JP6421595B2 - 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ - Google Patents
気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ Download PDFInfo
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- 238000005219 brazing Methods 0.000 claims description 221
- 239000004332 silver Substances 0.000 claims description 174
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 173
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- 229910000640 Fe alloy Inorganic materials 0.000 claims description 61
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
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- 238000007545 Vickers hardness test Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
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- B32B15/00—Layered products comprising a layer of metal
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
まず、図1〜図3を参照して、本発明の第1実施形態による蓋材10の構造について説明する。なお、蓋材10は、本発明の「気密封止用蓋材」の一例である。
次に、図1、図2、図4および図6を参照して、本発明の第2実施形態による蓋材110の構造について説明する。
次に、図3および図6〜図29を参照して、本発明の効果を確認するために行った第1実施形態および第2実施形態に対応するクラッド材の観察および機械的強度の測定と、銀ろう材層と所定の金属層との2層構造のクラッド材の観察とについて説明する。
まず、上記第1実施形態に対応する実施例1として、図3に示す銀ろう層21、Fe層22、中間層23、基材層24およびNi層25が積層された状態で、隣接する層同士がクラッド接合された、平板状の5層構造のクラッド材20を作成した。この際、銀ろう層21を72Ag−Cu合金を用いて構成した。Fe層22および基材層24を、共に、29Ni−17Co−Fe合金を用いて構成した。中間層23を、純Cuを用いて構成した。Ni層25を、純Niを用いて構成した。
次に、軟質化熱処理後の実施例1および2の平板状のクラッド材に対して、各々、機械的強度を測定した。具体的には、JIS規格に基づく引張試験を行うことによって、実施例1および2の伸び(破断伸び)を測定した。また、JIS規格に基づくビッカース硬さ試験を行うことによって、共に26Ni−17Co−Fe合金を用いて構成された基材層24およびFe層122のビッカース硬さを測定した。
次に、組成が異なるFe層と、72Ag−Cu合金または85Ag−Cu合金を用いて構成された銀ろう層とからなる2層構造のクラッド材を実施例として作成した。また、比較例として、Feを含まずに、CuおよびNiの少なくとも一方を含む金属層と、72Ag−Cu合金または85Ag−Cu合金を用いて構成された銀ろう層とからなる2層構造のクラッド材を作成した。なお、銀ろう層の厚みを10μmにするとともに、Fe層(金属層)の厚みを75μmにした。
13 凹部
20、120 クラッド材
21、121 銀ろう層
22、122 Fe層(第1Fe層)
23 中間層
24 基材層(第2Fe層)
30 基台(電子部品配置部材)
100 パッケージ(電子部品収納パッケージ)
Claims (9)
- 電子部品が配置される電子部品配置部材を含む電子部品収納パッケージに用いられる気密封止用蓋材であって、
AgとCuとを含有する銀ろう層と、
前記銀ろう層上に接合され、FeまたはFe合金を用いて構成される第1Fe層と、
前記第1Fe層上に接合され、少なくともCuおよびNiの一方を含む中間層と、
前記中間層上に接合され、FeまたはFe合金を用いて構成される第2Fe層とを備える、クラッド材により構成され、
前記クラッド材が曲げられることにより、凹部を含む箱型形状に形成されている、気密封止用蓋材。 - 前記第1Fe層は、少なくともCoおよびCrの一方を含むFe合金を用いて構成され、FeとCoとCrとが合計で50質量%以上含まれている、請求項1に記載の気密封止用蓋材。
- 前記第1Fe層は、1μm以上で、かつ、前記中間層の厚み以下の厚みを有する、請求項1または2に記載の気密封止用蓋材。
- 前記クラッド材の前記第2Fe層は、110HV以上200HV以下のビッカース硬さを有する、請求項1〜3のいずれか1項に記載の気密封止用蓋材。
- 前記クラッド材は、10%以上の伸び率を有する、請求項1〜4のいずれか1項に記載の気密封止用蓋材。
- 電子部品が配置される電子部品配置部材を含む電子部品収納パッケージに用いられる気密封止用蓋材の製造方法であって、
AgとCuとを含有する銀ろう板とFeまたはFe合金を用いて構成されたFe板とを圧延接合するとともに拡散焼鈍のための第1の熱処理を行うことによって、AgとCuとを含有する銀ろう層と、前記銀ろう層上に接合され、FeまたはFe合金を用いて構成される第1Fe層と、前記第1Fe層上に接合され、少なくともCuおよびNiの一方を含む中間層と、前記中間層上に接合され、FeまたはFe合金を用いて構成される第2Fe層とを備えるクラッド材を形成する工程と、
第2の熱処理を行うことにより前記クラッド材を軟質化する工程と、
軟質化された前記クラッド材を曲げ加工することによって、凹部を含む箱型形状の前記気密封止用蓋材を形成する工程と、を備える、気密封止用蓋材の製造方法。 - 前記クラッド材を軟質化する工程は、700℃以上前記銀ろう層の融点未満の温度で前記第2の熱処理を行うか、または、650℃以上700℃未満の温度で前記第1の熱処理の時間よりも長い時間前記第2の熱処理を行う工程を含む、請求項6に記載の気密封止用蓋材の製造方法。
- 前記クラッド材を軟質化する工程は、前記クラッド材が10%以上の伸び率を有するように前記クラッド材を軟質化する工程を含む、請求項6または7に記載の気密封止用蓋材の製造方法。
- 電子部品が配置される平板状の電子部品配置部材と、
AgとCuとを含有する銀ろう層と、前記銀ろう層上に接合され、FeまたはFe合金を用いて構成される第1Fe層と、前記第1Fe層上に接合され、少なくともCuおよびNiの一方を含む中間層と、前記中間層上に接合され、FeまたはFe合金を用いて構成される第2Fe層と、を含む、クラッド材により構成され、前記クラッド材が曲げられることにより、凹部を含む箱型形状に形成された気密封止用蓋材と、を備え、
前記気密封止用蓋材は、前記電子部品配置部材に配置された前記電子部品が前記凹部の内部に収納された状態で、前記銀ろう層により前記電子部品配置部材に対してろう付け接合されている、電子部品収納パッケージ。
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JP2014264538A JP6421595B2 (ja) | 2014-12-26 | 2014-12-26 | 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ |
EP15873144.8A EP3240022B1 (en) | 2014-12-26 | 2015-12-24 | Lid for hermetic sealing, method for producing lid for hermetic sealing, and hermetic electronic package with lid |
CN201580070689.8A CN107112287B (zh) | 2014-12-26 | 2015-12-24 | 气密密封用盖材、气密密封用盖材的制造方法和电子部件收纳封装体 |
KR1020177012049A KR101918877B1 (ko) | 2014-12-26 | 2015-12-24 | 기밀 밀봉용 덮개재, 기밀 밀봉용 덮개재의 제조 방법 및 전자 부품 수납 패키지 |
US15/536,285 US10595424B2 (en) | 2014-12-26 | 2015-12-24 | Hermetic sealing lid member |
PCT/JP2015/085964 WO2016104576A1 (ja) | 2014-12-26 | 2015-12-24 | 気密封止用蓋材、気密封止用蓋材の製造方法および電子部品収納パッケージ |
TW104143806A TWI636527B (zh) | 2014-12-26 | 2015-12-25 | 氣密密封用蓋材、氣密密封用蓋材之製造方法及電子零件收納用包裝 |
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