TWI651385B - 感溫性黏著劑、感溫性黏接片、感溫性黏接膠帶、陶瓷構件之製造方法及積層陶瓷電容器之製造方法 - Google Patents
感溫性黏著劑、感溫性黏接片、感溫性黏接膠帶、陶瓷構件之製造方法及積層陶瓷電容器之製造方法 Download PDFInfo
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- TWI651385B TWI651385B TW104107709A TW104107709A TWI651385B TW I651385 B TWI651385 B TW I651385B TW 104107709 A TW104107709 A TW 104107709A TW 104107709 A TW104107709 A TW 104107709A TW I651385 B TWI651385 B TW I651385B
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- temperature
- sensitive adhesive
- meth
- alkyl group
- acrylate
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- 239000000853 adhesive Substances 0.000 title claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 60
- 239000002390 adhesive tape Substances 0.000 title claims description 34
- 239000000919 ceramic Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000003985 ceramic capacitor Substances 0.000 title claims description 11
- -1 polysiloxane Polymers 0.000 claims abstract description 73
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 37
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 37
- 229920000642 polymer Polymers 0.000 claims abstract description 35
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 35
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 22
- 229920001577 copolymer Polymers 0.000 claims abstract description 21
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000000178 monomer Substances 0.000 claims description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 16
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 239000008187 granular material Substances 0.000 claims description 5
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000003786 synthesis reaction Methods 0.000 description 17
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
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- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
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- 239000011164 primary particle Substances 0.000 description 2
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- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 238000003851 corona treatment Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 229920001194 natural rubber Polymers 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014055328A JP6734010B2 (ja) | 2014-03-18 | 2014-03-18 | 感温性粘着シートおよび感温性粘着テープ |
| JP2014-055328 | 2014-03-18 |
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| Publication Number | Publication Date |
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| TW201538668A TW201538668A (zh) | 2015-10-16 |
| TWI651385B true TWI651385B (zh) | 2019-02-21 |
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Family Applications (1)
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| TW104107709A TWI651385B (zh) | 2014-03-18 | 2015-03-11 | 感溫性黏著劑、感溫性黏接片、感溫性黏接膠帶、陶瓷構件之製造方法及積層陶瓷電容器之製造方法 |
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| JP (1) | JP6734010B2 (ja) |
| KR (1) | KR102289184B1 (ja) |
| CN (1) | CN106103627B (ja) |
| MX (1) | MX2016011997A (ja) |
| TW (1) | TWI651385B (ja) |
| WO (1) | WO2015141294A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2017098077A (ja) * | 2015-11-24 | 2017-06-01 | デクセリアルズ株式会社 | 異方性導電フィルム、及び接続方法 |
| JP2017179004A (ja) * | 2016-03-28 | 2017-10-05 | ニッタ株式会社 | 感温性粘着剤 |
| JP6754609B2 (ja) * | 2016-05-17 | 2020-09-16 | ニッタ株式会社 | 感温性粘着剤 |
| JP6789001B2 (ja) * | 2016-05-17 | 2020-11-25 | ニッタ株式会社 | 感温性粘着剤 |
| JP7058405B2 (ja) * | 2016-06-23 | 2022-04-22 | ニッタ株式会社 | 感温性樹脂、感温性粘着剤および感温性粘着剤組成物 |
| KR102235979B1 (ko) * | 2018-03-28 | 2021-04-02 | 주식회사 엘지화학 | 점착 필름 및 점착 필름의 제조방법 |
| KR102256784B1 (ko) * | 2018-03-28 | 2021-05-26 | 주식회사 엘지화학 | 점착 필름 및 점착 필름의 제조방법 |
| KR102293935B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102290639B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102293550B1 (ko) | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102290643B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102290640B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102293551B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102290629B1 (ko) * | 2018-07-27 | 2021-08-17 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102293549B1 (ko) * | 2018-07-27 | 2021-08-24 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102542732B1 (ko) * | 2019-01-23 | 2023-06-12 | 주식회사 엘지화학 | 편광 필름, 이의 제조 방법 및 이를 포함하는 액정 표시 장치 |
| KR102375401B1 (ko) * | 2019-01-25 | 2022-03-16 | 주식회사 엘지화학 | 점착 필름 및 이를 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102476489B1 (ko) * | 2019-04-25 | 2022-12-09 | 주식회사 엘지화학 | 점착 필름 및 이를 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102428187B1 (ko) * | 2019-07-03 | 2022-08-02 | 주식회사 엘지화학 | 점착 필름, 이의 제조 방법 및 이를 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102428192B1 (ko) * | 2019-07-03 | 2022-08-02 | 주식회사 엘지화학 | 점착 필름, 이의 제조 방법 및 이를 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102428179B1 (ko) * | 2019-07-03 | 2022-08-02 | 주식회사 엘지화학 | 점착 필름, 이의 제조 방법 및 이를 포함하는 플라스틱 유기 발광 디스플레이 |
| CN110655883B (zh) * | 2019-09-24 | 2021-07-13 | 南京清尚新材料科技有限公司 | 一种冷关型粘合剂及其制备方法和一种粘合带的制备方法 |
| KR102409532B1 (ko) * | 2019-10-22 | 2022-06-15 | 주식회사 엘지화학 | 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이 |
| KR102481004B1 (ko) * | 2021-02-22 | 2022-12-23 | 주식회사 켐코 | 내한성 및 내열성이 우수한 점착제 조성물 및 이를 이용한 점착테이프 |
| CN117043297A (zh) * | 2021-03-26 | 2023-11-10 | 霓达株式会社 | 温敏性粘合剂及被加工物的加工方法 |
| KR102701685B1 (ko) * | 2023-02-27 | 2024-08-30 | 동우 화인켐 주식회사 | 점착제 조성물, 점착 시트 및 화상 표시 장치 |
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| JP2012158633A (ja) * | 2011-01-31 | 2012-08-23 | Nitta Corp | 易剥離性粘着シートおよび易剥離性粘着テープ |
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| JP5097336B2 (ja) * | 2005-03-07 | 2012-12-12 | ニッタ株式会社 | 積層セラミック電子部品の製造方法 |
| JP2007002092A (ja) * | 2005-06-23 | 2007-01-11 | Kyoeisha Chem Co Ltd | 共重合プレポリマーが架橋した離型剤 |
| JP5118350B2 (ja) * | 2007-01-26 | 2013-01-16 | ニッタ株式会社 | 粘着剤 |
| JP5231775B2 (ja) * | 2007-09-10 | 2013-07-10 | ニッタ株式会社 | 感温性樹脂および感温性粘着剤、並びに感温性粘着テープ |
| JP5358086B2 (ja) * | 2007-11-15 | 2013-12-04 | ニッタ株式会社 | 感温性粘着剤 |
| EP2412756B1 (en) * | 2009-03-23 | 2016-12-21 | Cemedine Co., Ltd. | Curable composition |
| JP5551959B2 (ja) * | 2010-04-09 | 2014-07-16 | ニッタ株式会社 | 易剥離性粘着シートおよび易剥離性粘着テープ |
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- 2015-01-30 KR KR1020167025271A patent/KR102289184B1/ko active IP Right Grant
- 2015-03-11 TW TW104107709A patent/TWI651385B/zh active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003183608A (ja) * | 2002-10-01 | 2003-07-03 | Nitta Ind Corp | セラミック電子部品用生シートの仮止め粘着テープ及びセラミック電子部品の製造方法 |
| JP2012158633A (ja) * | 2011-01-31 | 2012-08-23 | Nitta Corp | 易剥離性粘着シートおよび易剥離性粘着テープ |
Also Published As
| Publication number | Publication date |
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| TW201538668A (zh) | 2015-10-16 |
| JP2015178539A (ja) | 2015-10-08 |
| MX2016011997A (es) | 2016-12-07 |
| KR20160134677A (ko) | 2016-11-23 |
| WO2015141294A1 (ja) | 2015-09-24 |
| CN106103627B (zh) | 2019-01-01 |
| CN106103627A (zh) | 2016-11-09 |
| JP6734010B2 (ja) | 2020-08-05 |
| KR102289184B1 (ko) | 2021-08-13 |
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