TWI504886B - Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same - Google Patents
Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same Download PDFInfo
- Publication number
- TWI504886B TWI504886B TW102148360A TW102148360A TWI504886B TW I504886 B TWI504886 B TW I504886B TW 102148360 A TW102148360 A TW 102148360A TW 102148360 A TW102148360 A TW 102148360A TW I504886 B TWI504886 B TW I504886B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- illumination light
- wavelength
- light
- Prior art date
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
本發明係關於一種印刷電路板於光學上之檢測方法及檢測設備，更特別的是關於一種印刷電路板之缺陷現象的檢測方法及檢測設備。The invention relates to a method and a detection device for optically detecting a printed circuit board, and more particularly to a method and a detection device for detecting defects of a printed circuit board.
光源系統在自動光學檢測(AOI)上係扮演著舉足輕重的腳色。舉例來說，在液晶顯示器、半導體積體電路之晶片以及相關印刷電路的製造過程中皆須經過精密的自動光學檢測，以確保完成品的品質。The light source system plays a pivotal role in automatic optical inspection (AOI). For example, precision automated optical inspection is required in the manufacture of liquid crystal displays, wafers of semiconductor integrated circuits, and related printed circuits to ensure the quality of finished products.
印刷電路板上的檢測通常是針對金屬導線線路進行是否有缺陷的檢查，傳統上係使檢測光線對待測物進行正向照射，由於導線一般係採用金屬材料(例如：銅材料)，因此具高反射能力，藉著正向方向之該照射光的反射光有無來判斷導線是否有發生斷裂或斷開等的缺陷。Inspection on a printed circuit board is usually a check for defects in the metal wire line. Traditionally, the test light is forwardly irradiated to the object to be tested. Since the wire is generally made of a metal material (for example, copper material), it is high. The reflection ability determines whether or not the wire is broken or broken by the presence or absence of the reflected light of the illumination light in the forward direction.
在印刷電路板後續的製作流程上皆會在電路板的部分區域上披覆有覆蓋層(如：防焊層)，而在披覆覆蓋層的過程中可能會在製程上或是在輸送過程中因製程缺陷(如過熱或覆蓋層材料上的缺陷)或推擠而使印刷電路板發生彎曲，進而造成輕微的缺陷現象(例如：板裂，若是嚴重的板裂缺陷通常會導致電路板斷裂而可被輕易地發現)，此種輕微的缺陷現象不但嚴重影響了印刷電路板的品質，更可能在後續的輸送過程中進一步發生斷裂的現象，然而，此等輕微缺陷現象不易被視得，使得現今的印刷電路板檢測技術上無法對缺陷現象進行 有效的檢出處理。此外，印刷電路板在導電接點上沾染有其他物質時(會產生異色缺陷)亦會影響印刷電路板上之陷路導電的品質。據此，此等缺陷皆是必須被檢測出的，否則將難以提升印刷電路板的品質。In the subsequent manufacturing process of the printed circuit board, a cover layer (such as a solder resist layer) may be coated on a part of the circuit board, and may be in the process or in the process of transporting the cover layer. The printed circuit board is bent due to process defects (such as overheating or defects on the cover material) or pushing, resulting in slight defects (such as cracking, if a severe cracking defect usually causes the board to break It can be easily found) that such a slight defect not only seriously affects the quality of the printed circuit board, but is more likely to break in the subsequent transport process. However, such minor defects are not easily seen. This makes it impossible to detect defects on today's printed circuit board inspection technology. Effective checkout processing. In addition, when the printed circuit board is contaminated with other substances on the conductive contacts (which may cause heterochromatic defects), it also affects the quality of the trapping conduction on the printed circuit board. Accordingly, these defects must be detected, otherwise it will be difficult to improve the quality of the printed circuit board.
本發明之一目的在於檢出印刷電路板上的缺陷現象。One of the objects of the present invention is to detect defects on a printed circuit board.
本發明之另一目的在於使印刷電路板的成品品質得以提高。Another object of the present invention is to improve the quality of the finished printed circuit board.
為達上述目的及其他目的，本發明提出一種印刷電路板之缺陷現象的檢測方法，係用於檢測已覆蓋有防焊層的印刷電路板，包含：於該印刷電路板上方以具有第一波長段之第一照射光及第二波長段之第二照射光照射該印刷電路板；及擷取得該待測印刷電路板上的影像資料，以根據該影像資料進行是否有缺陷現象的判讀，其中，該第二照射光對該印刷電路板的入射角係大於該第一照射光對該印刷電路板的入射角，該第一照射光對該印刷電路板的入射角係小於20度，該第一波長段之波長係長於該第二波長段之波長。To achieve the above and other objects, the present invention provides a method for detecting a defect of a printed circuit board for detecting a printed circuit board covered with a solder resist layer, comprising: having a first wavelength above the printed circuit board The first illumination light of the segment and the second illumination light of the second wavelength segment illuminate the printed circuit board; and the image data on the printed circuit board to be tested is obtained to perform the interpretation of the defect according to the image data, wherein The incident angle of the second illumination light to the printed circuit board is greater than the incident angle of the first illumination light to the printed circuit board, and the incident angle of the first illumination light to the printed circuit board is less than 20 degrees. The wavelength of a wavelength band is longer than the wavelength of the second wavelength band.
為達上述目的及其他目的，本發明復提出一種印刷電路板之缺陷現象的檢測設備，係用於檢測已覆蓋有防焊層的印刷電路板，包含：一承載台，用於承載該印刷電路板；一第一照射光產生裝置，係配置於該承載台上方，用於以具有第一波長段之第一光源照射該印刷電路板；一第二照射光產生裝置，係配置於該承載台上方，用於以具有第二波長段之第二光源斜向照射該印刷電路板；一光源收集裝置，係配置於該承載台上方，用於取得該待測印刷電路板上的影像資料；及一運算主機，係連接該光源收集裝置，用於根據該影像資料進行是否有缺陷現象的判讀，其中，該第二照射光對該印刷電路板的入射角係大於該第一照射光對該印刷電路板的入射角，該第一照射光對該印刷電路板的入射角係小於20度，該第一波長段之波長係長於該第二波長段之波長。In order to achieve the above and other objects, the present invention provides a detecting device for a defect of a printed circuit board for detecting a printed circuit board covered with a solder resist layer, comprising: a carrying platform for carrying the printed circuit a first illumination light generating device disposed above the carrier for illuminating the printed circuit board with a first light source having a first wavelength band; and a second illumination light generating device disposed on the carrier Upper side, for illuminating the printed circuit board obliquely with a second light source having a second wavelength band; a light source collecting device disposed above the carrying platform for acquiring image data on the printed circuit board to be tested; a computing host is connected to the light source collecting device for performing an interpretation of a defect according to the image data, wherein an incident angle of the second illumination light to the printed circuit board is greater than the first illumination light to the printing An incident angle of the circuit board, the incident angle of the first illumination light to the printed circuit board is less than 20 degrees, and the wavelength of the first wavelength segment is longer than the wavelength of the second wavelength segment.
於本發明之一實施例中，該第二波長段的波長較佳為380nm~570nm，該第一波長段的波長較佳為600nm以上。In an embodiment of the invention, the wavelength of the second wavelength band is preferably 380 nm to 570 nm, and the wavelength of the first wavelength band is preferably 600 nm or more.
於本發明之一實施例中，該第二波長段的波長較佳為綠光波長段，而該第一波長段的波長較佳為600nm以上，其係可對異色缺陷的檢測有更佳的辨識效果。In an embodiment of the invention, the wavelength of the second wavelength segment is preferably a green wavelength band, and the wavelength of the first wavelength segment is preferably 600 nm or more, which is better for detecting different color defects. Identify the effect.
於本發明之一實施例中，該第二照射光產生裝置係用於使該第二照射光對該印刷電路板的入射角大於30度。In an embodiment of the invention, the second illumination light generating device is configured to make the incident angle of the second illumination light to the printed circuit board greater than 30 degrees.
於本發明之一實施例中，該第二照射光產生裝置係為環狀配置，以對該印刷電路板提供包圍式的照射光，或者是，該第二照射光產生裝置具有二光源產生裝置，該二光源產生裝置係配置於該第一照射光產生裝置的兩側。In an embodiment of the invention, the second illumination light generating device is in an annular configuration to provide the surrounding illumination light to the printed circuit board, or the second illumination light generating device has two light source generating devices. The two light source generating devices are disposed on both sides of the first illumination light generating device.
於本發明之一實施例中，該防焊層係為綠漆油墨層。In an embodiment of the invention, the solder resist layer is a green paint ink layer.
藉此，本發明透過不同波長段之照射光的照射，且長波長的照射光係接近直射的角度照射電路板，短波長之照射光則是於側邊以較大入射角入設，如此即將讓板裂缺陷在防焊層上造成的紋路、波紋等現象得以顯現在所擷取的影像資料中，以及異色缺陷在導電接點上造成的顏色改變現象(例如導電接點沾染其他物質，其係會影響接點的導電能力)得以顯現在所擷取的影像資料中，而可輕易地檢知出電路板的缺陷現象。Therefore, the present invention transmits illumination light of different wavelength bands, and the long-wavelength illumination light illuminates the circuit board at a direct angle, and the short-wavelength illumination light is placed at a larger incident angle on the side, so that The phenomenon of streaks, ripples, etc. caused by the crack defects on the solder resist layer can be seen in the captured image data, and the color change caused by the heterochromatic defects on the conductive contacts (for example, the conductive contacts are contaminated with other substances, It will affect the conductivity of the contacts. It can be seen in the captured image data, and the defects of the board can be easily detected.
100‧‧‧第一照射光產生裝置100‧‧‧First illumination light generating device
120‧‧‧第一照射光120‧‧‧First illumination
200‧‧‧第二照射光產生裝置200‧‧‧second illumination light generating device
220‧‧‧第二照射光220‧‧‧second illumination
300‧‧‧光源收集裝置300‧‧‧Light source collection device
400‧‧‧運算主機400‧‧‧ computing host
500‧‧‧承載台500‧‧‧bearing station
600‧‧‧印刷電路板600‧‧‧Printed circuit board
S101~S105‧‧‧步驟S101~S105‧‧‧Steps
第1圖係為本發明一實施例中之印刷電路板之缺陷現象的檢測方法流程圖。Fig. 1 is a flow chart showing a method for detecting a defect of a printed circuit board according to an embodiment of the present invention.
第2圖係為本發明一實施例中之印刷電路板檢測設備的示意圖。Fig. 2 is a schematic view showing a printed circuit board detecting apparatus in an embodiment of the invention.
第3圖係為本發明之第二照射光產生裝置於一實施態樣下的剖面示意圖。Fig. 3 is a schematic cross-sectional view showing a second illumination light generating device of the present invention in an embodiment.
第4A圖係為印刷電路板在一般光學檢測下對具有缺陷現象之印刷電路板所擷取的影像資料。Figure 4A is the image data captured by a printed circuit board on a printed circuit board with defects under general optical inspection.
第4B圖係為印刷電路板在本發明實施例中之紅光及綠光搭配下對具有板裂缺陷現象之印刷電路板所擷取的影像資料。FIG. 4B is an image data obtained by a printed circuit board on a printed circuit board having a crack defect phenomenon in the combination of red light and green light in the embodiment of the present invention.
第4C圖係為印刷電路板在本發明實施例中之紅光及藍光搭配下對具有板裂缺陷現象之印刷電路板所擷取的影像資料。Fig. 4C is a view showing the image data obtained by the printed circuit board on the printed circuit board having the phenomenon of cracking defects in the combination of red light and blue light in the embodiment of the present invention.
第5A圖係為印刷電路板在一般光學檢測下對具有異色缺陷現象之印刷電路板所擷取的影像資料。Figure 5A is the image data taken by a printed circuit board on a printed circuit board having a phenomenon of heterochromatic defects under general optical inspection.
第5B圖係為印刷電路板在本發明實施例中之紅光及綠光搭配下對具有異色缺陷現象之印刷電路板所擷取的影像資料。FIG. 5B is an image data captured by a printed circuit board having a heterochromatic defect phenomenon in a red light and a green light in the embodiment of the present invention.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：目前已知的板裂缺陷現象都是發生在印刷電路板上塗佈防焊層(如綠漆油墨層)之後，在防焊層上發生了裂痕，這種裂痕被稱之為「SR CRACK」；另一種則是電路板之導電接點上沾染其他物質而產生之異色現象之缺陷。其他可在不同波長段之照射光下顯現電路板狀況之缺陷的檢測亦可適用本發明。In order to fully understand the objects, features and effects of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings. After the solder resist layer (such as the green paint ink layer) is applied on the printed circuit board, cracks occur on the solder resist layer. This crack is called "SR CRACK"; the other is the conductive of the circuit board. Defects in the color difference caused by contamination with other substances on the joint. Other inventions that detect defects in the condition of the board under illumination from different wavelengths are also applicable to the present invention.
請同時參閱第1圖及第2圖，第1圖係為本發明一實施例中之印刷電路板之缺陷現象的檢測方法流程圖，第2圖係為本發明一實施例中之印刷電路板檢測設備的示意圖。本發明之缺陷現象的檢測設備包含：第一照射光產生裝置100、第二照射光產生裝置200、光源收集裝置300、運算主機400及承載台500。Please refer to FIG. 1 and FIG. 2 simultaneously. FIG. 1 is a flowchart of a method for detecting a defect of a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a printed circuit board according to an embodiment of the present invention. A schematic diagram of the detection device. The apparatus for detecting a defect of the present invention includes a first illumination light generating device 100, a second illumination light generating device 200, a light source collecting device 300, a computing host 400, and a carrying platform 500.
本發明之缺陷現象的檢測方法，係用於檢測已覆蓋有防焊層的印刷電路板，包含以下步驟：步驟S101、於該印刷電路板600上方以具有第一波長段之第一照射光120及第二波長段之第二照射光220照射該印刷電路板。該第二照射光220對該印刷電路板600的入射角係大於該第一照射光120對該印刷電路板600的入射 角。該第一照射光120對該印刷電路板600的入射角係小於20度。該第一波長段之波長係長於該第二波長段之波長。第2圖係以配置於該第一照射光產生裝置100的兩側為例，其他配置方式亦可適用本發明，然為獲得較佳的影像資料品質，左右兩側的配置係一較好的解決方案，欲取得更清楚之影像資料則可進一步參考本案第3圖所示之態樣。The method for detecting a defect phenomenon of the present invention is for detecting a printed circuit board covered with a solder resist layer, comprising the following steps: Step S101, the first illumination light 120 having a first wavelength band above the printed circuit board 600 And the second illumination light 220 of the second wavelength band illuminates the printed circuit board. The incident angle of the second illumination light 220 to the printed circuit board 600 is greater than the incidence of the first illumination light 120 on the printed circuit board 600. angle. The angle of incidence of the first illumination light 120 to the printed circuit board 600 is less than 20 degrees. The wavelength of the first wavelength band is longer than the wavelength of the second wavelength band. The second figure is exemplified on both sides of the first illumination light generating device 100. Other configurations may also be applied to the present invention. However, in order to obtain better image quality, the left and right configurations are better. Solution, for more clear image information, please refer to the situation shown in Figure 3 of this case.
接著，步驟S103、擷取得該待測印刷電路板上的影像資料。此步驟係透過光源收集裝置300(例如影像擷取裝置)來對該印刷電路板上受第一照射光120及第二照射光220的照射後所反射出的影像資料進行擷取，一旦印刷電路板上之止焊層上具有紋路、波紋等現象時即可清楚地呈現在該影像資料上。Next, in step S103, the image data on the printed circuit board to be tested is obtained. In this step, the image data reflected by the first illumination light 120 and the second illumination light 220 on the printed circuit board is captured by the light source collection device 300 (for example, the image capture device), once the printed circuit is printed. The image on the image of the solder layer on the board can be clearly presented on the image.
因此，步驟S105、根據該影像資料進行是否有缺陷現象的判讀。由於印刷電路板上之止焊層上的紋路、波紋等現象在本案兩種特殊照射光的照射下即會現形，因此，本發明可讓檢測人員或透過電腦自動判讀的方式快速地檢知出印刷電路板上是否具有板裂缺陷及該板裂的正確位置；於異色現象檢測的方面，一旦導電接點沾染有其他物質時，在本案兩種特殊照射光的照射下亦會現形，因此，本發明可讓檢測人員或透過電腦自動判讀的方式快速地檢知出導電接點上是否具有異色缺陷及該異色現象的正確位置。Therefore, in step S105, it is determined whether or not there is a defect based on the image data. Since the phenomenon of lines, ripples and the like on the solder resist layer on the printed circuit board will appear in the case of the irradiation of two special illumination lights in the present case, the present invention can be quickly detected by the inspector or by means of automatic interpretation by a computer. Whether there is a crack defect on the printed circuit board and the correct position of the crack; in the aspect of detecting the color difference, once the conductive contact is contaminated with other substances, it will also appear under the illumination of two special illumination lights in this case. The invention can quickly detect whether the conductive contact has a different color defect and the correct position of the color difference phenomenon by the detecting person or automatically interpreting by the computer.
本發明在特定之照射光的設定下，該第二波長段的波長係為380nm~570nm，較佳係可為藍光或綠光的波段。該第一波長段的波長係為600nm以上，較佳係為紅光的波段。其中，第二照射光線220入射的角度亦是使缺陷現象清楚現形的關鍵，因此第二照射光線220入射的角度必須大於第一照射光線120的入射角度，而較佳的是該第二照射光對該印刷電路板600的入射角係大於30度。此外，對於板裂缺陷的檢測來說，第二波長段係可採用藍光或綠光；而對於異色缺陷的檢測來說，第二波長段較佳係可採用綠光的波長段(例如：490nm~570nm)，以有更佳的檢測效果。In the present invention, the wavelength of the second wavelength band is 380 nm to 570 nm under the setting of the specific illumination light, and preferably it is a wavelength band of blue light or green light. The wavelength of the first wavelength band is 600 nm or more, and is preferably a band of red light. The angle at which the second illumination light 220 is incident is also the key to making the defect phenomenon clear. Therefore, the angle of incidence of the second illumination light 220 must be greater than the incident angle of the first illumination light 120, and preferably the second illumination light. The angle of incidence of the printed circuit board 600 is greater than 30 degrees. In addition, for the detection of the crack defect, the second wavelength band may adopt blue or green light; and for the detection of the heterochromatic defect, the second wavelength segment preferably adopts a wavelength range of green light (for example: 490 nm) ~570nm) for better detection results.
接著請參閱第3圖，係為本發明之第二照射光產生裝置於一實施態樣下的剖面示意圖。本發明之第二照射光產生裝置200可為單一的配置、對稱式的對向配置(如第2圖所示)或是如第3圖所示之環狀配置，該環狀式配置將可提供更充足的照射光源。其中，本發明之第二照射光產生裝置200如前所述較佳係採斜向角度入射該印刷電路板600(如第2、3圖所示)。Next, please refer to FIG. 3, which is a cross-sectional view showing a second illumination light generating device of the present invention in an embodiment. The second illumination light generating device 200 of the present invention may be a single configuration, a symmetric opposite configuration (as shown in FIG. 2) or a ring configuration as shown in FIG. 3, and the annular configuration will be Provide a more adequate illumination source. Preferably, the second illumination light generating device 200 of the present invention is incident on the printed circuit board 600 at an oblique angle as described above (as shown in FIGS. 2 and 3).
接著請同時參閱第4A~4C圖，第4A圖係為印刷電路板在一般光學檢測下對具有缺陷現象之印刷電路板所擷取的影像資料，第4B圖係為印刷電路板在本發明實施例中之紅光及綠光搭配下對具有缺陷現象之印刷電路板所擷取的影像資料，第4C圖係為印刷電路板在本發明實施例中之紅光及藍光搭配下對具有缺陷現象之印刷電路板所擷取的影像資料。Please refer to the 4A~4C diagram at the same time. The 4A figure is the image data of the printed circuit board which is taken by the printed circuit board with the defect phenomenon under the general optical inspection, and the 4B figure is the printed circuit board in the implementation of the invention. In the example, the red and green light are combined with the image data captured by the printed circuit board having the defect phenomenon, and the 4C is the printed circuit board having the defect of the red light and the blue light in the embodiment of the present invention. The image data captured by the printed circuit board.
由第4A圖可知在一般的檢測下，縱然印刷電路板具有缺陷現象，卻是完全無法被檢知出來，一般的照射光如本案先前技術所述，皆是以一般的光源(包含各波段之波長)來進行接近垂直入射的照射與檢測。It can be seen from Fig. 4A that under normal detection, even if the printed circuit board has defects, it is completely undetectable. Generally, the illumination light is a general light source (including each band) as described in the prior art of the present case. Wavelength) for illumination and detection near normal incidence.
反觀第4B及4C圖，其係以本案之配置方式依序以紅光及綠光、紅光及藍光兩種搭配下所擷取到之印刷電路板的影像資料，所述之綠光及藍光即由本案所稱之第二照射光產生裝置200所產生。如圖所示，印刷電路板的板裂現象可被輕易地檢知出，無論是人工檢視，或是透過對電腦的特殊演算設定以對具有該等板裂特徵之影像資料得以被自動化檢出的方式，皆可達到板裂現象的檢測，如此即將讓板裂在防焊層上造成的紋路、波紋等現象得以顯現在所擷取的影像資料中，而可被輕易地檢知出板裂現象。In contrast, in Figures 4B and 4C, the image data of the printed circuit board captured by the combination of red light, green light, red light and blue light in the configuration of the present case, the green light and blue light That is, it is produced by the second illumination light generating device 200 referred to in the present invention. As shown in the figure, the cracking phenomenon of the printed circuit board can be easily detected, whether it is a manual inspection or a special calculation setting for the computer to automatically detect the image data having the cracking characteristics. The method of detecting the cracking phenomenon can be achieved, so that the lines, ripples and the like caused by the cracking of the plate on the solder resist layer can be visualized in the captured image data, and the crack can be easily detected. phenomenon.
接著請同時參閱第5A、5B圖，第5A圖係為印刷電路板在一般光學檢測下對具有異色缺陷現象之印刷電路板所擷取的影像資料；第5B圖係為印刷電路板在本發明實施例中之紅光及綠光搭配下對具有異色缺陷現象之印刷電路板所擷取的影像資料。Please refer to the 5A and 5B drawings at the same time. The 5A is the image data obtained by the printed circuit board on the printed circuit board with the phenomenon of the heterochromatic defect under the general optical inspection; the 5B is the printed circuit board in the present invention. In the embodiment, the red and green light are combined with the image data captured by the printed circuit board having the phenomenon of heterochromatic defects.
由第5A圖可知在一般的檢測下，縱然印刷電路板之導電接點上具有異色缺陷現象，卻是完全無法被檢知出來，一般的照射光如本案先前技術所述，皆是以一般的光源(包含各波段之波長)來進行接近垂直入射的照射與檢測。反觀第5B圖，其係以本案之配置方式以紅光及綠光兩種搭配下所擷取到之印刷電路板的影像資料，所述之綠光即由本案所稱之第二照射光產生裝置200所產生。如圖所示，印刷電路板之導電接點上的異色缺陷現象可被輕易地檢知出，無論是人工檢視，或是透過對電腦的特殊演算設定以對具有該等異色缺陷之特徵的影像資料得以被自動化檢出的方式，皆可達到缺陷現象的檢測，如此即將讓因防焊層上沾染有其他物質而造成顏色改變的狀況得以顯現在所擷取的影像資料中，而可被輕易地檢知出異色現象。It can be seen from Fig. 5A that under normal detection, even if there is a phenomenon of heterochromatic defects on the conductive contacts of the printed circuit board, it is completely undetectable. The general illumination light is as described in the prior art of the present case. The light source (including the wavelength of each band) is used for illumination and detection near normal incidence. In contrast, in Figure 5B, the image data of the printed circuit board captured by the combination of red light and green light is used in the configuration of the present case, and the green light is generated by the second illumination light referred to in the present case. The device 200 is produced. As shown in the figure, the phenomenon of heterochromatic defects on the conductive contacts of the printed circuit board can be easily detected, whether by manual inspection or by special calculations on the computer to image the features with such heterochromatic defects. The way in which the data can be automatically detected can achieve the detection of defects, so that the color change caused by other substances on the solder mask can be displayed in the captured image data, and can be easily The ground detected a different color phenomenon.
綜合上述，本案係可對已覆蓋防焊層的印刷電路板進行難以識別的缺陷現象檢測，進而提高所出產之印刷電路板的品質。In summary, the present invention can detect a defect phenomenon that is difficult to identify on a printed circuit board covered with a solder resist layer, thereby improving the quality of the printed circuit board produced.
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
S101~S105‧‧‧步驟S101~S105‧‧‧Steps
Claims (17)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102148360A TWI504886B (en) | 2013-12-26 | 2013-12-26 | Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same |
| CN201410014120.7A CN104749185A (en) | 2013-12-26 | 2014-01-13 | Method and apparatus for detecting defect phenomenon of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102148360A TWI504886B (en) | 2013-12-26 | 2013-12-26 | Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201525453A TW201525453A (en) | 2015-07-01 |
| TWI504886B true TWI504886B (en) | 2015-10-21 |
Family
ID=53589187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102148360A TWI504886B (en) | 2013-12-26 | 2013-12-26 | Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104749185A (en) |
| TW (1) | TWI504886B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118130504B (en) * | 2024-04-30 | 2024-07-16 | 深圳市联合多层线路板有限公司 | PCB printing quality detection method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW552413B (en) * | 2000-06-28 | 2003-09-11 | Teradyne Inc | Optical system |
| CN1510393A (en) * | 2002-12-16 | 2004-07-07 | Ckd株式会社 | Measuring devices |
| TW201105957A (en) * | 2009-03-24 | 2011-02-16 | Orbotech Ltd | Method and automated optical inspection system for scanning a surface with a number of different illumination configurations |
| TWI401430B (en) * | 2010-06-18 | 2013-07-11 | Machvision Inc | Method for inspecting defects of power layer and ground layer of pcb |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020190207A1 (en) * | 2000-09-20 | 2002-12-19 | Ady Levy | Methods and systems for determining a characteristic of micro defects on a specimen |
| JP3918579B2 (en) * | 2002-02-22 | 2007-05-23 | オムロン株式会社 | Surface observation device |
| JP2007240432A (en) * | 2006-03-10 | 2007-09-20 | Omron Corp | Defect inspection device and defect inspection method |
| KR100932549B1 (en) * | 2007-08-24 | 2009-12-17 | 주식회사 미르기술 | Inclination surface test method and inclination surface test apparatus for test workpiece of electron parts using the same |
| CN202471611U (en) * | 2012-03-19 | 2012-10-03 | 宏濑科技股份有限公司 | Optical detection system |
-
2013
- 2013-12-26 TW TW102148360A patent/TWI504886B/en active
-
2014
- 2014-01-13 CN CN201410014120.7A patent/CN104749185A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW552413B (en) * | 2000-06-28 | 2003-09-11 | Teradyne Inc | Optical system |
| CN1510393A (en) * | 2002-12-16 | 2004-07-07 | Ckd株式会社 | Measuring devices |
| TW201105957A (en) * | 2009-03-24 | 2011-02-16 | Orbotech Ltd | Method and automated optical inspection system for scanning a surface with a number of different illumination configurations |
| TWI401430B (en) * | 2010-06-18 | 2013-07-11 | Machvision Inc | Method for inspecting defects of power layer and ground layer of pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201525453A (en) | 2015-07-01 |
| CN104749185A (en) | 2015-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010217169A (en) | Visual inspection system of printed circuit board, and method of the same | |
| TW201527744A (en) | Test apparatus, test system and test method of defects in blind vias of printed circuit board | |
| US10739288B2 (en) | Apparatus and method for testing conductivity of graphene | |
| TWI502186B (en) | A bright spot detection device for filtering foreign matter noise and its method | |
| CN103391685B (en) | The method of a kind of PCB pattern shaping and automated optical detection equipment thereof | |
| JP5830229B2 (en) | Wafer defect inspection system | |
| JP5831425B2 (en) | Solar cell inspection equipment | |
| TWI504886B (en) | Inspection method of crack defects and heterochromatic of printed circuit board and inspection apparatus of the same | |
| TWM568454U (en) | Optical inspection apparatus | |
| JP2008039444A (en) | Method and apparatus for inspecting foreign matter | |
| JP2012247343A (en) | Defect inspection method of antireflection film and defect inspection apparatus | |
| JP2015132625A (en) | Foreign matter inspection device, and foreign matter inspection method | |
| JP6248819B2 (en) | Inspection apparatus and inspection method | |
| KR20140031687A (en) | A optical examination system and method of substrate surface | |
| JP2009122089A (en) | Apparatus and method for optically inspecting printed circuit board | |
| TWI779055B (en) | Damage inspection method of optical display panel | |
| EP2165312A1 (en) | Method for semiconductor substrate inspection | |
| JP5380223B2 (en) | Circular lens inspection apparatus and method | |
| KR20090115997A (en) | Method and apparatus for inspecting display panel | |
| CN111982929B (en) | Electronic component detection equipment and electronic component detection method | |
| JP2013053981A (en) | Device and method for inspecting defect of tft substrate | |
| JP2015129662A (en) | Visual inspection device and visual inspection method | |
| JP7511824B2 (en) | Apparatus and method for inspecting the appearance of electronic components | |
| JP2008145171A (en) | Method and device for inspecting lead frame | |
| JP2018112515A (en) | Panel inspection system |