CN203708620U - 一种带有多重对位系统的pcb板 - Google Patents
一种带有多重对位系统的pcb板 Download PDFInfo
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- CN203708620U CN203708620U CN201320850577.2U CN201320850577U CN203708620U CN 203708620 U CN203708620 U CN 203708620U CN 201320850577 U CN201320850577 U CN 201320850577U CN 203708620 U CN203708620 U CN 203708620U
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- pcb board
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- plate body
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- 238000003475 lamination Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320850577.2U CN203708620U (zh) | 2013-12-23 | 2013-12-23 | 一种带有多重对位系统的pcb板 |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320850577.2U CN203708620U (zh) | 2013-12-23 | 2013-12-23 | 一种带有多重对位系统的pcb板 |
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| CN203708620U true CN203708620U (zh) | 2014-07-09 |
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| CN201320850577.2U Expired - Fee Related CN203708620U (zh) | 2013-12-23 | 2013-12-23 | 一种带有多重对位系统的pcb板 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764261A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | 线路ldi曝光定位方法及其应用 |
| CN111885828A (zh) * | 2020-06-16 | 2020-11-03 | 惠州美锐电子科技有限公司 | 一种具有通孔和盲孔的pcb板线路制作方法 |
| CN112616266A (zh) * | 2020-12-25 | 2021-04-06 | 悦虎晶芯电路(苏州)股份有限公司 | 表面阶梯型电路板对位检查方法及电路板 |
| CN115857290A (zh) * | 2023-01-09 | 2023-03-28 | 珠海中京半导体科技有限公司 | 一种ic载板线路曝光对位靶点设计方法、系统及应用 |
| CN116634661A (zh) * | 2023-07-26 | 2023-08-22 | 广州添利电子科技有限公司 | 一种厚铜hdi电路板复合标靶及其制作工艺 |
-
2013
- 2013-12-23 CN CN201320850577.2U patent/CN203708620U/zh not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764261A (zh) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | 线路ldi曝光定位方法及其应用 |
| CN111885828A (zh) * | 2020-06-16 | 2020-11-03 | 惠州美锐电子科技有限公司 | 一种具有通孔和盲孔的pcb板线路制作方法 |
| CN112616266A (zh) * | 2020-12-25 | 2021-04-06 | 悦虎晶芯电路(苏州)股份有限公司 | 表面阶梯型电路板对位检查方法及电路板 |
| CN115857290A (zh) * | 2023-01-09 | 2023-03-28 | 珠海中京半导体科技有限公司 | 一种ic载板线路曝光对位靶点设计方法、系统及应用 |
| CN116634661A (zh) * | 2023-07-26 | 2023-08-22 | 广州添利电子科技有限公司 | 一种厚铜hdi电路板复合标靶及其制作工艺 |
| CN116634661B (zh) * | 2023-07-26 | 2024-01-23 | 广州添利电子科技有限公司 | 一种厚铜hdi电路板复合标靶及其制作工艺 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Xin Guosheng Inventor after: Wu Tao Inventor after: Xie Houbin Inventor after: Xu Wanxin Inventor before: Zhao Zhiping Inventor before: Zhou Gang Inventor before: Kong Hualong |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170522 Address after: 510000 West Zone (Jiangkou area), Shixing Industrial Park, Shaoguan, Guangdong Patentee after: Yong Jie Electronics (Shixing) Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane 3, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20201223 |
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| CF01 | Termination of patent right due to non-payment of annual fee |