1324682 ASEK1895 22571 twf.doc/006 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種確認維修站及用以標記基板為 缺陷的方法，且特別是關於一種利用雷射以燒餘掉基板丄 具有缺陷部分之線路的確認維修站以及用以標記基板為缺 陷的方法。 土 ’ 、 【先前技術】 自動光學檢測系統(Automatic Optical Inspection，AOI) 疋利用光學方式對待檢測之物件進行掃描，並將掃描後所 得到的圖像儲存於資料庫中；之後，藉由將所得到之圖像 貢料與一參考圖案相比較，以找到缺陷所在之位置。自動 光學檢測系統目前主要是應用於檢測印刷電路板(pcB)、 平面顯示面板(FPD)等材料，以於製造及組裝期間，檢測物 件不同方面之特徵，例如：導體之完整性(是否有斷裂、短 路、破裂等情形)及尺寸、絕緣體或基板的完整性及尺寸、 開孔之尺寸及配置、導體間距、線寬及線長等。 由於自動光學檢測系統所採用的測試方式為邏輯比 較，通常會存在一些誤判的缺陷。因此，在經過自動光學 檢測系統之檢測後，基板通常會被輸送至一確認維修站 (Verification and Repair Station, VRS)，以藉由人工的方式 確S忍所偵測到之缺陷是屬於真實缺陷或只是誤警（如祀 alarm)。 當操作員辨識到此基板中的某個基板單元具有真實缺 陷枯，則會用筆刀將此基板單元連接至電鍍線的銅線路晝 4 1324682 ASEK1S95 22571twf.doc/〇〇6 $。如此，在後續進行鐘金製料，由於此基板單元的銅 線路已被截斷，因而無法在銅線路上鑛金。所以，之後在 ，行外觀檢測(Automated Visual Inspection，AVI)時，操作 1即可由崎與金線之色差，而觸出此基板單元是具有 缺陷的元件。 ’ 然而，在操作員用筆刀將銅線路畫斷的過程中，被畫 =的^線路會產生些微的_，這些_可能會跳到鄰二 ς板早7G的線路上，而使其他祕產生短路的情形，進而 率。此外，以人工方式進行銅線路之切割亦 θ浪費其作業時間。 【發明内容】 本發明提供一種用以標記基板為缺陷的方法，此方法 5於2轉站確認—待制基板上之軸為-真實缺陷 才 一雷射燒蝕掉此基板上連接於此缺陷之線路。如 t即可避免習知技術中由操作員以筆刀將線路晝斷，而 生銅屬掉^的問題，且可縮短其作業時間。 本發明提供一種確認維修站，此確認維修站之特點是 包，一雷射裝置。當確認維修站確認-待檢測基板上之$ ΐ铲:it陷時，則利用雷射裝置燒蝕掉基板上連接於 電鑛線之線2，以避免產生㈣掉落的情形。 本發明提出一種用以標記基板為缺陷的方法， =二驟首先，提供一待檢測之基板，此基板之一表面具 一電鍛線以及連接於此電麟之-線路。之後，利用二 自動光學檢測系統檢測此基板，並將基板上_測到之一 5 1324682 ASEK1895 22571twf.doc/〇〇6 於績電腦中。接下來’將基板傳輸至—確認維修 站，此確4修站將所制到之缺陷與—參考影像^ ，，以確認自動光學檢測系統所彳貞剩之缺陷是否為—直 實缺陷。最後，當確認此缺陷為真實缺陷時，二雷射 燒姓掉基板上連接於上述電錄線之線路。 、，在本發月之只施例中，此基板為一印刷電路板或_1324682 ASEK1895 22571 twf.doc/006 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for confirming a service station and for marking a substrate as a defect, and more particularly to a method of using a laser to burn A confirmation service station that removes the substrate from the substrate with the defective portion and a method for marking the substrate as a defect. Soil', [Prior Art] Automatic Optical Inspection (AOI) 疋 Scans the object to be detected optically, and stores the image obtained after scanning in the database; The resulting image metric is compared to a reference pattern to find the location of the defect. The automatic optical inspection system is mainly used to detect printed circuit board (PCB), flat display panel (FPD) and other materials to detect different aspects of the object during manufacturing and assembly, such as: the integrity of the conductor (whether there is a break , short circuit, cracking, etc.) and size, integrity and size of the insulator or substrate, size and configuration of the opening, conductor spacing, line width and line length. Since the test method used in the automatic optical inspection system is logically compared, there are usually some shortcomings. Therefore, after being detected by the automatic optical inspection system, the substrate is usually transported to a Verification and Repair Station (VRS) to verify that the defect detected by the manual method is a true defect. Or just a false alarm (such as 祀alarm). When the operator recognizes that a certain substrate unit in the substrate has a real defect, the substrate unit is connected to the copper line of the electroplating line with a pencil sharpener 13 4 1324682 ASEK1S95 22571twf.doc/〇〇6 $. Thus, in the subsequent processing of the bell gold, since the copper line of the substrate unit has been cut off, it is impossible to deposit gold on the copper line. Therefore, after the Automated Visual Inspection (AVI), the operation 1 can be made by the color difference between the Saki and the gold wires, and the substrate unit is a defective component. ' However, in the process of the operator cutting the copper line with a pen knife, the line drawn by the ^ will produce a slight _, these _ may jump to the line of the adjacent 2 早 board 7G, and make other secrets A situation in which a short circuit occurs, and then a rate. In addition, the manual cutting of the copper line also wastes its working time. SUMMARY OF THE INVENTION The present invention provides a method for marking a substrate as a defect. The method 5 is confirmed at 2 transfer stations - the axis on the substrate to be fabricated is a true defect, and a laser is ablated to connect the substrate to the defect. The line. For example, t can avoid the problem that the operator cuts off the line with the pen knife in the prior art, and the copper is dropped, and the working time can be shortened. The present invention provides a confirmation service station, which is characterized by a package, a laser device. When it is confirmed that the repair station confirms that the $ shovel on the substrate to be inspected is trapped, the laser is used to ablate the line 2 connected to the electric ore line on the substrate to avoid the occurrence of (4) falling. The invention provides a method for marking a substrate as a defect. First, a substrate to be inspected is provided. One surface of the substrate has an electric forging line and a line connected to the electric lining. After that, the substrate was detected by a two-automatic optical inspection system, and one of the substrates was measured and found in the computer. Next, the substrate is transferred to the confirmation service station. This confirms that the station will make the defects and the reference image ^ to confirm whether the defects left by the automatic optical inspection system are - direct defects. Finally, when it is confirmed that the defect is a real defect, the two lasers are burned off the line connected to the above-mentioned electric recording line on the substrate. , in the only example of this month, the substrate is a printed circuit board or _
在本發明之-實施射，此顧為二相祕路短 路之處。 本發明另提出一種痒認維修站，適於確認一待檢測基 板上之缺陷是否為一真實缺陷，此待檢測之基板的一表ς 具有一電鍍線以及連接於上述電鍍線之一線路，其特徵在 於此確認轉站包括—雷射裝置，#確認維修站確認此 缺陷為真實缺陷時，則利用雷射裝置燒蝕掉基板上連接於 上述電鍍線之線路。 'In the practice of the present invention, this is a short-circuit of the two-phase secret road. The present invention further provides an itching repair station, which is suitable for confirming whether a defect on a substrate to be inspected is a real defect, and a surface of the substrate to be inspected has an electroplating line and a line connected to the electroplating line. The feature here confirms that the transfer station includes a laser device, and # confirms that the repair station confirms that the defect is a real defect, and then uses a laser device to ablate the circuit connected to the plating line on the substrate. '
在本發明之一實施例中，此基板為一印刷電路板或一 平面顯示面板。 在本發明之一實施例中，此真實缺陷為二相鄰線路之 間短路之處。 本發明所提出之確認維修站及用以標記基板為缺陷 的方法’是於確認維修站確認一待檢測基板上之缺陷為一 真只缺Ptg 8守’利用一雷射燒餘掉此基板上連接於此缺陷之 線路’而不致產生銅屑掉落的問題，以提升產品之良率， 且亦可縮短其作業時間。 6 ASEK1895 22571twf.doc/006 ，讓本發明之上述特徵和優點能更明顯易懂，下文特 牛^佳只施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖1繪不為根據本發明之一實施例的一種用以標記基 陷之方法的方法流程圖。請參相i，首先，提供 一 it，基板(步驟11G)，此基板包含Μ基板單元以及 之：sT。：且各基ί單元的表面上具有—連接於此電鐘線 '—。母個基板單元可為—完成電路製作之印刷電路板 ^個示面ί。之後，利用一自動光學檢測系統檢 儲^ 土板 將各個基板單元上所_到之一缺陷 腦中（步驟12G)°舉例而言，此自動光學檢測系 體的完整性(是否有斷 ί寸二破裂等情形)及尺寸、絕緣體或基板狀整性及 、汗之尺寸及配置、導體間距、線寬及線長等。 陷。因:所之缺陷可能為誤警或是確實屬於真實缺 板傳動光學檢測系統之檢測後，需將此基 陷斑二修站’此確認維修站會將_測到之缺 到⑽ ===，以確認自動光學檢測系統所偵測 陷為直(步驟130)。最後，當確認此缺 於電鑛線之線路(步驟⑽)。由於二連接 連接於電鍍線之線路並不會有任何卓η ^術中因採用筆刀將銅線晝斷而產生銅二= 1324682 ASEK1895 22571 twf_doc/006 阐▲噃不馮畜得檢測之基板置放於確認維修站上，以 確認自動光學檢測系統所偵測到之缺陷是否為一真實缺陷 之示意圖。確認維修站200是以人工的方式確認自動光學 檢測系統所偵測到之缺陷310是屬於真實缺陷或只是誤 警。而此確認維修站200之特點即在於其包含一雷射裝置 210，右操作員確認所偵測到之缺陷31〇實屬一真實缺γ 時’則可利用雷射裝置·所產生的雷射光將基板單元· 上連接於電鑛線之線路燒轉，以 筆刀將缺陷部分^線路晝斷，而產生銅肩掉落的情开^用 更進-步而言’當基板放置於媒認維修站2〇 m維修站2GG之鏡頭22G會擷取出基板單元· =㈣像31Ga，並將影像遍顯示於—螢幕中1 4 ’操作員會將此影像3iGa與一參考影像 此缺陷310是否為一言昝从价丄 於伸扣至了 Μ確这 碟奋Α直·❹ί ”實 #操作員確認此缺陷310 200 掉早70 上連接_料之線路燒钱 掉以避免產生銅屑掉落的情形。 ％ 切、唯是於傳統的確 二?雷射裝置。當確認維修站確認-待』 板上連接於此缺陷之線路。由於===二基 :t操:員以筆刀將線路畫斷，而產生銅:==術 此外’由於此操作係屬於自動化作業，因此=1其 8 1324682 ASEKI895 22571twf.doc/006 作業時間。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤韩， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】In one embodiment of the invention, the substrate is a printed circuit board or a flat display panel. In one embodiment of the invention, this real defect is where there is a short circuit between two adjacent lines. The method for confirming the repair station and marking the substrate as a defect proposed by the present invention is to confirm that the repair station confirms that the defect on the substrate to be inspected is a lack of Ptg 8 Shou's use of a laser to burn off the substrate. Connected to this defective line' without the problem of copper chip falling, to improve the yield of the product, and also shorten the working time. 6 ASEK1895 22571 twf.doc/006, the above features and advantages of the present invention will be more apparent and understood, and the following detailed description will be given in conjunction with the accompanying drawings. [Embodiment] FIG. 1 is a flow chart showing a method for marking a pit according to an embodiment of the present invention. Please refer to phase i. First, an it substrate (step 11G) is provided. The substrate comprises a germanium substrate unit and: sT. : and the surface of each unit has - connected to the electric clock line '-. The mother substrate unit can be a printed circuit board for completing the circuit fabrication. Then, an automatic optical detection system is used to check the storage plate to remove the defective brain from each substrate unit (step 12G). For example, the automatic optical detection system integrity (whether or not there is a break) Second rupture and other conditions) and size, insulator or substrate-like integrity and sweat size and configuration, conductor spacing, line width and line length. trap. Because: the defects may be false alarms or indeed belong to the real lack of board transmission optical detection system detection, you need to base this station on the second repair station 'this confirmation service station will be _ measured missing (10) === To confirm that the detected by the automatic optical inspection system is straight (step 130). Finally, when this line lacking the electric mine line is confirmed (step (10)). Since the two connections are connected to the circuit of the electroplating line, there is no such thing as a ruthenium. In the operation, the copper wire is broken by the use of a pen knife to produce copper II = 1324682 ASEK1895 22571 twf_doc/006 Explanation ▲ 噃 冯 畜 畜 畜 检测 之 基板 基板 基板 基板 基板Confirm the repair station to confirm whether the defect detected by the automatic optical inspection system is a true defect. It is confirmed that the repair station 200 manually confirms that the defect 310 detected by the automatic optical inspection system is a true defect or just an alarm. The confirmation service station 200 is characterized in that it comprises a laser device 210, and the right operator confirms that the detected defect 31 is a real lack of γ, and then the laser light generated by the laser device can be used. The substrate unit is connected to the electric line of the electric ore line, and the defective part is cut off by the pen knife, and the copper shoulder is dropped. The use of the step is further step-by-step when the substrate is placed in the medium. Repair station 2〇m repair station 2GG lens 22G will take out the substrate unit · = (4) like 31Ga, and display the image in the screen - 1 4 'The operator will use this image 3iGa and a reference image whether this defect 310 is A word 昝 昝 昝 至 至 至 这 这 这 这 这 这 这 这 这 这 这 这 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作 操作Situation. % cut, only the traditional two laser equipment. When confirming the repair station confirmation - waiting for the board to connect to this defect line. Because === two base: t operation: the staff draws the line with a pen knife Broken, and produced copper: == surgery in addition 'Because this operation is an automated job, so =1 its 8 132 4682 ASEKI 895 22571 twf.doc/006 OPERATION TIME. While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and any one of ordinary skill in the art without departing from the spirit and scope of the invention In the meantime, the scope of protection of the present invention is subject to the definition of the scope of the appended patent application.
圖1繪不為根據本發明之一實施例的一種用以標記基 板為缺陷之方法的方法流程圖。 圖2繪不為當待檢測之基板置放於確認維修站上，以 確認自動光學檢_統_ _之缺陷是否為—真實缺陷 之示意圖。 【主要元件符號說明】 步驟110··提供—待檢測之基板1 is a flow chart of a method for marking a substrate as a defect in accordance with an embodiment of the present invention. Figure 2 depicts a schematic diagram of the fact that the substrate to be inspected is placed on a confirmation service station to confirm whether the defect of the automatic optical inspection is a true defect. [Description of main component symbols] Step 110··Provide—substrate to be tested
驟120利用—自動光學檢測系統檢測此基板，並 將土板上所伯測到之一缺陷儲存於_電腦中 站將戶二二：.將基板傳輸至—確認維修站，此確認維修 學檢到之缺陷是否為-真“Γ ^確認此缺陷為真實缺陷時，利用一雷射 k蝕掉此基板上連接於此缺陷之線路 200 :確認維修站 ' 210 :雷射裝置 220 I鏡頭 9 1324682 ASEKl 895 22571 twf.doc/006 300 :基板單元 310 :缺陷 310a :影像Step 120 uses an automatic optical inspection system to detect the substrate, and stores one of the defects detected on the soil plate in the computer station. The user transfers the substrate to the confirmation station, and confirms the maintenance inspection. Whether the defect is - true "Γ ^ When confirming that the defect is a real defect, use a laser k to etch the circuit 200 connected to the defect on the substrate: Confirm the service station ' 210 : Laser device 220 I lens 9 1324682 ASEKl 895 22571 twf.doc/006 300: Substrate unit 310: Defect 310a: Image