KR100495129B1 - Method of manufacturing surface mountable electrical device using conducting wire - Google Patents

Abstract

In the method of manufacturing a surface-mount positive temperature coefficient (PTC) device using a conductor mounted on a printed circuit board to protect a circuit, (a) a plurality of pairs of pairs of conductors are arranged at regular intervals. Preparing a sheet resistance sheet inserted and exposing the pair of conductors to the first and second surfaces, respectively; (b) forming first and second conductive layers, respectively, on the first and second surfaces of the sheet resistance sheet to be electrically connected to the pair of conductors; (c) removing a portion of the first and second conductive layers at a predetermined position between the pair of conductors to form a non-conductive gap; (d) cutting the thin sheet resistance sheet in a direction in which the wire pair is separated into respective wires; And (e) dividing the sheet resistance sheet in a direction perpendicular to the wire pair to make a plurality of electrical devices.

Description

Method for manufacturing surface-mounted electric devices using wires {METHOD OF MANUFACTURING SURFACE MOUNTABLE ELECTRICAL DEVICE USING CONDUCTING WIRE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a surface mounted electric device, and more particularly, to a surface mounted positive temperature coefficient (PTC) device using a conductor mounted on a printed circuit board to perform a function of protecting a circuit. It relates to a manufacturing method of.

In general, a so-called positive temperature coefficient (PTC) material composed of a mixture of a crystalline polymer resin and a conductive material has a wide range of application. At low temperatures, such as room temperature, PTC materials have a low resistance to pass current, but when the ambient temperature rises or the material temperature rises due to overcurrent, the resistance increases by 10 ³ to 10 ⁴ times or more, which blocks the current. Have

The PTC material is connected to a metal electrode and can be applied to various types of electric devices, and is mainly used for overcurrent blocking and circuit protection in an electric circuit. Such a PTC device is mainly mounted on a printed circuit board (PCB), which is subject to a lot of shape constraints by the components of the PCB board. In recent years, as the circuit design has been highly integrated, the demand for light and thin reduction of board mounted components has increased. To this end, many techniques for PTC devices have been proposed.

As manufacturing techniques related to PTC devices, for example, U.S. Patent Nos. 5,699,607, 5,831,510, 5,852,397, 5,864,281, 5,884,391, 5,900,800, 5,907,272, 6,020,808, 6,023,403, claim there are 6,124,781, 1 - 6157289, 1 - 6172591, 1 - 6188308, 1 - 6211771, 1 - 6223423, 1 - 6242997, 1 - 6292088, 1 - 6297722, 1 - 6348851, 1 - 6377467, 1 - 6380839 call, etc. .

Most of these manufacturing process technologies are based on a printed circuit board processing technology, and are distinguished from each other according to a method of connecting upper and lower electrodes of a basic device having PTC characteristics. Some of the representative patents listed above are described below.

First, U.S. Patent Nos. 5,831,510 and 5,852,397 connect a top and bottom electrode by drilling a hole in a plate-shaped PTC device in which metal foil is bonded to both sides of a PTC material, and copper plating the entire surface of the PTC device including the inside of the hole. And then etch the electrode near the aperture to separate it into an anode. This process is borrowed from the general board manufacturing process in the printed circuit board field.

U.S. Patent No. 5,884,391 is configured to form long slits instead of holes in the PTC element sheet, and to connect the upper and lower electrodes by copper plating the entire surface of the sheet including the cross section of the slits. In addition, after the copper plated upper and lower electrodes are separated from each other by etching, and a solder resist is applied, both ends of the copper plated upper and lower electrodes are surrounded by solder plating.

U.S. Pat.Nos. 5,699,607 and 5,900,800 show a long slit on a PTC sheet, apply solder plating to the front surface of the sheet including this slit cross section, and then give a gap to the upper and lower portions to expose the electrode surface. Copper plating surrounds both ends. This method eliminated some of the previously applied solder plating without etching the electrodes so that copper plated thereon could contact the electrodes.

One example of such various conventional PTC devices is shown in FIG. 1. The example shown in FIG. 1 is particularly similar to that shown in US Pat. Nos. 5,831,510 and 5,852,397.

Referring to FIG. 1, the conventional PTC device 1 forms electrodes 3 on the upper and lower surfaces of the sheet resistance component 2, and forms a plating layer 4 connecting the electrodes 3 on the upper and lower surfaces. After that, a portion of the electrode 3 and the plating layer 4 is removed to form a non-conductive gap 5, and an insulator 6 is coated on a portion of the surface of the non-conductive gap 5 and the plating layer 4, and the insulator (6) is configured to form an additional plating layer 7 in the uncoated region.

Surface-mounted PTC devices as described above have a common point in that slits or holes are commonly formed in a wide sheet, and a conductive layer is formed through these slits or holes to connect upper and lower electrodes. That is, until now, it was considered necessary to form a slit or a hole to connect the vertical electrodes, and no one can suggest another alternative. However, the prior art has the disadvantage that manufacturing time and cost are high due to the complicated process of forming fine holes or slits in the sheet and forming a conductive layer in the holes or slits. In addition, this process requires a very high technical force, a high incidence of defects in the process of forming a uniform conductive layer in a narrow area. In particular, the conductive layer formed in such a narrow area is likely to be damaged by impact or pressing during the installation of the PTC device.

In addition, the PTC composition of the PTC device is repeatedly contracted and expanded depending on the temperature, and in this process, a very thin conductive layer formed on the PTC composition, in particular, a conductive layer surrounding the side of the composition may be damaged.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of manufacturing a surface-mounted electrical device that is structurally more stable against external impact or pressure by connecting the upper and lower electrodes using a conductive wire.

In order to achieve the above object, in the method of manufacturing a surface-mounted electric device using a wire according to the present invention, (a) a plurality of wires formed in pairs are inserted at regular intervals, and the wire pairs are first and second, respectively. Preparing a sheet resistance sheet exposed to the surface; (b) forming first and second conductive layers, respectively, on the first and second surfaces of the sheet resistance sheet to be electrically connected to the pair of conductors; (c) removing a portion of the first and second conductive layers at a predetermined position between the pair of conductors to form a non-conductive gap; (d) cutting the thin sheet resistance sheet in a direction in which the wire pair is separated into respective wires; And (e) dividing the sheet resistance sheet in a direction perpendicular to the wire pair to make a plurality of electrical devices.

Preferably, the thin sheet resistance sheet is a conductive polymer having a positive temperature coefficient (PTC) characteristic, and the conductive wire includes an elastic material and a conductive metal coated on the outside of the elastic material, respectively.

In addition, the step (a) is a step of pressing the resistive material together with a plurality of wire pairs to form a sheet resistance sheet; And polishing the first and second surfaces of the sheet resistance sheet to expose the wire pairs.

Alternatively, in the step (a) and (b), the step of inserting the pair of wires into the sheet resistance sheet and forming the first and second conductive layers on the first and second surfaces of the sheet resistance sheet. The process may be performed simultaneously using a roll laminator.

In this case, in the step (c), the non-conductive gap is preferably formed in the first conductive layer adjacent to the one pair of conductors, and in the second conductive layer is formed in the vicinity of the adjacent pair of conductors.

Such a method of manufacturing a surface mounted electric device may include applying an insulating layer to at least a portion of the non-conductive gap and the first and second conductive layers after step (c); And

The method may further include forming a solder layer on surfaces of the first and second conductive layers to which the insulating layer is not applied.

In the step (c), the first conductive layer is separated into a first electrode and a second electrode by the non-conductive gap, and the second conductive layer is separated into a second electrode and a second additional electrode by the non-conductive gap. It is also preferred that the insulating layer be applied only to a portion of the non-conductive gap and the first and second electrodes.

According to another aspect of the invention, (a) a step of preparing a sheet resistance sheet is inserted into a plurality of conductors at regular intervals, the conductor is exposed to the first and second surfaces; (b) forming first and second conductive layers, respectively, on the first and second surfaces of the sheet resistance sheet to be electrically connected to the conductive wires; (c) removing a portion of the first and second conductive layers at a predetermined position between the conductive lines to form a non-conductive gap; (d) cutting the sheet resistance sheet in a direction in which the exposed portions of the conductive wires are separated; And (e) dividing the sheet resistance sheet in a direction perpendicular to the conductive wire to form a plurality of electrical devices.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

2 to 5 are views showing a method for manufacturing a surface-mounted electrical device according to a first embodiment of the present invention.

In order to manufacture the surface mounted electric device according to the present invention, first, a thin sheet resistance sheet 20 shown in FIG. 2 is prepared. The thin sheet resistance sheet 20 has an upper surface 22 and a lower surface 24, and a plurality of conductive wires 30 are inserted therein.

The thin sheet resistance sheet 20 preferably has a positive temperature coefficient (PTC) characteristic. Also preferably, the thin sheet resistance sheet 20 is made of a conductive polymer composed of a mixture of a crystalline polymer resin and a conductive material. As the conductive material, carbon black, metal particles or metal powder may be used.

More preferably, the crystalline polymer resin used in the sheet resistance sheet 20 uses HDPE (High Density Polyethylene) as the base resin, and 35% of carbon black is mixed with HDPE as a conductive material, and other antioxidants and peroxides are used. It is prepared by containing 0.3% and 0.2% of a crosslinking agent, respectively. Of course, the thin sheet resistance sheet 20 may be variously modified in addition to the above example.

The conductive wire 30 is disposed at regular intervals in the sheet resistance sheet 20, and part of the conductive wire 30 is exposed to the first surface 22 and the second surface 24. In the present embodiment, two conductive wires 30 are arranged in pairs, and each conductive wire pair 30 is disposed at regular intervals. The spacing of the wire pairs 30 is substantially equal to the width of the electrical device to be completed. The two paired wires are arranged close to each other and may contact each other.

In order to make the thin sheet resistance sheet 20, a roll laminator 200 illustrated in FIG. 6 may be used. That is, by pressing the resistive material and the conductive wire together with the roll laminator 200, the thin-film resistance sheet 20 into which the conductive wire 30 is inserted is made.

The thin sheet resistance sheet 20 compressed through the roll laminator 200 may occur, however, when the conductive wire 30 is not exposed to the outside. Therefore, as shown in FIG. 7, a process of polishing and removing a portion of the upper and lower surfaces 22 and 24 of the pressed sheet resistance sheet 20 may be further added. In this polishing process, part of the upper and lower surfaces 22 and 24 of the sheet resistance sheet 20 is removed, and at the same time, the conductive wire 30 is reliably exposed to the upper and lower surfaces 22 and 24. This is illustrated well in FIG. 8. In addition, since the polishing area increases the exposed area of the conductive wire 30, it is possible to ensure a more reliable electrical connection.

In the sheet resistance sheet 20 manufactured through the above-described process, conductive layers 40 and 50 are also formed. In the figure, it is shown that the first conductive layer 40 is formed on the first surface 22 of the sheet resistance sheet 20 and the second conductive layer 50 is formed on the second surface 24.

In order to form the first and second conductive layers 40 and 50, a process of simultaneously compressing the sheet resistance sheet 20 and the respective conductive layers 40 and 50 may be performed. That is, the conductive wires 30 and the conductive layers 40 and 50 are sequentially formed, respectively.

As an alternative, however, it is also possible to simultaneously form the conductor 30 and the conductive layers 40 and 50. This alternative is shown in FIG. 9, where the roll laminator 200 is used to compress the leads and conductive layers together with the resistive material. At this time, it is preferable that the roll laminator 200 makes the thickness of the thin sheet resistance sheet 20 completed slightly smaller than the conducting wire 30. In the pressing process by the roll laminator 200, the conductive wire 30 is in close contact with the conductive layers 40 and 50 and electrically connected to each other. In addition, during the crimping process, the conductive layers 40 and 50 are slightly pressed by the conducting wire 30, and the resistive material existing between the conducting wire 30 and the conducting layers 40 and 50 before the crimping process is conducted in the crimping process. 30) pushed out to the periphery.

In the thin sheet resistance sheet 20 manufactured through this process, upper and lower conductive layers 40 and 50 are electrically connected to each other by the conductive wires 30.

The thin sheet resistance sheet 20 completed through the above-described process becomes the shape shown in FIG. 2, and the first and second conductive layers 40 and 50 stacked on the thin sheet resistance sheet 20 are illustrated in FIG. 3. Partially removed to form the first and second non-conductive gaps 46, 56. The process of removing portions of the conductive layers 40 and 50 is performed by etching or the like. The first and second non-conductive gaps 46 and 56 are preferably located adjacent to the conducting wire 30 and are also preferably in staggered positions. In FIG. 3, the second non-conductive gap 56 formed in the second conductive layer 50 is formed adjacent to one conductive pair 30, and the first non-conductive gap 46 formed in the first conductive layer 40. ) Is shown to be formed adjacent to the pair of adjacent conductors 35.

As described above, the thin sheet resistance sheet 20 having the conductive wire 30 and the conductive layers 40 and 50 is cut into a plurality of strips along the cutting line 12 as shown in FIG. 4. In this case, the cutting line 12 is set in a direction in which the wire pair 30 is separated into respective wires, and two wires are inserted into the cut strip. In addition, since the two conductors in a pair of conductors are adjacent to or in contact with each other, in each strip produced by separating the conductor pairs, the conductors 30 and 35 are adjacent to the sides 26 and 28 of each strip (see FIG. 5). It will be located there.

5 shows a cross section of each strip cut by the cutting line 12 as described above, which is the same as the cross section of the finished electrical device 10. Subsequently, each strip is divided in a direction perpendicular to the conductors 30 and 35 to create a plurality of electrical devices.

Referring to FIG. 5, in the electric device 10 according to the present embodiment, two conductive wires 30 and 35 are positioned to be spaced apart from each other. In addition, the first conductive layer 40 is electrically separated from the first electrode 42 and the first additional electrode 44 by the non-conductive gaps 46 and 56, and the second conductive layer 50 is formed by the second conductive layer 50. The electrode 52 is separated from the second additional electrode 54. In addition, in the electric device 10, one conductive wire 30 electrically connects the first electrode 42 and the second additional electrode 54, and the other conductive wire 35 connects to the first additional electrode 44. The second electrode 52 is electrically connected.

This electrical device can be used as a surface mount of a printed circuit board (PCB). When mounted on a PCB, the electrical device 10 of the present embodiment has a first electrode 42 and the first additional electrode 44 or the second electrode 52 and the second additional electrode 54 electrically connected to the PCB. It serves as a terminal.

The following describes a method for manufacturing a surface mounted electric device according to a second embodiment of the present invention. In this embodiment, a process of preparing a thin sheet resistance sheet 20 in which the wire pair 30 is inserted and connected to the upper and lower conductive layers 40 and 50 (see FIG. 2) and the non-conductive gap in the conductive layers 40 and 50 are provided. The process of forming (46, 56) (refer FIG. 3) is the same as that of the previous Example. Therefore, this embodiment will be described from the step after performing the process shown in FIGS. 2 and 3.

After the non-conductive gaps 46 and 56 are formed in the first and second conductive layers 40 and 50, as shown in FIG. 3, in this embodiment, as shown in FIG. Insulating layers 60, 62 are applied to the first and second surfaces 22, 24. The insulating layers 60 and 62 completely fill the non-conductive gaps 46 and 56 and are applied to cover portions of the first and second conductive layers 40 and 50. In this case, the insulating layers 60 and 62 are not applied near the position where the wire pair 30 is inserted, and are preferably applied only to the region between the wire pair 30.

Next, as shown in FIG. 11, the solder layer 70 is formed on the surfaces of the first and second conductive layers 40 and 50 to which the insulating layers 60 and 62 are not applied. The solder layer 70 is formed only at a position adjacent to the conductive wire pair 30, and is preferably formed in left-right symmetry with respect to the center of the conductive wire pair 30. The solder layer 70 forms the same plane as the insulating layers 60 and 62.

After the solder layer 70 is formed, the sheet resistance sheet 20 is cut along the cutting line 14 shown in FIG. In this case, the cutting line 14 is at the same position as the cutting line 12 illustrated in FIG. 4, and divides the conductive wire pair 30 and the solder layer 70 in half.

The strip formed by cutting in this way becomes the shape shown in FIG. 13, and this cross section is the same as the cross section of the electric device 100 manufactured according to the present embodiment. Thereafter, as in the case of the first embodiment, when each strip is divided in a direction perpendicular to the conductive lines 30 and 35, a plurality of electrical devices are made. This electrical device can be used as a surface mount of a printed circuit board (PCB).

In the electric device 100 according to the present embodiment manufactured as described above, the conductive wires 30 and 35 and the conductive layers 40 and 50 have the same structure and arrangement as those of the first embodiment. That is, the two conductive wires 30 and 35 are positioned to be spaced apart from each other, and the first conductive layer 40 is connected to the first electrode 42 and the first additional electrode 44 by the non-conductive gaps 46 and 56. ) And the second conductive layer 50 is separated into the second electrode 52 and the second additional electrode 54. In addition, in the electric device 10, one conductive wire 30 electrically connects the first electrode 42 and the second additional electrode 54, and the other conductive wire 35 connects to the first additional electrode 44. The second electrode 52 is electrically connected. In addition, while the solder layer 70 is separated by the cutting line 14, the first solder 72 in contact with the first electrode 42 and the first additional solder 74 in contact with the first additional electrode 44. ), A second solder 76 in contact with the second electrode 52, and a second additional solder 78 in contact with the second additional electrode 54 are formed. Each of the solders 72 and 74 and the additional solders 76 and 78 have the same length as each other.

When mounted on a PCB, the electrical device 100 of this embodiment has a first solder 72 and a first additional solder 74 or a second solder 76 and a second additional solder 78 electrically connected to the PCB. It serves as a terminal.

The electric device 100 manufactured by the present embodiment has a symmetrical structure in each of the solders 72, 74, 76, and 78 serving as terminals, in the vertical, horizontal, and horizontal directions, and thus is very suitable for the surface mount type of the PCB. That is, the surface-mounted electric device according to the present embodiment has an advantage in that the installation direction can be arbitrarily determined due to the symmetrical structure of the solder layers 72, 74, 76, and 78, which is convenient for use. In addition, since the conductive wires 30 and 35 inserted into the sheet resistance element 20 serve to connect the upper and lower electrodes to each other, a wrap-around process, which has been conventionally performed, is not necessary. In addition, since the conducting wires 30 and 35 also play a role of the electrode with respect to the sheet resistance element 20, the effective area becomes wider. In particular, since the conductors 30 and 35 are circular, the effective area of the side surfaces produced by the conductors is approximately 1.57 times larger than by the conventional wraparound process.

FIG. 14 is a variation of the surface mount electrical device shown in FIG. 13. The electrical apparatus 100a according to the present modification has the same manufacturing process as the previous embodiment, except that the structures of the conductive wires 30a and 35a used are different.

The conductive wires 30a and 35a used in the present modification use a coating of a conductive metal on an elastic material. As the elastic material, both a conductor and a non-conductor can be used, and it is preferable to use an elastic material such as rubber. In addition, various conductive metals may be used as the conductive metal to be coated on the elastic material, and it is particularly preferable to use copper. Since the conductive wires 30a and 35a made of an elastic material and a conductive metal are elastic in themselves, they can be prevented from being damaged by deformation of the thin plate resistance element 20 when the sheet resistance element 20 is bent or bent. have. In addition, even if an impact is applied to the sheet resistance element 20, the failure rate may be lowered because the elastic material buffers. In particular, even when the sheet resistance element 20 expands and contracts according to the temperature change, the conductive wires 30a and 35a are not significantly affected by their elasticity.

15 to 20 are views for explaining a method of manufacturing a surface-mounted electrical device using a conductive wire according to a third embodiment of the present invention.

In this embodiment, rather than conducting wires are arranged in pairs in the sheet resistance sheet 20 as in the previous embodiment, each wire is arranged to be spaced at a predetermined interval. Referring to FIG. 15, in the present embodiment, the plurality of conductive wires 130 and 135 are disposed to be spaced apart from each other by a predetermined interval in the sheet resistance sheet 20. In addition, each of the conductive wires 130 and 135 may be electrically connected to the first and second conductive layers 40 and 50 formed on the first and second surfaces 22 and 24 of the sheet resistance sheet 20. Partially exposed to the second surfaces 22, 24. The process of preparing the thin sheet resistance sheet 20 differs only in that the conductors are not formed in pairs, and are substantially the same as those described in the first embodiment.

When the thin sheet resistance sheet 20 is prepared as described above, non-conductive gaps 46 and 56 are formed in the first and second conductive layers 40 and 50 as shown in FIG. 16. The non-conductive gaps 46 and 56 are formed by removing portions of the conductive layers 40 and 50 by etching or the like. The positions of the non-conductive gaps 46 and 56 are preferably staggered from one another. For example, when the non-conductive gap 56 formed in the second conductive layer 50 is formed adjacent to one conductor 130, the non-conductive gap 46 formed in the first conductive layer 40 may be adjacent. A portion adjacent to the conductive line 135 is formed.

Next, insulating layers 60 and 62 are applied to the first and second surfaces 22 and 24 of the sheet resistance sheet 20. This is illustrated well in FIG. 17. Insulating layers 60 and 62 are formed to cover portions of non-conductive gaps 46 and 56 and portions of conductive layers 40 and 50, as in the case of the first embodiment. In addition, the insulating layers 60 and 62 are not applied near the conductive wires 130 and 135.

After applying the insulating layers 60 and 62, the solder layer 70 is formed in the region where the insulating layers 60 and 62 are not applied, as shown in FIG. The formation region of the solder layer 70 becomes the surface of the conductive layers 40 and 50 adjacent to the conductive lines 130 and 135.

When the insulating layers 60 and 62 and the solder layer 70 are formed, the thin sheet resistance sheet 20 is cut into a plurality of strips along the cutting line 16, as shown in FIG. In this case, the cutting line 16 is determined in a direction dividing the conductive wires 130 and 135 in the vertical direction, and preferably, the conductive wires 130 and 135 are exposed to the first and second surfaces 22 and 24. And the portions in contact with the first and second conductive layers 40 and 50 are accurately bisected. That is, even if each of the conductive wires 130 and 135 is divided into two, the separated half of the conductive wires must be electrically connected to the first and second conductive layers 40 and 50.

The cross section of the strip thus cut is shown in FIG. 20, which is the same as the cross section of the surface mounted electrical device 110 manufactured by the present embodiment.

When the thin sheet resistance sheet 20 is cut along the cutting line 16, the first and second conductive layers 40 and 50 and the solder layer 70 are also cut along the cutting line 16. Accordingly, the first conductive layer 40 is divided into the first electrode 42 and the first additional electrode 44 based on the non-conductive gap 46, and the second conductive layer 50 is the non-conductive gap 56. ) Is divided into a second electrode 52 and a second additional electrode 54. The first electrode 42 and the second additional electrode 54 are electrically connected to the half conducting wire 130 positioned on the first side 26 of the sheet resistance sheet 20, and the second electrode 52 and the second electrode 52 are electrically connected to each other. The first additional electrode 44 is electrically connected to the half neighboring conductive line 135 positioned on the second side surface 28. In addition, each solder layer 70 is precisely nutrient, and the first solder 72 and the first additional electrode 44 are in contact with the first electrode 42 and the first electrode 42. The solder 74, the second solder 76 in contact with the second electrode 52, and the second additional solder 78 in contact with the second additional electrode 54 are made. Each of the solders 72 and 74 and the additional solders 76 and 78 have the same length as each other.

Each strip as described above is then divided in a direction perpendicular to the conductive wires (130, 135) to form a plurality of surface-mounted electrical device (110).

The surface-mounted electrical device 110 according to the present embodiment manufactured as described above has the same effect as the previous embodiment, and has an effect of reducing the manufacturing cost by reducing the use of the conductor in half. In addition, since the conducting wires 130 and 135 contact each electrode 42, 44, 52, 54 at both ends of the thin sheet resistance element, the effective area at the first and second surfaces 22, 24 can be maximized. have.

In the present embodiment, the conductive wires 130 and 135 are shown to be made of only a conductive material. However, it is not necessarily limited thereto, and various modifications are possible. For example, conductive wires coated with an elastic material may be used as the conductive wires 130 and 135. The electrical device 110a according to this modification is well shown in FIG. 21.

In addition, similar to the first embodiment, the electrical apparatus of the present embodiment may be implemented in a form except for the insulating layer and the solder layer. That is, after forming the non-conductive gaps 46 and 56 as shown in FIG. 16, the thin sheet resistance sheet 20 is cut and divided to make an electric device. The electric device 110b in this case has a cross section of the form shown in FIG.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

For example, although the cross section of the conductive wire inserted into the sheet resistance sheet has been described so far, the cross section may have various shapes such as square, rectangle, rhombus, and hexagon.

Such a method of manufacturing a surface-mounted electrical device using a wire according to the present invention includes a wrap-around process of wrapping a side of a sheet resistance element with a conductive layer by inserting a conductive wire into the sheet resistance element to connect upper and lower electrodes. It is not necessary.

Conductors inserted into the sheet resistance element also serve as additional electrodes, providing a larger effective area than the flat conductive layer by the wraparound process.

In addition, when the wire is made of an elastic material and a conductive metal coating, it is possible to greatly reduce the adverse effect of the sheet resistance element to repeat the shrinkage and expansion according to the temperature change.

In addition, when dividing the lead wire when cutting the thin-film resistance element, the use amount of the lead wire can be reduced as well as the effective area can be widened.

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to

1 is a diagram showing an example of a PTC device according to the prior art.

2 to 5 are diagrams sequentially showing a method of manufacturing a surface mounted electric device according to a first embodiment of the present invention.

6 is a diagram illustrating a step of inserting a conductive wire into a sheet resistance sheet.

7 and 8 are views for explaining a step of preparing a sheet resistance sheet.

9 is a diagram illustrating another example of the process of preparing a sheet resistance sheet.

10 to 13 are diagrams sequentially showing a method of manufacturing a surface mounted electric device according to a second embodiment of the present invention.

FIG. 14 is a diagram showing a modification of the electrical device shown in FIG. 13. FIG.

15 to 20 are diagrams sequentially showing a method of manufacturing a surface mount electric device according to a third embodiment of the present invention.

FIG. 21 is a view showing a modification of the electrical device shown in FIG. 20;

FIG. 22 shows yet another modification of the electrical apparatus shown in FIG. 20;

<Explanation of symbols for the main parts of the drawings>

10,100,100a, 110,110a, 110b..Surface Mount Electric Device

12,14,16..Cutting line 20.Sheet resistance sheet (element) 22.First surface

24. Second surface 26. First side 28. Second side

30,30a, 35,35a, 130,130a, 135,135a..conductor 40..first conductive layer

42. First electrode 44. First additional electrode 46. First non-conductive gap

50. Second conductive layer 52. Second electrode 54. Second additional electrode

56. Second non-conductive gap 60, 62. Insulation layer 70 Solder layer

200..roll laminator

Claims (17)

(a) preparing a sheet resistance sheet having a plurality of conductive wires inserted in pairs at regular intervals and exposing the conductive wire pairs to the first and second surfaces, respectively; (b) forming first and second conductive layers, respectively, on the first and second surfaces of the sheet resistance sheet to be electrically connected to the pair of conductors; (c) removing a portion of the first and second conductive layers at a predetermined position between the pair of conductors to form a non-conductive gap; (d) cutting the thin sheet resistance sheet in a direction in which the wire pair is separated into respective wires; And (e) dividing the sheet resistance sheet in a direction perpendicular to the pair of wires to form a plurality of electric devices. The method of claim 1, The sheet resistance sheet is a surface-mounted electrical device manufacturing method using a conductive wire, characterized in that the conductive polymer having a positive temperature coefficient (PTC) characteristics. The method of claim 1, The pair of conductive wires each include an elastic material and a conductive metal coated on the outside of the elastic material. The method of claim 1, wherein step (a) comprises: Pressing the resistive material together with the plurality of wire pairs to form a sheet resistance sheet; And And polishing the first and second surfaces of the sheet resistance sheet to expose the pair of conductors. The method of claim 1, wherein in steps (a) and (b), The step of inserting the wire pairs into the sheet resistance sheet and the forming of the first and second conductive layers on the first and second surfaces of the sheet resistance sheet are simultaneously performed using a roll laminator. Surface-mounted electrical device manufacturing method using the conductor, characterized in that. The method of claim 1, wherein in step (c), Wherein the non-conductive gap is formed in the first conductive layer adjacent to one pair of conductors, the second conductive layer is a surface-mounted electrical device manufacturing method using a conductor, characterized in that formed in the vicinity of the adjacent pair of conductors. . The method according to any one of claims 1 to 6, wherein after step (c), Applying an insulating layer to at least a portion of the non-conductive gap and the first and second conductive layers; And And forming a solder layer on the surfaces of the first and second conductive layers not coated with the insulating layer. The method of claim 7, wherein In the step (c), the first conductive layer is separated into a first electrode and a second electrode by the non-conductive gap, and the second conductive layer is separated into a second electrode and a second additional electrode by the non-conductive gap. Separate, And the insulating layer is applied only to a portion of the non-conductive gap and the first and second electrodes. (a) preparing a sheet resistance sheet in which a plurality of conductive wires are inserted at regular intervals and the conductive wires are exposed to the first and second surfaces; (b) forming first and second conductive layers, respectively, on the first and second surfaces of the sheet resistance sheet to be electrically connected to the conductive wires; (c) removing a portion of the first and second conductive layers at a predetermined position between the conductive lines to form a non-conductive gap; (d) cutting the sheet resistance sheet in a direction in which the exposed portions of the conductive wires are separated; And (e) dividing the sheet resistance sheet in a direction perpendicular to the conductive wire to make a plurality of electrical devices. The method of claim 9, The sheet resistance sheet is a surface-mounted electrical device manufacturing method using a conductive wire, characterized in that the conductive polymer having a positive temperature coefficient (PTC) characteristics. The method of claim 9, And the conductive wires each include an elastic material and a conductive metal coated on an outer surface of the elastic material. The method of claim 9, wherein step (a) comprises: Pressing the resistive material together with the plurality of conductors to form a sheet resistance sheet; And And polishing the first and second surfaces of the thin sheet resistance sheet to expose the conductive wires. The method of claim 9, wherein in steps (a) and (b), The step of inserting the conductive wire into the sheet resistance sheet and the step of forming the first and second conductive layers on the first and second surfaces of the sheet resistance sheet are performed simultaneously using a roll laminator. Surface-mounted electrical device manufacturing method using the conductive wire characterized in that. The method of claim 9, wherein in step (c), The non-conductive gap is formed in the first conductive layer adjacent to one of the conductive wires, the second conductive layer is a surface-mount type electrical device manufacturing method using a conductive line, characterized in that formed in the vicinity of the adjacent conductive wires. The method of claim 9, In the step (d), each wire is precisely bisected. The method according to any one of claims 9 to 15, wherein after step (c), Applying an insulating layer to at least a portion of the non-conductive gap and the first and second conductive layers; And And forming a solder layer on the surfaces of the first and second conductive layers not coated with the insulating layer. The method of claim 16, In the step (c), the first conductive layer is separated into a first electrode and a second electrode by the non-conductive gap, and the second conductive layer is separated into a second electrode and a second additional electrode by the non-conductive gap. Separate, And the insulating layer is applied only to a portion of the non-conductive gap and the first and second electrodes.