JP5275851B2 - レーザー溶接方法 - Google Patents
レーザー溶接方法 Download PDFInfo
- Publication number
- JP5275851B2 JP5275851B2 JP2009050886A JP2009050886A JP5275851B2 JP 5275851 B2 JP5275851 B2 JP 5275851B2 JP 2009050886 A JP2009050886 A JP 2009050886A JP 2009050886 A JP2009050886 A JP 2009050886A JP 5275851 B2 JP5275851 B2 JP 5275851B2
- Authority
- JP
- Japan
- Prior art keywords
- welding
- thin
- laser
- thin film
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6666—Structural association with built-in electrical component with built-in electronic circuit with built-in overvoltage protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Laser Beam Processing (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (7)
- 互いに幅方向に間隔をおいて配列された複数の帯状の金属薄板の厚さ方向一方の面に、レーザー光の吸収率の高い有機物からなるフィルム状の薄膜を介してレーザー光を入射することにより、金属薄板の厚さ方向他方の面側に配置された溶接対象物と金属薄板とを溶接するレーザー溶接方法において、
前記各金属薄板に溶接位置から金属薄板の端部まで延びる長孔または溝を設け、
薄膜の溶接位置にレーザー光を入射して金属薄板と溶接対象物とを溶接する
ことを特徴とするレーザー溶接方法。 - 互いに幅方向に間隔をおいて配列された複数の帯状の金属薄板の厚さ方向一方の面に、レーザー光の吸収率の高い有機物からなるフィルム状の薄膜を介してレーザー光を入射することにより、金属薄板の厚さ方向他方の面側に配置された溶接対象物と金属薄板とを溶接するレーザー溶接方法において、
前記薄膜の各溶接位置の間に薄膜の厚さ方向に貫通する孔を設け、
薄膜の溶接位置にレーザー光を入射して金属薄板と溶接対象物とを溶接する
ことを特徴とするレーザー溶接方法。 - 前記薄膜として厚さ0.1mm以下のフィルム状部材を用いる
ことを特徴とする請求項1または2記載のレーザー溶接方法。 - 前記薄膜がレーザー光により炭化して黒色化することにより、薄膜のレーザー光の吸収率を高める
ことを特徴とする請求項1、2または3記載のレーザー溶接方法。 - 前記金属薄板が厚さ40μm以下、幅500μm以下の帯状に形成されている
ことを特徴とする請求項1、2、3または4記載のレーザー溶接方法。 - 前記金属薄板の厚さ方向一方の面に前記薄膜を一体に形成し、薄膜の溶接位置にレーザー光を入射して金属薄板と溶接対象物とを溶接する
ことを特徴とする請求項1、2、3、4または5記載のレーザー溶接方法。 - 前記各溶接位置のうち一部の溶接位置が他の溶接位置に対して金属薄板の長手方向にずれるように溶接する
ことを特徴とする請求項6記載のレーザー溶接方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009050886A JP5275851B2 (ja) | 2008-04-24 | 2009-03-04 | レーザー溶接方法 |
TW098110431A TW200944322A (en) | 2008-04-24 | 2009-03-30 | Laser welding method |
KR1020090032837A KR20090115659A (ko) | 2008-04-24 | 2009-04-15 | 레이저 용접방법 |
CN2009101370255A CN101564797B (zh) | 2008-04-24 | 2009-04-23 | 激光焊接方法 |
PT90057316T PT2112723E (pt) | 2008-04-24 | 2009-04-23 | Método de soldadura a laser |
EP09005731.6A EP2112723B1 (en) | 2008-04-24 | 2009-04-23 | Laser welding method |
US12/429,209 US20100224601A1 (en) | 2009-03-04 | 2009-04-24 | Laser welding method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009519682 | 2008-04-24 | ||
JP2009519682 | 2008-04-24 | ||
JP2009050886A JP5275851B2 (ja) | 2008-04-24 | 2009-03-04 | レーザー溶接方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010194605A JP2010194605A (ja) | 2010-09-09 |
JP5275851B2 true JP5275851B2 (ja) | 2013-08-28 |
Family
ID=40941452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009050886A Expired - Fee Related JP5275851B2 (ja) | 2008-04-24 | 2009-03-04 | レーザー溶接方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100224601A1 (ja) |
EP (1) | EP2112723B1 (ja) |
JP (1) | JP5275851B2 (ja) |
KR (1) | KR20090115659A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010272488A (ja) * | 2009-05-25 | 2010-12-02 | Littelfuse Inc | 小型コネクタに静電気保護部を組み込むこと |
JP5737412B2 (ja) * | 2011-09-15 | 2015-06-17 | 富士電機株式会社 | 半導体装置の製造方法およびその製造方法を用いて製造した半導体装置 |
US9592541B2 (en) | 2013-12-03 | 2017-03-14 | Siemens Energy, Inc. | Flux assisted laser removal of thermal barrier coating |
CN104570415B (zh) * | 2014-12-05 | 2017-07-18 | 合肥鑫晟光电科技有限公司 | 金属线的修复方法及修复设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233080A (ja) * | 1988-03-12 | 1989-09-18 | Shinko Kogyo Kk | レーザ彫刻方法 |
US4978835A (en) * | 1989-08-21 | 1990-12-18 | Microelectronics And Computer Technology Corporation | Method of clamping electrical contacts for laser bonding |
US5274210A (en) * | 1993-03-02 | 1993-12-28 | Digital Equipment Corporation | Laser bonding highly reflective surfaces |
JP2000246445A (ja) * | 1999-03-05 | 2000-09-12 | Toyota Auto Body Co Ltd | めっき鋼板の溶接方法 |
JP2001087877A (ja) * | 1999-09-20 | 2001-04-03 | Sony Corp | レーザ溶接方法 |
JP4409038B2 (ja) * | 2000-03-30 | 2010-02-03 | 富士重工業株式会社 | めっき鋼板の重ねレーザ溶接方法 |
JP3087532U (ja) * | 2001-08-01 | 2002-08-09 | 鴻海精密工業股▲ふん▼有限公司 | 電気コネクタ |
US6844522B1 (en) * | 2004-05-04 | 2005-01-18 | General Motors Corporation | Method of metallurgically bonding articles and article therefor |
JP4652778B2 (ja) * | 2004-11-12 | 2011-03-16 | イリソ電子工業株式会社 | 過電圧保護装置及びこれを用いたコネクタ |
JP4553306B2 (ja) * | 2004-11-18 | 2010-09-29 | イリソ電子工業株式会社 | コネクタ |
US7462065B1 (en) * | 2007-11-05 | 2008-12-09 | Hon Hai Precision Ind. Co., Ltd. | Method for terminating conductors of a cable to tail portion of contact terminals of ultra fine pitch connector |
-
2009
- 2009-03-04 JP JP2009050886A patent/JP5275851B2/ja not_active Expired - Fee Related
- 2009-04-15 KR KR1020090032837A patent/KR20090115659A/ko not_active Application Discontinuation
- 2009-04-23 EP EP09005731.6A patent/EP2112723B1/en not_active Not-in-force
- 2009-04-24 US US12/429,209 patent/US20100224601A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20100224601A1 (en) | 2010-09-09 |
KR20090115659A (ko) | 2009-11-05 |
EP2112723A2 (en) | 2009-10-28 |
JP2010194605A (ja) | 2010-09-09 |
EP2112723A3 (en) | 2013-04-17 |
EP2112723B1 (en) | 2014-04-16 |
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