WO2015141294A1 - 感温性粘着剤 - Google Patents
感温性粘着剤 Download PDFInfo
- Publication number
- WO2015141294A1 WO2015141294A1 PCT/JP2015/052629 JP2015052629W WO2015141294A1 WO 2015141294 A1 WO2015141294 A1 WO 2015141294A1 JP 2015052629 W JP2015052629 W JP 2015052629W WO 2015141294 A1 WO2015141294 A1 WO 2015141294A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature
- sensitive adhesive
- acrylate
- meth
- alkyl group
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 64
- -1 polysiloxane Polymers 0.000 claims abstract description 72
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 52
- 150000001875 compounds Chemical class 0.000 claims abstract description 48
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 40
- 229920000642 polymer Polymers 0.000 claims abstract description 39
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 36
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 35
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
- 229920001577 copolymer Polymers 0.000 claims abstract description 20
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims description 30
- 239000002390 adhesive tape Substances 0.000 claims description 28
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- 239000000178 monomer Substances 0.000 claims description 21
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 18
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000003985 ceramic capacitor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000003786 synthesis reaction Methods 0.000 description 17
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Definitions
- the present invention relates to a temperature-sensitive adhesive that can reversibly control the adhesive force by heat.
- a temperature-sensitive adhesive is an adhesive that can reversibly control its adhesive strength by heat. More specifically, the temperature-sensitive adhesive is one that, when cooled to a temperature lower than the melting point of the side chain crystalline polymer contained as a main component, the side chain crystalline polymer is crystallized to reduce the adhesive force. is there.
- the present applicant first developed a temperature-sensitive adhesive tape described in Patent Document 2 that exhibits excellent releasability by copolymerizing a reactive polysiloxane compound with a side chain crystalline polymer. Since reactive polysiloxane compounds are relatively expensive, it is desirable that the proportion of copolymerization be small. Moreover, when the ratio of a reactive polysiloxane compound increases, there exists a possibility that the balance of the adhesiveness of a thermosensitive adhesive tape and peelability may become unstable.
- An object of the present invention is to provide a temperature-sensitive adhesive that can be reduced in cost and has an excellent balance between adhesiveness and peelability.
- the temperature-sensitive adhesive of the present invention contains a side chain crystalline polymer obtained by polymerizing a (meth) acrylate having a linear alkyl group having at least 16 carbon atoms. Adhesive strength decreases at temperatures below the melting point.
- the side chain crystalline polymer is made of a copolymer obtained by further polymerizing a reactive polysiloxane compound, the (meth) acrylate having at least a linear alkyl group having at least 16 carbon atoms and the reactive poly
- the ratio of the siloxane compound is (meth) acrylate: reactive polysiloxane compound having a linear alkyl group having at least 16 carbon atoms in a weight ratio of 91: 9 to 99: 1.
- the temperature-sensitive adhesive of this embodiment contains a side chain crystalline polymer.
- the side chain crystalline polymer is a polymer having a melting point.
- the melting point is a temperature at which a specific portion of the polymer that was initially aligned in an ordered arrangement becomes disordered by an equilibrium process, and is measured at 10 ° C./min by a differential thermal scanning calorimeter (DSC). It shall mean the value obtained by measurement.
- the side chain crystalline polymer is crystallized at a temperature lower than the melting point described above, and exhibits phase transition at a temperature higher than the melting point to exhibit fluidity. That is, the side chain crystalline polymer has temperature sensitivity that reversibly causes a crystalline state and a fluid state in response to a temperature change.
- the temperature sensitive adhesive of this embodiment contains a side chain crystalline polymer in the ratio which adhesive force falls when a side chain crystalline polymer crystallizes at the temperature below melting
- the temperature-sensitive pressure-sensitive adhesive When the temperature-sensitive pressure-sensitive adhesive is cooled to a temperature lower than the melting point of the side chain crystalline polymer, the side chain crystalline polymer is crystallized to reduce the adhesive force. In addition, if the temperature-sensitive adhesive is heated to a temperature equal to or higher than the melting point of the side chain crystalline polymer, the adhesive strength is restored by the fluidity of the side chain crystalline polymer, so that it can be used repeatedly.
- the melting point is preferably 30 ° C. or higher, more preferably 40 to 65 ° C., and further preferably 50 to 60 ° C.
- the melting point can be controlled to a desired value by adjusting the composition of the side chain crystalline polymer.
- the side chain crystalline polymer of this embodiment is composed of a copolymer obtained by polymerizing (meth) acrylate having a linear alkyl group having at least 16 carbon atoms and a reactive polysiloxane compound.
- the linear alkyl group having 16 or more carbon atoms functions as a side chain crystalline site in the side chain crystalline polymer. That is, the side chain crystalline polymer is a comb-shaped polymer having a linear alkyl group having 16 or more carbon atoms in the side chain, and is crystallized by aligning the side chain in an ordered arrangement by intermolecular force or the like. To do.
- Examples of the (meth) acrylate having a linear alkyl group having 16 or more carbon atoms include carbon atoms such as cetyl (meth) acrylate, stearyl (meth) acrylate, eicosyl (meth) acrylate, and behenyl (meth) acrylate. Examples thereof include (meth) acrylates having 16 to 22 linear alkyl groups, and these may be used alone or in combination. Of these (meth) acrylates exemplified, behenyl (meth) acrylate is preferred. In addition, (meth) acrylate shall mean an acrylate or a methacrylate.
- the reactive polysiloxane compound means a polysiloxane compound having a reactive functional group and having a siloxane bond in the main chain.
- the reactive polysiloxane compound may be in the form of a wax at room temperature (23 ° C.), but an oil that exhibits fluidity at room temperature, that is, a silicone oil, is preferable for efficient polymerization.
- Examples of the functional group described above include ethylenically unsaturated double bonds such as vinyl group, allyl group, (meth) acryl group, (meth) acryloyl group, (meth) acryloxy group; epoxy group (glycidyl group and epoxy) Cycloalkyl group), mercapto group, carbinol group, carboxyl group, silanol group, phenol group, amino group, hydroxyl group and the like.
- the exemplified functional groups may be introduced into the side chain of the main chain, or may be introduced into both ends or one end of the main chain. That is, as the reactive polysiloxane compound, there are four types of so-called side chain type, double-ended type, single-ended type, and double-ended side chain type depending on the bonding position of the functional group to be introduced.
- One end type i.e., one end reactive polysiloxane compound is preferable in terms of obtaining good properties and peelability.
- the polysiloxane component can be grafted into the main chain of the polymer in a comb shape, and the side chain crystalline polymer is crystallized without impairing the adhesiveness. It is presumed that sometimes the releasability by the polysiloxane compound is efficiently expressed.
- the one-terminal reactive polysiloxane compound include a modified polydimethylsiloxane compound represented by the following general formula (I). Since this compound is excellent in compatibility with the above-mentioned (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, a copolymer can be obtained efficiently.
- R 1 represents an alkyl group.
- R 2 represents a group: CH 2 ⁇ CHCOOR 3 — or CH 2 ⁇ C (CH 3 ) COOR 3 — (wherein R 3 represents an alkylene group).
- n represents an integer of 5 to 200.
- examples of the alkyl group represented by R 1 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, and pentyl.
- straight-chain or branched alkyl groups having 1 to 6 carbon atoms such as a group, isopentyl group, neopentyl group, and hexyl group.
- the alkylene group represented by R 3 is, for example, a straight chain or branched chain having 1 to 6 carbon atoms such as methylene group, ethylene group, trimethylene group, methylethylene group, propylene group, tetramethylene group, pentamethylene group, hexamethylene group, etc. And the like.
- modified polydimethylsiloxane compound represented by the general formula (I) include compounds represented by the following general formula (II). [Wherein R 1 and n are the same as defined above. ]
- modified polydimethylsiloxane compound a commercially available product can be used. Specific examples thereof include, for example, one-end reactive silicone oils “X-22-2475” and “X-24” manufactured by Shin-Etsu Chemical Co., Ltd. -8201 ",” X-22-2426 “,” KF-2012 "and the like.
- the side chain crystalline polymer of the present embodiment composed of a copolymer of a (meth) acrylate having a straight chain alkyl group having 16 or more carbon atoms and a reactive polysiloxane compound includes, for example, 1 carbon atom.
- (Meth) acrylates having 8 to 8 alkyl groups, polar monomers and the like can be further polymerized.
- Examples of the (meth) acrylate having an alkyl group having 1 to 8 carbon atoms include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, and the like. Alternatively, two or more kinds may be mixed and used. Of these (meth) acrylates exemplified, methyl (meth) acrylate is preferred.
- polar monomers examples include carboxyl group-containing ethylenically unsaturated monomers such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid and fumaric acid; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meta ), Ethylenically unsaturated monomers having a hydroxyl group such as acrylate and 2-hydroxyhexyl (meth) acrylate, and the like. These may be used alone or in combination of two or more. Of these polar monomers exemplified, acrylic acid is preferred.
- the ratio of the (meth) acrylate having at least a linear alkyl group having 16 or more carbon atoms and the reactive polysiloxane compound is a linear alkyl group having at least 16 carbon atoms in weight ratio.
- Such a ratio has a small proportion of the relatively expensive reactive polysiloxane compound. Therefore, according to this embodiment, the cost can be reduced.
- the ratio of the reactive polysiloxane compound is increased, and the balance between the adhesiveness and the peelability of the temperature-sensitive adhesive is suppressed, and the release by the polysiloxane compound is suppressed. Since moldability is obtained, even if the adhesive strength is designed to be high, the adhesive strength can be sufficiently reduced during peeling, and as a result, excellent adhesiveness and peelability can be exhibited.
- the (meth) acrylate having a linear alkyl group having at least 16 carbon atoms described above is a case where only a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms is polymerized with a reactive polysiloxane compound.
- Means a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, and the above-described (meth) acrylate having an alkyl group having 1 to 8 carbon atoms, a polar monomer or the like is further polymerized. In the case, it is meant to further include (meth) acrylate having 1 to 8 carbon atoms and a polar monomer.
- the polymerization method is not particularly limited, and for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed.
- a solution polymerization method a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method and the like can be employed.
- the solution polymerization method the above-described monomer may be mixed with a solvent and stirred at about 40 to 90 ° C. for about 2 to 10 hours.
- the 180 ° peel strength with respect to the polyethylene terephthalate film at an atmospheric temperature of 80 ° C. is preferably 0.1 N / 25 mm or more, and more preferably 0.2 N / 25 mm or more. Thereby, components can be fixed even in a high temperature atmosphere.
- the 180 ° peel strength with respect to the polyethylene terephthalate film at an ambient temperature of 80 ° C. is a value obtained by measurement according to JIS Z0237.
- the temperature-sensitive adhesive of this embodiment described above can be used, for example, in the form of a substrate-less sheet.
- the thickness is preferably 5 to 100 ⁇ m, more preferably 10 to 50 ⁇ m.
- the temperature sensitive adhesive of this embodiment can be used in the form of a tape.
- a thermosensitive adhesive as a thermosensitive adhesive tape
- an adhesive layer made of a thermosensitive adhesive may be laminated on one or both sides of a film-like substrate.
- the film shape is not limited to a film shape, and is a concept including a film shape or a sheet shape as long as the effects of the present embodiment are not impaired.
- constituent material of the base material examples include polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, ethylene polypropylene copolymer, and polyvinyl chloride. Resin.
- the substrate may be either a single layer or a multilayer, and the thickness is usually about 5 to 500 ⁇ m.
- the substrate can be subjected to surface treatment such as corona treatment, plasma treatment, blast treatment, chemical etching treatment, primer treatment, etc. in order to improve the adhesion to the pressure-sensitive adhesive layer.
- the thickness of the pressure-sensitive adhesive layer is preferably 5 to 60 ⁇ m, more preferably 10 to 60 ⁇ m, and even more preferably 10 to 50 ⁇ m.
- the thickness of the adhesive layer on one side and the thickness of the adhesive layer on the other side may be the same or different.
- the pressure-sensitive adhesive layer on the other side is not particularly limited as long as the pressure-sensitive adhesive layer on one side is made of a temperature-sensitive pressure-sensitive adhesive.
- the pressure-sensitive adhesive layer on the other side is constituted by a pressure-sensitive adhesive layer made of, for example, a temperature-sensitive pressure-sensitive adhesive, the composition thereof may be the same as or different from the composition of the pressure-sensitive adhesive layer on one side.
- the pressure-sensitive adhesive layer on the other side can be constituted by a pressure-sensitive adhesive layer made of, for example, a pressure-sensitive adhesive.
- the pressure-sensitive adhesive is a polymer having tackiness, and examples thereof include natural rubber adhesives, synthetic rubber adhesives, styrene / butadiene latex base adhesives, and acrylic adhesives.
- a release film on the surface of the temperature-sensitive adhesive sheet and the temperature-sensitive adhesive tape described above.
- the release film include those obtained by applying a release agent such as silicone to the surface of a film made of polyethylene terephthalate or the like.
- various additives such as a crosslinking agent, a tackifier, a plasticizer, an anti-aging agent, and an ultraviolet absorber are added to the above-described temperature-sensitive adhesive, temperature-sensitive adhesive sheet, and temperature-sensitive adhesive tape. can do.
- the method for manufacturing a ceramic component of the present embodiment uses the above-described temperature-sensitive adhesive tape and includes the following steps (i) to (iv).
- the manufacturing method of the multilayer ceramic capacitor of this embodiment further includes the following step (v).
- a temperature-sensitive adhesive tape is attached to the ceramic green sheet laminate.
- the ceramic green sheet laminate is fixed on the pedestal via a temperature-sensitive adhesive tape.
- the ceramic green sheet laminate is cut to form a plurality of raw chips.
- the temperature-sensitive adhesive tape is brought to a temperature lower than the melting point of the side chain crystalline polymer to reduce the adhesive strength of the adhesive layer, and a plurality of raw chips are taken out from the temperature-sensitive adhesive tape.
- the obtained raw chip is fired to obtain a ceramic chip, and external electrodes are formed on the end face of the ceramic chip to obtain a multilayer ceramic capacitor.
- the steps (i) and (ii) are so-called laminating steps
- the step (iii) is a so-called cut step
- the step (iv) This is a so-called brushing process.
- the steps (i) to (v) can be performed reliably, resulting in yield. It is possible to obtain ceramic parts and multilayer ceramic capacitors well.
- a ceramic powder slurry is thinly extended with a doctor blade to form a ceramic green sheet, and a plurality of electrodes are printed on the surface of the ceramic green sheet. It is obtained by laminating and integrating ceramic green sheets.
- the fixing method on the pedestal in the step (ii) is not particularly limited.
- a predetermined pressure-sensitive adhesive or adhesive is interposed between the base of the thermosensitive pressure-sensitive adhesive tape and the pedestal.
- a method of using a pedestal provided with fixing means such as a suction mechanism.
- the structure of the thermosensitive adhesive tape is a double-sided tape provided with an adhesive layer on both sides of the base film, it is opposite to the adhesive layer on one side where the ceramic green sheet laminate is adhered. It can also be fixed on the pedestal via an adhesive layer on the other side.
- the cutting in the step (iii) may be pressing with a cutting blade or cutting with a rotary blade.
- the method for manufacturing a ceramic component of the present embodiment can be applied to other ceramic components such as a ceramic inductor and a ceramic varistor in addition to the above-described multilayer ceramic capacitor.
- Synthesis Example 4 These monomers were polymerized in the same manner as in Synthesis Example 1 except that 45 parts of behenyl acrylate, 41 parts of methyl acrylate, 5 parts of acrylic acid, and 9 parts of the modified polydimethylsiloxane compound were used.
- the obtained copolymer had a weight average molecular weight of 640,000 and a melting point of 56 ° C.
- the copolymers of Synthesis Examples 1 to 4 and Comparative Synthesis Examples 1 to 2 are shown in Table 1.
- the weight average molecular weight was obtained by measuring a copolymer by GPC and converting the obtained measured value into polystyrene.
- the melting point was obtained by measuring the copolymer with DSC at 10 ° C./min.
- Examples 1-4 and Comparative Examples 1-2 ⁇ Preparation of temperature-sensitive adhesive tape> First, the copolymers obtained in Synthesis Examples 1 to 4 and Comparative Synthesis Examples 1 and 2 were adjusted with ethyl acetate to a solid content of 30% by weight to obtain a coating solution. Next, the coating solution was applied to one side of a film-like substrate made of polyethylene terephthalate having a thickness of 100 ⁇ m and dried to obtain a temperature-sensitive adhesive tape on which a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m was formed.
- 180 ° peel strength With respect to the polyethylene terephthalate film in each atmospheric temperature of 80 degreeC and 23 degreeC was measured based on JISZ0237. Specifically, a temperature-sensitive adhesive tape was attached to a polyethylene terephthalate film under the following conditions, and then peeled 180 ° using a load cell at a rate of 300 mm / min.
- a temperature-sensitive adhesive tape was attached to a polyethylene terephthalate film at an ambient temperature of 80 ° C. and allowed to stand for 20 minutes, and then peeled 180 °.
- thermosensitive pressure-sensitive adhesive tape After sticking a thermosensitive pressure-sensitive adhesive tape to a polyethylene terephthalate film at an ambient temperature of 80 ° C. and allowing to stand at this ambient temperature for 20 minutes, the ambient temperature was lowered to 23 ° C., and after leaving at this ambient temperature for 20 minutes, Peeled 180 °.
- the polyethylene terephthalate film was untreated with a thickness of 25 ⁇ m.
- the temperature-sensitive adhesive tape was attached to the polyethylene terephthalate film by reciprocating a 2 kg roller 5 times on the temperature-sensitive adhesive tape.
- Examples 1 to 4 show that the 180 ° peel strength at each ambient temperature of 80 ° C. and 23 ° C. shows good results.
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- Polymers & Plastics (AREA)
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- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Adhesive Tapes (AREA)
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Abstract
Description
以下、本発明の一実施形態に係る感温性粘着剤について詳細に説明する。本実施形態の感温性粘着剤は、側鎖結晶性ポリマーを含有する。側鎖結晶性ポリマーは、融点を有するポリマーである。融点とは、ある平衡プロセスにより、最初は秩序ある配列に整合されていた重合体の特定部分が無秩序状態になる温度であり、示差熱走査熱量計(DSC)によって10℃/分の測定条件で測定して得られる値のことを意味するものとする。
次に、本発明の一実施形態に係るセラミック部品の製造方法および積層セラミックコンデンサの製造方法について説明する。本実施形態のセラミック部品の製造方法は、上述した感温性粘着テープを使用するとともに、以下の(i)~(iv)の工程を備える。本実施形態の積層セラミックコンデンサの製造方法は、以下の(v)の工程をさらに備える。
(ii)感温性粘着テープを介してセラミックグリーンシート積層体を台座上に固定する。
(iii)セラミックグリーンシート積層体を切断して複数の生チップを形成する。
(iv)感温性粘着テープを側鎖結晶性ポリマーの融点未満の温度にして粘着剤層の粘着力を低下させ、複数の生チップを感温性粘着テープから取り出す。
(v)得られた生チップを焼成してセラミックチップを得、セラミックチップの端面に外部電極を形成して積層セラミックコンデンサを得る。
日油社製のベヘニルアクリレートを45部、日本触媒社製のメチルアクリレートを49部、アクリル酸を5部、変性ポリジメチルシロキサン化合物を1部、および重合開始剤として日油社製の「パーブチルND」を0.2部の割合で、それぞれ酢酸エチル230部に加えて混合し、55℃で4時間撹拌して、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は58万、融点は56℃であった。なお、使用した変性ポリジメチルシロキサン化合物は、以下のとおりである。
変性ポリジメチルシロキサン化合物:上述した一般式(II)で表される信越化学工業(株)製の片末端反応性シリコーンオイル「KF-2012」
ベヘニルアクリレートを45部、メチルアクリレートを46部、アクリル酸を5部、変性ポリジメチルシロキサン化合物を4部にした以外は、合成例1と同様にして、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は63万、融点は55℃であった。
ベヘニルアクリレートを45部、メチルアクリレートを45部、アクリル酸を5部、変性ポリジメチルシロキサン化合物を5部にした以外は、合成例1と同様にして、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は60万、融点は55℃であった。
ベヘニルアクリレートを45部、メチルアクリレートを41部、アクリル酸を5部、変性ポリジメチルシロキサン化合物を9部にした以外は、合成例1と同様にして、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は64万、融点は56℃であった。
ベヘニルアクリレートを45部、メチルアクリレートを50部、アクリル酸を5部にし、変性ポリジメチルシロキサン化合物を添加しなかった以外は、合成例1と同様にして、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は62万、融点は56℃であった。
ベヘニルアクリレートを45部、メチルアクリレートを40部、アクリル酸を5部、変性ポリジメチルシロキサン化合物を10部にした以外は、合成例1と同様にして、これらのモノマーを重合させた。得られた共重合体の重量平均分子量は66万、融点は56℃であった。
<感温性粘着テープの作製>
まず、合成例1~4および比較合成例1~2で得られた各共重合体を酢酸エチルによって固形分が30重量%となるように調整し、塗布液を得た。次に、塗布液を厚さ100μmのポリエチレンテレフタレートからなるフィルム状の基材の片面に塗布して乾燥し、厚さ10μmの粘着剤層が形成された感温性粘着テープを得た。
得られた感温性粘着テープについて、180°剥離強度を評価した。評価方法を以下に示すとともに、その結果を表2に示す。
得られた感温性粘着テープについて、80℃および23℃の各雰囲気温度におけるポリエチレンテレフタレートフィルムに対する180°剥離強度をJIS Z0237に準拠して測定した。具体的には、以下の条件で感温性粘着テープをポリエチレンテレフタレートフィルムに貼着した後、ロードセルを用いて300mm/分の速度で180°剥離した。
80℃の雰囲気温度で感温性粘着テープをポリエチレンテレフタレートフィルムに貼着して20分間静置した後、180°剥離した。
80℃の雰囲気温度で感温性粘着テープをポリエチレンテレフタレートフィルムに貼着し、この雰囲気温度で20分間静置した後、雰囲気温度を23℃に下げ、この雰囲気温度で20分間静置した後、180°剥離した。
Claims (18)
- 少なくとも炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレートを重合させることによって得られる側鎖結晶性ポリマーを含有し、前記側鎖結晶性ポリマーの融点未満の温度で粘着力が低下する感温性粘着剤であって、
前記側鎖結晶性ポリマーが、反応性ポリシロキサン化合物をさらに重合させることによって得られる共重合体からなり、
前記少なくとも炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレートおよび前記反応性ポリシロキサン化合物の比率が、重量比で、少なくとも炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート:反応性ポリシロキサン化合物=91:9~99:1である、感温性粘着剤。 - 前記比率が、重量比で、少なくとも炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート:反応性ポリシロキサン化合物=96:4~99:1である、請求項1に記載の感温性粘着剤。
- 前記側鎖結晶性ポリマーが、炭素数1~8のアルキル基を有する(メタ)アクリレートおよび極性モノマーをさらに重合させることによって得られる共重合体からなり、
前記炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート、前記炭素数1~8のアルキル基を有する(メタ)アクリレート、前記極性モノマーおよび前記反応性ポリシロキサン化合物の比率が、重量比で、炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート:炭素数1~8のアルキル基を有する(メタ)アクリレート:極性モノマー:反応性ポリシロキサン化合物=44~46:39~51:4~6:1~9である、請求項1に記載の感温性粘着剤。 - 前記比率が、重量比で、炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレート:炭素数1~8のアルキル基を有する(メタ)アクリレート:極性モノマー:反応性ポリシロキサン化合物=44~46:44~51:4~6:1~4である、請求項3に記載の感温性粘着剤。
- 80℃の雰囲気温度におけるポリエチレンテレフタレートフィルムに対する180°剥離強度が0.1N/25mm以上であり、
23℃の雰囲気温度におけるポリエチレンテレフタレートフィルムに対する180°剥離強度が0.1N/25mm以下である、請求項1または3に記載の感温性粘着剤。 - 80℃の雰囲気温度におけるポリエチレンテレフタレートフィルムに対する180°剥離強度が0.2N/25mm以上であり、
23℃の雰囲気温度におけるポリエチレンテレフタレートフィルムに対する180°剥離強度が0.05N/25mm以下である、請求項2または4に記載の感温性粘着剤。 - 前記融点が、50~60℃である、請求項1~6のいずれかに記載の感温性粘着剤。
- 前記共重合体の重量平均分子量が、50万~70万である、請求項1~7のいずれかに記載の感温性粘着剤。
- 前記炭素数16以上の直鎖状アルキル基を有する(メタ)アクリレートが、ベヘニル(メタ)アクリレートである、請求項1~10のいずれかに記載の感温性粘着剤。
- 前記炭素数1~8のアルキル基を有する(メタ)アクリレートが、メチル(メタ)アクリレートであり、
前記極性モノマーが、アクリル酸である、請求項3または4に記載の感温性粘着剤。 - セラミック部品製造用である、請求項1~12のいずれかに記載の感温性粘着剤。
- 前記セラミック部品が、積層セラミックコンデンサである、請求項13に記載の感温性粘着剤。
- 請求項1~14のいずれかに記載の感温性粘着剤からなる、感温性粘着シート。
- 請求項1~14のいずれかに記載の感温性粘着剤からなる粘着剤層を、フィルム状の基材の片面または両面に積層してなる、感温性粘着テープ。
- 請求項16に記載の感温性粘着テープをセラミックグリーンシート積層体に貼着する工程と、
前記感温性粘着テープを介して前記セラミックグリーンシート積層体を台座上に固定する工程と、
前記セラミックグリーンシート積層体を切断して複数の生チップを形成する工程と、
前記感温性粘着テープを前記側鎖結晶性ポリマーの融点未満の温度にして前記粘着剤層の粘着力を低下させ、前記複数の生チップを前記感温性粘着テープから取り出す工程と、
を備える、セラミック部品の製造方法。 - 請求項17に記載のセラミック部品の製造方法で得られる生チップを焼成してセラミックチップを得、前記セラミックチップの端面に外部電極を形成して積層セラミックコンデンサを得る、積層セラミックコンデンサの製造方法。
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JP2015178539A (ja) | 2015-10-08 |
JP6734010B2 (ja) | 2020-08-05 |
CN106103627B (zh) | 2019-01-01 |
CN106103627A (zh) | 2016-11-09 |
KR20160134677A (ko) | 2016-11-23 |
TWI651385B (zh) | 2019-02-21 |
TW201538668A (zh) | 2015-10-16 |
MX2016011997A (es) | 2016-12-07 |
KR102289184B1 (ko) | 2021-08-13 |
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