WO2018219065A1 - 阵列基板、阵列基板的维修方法、显示面板和显示装置 - Google Patents

阵列基板、阵列基板的维修方法、显示面板和显示装置 Download PDF

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Publication number
WO2018219065A1
WO2018219065A1 PCT/CN2018/084099 CN2018084099W WO2018219065A1 WO 2018219065 A1 WO2018219065 A1 WO 2018219065A1 CN 2018084099 W CN2018084099 W CN 2018084099W WO 2018219065 A1 WO2018219065 A1 WO 2018219065A1
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Prior art keywords
common electrode
electrode lead
signal line
array substrate
service connection
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PCT/CN2018/084099
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English (en)
French (fr)
Inventor
车璐
纪强强
刘国全
周强
魏晓梅
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/319,972 priority Critical patent/US10928693B2/en
Publication of WO2018219065A1 publication Critical patent/WO2018219065A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134318—Electrodes characterised by their geometrical arrangement having a patterned common electrode
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G02F1/136263—Line defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G02F1/136272—Auxiliary lines
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits

Definitions

  • Embodiments of the present disclosure relate to an array substrate, a method of repairing an array substrate, a display panel, and a display device.
  • TFT-LCD Thin Film Transistor Liquid Crystal Display
  • an array substrate including a substrate substrate and a common electrode layer, a common electrode lead mesh, a first metal layer, and a second metal layer disposed over the substrate substrate, the common electrode lead The mesh is electrically connected to the common electrode layer.
  • the first metal layer includes: a first signal line extending along the first direction;
  • the second metal layer includes: a second signal line extending in the second direction; and a plurality of service connection portions, each of the service connection portions having the A first overlapping portion of the signal line overlapping in a direction perpendicular to the substrate, and a second overlapping portion overlapping the common electrode lead net in a direction perpendicular to the substrate.
  • the common electrode lead mesh includes a first common electrode lead extending in the first direction and a second common electrode lead extending in the second direction, the second overlapping portion of each service connection portion being The first common electrode lead is overlapped in a direction perpendicular to the base substrate.
  • the array substrate includes a display area and a peripheral area surrounding the display area, and the plurality of service connection portions are disposed on the display area and the peripheral area of the array substrate.
  • each of the plurality of service connection portions extends in the second direction, and each of the plurality of service connection portions is spaced apart from the second signal line in the first direction.
  • the plurality of service connections are evenly distributed along the first direction.
  • the first signal line is a gate line or a data line
  • the second signal line is a data line or a gate line
  • a method of repairing an array substrate for repairing a first signal line break of the array substrate includes: selecting at least two service connections, the at least two service connections being respectively located on opposite sides of the disconnection position of the first signal line along the first direction; cutting the first from the common electrode lead wire a separation portion, the second overlapping portion of each of the selected service connection portions overlapping the first separation portion in a direction perpendicular to the base substrate; each of the selected service connection portions and the first A signal line is electrically connected to the first separation portion.
  • the array substrate further includes a pixel electrode layer
  • the maintenance method further includes: cutting a second separation from the pixel electrode layer overlapping the first separation portion in a direction perpendicular to the substrate substrate unit.
  • the common electrode lead mesh includes a first common electrode lead extending in the first direction and a second common electrode lead extending in the second direction, and cutting the first separation portion from the common electrode lead mesh includes : cutting the first separation portion from the first common electrode lead.
  • the first signal line is a gate line or a data line
  • the second signal line is a data line or a gate line
  • the electrically connecting each of the selected service connection portions to the first signal line and the first separation portion respectively includes: respectively selecting each of the selected service connection portions with the first signal line and The first separation portion is welded.
  • an array substrate including a substrate substrate and a common electrode layer, a common electrode lead mesh, a first metal layer, and a second metal layer disposed over the substrate substrate, the common electrode lead The mesh is electrically connected to the common electrode layer.
  • the first metal layer includes a first signal line extending in a first direction, the first signal line having an open circuit; the second metal layer includes a second signal line extending in the second direction and a plurality of service connections, each of the repairs
  • the connection portion has a first overlapping portion overlapping the first signal line in a direction perpendicular to the substrate substrate, and a second overlapping portion overlapping the common electrode lead net in a direction perpendicular to the substrate substrate;
  • the plurality of service connection portions includes at least two selected service connection portions, each of the at least two selected service connection portions being located on opposite sides of the disconnection position of the first signal line in the first direction, each selected a first overlapping portion of the fixed service connection portion is electrically connected to the first signal line, and a second overlapping portion of each of the selected service connection portions is electrically connected to the first separation portion, the common electrode lead wire including the The first separating portion and the first separating portion and the portion of the common electrode lead net other than the first separating portion are disconnected from each other.
  • the common electrode lead mesh includes a first common electrode lead extending in the first direction and a second common electrode lead extending in the second direction, and the first common electrode lead includes the first a separation portion and portions of the first separation portion and the first common electrode lead other than the first separation portion are disconnected from each other.
  • each of the plurality of service connection portions extends in the second direction, and each of the plurality of service connection portions is spaced apart from the second signal line in the first direction.
  • the plurality of service connections are evenly distributed along the first direction.
  • the first signal line is a gate line or a data line
  • the second signal line is a data line or a gate line
  • the array substrate further includes a pixel electrode layer including a second separation portion, and the second separation portion and portions of the pixel electrode layer other than the second separation portion are disconnected from each other.
  • a display panel including the array substrate as described above.
  • a display device including the display panel as described above.
  • FIG. 1 is a top plan view of an array substrate in accordance with an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view of an array substrate in accordance with an embodiment of the present disclosure
  • FIG. 3 is another schematic cross-sectional view of an array substrate in accordance with an embodiment of the present disclosure.
  • FIG. 4 is a schematic flow chart of a method of repairing an array substrate according to an embodiment of the present disclosure
  • FIG. 5 is another top view of an array substrate in accordance with an embodiment of the present disclosure.
  • FIG. 6 is another schematic cross-sectional view of an array substrate in accordance with an embodiment of the present disclosure.
  • the main component of the liquid crystal display is a liquid crystal display panel.
  • the liquid crystal display panel includes an array substrate, an opposite substrate disposed opposite to the array substrate, and a liquid crystal layer between the array substrate and the opposite substrate.
  • the array substrate of the liquid crystal display panel mainly includes: a base substrate and a first electrode layer, a first metal layer, a first insulating layer, an active layer, a second metal layer, and a second insulation sequentially disposed on the base substrate Layer and second electrode layer.
  • the first metal layer includes a gate line, a gate connected to the gate line, and a common electrode lead connected to the first electrode layer;
  • the second metal layer includes a data line, a source connected to the data line, and a source spaced from the source a drain is disposed;
  • the second electrode layer is connected to the drain of the second metal layer through a via on the second insulating layer; the gate, the active layer, the source and the drain constitute a thin film transistor.
  • a repair method may be adopted in which two via holes are formed in the second insulating layer of the array substrate, and the two via holes are located on both sides of the disconnected position of the gate line and penetrate to the side surface of the gate line away from the substrate substrate.
  • a wire is formed on the surface of the second insulating layer, and both ends of the wire are respectively located in the two via holes, thereby turning on the broken gate line.
  • the via Since the via has a certain depth, the wire is prone to break when extending from the surface of the second insulating layer to the inner wall of the via, so that the gate line cannot be turned on, resulting in maintenance failure.
  • a laser is usually used to open the via hole and the first metal layer is usually made of a metal such as copper having a high reflectance. When the laser is reflected by the first metal layer, it is highly likely that the first insulating layer and the second insulating layer are cracked.
  • Embodiments of the present disclosure provide an array substrate including a substrate substrate and a common electrode layer disposed on the substrate substrate, a common electrode lead mesh, a first metal layer, and a second metal layer, the common electrode lead mesh and The common electrode layer is electrically connected.
  • the first metal layer includes: a first signal line extending along the first direction;
  • the second metal layer includes: a second signal line extending in the second direction; and a plurality of service connection portions, each of the service connection portions having the A first overlapping portion of the signal line overlapping in a direction perpendicular to the substrate, and a second overlapping portion overlapping the common electrode lead net in a direction perpendicular to the substrate.
  • Embodiments of the present disclosure provide a method of repairing an array substrate for repairing a first signal line break of the array substrate as described above.
  • the method includes: selecting at least two service connection portions that are respectively located on both sides of a disconnection position of the first signal line along the first direction; and cutting a portion from a common electrode lead wire a separation portion, the second overlapping portion of each of the selected service connection portions overlapping the first separation portion in a direction perpendicular to the base substrate; each of the selected service connection portions is respectively associated with the The first signal line and the first separation portion are electrically connected.
  • Embodiments of the present disclosure also provide an array substrate including a substrate substrate and a common electrode layer disposed on the substrate substrate, a common electrode lead mesh, a first metal layer, and a second metal layer, the common electrode lead mesh Electrically connected to the common electrode layer.
  • the first metal layer includes a first signal line extending in the first direction, the first signal line having an open circuit;
  • the second metal layer includes a plurality of second signal lines extending in the second direction and a plurality of service connections, each The service connection portion has a first overlapping portion overlapping the first signal line in a direction perpendicular to the substrate substrate, and a second overlapping portion overlapping the common electrode lead net in a direction perpendicular to the substrate substrate;
  • the plurality of service connection portions includes at least two selected service connection portions, the at least two selected service connection portions being respectively located on opposite sides of the disconnection position of the first signal line in the first direction, each A first overlapping portion of the selected service connection portion is electrically connected to the first signal line, and a second overlapping portion of each of the selected service connection portions is electrically connected to the first separation portion, the common electrode lead wire including The first separating portion and the first separating portion and the portion of the common electrode lead net other than the first separating portion are disconnected from each other.
  • the disconnection of the first signal line can be reliably repaired, thereby improving the repair success rate of the array substrate.
  • the first metal layer is insulated from any one of the common electrode layer, the common electrode lead mesh, and the second metal layer, and the second metal layer and the common electrode layer, the common electrode lead mesh, and the first metal Any one of the layers is insulated.
  • the upper and lower positional relationship of the first metal layer and the second metal layer in the direction perpendicular to the substrate substrate is not limited.
  • the description will be made taking the case where the first metal layer is located below the second metal layer.
  • the upper and lower positional relationship of the common electrode layer, the common electrode lead mesh, the first metal layer, and the second metal layer in the direction perpendicular to the substrate is not limited, and may be set as needed.
  • the first embodiment of the present disclosure does not limit the first signal line and the second signal line.
  • the first signal line is a gate line or a data line
  • the second signal line is a data line or a gate line.
  • the first signal line and the second signal line may also be other wires than the gate line and the data line, such as a power line, a reset line, and the like.
  • the description will be made taking the case where the first signal line is the gate line and the second signal line is the data line.
  • an embodiment of the present disclosure provides an array substrate including a substrate substrate 1 and a common electrode layer 2 disposed on the substrate substrate 1, a common electrode lead mesh, and a first metal layer 3. And the second metal layer 4, the common electrode lead mesh is electrically connected to the common electrode layer 2.
  • the array substrate further includes a first insulating layer 6, and the first metal layer 3 and the second metal layer 4 are insulated from each other by the first insulating layer 6.
  • the first metal layer 3 includes gate lines 31 extending in the first direction.
  • the second metal layer 4 includes a data line 41 extending in the second direction and a plurality of service connection portions 42, each of the service connection portions 42 having a first overlap with the gate line 31 in a direction perpendicular to the base substrate 1.
  • the overlapping portion and the second overlapping portion overlapping the common electrode lead mesh in a direction perpendicular to the base substrate 1.
  • the common electrode lead mesh includes a first common electrode lead 32 extending in a first direction and a second common electrode lead 32' extending in the second direction, and a second overlapping portion of each of the service connection portions 42 is perpendicular to The first common electrode lead 32 is overlapped in the direction of the base substrate 1.
  • each of the service connection portions 42 extends in the second direction, and each of the service connection portions 42 is spaced apart from the data line 41 in the first direction.
  • the plurality of service connections 42 are evenly distributed along the first direction.
  • the array substrate includes a plurality of gate lines 31 and a plurality of data lines 41, the plurality of gate lines 31 and the plurality of data lines 41 intersecting each other to define a plurality of pixel units, each of the pixel units including a thin film transistor and a thin film transistor Pixel electrode layer.
  • the thin film transistor includes a gate, an active layer, a source, and a drain. The gate is connected or integrally formed with the gate line 31, and the source is connected or integrally formed with the data line 41, and the drain is connected to the pixel electrode layer.
  • a plurality of service connection portions 42 are provided in the first direction.
  • both the common electrode layer 2 and the first metal layer 3 are in direct contact with the base substrate 1, and the common electrode layer 2 and the first metal layer 3 are spaced apart from each other.
  • the common electrode lead mesh is formed of the same material and simultaneously with the gate line 31. That is, the common electrode lead mesh and the gate line 31 are simultaneously formed by the same patterning process.
  • the gate line 31 when the gate line 31 is broken, at least two service connection portions 42 are first selected, and the at least two service connection portions 42 are respectively located on the gate line 31 along the extending direction of the gate line 31.
  • the two sides of the disconnection position secondly, the first separation portion 321 is cut out from the common electrode lead net (for example, the first common electrode lead 32), and the second overlapping portion of each selected service connection portion 42 is the same
  • a separating portion 321 is overlapped in a direction perpendicular to the base substrate 1; finally, each of the selected service connecting portions 42 is electrically connected to the gate line 31 and the first separating portion 321 by, for example, soldering.
  • the gate lines 31 on both sides of the disconnection position are reliably turned on, and the repair success rate of the array substrate is improved.
  • the first metal layer 3 further includes a gate connected to the gate line 31, and the second metal layer 4 further includes a source connected to the data line 41, and a drain spaced apart from the source.
  • the specific type of the service connection portion 42 is not limited, and may be, for example, a line-shaped service connection portion or a sheet-shaped service connection portion.
  • the cross-sectional shape of the service connecting portion 42 is not limited and may be, for example, rectangular, circular, triangular or trapezoidal.
  • the array substrate includes a display area and a peripheral area surrounding the display area, and the plurality of gate lines 31 and the plurality of data lines 41 cross each other to define a plurality of pixel units located in the display area, and the plurality of service connection portions 42 are distributed on the display area of the array substrate And the surrounding area.
  • each of the pixel units includes a display area and a non-display area outside the display area, the common electrode layer 2 is located in the display area, and the gate line 31 and the data line 41 are located in the non-display area.
  • each of the service connection portions 42 extends from the display area of the pixel unit to the non-display area.
  • the maintenance connection portion 42 closest to the gate line 31 on both sides of the disconnection position can be preferentially selected for maintenance, so that the maintenance area of the array substrate is small.
  • the array substrate further includes a second insulating layer 8 and a pixel electrode layer 5 which are sequentially disposed over the second metal layer 4.
  • the array substrate includes a base substrate 1, and a common electrode layer 2, a first metal layer 3, a first insulating layer 6, an active layer 7, and a second layer which are sequentially disposed on the base substrate 1.
  • the second insulating layer 8 has a via hole (not shown), and the pixel electrode layer 5 is connected to the drain included in the second metal layer 4 through the via hole.
  • Embodiments of the present disclosure also provide a display panel including the array substrate as described above.
  • the at least two service connection portions 42 are first selected, and the at least two service connection portions 42 are respectively located along the gate line 31 in the extending direction of the gate line 31.
  • the gate lines 31 on both sides of the disconnection position are reliably turned on, and the repair success rate of the array substrate is improved.
  • Embodiments of the present disclosure also provide a display device including the display panel as described above.
  • the display device provided by the embodiment of the present disclosure when the array substrate used in the display panel is broken, the success rate of the repair is high.
  • the embodiment of the present disclosure is not limited to a specific type of display device, and may be, for example, a liquid crystal television set, a liquid crystal display device, a digital photo frame, an electronic paper, a mobile phone, or the like.
  • the embodiment of the present disclosure further provides a method for repairing the open circuit of the gate line 31 of the array substrate of the foregoing embodiment.
  • the method includes:
  • Step 101 Select at least two service connection portions 42 respectively located on opposite sides of the disconnection position of the gate line 31 in the first direction;
  • Step 102 cutting out the first separating portion 321 from the common electrode lead wire, and the second overlapping portion of each selected service connecting portion 42 overlaps with the first separating portion 321 in a direction perpendicular to the base substrate 1;
  • Step 103 Each selected service connection portion 42 is electrically connected to the gate line 31 and the first separation portion 321, respectively.
  • the gate line 31 when the gate line 31 is broken, at least two service connection portions 42 are first selected, and the at least two service connection portions 42 are respectively located at the opening of the gate line 31 along the extending direction of the gate line 31.
  • the portions 321 are overlapped in a direction perpendicular to the base substrate 1; finally, each of the selected service connection portions 42 is electrically connected to the gate lines 31 and the first separation portions 321 by, for example, soldering.
  • the gate lines 31 on both sides of the disconnection position are reliably turned on, and the repair success rate of the array substrate is improved.
  • the array substrate further includes a second insulating layer 8 and a pixel electrode layer 5 which are sequentially disposed over the second metal layer 4, and the above maintenance method further includes: cutting from the pixel electrode layer 5 with the first separating portion 321 The second separation portion 5' that is perpendicular to the direction of the base substrate 1 is overlapped. In this way, an electric field can be prevented from being formed between the first separation portion 321 of the common electrode lead 32 and the pixel electrode layer 5, thereby improving the display effect of the display panel.
  • the second separation portion 5' has a relatively large area, for example, the first separation portion 321 is on the base substrate.
  • the orthographic projection on 1 is located within the orthographic projection of the second separation portion 5' on the base substrate 1.
  • the second separation portion 5' has a relatively small area, for example, the orthographic projection of the first separation portion 321 on the base substrate 1 and the second separation portion 5' on the base substrate 1.
  • the orthographic projections are completely coincident.
  • each of the selected service connection portions 42 is electrically connected to the gate line 31 and the first separation portion 321 by welding, respectively.
  • the welding method is not limited and may be laser welding, electric welding or gas welding.
  • the common electrode lead mesh includes a first common electrode lead 32 extending in a first direction and a second common electrode lead 32' extending in a second direction, and in step 102, is cut out from the first common electrode lead 32 The first separating unit 321 .
  • the array substrate includes the base substrate 1, and the common electrode layer 2, the first metal layer 3, and the second metal layer 4 which are sequentially disposed on the base substrate 1, and the gate lines are found after the formation of the second metal layer 4
  • the maintenance method includes: selecting at least two service connection portions 42 according to the disconnection position of the gate line 31, the at least two service connection portions 42 being respectively located at the disconnection position of the gate line 31 along the extending direction of the gate line 31.
  • the first separating portion 321 is cut out from the common electrode lead wire, and the second overlapping portion of each of the selected service connecting portions 42 overlaps with the first separating portion 321 in a direction perpendicular to the base substrate 1;
  • the selected service connection portions 42 are respectively soldered to the gate lines 31 and the first separation portion 321, and the repaired array substrate is as shown in FIG.
  • the array substrate further includes a second insulating layer 8 and a pixel electrode layer 5 which are sequentially disposed on the second metal layer 4.
  • the maintenance method includes: At the break point position of the line 31, at least two service connection portions 42 are selected, which are respectively located on both sides of the disconnection position of the gate line 31 along the extending direction of the gate line 31; cut from the common electrode lead wire Out of the first separating portion 321, the second overlapping portion of each selected service connecting portion 42 overlaps with the first separating portion 321 in a direction perpendicular to the base substrate 1; each selected service connecting portion 42 is respectively Welding with the gate line 31 and the first separation portion 321; cutting out the second separation portion 5' overlapping the first separation portion 321 in the direction perpendicular to the base substrate 1 from the pixel electrode layer 5, the array substrate after repair As shown in Figure 6.
  • an embodiment of the present disclosure further provides an array substrate including a substrate substrate 1 and a common electrode layer 2 disposed on the substrate substrate 1 , a common electrode lead mesh, and a first metal layer. 3 and the second metal layer 4, the common electrode lead mesh is electrically connected to the common electrode layer 2.
  • the array substrate further includes a first insulating layer 6, and the first metal layer 3 and the second metal layer 4 are insulated from each other by the first insulating layer 6.
  • the first metal layer 3 includes a gate line 31 extending in a first direction, the gate line having an open circuit.
  • the second metal layer 4 includes a second signal line 41 extending in the second direction and a plurality of service connection portions 42, each of which has a overlap with the gate line 31 in a direction perpendicular to the base substrate 1.
  • the first overlapping portion and the second overlapping portion overlapping the common electrode lead mesh in a direction perpendicular to the base substrate 1.
  • the plurality of service connection portions 42 include at least two selected service connection portions 42 that are respectively located on opposite sides of the disconnection position of the gate line 31 in the first direction, each selected The first overlapping portion of the fixed service connection portion 42 is electrically connected to the gate line 31, and the second overlapping portion of each of the selected service connection portions 42 is electrically connected to the first separation portion 321, which includes the The first separation portion 321 and the first separation portion 321 and portions of the common electrode lead mesh other than the first separation portion 321 are disconnected from each other.
  • the common electrode lead mesh includes a first common electrode lead 32 extending in a first direction and a second common electrode lead 32 ′ extending in a second direction, and the first common electrode lead 32 includes a first separation portion 321 and first The portions of the first common electrode lead 32 other than the first separating portion 321 are disconnected from each other.
  • the array substrate further includes a pixel electrode layer 5 including the second separation portion 5', and the second separation portion 5' and the portion of the pixel electrode layer 5 other than the second separation portion 5' are disconnected from each other .
  • the above array substrate is an array substrate which has been repaired by the maintenance method as in the foregoing embodiment.

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Abstract

一种阵列基板、阵列基板的维修方法、显示面板和显示装置。阵列基板包括衬底基板(1)以及设置在衬底基板(1)之上的公共电极层(2)、公共电极引线网、第一金属层(3)和第二金属层(4)，公共电极引线网与公共电极层(2)电连接。第一金属层(3)包括沿第一方向延伸的第一信号线(31)；第二金属层包括：沿第二方向延伸的第二信号线(41)以及多个维修连接部(42)，每个维修连接部(42)具有与第一信号线(31)在垂直于衬底基板(1)的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板(1)的方向上重叠的第二重叠部分。

Description

阵列基板、阵列基板的维修方法、显示面板和显示装置
本申请要求于2017年5月27日递交的第201710393686.9号中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及阵列基板、阵列基板的维修方法、显示面板和显示装置。
背景技术
薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display，简称TFT-LCD)具有体积小、功耗低、制造成本相对较低和无辐射等特点，在当前的平板显示器市场占据了主导地位。
发明内容
根据本公开的实施例，提供一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接。第一金属层包括：沿第一方向延伸的第一信号线；第二金属层包括：沿第二方向延伸的第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与所述公共电极引线网在垂直于衬底基板的方向上重叠的第二重叠部分。
例如，所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，每个维修连接部的所述第二重叠部分在垂直于衬底基板的方向上与所述第一公共电极引线重叠。
例如，阵列基板包括显示区域和围绕显示区域的周边区域，所述多个维修连接部分布于所述阵列基板的显示区域和周边区域。
例如，所述多个维修连接部的每个沿所述第二方向延伸，并且所述多个 维修连接部的每个与所述第二信号线沿所述第一方向间隔开。
例如，所述多个维修连接部沿所述第一方向均匀分布。
例如，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
根据本公开的实施例，提供一种阵列基板的维修方法，用于对如上所述的阵列基板的第一信号线断路进行维修。该方法包括：选定至少两个维修连接部，该至少两个维修连接部沿所述第一方向分别位于所述第一信号线的断路位置的两侧；从公共电极引线网上切割出第一分离部，每个选定的维修连接部的所述第二重叠部分在垂直于衬底基板的方向上与所述第一分离部重叠；将每个选定的维修连接部分别与所述第一信号线和所述第一分离部电连接。
例如，所述阵列基板还包括像素电极层，并且所述维修方法还包括：从所述像素电极层上切割出与所述第一分离部在垂直于衬底基板的方向上重叠的第二分离部。
例如，所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，并且从公共电极引线网上切割出第一分离部包括：从所述第一公共电极引线上切割出所述第一分离部。
例如，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
例如，所述将每个选定的维修连接部分别与所述第一信号线和所述第一分离部电连接包括：将每个选定的维修连接部分别与所述第一信号线和所述第一分离部焊接。
根据本公开的实施例，提供一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接。第一金属层包括沿第一方向延伸的第一信号线，所述第一信号线具有断路；第二金属层包括沿第二方向延伸的第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板的方向上重叠的第二重叠部分；所述多个维修连接部包括至少两个选定的维修连接部，该至少两个选定的维修连接部沿所述第一方向 分别位于所述第一信号线的断路位置的两侧，每个选定的维修连接部的第一重叠部分与所述第一信号线电连接，每个选定的维修连接部的第二重叠部分与第一分离部电连接，所述公共电极引线网包括所述第一分离部并且所述第一分离部与所述公共电极引线网的除所述第一分离部之外的部分彼此断开。
例如，所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，并且所述第一公共电极引线包括所述第一分离部并且所述第一分离部与所述第一公共电极引线的除所述第一分离部之外的部分彼此断开。
例如，所述多个维修连接部的每个沿所述第二方向延伸，并且所述多个维修连接部的每个与所述第二信号线沿所述第一方向间隔开。
例如，所述多个维修连接部沿所述第一方向均匀分布。
例如，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
例如，阵列基板还包括像素电极层，所述像素电极层包括第二分离部，所述第二分离部与所述像素电极层的除所述第二分离部之外的部分彼此断开。
根据本公开的实施例，提供一种显示面板，该显示面板包括如上所述的阵列基板。
根据本公开的实施例，提供一种显示装置，该显示装置包括如上所述的显示面板。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为根据本公开实施例的阵列基板的俯视图；
图2为根据本公开实施例的阵列基板的截面示意图；
图3为根据本公开实施例的阵列基板的另一截面示意图；
图4为根据本公开实施例的阵列基板的维修方法的流程示意图；
图5为根据本公开实施例的阵列基板的另一俯视图；并且
图6为根据本公开实施例的阵列基板的另一截面示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
液晶显示器的主要部件为液晶显示面板，液晶显示面板包括：阵列基板、与阵列基板相对设置的对置基板、以及位于阵列基板与对置基板之间的液晶层。例如，液晶显示面板的阵列基板主要包括：衬底基板和在衬底基板上依次设置的第一电极层、第一金属层、第一绝缘层、有源层、第二金属层、第二绝缘层和第二电极层。例如，第一金属层包括栅线、与栅线连接的栅极，以及与第一电极层连接的公共电极引线；第二金属层包括数据线、与数据线连接的源极和与源极间隔设置的漏极；第二电极层通过第二绝缘层上的过孔与第二金属层的漏极连接；栅极、有源层、源极和漏极构成薄膜晶体管。
在阵列基板的制作过程中，受制作工艺条件的限制，灰尘等异物颗粒不可避免地会粘附在第一金属层远离衬底基板的一侧表面，这些异物颗粒有可能刺穿第一绝缘层，造成第一绝缘层破损。在制作第二金属层时，刻蚀液会从第一绝缘层的破损处流入并腐蚀第一金属层，从而导致栅线断路。
例如，可以采用的维修方法为：在阵列基板的第二绝缘层开设两个过孔，这两个过孔位于栅线断开位置的两侧并穿通至栅线远离衬底基板的一侧表面；在第二绝缘层表面形成导线，导线的两端分别位于前述两个过孔内，从而将断开的栅线导通。
由于过孔具有一定的深度，导线在从第二绝缘层表面延伸到过孔内壁时易产生断裂，从而无法将栅线导通，导致维修失败。此外，通常采用激光开设过孔并且第一金属层通常采用反射率较高的铜等金属，激光经第一金属层 反射后极有可能造成第一绝缘层和第二绝缘层崩裂。
本公开的实施例提供一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接。第一金属层包括：沿第一方向延伸的第一信号线；第二金属层包括：沿第二方向延伸的第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与所述公共电极引线网在垂直于衬底基板的方向上重叠的第二重叠部分。
本公开的实施例提供一种阵列基板的维修方法，用于对如上所述的阵列基板的第一信号线断路进行维修。所述方法包括：选定至少两个维修连接部，该至少两个维修连接部沿所述第一方向分别位于所述第一信号线的断路位置的两侧；从公共电极引线网上切割出第一分离部，每个选定的维修连接部的所述第二重叠部分在垂直于衬底基板的方向上与所述第一分离部重叠；将每个选定的维修连接部分别与所述第一信号线和所述第一分离部电连接。
本公开的实施例还提供一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接。第一金属层包括沿第一方向延伸的第一信号线，所述第一信号线具有断路；第二金属层包括沿第二方向延伸的多个第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板的方向上重叠的第二重叠部分；所述多个维修连接部包括至少两个选定的维修连接部，该至少两个选定的维修连接部沿所述第一方向分别位于所述第一信号线的断路位置的两侧，每个选定的维修连接部的第一重叠部分与所述第一信号线电连接，每个选定的维修连接部的第二重叠部分与第一分离部电连接，所述公共电极引线网包括所述第一分离部并且所述第一分离部与所述公共电极引线网的除所述第一分离部之外的部分彼此断开。
在根据本公开实施例的阵列基板及维修方法中，可以可靠地对第一信号 线的断路进行维修，从而提高了阵列基板的维修成功率。
需要说明的是，根据需要，第一金属层与公共电极层、公共电极引线网和第二金属层中的任一个绝缘，并且第二金属层与公共电极层、公共电极引线网和第一金属层中的任一个绝缘。
需要说明的是，本公开实施例对第一金属层和第二金属层在垂直于衬底基板方向上的上下位置关系不做限定。例如，在下面的描述中，以第一金属层位于第二金属层下方为例进行描述。
需要说明的是，本公开实施例对公共电极层、公共电极引线网、第一金属层和第二金属层在垂直于衬底基板方向上的上下位置关系不做限定，可以根据需要进行设置。
需要说明的是，本公开实施例对第一信号线和第二信号线不做限制。例如，第一信号线为栅线或数据线，第二信号线为数据线或栅线。例如，第一信号线和第二信号线还可以是除栅线和数据线之外的其他电线，诸如电源线、复位线等。例如，在下面的描述中，以第一信号线为栅线且第二信号线为数据线为例进行描述。
下面，将结合附图对本公开的实施例进行详细描述。
如图1和图2所示，本公开实施例提供了一种阵列基板，包括衬底基板1以及设置在衬底基板1之上的公共电极层2、公共电极引线网、第一金属层3和第二金属层4，公共电极引线网与公共电极层2电连接。
例如，阵列基板还包括第一绝缘层6，第一金属层3和第二金属层4通过第一绝缘层6而彼此绝缘。
例如，第一金属层3包括沿第一方向延伸的栅线31。
例如，第二金属层4包括沿第二方向延伸的数据线41以及多个维修连接部42，每个维修连接部42具有与栅线31在垂直于衬底基板1的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板1的方向上重叠的第二重叠部分。
例如，公共电极引线网包括沿第一方向延伸的第一公共电极引线32和沿 所述第二方向延伸的第二公共电极引线32’，每个维修连接部42的第二重叠部分在垂直于衬底基板1的方向上与第一公共电极引线32重叠。
例如，每个维修连接部42沿第二方向延伸，并且每个维修连接部42与数据线41沿第一方向间隔开。
例如，多个维修连接部42沿第一方向均匀分布。
例如，阵列基板包括多条栅线31和多条数据线41，该多条栅线31和多条数据线41彼此交叉限定多个像素单元，每个像素单元包括薄膜晶体管和与薄膜晶体管连接的像素电极层。薄膜晶体管包括栅极、有源层、源极和漏极。栅极与栅线31连接或一体形成，源极与数据线41连接或一体形成，漏极与像素电极层连接。
例如，针对每条栅线31，沿第一方向设置多个维修连接部42。
例如，公共电极层2与第一金属层3均与衬底基板1直接接触，且公共电极层2与第一金属层3彼此间隔开。
例如，公共电极引线网与栅线31同材料且同时形成。也就是，公共电极引线网与栅线31通过同一次构图工艺同时形成。
在本公开实施例提供的阵列基板中，当栅线31发生断路时，首先选定至少两个维修连接部42，该至少两个维修连接部42沿栅线31的延伸方向分别位于栅线31的断路位置的两侧；其次从公共电极引线网(例如，第一公共电极引线32)上切割出第一分离部321，且每个选定的维修连接部42的第二重叠部分与该第一分离部321在垂直于衬底基板1的方向上重叠；最后将每个选定的维修连接部42分别与栅线31和第一分离部321通过例如焊接的方式电连接。这样一来，可靠地使断路位置两侧的栅线31导通，提高阵列基板的维修成功率。
例如，第一金属层3还包括与栅线31连接的栅极，第二金属层4还包括与数据线41连接的源极，以及与源极间隔设置的漏极。
在本公开的实施例中，维修连接部42的具体类型不限，例如可以为线状维修连接部或片状维修连接部。维修连接部42的截面形状不限，例如可以为 矩形、圆形、三角形或梯形。
例如，阵列基板包括显示区域和围绕显示区域的周边区域，多条栅线31和多条数据线41彼此交叉限定多个像素单元位于显示区域，多个维修连接部42分布于阵列基板的显示区域和周边区域。
例如，如图1所示，每个像素单元包括显示区域和位于显示区域之外的非显示区域，公共电极层2位于显示区域，栅线31和数据线41位于非显示区域。例如，每个维修连接部42从像素单元的显示区域延伸至非显示区域。
例如，当栅线31出现断路时，可以优先选择与断路位置两侧的栅线31距离最近的维修连接部42来实施维修，从而使阵列基板的维修区域较小。
例如，阵列基板还包括在第二金属层4之上依次设置的第二绝缘层8和像素电极层5。例如，如图3所示，阵列基板包括衬底基板1，以及在衬底基板1上依次设置的公共电极层2、第一金属层3、第一绝缘层6、有源层7、第二金属层4、第二绝缘层8和像素电极层5。例如，第二绝缘层8具有过孔(图中未示出)，像素电极层5通过过孔与第二金属层4所包括的漏极连接。
本公开实施例还提供了一种显示面板，包括如上所述的阵列基板。
本公开实施例提供的显示面板，当其阵列基板发生栅线31断路时，首先选定至少两个维修连接部42，该至少两个维修连接部42沿栅线31的延伸方向分别位于栅线31的断路位置的两侧；其次从公共电极引线网(例如，第一公共电极引线32)上切割出第一分离部321，且每个选定的维修连接部42的第二重叠部分与该第一分离部321在垂直于衬底基板1的方向上重叠；最后将每个选定的维修连接部42分别与栅线31和第一分离部321通过例如焊接的方式电连接。这样一来，可靠地使断路位置两侧的栅线31导通，提高阵列基板的维修成功率。
本公开实施例还提供了一种显示装置，包括如上所述的显示面板。本公开实施例提供的显示装置，其显示面板采用的阵列基板发生栅线31断路时，维修成功率较高。
本公开实施例对显示装置的具体类型不限，例如可以为液晶电视机、液 晶显示器件、数码相框、电子纸、手机等。
如图4所示，本公开实施例还提供了一种对前述实施例的阵列基板的栅线31断路进行维修的方法。例如，该方法包括：
步骤101、选定至少两个维修连接部42，该至少两个维修连接部42沿第一方向分别位于栅线31的断路位置的两侧；
步骤102、从公共电极引线网上切割出第一分离部321，每个选定的维修连接部42的第二重叠部分在垂直于衬底基板1的方向上与第一分离部321重叠；
步骤103、将每个选定的维修连接部42分别与栅线31和第一分离部321电连接。
本公开实施例提供的维修方法，当栅线31出现断路时，首先选定至少两个维修连接部42，该至少两个维修连接部42沿栅线31的延伸方向分别位于栅线31的断路位置的两侧；其次从公共电极引线网(例如，第一公共电极引线32)上切割出第一分离部321，且每个选定的维修连接部42的第二重叠部分与该第一分离部321在垂直于衬底基板1的方向上重叠；最后将每个选定的维修连接部42分别与栅线31和第一分离部321通过例如焊接的方式电连接。这样一来，可靠地使断路位置两侧的栅线31导通，提高阵列基板的维修成功率。
例如，阵列基板还包括在第二金属层4之上依次设置的第二绝缘层8和像素电极层5，并且上述维修方法还包括：从像素电极层5上切割出与第一分离部321在垂直于衬底基板1的方向上重叠的第二分离部5’。这样一来，可以防止在公共电极引线32的第一分离部321与像素电极层5之间形成电场，从而改善了显示面板的显示效果。
例如，处于防止在公共电极引线32的第一分离部321与像素电极层5之间形成电场的目的，希望第二分离部5’具有比较大的面积，例如第一分离部321在衬底基板1上的正投影位于第二分离部5’在衬底基板1上的正投影之内。
例如，处于增加显示区域的目的，希望第二分离部5’具有比较小的面积，例如第一分离部321在衬底基板1上的正投影与第二分离部5’在衬底基板1上的正投影完全重合。
例如，在步骤103中，将每个选定的维修连接部42分别与栅线31和第一分离部321通过焊接的方式进行电连接。例如，焊接方式不限，可以为激光焊、电焊或气焊。
例如，公共电极引线网包括沿第一方向延伸的第一公共电极引线32和沿第二方向延伸的第二公共电极引线32’，并且在步骤102中，从第一公共电极引线32上切割出第一分离部321。
例如，阵列基板包括衬底基板1，以及在衬底基板1上依次设置的公共电极层2、第一金属层3和第二金属层4，当在第二层金属层4形成后发现栅线出现断路时，维修方法包括：根据栅线31的断路位置，选定至少两个维修连接部42，该至少两个维修连接部42沿栅线31的延伸方向分别位于栅线31的断路位置的两侧；从公共电极引线网上切割出第一分离部321，每个选定的维修连接部42的第二重叠部分与第一分离部321在垂直于衬底基板1的方向上重叠；将每个选定的维修连接部42分别与栅线31和第一分离部321焊接，维修后的阵列基板如图5所示。
例如，阵列基板还包括依次设置于第二金属层4之上的第二绝缘层8和像素电极层5，当在像素电极层5形成后发现栅线31出现断路时，维修方法包括：根据栅线31的断点位置，选定至少两个维修连接部42，该至少两个维修连接部42沿栅线31的延伸方向分别位于栅线31的断路位置的两侧；从公共电极引线网上切割出第一分离部321，每个选定的维修连接部42的第二重叠部分与第一分离部321在垂直于衬底基板1的方向上重叠；将每个选定的维修连接部42分别与栅线31和第一分离部321焊接；从像素电极层5上切割出与第一分离部321在垂直于衬底基板1的方向上重叠的第二分离部5’，维修后的阵列基板如图6所示。
如图5和图6所示，本公开实施例还提供了一种阵列基板，包括衬底基 板1以及设置在衬底基板1之上的公共电极层2、公共电极引线网、第一金属层3和第二金属层4，公共电极引线网与公共电极层2电连接。
例如，阵列基板还包括第一绝缘层6，第一金属层3和第二金属层4通过第一绝缘层6而彼此绝缘。
例如，第一金属层3包括沿第一方向延伸的栅线31，所述栅线具有断路。
例如，第二金属层4包括沿第二方向延伸的第二信号线41以及多个维修连接部42，每个维修连接部42具有与栅线31在垂直于衬底基板1的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板1的方向上重叠的第二重叠部分。
例如，多个维修连接部42包括至少两个选定的维修连接部42，该至少两个选定的维修连接部42沿第一方向分别位于栅线31的断路位置的两侧，每个选定的维修连接部42的第一重叠部分与栅线31电连接，每个选定的维修连接部42的第二重叠部分与第一分离部321电连接，所述公共电极引线网包括所述第一分离部321并且所述第一分离部321与所述公共电极引线网的除所述第一分离部321之外的部分彼此断开。
例如，公共电极引线网包括沿第一方向延伸的第一公共电极引线32和沿第二方向延伸的第二公共电极引线32’，并且第一公共电极引线32包括第一分离部321并且第一分离部321与第一公共电极引线32的除第一分离部321之外的部分彼此断开。
例如，阵列基板还包括像素电极层5，像素电极层5包括第二分离部5’，并且第二分离部5’与像素电极层5的除第二分离部5’之外的部分彼此断开。
例如，上述阵列基板为采用如前述实施例的维修方法维修后的阵列基板。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (19)

  1. 一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接，其中，
    第一金属层包括：沿第一方向延伸的第一信号线；
    第二金属层包括：沿第二方向延伸的第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与所述公共电极引线网在垂直于衬底基板的方向上重叠的第二重叠部分。
  2. 如权利要求1所述的阵列基板，其中，所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，每个维修连接部的所述第二重叠部分在垂直于衬底基板的方向上与所述第一公共电极引线重叠。
  3. 如权利要求1或2所述的阵列基板，包括显示区域和围绕显示区域的周边区域，其中，所述多个维修连接部分布于所述阵列基板的显示区域和周边区域。
  4. 如权利要求1或2所述的阵列基板，其中，所述多个维修连接部的每个沿所述第二方向延伸，并且所述多个维修连接部的每个与所述第二信号线沿所述第一方向间隔开。
  5. 如权利要求1或2所述的阵列基板，其中，所述多个维修连接部沿所述第一方向均匀分布。
  6. 如权利要求1-5任一项所述的阵列基板，其中，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
  7. 一种阵列基板的维修方法，用于对如权利要求1所述的阵列基板的第一信号线断路进行维修，包括：
    选定至少两个维修连接部，该至少两个维修连接部沿所述第一方向分别位于所述第一信号线的断路位置的两侧；
    从公共电极引线网上切割出第一分离部，每个选定的维修连接部的所述第二重叠部分在垂直于衬底基板的方向上与所述第一分离部重叠；
    将每个选定的维修连接部分别与所述第一信号线和所述第一分离部电连接。
  8. 如权利要求7所述的维修方法，其中，所述阵列基板还包括像素电极层，并且所述维修方法还包括：从所述像素电极层上切割出与所述第一分离部在垂直于衬底基板的方向上重叠的第二分离部。
  9. 如权利要求7所述的维修方法，其中，
    所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，并且
    从公共电极引线网上切割出第一分离部包括：从所述第一公共电极引线上切割出所述第一分离部。
  10. 如权利要求7-9任一项所述的维修方法，其中，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
  11. 如权利要求7-10任一项所述的维修方法，其中，所述将每个选定的维修连接部分别与所述第一信号线和所述第一分离部电连接包括：将每个选定的维修连接部分别与所述第一信号线和所述第一分离部焊接。
  12. 一种阵列基板，包括衬底基板以及设置在衬底基板之上的公共电极层、公共电极引线网、第一金属层和第二金属层，所述公共电极引线网与所述公共电极层电连接，其中：
    第一金属层包括沿第一方向延伸的第一信号线，所述第一信号线具有断路；
    第二金属层包括沿第二方向延伸的第二信号线以及多个维修连接部，每个维修连接部具有与所述第一信号线在垂直于衬底基板的方向上重叠的第一重叠部分，以及与公共电极引线网在垂直于衬底基板的方向上重叠的第二重 叠部分；
    所述多个维修连接部包括至少两个选定的维修连接部，该至少两个选定的维修连接部沿所述第一方向分别位于所述第一信号线的断路位置的两侧，每个选定的维修连接部的第一重叠部分与所述第一信号线电连接，每个选定的维修连接部的第二重叠部分与第一分离部电连接，所述公共电极引线网包括所述第一分离部并且所述第一分离部与所述公共电极引线网的除所述第一分离部之外的部分彼此断开。
  13. 根据权利要求12所述的阵列基板，其中，
    所述公共电极引线网包括沿所述第一方向延伸的第一公共电极引线和沿所述第二方向延伸的第二公共电极引线，并且
    所述第一公共电极引线包括所述第一分离部并且所述第一分离部与所述第一公共电极引线的除所述第一分离部之外的部分彼此断开。
  14. 如权利要求12或13所述的阵列基板，其中，所述多个维修连接部的每个沿所述第二方向延伸，并且所述多个维修连接部的每个与所述第二信号线沿所述第一方向间隔开。
  15. 如权利要求12或13所述的阵列基板，其中，所述多个维修连接部沿所述第一方向均匀分布。
  16. 如权利要求12-15任一项所述的阵列基板，其中，所述第一信号线为栅线或数据线，并且所述第二信号线为数据线或栅线。
  17. 如权利要求12-16任一项所述的阵列基板，还包括像素电极层，其中，所述像素电极层包括第二分离部，所述第二分离部与所述像素电极层的除所述第二分离部之外的部分彼此断开。
  18. 一种显示面板，包括如权利要求1-6及12-17任一项所述的阵列基板。
  19. 一种显示装置，其中，包括如权利要求18所述的显示面板。
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CN107179640B (zh) * 2017-05-27 2020-07-07 京东方科技集团股份有限公司 阵列基板、阵列基板的维修方法、显示面板和显示装置
CN108710245B (zh) * 2018-05-22 2021-01-26 京东方科技集团股份有限公司 显示基板及其修复方法、显示面板
CN108873529B (zh) * 2018-07-27 2021-04-02 京东方科技集团股份有限公司 一种阵列基板及其修复方法、显示面板
CN110797350B (zh) * 2019-11-01 2021-12-03 深圳市华星光电半导体显示技术有限公司 一种阵列基板及oled显示面板
CN111665670B (zh) * 2020-06-29 2022-05-31 武汉华星光电技术有限公司 阵列基板和显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094081A1 (en) * 2000-08-30 2005-05-05 Lee Joun H. Plane switching mode liquid crystal display device and method for manufacturing the same
CN101666948A (zh) * 2008-09-03 2010-03-10 北京京东方光电科技有限公司 Tft-lcd像素结构、制造方法和断线修复方法
CN102289120A (zh) * 2011-07-25 2011-12-21 深圳市华星光电技术有限公司 Tft阵列基板、液晶显示面板及配线修补方法
CN102650784A (zh) * 2012-01-21 2012-08-29 京东方科技集团股份有限公司 一种阵列基板、液晶显示器件及其修复方法
CN107179640A (zh) * 2017-05-27 2017-09-19 京东方科技集团股份有限公司 阵列基板、阵列基板的维修方法、显示面板和显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100318537B1 (ko) * 1999-03-19 2001-12-22 윤종용 액정 표시 장치용 박막 트랜지스터 기판 및 그 수리 방법
TWI387825B (zh) * 2009-04-17 2013-03-01 Chunghwa Picture Tubes Ltd 具修補結構之顯示面板及修補顯示面板之方法
CN101621063B (zh) * 2009-07-28 2011-07-06 上海广电光电子有限公司 阵列基板及其扫描线修复方法
CN201984264U (zh) * 2010-10-29 2011-09-21 北京京东方光电科技有限公司 薄膜晶体管阵列基板、液晶显示装置及已修复的阵列基板
US9312281B2 (en) 2011-07-25 2016-04-12 Shenzhen China Star Opoelectronics Technology Co., Ltd. TFT array substrate, LCD panel and wiring repairing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094081A1 (en) * 2000-08-30 2005-05-05 Lee Joun H. Plane switching mode liquid crystal display device and method for manufacturing the same
CN101666948A (zh) * 2008-09-03 2010-03-10 北京京东方光电科技有限公司 Tft-lcd像素结构、制造方法和断线修复方法
CN102289120A (zh) * 2011-07-25 2011-12-21 深圳市华星光电技术有限公司 Tft阵列基板、液晶显示面板及配线修补方法
CN102650784A (zh) * 2012-01-21 2012-08-29 京东方科技集团股份有限公司 一种阵列基板、液晶显示器件及其修复方法
CN107179640A (zh) * 2017-05-27 2017-09-19 京东方科技集团股份有限公司 阵列基板、阵列基板的维修方法、显示面板和显示装置

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