clad material of Example 11 and Comparative Examples 11 and 12 after the softening heat treatment was observed using a scanning electron microscope to examine the presence or absence of swelling caused by void coarsening.
- Example 21 including the Fe layer.
- Comparative Example 21 including a metal layer containing at least one of Cu and Ni without containing any voids voids were generated. From this, it was confirmed that the generation of voids can be suppressed by the Fe layer regardless of the content ratios of Ag and Cu in the silver brazing layer.
- the Ni layers 25 and 125 are provided on the clad materials 20 and 120 constituting the lid materials 10 and 110, respectively.
- the present invention is limited to this. Absent.
- the Ni layer may not be provided on the clad material constituting the hermetic sealing lid material. That is, the clad material may have a two-layer structure or a four-layer structure.
- the clad material having the two-layer structure of Examples 11 to 16 and 21 may be used as it is for the lid for hermetic sealing. At this time, laser welding is preferable to seam welding for the brazing joint between the lid member and the base.
- the clad material constituting the hermetic sealing lid material may have a layer structure of six layers or more.
- the intermediate layer 23 is intended to include at least one of Cu and Ni. That is, the intermediate layer may be made of pure Ni such as NW2201 (JIS standard), Ni—Cu alloy, or the like.
- the Ni—Cu alloy include a 30Ni—Cu alloy composed of about 30% by mass of Ni, inevitable impurities, and the balance Cu.
- the intermediate layer is made of Ni, it hardly contains a solid solution with Ag contained in the silver brazing layer under the temperature condition of about 650 ° C. or higher, but is contained in the silver brazing layer. A solid solution is easily formed with Cu. For this reason, when the silver brazing layer and the intermediate layer made of Ni are in direct contact with each other, voids are generated by the softening heat treatment as in Comparative Examples 2 and 12 above. In the case where the intermediate layer is composed of a Ni—Cu alloy, both Ag and Cu contained in the silver brazing layer easily form a solid solution under a temperature condition of about 650 ° C. or higher.
- the present invention is not limited to this. In this invention, you may form only a recessed part, without forming a flange part in a cover material.
- the base layer 24 has a Vickers hardness of about 110 HV or more and about 200 HV or less, but the present invention is not limited to this.
- the Vickers hardness of the second Fe layer may be less than about 110 HV or greater than about 200 HV.
- the Vickers hardness of the second Fe layer is about 110 HV. Even when configured to be less than or greater than about 200 HV, it is considered possible to sufficiently suppress the occurrence of cracks in bending while suppressing deformation of the hermetic sealing lid member due to external force or the like.
- the Fe layer 122 has a Vickers hardness of about 110 HV or more and about 200 HV or less, but the present invention is not limited to this. In the present invention, the Vickers hardness of the first Fe layer may be less than about 110 HV or greater than about 200 HV.
- the clad materials 20 and 120 have been shown to have an elongation (ratio of elongation at break) of about 10% or more, but the present invention is not limited to this. In the present invention, the cladding material may have an elongation of less than about 10%.
- the Ni layers 25 and 125 are made of pure Ni.
- the present invention is not limited to this.
- the Ni layer may be formed using a Ni alloy.
- the Ni layer is not formed by rolling and bonding to another layer, and a lid having a Ni plating layer (Ni layer) is formed by performing Ni plating after first press-bonding a metal layer other than the Ni layer. Material may be created.
- the clad material 20 and 120 are of the overlay type is shown, but the present invention is not limited to this.
- the clad material may be an inlay type clad material.
Abstract
Description
まず、図1~図3を参照して、本発明の第1実施形態による蓋材10の構造について説明する。なお、蓋材10は、本発明の「気密封止用蓋材」の一例である。
次に、図1、図2、図4および図6を参照して、本発明の第2実施形態による蓋材110の構造について説明する。
次に、図3および図6~図29を参照して、本発明の効果を確認するために行った第1実施形態および第2実施形態に対応するクラッド材の観察および機械的強度の測定と、銀ろう材層と所定の金属層との2層構造のクラッド材の観察とについて説明する。
まず、上記第1実施形態に対応する実施例1として、図3に示す銀ろう層21、Fe層22、中間層23、基材層24およびNi層25が積層された状態で、隣接する層同士がクラッド接合された、平板状の5層構造のクラッド材20を作成した。この際、銀ろう層21を72Ag-Cu合金を用いて構成した。Fe層22および基材層24を、共に、29Ni-17Co-Fe合金を用いて構成した。中間層23を、純Cuを用いて構成した。Ni層25を、純Niを用いて構成した。
次に、軟質化熱処理後の実施例1および2の平板状のクラッド材に対して、各々、機械的強度を測定した。具体的には、JIS規格に基づく引張試験を行うことによって、実施例1および2の伸び(破断伸び)を測定した。また、JIS規格に基づくビッカース硬さ試験を行うことによって、共に29Ni-17Co-Fe合金を用いて構成された基材層24およびFe層122のビッカース硬さを測定した。
次に、組成が異なるFe層と、72Ag-Cu合金または85Ag-Cu合金を用いて構成された銀ろう層とからなる2層構造のクラッド材を実施例として作成した。また、比較例として、Feを含まずに、CuおよびNiの少なくとも一方を含む金属層と、72Ag-Cu合金または85Ag-Cu合金を用いて構成された銀ろう層とからなる2層構造のクラッド材を作成した。なお、銀ろう層の厚みを10μmにするとともに、Fe層(金属層)の厚みを75μmにした。
13 凹部
20、120 クラッド材
21、121 銀ろう層
22、122 Fe層(第1Fe層)
23 中間層
24 基材層(第2Fe層)
25 Ni層
30 基台(電子部品配置部材)
40 電子部品
100 パッケージ(電子部品収納パッケージ)
Claims (20)
- 電子部品(40)が配置される電子部品配置部材(30)を含む電子部品収納パッケージ(100)に用いられる気密封止用蓋材(10)であって、
AgとCuとを含有する銀ろう層(21)と、
前記銀ろう層上に接合され、FeまたはFe合金を用いて構成される第1Fe層(22)と、を備える、クラッド材(20)により構成され、
前記クラッド材が曲げられることにより、凹部(13)を含む箱型形状に形成されている、気密封止用蓋材。 - 前記第1Fe層は、少なくともCoおよびCrの一方を含むFe合金を用いて構成され、FeとCoとCrとが合計で50質量%以上含まれている、請求項1に記載の気密封止用蓋材。
- 前記クラッド材は、
前記第1Fe層上に接合され、少なくともCuおよびNiの一方を含む中間層(23)と、
前記中間層上に接合され、FeまたはFe合金を用いて構成される第2Fe層(24)とをさらに備えている、請求項1または2に記載の気密封止用蓋材。 - 前記第1Fe層は、1μm以上で、かつ、前記中間層の厚み以下の厚みを有する、請求項3に記載の気密封止用蓋材。
- 前記クラッド材の前記第2Fe層は、110HV以上200HV以下のビッカース硬さを有する、請求項3に記載の気密封止用蓋材。
- 前記クラッド材の前記第2Fe層は、前記クラッド材の厚みの50%以上の厚みを有する、請求項3に記載の気密封止用蓋材。
- 前記第1Fe層は、0質量%より大きく50質量%以下のNiを含むFe合金を用いて構成されている、請求項1に記載の気密封止用蓋材。
- 前記クラッド材は、10%以上の伸び率を有する、請求項1または2に記載の気密封止用蓋材。
- 前記クラッド材は、前記銀ろう層とは反対側において最外層を構成し、Niを含有するNi層(25)をさらに備える、請求項1または2に記載の気密封止用蓋材。
- 電子部品(40)が配置される電子部品配置部材(30)を含む電子部品収納パッケージ(100)に用いられる気密封止用蓋材(10)の製造方法であって、
AgとCuとを含有する銀ろう板とFeまたはFe合金を用いて構成された第1Fe板とを圧延接合するとともに拡散焼鈍のための第1の熱処理を行うことによって、AgとCuとを含有する銀ろう層(21)と、前記銀ろう層上に配置され、FeまたはFe合金を用いて構成される第1Fe層(22)とが接合されたクラッド材(20)を形成する工程と、
第2の熱処理を行うことにより前記クラッド材を軟質化する工程と、
軟質化された前記クラッド材を曲げ加工することによって、凹部(13)を含む箱型形状の前記気密封止用蓋材を形成する工程と、を備える、気密封止用蓋材の製造方法。 - 前記クラッド材を軟質化する工程は、700℃以上前記銀ろう層の融点未満の温度で前記第2の熱処理を行うか、または、650℃以上700℃未満の温度で前記第1の熱処理の時間よりも長い時間前記第2の熱処理を行う工程を含む、請求項10に記載の気密封止用蓋材の製造方法。
- 前記クラッド材を形成する工程は、前記銀ろう板と、前記第1Fe板と、少なくともCuおよびNiの一方を含む中間層用板と、FeまたはFe合金を用いて構成された第2Fe板とを圧延接合するとともに前記第1の熱処理を行うことによって、前記銀ろう層と、前記第1Fe層と、前記第1Fe層上に配置され、少なくともCuおよびNiの一方を含む中間層(23)と、前記中間層上に配置され、FeまたはFe合金を用いて構成される第2Fe層(24)とが接合された前記クラッド材を形成する工程を含む、請求項10または11に記載の気密封止用蓋材の製造方法。
- 前記クラッド材を軟質化する工程は、前記第2の熱処理を行うことにより、前記クラッド材の前記第2Fe層におけるビッカース硬さを、110HV以上200HV以下にする工程を含む、請求項12に記載の気密封止用蓋材の製造方法。
- 前記クラッド材を軟質化する工程は、前記第2の熱処理を行うことにより、前記クラッド材が10%以上の伸び率を有するように前記クラッド材を軟質化する工程を含む、請求項10または11に記載の気密封止用蓋材の製造方法。
- 前記クラッド材を形成する工程は、前記銀ろう板と、前記第1Fe板と、Niを含有するNi板とを圧延接合するとともに前記第1の熱処理を行うことによって、前記銀ろう層と、前記第1Fe層と、前記銀ろう層とは反対側において最外層を構成するように、Niを含有するNi層(25)とが接合された前記クラッド材を形成する工程を含む、請求項10または11に記載の気密封止用蓋材の製造方法。
- 電子部品(40)が配置される平板状の電子部品配置部材(30)と、
AgとCuとを含有する銀ろう層(21)と、前記銀ろう層上に接合され、FeまたはFe合金を用いて構成される第1Fe層(22)と、を含む、クラッド材(20)により構成され、前記クラッド材が曲げられることにより、凹部(13)を含む箱型形状に形成された気密封止用蓋材と、を備え、
前記気密封止用蓋材は、前記電子部品配置部材に配置された前記電子部品が前記凹部の内部に収納された状態で、前記銀ろう層により前記電子部品配置部材に対してろう付け接合されている、電子部品収納パッケージ(100)。 - 前記第1Fe層は、少なくともCoおよびCrの一方を含むFe合金を用いて構成され、FeとCoとCrとが合計で50質量%以上含まれている、請求項16に記載の電子部品収納パッケージ。
- 前記クラッド材は、前記第1Fe層上に接合され、少なくともCuおよびNiの一方を含む中間層(23)と、前記中間層上に接合され、FeまたはFe合金を用いて構成される第2Fe層(24)をさらに含んでいる、請求項16または17に記載の電子部品収納パッケージ。
- 前記第1Fe層は、1μm以上で、かつ、前記中間層の厚み以下の厚みを有する、請求項18に記載の電子部品収納パッケージ。
- 前記クラッド材の前記第2Fe層は、110HV以上200HV以下のビッカース硬さを有する、請求項18に記載の電子部品収納パッケージ。
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US15/536,285 US10595424B2 (en) | 2014-12-26 | 2015-12-24 | Hermetic sealing lid member |
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US20170354049A1 (en) | 2017-12-07 |
US20190289738A1 (en) | 2019-09-19 |
US11178786B2 (en) | 2021-11-16 |
CN107112287B (zh) | 2019-06-18 |
TW201637136A (zh) | 2016-10-16 |
JP2016127055A (ja) | 2016-07-11 |
KR101918877B1 (ko) | 2018-11-14 |
EP3240022A1 (en) | 2017-11-01 |
US10595424B2 (en) | 2020-03-17 |
EP3240022B1 (en) | 2021-06-16 |
KR20170075750A (ko) | 2017-07-03 |
CN107112287A (zh) | 2017-08-29 |
EP3240022A4 (en) | 2018-09-12 |
JP6421595B2 (ja) | 2018-11-14 |
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