CN104749185A - Method and apparatus for detecting defect phenomenon of printed circuit board - Google Patents
Method and apparatus for detecting defect phenomenon of printed circuit board Download PDFInfo
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- CN104749185A CN104749185A CN201410014120.7A CN201410014120A CN104749185A CN 104749185 A CN104749185 A CN 104749185A CN 201410014120 A CN201410014120 A CN 201410014120A CN 104749185 A CN104749185 A CN 104749185A
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- circuit board
- printed circuit
- pcb
- light
- irradiation light
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- 230000007547 defect Effects 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title abstract description 10
- 238000001514 detection method Methods 0.000 claims description 33
- 238000003466 welding Methods 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
The invention discloses a method and equipment for detecting defect phenomena of a printed circuit board, which are characterized in that through setting and configuration of two irradiation light sources with different wavelength bands and different incidence angles, namely, the incidence angle of second irradiation light to the printed circuit board is larger than the incidence angle of first irradiation light to the printed circuit board, and the wavelength of the first irradiation light is longer than that of the second irradiation light, the defect phenomena of the printed circuit board covered with a solder mask layer are detected, whether the defect phenomena exist is judged by capturing image data on the printed circuit board to be detected, then crack defects on the solder mask layer and/or heterochromatic defects on conductive joints are identified, and the board crack positions and/or heterochromatic positions are confirmed. Therefore, the invention can improve the quality of the produced printed circuit board.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) detection method optically and checkout equipment, particularly relate to a kind of detection method and checkout equipment of defect phenomenon of printed circuit board (PCB).
Background technology
Light-source system plays very important part on automatic optics inspection (AOI).For example, in the chip of liquid crystal display, SIC (semiconductor integrated circuit) and the manufacture process of relevant P.e.c., all accurate automatic optics inspection must be passed through, to guarantee the quality of finished goods.
Detection on printed circuit board (PCB) normally carries out whether defective inspection for metallic line, detection light is made to carry out forward irradiation to determinand traditionally, because wire generally adopts metal material (such as: copper product), therefore a high reflectance is had, by the reflected light of this irradiation light of direction with or without judging whether wire has the defect that fracture or disconnection etc. occur.
The Making programme that printed circuit board (PCB) is follow-up all can be coated with overlayer (as: welding resisting layer) on the subregion of circuit board, and may because of processing procedure defect (defect as on overheated or covering layer material) or push and make printed circuit board (PCB) bend on processing procedure or in course of conveying in the tectal process of coating, and then cause slight defect phenomenon (such as: plate splits, usually circuit board can be caused to rupture and can be found easily if serious plate splits defect), this kind of slight defect phenomenon has not only had a strong impact on the quality of printed circuit board (PCB), in follow-up course of conveying, more may there is the phenomenon ruptured further, but, such light defects phenomenon is not easily looked, make PCB detecting now technically effectively cannot detect process to defect phenomenon.In addition, when printed circuit board (PCB) is infected with other materials on conductive junction point, (can produce heterochromatic defect) also can affect the quality of the circuit conduction on printed circuit board (PCB).Accordingly, such defect all must be detected, otherwise will be difficult to the quality promoting printed circuit board (PCB).
Summary of the invention
One object of the present invention is the defect phenomenon detected on printed circuit board (PCB).
Another object of the present invention is to make the end product quality of printed circuit board (PCB) to be improved.
For reaching above-mentioned purpose and other objects, the present invention proposes a kind of detection method of defect phenomenon of printed circuit board (PCB), for detecting the printed circuit board (PCB) being coated with welding resisting layer, comprise: this printed circuit board (PCB) is penetrated in the second irradiation illumination of irradiating light and second wave length section with first with first wave length section above this printed circuit board (PCB); And capture to obtain the image data on test print circuit board, to carry out the interpretation of whether defectiveness phenomenon according to this image data, wherein, the incident angle of this second irradiation light to this printed circuit board (PCB) is greater than this first irradiation light to the incident angle of this printed circuit board (PCB), the incident angle of this first irradiation light to this printed circuit board (PCB) is less than 20 degree, and the wavelength of this first wave length section is longer than the wavelength of this second wave length section.
For reaching above-mentioned purpose and other objects, the present invention also proposes a kind of checkout equipment of defect phenomenon of printed circuit board (PCB), for detecting the printed circuit board (PCB) being coated with welding resisting layer, comprises: plummer, for carrying this printed circuit board (PCB); First irradiates light generating device, is configured at above this plummer, for this printed circuit board (PCB) of the first light source irradiation to have first wave length section; Second irradiates light generating device, is configured at above this plummer, for this printed circuit board (PCB) of the oblique irradiation of the secondary light source with second wave length section; Source-collector device, is configured at above this plummer, for obtaining the image data on test print circuit board; And computing host, connect this source-collector device, for carrying out the interpretation of whether defectiveness phenomenon according to this image data, wherein, the incident angle of this second irradiation light to this printed circuit board (PCB) is greater than this first irradiation light to the incident angle of this printed circuit board (PCB), the incident angle of this first irradiation light to this printed circuit board (PCB) is less than 20 degree, and the wavelength of this first wave length section is longer than the wavelength of this second wave length section.
In embodiments of the present invention, the wavelength of this second wave length section is preferably 380nm ~ 570nm, and the wavelength of this first wave length section is preferably more than 600nm.
In embodiments of the present invention, the wavelength of this second wave length section is preferably green wavelength section, and the wavelength of this first wave length section is preferably more than 600nm, and it can have better identification effect to the detection of heterochromatic defect.
In embodiments of the present invention, this second irradiation light generating device is greater than 30 degree for making the incident angle of this second irradiation light to this printed circuit board (PCB).
In embodiments of the present invention, this the second irradiation light generating device is ring-type configuration, to provide the irradiation light of enclosed to this printed circuit board (PCB), or, this the second irradiation light generating device has two light-source generation device, and these two light-source generation device are configured at the both sides of this first irradiation light generating device.
In embodiments of the present invention, this welding resisting layer is green urushoil layer of ink.
Whereby, the present invention is by the irradiation of the irradiation light of different wave length section, and the irradiation light of long wavelength is close to the angular illumination circuit board of direct projection, the irradiation light of short wavelength is then with larger incident angles at side, the lines being so about to allow plate split defect and causing on welding resisting layer, the phenomenons such as ripple are apparent in captured image data, and the color change phenomenon that causes on conductive junction point of heterochromatic defect (such as conductive junction point is infected with other materials, it can affect the conductive capability of contact) be apparent in captured image data, and the defect phenomenon of circuit board can be detected out easily.
Accompanying drawing explanation
Fig. 1 is the detection method process flow diagram of the defect phenomenon of printed circuit board (PCB) in one embodiment of the invention.
Fig. 2 is the schematic diagram of the printed circuit board testing device in one embodiment of the invention.
Fig. 3 is the diagrammatic cross-section under the second irradiation light generating device of the present invention implements aspect at.
Fig. 4 A for printed circuit board (PCB) under general optical detection to the image data that the printed circuit board (PCB) with defect phenomenon captures.
Fig. 4 B under printed circuit board (PCB) ruddiness in embodiments of the present invention and green glow collocation to the image data there is printed circuit board (PCB) that plate splits defect phenomenon capturing.
Fig. 4 C under printed circuit board (PCB) ruddiness in embodiments of the present invention and blue light collocation to the image data there is printed circuit board (PCB) that plate splits defect phenomenon capturing.
Fig. 5 A for printed circuit board (PCB) under general optical detection to the image data that the printed circuit board (PCB) with heterochromatic defect phenomenon captures.
The image data of Fig. 5 B for capturing the printed circuit board (PCB) with heterochromatic defect phenomenon under printed circuit board (PCB) ruddiness in embodiments of the present invention and green glow collocation.
Critical piece Reference numeral:
100 first irradiate light generating device
120 first irradiate light
200 second irradiate light generating device
220 second irradiate light
300 source-collector devices
400 computing host
500 plummers
600 printed circuit board (PCB)s
S101 ~ S105 step
Embodiment
For fully understanding object of the present invention, feature and technique effect, hereby by following specific embodiment, and by reference to the accompanying drawings, the present invention being elaborated, being described as follows:
Plate known at present split defect phenomenon be all occur to be coated with welding resisting layer (as green urushoil layer of ink) on a printed circuit after, welding resisting layer there occurs slight crack, and this slight crack is called as " SR CRACK "; Another kind of then be circuit board conductive junction point on be infected with other materials and the defect of the heterochromatic phenomenon produced.Other can manifest detection also applicable the present invention of the defect of circuit board situation under the irradiation light of different wave length section.
Be the detection method process flow diagram of the defect phenomenon of printed circuit board (PCB) in one embodiment of the invention please refer to Fig. 1 and Fig. 2, Fig. 1, Fig. 2 is the schematic diagram of the printed circuit board testing device in one embodiment of the invention.The checkout equipment of defect phenomenon of the present invention comprises: first irradiates light generating device 100, second irradiates light generating device 200, source-collector device 300, computing host 400 and plummer 500.
The detection method of defect phenomenon of the present invention, for detecting the printed circuit board (PCB) being coated with welding resisting layer, comprises following steps:
Step S101, the second irradiation light 220 irradiating light 120 and second wave length section with first with first wave length section above this printed circuit board (PCB) 600 irradiate this printed circuit board (PCB).The incident angle of this second irradiation light 220 to this printed circuit board (PCB) 600 is greater than this first irradiation light 120 to the incident angle of this printed circuit board (PCB) 600.The incident angle of this first irradiation light 120 to this printed circuit board (PCB) 600 is less than 20 degree.The wavelength of this first wave length section is longer than the wavelength of this second wave length section.Fig. 2 is to be configured at the both sides of this first irradiation light generating device 100, other configuration modes are applicable the present invention also, so for obtaining preferably image quality, the left and right sides be configured to a good solution, then can with further reference to the aspect shown in Fig. 3 of the present invention for obtaining clearer image data.
Then, step S103, capture to obtain the image data on this test print circuit board.This step is by source-collector device 300(such as image capturing device) capture this printed circuit board (PCB) irradiates by first the image data reflected after light 120 and second irradiates the irradiation of light 220, once stopping on printed circuit board (PCB), layer has the phenomenon such as lines, ripple and can clearly be presented on this image data.
Therefore, step S105, carry out the interpretation of whether defectiveness phenomenon according to this image data.Because namely the phenomenon such as lines, ripple on the only layer on printed circuit board (PCB) can show shape under the irradiation of the special irradiation light of the present invention two kinds, therefore, the present invention can allow testing staff or detected out rapidly by the mode of computing machine automatic interpretation and whether printed circuit board (PCB) have plate and split the tram that defect and this plate split; Heterochromatic phenomenon detect in, other materials have been infected with once conductive junction point, also shape can be showed under the irradiation of the special irradiation light of the present invention two kinds, therefore, the present invention can allow testing staff or detect out the tram whether conductive junction point with heterochromatic defect and this heterochromatic phenomenon rapidly by the mode of computing machine automatic interpretation.
The present invention is under the setting of specific irradiation light, and the wavelength of this second wave length section is 380nm ~ 570nm, the better wave band that can be blue light or green glow.The wavelength of this first wave length section is more than 600nm, is preferably the wave band of ruddiness.Wherein, the angle of the second irradiation light 220 incidence is also the key making defect phenomenon know existing shape, therefore the angle of the second irradiation light 220 incidence must be greater than the incident angle of the first irradiation light 120, and preferably the incident angle of this second irradiation light to this printed circuit board (PCB) 600 is greater than 30 degree.In addition, plate is split to the detection of defect, second wave length section can adopt blue light or green glow; And for the detection of heterochromatic defect, the better wavelength period (such as: 490nm ~ 570nm) adopting green glow of second wave length section, there to be better Detection results.
Then Fig. 3 is referred to, for of the present invention second irradiates the diagrammatic cross-section of light generating device under an enforcement aspect.Of the present invention second irradiates light generating device 200 can be single configuration, subtend configuration (as shown in Figure 2) of symmetrical expression or the configuration of ring-type as shown in Figure 3, and the configuration of this ring-type can provide more sufficient radiation source.Wherein, the second irradiation light generating device 200 of the present invention is preferably as previously mentioned and adopts incident this printed circuit board (PCB) 600(of oblique angle as shown in Figure 2,3).
Then please refer to Fig. 4 A ~ 4C, Fig. 4 A for printed circuit board (PCB) under general optical detection to the image data that the printed circuit board (PCB) with defect phenomenon captures, the image data of Fig. 4 B for capturing the printed circuit board (PCB) with defect phenomenon under printed circuit board (PCB) ruddiness in embodiments of the present invention and green glow collocation, the image data of Fig. 4 C for capturing the printed circuit board (PCB) with defect phenomenon under printed circuit board (PCB) ruddiness in embodiments of the present invention and blue light collocation.
Known under general detection by Fig. 4 A, although printed circuit board (PCB) has defect phenomenon, cannot be detected out completely, general irradiation light, as described in prior art of the present invention, is all carry out irradiation close to vertical incidence and detection with general light source (comprising the wavelength of each wave band).
Review Fig. 4 B and 4C, the image data of its printed circuit board (PCB) sequentially arrived with ruddiness and lower the acquisition of green glow, ruddiness and blue light two kinds collocation with configuration mode of the present invention, described green glow and blue light the second irradiation light generating device 200 namely alleged by the present invention produced.As shown in the figure, the plate of printed circuit board (PCB) splits phenomenon and can be detected out easily, no matter be manually inspect, or by the special calculation setting of computing machine in the mode detected that is automated to the image data there are these plates splitting feature, all can reach the detection that plate splits phenomenon, the phenomenon such as lines, ripple being so about to allow plate split and causing on welding resisting layer is apparent in captured image data, and can be split phenomenon by detecting easily ejecting plate.
Then please refer to Fig. 5 A, 5B, Fig. 5 A for printed circuit board (PCB) under general optical detection to the image data that the printed circuit board (PCB) with heterochromatic defect phenomenon captures; The image data of Fig. 5 B for capturing the printed circuit board (PCB) with heterochromatic defect phenomenon under printed circuit board (PCB) ruddiness in embodiments of the present invention and green glow collocation.
Known under general detection by Fig. 5 A, although the conductive junction point of printed circuit board (PCB) has heterochromatic defect phenomenon, cannot be detected out completely, general irradiation light, as described in prior art of the present invention, is all carry out irradiation close to vertical incidence and detection with general light source (comprising the wavelength of each wave band).Review Fig. 5 B, the image data of its printed circuit board (PCB) arrived with ruddiness and lower the acquisition of green glow two kinds collocation with configuration mode of the present invention, the second irradiation light generating device 200 of described green glow namely alleged by the present invention produced.As shown in the figure, heterochromatic defect phenomenon on the conductive junction point of printed circuit board (PCB) can be detected out easily, no matter be manually inspect, or by setting the special calculation of computing machine in the mode detected that is automated to the image data of the feature with these heterochromatic defects, all can reach the detection of defect phenomenon, so be about to allow and cause the situation of color change to be apparent in captured image data because welding resisting layer being infected with other materials, and heterochromatic phenomenon can be detected out easily.
Comprehensively above-mentioned, the present invention can carry out impalpable defect phenomenon and detect to the printed circuit board (PCB) covering welding resisting layer, and then improves the quality of the printed circuit board (PCB) produced.
The present invention discloses with preferred embodiment hereinbefore, but it will be understood by those skilled in the art that this embodiment only for describing the present invention, and should not be read as and limit the scope of the invention.It should be noted, every change with this embodiment equivalence and displacement, all should be considered as being covered by category of the present invention.Therefore, the content that protection scope of the present invention ought limit with claims is as the criterion.
Claims (17)
1. a detection method for the defect phenomenon of printed circuit board (PCB), is characterized in that, for detecting the printed circuit board (PCB) being coated with welding resisting layer, comprises:
This printed circuit board (PCB) is penetrated in the second irradiation illumination of irradiating light and second wave length section with first with first wave length section above this printed circuit board (PCB);
Capture to obtain the image data on test print circuit board; And
The interpretation of whether defectiveness phenomenon is carried out according to this image data,
Wherein, the incident angle of this second irradiation light to this printed circuit board (PCB) is greater than this first irradiation light to the incident angle of this printed circuit board (PCB), the incident angle of this first irradiation light to this printed circuit board (PCB) is less than 20 degree, and the wavelength of this first wave length section is longer than the wavelength of this second wave length section.
2. detection method as claimed in claim 1, it is characterized in that, the wavelength of this second wave length section is 380nm ~ 570nm.
3. detection method as claimed in claim 2, it is characterized in that, the wavelength of this first wave length section is more than 600nm.
4. detection method as claimed in claim 3, it is characterized in that, the wavelength of this second wave length section is green wavelength section.
5. detection method as claimed in claim 1, is characterized in that, the incident angle of this second irradiation light to this printed circuit board (PCB) is greater than 30 degree.
6. detection method as claimed in claim 1, is characterized in that, this second light-source generation device of irradiating light is ring-type configuration, to provide the irradiation light of enclosed to this printed circuit board (PCB).
7. detection method as claimed in claim 1, is characterized in that, this second irradiation light has two light-source generation device, and these two light-source generation device are configured at the both sides of the light-source generation device of this first irradiation light.
8. detection method as claimed in claim 1, is characterized in that, first to irradiate light be ruddiness for this, and second to irradiate light be one of them of blue light and green glow for this, and this second irradiates the incident angle of light to this printed circuit board (PCB) and be greater than 30 degree.
9. detection method as claimed in claim 1, it is characterized in that, this welding resisting layer is green urushoil layer of ink.
10. a checkout equipment for the defect phenomenon of printed circuit board (PCB), is characterized in that, for detecting the printed circuit board (PCB) being coated with welding resisting layer, comprises:
Plummer, for carrying this printed circuit board (PCB);
First irradiates light generating device, is configured at above this plummer, for this printed circuit board (PCB) of the first light source irradiation to have first wave length section;
Second irradiates light generating device, is configured at above this plummer, for this printed circuit board (PCB) of the oblique irradiation of the secondary light source with second wave length section;
Source-collector device, is configured at above this plummer, for obtaining the image data on test print circuit board; And
Computing host, connects this source-collector device, for carrying out the interpretation of whether defectiveness phenomenon according to this image data,
Wherein, the incident angle of this second irradiation light to this printed circuit board (PCB) is greater than this first irradiation light to the incident angle of this printed circuit board (PCB), the incident angle of this first irradiation light to this printed circuit board (PCB) is less than 20 degree, and the wavelength of this first wave length section is longer than the wavelength of this second wave length section.
11. checkout equipments as claimed in claim 10, is characterized in that, the wavelength of this second wave length section is 380nm ~ 570nm.
12. checkout equipments as claimed in claim 11, it is characterized in that, the wavelength of this first wave length section is more than 600nm.
13. checkout equipments as claimed in claim 12, is characterized in that, the wavelength of this second wave length section is green wavelength section.
14. checkout equipments as claimed in claim 10, is characterized in that, this second irradiation light generating device is greater than 30 degree for making the incident angle of this second irradiation light to this printed circuit board (PCB).
15. checkout equipments as claimed in claim 10, is characterized in that, this second irradiation light generating device is ring-type configuration, to provide the irradiation light of enclosed to this printed circuit board (PCB).
16. checkout equipments as claimed in claim 10, is characterized in that, this second irradiation light generating device has two light-source generation device, and these two light-source generation device are configured at the both sides of this first irradiation light generating device.
17. checkout equipments as claimed in claim 10, is characterized in that, this welding resisting layer is green urushoil layer of ink.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102148360A TWI504886B (en) | 2013-12-26 | 2013-12-26 | Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same |
| TW102148360 | 2013-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104749185A true CN104749185A (en) | 2015-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410014120.7A Pending CN104749185A (en) | 2013-12-26 | 2014-01-13 | Method and apparatus for detecting defect phenomenon of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104749185A (en) |
| TW (1) | TWI504886B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020180985A1 (en) * | 2000-09-20 | 2002-12-05 | Dan Wack | Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen |
| JP3918579B2 (en) * | 2002-02-22 | 2007-05-23 | オムロン株式会社 | Surface observation device |
| CN101034069A (en) * | 2006-03-10 | 2007-09-12 | 欧姆龙株式会社 | Defect inspection apparatus and defect inspection method |
| KR20090021023A (en) * | 2007-08-24 | 2009-02-27 | 주식회사 미르기술 | Inclination surface test method and inclination surface test apparatus for test workpiece of electron parts using the same |
| CN202471611U (en) * | 2012-03-19 | 2012-10-03 | 宏濑科技股份有限公司 | Optical detection system |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6552783B1 (en) * | 2000-06-28 | 2003-04-22 | Teradyne, Inc. | Optical system |
| JP3872007B2 (en) * | 2002-12-16 | 2007-01-24 | シーケーディ株式会社 | Measuring device and inspection device |
| US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
| TWI401430B (en) * | 2010-06-18 | 2013-07-11 | Machvision Inc | Method for inspecting defects of power layer and ground layer of pcb |
-
2013
- 2013-12-26 TW TW102148360A patent/TWI504886B/en active
-
2014
- 2014-01-13 CN CN201410014120.7A patent/CN104749185A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020180985A1 (en) * | 2000-09-20 | 2002-12-05 | Dan Wack | Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen |
| JP3918579B2 (en) * | 2002-02-22 | 2007-05-23 | オムロン株式会社 | Surface observation device |
| CN101034069A (en) * | 2006-03-10 | 2007-09-12 | 欧姆龙株式会社 | Defect inspection apparatus and defect inspection method |
| KR20090021023A (en) * | 2007-08-24 | 2009-02-27 | 주식회사 미르기술 | Inclination surface test method and inclination surface test apparatus for test workpiece of electron parts using the same |
| CN202471611U (en) * | 2012-03-19 | 2012-10-03 | 宏濑科技股份有限公司 | Optical detection system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI504886B (en) | 2015-10-21 |
| TW201525453A (en) | 2015-07-01 |
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Application publication date: 20150701 |