WO2016086603A1 - 金属线的修复方法及修复设备 - Google Patents

金属线的修复方法及修复设备 Download PDF

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Publication number
WO2016086603A1
WO2016086603A1 PCT/CN2015/078739 CN2015078739W WO2016086603A1 WO 2016086603 A1 WO2016086603 A1 WO 2016086603A1 CN 2015078739 W CN2015078739 W CN 2015078739W WO 2016086603 A1 WO2016086603 A1 WO 2016086603A1
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WIPO (PCT)
Prior art keywords
fracture
metal wire
metal
laser beam
repaired
Prior art date
Application number
PCT/CN2015/078739
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English (en)
French (fr)
Inventor
魏平玉
韩磊
郭栋
吴涛
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/888,643 priority Critical patent/US9772533B2/en
Priority to EP15784264.2A priority patent/EP3229062B1/en
Publication of WO2016086603A1 publication Critical patent/WO2016086603A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G02F1/136263—Line defects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H01L23/5254—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present disclosure relates to the field of display manufacturing technology, and in particular to a metal wire repairing method and a repairing device.
  • the liquid crystal substrate of the box is cut into liquid crystal panels of different sizes, and then the lighting detection process is required for each liquid crystal panel to detect various kinds of liquid crystal panels.
  • the electrical defect is a large proportion of bad, mainly including bright spots, open circuits (including data lines, gate lines and common lines), short circuits (including data lines, gate lines and common lines short circuit), X bright / Dark lines and Y light/dark lines are not good.
  • the disconnection failure mainly occurs in two positions: the first one is the metal wire break in the display area of the liquid crystal panel. When such a bad light is detected, it appears as a bright line or a dark line that does not penetrate the full screen; the second type occurs in the terminal area.
  • Metal wire break data line terminal or gate line terminal, which is a bright line or dark line phenomenon that runs through the full screen when performing the lighting detection.
  • FIG. 1a is a schematic structural view of a terminal area of a general liquid crystal panel
  • FIG. 1b is an enlarged view of a structure of a terminal area.
  • the liquid crystal panel includes an array substrate 1 and a color filter substrate 2 disposed opposite to each other.
  • the array substrate 1 has a larger size than the color filter substrate 2, and thus is formed as an array substrate 1 portion extending from the edge of the color filter substrate 2 in FIGS. 1a and 1b.
  • the terminal region 3 is disposed on the portion of the edge of the array substrate 1 that extends relative to the color filter substrate 2, and is exposed.
  • the terminal area 3 is a portion of the data line or the metal line of the gate line extending, and is usually disposed on the left side and the upper side of the liquid crystal panel, the left side is a gate line terminal, and the upper side is a data line terminal.
  • the metal wire breakage occurring in the display area of the liquid crystal panel can be repaired by two methods, one is repaired by a special repair line set on the panel, and the other method is through a specific image.
  • the prime structure is repaired by various lines in the pixel.
  • the metal breakage occurring in the terminal area 3 cannot be repaired by the special repair line, and since the terminal metal disconnection 4 (shown in FIG. 1b) has no pixel structure or other lines, it cannot be repaired by other lines.
  • the metal line is easily damaged, especially in the cutting process.
  • the glass debris often causes a large number of metal lines to be scratched, resulting in a bright/dark line. The resulting, resulting in panel NG. Therefore, there is an urgent need for a method for repairing defective metal wires in a terminal area to improve yield and improve economic efficiency.
  • the purpose of the technical solution of the present disclosure is to provide a method and a repairing device for repairing a metal wire, which can be adapted to the poor repair of the metal wire in the terminal area of the display panel.
  • the present disclosure provides a method of repairing a metal wire, the repairing method comprising:
  • the repair method described above further includes:
  • the repair method described above further includes:
  • a protective film layer is sprayed on the exposed metal wire at the first position to the second position.
  • the repairing method before the positioning of the first position and the second position on the metal wire, the repairing method further includes:
  • the repairing method described above before filling the gap on the insulating layer under the fracture, the repairing method further comprises:
  • the insulating layer under the fracture is removed such that a gap of the insulating layer under the fracture corresponds to the fracture.
  • the step of removing the insulating layer located under the fracture according to the repairing method described above specifically includes:
  • the third position and/or the fourth position are located at an edge of the fracture.
  • the first laser beam and the second laser beam are respectively scanned a plurality of times.
  • the present disclosure also provides a metal wire repairing device, the repairing device comprising:
  • a first laser output device for outputting a first laser beam
  • a first positioning device configured to position a first position on the metal wire to be repaired, wherein the first position is located on a first side of a fracture of the metal wire to be repaired;
  • control device for controlling the first laser output device to move the first laser beam from the first position toward the fracture to melt between the first position and the fracture a metal wire and causing the molten metal to flow toward the fracture to fill the fracture.
  • the repairing device described above further includes:
  • a second laser output device for outputting a second laser beam
  • a second positioning device configured to position a second position on the metal wire to be repaired, wherein the second position is located on a second side of the fracture of the metal wire to be repaired;
  • control device is further configured to control the second laser output device to move the second laser beam from the second position toward the fracture to melt the second position and the A metal line between the fractures and causing the molten metal to flow toward the fracture to fill the fracture.
  • the repairing device described above further includes:
  • a spraying device for spraying a protective film layer on the exposed metal wire at the first position to the second position after the fracture is filled.
  • the first positioning device and the second positioning device respectively comprise:
  • An image acquisition unit configured to capture an image of the metal wire to be repaired
  • An image analyzing unit configured to determine a position of the fracture of the metal wire to be repaired
  • a positioning unit configured to locate the first location or the second location, and transmit information of the first location and the second location to the control device.
  • Laser beam irradiation is used to irradiate the metal near the fracture of the repaired metal wire, so that the metal irradiated by the laser beam is melted, and the laser beam is moved from the first position toward the fracture and the metal wire is scanned, and induced by laser.
  • the molten metal flows from the first position toward the fracture, and the broken wires are connected. Therefore, the repair of the fracture is completed by the metal wire itself, without using other special repair wires, so that it can be applied to the terminal area of the display panel without the special repair line.
  • 1a is a schematic structural view of a terminal area of a general liquid crystal panel
  • Figure 1b is an enlarged view of the structure of the terminal area
  • FIGS. 2a to 2c are schematic flowcharts of a repairing method according to a first embodiment of the present disclosure
  • 3a to 3c are schematic flowcharts of a repairing method according to a second embodiment of the present disclosure
  • FIGS. 4a to 4f are schematic flowcharts of a repairing method according to a third embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a repairing apparatus according to an embodiment of the present disclosure.
  • the laser beam is irradiated to the metal in the vicinity of the wire break to melt the metal irradiated by the laser beam, and the laser beam is moved from the first position toward the fracture and scanned.
  • the metal wire uses the laser to induce the molten metal to flow from the first position toward the fracture, thereby connecting the broken wires. Therefore, the repair of the fracture is completed by the metal wire itself, and the special terminal can be applied to the terminal area of the display panel without using other special repair wires. There is no special repair line.
  • the present disclosure provides a repairing method of the first embodiment, in which a laser beam is used to move in a direction of a fracture at a side of a fracture, so that the metal on the fracture side of the metal wire is melted and flows toward the fracture, so that the metal flowing after melting will Fracture fill to connect the broken two parts to complete the repair.
  • the terminal region portion includes, in order from bottom to top, a glass substrate 10, a first insulating layer 20, a metal wire layer 30 and a second insulating layer 40.
  • a pattern is generated as shown in FIG. 2a.
  • the fracture 50 extends from the second insulating layer 40 of the upper layer to the wire layer 30.
  • Step of repairing the fracture 50 of Fig. 2a by using the repairing method described in the first embodiment of the present disclosure The steps include:
  • Step 1 positioning a first position A on the metal line of the fracture line 50 of the metal wire layer 30, the first position A being located on one side of the fracture 50 (as shown on the left side of FIG. 2a, of course, On the right side);
  • Step 2 positioning the first laser beam at the first position A, and controlling the first laser beam to move in a direction from the first position A toward the fracture 50 in the direction of the arrow of FIG. 2a and scanning at the first position A and
  • the metal wire between the fractures 50 melts the metal wire between the first position A and the fracture 50, and the molten metal is pushed by the first laser beam as it is scanned toward the fracture 50, so that the molten metal flows toward the fracture 50.
  • Step 3 when the first laser beam scanning through the above step 2, the molten metal flowing toward the fracture 50 cannot completely connect the metal wires located in the fracture 50, or even if it can be connected, the thickness of the metal in the fracture 50 is insufficient.
  • the above step 2 is repeated a plurality of times until the two parts of the disconnection are completely connected; of course, when the above step 2 is repeatedly performed, the first position A of the starting point of the first laser beam scanning, It may be fixed or not fixed as long as the molten metal can be filled enough to fill the fracture 50, as shown in Fig. 2b;
  • step 4 the protective film layer 60 is sprayed on the exposed metal wire by the spraying device.
  • the starting position is not farthest from the fracture 50.
  • the protective film layer 60 needs to be sprayed between the first position A and the rightmost edge of the fracture 50, so that the sprayed protective film layer 60 connects the two portions of the broken second insulating layer 40. stand up.
  • the first laser beam used may be an infrared laser having a wavelength of 1064 nm or a visible laser having a wavelength of 532 nm, or may be a laser of other wavelengths, a laser of a different wavelength, and
  • the metal on the left side of the fracture 50 is lasered by repeated laser action. Under the action of melting and fixed to the fracture 50, the metal on both sides of the fracture 50 can be finally connected together, and a certain thickness is ensured, the two parts are effectively connected, and the broken metal wire layers are reconnected together to realize the electrical signal. The delivery, thus successfully repairing bad.
  • the setting of the first position A described above can repair the size of the fracture and the laser process as needed.
  • Parameter setting According to experience, those skilled in the art can determine the above-mentioned laser process parameters and the distance between the first position A and the fracture according to the material, the thickness and the size of the fracture of the metal wire.
  • the two parts of the disconnection cannot be effectively connected. It can further include:
  • a laser scanning process is added on the second side of the fracture to melt the metal on the second side of the fracture and flow toward the fracture to fill the fracture from the direction of the second side, thereby increasing the amount of metal at the fracture, further ensuring The two parts of the broken metal wire are operatively connected.
  • the present disclosure also provides a repairing method of the second embodiment.
  • two laser beams are used to perform opposite scanning on the two sides of the fracture toward the fracture, so that the metals on both sides of the fracture on the metal wire are respectively melted.
  • the opposite direction flows toward the fracture, so that the metal flowing after the melting fills the fracture to join the broken two parts to complete the repair.
  • FIG. 3a is a schematic diagram showing the cross-sectional structure of the terminal area of the display panel before the repair by the repair method according to the first embodiment.
  • the structure of the terminal region repaired in this embodiment is the same as that of the first embodiment.
  • the glass substrate 10, the first insulating layer 20, the metal wire layer 30 and the second insulating layer 40 are sequentially arranged from bottom to top.
  • the fracture 50 extends from the second insulating layer 40 of the upper layer to the metal line layer 30.
  • the steps of repairing the fracture 50 in FIG. 3a by using the repair method described in the second embodiment of the present disclosure include:
  • Step 1 positioning a first position A on the metal line of the fracture line 50 of the metal wire layer 30, the first position A being located on the first side of the fracture 50, as shown in FIG. 3a as the fracture 50
  • the second position B is located on the metal line where the fracture 50 of the metal wire layer 30 is located, and the second position B is located on the second side of the fracture 50, as shown in FIG. 3a as the right side of the fracture 50;
  • Step 2 positioning the first laser beam at the first position A while positioning the second laser beam at the second position B, and controlling the first laser beam to move from the first position A toward the fracture 50 and Scanning the metal line between the first position A and the fracture 50, and controlling the second laser beam to move from the second position B toward the fracture 50 and scanning the metal line between the second position B and the fracture 50, such as Figure 3a shows the direction of the arrows on either side of the break port 50; the scanning push of the laser light moving across the break 50 and toward the break 50 causes the wire between the first position A and the break 50 to melt and the second position B to The metal wire between the fractures 50 melts and flows in opposite directions, converges to the fracture 50, filling the fracture 50;
  • Step 3 when the first laser beam scanning and the second laser beam scanning through the above step two, the molten metal flowing toward the fracture 50 cannot completely connect the metal wires of the fracture 50, or even if it can be connected, the fracture 50 If the thickness of the metal is insufficient, so that the connection between the two parts is not effective, repeat step two above repeatedly until the two parts that are disconnected are completely connected; of course, the starting point of the first laser beam scanning is repeated when the above step 2 is repeatedly performed.
  • the second position B of the first position A and the second laser beam scanning may be fixed or not fixed as long as the molten metal can be filled enough to fill the fracture 50, as shown in FIG. 3b;
  • step 4 the protective film layer 60 is sprayed on the exposed metal wire by the spraying device.
  • the starting position of the first laser beam is away from the fracture 50.
  • the farthest position does not exceed the first position A
  • the starting position of the second laser beam does not exceed the second position B from the farthest position of the fracture 50, and a protective film needs to be sprayed between the first position A and the second position B.
  • the layer 60 causes the sprayed protective film layer 60 to join the two portions of the broken second insulating layer 40.
  • the principle of determining the process parameters of the first laser beam and the second laser beam and the determination principles of the first position A and the second position B are the same as those of the first embodiment, and will not be described in detail herein.
  • the repair process of the embodiment of the present disclosure is described by simultaneously performing laser scanning on both sides of the fracture. It can be understood that the first laser beam is from the first position A to The scanning of the fracture and the scanning of the second laser beam from the second position B to the fracture may not be performed at the same time, or a laser head may be separately used to output the laser beam on both sides of the fracture for scanning, and the two scanning steps are performed alternately. The way to complete the repair method of the present disclosure.
  • the present disclosure also provides a repairing method of the third embodiment, which is adapted to repair a case where the insulating layer under the metal wire layer is simultaneously damaged.
  • FIG. 4a is a schematic structural view of a terminal area of a display panel before repairing by using the repairing method according to the third embodiment.
  • the structure of the terminal region repaired in this embodiment is the same as that of the first embodiment and the second embodiment.
  • the glass substrate 10, the first insulating layer 20, the metal wire layer 30 and the first layer are sequentially arranged from bottom to top.
  • the gaps in the first insulating layer 20 under the fractures 50 need to be filled before the laser beam is output to fuse and join the wires.
  • the protective film layer under the fracture is removed, so that the gap of the protective film layer under the fracture is The fracture corresponds.
  • the steps of repairing the fracture 50 in FIG. 4a by using the repair method described in the third embodiment of the present disclosure include:
  • Step 1 positioning a third position C on the metal line, wherein the third position C is located on the first side of the fracture 50 on the metal line, that is, the left side of the fracture 50 shown in FIG. 4b.
  • Step 2 positioning a third position C on the metal line, wherein the third position C is located on the first side of the fracture 50 on the metal line, that is, the left side of the fracture 50 shown in FIG. 4b.
  • Step 3 Outputting a third laser beam, moving the third laser beam from the third position C toward the fracture 50 and scanning a metal line between the third position C and the fracture 50 and a lower first insulating layer 20 to remove the metal line between the third position C and the fracture 50 and the lower first insulating layer 20;
  • Step 2 positioning a fourth position D on the metal line, wherein the fourth position D is located on the second side of the fracture 50 on the metal line, that is, the right side of the fracture 50 shown in FIG. 4b.
  • Outputting a fourth laser beam such that the fourth laser beam is from the fourth position D toward the fracture 50 Moving in a direction and scanning a metal line between the fourth position D and the fracture and a first insulating layer of the lower layer to remove a metal line between the fourth position D and the fracture and a lower layer An insulating layer; thus, the shaped fracture is obtained, and the metal wire layer 30 corresponds to the fracture on the first insulating layer 20, having openings of the same size; specifically, the third position C and/or the fourth position D may be located on the edge of the original fracture 50 of the wire;
  • Step 3 as shown in FIG. 4c, spraying a protective film layer 70 on the shaped fracture surface by using a spraying device, so that the sprayed protective film layer 70 fills the fracture on the first insulating layer 20, and the thickness and the first insulating layer 20 has the same thickness;
  • Step 4 as shown in FIG. 4d, the first position A is located on the metal line of the fracture line 50 of the metal wire layer 30, and the first position A is located on the first side of the fracture 50, as shown in FIG. 4d as the fracture 50.
  • the second position B is located on the metal line where the fracture 50 of the metal wire layer 30 is located, and the second position B is located on the second side of the fracture 50, as shown in FIG. 4d is the right side of the fracture 50;
  • the first position A is further away from the fracture 50 than the third position C; the second position B is further away from the fracture 50 than the fourth position D;
  • Step 5 positioning the first laser beam at the first position A while positioning the second laser beam at the second position B, and controlling the first laser beam to move from the first position A toward the fracture 50 and Scanning the metal line between the first position A and the fracture 50, and controlling the second laser beam to move from the second position B toward the fracture 50 and scanning the metal line between the second position B and the fracture 50, for example Moving the first laser beam and the second laser beam respectively along the direction of the arrows on both sides of the interruption port 50 of FIG.
  • Step six when the first laser beam scanning and the second laser beam scanning through the above step 5, the molten metal flowing toward the fracture 50 cannot completely connect the metal wires of the fracture 50, or even if it can be connected, the fracture 50 If the thickness of the metal is insufficient, so that the connection between the two parts is not effective, repeat step two above repeatedly until the two parts of the disconnection are completely connected; of course, when the above step 6 is repeatedly performed, the starting point of the first laser beam scanning is The second position B of the starting point of the position A and the second laser beam scanning may be fixed or not fixed as long as the molten metal can be filled enough to fill the fracture 50, as shown in FIG. 4e;
  • Step 7 spraying the protective film layer 60 on the exposed metal wire by the spraying device, as shown in FIG. 4f.
  • the starting position of the first laser beam is away from the fracture 50.
  • the farthest position does not exceed the first position A
  • the starting position of the second laser beam does not exceed the second position B from the farthest position of the fracture 50, and a protective film needs to be sprayed between the first position A and the second position B.
  • the layer 60 causes the sprayed protective film layer 60 to join the two portions of the broken second insulating layer 40.
  • the principle of determining the process parameters of the first laser beam and the second laser beam and the determination principles of the first position A and the second position B are the same as those of the first embodiment, and will not be described in detail herein.
  • the two laser beams are used for the opposite scanning to fill the fracture of the molten metal, and the laser beam can be scanned from one direction to make the molten metal in the first embodiment.
  • the method of filling the fracture is replaced, and the specific steps of the method are not described here.
  • the present disclosure further provides a metal wire repairing apparatus, including:
  • a first laser output device for outputting a first laser beam
  • a first positioning device for positioning a first position on the metal wire, wherein the first position is located on a first side of a fracture of the metal line;
  • control device for controlling the first laser output device to move the first laser beam from the first position toward the fracture to melt between the first position and the fracture a metal wire and causing the molten metal to flow toward the fracture to fill the fracture.
  • the first laser output device outputs a first laser beam
  • the first laser output device is controlled by the control device to move the first laser beam from the first position toward the fracture and scan the metal wire.
  • the metal irradiated by the laser beam is melted, and the molten metal is induced to flow from the first position toward the fracture, thereby connecting the broken wires. Therefore, the repair of the fracture is completed by the metal wire itself, and the utility model can be applied to the display panel without using other special repair wires. There is no special repair line in the terminal area.
  • the repairing device further comprises:
  • a second laser output device for outputting a second laser beam
  • a second positioning device for positioning a second position on the metal wire, wherein the second position is located on a second side of the fracture on the metal line;
  • control device is further configured to control the second laser output device to move the second laser beam from the second position toward the fracture to melt the second position and the A metal line between the fractures and causing the molten metal to flow toward the fracture to fill the fracture.
  • the first laser output device and the second laser output device may be one or two.
  • the laser output device may be used to output laser beams on both sides of the fracture for scanning.
  • the repair method of the present disclosure is accomplished by alternately performing two scanning steps.
  • the repairing device further includes:
  • a spraying device for spraying a protective film layer on the exposed metal wire at the first position to the second position after the fracture is filled.
  • the first positioning device and the second positioning device respectively include:
  • An image acquisition unit for taking an image of a metal line
  • An image analyzing unit configured to determine a position of the fracture on the metal line
  • a positioning unit configured to locate the first location or the second location, and transmit information of the first location and the second location to the control device.
  • the image acquisition unit and the image analysis unit can be applied to a high-magnification camera device, and the image of the metal wire in the terminal area is captured by the image acquisition unit, and the metal line of the terminal area is checked by the image analysis unit for bad (such as by acquiring an image and Standard image contrast or bright and dark grayscale comparison, etc.), to determine whether there is a break, if it is judged that there is a broken circuit, record the position of the fracture, and then transfer to the control device, so that the laser output device and the spray device are positioned to the fracture.
  • bad such as by acquiring an image and Standard image contrast or bright and dark grayscale comparison, etc.
  • FIG. 5 is a schematic structural diagram of a specific embodiment of a repairing apparatus according to the present disclosure.
  • a fixed base 100 and a movable bracket 200 are also used, and the base 100 is used for
  • the display panel 300 to be inspected is configured to be reciprocable in a direction relative to the base 100.
  • the bracket 300 is provided with a high-magnification camera 400, a laser output device 500 and a spraying device 600, which are to be detected.
  • a control device 700 is fixedly disposed on one side of the bracket 200.
  • the detection of the wire in the terminal area on the display panel and the determination of the fracture position are performed by the high-magnification imaging device 400 described above, so that the control device 700 can further determine the positioning position of the laser output device 500 on the metal wire according to the fracture position;
  • the device 500 outputs a laser to melt the metal wire;
  • the laser output device 500 is positioned to a starting position by the control device 700, and scanned along the metal line to the fracture, and the spraying device 600 is controlled to spray the protective film layer.

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Abstract

一种金属线的修复方法及修复设备。修复方法包括：在待修复金属线上定位第一位置（A），第一位置（A）位于待修复金属线上一断口（50）的第一侧；输出从第一位置（A）起朝断口（50）方向运动并扫描位于第一位置（A）与断口（50）之间的金属线的第一激光光束，以熔融位于第一位置（A）与断口（50）之间的金属线，并使得熔融后的金属朝断口（50）流动，填充断口（50）。采用激光光束照射方式，对金属线断口（50）附近的金属进行激光照射，使受激光光束照射的金属熔融，并使激光光束从第一位置（A）起朝断口（50）方向运动并扫描金属线，利用激光诱导熔融金属从第一位置（A）起朝断口（50）流动，将断线连接起来，利用金属线的本身完成断口（50）的修复，无需借助其他专用修复线，从而能够应用于显示面板的端子区不存在专用修复线的情况。

Description

金属线的修复方法及修复设备
相关申请的交叉引用
本申请主张在2014年12月5日在中国提交的中国专利申请号No.201410736692.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造技术领域，尤其是指金属线的修复方法及修复设备。
背景技术
在液晶显示器显示面板的成盒制造过程中，在切割段之后，对盒的液晶基板被切割成不同尺寸的液晶面板(Panel)，之后需要对各液晶面板进行点灯检测工序，以检测出各种不良。其中电学性不良是比例较大的不良，主要包括有亮点、断路(包括数据线、栅极线和公共线)、短路(包括数据线、栅极线和公共线两两短路)、X亮/暗线和Y亮/暗线等不良。
目前断路不良主要发生在两个位置：第一种是液晶面板显示区域的金属线断路，该类不良进行点灯检测时呈现为不贯穿全屏的亮线或暗线现象；第二种是在端子区发生金属线断路(数据线端子或栅极线端子)，该类不良进行点灯检测时呈现为贯穿全屏的亮线或暗线现象。
如图1a为通常液晶面板的端子区的结构示意图，图1b为端子区结构的放大图。液晶面板包括相对设置的阵列基板1和彩膜基板2，通常阵列基板1的尺寸大于彩膜基板2，因此形成为图1a和图1b在彩膜基板2的边缘延伸出的阵列基板1部分，其中端子区3设置于阵列基板1的边缘相对于彩膜基板2延伸出来的这一部分上，裸露在外。端子区3为数据线或栅线的金属线延伸的部分，通常设置在液晶面板的左侧和上侧，左侧为栅极线端子，上侧为数据线端子。
目前，发生在液晶面板显示区域的金属断线可以通过两种方法进行修复，一种是通过设置在面板上的专用修复线进行修复，另一种方法是通过特定像 素结构，借助像素中的各种线路进行断线修复。而发生在端子区3的金属断线，则无法借助专用修复线进行修复，同时由于端子金属断线4(如图1b所示)周围无像素结构或其他线路，因此无法借助其他线路进行修复。而在实际生产过程中由于端子区域是裸露在外的，这样金属线路极易遭到破坏，尤其是在切割工艺，实际生产中，玻璃碎屑往往造成大量金属线的划伤，从而导致亮/暗线的产生，造成面板NG。因此，当前急需一种端子区金属线的不良修复的方法，以提升良率、提高经济效益。
发明内容
本公开技术方案的目的是提供一种金属线的修复方法及修复设备，能够适应于显示面板的端子区金属线的不良修复。
本公开提供一种金属线的修复方法，所述修复方法包括：
在待修复金属线上定位第一位置，其中所述第一位置位于所述待修复金属线上一断口的第一侧；
输出从所述第一位置起朝所述断口的方向移动并扫描位于所述第一位置与所述断口之间的金属线的第一激光光束，以熔融位于所述第一位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
优选地，上述所述的修复方法，还包括：
在所述待修复金属线上定位第二位置，其中所述第二位置位于所述待修复金属线上所述断口的第二侧；
输出从所述第二位置起朝所述断口的方向移动并扫描位于所述第二位置与所述断口之间的金属线的第二激光光束，以熔融位于所述第二位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
优选地，上述所述的修复方法，还包括：
在所述断口填充后，在所述第一位置至所述第二位置处暴露的金属线上喷涂保护膜层。
优选地，上述所述的修复方法，在金属线上定位所述第一位置和所述第二位置之前，所述修复方法还包括：
填充位于所述断口下方的绝缘层上的缺口。
优选地，上述所述的修复方法，在填充位于所述断口下方的绝缘层上的缺口之前，所述修复方法还包括：
清除位于所述断口下方的绝缘层，使位于所述断口下方的绝缘层的缺口与所述断口相对应。
优选地，上述所述的修复方法，清除位于所述断口下方的绝缘层的步骤具体包括：
在所述待修复金属线上定位第三位置，其中所述第三位置位于所述待修复金属线上所述断口的第一侧，且所述第三位置较所述第一位置靠近所述断口；
输出第三激光光束，使所述第三激光光束从所述第三位置起朝所述断口的方向移动并扫描位于所述第三位置与所述断口之间的金属线以及下层的绝缘层，以清除位于所述第三位置与所述断口之间的金属线以及下层的绝缘层；
在所述待修复金属线上定位第四位置，其中所述第四位置位于所述待修复金属线上所述断口的第二侧，且所述第四位置较所述第二位置靠近所述断口；
输出第四激光光束，使所述第四激光光束从所述第四位置起朝所述断口的方向移动并扫描位于所述第四位置与所述断口之间的金属线以及下层的绝缘层，以清除位于所述第四位置与所述断口之间的金属线以及下层的绝缘层。
优选地，上述所述的修复方法，所述第三位置和/或所述第四位置位于所述断口的边缘。
优选地，上述所述的修复方法，所述第一激光光束和所述第二激光光束分别扫描多次。
本公开还提供一种金属线的修复设备，所述修复设备包括：
第一激光输出装置，用于输出第一激光光束；
第一定位装置，用于在待修复金属线上定位第一位置，其中所述第一位置位于所述待修复金属线上一断口的第一侧；
控制装置，用于控制所述第一激光输出装置，使所述第一激光光束从所述第一位置起朝所述断口的方向运动，以熔融位于所述第一位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
优选地，上述所述的修复设备，还包括：
第二激光输出装置，用于输出第二激光光束；
第二定位装置，用于在所述待修复金属线上定位第二位置，其中所述第二位置位于所述待修复金属线上所述断口的第二侧；
其中所述控制装置还用于控制所述第二激光输出装置，使所述第二激光光束从所述第二位置起朝所述断口的方向运动，以熔融位于所述第二位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
优选地，上述所述的修复设备，还包括：
喷涂装置，用于在所述断口填充后，在所述第一位置至所述第二位置处暴露的金属线上喷涂保护膜层。
优选地，上述所述的修复设备，所述第一定位装置和所述第二定位装置分别包括：
图像获取单元，用于拍摄所述待修复金属线的图像；
图像分析单元，用于判断所述待修复金属线的所述断口的位置；
定位单元，用于定位所述第一位置或所述第二位置，并将所述第一位置与所述第二位置的信息传输至所述控制装置。
本公开具体实施例上述技术方案中的至少一个具有以下有益效果：
采用激光光束照射的方式，对待修复金属线断口附近的金属进行激光照射，使受激光光束照射的金属熔融，并使激光光束从第一位置起朝断口的方向移动并扫描金属线，利用激光诱导熔融金属从第一位置起朝断口流动，将断线连接起来，因此利用金属线的本身完成断口的修复，无需借助其他专用修复线，从而能够应用于显示面板的端子区不存在专用修复线的情况。
附图说明
图1a为通常液晶面板的端子区的结构示意图；
图1b为端子区结构的放大图；
图2a至图2c为本公开第一实施例所述修复方法的流程示意图；
图3a至图3c为本公开第二实施例所述修复方法的流程示意图；
图4a至4f为本公开第三实施例所述修复方法的流程示意图；
图5为本公开实施例所述修复设备的结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图及具体实施例对本公开进行详细描述。
本公开具体实施例所述金属线的修复方法，包括：
在金属线上定位第一位置，其中所述第一位置位于金属线上一断口的第一侧；
输出从所述第一位置起朝所述断口的方向移动并扫描位于所述第一位置与所述断口之间的金属线的第一激光光束，以熔融从所述第一位置至所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
上述实施例的修复方法，采用激光光束照射的方式，对金属线断口附近的金属进行激光照射，使受激光光束照射的金属熔融，并使激光光束从第一位置起朝断口的方向移动并扫描金属线，利用激光诱导熔融金属从第一位置起朝断口流动，将断线连接起来，因此利用金属线的本身完成断口的修复，无需借助其他专用修复线，从而能够应用于显示面板的端子区不存在专用修复线的情况。
以下以应用于显示面板的端子区金属线的修复，对本公开实施例所述修复方法的具体方式进行详细描述。
本公开提供第一实施例的修复方法，利用一个激光束，在断口的一侧朝断口方向移动进行扫描，使金属线上断口一侧的金属熔融，朝断口流动，使熔融后流动的金属将断口填充，以将断开的两部分连接起来，完成修复。
图2a为采用第一实施例所述修复方法，在修复前，显示面板的端子区截面结构示意图。根据图2a，端子区部分从下至上依次包括：玻璃基板10、第一绝缘层20、金属线层30和第二绝缘层40，当该部分的金属发生断路后，会产生如图2a所示的断口50，断口50从上层的第二绝缘层40延伸至金属线层30。
采用本公开第一实施例所述修复方法对图2a中的断口50进行修复的步 骤包括：
步骤一，如图2a所示，在金属线层30的断口50所在金属线上定位第一位置A，该第一位置A位于该断口50的一侧(如图2a的左侧，当然也可以位于右侧)；
步骤二，将第一激光光束定位在该第一位置A，并控制该第一激光光束沿从第一位置A起朝断口50的方向如图2a的箭头方向移动并扫描位于第一位置A与断口50之间的金属线，使位于第一位置A与断口50之间的金属线熔融，利用第一激光光束朝断口50扫描时对熔融金属的推动效果，使得熔融后的金属朝断口50流动，填充断口50；
步骤三，当经过上述步骤二的第一激光光束扫描，朝断口50流动的熔融金属不能完全使位于断口50内的金属线连接起来时，或者即使能够连接，但断口50内的金属厚度不够，使两部分的连接不够有效时，重复多次执行上述的步骤二，直至断开的两部分完全连接为止；当然在重复执行上述的步骤二时，第一激光光束扫描的起点第一位置A，可以为固定，也可以为不固定，只要能够使熔融的金属足够填充断口50即可，如图2b所示；
步骤四，采用喷涂装置在修复后暴露的金属线上喷涂保护膜层60，如图2c所示，本公开实施例中，若多次的激光扫描，起点位置距离断口50的最远位置不会超过第一位置A，则需要在第一位置A至断口50的最右侧边缘之间喷涂保护膜层60，使所喷涂的保护膜层60将断开的第二绝缘层40的两部分连接起来。
在上述的步骤二和步骤三中，所使用的第一激光光束可以为波长1064nm的红外激光，也可以是波长为532nm的可见光激光，当然也可以是其他波长的激光，不同波长的激光，以及连接不同金属材质、不同线宽和线厚的金属线时，需要选择不同功率和光斑尺寸的激光参数，采用本实施例的方法，通过多次的激光反复作用，断口50左侧的金属在激光作用下熔融并定流向断口50，最终能够使断口50两侧的金属连接在一起，并保证达到一定厚度，实现两部分的有效连接，将断开的金属线层重新连接在一起，实现电信号的传递，从而成功修复不良。
另外，上述第一位置A的设定可以根据需要修复断口的大小和激光工艺 参数设定。本领域技术人员根据经验，根据需要修复金属线的材质、厚度以及断口的大小等，确定上述的激光工艺参数和第一位置A与断口之间的距离。
采用本公开第一实施例的修复方法，在上述的步骤三之后，若激光工艺参数确定不够合理，在反复执行步骤二之后，仍然不能够使断开的两部分实现有效连接，所述修复方法还可以进一步包括：
在金属线上定位第二位置，其中所述第二位置位于金属线上所述断口的第二侧，也即当第一位置A位于如图2a所示断口50的左侧时，第二位置位于断口50的右侧；
输出从所述第二位置起朝所述断口方向移动并的内部扫描位于所述第二位置与所述断口之间的金属线的第二激光光束，以熔融位于从所述第二位置与至所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
利用增加的上述步骤，在断口的第二侧增加一道激光扫描工序，使断口第二侧的金属熔融并朝断口流动，以从第二侧的方向填充断口，在断口处增加金属量，进一步保证金属线断开的两部分有效连接。
此外，本公开还提供第二实施例的修复方法，在第二实施例中，利用两个激光束，在断口的两侧朝断口作对向扫描，使金属线上断口两侧的金属分别熔融，相向朝断口流动，使熔融后流动的金属将断口填充，以将断开的两部分连接起来，完成修复。
图3a为采用第一实施例所述修复方法，在修复前，显示面板的端子区截面结构示意图。该实施例所修复的端子区的结构与第一实施例相同，如图3a所示，从下至上依次包括：玻璃基板10、第一绝缘层20、金属线层30和第二绝缘层40，其中断口50从上层的第二绝缘层40延伸至金属线层30。
采用本公开第二实施例所述修复方法对图3a中的断口50进行修复的步骤包括：
步骤一，如图3a所示，在金属线层30的断口50所在金属线上定位第一位置A，该第一位置A位于该断口50的第一侧，如图3a所示为断口50的左侧；同时在金属线层30的断口50所在金属线上定位第二位置B，该第二位置B位于该断口50的第二侧，如图3a所示为断口50的右侧；
步骤二，将第一激光光束定位在该第一位置A，同时将该第二激光光束定位在该第二位置B，控制该第一激光光束从第一位置A起朝断口50的方向移动并扫描位于第一位置A与断口50之间的金属线，并控制第二激光光束从第二位置B起朝断口50的方向移动并扫描位于第二位置B与断口50之间的金属线，如图3a中断口50两侧的箭头方向；利用断口50两侧并朝向断口50移动的激光的扫描推动作用，使第一位置A与断口50之间的金属线熔融，且使第二位置B与断口50之间的金属线熔融，并作对向流动，汇聚到断口50处，填充断口50；
步骤三，当经过上述步骤二的第一激光光束扫描和第二激光光束扫描，朝断口50流动的熔融金属不能完全使断口50的金属线连接起来时，或者即使能够连接，但断口50内的金属厚度不够，使两部分的连接不够有效时，重复多次执行上述的步骤二，直至断开的两部分完全连接为止；当然，在重复执行上述的步骤二时，第一激光光束扫描的起点第一位置A和第二激光光束扫描的起点第二位置B，可以为固定，也可以为不固定，只要能够使熔融的金属足够填充断口50即可，如图3b所示；
步骤四，采用喷涂装置在修复后暴露的金属线上喷涂保护膜层60，如图3c所示，本公开实施例中，若多次的激光扫描，第一激光光束的起点位置距离断口50的最远位置不会超过第一位置A，第二激光光束的起点位置距离断口50的最远位置不会超过第二位置B，则需要在第一位置A至第二位置B之间喷涂保护膜层60，使所喷涂的保护膜层60将断开的第二绝缘层40的两部分连接起来。
在第二实施例中，第一激光光束和第二激光光束的工艺参数的确定原则以及第一位置A和第二位置B的确定原则与第一实施例相同，在此不再详细描述。另外，需要说明的是，上述的步骤二中，以断口两侧的激光束同时作对向扫描对本公开实施例的修复过程进行了描述，可以理解的是，第一激光光束从第一位置A至断口的扫描以及第二激光光束从第二位置B至断口的扫描，可以并非为同时进行，或者可以采用一个激光头在断口两侧分别输出激光光束进行扫描，先后、交替执行该两个扫描步骤的方式完成本公开的修复方法。
在上述第一实施例和第二实施例中，金属线层30下方的第一绝缘层20完好，因此仅需要修复金属线层30即可。另外，本公开还提供第三实施例的修复方法，适应于修复金属线层下方的绝缘层同时遭到破坏的情况。
以下将以上述的第二实施例的原理，利用两个激光束作对向扫描使熔融的金属填充断口的方式，说明需要同时修复金属线下方的绝缘层时的具体方式。
图4a为采用第三实施例所述修复方法，在修复前，显示面板的端子区域的结构示意图。该实施例所修复的端子区的结构与第一实施例和第二实施例相同，如图4a所示，从下至上依次包括：玻璃基板10、第一绝缘层20、金属线层30和第二绝缘层40，但与第一实施例和第二实施例所不同的是，断口50从上层的第二绝缘层40延伸至第一绝缘层20，也即第一绝缘层20上存在缺口。
在对图4a所示结构的金属线进行修复时，在输出激光光束使金属线熔融并连接在一起之前，需要先填充位于断口50下方的第一绝缘层20上的缺口。为保证缺口填充过程的工艺过程便于控制以及批量化作业，最佳地，在填充该缺口之前，先清除位于所述断口下方的保护膜层，使位于所述断口下方的保护膜层的缺口与所述断口相对应。
以下结合附图对该实施例所述修复方法的具体过程进行详细描述。
采用本公开第三实施例所述修复方法对图4a中的断口50进行修复的步骤包括：
步骤一，如图4b所示，在金属线上定位第三位置C，其中所述第三位置C位于金属线上所述断口50的第一侧，也即图4b所示断口50的左侧；输出第三激光光束，使所述第三激光光束从所述第三位置C起朝所述断口50的方向移动并扫描位于所述第三位置C与所述断口50之间的金属线以及下层的第一绝缘层20，以清除位于所述第三位置C与所述断口50之间的金属线以及下层的第一绝缘层20；
步骤二，如图4b所示，在金属线上定位第四位置D，其中所述第四位置D位于金属线上所述断口50的第二侧，也即图4b所示断口50的右侧；输出第四激光光束，使所述第四激光光束从所述第四位置D起朝所述断口50的 方向移动并扫描位于所述第四位置D与所述断口之间的金属线以及下层的第一绝缘层，以清除位于所述第四位置D与所述断口之间的金属线以及下层的第一绝缘层；这样，获得被整形后的断口，且金属线层30和第一绝缘层20上的断口相对应，具有相同尺寸的开口；具体地，该第三位置C和/或第四位置D可以位于金属线上原来的断口50的边缘；
步骤三，如图4c所示，采用喷涂装置在被整形后的断口处喷涂保护膜层70，使所喷涂的保护膜层70填充第一绝缘层20上的断口，且厚度与第一绝缘层20的厚度相同；
步骤四；如图4d所示，在金属线层30的断口50所在金属线上定位第一位置A，该第一位置A位于该断口50的第一侧，如图4d所示为断口50的左侧；同时在金属线层30的断口50所在金属线上定位第二位置B，该第二位置B位于该断口50的第二侧，如图4d所示为断口50的右侧；通常，该第一位置A相较于第三位置C更远离断口50；该第二位置B相较于第四位置D更远离断口50；
步骤五，将第一激光光束定位在该第一位置A，同时将该第二激光光束定位在该第二位置B，控制该第一激光光束从第一位置A起朝断口50的方向移动并扫描位于第一位置A与断口50之间的金属线，并控制第二激光光束从第二位置B起朝断口50的方向移动并扫描位于第二位置B与断口50之间的金属线，例如，沿图4d中断口50两侧的箭头方向分别移动第一激光光束和第二激光光束；利用断口50两侧并朝向断口50移动的激光的扫描推动作用，使位于第一位置A与断口50之间的金属线熔融，且使位于第二位置B与断口50之间的金属线熔融，并作对向流动，汇聚到断口处，填充断口50；
步骤六，当经过上述步骤五的第一激光光束扫描和第二激光光束扫描，朝断口50流动的熔融金属不能完全使断口50的金属线连接起来时，或者即使能够连接，但断口50内的金属厚度不够，使两部分的连接不够有效时，重复多次执行上述的步骤二，直至断开的两部分完全连接为止；当然，在重复执行上述步骤六时，第一激光光束扫描的起点第一位置A和第二激光光束扫描的起点第二位置B，可以为固定，也可以为不固定，只要能够使熔融的金属足够填充断口50即可，如图4e所示；
步骤七，采用喷涂装置在修复后暴露的金属线上喷涂保护膜层60，如图4f所示，本公开实施例中，若多次的激光扫描，第一激光光束的起点位置距离断口50的最远位置不会超过第一位置A，第二激光光束的起点位置距离断口50的最远位置不会超过第二位置B，则需要在第一位置A至第二位置B之间喷涂保护膜层60，使所喷涂的保护膜层60将断开的第二绝缘层40的两部分连接起来。
在第三实施例中，第一激光光束和第二激光光束的工艺参数的确定原则以及第一位置A和第二位置B的确定原则与第一实施例相同，在此不再详细描述。
当然，可以理解的是，上述步骤四至步骤六中，采用两个激光光束作对向扫描使熔融的金属填充断口的方式，也可以用第一实施例中一个激光光束从一个方向扫描使熔融的金属填充断口的方式替代，在此不再对该方式的具体步骤进行描述。
基于上述金属线的修复方法，本公开还提供一种金属线的修复设备，包括：
第一激光输出装置，用于输出第一激光光束；
第一定位装置，用于在金属线上定位第一位置，其中所述第一位置位于金属线上一断口的第一侧；
控制装置，用于控制所述第一激光输出装置，使所述第一激光光束从所述第一位置起朝所述断口的方向运动，以熔融位于所述第一位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
上述的修复设备，利用第一激光输出装置输出第一激光光束，利用控制装置对第一激光输出装置进行控制，使第一激光光束从第一位置起朝断口的方向移动并扫描金属线，使受激光光束照射的金属熔融，诱导熔融金属从第一位置起朝断口流动，将断线连接起来，因此利用金属线的本身完成断口的修复，无需借助其他专用修复线，从而能够应用于显示面板的端子区不存在专用修复线的情况。
最佳地，所述修复设备还包括：
第二激光输出装置，用于输出第二激光光束；
第二定位装置，用于在金属线上定位第二位置，其中所述第二位置位于金属线上所述断口的第二侧；
其中所述控制装置还用于控制所述第二激光输出装置，使所述第二激光光束从所述第二位置起朝所述断口的方向运动，以熔融位于所述第二位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
通过以上第一激光输出装置和第二激光输出装置的组合，输出两个激光束，在断口的两侧朝断口作对向扫描，使金属线上断口两侧的金属分别熔融，相向朝断口流动，使熔融后流动的金属将断口填充，以将断开的两部分连接起来，完成修复。
具体地，该第一激光输出装置和第二激光输出装置可以为一个，也可以为两个，当为一个时，可以采用该一个激光输出装置在断口两侧分别输出激光光束进行扫描，先后、交替执行两个扫描步骤的方式完成本公开的修复方法。
进一步地，所述修复设备还包括：
喷涂装置，用于在所述断口填充后，在所述第一位置至所述第二位置处暴露的金属线上喷涂保护膜层。
此外，具体地，所述第一定位装置和所述第二定位装置分别包括：
图像获取单元，用于拍摄金属线的图像；
图像分析单元，用于判断金属线上所述断口的位置；
定位单元，用于定位所述第一位置或所述第二位置，并将所述第一位置与所述第二位置的信息传输至所述控制装置。
其中该图像获取单元和图像分析单元可以应用于一高倍率摄像装置中，通过图像获取单元拍摄端子区金属线的图像，通过图像分析单元检查端子区的金属线路是否有不良(如通过获取图像与标准图像对比或亮暗灰度比较等方式)，判断是否有断口，如果判断有断路不良时，记录断口的位置，并后续传输至控制装置，以便于激光输出装置和喷涂装置定位至断口处。
图5为本公开所述修复设备的一种具体实施例的结构示意图。参阅图5的修复设备，还包括一固定的基台100和可移动的支架200，基台100用于 设置待检测的显示面板300，可移动的支架200能够相对于基台100沿一个方向往复移动，其中该支架300上设置有高倍率摄像装置400、激光输出装置500和喷涂装置600，位于待检测显示面板300的正上方，而且在支架200的一侧固定设置有控制装置700。
通过上述的高倍率摄像装置400实现显示面板上端子区金属线的检测、断口位置的确定，以使控制装置700能够根据断口位置进一步确定激光输出装置500在金属线上的定位位置；通过激光输出装置500输出激光，使金属线熔融；通过控制装置700将激光输出装置500定位至起点位置，并沿金属线扫描至断口处，并控制喷涂装置600喷涂保护膜层。
本公开所述实施例所述修复设备的具体实施结构并不限于一种，本领域技术人员当可以作出各种变形，在此不一一详细描述。
以上所述的是本公开的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (12)

  1. 一种金属线的修复方法，包括：
    在待修复金属线上定位第一位置，其中所述第一位置位于所述待修复金属线上一断口的第一侧；
    输出从所述第一位置起朝所述断口的方向移动并扫描位于所述第一位置与所述断口之间的金属线的第一激光光束，以熔融位于所述第一位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
  2. 如权利要求1所述的修复方法，其中，所述修复方法还包括：
    在所述待修复金属线上定位第二位置，其中所述第二位置位于所述待修复金属线上所述断口的第二侧；
    输出从所述第二位置起朝所述断口的方向移动并扫描位于所述第二位置与所述断口之间的金属线的第二激光光束，以熔融位于所述第二位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
  3. 如权利要求2所述的修复方法，其中，所述修复方法还包括：
    在所述断口填充后，在所述第一位置至所述第二位置处暴露的金属线上喷涂保护膜层。
  4. 如权利要求2所述的修复方法，其中，在所述待修复金属线上定位所述第一位置和所述第二位置之前，所述修复方法还包括：
    填充位于所述断口下方的绝缘层上的缺口。
  5. 如权利要求4所述的修复方法，其中，在填充位于所述断口下方的绝缘层上的缺口之前，所述修复方法还包括：
    清除位于所述断口下方的绝缘层，使位于所述断口下方的绝缘层的缺口与所述断口相对应。
  6. 如权利要求5所述的修复方法，其中，清除位于所述断口下方的绝缘层的步骤具体包括：
    在所述待修复金属线上定位第三位置，其中所述第三位置位于所述待修复金属线上所述断口的第一侧，且所述第三位置较所述第一位置靠近所述断口；
    输出第三激光光束，使所述第三激光光束从所述第三位置起朝所述断口的方向移动并扫描位于所述第三位置与所述断口之间的金属线以及下层的绝缘层，以清除位于所述第三位置与所述断口之间的金属线以及下层的绝缘层；
    在所述待修复金属线上定位第四位置，其中所述第四位置位于所述待修复金属线上所述断口的第二侧，且所述第四位置较所述第二位置靠近所述断口；
    输出第四激光光束，使所述第四激光光束从所述第四位置起朝所述断口的方向移动并扫描位于所述第四位置与所述断口之间的金属线以及下层的绝缘层，以清除所述第四位置与所述断口之间的金属线以及下层的绝缘层。
  7. 如权利要求6所述的修复方法，其中，所述第三位置和/或所述第四位置位于所述断口的边缘。
  8. 如权利要求2所述的修复方法，其中，所述第一激光光束和所述第二激光光束分别扫描多次。
  9. 一种金属线的修复设备，包括：
    第一激光输出装置，用于输出第一激光光束；
    第一定位装置，用于在待修复金属线上定位第一位置，其中所述第一位置位于所述待修复金属线上一断口的第一侧；
    控制装置，用于控制所述第一激光输出装置，使所述第一激光光束从所述第一位置起朝所述断口的方向运动，以熔融位于所述第一位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
  10. 如权利要求9所述的修复设备，其中，所述修复设备还包括：
    第二激光输出装置，用于输出第二激光光束；
    第二定位装置，用于在所述待修复金属线上定位第二位置，其中所述第二位置位于所述待修复金属线上所述断口的第二侧；
    其中所述控制装置还用于控制所述第二激光输出装置，使所述第二激光光束从所述第二位置起朝所述断口的方向运动，以熔融位于所述第二位置与所述断口之间的金属线，并使得熔融后的金属朝所述断口流动，填充所述断口。
  11. 如权利要求10所述的修复设备，其中，所述修复设备还包括：
    喷涂装置，用于在所述断口填充后，在所述第一位置至所述第二位置处暴露的金属线上喷涂保护膜层。
  12. 如权利要求10所述的修复设备，其中，所述第一定位装置和所述第二定位装置分别包括：
    图像获取单元，用于拍摄所述待修复金属线的图像；
    图像分析单元，用于判断所述待修复金属线的所述断口的位置；
    定位单元，用于定位所述第一位置或所述第二位置，并将所述第一位置与所述第二位置的信息传输至所述控制装置。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113589610A (zh) * 2021-07-30 2021-11-02 乐金显示光电科技(中国)有限公司 一种金属线的修复方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104570415B (zh) * 2014-12-05 2017-07-18 合肥鑫晟光电科技有限公司 金属线的修复方法及修复设备
CN105785678B (zh) * 2016-05-12 2019-04-30 深圳市华星光电技术有限公司 Tft基板的断线修复方法
CN105970210B (zh) * 2016-05-26 2018-03-30 京东方科技集团股份有限公司 一种阵列基板的断线修复装置及阵列基板的断线修复方法
CN106098966B (zh) * 2016-06-29 2018-04-24 京东方科技集团股份有限公司 一种薄膜及其修复方法、显示基板及其制作方法
CN107329292A (zh) * 2017-08-18 2017-11-07 深圳市华星光电技术有限公司 镭射修复方法及镭射修复后基板
CN109270715B (zh) * 2018-11-13 2022-07-29 成都中电熊猫显示科技有限公司 液晶显示器中白缺陷的修正方法
CN111741608A (zh) * 2019-03-25 2020-10-02 深圳市百柔新材料技术有限公司 导电线路修补方法
CN110972406B (zh) * 2019-12-04 2020-07-28 广东工业大学 一种用于精细线路的修复方法
CN113194612A (zh) * 2021-04-27 2021-07-30 黄冬云 一种用ito电极修复电子显示屏线路的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0156201B1 (ko) * 1995-08-02 1998-11-16 구자홍 리페어라인을 갖는 액정표시장치의 박막트랜지스터 어레이구조 및 이의 제조방법
JPH11121906A (ja) * 1997-10-09 1999-04-30 Nec Toyama Ltd プリント配線板の回路断線修理方法
CN102368478A (zh) * 2011-04-22 2012-03-07 友达光电股份有限公司 导线的修补方法以及显示面板的修补方法
CN203782232U (zh) * 2014-02-24 2014-08-20 南京中科煜宸激光技术有限公司 一种复杂结构件预置粉末激光熔覆装置
CN204215119U (zh) * 2014-12-05 2015-03-18 合肥鑫晟光电科技有限公司 金属线的修复设备
CN104570415A (zh) * 2014-12-05 2015-04-29 合肥鑫晟光电科技有限公司 金属线的修复方法及修复设备

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233084A (ja) * 1988-03-14 1989-09-18 Mitsubishi Electric Corp 薄板の突合せレーザ溶接方法
JPH03176919A (ja) * 1990-04-27 1991-07-31 Matsushita Electric Works Ltd 多層接点の溶接方法
US5164565A (en) * 1991-04-18 1992-11-17 Photon Dynamics, Inc. Laser-based system for material deposition and removal
US6313815B1 (en) * 1991-06-06 2001-11-06 Canon Kabushiki Kaisha Electron source and production thereof and image-forming apparatus and production thereof
US5175504A (en) * 1991-06-17 1992-12-29 Photon Dynamics, Inc. Method and apparatus for automatically inspecting and repairing a simple matrix circuit panel
US5391516A (en) * 1991-10-10 1995-02-21 Martin Marietta Corp. Method for enhancement of semiconductor device contact pads
JP3264986B2 (ja) * 1992-06-30 2002-03-11 大日本印刷株式会社 電極の断線補修方法
JP3397481B2 (ja) * 1994-12-28 2003-04-14 株式会社日立製作所 配線の断線修正方法
DE19542554C2 (de) * 1995-11-15 2000-12-14 Fraunhofer Ges Forschung Verfahren zur Prüfung von Schweißnähten
JPH10244367A (ja) * 1997-03-03 1998-09-14 Fanuc Ltd 溶接ロボットシステム
US6807732B2 (en) * 2002-07-24 2004-10-26 Agilent Technologies, Inc. Methods for modifying inner-layer circuit features of printed circuit boards
KR100942841B1 (ko) * 2003-06-02 2010-02-18 엘지디스플레이 주식회사 액정표시소자의 검사 방법 및 장치와 리페어방법 및 장치
US7276385B1 (en) * 2003-11-24 2007-10-02 Kovio, Inc. Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods
US20090223940A1 (en) * 2004-08-09 2009-09-10 Nec Corporation Different metallic thin plates welding method, bimetallic thin plates jointing element, electric device, and electric device assembly
JP4688525B2 (ja) * 2004-09-27 2011-05-25 株式会社 日立ディスプレイズ パターン修正装置および表示装置の製造方法
CN1782826A (zh) * 2004-12-02 2006-06-07 群康科技(深圳)有限公司 液晶显示装置
TWI319104B (en) * 2005-09-20 2010-01-01 Chi Mei Optoelectronics Corp Apparatus for driving a flat panel display and repair flat panel display signal line
TWI352842B (en) * 2006-05-09 2011-11-21 Au Optronics Corp Rescue structure and method for laser welding
KR20080042201A (ko) * 2006-11-09 2008-05-15 참앤씨(주) 평판디스플레이 패널의 결함부위 리페어방법
KR20080082145A (ko) * 2007-03-07 2008-09-11 엘지디스플레이 주식회사 액정표시장치 및 리페어 방법
TWI354172B (en) * 2007-03-21 2011-12-11 Au Optronics Corp Pixel array substrate
CN101471272B (zh) * 2007-12-29 2010-08-11 财团法人工业技术研究院 基板激光修补机自动瑕疵检测装置及方法
JP5275851B2 (ja) * 2008-04-24 2013-08-28 イリソ電子工業株式会社 レーザー溶接方法
JP2010253500A (ja) * 2009-04-23 2010-11-11 Sumitomo Electric Ind Ltd レーザ溶接方法
KR101116638B1 (ko) * 2009-12-15 2012-03-07 주식회사 성우하이텍 강판의 레이저 용접방법
US9035673B2 (en) * 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
JP5466194B2 (ja) * 2011-03-15 2014-04-09 日本航空電子工業株式会社 電線対導電性金属板のレーザ溶接構造
US20130341077A1 (en) * 2012-06-25 2013-12-26 Ibiden Co., Ltd. Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board
WO2014129635A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 レーザ溶接装置及びレーザ溶接方法
KR20150142821A (ko) * 2014-06-11 2015-12-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 리페어 방법
JP6558990B2 (ja) * 2015-07-17 2019-08-14 三菱電機株式会社 電子装置およびその製造方法とリペア方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0156201B1 (ko) * 1995-08-02 1998-11-16 구자홍 리페어라인을 갖는 액정표시장치의 박막트랜지스터 어레이구조 및 이의 제조방법
JPH11121906A (ja) * 1997-10-09 1999-04-30 Nec Toyama Ltd プリント配線板の回路断線修理方法
CN102368478A (zh) * 2011-04-22 2012-03-07 友达光电股份有限公司 导线的修补方法以及显示面板的修补方法
CN203782232U (zh) * 2014-02-24 2014-08-20 南京中科煜宸激光技术有限公司 一种复杂结构件预置粉末激光熔覆装置
CN204215119U (zh) * 2014-12-05 2015-03-18 合肥鑫晟光电科技有限公司 金属线的修复设备
CN104570415A (zh) * 2014-12-05 2015-04-29 合肥鑫晟光电科技有限公司 金属线的修复方法及修复设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113589610A (zh) * 2021-07-30 2021-11-02 乐金显示光电科技(中国)有限公司 一种金属线的修复方法

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