TW200944322A - Laser welding method - Google Patents
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- TW200944322A TW200944322A TW098110431A TW98110431A TW200944322A TW 200944322 A TW200944322 A TW 200944322A TW 098110431 A TW098110431 A TW 098110431A TW 98110431 A TW98110431 A TW 98110431A TW 200944322 A TW200944322 A TW 200944322A
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200944322 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種例如太蕾 保護元件時使用的雷射焊接方法在取連接終袭過渡電麗 【先前技術】 物插入二Ά子機*器等所使用的連接器係具備可將連接對象 方之連接11核,及麵接1^咖相互之寬产 方向具間隔地配置複數個端子 .又 ❹ 内的連接縣齡做電性連接使各奸制插人連接器本體 及隹傳遞量的增A ’各種雖11件之高速化 渡電壓而導致電子零件被破壞的問題。 ㈣位化而使連接11等配線機器多極化,因此,為了 免過渡電_要安裝許多保護裝置。現狀是 因機器小'絲在迴路基板上構裝髓裝置之郎已變小。 因此’藉由在連接器安褒過渡電壓保護元件,而去掉在迴 =板安裝倾裝置的部效的綠。習知—種做為此過 k…壓保濩元件具備.連接接地(gr〇und)用端子之第一導電 部:連接於複數個信號線用端子的複數個第二導電部,以及介 於第-導電部與各第二導電部之間的可變電阻體,在連接各信 號線用端子的迴路產生過渡電壓時,藉由可變電阻體導通信號 線用鳊子與接地用端子,藉由接地用端子使過渡電壓對外部放 電(參閱例如日本特開2006-140344號公報)。 “但=,因連接器的小型化及多極化,許多信號線用端子多 半會被兩密度的排列’隨之過渡電壓保護元件的各第二導電部 亦有必要以寬度小之帶狀金屬薄板來形成。此細帶狀金屬薄 板’例如是使用YAG雷射焊接,為了確實的焊接而加大雷射 4 200944322 輸出%’寬度小之金屬薄板在焊接前會因雷射光而造成破壞或 缺損之問題。 因此’習知有-種雷射焊接方法,對金屬薄板厚度方向的 —邊的面藉由雷射級收率高的樹脂之薄膜射人雷射光,可利 用薄膜提高的雷射光吸收率,而不用加大雷射的輸出進行焊接 (参考例如日本特開2001-87877號公報)。 t _但?^對薄膜射入雷射光時,目雷射的熱而碳化的薄膜樹 脂會從薄膜與金屬薄板之間嘴出到鄰接的金屬薄板之間,各金 _ 屬薄板間的、纟巴緣電阻因碳化物而降低之問題點。 ⑩ 【發明内容】 ’’ 有鑑於前述問題點本發明提供一種雷射焊接方法,其目 的在於’對薄麟人雷射光時,雷射的熱所產生的碳化物^會 噴出到各金屬薄板之間。 ^為了達成前述目的,本發明為一種雷射焊接方法,係對著 彼此在寬度方向具間隔地排列的複數個帶狀金屬薄板之厚度 方向之-邊的面,隔著由雷射光的吸收率高的有機物組成的^ 片(film)狀薄膜射入雷射光,藉此來焊接金屬薄板厚度方向另 ❿ 邊的面侧所配置之焊接對象物與金屬薄板之雷射焊接方 法’其中在前述各金屬薄板設置由焊接位置至金屬薄板的端部 延長之長孔或溝’在薄膜的焊接位置射入雷射光來焊接金屬薄 板與焊接對象物。 藉此,雖雷射光射入部分之薄膜受到雷射熱能而碳化且 由焊接部分喷出碳化物’但碳化物會藉由金屬薄板的長孔或溝 從金屬薄板的端部向外部放出,所以碳化物不會喷出到鄰接金 屬薄板之間。 、 ’ 又,為了達成前述目的,本發明為一種雷射焊接方法,係 對者彼此在寬度方向具間隔地排列的複數個帶狀金屬薄板之 厚度方向之一邊的面,隔著由雷射光的吸收率高的有機物組成 5 200944322 2=膜射入雷射光,藉此來焊接金屬薄板厚度方向另- 接對象物與金屬薄板之雷射雜方法,其 接位置之間設置在薄板的厚度方向貫穿 象物。’、、焊接位置獻雷射絲焊接金屬驗與焊接對 焊接便光獻部分之_受顺賴能而碳化從 化物’碳化物仍經由薄膜的孔向外部放出,所 以石反化物不會喷到鄰接的金屬薄板之間。 ❹ ❿ 秘fii發明,雷射光射入薄膜時,因雷射的熱而產生的碳 【實施方式】 圖至第十關示本發明第—實施形態。同圖顯示的連 ίΐΐ:可將作為連接對象物的對方侧連接器(未顯示於圖) 本體1G、連接器本體1G内相互在寬度方向等間 &配置的複數個端子20、保持各端子20之保持部件3〇、及過 ^電,產生時使各端子20與連接器本體1〇導通之過渡電壓保 連接器本體10係由在前面側及背面側分別有開口 性金屬部件構成’其前_σ部形成對方側連接器插入口 施。連接器本體1G寬度方向的兩側有向下方延長之前後 ^接地連接部1卜各自組裝為—體’各接地連接部u連接於 未顯示於®之迴路基板之接地部。又,連接器本體ω的背面 侧的寬度方向兩端分別設置有與過渡電壓保護元 突部12。 义各端子20係由前後方向延長之導電性金屬部件組成,其 前端侧形成與對方侧連接器之端子接觸之接觸部21。各端子、 2〇後端側設有朝下方屈曲之垂直部22、以及垂直部22下端至 6 200944322 後方延長之基板連接部22,基板連接部22 之迴路基板的信號專用導電部。 連接於未顯不於圖 $部件3G由合成樹脂等的絕緣性部件組成, 1〇内。保持部件30設妓板狀延長到前方之端子t ^3。1 ’於端子支撑部31之下面侧配置有各端子2。的接觸支 A板ί渡其電^^元件4〇具備:作為橫長狀之膠片狀部件的 土板41,基板41刖面所形成的第一導 ❹ ❿ =之複數個第二導電部43 ;介於第一“部 覆部件間的可變電阻體44 ;以及被覆可變電阻體44之被 基板41係以雷射光吸收率高的有機物(例如,聚酿 0 y^e,PI)等合成樹脂)所構成,其厚度形成為咖以 二土板41之寬度方向兩端設有缺口部4U,缺口部仙盘 連接器本體10之突部12卡合。 /、 、第一導電部42係由形成於基板41 -邊之面且厚度4〇 以下的金屬薄板所形成,從基板41的寬度方向(長度方向 兩端侧至上端侧以長度方向延長而連續形成。 各第二導電部43係與第-導電部42囉,由基板4卜 邊之面卿成的厚度40师以下的金屬薄板組成,設置於 41除了寬度方向兩端側及上侧以外之下端侧且相互在寬度 方向上有間隔。各第二導電部43係形成為於上下方向延長^ 帶狀,其寬度Η為500叫以下。各第二導電部43的上端與第 -導電部42之間分卿成有4〇μιη以下的間隙4如,各間隙 43a沿著基板41的長度方向配置於一直線上。又,各第二導 電部43分別言免置有沿著上下方向延伸的長孔43b,各長孔伽 的下端側是對於第二導電部犯的下端開放而形成。各長孔视 之上端的位置是對於第二導電部43的長度方向各隔一個而上 7 200944322 下偏移來形成,各長孔43b的上端位置成為於後述之焊接位 置。即是,各第二導電部43交互設置有,於上下方向長的長 孔43b與紐的長孔43b,各長孔43b是和第一及第二導電部 42,43 —起利用蝕刻而形成。 可變電阻體44係由例如使用非線性電阻材料之周知素 材所形成,其性質為在過渡電壓沒有產生時會有高電性電阻, 而過渡電壓產生時會活性化而立刻變為電性電阻低的材料。 又,若是具有同樣的性質,也可使用其他種類的材料。可變電 ,體44係以覆蓋各第二導電部43的間隙43a之方式形成為二 著基板41的長度方向延伸的一直線狀,如第二圖所示連各間 隙43a内都被充填。此場合,可變電阻體44係將液狀的原材 料塗布或是印刷於基板41並予以硬化,而形成為沿著基板41 的長度方向延伸的一直線狀。 被覆部件45係以胺甲酸乙酯(urethane)等的絕緣性部件所 組成’以被覆可變電阻體44之方式形成為沿著基板41的長度 方向延伸的一直線狀。 如上述構成之過渡電壓保護元件40係配置於連接器本體 Q 10的背面侧,以習知的YAG雷射焊接而與各端子20 &垂直 部22及連接器本體1〇的後端面接合而安裝於連接器。即,安 裴於過渡電壓保護元件40時,如第六圖所顯示將過渡電壓保 護元件40以基板41為背面側配置於連接器本體1〇的背面 侧,並且如第七圖所顯示基板41的各缺口部41a個別卡合連 接器本體10的各突部12。藉此,過渡電壓保護元件4〇的各 第二導電部43會配置成與各端子2〇的垂直部22個別對應。 其火’如第八圖所顯不將波長l〇64nm的YAG雷射光 (L) ’對著第二導電部43的厚度方向一邊的面(背面侧)從基板 41侧以規定的脈波寬度及規定的輪出照射。藉此,基板41的 雷射光的射入部分的樹脂因雷射的熱能而碳化,如第九圖所顯 200944322200944322 VI. Description of the Invention: [Technical Field] The present invention relates to a laser welding method used in, for example, a Tailei protection element, in connection with a final connection, a prior art, a prior art, a second insertion device The connector used in the system is provided with 11 cores for connection to the connection object, and a plurality of terminals are arranged at intervals in the direction in which the surface is connected to each other. Increased transmission capacity of the connector body and the increase in the amount of AA 'The various high-speed voltages of 11 pieces cause the electronic components to be destroyed. (4) Positioning causes the wiring machine such as the connection 11 to be multi-polarized. Therefore, in order to avoid the transitional electricity, many protection devices are installed. The current situation is that the small machine wire has been made smaller on the circuit substrate. Therefore, by replacing the voltage protection element in the connector, the green of the part of the board is installed. The first conductive portion of the terminal for connecting the grounding (gr〇und) is connected to the plurality of second conductive portions connected to the plurality of signal line terminals, and When the varistor body between the first conductive portion and each of the second conductive portions generates a transient voltage in a circuit connecting the terminals for the signal lines, the varistor turns on the signal line for the dice and the ground terminal. The transition voltage is externally discharged by the grounding terminal (see, for example, Japanese Laid-Open Patent Publication No. 2006-140344). "But =, due to the miniaturization and multi-polarization of the connector, many of the signal line terminals will be arranged in two densities." With the second conductive portion of the transition voltage protection element, it is also necessary to use a strip-shaped metal sheet with a small width. The thin strip-shaped metal sheet is formed by, for example, YAG laser welding, and the laser is increased for the purpose of soldering. 200944322 The metal sheet with a small %' width is damaged or defective due to laser light before soldering. Therefore, it is known that there is a laser welding method in which the surface of the thickness direction of the thin metal plate is irradiated with laser light by a film of a resin having a high laser-rate yield, and the laser light absorption rate of the film can be improved. It is not necessary to increase the output of the laser for soldering (refer to, for example, Japanese Laid-Open Patent Publication No. 2001-87877). t _ _ ^ When the film is incident on the laser light, the hot and carbonized film resin of the laser is removed from the film. The gap between the metal sheets is between the adjacent metal sheets, and the gap between the gold sheets and the strips is reduced by carbides. 10 [Invention] In view of the above problems A laser welding method is provided, the purpose of which is that when a thin laser is irradiated, the carbide generated by the heat of the laser is ejected between the metal sheets. ^ In order to achieve the foregoing object, the present invention is a mine. The radiation-welding method is a film-like surface composed of an organic material having a high absorptivity of laser light across a surface of a plurality of strip-shaped metal sheets which are arranged at intervals in the width direction. The film is irradiated with laser light, thereby soldering a laser welding method of a welding object and a metal thin plate disposed on the other side of the thickness direction of the thin metal plate, wherein the respective metal thin plates are disposed from the welding position to the end of the metal thin plate The elongated hole or groove' is irradiated with laser light at the welding position of the film to weld the metal thin plate and the object to be welded. Thereby, the film of the laser light incident portion is carbonized by the laser heat energy and is carbonized by the welded portion. "The carbide will be released from the end of the metal sheet to the outside by the long hole or groove of the thin metal plate, so the carbide will not be ejected between the adjacent metal sheets." Moreover, in order to achieve the above object, the present invention is a laser welding method in which the surface of one of the plurality of strip-shaped metal sheets arranged in the width direction is spaced apart from each other in the thickness direction, and the absorption rate by the laser light is interposed. High organic composition 5 200944322 2=The film is irradiated with laser light, thereby welding the thickness direction of the metal thin plate and the laser hybrid method of the object and the metal thin plate, and the connection position is arranged between the thickness direction of the thin plate through the object ',, the welding position of the laser welding metal test and the welding to the welding light part of the _ by the cycling energy and carbonization of the 'carbide is still released to the outside through the hole of the film, so the stone reaction will not spray Between the adjacent metal sheets. ❹ 秘 Secret fii invention, carbon generated by laser heat when laser light is incident on the film [Embodiment] The tenth embodiment shows the first embodiment of the present invention. The connection shown in the figure is the same as that of the other side connector (not shown) in the main body 1G and the connector main body 1G. The holding member of the holding member 3, and the electric power is generated, and the transition voltage of the terminal 20 and the connector body 1 is electrically connected to each other. The connector body 10 is formed of an open metal member on the front side and the back side, respectively. The front _σ portion forms a counterpart connector insertion port. The both sides of the connector body 1G in the width direction are extended downward. The ground connection portions 1 are assembled into a body. The ground connection portions u are connected to the ground portion of the circuit substrate not shown in the ®. Further, the transition body voltage protection projections 12 are provided at both ends in the width direction of the back side of the connector body ω. Each of the terminals 20 is composed of a conductive metal member elongated in the front-rear direction, and a contact portion 21 that comes into contact with the terminal of the counterpart connector is formed on the distal end side. Each of the terminals and the rear end side of the second side is provided with a vertical portion 22 which is bent downward, and a board connecting portion 22 which is extended from the lower end of the vertical portion 22 to the rear of the 200944322, and a signal-dedicated conductive portion of the circuit board of the substrate connecting portion 22. The connection is not shown in the figure. The component 3G is composed of an insulating member such as a synthetic resin. The holding member 30 is provided with a terminal t^3 which is extended to the front in a see-saw shape. 1' Each terminal 2 is disposed on the lower surface side of the terminal support portion 31. The contact plate A has an earth plate 41 as a horizontally long film-like member, and a first guide 形成 formed by the face of the substrate 41 = a plurality of second conductive portions 43 The variable resistor 44 interposed between the first "components" and the substrate 41 covered with the varistor 44 are organic substances having a high laser light absorption rate (for example, poly-bright y^e, PI) The synthetic resin is formed so as to have a notch portion 4U at both ends in the width direction of the two earth plates 41, and the protrusions 12 of the notch portion of the panel connector body 10 are engaged with each other. /, The first conductive portion 42 It is formed of a thin metal plate having a thickness of 4 Å or less formed on the surface of the substrate 41 side, and is continuously formed in the longitudinal direction from the both end sides to the upper end side in the longitudinal direction of the substrate 41. The second conductive portions 43 are formed continuously. And the first conductive portion 42A, which is composed of a thin metal plate having a thickness of 40 or less, which is formed by the surface of the substrate 4, and is disposed on the lower end side of the end face and the upper side in the width direction, and is in the width direction. Each of the second conductive portions 43 is formed to extend in the up and down direction, and has a width The upper end of each of the second conductive portions 43 and the first conductive portion 42 are separated by a gap 4 of 4 μm or less. For example, the gaps 43a are arranged on the straight line along the longitudinal direction of the substrate 41. Further, each of the second conductive portions 43 is provided with a long hole 43b extending in the vertical direction, and the lower end side of each long hole is formed to be open to the lower end of the second conductive portion. The position is formed by shifting the length of the second conductive portion 43 one by one and the upper portion 7 200944322, and the upper end position of each long hole 43b is a welding position to be described later. That is, each of the second conductive portions 43 is alternately provided. The long holes 43b long in the up-and-down direction and the long holes 43b of the new ones are formed by etching together with the first and second conductive portions 42, 43. The variable resistor 44 is made of, for example, nonlinear It is formed of a known material of a resistive material, and has a property of high electrical resistance when a transient voltage is not generated, and a material which is activated when a transient voltage is generated and immediately becomes a low electrical resistance. Further, if it has the same property , you can also use other The material of the type is variable, and the body 44 is formed in a line shape extending in the longitudinal direction of the substrate 41 so as to cover the gap 43a of each of the second conductive portions 43, as shown in the second figure, even in the respective gaps 43a. In this case, the variable resistor 44 is formed by coating or printing a liquid material on the substrate 41 and curing it, and forming a linear shape extending along the longitudinal direction of the substrate 41. The coated member 45 is made of a uric acid. The insulating member such as urethane is formed so as to cover the varistor 44 so as to extend in the longitudinal direction of the substrate 41. The transient voltage protection element 40 having the above configuration is disposed in the connector. The back side of the main body Q 10 is joined to the rear end faces of the respective terminals 20 & the vertical portion 22 and the connector body 1 by conventional YAG laser welding, and is attached to the connector. That is, when the transition voltage protection element 40 is mounted, as shown in FIG. 6, the transition voltage protection element 40 is disposed on the back side of the connector body 1A with the substrate 41 as the back side, and the substrate 41 as shown in the seventh figure. Each of the notch portions 41a is individually engaged with each of the projections 12 of the connector body 10. Thereby, each of the second conductive portions 43 of the transient voltage protection element 4A is disposed to individually correspond to the vertical portion 22 of each terminal 2A. As shown in the eighth diagram, the YAG laser light (L) of the wavelength l〇64 nm is not perpendicular to the surface (back side) of the second conductive portion 43 in the thickness direction from the substrate 41 side with a predetermined pulse width. And prescribed rounds of exposure. Thereby, the resin of the incident portion of the laser light of the substrate 41 is carbonized by the thermal energy of the laser, as shown in the ninth figure.
化而黑色化的黑色部B被形成。此場合,因里色邻B ;屬=急速缝。其次,如第十圖所顯4^ 貝牙第一¥電部43的金屬薄板達到端子%的 t由_部w使第二導電部43的金屬薄板與配置於 ❹ 部τϋ4?厚ΐ方向另一邊的面(前面側〉的端子2〇的垂直 I 知接。此場合,如第五圖所顯示焊接部w係第二導雷 ^ 43的長度方向各隔一個而上下偏移來將各第二導電部犯 焊接於各端子20 ’藉此將各焊鮮w形成於第二導電° 的各長孔43b的上端位置。此時,當雷射光的射入部分 口田射的熱能而碳化時,碳化物會從焊接部分噴出,但如第 圖的實線箭頭所顯示碳化物會藉由長孔Μ從第二導電部衫 的下端放出到基板41的外部,所以碳化物不會喷 二導電部43之間。又,對著對應連接器本體1()的寬 侧之第一導電部42的厚度方向一邊的面(背面側)從基 14^侧 照射雷射光’藉此與前朗獅焊接第—導電部42 本體10的後端面。 /、 ° 〇 在安裝有前述過渡電壓保護元件40之連接器中,將各端 =20的基板連接部^及各接地連接部㈣焊接於未顯示於 圖的迴路基板,因此,各端子2〇連接於迴路基板的迴路圖案, 各接地連接部11連接於迴路基板的接地部。又,在 體10的插入口 l〇a插入未顯示於圖之對方侧連接器因1,The black portion B that is blackened is formed. In this case, because of the color of the neighboring B; genus = rapid seam. Next, as shown in the tenth figure, the metal thin plate of the first electric power unit 43 reaches the terminal % t, and the metal thin plate of the second conductive portion 43 is disposed in the direction of the ϋ τ ϋ 4 The vertical direction I of the terminal 2〇 on the one side (front side) is known. In this case, as shown in the fifth figure, the welded portion w is the second guide rail 43. The two conductive portions are soldered to the respective terminals 20', whereby the respective soldering w is formed at the upper end position of each of the long holes 43b of the second conductive portion. At this time, when the incident portion of the laser light is carbonized by the heat energy generated by the field, The carbide will be ejected from the welded portion, but as shown by the solid arrow in the figure, the carbide will be discharged from the lower end of the second conductive portion to the outside of the substrate 41 by the long hole, so that the carbide does not spray the second conductive portion. Further, the surface (back side) of one side in the thickness direction of the first conductive portion 42 corresponding to the wide side of the connector body 1 () is irradiated with laser light from the side of the base 14 side, thereby soldering with the former Langshi The first end surface of the main body 10 of the first conductive portion 42. /, ° 安装 is mounted with the aforementioned transient voltage protection element 40 In the connector, the substrate connection portion and the ground connection portion (4) of each terminal=20 are soldered to the circuit substrate not shown in the drawing. Therefore, the terminals 2 are connected to the circuit pattern of the circuit board, and the ground connection portions 11 are connected. In the grounding portion of the circuit board, the insertion port l〇a of the body 10 is inserted into the connector of the other side not shown in the figure,
各端子20的接觸部21會接觸對方侧連接器的端子,盘 連接器電性的連接。 〃 J 、、在此,在前述連接器中,當對方側連接器侧產生靜電等的 過渡電壓時,產生過渡電壓之信號線的端子2〇與連接器本體 10之間藉由過渡電壓保護元件40導通,迴路基板侧的迴路受 到保護而避開過渡電壓。即是,對方側連接器的某處信號線產 200944322 t渡妗:可變電阻體44立刻變化為低電性電阻材料。 由連接^本㈣的各接地連接部“== $地側。此場合,可變電阻體44的龍依存㈣隙祝的 43 實施雜,如金㈣她合的各第二導電部 對著又第二導電部43的端部延長之長孔43b, ί::各端子20,使雷射光射入部分的樹=: 二分會喷出碳化物,即使如此,仍可使碳化 孔43b從第二導電部43的下端向外 。隨出。藉此’碳化物不會喷出到鄰接之第二導電部43之間, Z有效的防止因碳化物使各第二導電部43間的絕緣電阻之降 ❹ 此場合,對著第二導電部43,隔著由 ^機物所組成的厚度G.lmm以下的基板人光Ί H光的魏_絲41 w,_购=長所以 輸出’也可以確實烊接,不必提高雷射的 曰ί 導電部43之寬度小的金屬薄板也可不破 浐電餅1對^各端子20高密度排列之小型連接器用的過 渡電壓保,件40絲於連接鱗是極為有利的。 # H由有機物所組成的基板41由雷射光而碳化成黑色 L田ϊ 的雷射光的吸收率,可謀求生產性的提高, 不用再另外施行提高吸收率的處理。 以·^,第*二導電部43的厚度形成為4〇卿以下、寬度5〇_ ^ $,吏用波長1064nm的YAG雷射之通常的焊接方法會 谷易產生金屬薄板的破壞,在本實施形態的焊接方法,對於 接此尺寸的金屬薄板是極為有利的。 、 200944322 又’將作為金屬薄板的第二導電部43 件的基板41形成為—體,從基板“侧射 光烊接所= 優點是能以保持各第二導電部43之基板 收率,基板41以外不必再追加膠片狀部件认_射先的吸 又’在基板41朝寬度方向排列複數個 置中-部分的焊接== ,接位置朝第二導電部43的長度方向偏移。所以,: V電部43在寬度方向接近時,也可加 ❿ φ 在各第二導電部43高密度的場合也可容易 便有些碳化物噴出到鄰接之第二導電部43之間,因焊接^ ί = 43的長度方向偏移’故*會從相互鄰接之第 極為有_。又,因焊接位置向各第= 電4 43的長度方向偏移,所以相較於將焊接位置配置為 的場合’對於基板41 _離防止是有效的。 ’、、、 第十-圖至第十三圖顯示本發明 實施形態同等的構成部分使用相_符號來顯示。〜J 第-實施形細摊纟金屬帛她 =二導電部43在厚度方向貫穿的長孔43b 中,代替第-實施形態的長孔视,在第二導電部幻 將第二導電部43在厚度方向不貫穿之溝攸, 且溝43c你接位置延伸至第二導電部43的端部。 φ立可將從焊接部分嘴出的碳化物藉由溝43c從第二導 H 向外部放出’所以與第一實施形態同樣,鄰接 不會有礙化物喷出,可以有效的防止因 石反化,導致的各第二導電部43之間的絕緣電阻的降低。 至針六_林發_第三實施雜,所 第一實施形朗等的構成部分以相同的符號來顯示。 200944322 在本實施形態中,代替第一實施形態的長孔杨,在基板 41(薄膜)的焊接位置之間設置將_41在厚度方向貫穿之縱 長的孔43d,對著基板41的各谭接位置射入雷射光,將各第 二導電部43分別焊接於各端子2〇。 藉此,如第十六圖的實線箭頭所示,可將從焊接部分的基 板41與第二導電部43之間喷出的碳化物從基板41的孔43d 朝外部放A,所轉第-實鬚彡態囉,碳化物不會喷到鄰接 之第二導電部43之間,可財效的社因碳錄導致的各第 一導電部43間的絕緣電阻的降低。 又’在前述各實施形態顯示與對方側連接器連接之連接器, 也可以為例如連接撓性印刷迴路(FPC : Flexibleprintedwiri%The contact portion 21 of each terminal 20 contacts the terminal of the counterpart connector, and the disk connector is electrically connected. In the above connector, when a transient voltage such as static electricity is generated on the connector side of the partner side, a transition voltage protection element is provided between the terminal 2A of the signal line for generating the transient voltage and the connector body 10. 40 is turned on, and the circuit on the circuit substrate side is protected from the transition voltage. That is, the signal line of the other side connector is generated. 200944322 t: The variable resistor body 44 is immediately changed to a low-resistance material. The grounding connection portion of the connection (4) is "==$ ground side. In this case, the dragon-dependent (four) gap of the variable resistor body 44 is implemented, such as gold (four), the second conductive portion of her combination is opposite The long hole 43b of the second conductive portion 43 is elongated, and the terminal 20 is such that the laser light enters the portion of the tree =: the binary portion emits carbide, and even then, the carbonized hole 43b can be made from the second The lower end of the conductive portion 43 is outwardly directed. Thereby, the carbide is not ejected between the adjacent second conductive portions 43, and Z effectively prevents the insulation resistance between the second conductive portions 43 due to the carbide. In this case, the second conductive portion 43 is separated by a thickness of G.lmm or less of the substrate, which is composed of a thickness of G.lmm or less. It is not necessary to increase the thickness of the laser. The thin metal plate with a small width of the conductive portion 43 can also be used for the transition voltage of the small connector of the high-density arrangement of the terminals 20, and the member 40 is connected to the scale. It is extremely advantageous. # H Absorption rate of laser light which is composed of organic matter and is carbonized into black L field by laser light. In order to improve the productivity, it is not necessary to additionally perform the treatment for increasing the absorption rate. The thickness of the second conductive portion 43 is 4 〇 〇, width 5 〇 _ ^ $, and YAG having a wavelength of 1064 nm is used. The usual soldering method of the laser may cause damage to the thin metal plate, and the soldering method of the present embodiment is extremely advantageous for the metal thin plate of this size. 200944322 Further, the second conductive portion 43 will be used as the metal thin plate. The substrate 41 of the device is formed as a body, and the side of the substrate is optically spliced. The advantage is that the substrate yield of each of the second conductive portions 43 can be maintained, and it is not necessary to add a film-like member to the substrate 41. 'When the substrate 41 is aligned in the width direction, a plurality of centering-parts are welded ==, and the bonding position is shifted toward the longitudinal direction of the second conductive portion 43. Therefore, when the V electrical portion 43 approaches in the width direction, φ can be added. When the second conductive portion 43 has a high density, it is easy to discharge some carbide between the adjacent second conductive portions 43 due to soldering. ^ ί = 43 is offset in the length direction 'so * will be _ from the first adjacent to each other. Further, since the welding position is shifted in the longitudinal direction of each of the electric wires 4 43 , it is effective for preventing the substrate 41 from being separated from the case where the welding position is disposed. The tenth to thirteenthth drawings show the components of the embodiment of the present invention which are equivalent to each other and are displayed using phase symbols. In the long hole 43b through which the second conductive portion 43 penetrates in the thickness direction, instead of the long hole view of the first embodiment, the second conductive portion 43 is slid in the second conductive portion. The groove is not penetrated in the thickness direction, and the groove 43c extends to the end of the second conductive portion 43. The φ 立 can release the carbide from the nozzle of the welded portion from the second guide H to the outside through the groove 43c. Therefore, similarly to the first embodiment, the adjacent product is prevented from being ejected, and the stone reversal can be effectively prevented. The resulting decrease in insulation resistance between the respective second conductive portions 43. The components of the first embodiment, such as the first embodiment, are shown by the same reference numerals. In the present embodiment, instead of the long hole yang of the first embodiment, a vertically long hole 43d through which the _41 penetrates in the thickness direction is provided between the welding positions of the substrate 41 (film), and each of the substrates 41 is opposed to each other. The laser beam is incident on the contact position, and each of the second conductive portions 43 is soldered to each of the terminals 2A. Thereby, as shown by the solid arrows in FIG. 16, the carbide ejected from between the substrate 41 of the welded portion and the second conductive portion 43 can be released from the hole 43d of the substrate 41 to the outside. - In the case of a solid state, the carbide is not sprayed between the adjacent second conductive portions 43, and the insulation resistance between the first conductive portions 43 due to carbon recording can be reduced. Further, in the above embodiments, the connector connected to the counterpart connector may be connected to a flexible printed circuit (FPC: Flexible Printed Wiri%).
Board)或可$性扁平纜線(FFC : Flexible卿Cable)等之連接器。 又,在前述各實施形態,顯示了安裝過渡電壓保護元件 4〇於連接器的焊接方法,若是金屬薄板的焊接,本發明可使 用於其他用途之各種的焊接。此場合,可以不使用如前述實施 形態作為膠片狀部件的基板41,而使用例如在金屬薄板的 接處塗布黑色塗料來形成薄膜。Board) or a connector such as a flat cable (FFC: Flexible). Further, in each of the above embodiments, the welding method of attaching the transient voltage protection element 4 to the connector is shown. If the metal thin plate is welded, the present invention can be used for various types of welding for other purposes. In this case, it is possible to form a film by applying a black paint to the joint of the thin metal plate, for example, without using the substrate 41 as the film-like member as in the above embodiment.
【圖式簡單說明】 第一圖係顯示依據本發明的焊接方法將過渡電壓保護元 件安裝於連接器的第一實施形態之前視圖。 3 第一圖係過渡電壓保護元件的側面剖面圖。 第三圖係過渡電壓保護元件的分解立體圖。 第四圖係具備過渡電壓保護元件之連接器的侧面剖面 圖。 ° 係顯示過渡電壓保護元件之安裝程序之連接器的 圖。 ' 第五圖係具備過渡電壓保護元件之連接器的後視圖。 第六圖 正面側立體 第七圖係顯示過渡電壓保護元件之安裝程序之連接器的 12 200944322 背面側立體圖。 面囷第八圖係顯示本發明的焊接程序連接器的重要部側面剖 第九圖係|員示本發明的焊接程序之連接器的重要部 sit n y 剖面圖 器的明的第二實施形態之焊接程序之連接BRIEF DESCRIPTION OF THE DRAWINGS The first drawing shows a front view of a first embodiment in which a transient voltage protection element is mounted to a connector in accordance with the welding method of the present invention. 3 The first figure is a side cross-sectional view of the transition voltage protection component. The third figure is an exploded perspective view of the transition voltage protection component. The fourth figure is a side cross-sectional view of a connector with a transitional voltage protection element. ° A diagram showing the connector of the installation procedure for the transition voltage protection component. 'The fifth picture is a rear view of the connector with the transition voltage protection element. Figure 6 Front side perspective The seventh diagram shows the connector for the installation procedure of the transition voltage protection component. 12 200944322 Rear side perspective view. The eighth embodiment shows the important part of the welding program connector of the present invention, and the ninth embodiment of the connector of the welding program of the present invention is shown in the second embodiment of the main part of the connector of the welding program of the present invention. Welding procedure connection
第十—圖係顯示本發明的焊接程序之連接器的重要部 面剖面圖。 JTenth is a cross-sectional view showing an important part of the connector of the welding procedure of the present invention. J
面剖、顯示本發明触序之連接11的重要部側 面剖㈣、顯示本剌的焊接程序之输11的重要部側The cross section of the important portion of the connection 11 of the present invention is shown in section (4), and the important portion of the transmission 11 of the welding procedure of the present invention is shown.
元件靖雜據本發明的焊接方法㈣渡電壓保護 兀件女裝於連接器的第二實施形態之後視圖。 I 2十五圖係過渡電壓保護元件的侧面剖面圖。 第十六圖係過渡電壓保護元件的要部後視圖。 【主要元件符號說明】 10 連接器本體 l〇a連接器插入口 11 接地連接部 20 端子 21 接觸部 22 垂直部 3〇 保持部件 31 端子支撐部 40 過渡電壓保護元件 13 200944322 41 基板 41a缺口部 42 第一導電部 43 第二導電部 43a間隙 43b長孔 43c溝 43d長孔 44 可變電阻體 ❹ 45 被覆部件The welding method according to the present invention (4) The voltage protection of the second embodiment of the connector. I 2 Fifteen is a side cross-sectional view of a transition voltage protection element. Figure 16 is a rear view of the main part of the transition voltage protection component. [Description of main component symbols] 10 Connector body l〇a connector insertion port 11 Ground connection portion 20 Terminal 21 Contact portion 22 Vertical portion 3〇 Holding member 31 Terminal support portion 40 Transition voltage protection element 13 200944322 41 Substrate 41a notch 42 First conductive portion 43 second conductive portion 43a gap 43b long hole 43c groove 43d long hole 44 variable resistor body 被 45 coated member
Claims (1)
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Application Number | Priority Date | Filing Date | Title |
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PCT/JP2008/057963 WO2009130779A1 (en) | 2008-04-24 | 2008-04-24 | Laser welding method |
JP2009050886A JP5275851B2 (en) | 2008-04-24 | 2009-03-04 | Laser welding method |
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Publication Number | Publication Date |
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TW200944322A true TW200944322A (en) | 2009-11-01 |
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ID=44869286
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Application Number | Title | Priority Date | Filing Date |
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TW098110431A TW200944322A (en) | 2008-04-24 | 2009-03-30 | Laser welding method |
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PT (1) | PT2112723E (en) |
TW (1) | TW200944322A (en) |
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