WO2016074286A1 - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
WO2016074286A1
WO2016074286A1 PCT/CN2014/092581 CN2014092581W WO2016074286A1 WO 2016074286 A1 WO2016074286 A1 WO 2016074286A1 CN 2014092581 W CN2014092581 W CN 2014092581W WO 2016074286 A1 WO2016074286 A1 WO 2016074286A1
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WO
WIPO (PCT)
Prior art keywords
pad
printed circuit
circuit board
pads
length
Prior art date
Application number
PCT/CN2014/092581
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English (en)
French (fr)
Inventor
符俭泳
李文东
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/426,747 priority Critical patent/US20160345435A1/en
Publication of WO2016074286A1 publication Critical patent/WO2016074286A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a printed circuit board, and more particularly to a printed circuit board compatible with electronic components of different sizes.
  • the formation of electronic components is formed according to the data sheet (Datesheet) provided by the supplier.
  • the data sheets are provided with specific electronic components.
  • the size (which includes the pin size, etc.) and the size of the pad, that is, one electronic component corresponds to one package.
  • the difference in size between the data sheets of two electronic components is small, it can be integrated into one package; but when the difference in pin size between two electronic components is too large, if they are also designed as a package at this time , too much solder paste is used when the part is hit, which causes the components to shift, resulting in poor writing.
  • an object of the present invention is to provide a printed circuit board including a board body, two sets of pads disposed on the board body and disposed adjacent to each other in a first direction, each of which The group pad includes first and second pads disposed adjacent in a second direction perpendicular to the first direction, wherein the first pad and the second pad have different specifications.
  • first pad and the second pad each have a rectangular shape.
  • the length of the first pad is smaller than the length of the second pad, and the width of the first pad is equal to the width of the second pad.
  • Another object of the present invention is to provide a printed circuit board including a board body, two sets of pads disposed on the board body and disposed adjacent to each other in a first direction, each set of pads including an edge a first pad and a second pad disposed adjacent to each other in a second direction perpendicular to the first direction, the first pad and the second pad each having a rectangular shape, and the length of the first pad is less than The length of the second pad, the first solder The width of the disk is equal to the width of the second pad.
  • the printed circuit board of the invention can be compatible with the welding of electronic components of different sizes, and can reduce the area of the printed circuit board, improve the utilization rate of the printed circuit board, and avoid the component shifting due to excessive solder paste during the writing. Bad position caused by the position.
  • FIG. 1 is a schematic structural view of a printed circuit board in accordance with an embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a printed circuit board in accordance with an embodiment of the present invention.
  • a printed circuit board includes a board body 10 and two sets of pads, wherein at least one land 20 is provided on a surface of the board body 10, and the two sets of pads are disposed in the land area 20. And disposed adjacently in the first direction, each set of pads (identified by a dashed box in FIG. 1) includes a first pad 31 and a second pad 32, where the first pad 31 and the second pad 32 are along The second direction perpendicular to the first direction is disposed adjacent to each other, and the specifications of the first pad 31 and the second pad 32 are different.
  • the first direction may be the x direction
  • the second direction may be the y direction perpendicular to the x direction, but the invention is not limited thereto.
  • the first direction may be any direction on the surface of the board 10
  • the second direction may be a direction perpendicular to the first direction on the surface of the board 10.
  • each set of pads is not limited to the number shown in FIG. 1, which may include any number of pads for the size of the electronic components, for example, each set of pads may include Three pads disposed adjacent in the second direction.
  • the first pad 31 and the second pad 32 are each in a rectangular shape, and the specifications of the first pad 31 and the second pad 32 are different: the length L1 of the first pad 31 is smaller than the first The length L2 of the second pad 32 is equal to the width W1 of the first pad 31 and the width W2 of the second pad 32.
  • the soldering area 20 can solder electronic components of different sizes.
  • the pins on both sides of the electronic component can be soldered separately.
  • Two adjacent pads 31 are disposed adjacent to each other; when the pin length of the electronic component is equal to the length L2 of the second pad 32, the pins on both sides of the electronic component may be respectively soldered to two adjacently disposed On the second pad 32; when the pin length of the electronic component is equal to the sum of the length L1 of the first pad 31 and the length L2 of the second pad 32, the pins on the side of the electronic component can be soldered On one set of pads (ie, one of the two first pads 31 and the second pad 32 on the same side thereof), the pins on the other side of the electronic component are soldered to the other set of pads (ie, two The other one of the pads 31 and the second pad 32 on the same side thereof.
  • the design of the printed circuit board according to the embodiment of the present invention avoids designing different soldering areas on the same printed circuit board to solder the same type of electronic components of different sizes, reducing the area of the printed circuit board, and improving the printed circuit.
  • the utilization rate of the plate material, at the same time avoids the displacement of the components caused by the excessive solder paste at the time of the punching, which causes the phenomenon of poor writing.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种印刷电路板，包括板体(10)、设置在所述板体(10)上且沿第一方向相邻设置的两组焊盘，所述每组焊盘包括沿与所述第一方向垂直的第二方向相邻设置的第一焊盘(31)和第二焊盘(32)，其中，所述第一焊盘(31)和所述第二焊盘(32)的规格不同。该印刷电路板能够兼容不同尺寸电子元器件的焊接，且可减少印刷电路板的面积，提高印刷电路板板材的利用率，同时避免在打件时因为锡膏过多导致元器件移位而造成的打件不良现象。

Description

印刷电路板 技术领域
本发明涉及一种印刷电路板，尤其涉及一种兼容不同尺寸电子元器件的印刷电路板。
背景技术
目前，在印刷电路板(PCB)的设计中，电子元器件(诸如电感、电阻等)封装的形成均按照供应商提供的数据手册(Datesheet)来建立，数据手册中均提供电子元器件具体的尺寸(其包括针脚尺寸等)以及焊盘的大小，即一个电子元器件对应一个封装。当两个电子元器件的数据手册中的尺寸差异不大时，即可综合设计成一个封装；但当两个电子元器件的针脚尺寸差异过大时，如果此时也将它们设计成一个封装，则在打件时则会使用过多的锡膏，从而导致元器件移位，造成打件不良现象。
发明内容
为了解决上述现有技术存在的问题，本发明的目的在于提供一种印刷电路板，包括板体、设置在所述板体上且沿第一方向相邻设置的两组焊盘，所述每组焊盘包括沿与所述第一方向垂直的第二方向相邻设置的第一焊盘和第二焊盘，其中，所述第一焊盘和所述第二焊盘的规格不同。
进一步地，所述第一焊盘和所述第二焊盘均呈矩形形状。
进一步地，所述第一焊盘的长度小于所述第二焊盘的长度，所述第一焊盘的宽度与所述第二焊盘的宽度相等。
本发明的另一目的还在于提供一种印刷电路板，包括板体、设置在所述板体上且沿第一方向相邻设置的两组焊盘，所述每组焊盘包括沿与所述第一方向垂直的第二方向相邻设置的第一焊盘和第二焊盘，所述第一焊盘和所述第二焊盘均呈矩形形状，所述第一焊盘的长度小于所述第二焊盘的长度，所述第一焊 盘的宽度与所述第二焊盘的宽度相等。
本发明的印刷电路板，能够兼容不同尺寸电子元器件的焊接，且可减少印刷电路板的面积，提高印刷电路板板材的利用率，同时避免在打件时因为锡膏过多导致元器件移位而造成的打件不良现象。
附图说明
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：
图1是根据本发明的实施例的印刷电路板的结构示意图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。
图1是根据本发明的实施例的印刷电路板的结构示意图。
参照图1，根据本发明的实施例的印刷电路板包括板体10和两组焊盘，其中，在板体10的表面上具有至少一焊接区20，这两组焊盘设置在焊接区20中且沿第一方向相邻设置，每组焊盘(图1中以虚线框标识)包括第一焊盘31和第二焊盘32，这里，第一焊盘31和第二焊盘32沿与第一方向垂直的第二方向相邻设置，并且第一焊盘31和第二焊盘32的规格不同。
在本实施例中，第一方向可为x方向，而第二方向可为与x方向垂直的y方向，但本发明并不限制于此。在本发明中第一方向可为在板体10表面上的任意方向，而第二方向可为在板体10表面上的与第一方向垂直的方向。
在本发明中，每组焊盘包括的焊盘数量并不以图1所示的数量为限，其可针对电子元器件的尺寸而包括任意数量的焊盘，例如，每组焊盘可包括沿第二方向相邻设置的三个焊盘。
在本实施例中，第一焊盘31和第二焊盘32均呈矩形形状，第一焊盘31和第二焊盘32的规格不同指的是：第一焊盘31的长度L1小于第二焊盘32的长度L2，第一焊盘31的宽度W1与第二焊盘32的宽度W2相等。
综上，在焊接区20可焊接不同尺寸的电子元器件，例如，当电子元器件的针脚长度与第一焊盘31的长度L1相当时，可将该电子元器件两侧的针脚分别焊接在相邻设置的两个第一焊盘31上；当电子元器件的针脚长度与第二焊盘32的长度L2相当时，可将该电子元器件两侧的针脚分别焊接在相邻设置的两个第二焊盘32上；而当电子元器件的针脚长度与第一焊盘31的长度L1和第二焊盘32的长度L2之和相当时，可将该电子元器件一侧的针脚焊接在一组焊盘(即两个第一焊盘31之一和其同侧的第二焊盘32)上，该电子元器件另一侧的针脚焊接在另一组焊盘(即两个第一焊盘31之另一和其同侧的第二焊盘32)上。而且，根据本发明的实施例的印刷电路板的设计，避免了在同一印刷电路板上设计不同的焊接区来焊接尺寸不同的同种类电子元器件，可减少印刷电路板的面积，提高印刷电路板板材的利用率，同时避免在打件时因为锡膏过多而导致的元器件移位，造成打件不良的现象。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (4)

  1. 一种印刷电路板，包括板体、设置在所述板体上且沿第一方向相邻设置的两组焊盘，其中，所述每组焊盘包括沿与所述第一方向垂直的第二方向相邻设置的第一焊盘和第二焊盘，其中，所述第一焊盘和所述第二焊盘的规格不同。
  2. 根据权利要求1所述的印刷电路板，其中，所述第一焊盘和所述第二焊盘均呈矩形形状。
  3. 根据权利要求2所述的印刷电路板，其中，所述第一焊盘的长度小于所述第二焊盘的长度，所述第一焊盘的宽度与所述第二焊盘的宽度相等。
  4. 一种印刷电路板，包括板体、设置在所述板体上且沿第一方向相邻设置的两组焊盘，其中，所述每组焊盘包括沿与所述第一方向垂直的第二方向相邻设置的第一焊盘和第二焊盘，所述第一焊盘和所述第二焊盘均呈矩形形状，所述第一焊盘的长度小于所述第二焊盘的长度，所述第一焊盘的宽度与所述第二焊盘的宽度相等。
PCT/CN2014/092581 2014-11-13 2014-11-28 印刷电路板 WO2016074286A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/426,747 US20160345435A1 (en) 2014-11-13 2014-11-28 Print circuit board

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Application Number Priority Date Filing Date Title
CN201410643189.6A CN104363700B (zh) 2014-11-13 2014-11-13 印刷电路板
CN201410643189.6 2014-11-13

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US20160345435A1 (en) 2016-11-24
CN104363700A (zh) 2015-02-18

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