KR100495130B1 - Method of manufacturing surface mountable electrical device for printed circuit board using heat welding and surface mountable electrical device made by the method - Google Patents

Abstract

A method of manufacturing a surface mounted electric device for a printed circuit board, in which upper and lower electrodes are connected to each other by thermal fusion, includes: (a) a first and a second surface, wherein a first conductive layer is formed on the first surface; Providing a thin sheet resistance sheet having a second conductive layer formed on the second surface thereof; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) cutting the sheet resistance sheet along the heat seal portion; And (e) dividing the sheet resistance sheet to form a plurality of electrical devices.

Description

Method for manufacturing surface-mounted electrical device for printed circuit board using heat fusion and surface-mounted electric device manufactured by the same

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a surface mount type electric device for a printed circuit board, and more particularly, to a surface mount type electric device for a printed circuit board in which upper and lower electrodes are connected to each other by thermal fusion, and a manufacturing method thereof.

In general, a so-called positive temperature coefficient (PTC) material composed of a mixture of a crystalline polymer resin and a conductive material has a wide range of application. At low temperatures, such as room temperature, PTC materials have a low resistance to pass current, but when the ambient temperature rises or the material temperature rises due to overcurrent, the resistance increases by 10 ³ to 10 ⁴ times or more, which blocks the current. Have

The PTC material is connected to a metal electrode and can be applied to various types of electric devices, and is mainly used for overcurrent blocking and circuit protection in an electric circuit. Such a PTC device is mainly mounted on a printed circuit board (PCB), which is subject to a lot of shape constraints by the components of the PCB board. In recent years, as the circuit design has been highly integrated, the demand for light and thin reduction of board mounted components has increased. To this end, many techniques for PTC devices have been proposed.

As a manufacturing technique related to a PTC device, for example, U.S. Pat. Nos. 6,124,781, 6,157,289, 6,172,591, 6,188,308, 6,211,771, 6,223,423, 6,242,997, 6,292,088, 6,297,722, 6,348,851, 6,377,6,3,6,3,6,3,8,380,393 have.

Most of these manufacturing process technologies are based on a printed circuit board processing technology, and are distinguished from each other according to a method of connecting upper and lower electrodes of a basic device having PTC characteristics. Some of the representative patents listed above are described below.

First, U.S. Patent Nos. 5,831,510 and 5,852,397 connect a top and bottom electrode by drilling a hole in a plate-shaped PTC device in which metal foil is bonded to both sides of a PTC material, and copper plating the entire surface of the PTC device including the inside of the hole. And then etch the electrode near the aperture to separate it into an anode. This process is borrowed from the general board manufacturing process in the printed circuit board field.

U.S. Patent No. 5,884,391 is configured to form long slits instead of holes in the PTC element sheet, and to connect the upper and lower electrodes by copper plating the entire surface of the sheet including the cross section of the slits. In addition, the copper plated upper and lower electrodes are separated from each other by etching, and after solder resist is applied, both ends have a shape surrounded by solder plating.

U.S. Pat.Nos. 5,699,607 and 5,900,800 show a long slit on a PTC sheet, apply solder plating to the front surface of the sheet including the slit cross section, and then give a gap to the upper and lower portions to expose the electrode surface. Copper plating surrounds both ends. This method eliminates a portion of the first solder plating applied without etching the electrodes so that the copper plated on them can contact the electrodes, so that the upper and lower electrodes are not connected through the inner or slit surface of the hole so that each electrode is effective. It is characterized by an increased area.

These conventional PTC devices have some differences from each other, but they have in common that a new conductive layer must be added to connect the electrodes formed on the upper and lower surfaces of the PTC element to each other. This conductive layer does not substantially improve PTC properties, and sometimes the effective area is reduced in the process of forming the conductive layer. In addition, there is a disadvantage that the time and cost burden increases in the process of adding the conductive layer.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a method of manufacturing a surface mounted electric device for a printed circuit board, which can simplify the process by connecting the upper and lower electrodes of the PTC element by thermal fusion. There is this.

It is still another object of the present invention to provide a surface mount electric device for a printed circuit board manufactured by the above-described method.

In order to achieve the above object, a method of manufacturing a surface mounted electric device for a printed circuit board using thermal welding according to the present invention includes (a) a first and a second surface, and a first conductive layer on the first surface. Providing a thin sheet resistance sheet having a second conductive layer formed thereon and having a second conductive layer formed thereon; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) applying first and second insulating layers to portions of the first and second conductive layers together with the nonconductive gaps; (e) plating solder on regions where the first and second insulating layers are not applied; (f) cutting the sheet resistance sheet along the heat seal portion; And (g) dividing the sheet resistance sheet to create a plurality of electrical devices.

According to another aspect of the invention, (a) providing a sheet resistance sheet having a first and a second surface, the first surface is formed with a first conductive layer and the second surface is formed with a second conductive layer step; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) applying first and second insulating layers to portions of the first and second conductive layers together with the nonconductive gaps; (e) cutting the sheet resistance sheet along the heat seal portion; (f) plating solder on regions to which the first and second insulating layers are not applied; And (g) dividing the sheet resistance sheet to form a plurality of electrical devices, thereby providing a method of manufacturing a surface mounted electric device for a printed circuit board using thermal welding.

Preferably, in the heat fusion process of step (b), the sheet resistance sheet is pressed by a heating member facing each other in a pair, the heating member is selected from a high current probe, a high frequency probe and an ultrasonic probe, the heating member is It is also preferred that the ends are rounded.

Further, in the step (c), the non-conductive gap between adjacent heat-sealed portions is formed at a position adjacent to one heat-sealed portion in the case of the first conductive layer, and the other in the case of the second conductive layer. It is preferably formed at a position adjacent to the heat-sealed portion.

In addition, in the step (d), it is preferable that the insulating layer is applied to a place other than the region adjacent to the heat-sealed portion.

Preferably, the thin sheet resistance sheet is a conductive polymer having a constant temperature coefficient characteristic.

According to still another aspect of the present invention, there is provided a surface mount type electric device for a printed circuit board using heat welding manufactured by the above method.

This electrical device comprises a sheet resistance component having first and second surfaces and first and second side surfaces connected to the first and second surfaces; A first electrode formed on the first surface of the sheet resistance component and extending from the first side toward the second side; A first additional electrode formed on the second side surface at the first surface of the sheet resistance component and electrically separated from the first electrode by a first nonconductive gap; A second electrode formed on the second surface of the sheet resistance component and extending from the second side toward the first side; And a second additional electrode formed on the first side surface at the second surface of the sheet resistance component and electrically separated from the second electrode by a second nonconductive gap, wherein the first electrode and the first electrode The two additional electrodes may be electrically connected to each other by heat fusion at the first side, and the second electrode and the first additional electrode may be configured to be electrically connected to each other by heat fusion at the second side.

The electrical device also includes a first insulating layer applied to a portion of the first electrode and the first nonconductive gap; A second insulating layer applied to a portion of the second electrode and the second nonconductive gap; First solder plating surrounding the first side surface and formed in an area where the first and second insulating layers are not applied; And a second solder plating formed on an area where the first and second insulating layers are not coated while covering the second side surface.

On the other hand, an insulating material may be applied only to the first and second non-conductive gaps.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a view showing the configuration of a surface mounted electric device for a printed circuit board (PCB) according to an embodiment of the present invention. Referring to FIG. 1, the electrical apparatus of the present invention includes a sheet resistance component 10 having a predetermined length, wherein the sheet resistance component 10 includes the first and second surfaces 12 and 14 facing each other and the first and second surfaces. It has first and second sides 16, 18 connected to the first and second surfaces 12, 14. In the figure, the first surface 12 of the sheet resistance component 10 is shown as an upper surface, the second surface 14 as a lower surface, the first side 16 is the left side, and the second side 18 is the same. Is shown to represent the right side.

The sheet resistance component 10 preferably has a positive temperature coefficient (PTC) characteristic. Also preferably, this sheet resistance component 10 is made of a conductive polymer composed of a mixture of a crystalline polymer resin and a conductive material. As the conductive material, carbon black, metal particles or metal powder may be used.

The first electrode 20 is formed on the first surface 12 of the sheet resistance component 10. The first electrode 20 extends from the first side 16 of the sheet resistance component 10 toward the second side 18 by a predetermined distance.

The first additional electrode 22 is also formed on the first surface 12. The first additional electrode 22 is formed on the second side surface 18 side, and preferably has a shorter length than the first electrode 20. The first electrode 20 and the first additional electrode 22 are electrically separated by the nonconductive gap 24.

The second electrode 30 is formed on the second surface 14 of the sheet resistance component 10. The second electrode 30 extends from the second side face 18 of the sheet resistance component 10 toward the first side face 16 by a predetermined distance.

The second additional electrode 32 is also formed on the second surface 14. The second additional electrode 32 is formed on the side of the first side surface 16, and preferably has a shorter length than that of the second electrode 30. The second electrode 30 and the second additional electrode 32 are electrically separated by the nonconductive gap 34.

In this case, the first electrode 20 of the first surface 12 and the second additional electrode 32 of the second surface 14 are electrically connected to each other by thermal fusion, and the first surface of the first surface 12. The additional electrode 22 and the second electrode 30 of the second surface 14 are also electrically connected to each other by thermal fusion. The heat fusion is performed by a heating means, and the heating means may be a high current probe, a high frequency probe, an ultrasonic probe, or the like. In the present invention, a high frequency probe (200, 210 (see Fig. 3b)) as a heating means will be described as a representative example. The high frequency probes 200 and 210 pressurize portions of the first side surface 16 and the second side surface 18 of the sheet resistance component 10 and heat them at a high frequency, thereby heating the first electrode 20 and the second additional electrode. And the second electrode 30 and the first additional electrode 22 are attached to each other.

In the electric device according to the present invention configured as described above, the first electrode 20 and the first additional electrode 22 or the second electrode 30 and the second additional electrode 32 serve as terminals, and are mounted on the surface of the PCB. . In this case, the first electrode 20, the first additional electrode 22, the second electrode 30 and the second additional electrode 32 are on the same surface, and are connected to the surface of the PCB at the same time. I don't need it. Thus, the above-described electrical apparatus can be mounted on the surface of the PCB on either the top or bottom side.

2 is a modified example in which the above-described electrical apparatus is reinforced. Referring to FIG. 2, the electrical apparatus of the present modification includes all the configurations shown in FIG. 1, and includes the first and second insulating layers 50 and 52, the first and second solder platings 60 and 62, and the first and second solder layers 60 and 62. First and second additional solder platings 64 and 66 are added.

The first insulating layer 50 is applied to a portion of the first electrode 20 and the first nonconductive gap 24. In this case, the first insulating layer 50 is not applied to the position adjacent to the first side surface 16. Thus, the first electrode 20 is exposed to the outside at a portion adjacent to the first side 16. An insulator applied to the first nonconductive gap 24 electrically reliably separates the first electrode 20 and the first additional electrode 22. The first insulating layer 50 may also be coated to cover a portion of the first additional electrode 22.

The second insulating layer 52 is applied to a portion of the second electrode 30 and the second nonconductive gap 34. In this case, the second insulating layer 52 is not applied to the position adjacent to the second side surface 18. Thus, the second electrode 30 is exposed to the outside at a portion adjacent to the second side surface 18. An insulator applied to the second nonconductive gap 34 electrically separates the second electrode 30 from the second additional electrode 32. The second insulating layer 52 may also be coated to cover a portion of the second additional electrode 32.

Solder is plated in an area where the first and second insulating layers 52 are not applied. Referring to the drawings, the first solder plating 60 is formed on the exposed portion of the first electrode 20, and the first additional solder plating 64 is formed on the exposed portion of the first additional electrode 22. . In addition, the second solder plating 62 is formed on the exposed portion of the second electrode 30, and the second additional solder plating 66 is formed on the exposed portion of the second additional electrode 32.

In the electric device having such a structure, the first electrode 20 and the first additional electrode 22 and the second electrode 30 and the second additional electrode 32 are electrically secured by the insulating layers 50 and 52. It is more stable because it is separated. In addition, each solder plating (60, 62, 64, 66) serving as a terminal connected to the PCB is symmetrical in the vertical direction and the left and right, there is an advantage that it is very convenient to use.

Next, a method of manufacturing a surface mounted electric device for a PCB according to an embodiment of the present invention as described above with reference to FIGS. 3A to 3F will be described.

To make the electric device according to the present invention, first, a wide resistive element as shown in FIG. 3A is prepared. The resistive element is composed of a thin sheet resistance sheet 100 and first and second conductive layers 102 and 104. The first conductive layer 102 is formed on the first surface 112 of the sheet resistance sheet 100, and the second conductive layer 104 is formed on the second surface 114 of the sheet resistance sheet 100.

The thin sheet resistance sheet 100 preferably has a positive temperature coefficient (PTC) characteristic and is made of a conductive polymer composed of a mixture of a crystalline polymer resin and a conductive material. As the conductive material, carbon black, metal particles or metal powder may be used.

Next, as shown in FIG. 3B, the first and second conductive layers 102 and 104 are heated to contact each other while pressing the first and second surfaces 112 and 114 of the sheet resistance sheet 100 at regular intervals. Fusion. Thermal fusion is performed with a pair of high frequency probes 200 and 210. Each pair of high frequency probes 200 and 210 are arranged to face each other.

In this process, the high frequency probes 200 and 210 press the sheet resistance sheet 100 in the vertical direction, and the first and second conductive layers 102 and 104 come into contact with each other while the pressed portion is extended. The high frequency probes 200 and 210 also generate high frequencies to heat the contact portions of the first and second conductive layers 102 and 104, and the heated portions are thermally fused to each other. By the heat-sealed portion 140 formed as described above, the first and second conductive layers 102 and 104 are electrically connected to each other.

In this case, the high frequency probes 200 and 210 preferably have end portions 202 and 212 facing each other in a round shape. When the end portions 202 and 212 of the high frequency probes 200 and 210 are manufactured in a round shape, the heat fusion portion 140 may be formed wider. If the heat-sealed portion 140 is too narrow, there is a greater possibility that the electrical connection between the first and second conductive layers 102 and 104 is separated in the process of dividing the sheet resistance sheet. In addition, since the rounded ends 202 and 212 of the high frequency probes 200 and 210 sequentially apply a pressing force when pressing the first and second conductive layers 102 and 104, the conductive layers 102 and 104 are applied. It is possible to prevent the break in the stretching process.

As such, the portion divided by the heat fusion unit 140 has a width substantially the same as that of the finally manufactured electric device. For convenience of description, the side of the sheet resistance element on which one heat fusion portion is formed is called the first side surface 116, and the side of the sheet resistance element on which the adjacent heat fusion portion is formed is called the second side surface 118. The first side 116 is shown to be on the left and the second side 118 to the right.

Next, a plurality of non-conductive gaps 124 and 134 are formed in the first and second conductive layers 102 and 104 as shown in FIG. 3C. Non-conductive gaps 124 and 134 are formed in the first and second conductive layers 102 and 104, respectively, between adjacent heat seals 140. In this case, the first non-conductive gap 124 formed in the first conductive layer 102 is formed adjacent to the second side surface 118, so that the first conductive layer 102 of the corresponding region is formed in the first electrode 120. And the first additional electrode 122 are electrically separated. In addition, the second non-conductive gap 134 formed in the second conductive layer 104 is formed adjacent to the first side surface 116 to form the second conductive layer 104 in the corresponding region. And electrically separated from the second additional electrode 132. In this state, the first electrode 120 is electrically connected to the second additional electrode 132 by thermal fusion, and the second electrode 130 is electrically connected to the first additional electrode 122 by thermal fusion. It is connected.

After cutting the thin plate resistance element through the above-described process along the heat-sealed portion 140, and dividing the thin-film resistor element in the cross-sectional direction again, the electric device illustrated in FIG. 1 may be obtained.

On the other hand, an additional process is required to make a reinforced electrical device such as that shown in FIG. In order to make the electrical apparatus of FIG. 2, the first and second insulating layers 150 and 160 are coated on the thin plate resistor elements that have undergone the processes of FIGS. 3A to 3C. As shown in FIG. 3D, the first insulating layer 150 is applied to cover a portion of the first electrode 120 and the non-conductive gap 124. The first insulating layer 150 is not applied to an area adjacent to the first side surface 116, and thus the first electrode 120 is exposed to the outside in an area adjacent to the first side surface 116. The first insulating layer 150 may also partially cover the first additional electrode 122. The second insulating layer 160 is applied to cover a portion of the second electrode 130 and the nonconductive gap 134. The second insulating layer 160 is not applied to an area adjacent to the second side surface 118, and allows the second electrode 130 to be exposed to the outside in an area adjacent to the second side surface 118. The second insulating layer 150 may also partially cover the second additional electrode 132. The insulating layers 150 and 160 help to electrically and reliably separate the first electrode 120, the first additional electrode 122, and the second electrode 130 and the second additional electrode 132.

Thereafter, solder is plated in the region where the insulating layers 150 and 160 are not applied. The solder is plated on all exposed areas of the first and second electrodes 120, 130 and the first and second additional electrodes 122, 132, as shown in FIG. 3E. That is, the first solder plating 160 is formed on the exposed top and side surfaces of the first electrode 120, and the first additional solder plating 164 is formed on the exposed top and side surfaces of the first additional electrode 122. The second solder plating 162 is formed on the exposed upper and side surfaces of the second electrode 130, and the second additional solder plating 166 is formed on the exposed upper and side surfaces of the second additional electrode 132. do. Each solder plating 160, 162, 164, 166 serves as a terminal when mounted on a PCB. The solder platings 160, 162, 164, and 166 are symmetric in the vertical direction and the left and right directions, and are very convenient in structure.

Next, as shown in FIG. 2F, the thin sheet resistance sheet 100 is cut along the heat seal 140. The position at which the thin sheet resistance sheet 100 is cut is preferably passed through the center of the heat-sealed portion 140. When cutting an area deviating from the center of the heat fusion unit 140, upper and lower electrode connections may be separated.

The thin sheet resistance element that has undergone the above-described process is then divided in the cross-sectional direction to make a plurality of electrical devices. In this case, the finally manufactured electric device is the same as that shown in FIG. 2.

In this modification, the insulation layer and the solder plating were added to the electrical device of FIG. 1. However, it is not necessarily limited to these examples, and other variations are sufficiently possible. For example, in the electrical device of FIG. 1, it is also possible to fill the insulating material only with the non-conductive gaps 124 and 134. This modification is well illustrated in FIG. 4. In this case, the insulating material 220 also has an effect of reliably disconnecting the electrical connection between the electrode and the additional electrode located on one surface.

5A to 5F are diagrams sequentially illustrating a method of manufacturing a surface mounted electric device for a printed circuit board according to another exemplary embodiment of the present invention.

In the present embodiment, the conductive layers 102 and 104 are formed in the sheet resistance sheet 100 (FIG. 5A), and the sheet resistance sheet 100 is pressurized with high frequency probes 200 and 210 and heat is applied to the conductive layer ( 102 and 104 are connected to each other by the heat fusion unit 140 (FIG. 5B), and the non-conductive gaps 124 and 134 are formed in the conductive layers 102 and 104 to form the respective conductive layers 102 and 104. The first electrode 120, the first additional electrode 122, and the second electrode 130 and the second additional electrode 132 are separated (FIG. 5C), and a part of each electrode 120 and 130 and a non-conductive gap The process of coating the insulating layers 150 and 152 on 124 and 134 (FIG. 5D) is the same as the process shown in FIGS. 3A to 3D of the previous embodiment.

However, in the present embodiment, as shown in FIG. 5E, a process of cutting the thin sheet resistance sheet 100 along the heat fusion unit 140 is first performed in the following process. In this process, the center of the heat fusion unit 140 is cut, and the center of the heat fusion unit 140 is removed by a predetermined width.

Next, in the state in which the heat fusion unit 140 is cut, solder is plated on an area where the insulating layers 150 and 152 are not applied. The solder is plated to cover both sides of the sheet resistance element 100 as shown in FIG. 5F. The first solder plating 160a surrounds the first side surface 116 of the sheet resistance element 100 to connect the first electrode 120 and the second additional electrode 132 to each other, and the second solder plating 162a. The second electrode 130 and the first additional electrode 122 are connected to each other while surrounding the second side surface 118 of the thin plate resistance element 100. Therefore, even when the electrode and the additional electrode are disconnected in the process of cutting the heat fusion unit 140, the connection can be restored through the solder plating (160a, 162a). Therefore, this embodiment has the advantage that the electrical connection between the electrode and the additional electrode is made more stable.

As described above, the thin plate resistive element having the solder plating is divided in the cross-sectional direction to make a plurality of electric devices. The cross section of the finally produced electrical device in this embodiment is the same as that shown in FIG. 5F.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, the method for manufacturing a surface-mounted electric device for a printed circuit board according to the present invention connects the conductive layers to each other by thermal fusion, thereby simplifying the manufacturing process as compared with the prior art, and consequently, The advantage is that the cost can be reduced.

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to

1 is a cross-sectional view showing a surface mounted electric device for a printed circuit board according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a modified variant of the electrical device shown in FIG. 1. FIG.

3A to 3F are diagrams sequentially illustrating a method of manufacturing a surface mounted electric device for a printed circuit board according to an embodiment of the present invention.

4 is a cross-sectional view showing yet another modification of the electrical apparatus shown in FIG.

5A through 5F sequentially illustrate a method of manufacturing a surface mounted electric device for a printed circuit board according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10. Thin sheet resistance component 12,112. First surface 14, 114. Second surface

16,116. First side 18,118. Second side 20,120. First electrode

22,122.First additional electrode 24,34,124,134..Nonconductive gap

30,130. Second electrode 32,132. Second additional electrode 40,140.

50,150 .. First insulating layer 52,152 .. Second insulating layer

60,62,64,66,160,160a, 162,162a, 164,168..Solder Plating

100. Thin sheet resistance sheet 102. First conductive layer 104. Second conductive layer

200,210 High frequency probe 202,212 Round end 220 Insulating material

Claims (22)

(a) providing a sheet resistance sheet having first and second surfaces, wherein a first conductive layer is formed on the first surface and a second conductive layer is formed on the second surface; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) applying first and second insulating layers to portions of the first and second conductive layers together with the nonconductive gaps; (e) plating solder on regions where the first and second insulating layers are not applied; (f) cutting the sheet resistance sheet along the heat seal portion; And (g) dividing the sheet resistance sheet to form a plurality of electrical devices, the method of manufacturing a surface mounted electric device for a printed circuit board using thermal welding. The method of claim 1, In the heat fusion process of step (b), the sheet resistance sheet is pressurized by a pair of heating means facing each other, and the heating means is heat fusion, characterized in that any one of a high current probe, a high frequency probe and an ultrasonic probe. Method of manufacturing a surface mounted electric device for a printed circuit board using the same. The method of claim 2, The heating means is a manufacturing method of the surface-mounted electrical device for a printed circuit board using a thermal fusion, characterized in that the end is formed in a round shape. The method of claim 1, In the step (c), the non-conductive gap is formed between the heat-sealed portions adjacent to each other in the position adjacent to one heat-sealed portion in the case of the first conductive layer, the other heat-sealed in the case of the second conductive layer Method for manufacturing a surface-mounted electrical device for a printed circuit board using heat welding, characterized in that formed in a position adjacent to the portion. The method of claim 1, In the step (d), the insulating layer is a surface-mounted electrical device manufacturing method for a printed circuit board using a thermal fusion, characterized in that the coating is applied to a region other than the region adjacent to the thermal fusion. The method according to any one of claims 1 to 5, The sheet resistance sheet is a method of manufacturing a surface-mounted electrical device for a printed circuit board using thermal fusion, characterized in that the conductive polymer having a constant temperature coefficient characteristics. A surface-mounted electrical device for a printed circuit board using heat welding manufactured by the method defined in any one of claims 1 to 5. The method of claim 7, wherein The sheet resistance sheet is a surface-mounted electrical device for a printed circuit board using thermal fusion, characterized in that the conductive polymer having a constant temperature coefficient characteristics. (a) providing a sheet resistance sheet having first and second surfaces, wherein a first conductive layer is formed on the first surface and a second conductive layer is formed on the second surface; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) applying first and second insulating layers to portions of the first and second conductive layers together with the nonconductive gaps; (e) cutting the sheet resistance sheet along the heat seal portion; (f) plating solder on regions to which the first and second insulating layers are not applied; And (g) dividing the sheet resistance sheet to form a plurality of electrical devices, the method of manufacturing a surface mounted electric device for a printed circuit board using thermal welding. The method of claim 9, In the heat fusion process of step (b), the sheet resistance sheet is pressurized by a pair of heating means facing each other, wherein the heating means is one of a high current probe, a high frequency probe, and an ultrasonic probe. Method of manufacturing surface-mount electrical devices for printed circuit boards. The method of claim 10, The heating means is a manufacturing method of the surface-mounted electrical device for a printed circuit board using a thermal fusion, characterized in that the end is formed in a round shape. The method of claim 9, In the step (c), the non-conductive gap is formed between the heat-sealed portions adjacent to each other in the position adjacent to one heat-sealed portion in the case of the first conductive layer, the other heat-sealed in the case of the second conductive layer Method for manufacturing a surface-mounted electrical device for a printed circuit board using heat welding, characterized in that formed in a position adjacent to the portion. The method of claim 9, In the step (d), the insulating layer is a surface-mounted electrical device manufacturing method for a printed circuit board using a thermal fusion, characterized in that the coating is applied to a region other than the region adjacent to the thermal fusion. The method according to any one of claims 9 to 13, The sheet resistance sheet is a method of manufacturing a surface-mounted electrical device for a printed circuit board using thermal fusion, characterized in that the conductive polymer having a constant temperature coefficient characteristics. A surface mount type electric device for a printed circuit board using heat welding manufactured by the method defined in any one of claims 9 to 13. The method of claim 15, The sheet resistance sheet is a surface-mounted electrical device for a printed circuit board using thermal fusion, characterized in that the conductive polymer having a constant temperature coefficient characteristics. A sheet resistance component having first and second surfaces and first and second side surfaces connected to the first and second surfaces; A first electrode formed on the first surface of the sheet resistance component and extending from the first side toward the second side; A first additional electrode formed on the second side surface at the first surface of the sheet resistance component and electrically separated from the first electrode by a first nonconductive gap; A second electrode formed on the second surface of the sheet resistance component and extending from the second side toward the first side; And A second additional electrode formed on the first side surface at the second surface of the sheet resistance component and electrically separated from the second electrode by a second nonconductive gap, The first electrode and the second additional electrode are electrically connected to each other by heat fusion at the first side surface, And the second electrode and the first additional electrode are electrically connected to each other by thermal fusion at the second side surface. The method of claim 17, A first insulating layer applied to a portion of the first electrode and the first non-conductive gap; A second insulating layer applied to a portion of the second electrode and the second nonconductive gap; First solder plating surrounding the first side surface and formed in an area where the first and second insulating layers are not applied; And And a second solder plating formed on an area where the first and second insulating layers are not applied while surrounding the second side surface. The method of claim 17, Surface-mounted electrical device for a printed circuit board using heat welding, characterized in that the insulating material is applied to the first and second non-conductive gap. The method of claim 17, And the first non-conductive gap is located adjacent to the second side, and the second non-conductive gap is located adjacent to the first side. The method according to any one of claims 17 to 20, The sheet resistance sheet is a surface-mounted electrical device for a printed circuit board using thermal fusion, characterized in that the conductive polymer having a constant temperature coefficient characteristics. (a) providing a sheet resistance sheet having first and second surfaces, wherein a first conductive layer is formed on the first surface and a second conductive layer is formed on the second surface; (b) heat-sealing the first and second conductive layers so as to contact each other while pressing the first and second surfaces of the sheet resistance sheet at regular intervals; (c) forming a plurality of non-conductive gaps in the first and second conductive layers; (d) cutting the sheet resistance sheet along the heat seal portion; And (e) dividing the sheet resistance sheet to produce a plurality of electrical devices.