WO2015108025A1 - 接続体、接続体の製造方法、接続方法、異方性導電接着剤 - Google Patents

接続体、接続体の製造方法、接続方法、異方性導電接着剤 Download PDF

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Publication number
WO2015108025A1
WO2015108025A1 PCT/JP2015/050619 JP2015050619W WO2015108025A1 WO 2015108025 A1 WO2015108025 A1 WO 2015108025A1 JP 2015050619 W JP2015050619 W JP 2015050619W WO 2015108025 A1 WO2015108025 A1 WO 2015108025A1
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Prior art keywords
conductive particles
anisotropic conductive
electronic component
connection
liquid crystal
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Ceased
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PCT/JP2015/050619
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English (en)
French (fr)
Japanese (ja)
Inventor
誠一郎 篠原
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Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201580004803.7A priority Critical patent/CN105917529B/zh
Priority to KR1020167017700A priority patent/KR102386367B1/ko
Priority to US15/112,263 priority patent/US10175544B2/en
Priority to CN202010070103.0A priority patent/CN111508855B/zh
Publication of WO2015108025A1 publication Critical patent/WO2015108025A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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Definitions

  • the present invention relates to a method for connecting an electronic component and a circuit board, and in particular, a connection body in which the electronic component is connected to the circuit board via an adhesive containing conductive particles, a method for manufacturing the connection body, and a method for connecting the electronic component. And an anisotropic conductive adhesive.
  • liquid crystal display devices and organic EL panels have been used as various display means such as televisions, PC monitors, mobile phones, smart phones, portable game machines, tablet terminals, wearable terminals, and in-vehicle monitors.
  • COG chip on glass
  • a transparent electrode 102 made of ITO (indium tin oxide) or the like is provided on a transparent substrate 101 made of a glass substrate or the like.
  • a plurality of such electronic components such as a liquid crystal driving IC 103 are connected on the transparent electrode 102.
  • the liquid crystal driving IC 103 is formed with a plurality of electrode terminals 104 corresponding to the transparent electrodes 102 on the mounting surface, and thermocompression-bonded on the transparent substrate 101 via the anisotropic conductive film 105, thereby the electrode terminals 104. And the transparent electrode 102 are connected.
  • the anisotropic conductive film 105 is a film formed by mixing conductive particles in a binder resin, and heat conduction is performed between the two conductors so that electrical conduction between the conductors is achieved with the conductive particles.
  • the binder resin maintains the mechanical connection between the conductors.
  • a highly reliable thermosetting binder resin is usually used, but a photocurable binder resin or a photothermal binder resin may be used.
  • the anisotropic conductive film 105 is first attached to the transparent electrode 102 of the transparent substrate 101 by a temporary pressure bonding means (not shown). Temporarily stick. Subsequently, after mounting the liquid crystal driving IC 103 on the transparent substrate 101 via the anisotropic conductive film 105 to form a temporary connection body, the liquid crystal driving IC 103 is anisotropically formed by thermocompression bonding means such as a thermocompression bonding head 106. Heated and pressed to the transparent electrode 102 side together with the conductive film 105. By the heating by the thermocompression bonding head 106, the anisotropic conductive film 105 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 103 is bonded onto the transparent electrode 102.
  • thermocompression bonding head 106 Heated and pressed to the transparent electrode 102 side together with the conductive film 105.
  • the anisotropy in which the conductive particles 107 are filled with a high density when the conductive film is used, the conductive particles 107 are connected between the terminals of the electrode terminal 104, and a short circuit between the terminals occurs.
  • the electrodes formed on the circuit board are formed with a thickness of the order of several tens of nanometers to several ⁇ m by printing or the like, so a short circuit between the electrodes on the circuit board side does not cause a problem.
  • the present invention ensures the electrical connection between the electronic component and the circuit board and prevents a short circuit between the electrode terminals of the electronic component even if the wiring pitch of the circuit board and the electrode terminal of the electronic component are made fine. It is an object of the present invention to provide a connection body, a connection body manufacturing method, an electronic component connection method, and an anisotropic conductive adhesive.
  • a connection body according to the present invention is a connection body in which an electronic component is connected to a circuit board via an anisotropic conductive adhesive.
  • the conductive particles are regularly arranged, and the particle diameter of the conductive particles is 1 ⁇ 2 or less of the height of the connection electrode of the electronic component.
  • connection body mounts an electronic component on the circuit board through the adhesive agent containing electroconductive particle, and presses the said electronic component with respect to the said circuit board
  • the anisotropic conductive adhesive has conductive particles regularly arranged, and the conductive particles A particle diameter is 1/2 or less of the height of the connection electrode of the said electronic component.
  • the electronic component connection method includes mounting an electronic component on a circuit board via an adhesive containing conductive particles, pressing the electronic component against the circuit board, and
  • the anisotropic conductive adhesive has conductive particles regularly arranged, and the particle diameter of the conductive particles is The height of the connection electrode of the electronic component is 1 ⁇ 2 or less.
  • the anisotropic conductive adhesive according to the present invention is attached to the surface of a circuit board, and an electronic component is mounted on the anisotropic conductive adhesive for connecting the electronic component to the circuit board.
  • the conductive particles are regularly arranged, and the particle diameter of the conductive particles is 1 ⁇ 2 or less of the height of the connection electrode of the electronic component.
  • the conductive particles of the anisotropic conductive adhesive are regularly arranged, and the conductive particle diameter is not more than 1 ⁇ 2 of the height of the connection electrode of the electronic component.
  • the conductive particles are not agglomerated between them, and the distance between the particles is maintained. Therefore, a short circuit between terminals can be prevented even by reducing the cross-sectional area between the connection electrodes.
  • FIG. 1 is a cross-sectional view of a liquid crystal display panel shown as an example of a connection body.
  • FIG. 2 is a cross-sectional view showing a connection process between the liquid crystal driving IC and the transparent substrate.
  • FIG. 3 is a cross-sectional view showing an anisotropic conductive film.
  • FIG. 4 is a plan view showing an anisotropic conductive film in which conductive particles are regularly arranged in a lattice shape.
  • FIG. 5A is a cross-sectional view showing a connection state of an IC chip having a height of a conventional electrode terminal
  • FIG. 5B is a connection of an IC chip in which the height of the electrode terminal is reduced in the present invention. It is sectional drawing which shows a state.
  • FIG. 5A is a cross-sectional view showing a connection state of an IC chip having a height of a conventional electrode terminal
  • FIG. 5B is a connection of an IC chip in which the height of the electrode terminal is reduced in the
  • FIG. 6 is a cross-sectional view showing the process of connecting the IC chip to the transparent substrate of the liquid crystal display panel.
  • FIG. 7A is a cross-sectional view showing a connection state of an IC chip having a height of a conventional electrode terminal
  • FIG. 7B is an IC chip in which the height of the electrode terminal is reduced in the conventional configuration. It is sectional drawing which shows these connection states.
  • connection body a connection body manufacturing method, a connection method, and an anisotropic conductive adhesive to which the present invention is applied will be described in detail with reference to the drawings.
  • the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention.
  • the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
  • the liquid crystal display panel 10 includes two transparent substrates 11 and 12 made of a glass substrate and the like, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped seal 13. .
  • the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form a panel display unit 15.
  • the transparent substrates 11 and 12 have a pair of striped transparent electrodes 16 and 17 made of ITO (Indium Tin Oxide) or the like on both inner surfaces facing each other so as to intersect each other.
  • the transparent electrodes 16 and 17 are configured such that a pixel as a minimum unit of liquid crystal display is configured by the intersection of the transparent electrodes 16 and 17.
  • one transparent substrate 12 is formed to have a larger planar dimension than the other transparent substrate 11, and an edge 12a of the formed transparent substrate 12 has an electronic component.
  • a COG mounting unit 20 on which the liquid crystal driving IC 18 is mounted is provided.
  • the COG mounting portion 20 is formed with a substrate-side alignment mark 21 that overlaps the terminal portion 17 a of the transparent electrode 17 and the IC-side alignment mark 22 provided on the liquid crystal driving IC 18.
  • the liquid crystal driving IC 18 can selectively apply a liquid crystal driving voltage to the pixels to change the alignment of the liquid crystal partially to perform a predetermined liquid crystal display.
  • the liquid crystal driving IC 18 has a plurality of electrode terminals 19 (bumps) that are electrically connected to the terminal portions 17 a of the transparent electrode 17 on the mounting surface 18 a to the transparent substrate 12.
  • the electrode terminal 19 for example, a copper bump, a gold bump, or a copper bump plated with gold is suitably used.
  • the input bumps are arranged in a line along one side edge of the mounting surface 18a, and the output bumps are arranged in a staggered pattern in a plurality of lines along the other side edge facing the one side edge.
  • the electrode terminals 19 and the terminal portions 17a provided on the COG mounting portion 20 of the transparent substrate 12 are formed with the same number and the same pitch, respectively, and the transparent substrate 12 and the liquid crystal driving IC 18 are aligned and connected. Is connected.
  • liquid crystal driving IC 18 With the recent miniaturization and higher functionality of liquid crystal display devices and other electronic devices, electronic components such as the liquid crystal driving IC 18 are also required to be smaller and lower in height, and the electrode terminal 19 is also lowered in height. (For example, 6 to 15 ⁇ m).
  • the liquid crystal driving IC 18 is formed with an IC side alignment mark 22 for alignment with the transparent substrate 12 by being superimposed on the mounting surface 18a with the substrate side alignment mark 21. Since the wiring pitch of the transparent electrodes 17 of the transparent substrate 12 and the fine pitch of the electrode terminals 19 of the liquid crystal driving IC 18 are increasing, the liquid crystal driving IC 18 and the transparent substrate 12 are required to have high-precision alignment adjustment. It has been.
  • the substrate-side alignment mark 21 and the IC-side alignment mark 22 various marks that can be aligned with the transparent substrate 12 and the liquid crystal driving IC 18 by being combined can be used.
  • the liquid crystal driving IC 18 is connected to the terminal part 17a of the transparent electrode 17 formed in the COG mounting part 20 using the anisotropic conductive film 1 as an adhesive for circuit connection.
  • the anisotropic conductive film 1 contains conductive particles 4, and the electrode terminal 19 of the liquid crystal driving IC 18 and the terminal portion 17 a of the transparent electrode 17 formed on the edge portion 12 a of the transparent substrate 12 are electrically conductive. Electrical connection is made through the particles 4.
  • the anisotropic conductive film 1 is thermocompression bonded by the thermocompression bonding head 33, whereby the binder resin is fluidized and the conductive particles 4 are crushed between the terminal portion 17a and the electrode terminal 19 of the liquid crystal driving IC 18. In this state, the binder resin is cured. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 and the liquid crystal driving IC 18.
  • an alignment film 24 subjected to a predetermined rubbing process is formed on both the transparent electrodes 16 and 17, and the initial alignment of liquid crystal molecules is regulated by the alignment film 24.
  • a pair of polarizing plates 25 and 26 are disposed outside the transparent substrates 11 and 12, and these polarizing plates 25 and 26 allow transmitted light from a light source (not shown) such as a backlight to be transmitted. The vibration direction is regulated.
  • an anisotropic conductive film (ACF) 1 usually has a binder resin layer (adhesive layer) 3 containing conductive particles 4 on a release film 2 serving as a substrate. It is formed.
  • the anisotropic conductive film 1 is a thermosetting adhesive or a photo-curing adhesive such as ultraviolet rays, and is attached to the transparent electrode 17 formed on the transparent substrate 12 of the liquid crystal display panel 10 and also has a liquid crystal driving IC 18.
  • the anisotropic conductive film 1 can connect the transparent substrate 12 and the liquid crystal driving IC 18 to make them conductive.
  • the anisotropic conductive film 1 has regular conductive particles 4 in a predetermined pattern on a normal binder resin layer 3 containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent and the like. Is arranged.
  • the release film 2 that supports the binder resin layer 3 is made of, for example, PET (Poly (Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene) or the like with a release agent such as silicone. It coats and prevents the anisotropic conductive film 1 from drying, and maintains the shape of the anisotropic conductive film 1.
  • the film-forming resin contained in the binder resin layer 3 is preferably a resin having an average molecular weight of about 10,000 to 80,000.
  • the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.
  • thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.
  • the epoxy resin is not particularly limited.
  • naphthalene type epoxy resin biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin.
  • an acrylic compound, liquid acrylate, etc. can be selected suitably.
  • what made acrylate the methacrylate can also be selected from methyl acrylate, ethyl acrylate, isopropy
  • the latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type.
  • the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
  • the activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature
  • active species cation, anion, radical
  • Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.
  • the silane coupling agent is not particularly limited, and examples thereof include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
  • Examples of the conductive particles 4 include any known conductive particles used in the anisotropic conductive film 1.
  • Examples of the conductive particles 4 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film.
  • examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
  • the anisotropic conductive film 1 is filled with the conductive particles 4 at a high density (for example, 16000 particles / mm 2 ) in order to ensure that the conductive particles are sandwiched between the electrode terminals and ensure conduction. .
  • the conductive particles 4 are regularly arranged in a predetermined arrangement pattern in a plan view.
  • the anisotropic conductive film 1 is arranged in a lattice shape and uniformly.
  • the anisotropic conductive film 1 has a finer space between the adjacent electrode terminals 19 of the liquid crystal driving IC 18 than when the conductive particles 4 are randomly dispersed. Even when the pitch is reduced and the area between the terminals is reduced, and the conductive particles 4 are filled with high density, the short circuit between the electrode terminals 19 due to the aggregate of the conductive particles 4 is prevented in the connection process of the liquid crystal driving IC 18. can do.
  • the anisotropic conductive film 1 prevents the occurrence of roughness due to aggregation of the conductive particles 4 even when the binder resin layer 3 is filled with high density by arranging the conductive particles 4 regularly. Has been. Therefore, according to the anisotropic conductive film 1, the conductive particles 4 can be captured even in the terminal portions 17 a and the electrode terminals 19 that are fine pitched.
  • the uniform arrangement pattern of the conductive particles 4 can be arbitrarily set such as a tetragonal lattice or a hexagonal lattice in a plan view. The connection process of the liquid crystal driving IC 18 will be described in detail later.
  • an anisotropic conductive film 1 for example, a pressure-sensitive adhesive is applied on a stretchable sheet, the conductive particles 4 are arranged in a single layer thereon, and then the sheet is stretched at a desired stretch ratio.
  • the binder resin layer is filled with a high density, and preferably has a number density of 10,000 to 60,000 pieces / mm 2 .
  • the particle number density is less than 10000 / mm 2
  • the number of particles trapped between the electrode terminals 19 and the terminal portions 17a that are fine pitched decreases, and the conduction resistance increases.
  • the particle number density is more than 60000 / mm 2 , the conductive particles in the space between the narrowed electrode terminals 19 are connected, and there is a possibility that the adjacent electrode terminals 19 are short-circuited.
  • the shape of the anisotropic conductive film 1 is not particularly limited.
  • the anisotropic conductive film 1 has a long tape shape that can be wound around a take-up reel 6 and is cut and used for a predetermined length. can do.
  • molded the thermosetting resin composition which regularly arranged the electroconductive particle 4 in the binder resin layer 3 as the anisotropic conductive film 1 in the film form is not limited to this.
  • an insulating adhesive layer made of only the binder resin 3 and a conductive particle-containing layer made of the binder resin 3 in which the conductive particles 4 are regularly arranged are laminated. It can be configured.
  • the anisotropic conductive film 1 is arranged in a single layer as shown in FIG. 2, and the conductive particles 4 extend over a plurality of binder resin layers 3. May be arranged and regularly arranged in a plan view.
  • the anisotropic conductive film 1 may be a single dispersion at a predetermined distance in at least one layer of a multilayer structure.
  • connection process Next, a connection process for connecting the liquid crystal driving IC 18 to the transparent substrate 12 will be described.
  • the anisotropic conductive film 1 is temporarily attached on the COG mounting part 20 in which the terminal part 17a of the transparent substrate 12 is formed.
  • the transparent substrate 12 is placed on the stage of the connection device, and the liquid crystal driving IC 18 is disposed on the mounting portion of the transparent substrate 12 via the anisotropic conductive film 1.
  • thermocompression bonding head 33 heated to a predetermined temperature for curing the binder resin layer 3 is hot-pressed from above the liquid crystal driving IC 18 at a predetermined pressure and time.
  • the binder resin layer 3 of the anisotropic conductive film 1 exhibits fluidity, and flows out from between the mounting surface 18a of the liquid crystal driving IC 18 and the COG mounting portion 20 of the transparent substrate 12, and in the binder resin layer 3.
  • the conductive particles 4 are sandwiched between the electrode terminals 19 of the liquid crystal driving IC 18 and the terminal portions 17a of the transparent substrate 12 and are crushed.
  • the conductive particles 4 are electrically connected between the electrode terminals 19 and the terminal portions 17a, and in this state, the binder resin heated by the thermocompression bonding head 33 is cured. Thereby, the liquid crystal display panel 10 in which electrical conductivity is ensured between the electrode terminal 19 of the liquid crystal driving IC 18 and the terminal portion 17a formed on the transparent substrate 12 can be manufactured.
  • the conductive particles 4 that are not between the electrode terminal 19 and the terminal portion 17a are dispersed in the binder resin between the adjacent electrode terminals 19, and maintain an electrically insulated state. Thereby, electrical conduction is achieved only between the output electrode terminal 19 of the liquid crystal driving IC 18 and the terminal portion 17 a of the transparent substrate 12.
  • the binder resin can be rapidly cured even with a short heating time.
  • the anisotropic conductive film 1 is not limited to the thermosetting type, and may be a photo-curing type or a photo-heat combined type adhesive as long as pressure connection is performed.
  • the particle diameter of the electroconductive particle 4 shall be 1/2 or less of the height of the electrode terminal 19 of IC18 for liquid crystal drive mentioned above. Thereby, it is possible to prevent a short circuit between the terminals due to the conductive particles 4 being continuous between the electrode terminals 19 having a fine pitch.
  • liquid crystal driving IC 18 electronic components such as the liquid crystal driving IC 18 are also required to be smaller and lower in height, and the electrode terminal 19 is Since the height is low, as shown in FIGS. 5A and 5B, the area between the adjacent electrode terminals 19 is also narrowed.
  • the conductive particles 4 of the anisotropic conductive film 1 are regularly arranged, and the particle diameter of the conductive particles 4 is 1 / height of the height of the electrode terminal 19 of the liquid crystal driving IC 18 described above. 2 or less.
  • the liquid crystal display panel 10 can reliably capture the conductive particles between the electrode terminals 19 and the terminal portions 17a to ensure the electrical conductivity, and between the adjacent electrode terminals 19, a predetermined value can be obtained. It is dispersed while maintaining the distance between the particles, and a short circuit between the electrode terminals 19 can be prevented.
  • the number density of the conductive particles is preferably 10,000 to 60,000 particles / mm 2 .
  • the liquid crystal display panel 10 prevents short-circuiting between the narrowed electrode terminals 19 and the conductive particles 4 between the electrode terminals 19 and the terminal portions 17a that are fine pitched. It is possible to reliably capture and improve conductivity.
  • the binder resin layer of the anisotropic conductive film used for connecting the IC for evaluation was 60 parts by mass of phenoxy resin (trade name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.), epoxy resin (trade name: jER828, manufactured by Mitsubishi Chemical Corporation).
  • a binder resin composition prepared by adding 40 parts by mass and 2 parts by mass of a cationic curing agent (trade name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) to a solvent is prepared, and this binder resin composition is applied onto a release film. It was formed by firing.
  • an evaluation element As an evaluation element, an evaluation IC having an outer shape: 1.5 mm ⁇ 13 mm, a thickness of 0.5 mm, a bump (Au-plated) area: 25 ⁇ ⁇ 140 ⁇ m, and a space between bumps: 7.5 ⁇ m was used.
  • an ITO pattern glass having an outer shape: 30 mm ⁇ 50 mm, a thickness of 0.5 mm, and a comb-like electrode pattern having the same size and the same pitch as the bump of the evaluation IC is used. It was.
  • the evaluation IC After temporarily attaching an anisotropic conductive film to this evaluation glass substrate, the evaluation IC was mounted while aligning the bumps of the evaluation IC with the wiring electrodes of the evaluation glass substrate, and 180 ° C. with a thermocompression head.
  • a connector sample was prepared by thermocompression bonding under conditions of 80 MPa and 5 sec. About each connection body sample, the capture
  • the number of conductive particles captured between the IC bump and the substrate electrode is the number of conductive particles captured between the pair of IC bump for evaluation and the electrode of the glass substrate for evaluation for each connection sample. All IC bumps and substrate electrodes were measured, and the average number and the minimum number were obtained. The conduction resistance was measured at the initial stage and after the reliability test (85 ° C., 85% RH, 500 hours). The number of shorts between bumps was determined by measuring the number of shorts between bumps of the evaluation IC.
  • the shortest distance ( ⁇ m) between the conductive particles and the maximum number of conductive particles existing between the bumps in a cross-sectional view in the arrangement direction of the bumps of the evaluation IC were measured.
  • Example 1 an anisotropic conductive film in which conductive particles are regularly arranged in a binder resin layer was used.
  • the anisotropic conductive film used in Example 1 was obtained by applying a pressure-sensitive adhesive on a stretchable sheet, arranging the conductive particles 4 thereon as a single layer, and then stretching the sheet at a desired stretch ratio. In this state, it was manufactured by laminating a binder resin layer.
  • the used conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) have a particle diameter of 4 ⁇ m and a particle number density of 16000 particles / mm 2 .
  • the bump height of the evaluation IC used in Example 1 is 15 ⁇ m, and the cross-sectional area of the space between the bumps is 112.5 ⁇ m 2 (15 ⁇ m ⁇ 7.5 ⁇ m).
  • Example 2 In Example 2, the same conditions as in Example 1 were applied except that the bump height of the evaluation IC was 12 ⁇ m and the cross-sectional area of the space between the bumps was 90 ⁇ m 2 (12 ⁇ m ⁇ 7.5 ⁇ m).
  • Example 3 In Example 3, the conditions were the same as in Example 1 except that the bump height of the evaluation IC was 8 ⁇ m and the cross-sectional area of the space between the bumps was 60 ⁇ m 2 (8 ⁇ m ⁇ 7.5 ⁇ m).
  • Example 4 an anisotropic conductive film was obtained by the same production method as Example 1 using conductive particles having a particle diameter of 5 ⁇ m (trade name: AUL705, manufactured by Sekisui Chemical Co., Ltd.). The particle number density is 16000 particles / mm 2 .
  • the bump height of the evaluation IC used in Example 4 is 10 ⁇ m, and the cross-sectional area of the space between the bumps is 75 ⁇ m 2 (10 ⁇ m ⁇ 7.5 ⁇ m).
  • Example 5 an anisotropic conductive film was obtained by the same production method as in Example 1 using the same conductive particles as in Example 1.
  • the particle number density was 10,000 particles / mm 2 .
  • the bump height of the evaluation IC used in Example 5 is 8 ⁇ m, and the cross-sectional area of the space between the bumps is 60 ⁇ m 2 (10 ⁇ m ⁇ 7.5 ⁇ m).
  • Example 6 an anisotropic conductive film was obtained by the same production method as Example 1 using conductive particles having a particle diameter of 3 ⁇ m (trade name: AUL703, manufactured by Sekisui Chemical Co., Ltd.). The particle number density is 60,000 particles / mm 2 .
  • the bump height of the evaluation IC used in Example 6 is 8 ⁇ m, and the cross-sectional area of the space between the bumps is 60 ⁇ m 2 (10 ⁇ m ⁇ 7.5 ⁇ m).
  • Comparative Example 1 an anisotropic conductive film in which conductive particles are randomly dispersed in a binder resin layer is prepared by adding conductive particles to a binder resin composition, and applying and baking on the release film. Using.
  • the used conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) have a particle diameter of 4 ⁇ m and a particle number density of 16000 particles / mm 2 .
  • the bump height of the evaluation IC used in Comparative Example 1 is 15 ⁇ m, and the cross-sectional area of the space between the bumps is 112.5 ⁇ m 2 (15 ⁇ m ⁇ 7.5 ⁇ m).
  • Comparative Example 2 In Comparative Example 2, the conditions were the same as in Comparative Example 1 except that the bump height of the evaluation IC was 8 ⁇ m and the cross-sectional area of the space between the bumps was 60 ⁇ m 2 (8 ⁇ m ⁇ 7.5 ⁇ m).
  • Comparative Example 3 an anisotropic conductive film was obtained by the same production method as Example 1 using conductive particles having a particle diameter of 5 ⁇ m (trade name: AUL705, manufactured by Sekisui Chemical Co., Ltd.). The particle number density is 16000 particles / mm 2 .
  • the bump height of the evaluation IC used in Comparative Example 3 is 8 ⁇ m, and the cross-sectional area of the space between the bumps is 60 ⁇ m 2 (8 ⁇ m ⁇ 7.5 ⁇ m).
  • the average number of conductive particles sandwiched between the pair of evaluation IC bumps and the evaluation glass substrate electrode was 7.2 or more.
  • the initial conduction resistance was 0.2 ⁇ , and the conduction resistance after the reliability test was as good as 5 ⁇ or less.
  • the maximum number of conductive particles between the bumps is 1 to 4, the particle interval is 0.5 to 2.1 ⁇ m, and the number of shorts between the bumps is 40 ppm or less. The insulation between the bumps was also good.
  • Comparative Example 1 since the conductive particles are randomly dispersed in the binder resin layer, the maximum number of conductive particles between the bumps is 7 and the minimum particle interval is 0 ⁇ m, that is, the conductive particles are continuous. The number of shorts between the bumps was 3000 ppm.
  • the bump height is as low as 8 ⁇ m, and the cross-sectional area of the space between the bumps is 60 ⁇ m 2, which is narrower than Comparative Example 1.
  • the number of shorts generated was 5000 ppm.
  • the particle size of the conductive particles is larger than 1 ⁇ 2 of the bump height (8 ⁇ m). For this reason, the location where conductive particles continue in the space between the bumps was generated, and the number of shorts between the bumps was 60 ppm. From this, it can be seen that the particle diameter of the conductive particles is preferably 1 ⁇ 2 or less of the bump height.
  • Example 5 the number density of the conductive particles was 10,000 / mm 2 , but when the number of trapped particles was 4 or less, the number was 6 at the minimum, and there was no practical problem.
  • Example 6 the number density of the conductive particles was 60000 / mm 2 , but the number of shorts between the bumps was 50 ppm or more, but it was 40 ppm or less, and there was no practical problem. That is, it can be seen that the number density of the conductive particles before adhesion of the anisotropic conductive film is preferably 10,000 to 60,000 particles / mm 2 .

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